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Packaging technology
4. Conclusion
Electronic Packaging Development Trend
Packaging technology is developing to compensate the technology
gap between Si and PCB tech.
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Memory Packaging Roadmap
Flip chip and TSV/WLCSP are promising technologies to satisfy faster
speed, wider bandwidth and smaller/thinner package
Past Present Near Future
PC/Notebook Smart Phone/Tablet PC IoT (Wearable Device, Smart Car, Cloud(Big Data)
/Smart Device Smart Home and so on)
Device
Market
DRAM
TSV
High Performance
BOC & Density
Flip Chip 3D SiP
2.5D SiP*** Optical
TSOP RDL DDP/QDP Interconnection
High Performance
SSD
& Density
eMMC UFS
(with Controller) BGA SSD NAND TSV
EMI* Shield
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Innovative Packaging Technology - Package
② Chip Stack (Planar)
Planar chip stack is driven by low cost and high density requirement
2.5D SiP is a suitable solution to place memory dies near SoC
Planar Stack Package 2.5D SiP
BOC/Flip chip planar DDP(Dual Die Package) SoC + 2/4/8 HBMs(High Bandwidth Memory)
on interposer
Various structures : CoCoS, CoWoS (TSMC),
EMIB (Intel)
HBM
Interposer
Substrate
Pinwheel package
- Thin Profile HBM
- Improve Signal Integrity
Source : AMD
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Innovative Packaging Technology - Package
② Chip Stack (Vertical)
Conventional chip stack using wiring and TSV chip stack are implemented
Wire Interconnection TSV Interconnection
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Innovative Packaging Technology - Package
③ Fan out package
Cost
Performance
*Source: http://gigglehd.com/zbxe/14078384
1InFO (Integrated Fan Out Wafer Level PKG), 2SLIM (siliconless integrated module),
3SWIFT (Silicon Wafer Integrated Fan-out Tech.), 4SLIT (Silicon-less Interconnect Tech.)
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Innovative Packaging Technology - Package
③ Fan out package
Infra
YIELD
fBGA FOWLP FOPLP
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Conclusion
SK hynix is leading new and advanced memory package development
against diverse and rapidly changing circumstances of semiconductor industry
2GB DDR2 Wafer Level
Package Memory Module
24Stack 1.4T NAND -World Wide 1st (2007.1)
-World Wide 1st
(M/S, 2007.9)
Flexible
2007
4GB DDR2 Wafer Level 2008 Package Optical
Package Memory Module 8Stack NAND
-World Wide 1st (2008.12) -World Wide 1st Interconnection
(C/S, 2008.12)
2Stack Wafer level
Package using TSV 2010
WLCSP 0.37T
- World Wide 1st
(E/S, 2013.9) 128GB LRDIMM 3DS for 64GB/128GB
128GB DDR4 WIO2 Mobile DRAM Module using TSV RDIMM
Module using TSV (4x Faster) using TSV -World Wide 1st
-World Wide 1 st st
-World Wide 1 (2014.9) (Validated 2015.11)
Conventional PKG (2014.3) 16Stack NAND 0.9T
64GB DDR4
Wafer Level PKG (WLP, TSV) Module using TSV using 15um Chip
-World Wide 1st
-World Wide 1st
(E/S, 2014.9)
(2013.9)
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Thanks for Your Time