DVD PLAYER DVP3320X/78

DVD PLAYER DVP3320X/78

Service Manual
Service Manual
Conteúdo Página
Especificações Técnicas 2
Instruções de Segurança 3
Instruções Mecânicas e Desmontagem 5
Atualização de Software 9
Fluxos de Solução de Problemas 10
Diagrama de Ligações 21
Painel Frontal 22
Painel Switch 23
Painel OK 24
Painel Power 25
Painel Principal 26
Guias de Placas 30
Vista Explodida 35 CLASS 1
LASER PRODUCT

Impresso no Brasil Sujeito a Alterações Todos os Direitos Reservados

CLASS 1
4806 727 17377

PHILIPS
08/2009
LASER PRODUCT

Impresso no Brasil Sujeito a Alterações Todos os Direitos Reservados 4806 727 17377

PHILIPS
08/2009
 DVP3320

Especificações Desempenho do áudio

• Conversor DA: 24 bits, 192 kHz
• Resposta de frequência:
• DVD: 4 Hz - 22 kHz (48 kHz); 4 Hz
- 44 kHz (96 kHz)
Nota
• SVCD: 4 Hz - 20 kHz (44.1 kHz); 4
• Especificações e aparência estão sujeitas a Hz - 22 kHz (48 kHz)
alterações sem prévio aviso.
• CD/VCD: 4 Hz - 20 kHz (44.1 kHz)
• Sinal-Ruído(1 kHz): > 90 dB (A-
Acessórios fornecidos weighted)
• Controle remoto • Relação Dinâmica(1 kHz): > 80 dB (A-
• Cabos de áudio/vídeo weighted)
• Cabo de força • Crosstalk (1 kHz): > 90 dB
• Distorção/ruído(1 kHz): > 65 dB
Mídia de reprodução • MPEG MP3: MPEG Audio L3
• DVD-Video, Video CD/SVCD, Audio CD,
CD-R/CD-RW, DVD+R/+RW, DVD-R/- Formato de áudio
RW, Picture CD, MP3-CD, WMA-CD, • Digital:
USB flash drive • MPEG/AC-3/PCM: Compressão
USB digital (16, 20, 24 bits fs, 44.1, 48, 96
• Compatível: USB kHz)
• Classe suportada: UMS (USB Mass Storage • MP3 (ISO 9660): 96, 112, 128, 256
Class) kbps & variable bit rate fs, 32, 44.1,
48 kHz
• Audio analógico estéreo
TV padrão • Downmix compatível Dolby surround
• Número de linhas: do áudio Dolby Digital multi-channel
• 625 (PAL/50Hz); 525 (NTSC/60Hz)
• Reprodução: Multi-standard (PAL/NTSC) Conexões
• Saída YPbPr: Cinch3x
• Saída de Vídeo: Cinch (amarelo)
Desempenho de vídeo • Saída de Áudio: (L+R): Cinch (branco/vermelho)
• Video DAC: 14 bits, 108 MHz • Saída Digital :
• Y Pb Pr: 0.7 Vpp ~ 75 ohm • 1 coaxial: IEC60958 para CDDA/
• Saída de vídeo: 1 Vpp ~ 75 ohm LPCM; IEC61937 para MPEG 1/2,
Dolby Digital
Formato de vídeo Unidade Principal
• Compressão Digital: • Dimensões (L x A x P): 360 x 37 x 209
• MPEG 2: DVD/SVCD (mm)
• MPEG 1: VCD • Peso: aproximado 1.3 kg
• Resolução Horizontal: Alimentação
• DVD: 720 pixels (50 Hz); 720 pixels • Tensão de alimentação : 110 V - 240 V; 50/60
(60 Hz) Hz
• VCD: 352 pixels (50 Hz); 352 pixels • Consumo de energia: < 10 W
(60 Hz) • Consumo de energia no modo standby:
• Resolução Vertical: <1W
Especificação do Laser
• Tipo: Semicondutor laser InGaAIP
• DVD: 576 pixels (50 Hz); 480 pixels
(DVD), AIGaAs (CD)
(60 Hz)
• Comprimento de onda: 655 nm (DVD), 790 nm
• VCD: 288 lines (50 Hz); 240 lines
(CD)
(60 Hz)
• Potência de saída: 10 mW (DVD), 5 mW
(VCD/CD)
• Divergência do feixe: 60 graus
 Safety Information, General Notes & Lead Free Requirements 3139 785 3093x 2. EN 5

