HybridPACK™DriveModule

FS820R08A6P2B

FinalDataSheet
V3.0,2017-03-09

AutomotiveHighPower
 FS820R08A6P2B
HybridPACK™DriveModule

1Features/Description
HybridPACK™DrivemodulewithEDT2IGBTandDiode

VCES = 750V
IC nom = 820A / ICRM = 1640A

TypicalApplications Description
• AutomotiveApplications The HybridPACKTM Drive is a very compact
• HybridElectricalVehicles(H)EV six-pack module (750V/820A) optimized for hybrid
and electric vehicles. The power module
• MotorDrives
implements the new EDT2 IGBT generation, which
• CommercialAgricultureVehicles is an automotive Micro-Pattern Trench-Field-Stop
cell design optimized for electric drive train
applications. The chipset has benchmark current
ElectricalFeatures density combined with short circuit ruggedness and
• Blockingvoltage750V increased blocking voltage for reliable inverter
• LowVCEsat operation under harsh environmental conditions.
• LowSwitchingLosses The EDT2 IGBTs also show excellent light load
power losses, which helps to improve system
• LowQgandCres efficiency over a real driving cycle. The EDT2 IGBT
• LowInductiveDesign was optimized for applications with switching
• Tvjop=150°C frequencies in the range of 10 kHz.
• Short-time extended Operation Temperature
Tvjop=175°C The new HybridPACKTM Drive power module family
comes with mechanical guiding elements
supporting easy assembly processes for customers.
MechanicalFeatures Furthermore, the press-fit pins for the signal
terminals avoid additional time consuming selective
• 4.2kVDC1secInsulation
solder processes, which provides cost savings on
• HighCreepageandClearanceDistances system level and increases system reliability. The
• Compactdesign direct cooled baseplate with PinFin structure in the
• HighPowerDensity FS820R08A6P2B product best utilizes the
implemented chipset and shows superior thermal
• DirectCooledBasePlate
characteristics. Due to the high clearance &
• GuidingelementsforPCBandcoolerassembly creepage distances, the module family is also well
• IntegratedNTCtemperaturesensor suited for increased system working voltages and
• PressFITContactTechnology supports modular inverter approaches.
• RoHScompliant
• UL94V0moduleframe

ProductName OrderingCode
FS820R08A6P2B SP001499708

Final Data Sheet 2 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™DriveModule

2IGBT,Inverter
2.1MaximumRatedValues
Parameter Conditions Symbol Value Unit
Collector-emittervoltage Tvj = 25°C VCES 750 V
Implementedcollectorcurrent ICN 820 A
ContinuousDCcollectorcurrent TF = 80°C, Tvj max = 175°C IC nom 4501) A
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 1640 A
Totalpowerdissipation TF = 75°C, Tvj max = 175°C Ptot 7141) W
Gate-emitterpeakvoltage VGES +/-20 V

2.2CharacteristicValues min. typ. max.

