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SGT40N60NPFDPN_Datasheet

40A, 600V FIELD STOP IGBT

DESCRIPTION

SGT40N60NPFDPN using Field Stop IGBT technology, offer the optimum


performance for induction Heating, UPS, SMPS and PFC application.

FEATURES

 40A, 600V, VCE(sat)(typ.)=1.8V@IC=40A


 Low conduction loss
 Fast switching
 High input impedance

NOMENCLATURE

ORDERING INFORMATION

Part No. Package Marking Material Packing


SGT40N60NPFDPN TO-3P 40N60NPFD Pb free Tube

ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise noted)

Parameter Symbol Ratings Units


Collector to Emitter Voltage VCE 600 V
Gate to Emitter Voltage VGE ±20 V
TC=25°C 80
Collector Current IC A
TC=100°C 40
Pulsed Collector Current ICM 120 A
290 W
Maximum Power Dissipation (TC=25°C) PD
2.32 W/°C
Operating Junction Temperature TJ -55~+150 °C
Storage Temperature Range Tstg -55~+150 °C

HANGZHOU SILAN MICROELECTRONICS CO.,LTD Rev.:1.1


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Microelectronics SGT40N60NPFDPN_Datasheet
THERMAL CHARACTERISTICS

Parameter Symbol Ratings Units


Thermal Resistance, Junction to Case (IGBT) RθJC 0.24 °C/W
Thermal Resistance, Junction to Case (FRD) RθJC 1.4 °C/W
Thermal Resistance, Junction to Ambient RθJA 35.5 °C/W

ELECTRICAL CHARACTERISTICS OF IGBT (TC = 25°C unless otherwise noted)

Parameter Symbol Test conditions Min. Typ. Max. Units


Collector to Emitter Breakdown
BVCE VGE=0V,IC=250uA 600 -- -- V
Voltage
C-E Leakage Current ICES VCE=600V,VGE=0V -- -- 200 uA
G-E Leakage Current IGES VGE=20V,VCE=0V -- -- ±400 nA
G-E Threshold Voltage VGE(th) IC=250uA,VCE=VGE 4.0 5.0 6.5 V
IC=40A,VGE=15V -- 1.8 2.5 V
Collector to Emitter Saturation
VCE(sat) IC=40A,VGE=15V
Voltage -- 2.1 -- V
TC=125°C
Input Capacitance Cies VCE=30V -- 1850 --
Output Capacitance Coes VGE=0V -- 180 -- pF
Reverse Transfer Capacitance Cres f=1MHz -- 50 --
Turn-On Delay Time Td(on) -- 18 --
Rise Time Tr VCE=400V -- 80 --
ns
Turn-Off Delay Time Td(off) IC=40A -- 110 --
Fall Time Tf Rg=10Ω -- 105 --
Turn-On Switching Loss Eon VGE=15V -- 1.87 --
Turn-Off Switching Loss Eoff Inductive Load, -- 0.68 -- mJ
Total Switching Loss Est -- 2.55 --
Total Gate Charge Qg -- 100 --
VCE = 300V, IC=20A,
Gate to Emitter Charge Qge -- 11 --
VGE = 15V nC
Gate to Collector Charge Qgc -- 52 --

ELECTRICAL CHARACTERISTICS OF FRD (TC = 25°C unless otherwise noted)

Parameter Symbol Test conditions Min. Typ. Max. Units


IF = 20A TC=25°C -- 1.9 2.6
Diode Forward Voltage Vfm V
IF = 20A TC=125°C -- 1.5 --
Diode Reverse Recovery Time Trr IES =20A, dIES/dt=200A/μs -- 32 -- ns
Diode Reverse Recovery Charge Qrr IES =20A, dIES/dt=200A/μs -- 74 -- nC

HANGZHOU SILAN MICROELECTRONICS CO.,LTD Rev.:1.1


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Microelectronics SGT40N60NPFDPN_Datasheet
TYPICAL CHARACTERISTICS CURVE

Figure 1. Typical output characteristics Figure 2. Typical output characteristics


120 120
TC=25°C TC=125°C 20V
20V 15V
100 100

Collector current – IC(A)


Collector current – IC(A)

15V
12V 12V
80 80
10V 10V

60 60

40 40
VGE=8V
VGE=8V
20 20

0 0
0 1.5 3.0 4.5 6.0 0 1.5 3.0 4.5 6.0

Collector-Emitter voltage – VCE(V) Collector-Emitter voltage– VCE(V)

Figure 3. Typical saturation voltage characteristic Figure 4. Transmission characteristic


120 120
Emitter in Emitter in
100 common 100 common
Collector current – IC(A)

Collector current – IC(A)

VGE=15V VGE=20V
TC=25°C

80 80

60 TC=125°C 60
TC=25°C
40 40
TC=125°C

20 20

0 0
0 1 2 3 4 5 4 5 6 7 8 9 10 11 12

Collector-Emitter voltage – VCE(V) Gate-Emitter voltage – VGE(V)