DVP3320 
2. Safety Information,
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Safety Information,
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2.1 Safety Instructions 2.2 Warnings
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STRÅLENDEM STRAHL AUSSETSEN
DEM STRAHL AUSSETSEN
Wavelength : 0.8 mW :
(leitura0.8 mW
de DVD)
: : 650
VARO! AVATTAESSA
DANGER VISIBLE ANDOLET ALTTIINALASER
INVISIBLE NÄKYVÄLLE
RADIATION JA NÄKYMÄTTÖMÄLLE
WHEN OPEN AVOID LASER
DIRECTSÄTEILYLLE.
EXPOSURE ÄLÄTOKATSO
BEAM SÄTEESEEN

nmnm nm(DVD)
DANGER VISIBLESICHTBARE
AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM
: reading)
780 780 (VCD/CD) (VCD/CD) VORSICHT
ATTENTION RAYONNEMENT
UND UNSICHTBARE
LASER VISIBLE
LASERSTRAHLUNG
ETRADIATION
INVISIBLE WHEN EN CAS
WENN ABDECKUNG
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU
D’OUVERTURE
GEÖFFNET
EXPOSITION
NICHT
DANGEREUSE
DEM STRAHL
TO BEAM AU FAISCEAU
AUSSETSEN
FAISCEAU

: 0.3 mW (leitura de VDC/CD) (DVD : 780 nm (VCD/CD) 2.2.3 NotesDANGER VISIBLE AND INVISIBLE
ATTENTION RAYONNEMENT LASERFigura
LASER OPEN AVOID DIRECT EXPOSURE
2-2 EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU
Output
Output Power Power : 20 : mW20 mW VISIBLE ET INVISIBLE