Collector-emittersaturationvoltage IC = 450 A, VGE = 15 V Tvj = 25°C 1.10 1.35
IC = 450 A, VGE = 15 V Tvj = 150°C 1.15
IC = 450 A, VGE = 15 V Tvj = 175°C 1.15
VCE sat V
IC = 820 A, VGE = 15 V Tvj = 25°C 1.30
IC = 820 A, VGE = 15 V Tvj = 175°C 1.50
Gatethresholdvoltage IC = 9.60 mA, VCE = VGE Tvj = 25°C 4.90 5.80 6.50
VGEth V
Tvj = 175°C 4,10
Gatecharge VGE = -8 V ... 15 V, VCE = 400V QG 4.40 µC
Internalgateresistor Tvj = 25°C RGint 0.7 Ω
Inputcapacitance f = 1 MHz, VCE = 50 V, VGE = 0 V Tvj = 25°C Cies 80.0 nF
Outputcapacitance f = 1 MHz, VCE = 50 V, VGE = 0 V Tvj = 25°C Coes 1.00 nF
Reversetransfercapacitance f = 1 MHz, VCE = 50 V, VGE = 0 V Tvj = 25°C Cres 0.30 nF
Collector-emittercut-offcurrent VCE = 750 V, VGE = 0 V Tvj = 25°C 1.0
ICES mA
VCE = 750 V, VGE = 0 V Tvj = 175°C 5
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V Tvj = 25°C IGES 400 nA
Turn-ondelaytime,inductiveload IC = 450 A, VCE = 400 V Tvj = 25°C 0.28
VGE = -8 V / +15 V Tvj = 150°C td on 0.29 µs
RGon = 2.4 Ω Tvj = 175°C 0.30
Risetime,inductiveload IC = 450 A, VCE = 400 V Tvj = 25°C 0.07
VGE = -8 V / +15 V Tvj = 150°C tr 0.08 µs
RGon = 2.4 Ω Tvj = 175°C 0.08
Turn-offdelaytime,inductiveload IC = 450 A, VCE = 400 V Tvj = 25°C 0.94
VGE = -8 V / +15 V Tvj = 125°C td off 1.05 µs
RGoff = 5.1 Ω Tvj = 175°C 1.05
Falltime,inductiveload IC = 450 A, VCE = 400 V Tvj = 25°C 0.04
VGE = -8 V / +15 V Tvj = 150°C tf 0.05 µs
RGoff = 5.1 Ω Tvj = 175°C 0.06
Turn-onenergylossperpulse IC = 450 A, VCE = 400 V, LS = 20 nH Tvj = 25°C 13.5
VGE = -8 V / +15 V Tvj = 150°C 17.5
RGon = 2.4 Ω Tvj = 175°C Eon 18.0 mJ
di/dt (Tvj 25°C) = 5500 A/µs
di/dt (Tvj 150°C) = 5000 A/µs
Turn-offenergylossperpulse IC = 450 A, VCE = 400 V, LS = 20 nH Tvj = 25°C 23.5
VGE = -8 V / +15 V Tvj = 150°C 29.0
RGoff = 5.1 Ω Tvj = 175°C Eoff 30.0 mJ
dv/dt (Tvj 25°C) = 3100 V/µs
dv/dt (Tvj 150°C) = 2500 V/µs
SCdata VGE ≤ 15 V, VCC = 400 V tP ≤ 6 µs, Tvj = 25°C 4800
ISC A
VCEmax = VCES -LsCE ·di/dt tP ≤ 3 µs, Tvj = 175°C 3900
Thermalresistance,junctiontocoolingfluid perIGBT;∆V/∆t=10dm³/min,TF=75°C RthJF 0.1202) 0.1402) K/W
Temperatureunderswitchingconditions top continuous -40 1503)
for 10s within a period of 30s, occurence maximum 3000 Tvj op 150 175 °C
times over lifetime

1)
Verified by characterization / design not by test.
2)
Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
3)
For Tvjop > 150°C: Baseplate temperature has to be limited to 125°C.
Final Data Sheet 3 V3.0,2017-03-09
 FS820R08A6P2B
HybridPACK™DriveModule

3Diode,Inverter
3.1MaximumRatedValues
Parameter Conditions Symbol Value Unit
Repetitivepeakreversevoltage Tvj = 25°C VRRM 750 V
Implementedforwardcurrent IFN 820 A
ContinuousDCforwardcurrent IF 4501) A
Repetitivepeakforwardcurrent tP = 1 ms IFRM 1640 A
I²t-value VR = 0 V, tP = 10 ms, Tvj = 150°C 19000 A²s
I²t
VR = 0 V, tP = 10 ms, Tvj = 175°C 16000 A²s

3.2CharacteristicValues min. typ. max.

Forwardvoltage IF = 450 A, VGE = 0 V Tvj = 25°C 1.45 1.65
IF = 450 A, VGE = 0 V Tvj = 150°C 1.30
IF = 450 A, VGE = 0 V Tvj = 175°C 1.25
VF V
IF = 820 A, VGE = 0 V Tvj = 25°C 1.70
IF = 820 A, VGE = 0 V Tvj = 175°C 1.60
Peakreverserecoverycurrent IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C) Tvj = 25°C 250
VR = 400 V Tvj = 150°C IRM 350 A
VGE = -8 V Tvj = 175°C 370
Recoveredcharge IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C) Tvj = 25°C 20.0
VR = 400 V Tvj = 150°C Qr 40.0 µC
VGE = -8 V Tvj = 175°C 45.0
Reverserecoveryenergy IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C) Tvj = 25°C 7.00
VR = 400 V Tvj = 150°C Erec 13.0 mJ
VGE = -8 V Tvj = 175°C 15.0
Thermalresistance,junctiontocoolingfluid perdiode;∆V/∆t=10dm³/min,TF=75°C RthJF 0.1752) 0.2002) K/W
Temperatureunderswitchingconditions top continuous -40 1503)
for 10s within a period of 30s, occurence maximum 3000 Tvj op 150 175 °C
times over lifetime

