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Key words: Heat trmsfer enhancement, forced convection in rectangular duct, rectangular
ribs, passive cooling
INTRODUCTION
Cooling of hot electronic boards surfaces with air flow is one of the common methods in
practical. All of the elecffonic boards are constmcted from small and tiny elements which generate
considerable amount ofheat. The main cooling systems for these equipments is flowing of the air
over them through channels and reducing of generated heat by forced convection Now a days, due
to using a lot of different elements in boards and enhancement in the compactions of these elements
in one board to reduce the sizes, the cooling has became a vital and inevitable process for these
equipments. Thus using of optimum active and/or passive cooling systems are preferred to enhance
performance evaluttion clitelia (PEC) of boards (Zimparov et al., 2006; Peterson and Ortega, 1990).
Passive methods we]] known for their ability to work without any outsource energies. The present
study is based on special passive method.
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