DivergênciaOutput Power do feixe: 60: graus 0.3 mW : 20 mW

Figure
(VCD/CD (DVD+RW (DVD+RW writing)
reading) writing) Dolby Figure 2-2 2-2
: (DVD+RW
0.8 mW writing) 2.2.3 Notas Figure 2-2
Beam divergence : 60 degree : 0.8 mW Manufactured under licence from Dolby Laboratories. “Dolby”,
: 0.8 mWreading)
: 0.3
(DVD (DVD
: (DVD
reading)
0.3 mW
mW reading)
2.2.3
“Pro
2.2.3Notes
Logic”
2.2.3 NotesDolby
Notes
and the double-D symbol are trademarks of Dolby
: 0.3 mW Laboratories.
Manufaturado Condential sob Unpublished
licença do Dolby Works. Laboratories. "Dolby", "Pro
(VCD/CD reading) Dolby
(VCD/CD reading)
(VCD/CD reading) Dolby
©1992-1997 Logic" DolbyDolby
e o símbolo Laboratories, duplo-D Inc. são Allmarcas
rights reserved.resgistradas do Laborató
Beam Beam divergence
divergence : 60: degree 60 degree Manufactured under licence fromfrom Dolby Laboratories. “Dolby”,
Beam divergence CLASS 1 : 60 degree Manufactured
rio Manufactured
Dolby. under
under
licence
licence from
Dolby
Dolby
Laboratories.
Laboratories.
“Dolby”,
“Dolby”,
“Pro “Pro
Logic” Logic” and and
the the
double-D double-D symbol symbol are are trademarks
trademarks of of Dolby
Dolby
LASER PRODUCT © 1992-1997
“Pro Logic”Con Laboratório
andCon the double-D Dolby, Inc. Todos
symbolWorks. os
areWorks. direitos
trademarks of Dolby reservados.
Laboratories.
Laboratories. dential dential Unpublished
Unpublished
Laboratories.
©1992-1997 Con
Dolby
©1992-1997 Dolby Laboratories, Inc. All rights dential
Laboratories, Unpublished Inc. AllWorks.
rights reserved.
reserved.
Figura 2-1 CLASS 1 ©1992-1997 Dolby Laboratories, Inc. All rights reserved.
CLASS 1 Figure 2-3
FigureLASER CLASS2-1PRODUCT 1
LASER PRODUCT
Nota: o uso dos controles LASER ou do ajuste ou o desempenho do pro-
PRODUCT
cedimento à exceção daqueles especificado neste manual, podem Trusurround
resultar na exposição perigosa à radiação. Evite a exposição direta TRUSURROUND, Figura SRS 2-3 and symbol (g 2-4) are trademarks
Note: Use of controls or adjustments or performance of Figure Figure 2-3 2-3
ao feixe. Figure Figure 2-1may 2-1 of SRS Labs, Inc. TRUSURROUND Figure technology
2-3 is
procedure other than those specied herein,
Figure 2-1 result in
manufactured
Trusurround under licence frm SRS labs, Inc.
hazardous radiation exposure. Avoid direct exposure to beam. Trusurround
Trusurround
TRUSURROUND,
Trusurround SRS e o símbolo (fig. 2-4) são marcas registra
TRUSURROUND, SRS and symbol (g 2-4) are trademarks
Note: Use of controls
Note: Use of controls or adjustments or performance of or adjustments or performance of das do LaboratórioSRS
TRUSURROUND,
TRUSURROUND, SRS, SRS
andInc.and
symbol
A tecnologia
symbol
(g 2-4) are trademarks
gTRUSURROUND
(technology
2-4) are trademarks é
Note: Use of controls or adjustments or performance of of SRS of SRS Labs, Labs, Inc. Inc.
TRUSURROUNDTRUSURROUND technology is is
procedure
procedure other other
thanthan those thosespeci speci ed herein,
ed herein, maymay result result
in in manufaturada ofmanufactured
SRS Labs, sob Inc. licençaTRUSURROUND do laboratório SRS,
technology Inc.
procedure
hazardous other
radiationthan those speci
exposure. Avoided herein,
direct may result
exposure toinbeam. manufactured under under licence licence frm SRS frm SRS labs, Inc. Inc. is
labs,
hazardous radiation exposure. Avoid direct exposure to beam. manufactured Figure under 2-4licence frm SRS labs, Inc.
hazardous radiation exposure. Avoid direct exposure to beam.