4NTC-Thermistor min. typ. max.

Parameter Conditions Symbol Value Unit
Ratedresistance TC = 25°C R25 5.00 kΩ
DeviationofR100 TC = 100°C, R100 = 493 Ω ∆R/R 5 5 %
Powerdissipation TC = 25°C P25 20.0 mW
B-value R2 = R25 exp [B25/50(1/T2 - 1/(298,15 K))] B25/50 3375 K
B-value R2 = R25 exp [B25/80(1/T2 - 1/(298,15 K))] B25/80 3411 K
B-value R2 = R25 exp [B25/100(1/T2 - 1/(298,15 K))] B25/100 3433 K
Specificationaccordingtothevalidapplicationnote.

1)
Verified by characterization / design not by test.
2)
Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
3)
For Tvjop > 150°C: Baseplate temperature has to be limited to 125°C.
Final Data Sheet 4 V3.0,2017-03-09
 FS820R08A6P2B
HybridPACK™DriveModule

5Module
Parameter Conditions Symbol Value Unit
Isolationtestvoltage RMS, f = 0 Hz, t = 1 sec VISOL  4.2  kV
Materialofmodulebaseplate  Cu+Ni1) 
Internalisolation basicinsulation(class1,IEC61140)  Al2O32) 
Creepagedistance terminaltoheatsink 9.0
dCreep   mm
terminaltoterminal 9.0
Clearance terminaltoheatsink 4.5
dClear   mm
terminaltoterminal 4.5
Comperativetrackingindex CTI  > 200 
min. typ. max.
Pressuredropincoolingcircuit ∆V/∆t = 10.0 dm³/min; TF = 75°C ∆p 643) mbar
Maximumpressureincoolingcircuit
Tbaseplate < 40°C 2.5
Tbaseplate > 40°C p 2.0 bar
(relative pressure)

Strayinductancemodule LsCE 8.0 nH

Moduleleadresistance,terminals-chip TF=25°C,perswitch RCC'+EE' 0.75 mΩ
Storagetemperature Tstg -40 125 °C
Mountingtorqueformodulmounting ScrewM4baseplatetoheatsink 1.80 2.00 2.20
M Nm
ScrewEJOTDeltaPCBtoframe 0.45 0.50 0.554)
Weight G 800 g

Maximum RMS module terminal current Tf = 75°C; TCt = 105°C ItRMS 500 A

1)
Ni plated Cu baseplate.
2)
Improved Al2O3 ceramic.
3)
Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
4)
EJOT Delta PT WN 5451 30x10. Effective mounting torque according to application note AN-HPD-ASSEMBLY
Final Data Sheet 5 V3.0,2017-03-09
 FS820R08A6P2B
HybridPACK™DriveModule

6CharacteristicsDiagrams
outputcharacteristicIGBT,Inverter(typical) outputcharacteristicIGBT,Inverter(typical)
IC=f(VCE) IC=f(VCE)
VGE=15V Tvj=150°C
1600 1600
1500 Tvj = 25°C 1500 VGE = 19V
Tvj = 150°C VGE = 17V
1400 Tvj = 175°C 1400 VGE = 15V
VGE = 13V
1300 1300 VGE = 11V
VGE = 9V
1200 1200
1100 1100
1000 1000
900 900
IC [A]