Figure 5. Saturation voltage vs. VGE Figure 6. Saturation voltage vs. VGE
20 20
Emitter in Emitter in
Collector-Emitter voltage – VCE(V)

Collector-Emitter voltage– VCE(V)

common common
TC=25°C TC=125°C
16 16

12 80A 12 80A

8 40A
8 40A
IC=20A IC=20A

4 4

0 0
4 8 12 16 20 4 8 12 16 20

Gate-Emitter voltage – VGE(V) Gate-Emitter voltage– VGE(V)

HANGZHOU SILAN MICROELECTRONICS CO.,LTD Rev.:1.1


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TYPICAL CHARACTERISTICS CURVE (CONTINUED)

Figure 7. Capacitance characteristic Figure 8. Gate charge characteristic


5000 15
Emitter in
common Emitter in
common

Gate-Emitter voltage - VGE(V)


VGE=0V, f=1MHz VCC=100V
4000 TC=25°C 12 TC=25°C
Cies
Capacitance (pF)

3000 200V
9

Coes
300V
2000 6
Cres

1000 3

0 0
0.1 1.0 10.0 30.0 0 30 60 90 120

Collector-Emitter voltage – VCE(V) Gate charge – QG(nC)

Figure 9. Turn-on characteristic vs. Gate resistance Figure 10. Turn-off characteristic vs. Gate resistance
200 5500
Emitter in common Emitter in common
VCC=400V, VGE=15V, IC=40A VCC=400V, VGE=15V, IC=40A
100 TC=25°C TC=25°C
1000
Switching time [ns]

Switching time [ns]

tr

td(off)

100 tf
td(on)

10 10
0 10 20 30 40 50 0 10 20 30 40 50
Gate resistance - RG(Ω) Gate resistance - RG(Ω)

Figure 11. Switching loss vs. Gate resistance Figure 12. Forward characteristic
10.0 80.0
Emitter in common
VCC=400V, VGE=15V, IC=40A
TC=25°C
Forward current - IF(A)

TC=125°C
Switching loss [mJ]

10.0
Eon
TC=25°C

1.0 Eoff
1.0

0.3 0.2
0 10 20 30 40 50 0 1 2 3 4
Gate resistance - RG(Ω) Forward voltage - VF(V)

HANGZHOU SILAN MICROELECTRONICS CO.,LTD Rev.:1.1


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Microelectronics SGT40N60NPFDPN_Datasheet
TYPICAL CHARACTERISTICS CURVE (CONTINUED)

Figure 14. Transient Thermal


Figure 13. SOA Characteristics
Impedance of IGBT
102 0.25
Single Pulse Curve

Peak Power Impedance (°C/W)


90%
0.2
Collector Current - IC(A)

101 100ms
70%
DC 10ms
1ms 0.15

50%

0.1
100 30%

Single Nonrepetitive Pulse TC = 25°C 0.05


Curves must be derated
10%
linearly with increase 5%
in temperature 2%
10-1 0
100 101 102 103 10-5 10-4 10-3 10-2 10-1

Collector-Emitter Voltage - VCE(V) On-Pulse Duration(Sec)

PACKAGE OUTLINE

TO-3P Unit:mm
15.5±0.50

8.5~10.0 1.2~1.80

Φ 3.0~3.7
19.5~21.0
39.0~41.5

2.6~3.8

1.2~2.0
2.0±0.3
3.0±0.3
19.5~20.0

1.0±0.3

0.6±0.2

5.45TYP
4.4~5.2

HANGZHOU SILAN MICROELECTRONICS CO.,LTD Rev.:1.1


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Microelectronics SGT40N60NPFDPN_Datasheet
Disclaimer :
• Silan reserves the right to make changes to the information herein for the improvement of the design and performance without
further notice! Customers should obtain the latest relevant information before placing orders and should verify that such
information is complete and current.
• All semiconductor products malfunction or fail with some probability under special conditions. When using Silan products in
system design or complete machine manufacturing, it is the responsibility of the buyer to comply with the safety standards
strictly and take essential measures to avoid situations in which a malfunction or failure of such Silan products could cause
loss of body injury or damage to property.
• Silan will supply the best possible product for customers!

Part No.: SGT40N60NPFDPN Document Type: Datasheet


Copyright: HANGZHOU SILAN MICROELECTRONICS CO.,LTD Website: http: //www.silan.com.cn

Rev.: 1.1 Author: Zhang Kefeng


Revision History:
1. Add pin No.
2. Modify the package outline of TO-3P
Rev.: 1.0 Author: Zhang Kefeng
Revision History:
1. First release

HANGZHOU SILAN MICROELECTRONICS CO.,LTD Rev.:1.1


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