IC [A]
800 800
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 0,0 0,4 0,8 1,2 1,6 2,0 2,4 2,8 3,2 3,6 4,0
VCE [V] VCE [V]

transfercharacteristicIGBT,Inverter(typical) switchinglossesIGBT,Inverter(typical)
IC=f(VGE) Eon=f(IC),Eoff=f(IC),
VCE=20V VGE=+15V/-8V,RGon=2.4Ω,RGoff=5.1Ω,VCE=400V
1600 70
1500 Tvj = 25°C Eon, Tvj = 150°C
Tvj = 150°C Eoff, Tvj = 150°C
1400 Tvj = 175°C Eon, Tvj = 175°C
60 Eoff, Tvj = 175°C
1300
1200
50
1100
1000
900 40
E [mJ]
IC [A]

800
700 30
600
500
20
400
300
10
200
100
0 0
5 6 7 8 9 10 11 12 0 100 200 300 400 500 600 700 800 900
VGE [V] IC [A]

Final Data Sheet 6 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™DriveModule

switchinglossesIGBT,Inverter(typical) transientthermalimpedanceIGBT,Inverter
Eon=f(RG),Eoff=f(RG), ZthJF=f(t),coolerdesignaccordingtoAN-HPD-ASSEMBLY
VGE=+15V/-8V,IC=450A,VCE=400V ∆V/∆t=10dm³/min;Tf=75°C;50%water/50%ethylenglycol
140 1
Eon, Tvj = 150°C ZthJF : IGBT
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
120 Eoff, Tvj = 175°C

100
0,1

80 ZthJF [K/W]
E [mJ]

60

0,01
40

20 i: 1 2 3 4
ri[K/W]: 0,005 0,05 0,065 0,02
τi[s]: 0,001 0,03 0,25 1,5

0 0,001
0 2 4 6 8 10 12 14 16 18 20 22 24 0,001 0,01 0,1 1 10
RG [Ω] t [s]

reversebiassafeoperatingareaIGBT,Inverter(RBSOA) thermalimpedanceIGBT,Inverter
IC=f(VCE) RthJF=f(∆V/∆t),coolerdesignaccordingtoAN-HPD-Assembly
VGE=+15V/-8V,RGoff=5,1Ω,Tvj=175°C Tf=75°C;50%water/50%ethylenglycol
1700 0,152
1600 RthJF: IGBT

1500 0,150

1400
1300 0,148

1200
0,146
1100
1000
0,144
RthJF [K/W]

900
IC [A]

800
0,142
700
600
0,140
500
400 0,138
300 IC, Modul
IC, Chip
200 0,136
100
0 0,134
0 100 200 300 400 500 600 700 800 4 5 6 7 8 9 10 11 12 13 14
VCE [V] ∆V/∆t [dm³/min]

Final Data Sheet 7 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™DriveModule

capacitycharcteristicIGBT,Inverter(typical) gatechargecharacteristicIGBT,Inverter(typical)
C=f(VCE) VGE=f(QG)
VGE=0V,Tvj=25°C,f=1MHz VCE=400V,IC=450A,Tvj=25°C
100 15
QG
Cies
Coes 12
Cres

10
6

VGE [V]
C [nF]

0
1

-3

-6

0,1 -9
0 100 200 300 400 500 0 1 2 3 4 5
VCE [V] QG [µC]

maximumallowedcollector-emittervoltage forwardcharacteristicofDiode,Inverter(typical)
VCES = f(Tvj), verified by characterization / design not by test IF=f(VF)
ICES = 1 mA for Tvj ≤ 25°C; ICES = 30 mA for Tvj > 25°C
800 1600
VCES 1500 Tvj = 25°C
Tvj = 150°C
1400 Tvj = 175°C
775
1300
1200
1100
750
1000
900
VCES [V]

IF [A]

725 800
700
600
700
500
400
300
675
200
100
650 0
-50 -25 0 25 50 75 100 125 150 175 200 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2
Tvj [°C] VF [V]

Final Data Sheet 8 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™DriveModule

switchinglossesDiode,Inverter(typical) switchinglossesDiode,Inverter(typical)
Erec=f(IF), Erec=f(RG),
RGon=2.4Ω,VCE=400V IF=450A,VCE=400V
22 20
Erec, Tvj = 150°C Erec, Tvj = 150°C
20 Erec, Tvj = 175°C Erec, Tvj = 175°C
18

18
16

16
14
14
12
12
E [mJ]

E [mJ]
10
10
8
8
6
6

4
4

2 2

0 0
0 100 200 300 400 500 600 700 800 900 0 2 4 6 8 10 12 14 16 18 20 22 24
IF [A] RG [Ω]

transientthermalimpedanceDiode,Inverter thermalimpedanceDiode,Inverter
ZthJF=f(t),coolerdesignaccordingtoAN-HPD-ASSEMBLY RthJF=f(∆V/∆t),coolerdesignaccordingtoAN-HPD-ASSEMBLY
∆V/∆t=10dm³/min;Tf=75°C;50%water/50%ethylenglycol Tf=75°C;50%water/50%ethylenglycol
1 0,214
ZthJC : Diode RthJF: Diode
0,212

0,210

0,208
0,1

0,206
RthJF [K/W]
ZthJC [K/W]

0,204

0,202

0,01
0,200

0,198
i: 1 2 3 4
ri[K/W]: 0,015 0,1 0,065 0,02
τi[s]: 0,001 0,03 0,25 1,5
0,196

0,001 0,194
0,001 0,01 0,1 1 10 4 5 6 7 8 9 10 11 12 13 14
t [s] ∆V/∆t [dm³/min]

Final Data Sheet 9 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™DriveModule

NTC-Thermistor-temperaturecharacteristic(typical) pressuredropincoolingcircuit
R=f(T) ∆p=f(∆V/∆t),coolerdesignaccordingtoAN-HPD-ASSEMBLY
Tf=75°C;50%water/50%ethylenglycol
100000 120
Rtyp ∆p: Modul

100

10000 80

∆p [mbar]
R[Ω]

60

1000 40

20

100 0
0 20 40 60 80 100 120 140 160 4 5 6 7 8 9 10 11 12 13 14
TC [°C] ∆V/∆t [dm³/min]

Final Data Sheet 10 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™DriveModule

7Circuitdiagram
P3 P2 P1
T11
C5 C3 C1
T

T12

G5 G3 G1
E5 E3 E1 T21
3 2 1 T
C6 C4 C2
T22

G6 G4 G2 T31

E6 E4 E2 T

T32
N3 N2 N1

Final Data Sheet 11 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™DriveModule

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Final Data Sheet 12 V3.0,2017-03-09

 FS820R08A6P2B
HybridPACK™ Drive Module

9 Label Codes
9.1 Module Code
Code Format Data Matrix
Encoding ASCII Text
Symbol Size 16x16
Standard IEC24720 and IEC16022
Code Content Content Digit Example (below)
Module Serial Number 1-5 71549
Module Material Number 6 - 11 142846
Production Order Number 12 - 19 55054991
Datecode (Production Year) 20 - 21 15
Datecode (Production Week) 22 - 23 30
Example

71549142846550549911530

9.2 Packing Code

Code Format Code128
Encoding Code Set A
Symbol Size 34 digits
Standard IEC8859-1
Code Content Content Identifier Digit Example (below)
Backend Construction Number X 2-9 95056609
Production Lot Number 1T 12 - 19 2X0003E0
Serial Number S 21 - 25 754389
Date Code 9D 28 - 31 1139
Box Quantity Q 33 - 34 15
Example

X950566091T2X0003E0S754389D1139Q15

Final Data Sheet 13 V3.0, 2017-03-09

 FS820R08A6P2B
HybridPACK™ Drive Module

Revision History
Major changes since previous revision

Revision History
Reference Date Description
V1.2 2016-01-14 Increased ICRM and minor revisions, based on FS660R08A6P2B revision 1.1
V2.0 2016-11-24 Preliminary datasheet 2.0
V3.0 2017-03-09 Final datasheet 3.0

Final Data Sheet 14 V3.0, 2017-03-09

 FS820R08A6P2B
HybridPACK™ Drive Module

Terms & Conditions of usage

Edition 2014-05-30

Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.

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DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™,
HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, POWERCODE™,
PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™,
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Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™,
µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of
DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of
Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION
FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor
Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO.,
MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave
Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun
Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited.
VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of
WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.

Last update 2011-11-11

Final Data Sheet 15 V3.0, 2017-03-09

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