Figura 2-4 Figure

Figure 2-4 2-4
Figure 2-4
 EN 6 2. 3139 785 3093x Safety Information, General Notes & Lead Free Requirements
93x Safety Information, General Notes & Lead Free Requirements
 6
EN Video 2. PlusDVP3320 3139 785 3093x Safety Information, General
Due to lead-free Notes &some
technology Lead rulesFree have Requirements
to be respected by the
“Video Plus+” Due and to “PlusCode” are registered
lead-free technology some trademarks
rules have workshopby
of to be respected during
the a repair:
stered trademarks the Gemstar
of Development
workshop during Corporation.
a repair: The “Video Plus+”
Video
system Plus is manufactured under licence from the Gemstar Due to lead-free
x Use only technology
lead-free some solder rules alloyhave to beSAC305
Philips respected withbyorder
the
n. The “Video Plus+”
Vídeo Plus
“Video Plus+” and
Development Corporation. “PlusCode” are registered trademarks of companhias
workshop during aexternas.
repair:
code 0622 149 00106. If lead-free solder-pate is required,
from the Gemstar x Use only lead-free solder alloy Philips SAC305 with order
"Video thePlus+"
Gemstar e "Plus Code" são
Development marcas registradas
Corporation. The “Video do Plus+”
Gemstar • Informações pleaseespeciais contact the para ICs BGA sem
manufacturer chumbo:
of your estes ICs
solder-equipment.
code 0622 149 00106. If lead-free solder-pate is required,
Development Corporation. O sistema
system is manufactured under licence from the Gemstar "Video Plus+" é fabricado serão
x Use entregues
In only lead-free
general nouse chamado
of solder “pacote
solder-paste alloy Philipsa seco”
within para proteger
SAC305
workshops with order
should o IC
be
please contact the manufacturer of your solder-equipment.
sob Development
a licença da Gemstar Corporation. Development Corporation. contracode umidade.
avoided 0622 Este
149 pacote
00106. If só pode
lead-free ser aberto
solder-pate pouco
is antes
required, de
In general use of solder-paste within workshops should be because paste is not easy to store and to handle.
ser usado Use(soldado).
please contact Oumanufacturer
the então o corpo
tools of doyourIC fica “molhado”
solder-equipment. dentro
avoided because paste is not easy to store and to x handle. only adequate solder applicable for lead-free
e durante
Insolder o tempo
general use deof aquecimento
solder-paste
alloy. The solder tool must be able a estrutura
within workshopsdo IC será
should destru-
be
 x Use only adequate solder tools applicable for lead-free
ída por causa
avoidedo To becauseda altaattemperatura
reach notdentro
easy todostore
pasteaissolder-temperature
least corpo. ofSe
and toohandle.
400°C, pacote for
solder alloy. The solder tool must be able
 aberto
x Use antes onlydoadequate
uso, o the ICsolder
deve ser
toolsesquentado
applicable for por algumas
lead-free horas
o To reach at least a solder-temperature of 400°C, o To stabilize adjusted temperature at the solder-tip
Figure 2-5 (em torno
solder o To exchange solder-tips for different applications. RE-
de 90
alloy. o
) Para
The secar
solder (pense
tool must nabeproteção
able ESD!). NÃO
o To stabilize the adjusted temperature at the solder-tip
Figura 2-5  USExBGAs o To de
Adjust reach modo
your at algum!
least
solder a solder-temperature
tool so that a temperature of 400°C,
around 360°C
o To exchange solder-tips for different applications.
• Para produtoso To produzidos
stabilize the ante
adjusted de 1.1.2005,
temperature contendo
at ferramenta
the solder-tip
 x Adjust
Figure 2-5 your solder tool so that a temperature around –360°C 380°C is reached and stabilized at the solder joint.
Microvision Macrovision de solda o com chumbo solder-tips
To exchange e componentes, toda a applications.
for different lista de peças será
– 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec.
Este produto This productincorpora tecnológia
incorporates de proteção
copyright de cópia
protection que é that 
technology avaliada
x Adjust atéyour o fimsolderdo períodotool sodethat serviço. Para reparo
a temperature around destes
360°C
Heating-time of the solder-joint should not exceed ~ Avoid 4 sec. temperatures above 400°C otherwise wear-out of tips
o metódo
otection technology dethat
proteção
is protected exigidoclaims
by method da certificado
of certain U.S
U.S. depatents
patentes ande aparelhos,
– will
380°C nada
rise is muda.
reached
drastically and
and stabilized
 ux- uid at
will the
be solder
destroyed. joint. To avoid
Macrovision Avoid temperatures above 400°C otherwise wear-out of tips
outros
in U.S. patents proprietários
other
and intellectual intelectuais
property da própria
rights owned Macrovision
by Macrovision Corpora- • No websiteHeating-time www. atyourservice.ce.Philips.com
of the solder-joint should notvocê exceed encontra
~ 4 sec. mais
This product incorporates will rise drastically
copyright protection and ux-uid will
technology that be destroyed. Towear-out avoid of tips switch off un-used equipment, or reduce
tion. Corporation and other rights owners.
d by Macrovision informações
Avoid
heat. sobe:
temperatures above 400°C otherwise wear-out of tips
isUse
protected wear-out of tipsU.S.
switch off un-used
and equipment, or reduce
O uso desta thisby
of tecnologia method
copyright claims
de protection
proteção
heat.
ofdecertain
cópia deve
technology patents
mustser be
autorizada •  (De) xSolda
will
Mix rise BGA
of (+ instruções
drastically
lead-free and ux-
solder de operação).
alloy uid will be
/ parts withdestroyed.
leaded solder To avoid alloy
pela other intellectual
Macrovision property
Corporation rights
e é owned
permitido by
paraMacrovision
casas e outros • Perfis de
wear-out aquecimentoofpossible dos
tips switch BGAs
off e outros
un-used ICs usados
equipment, em apare-
or reduce
logy must be authorized by Macrovision Corporation,
x Mixowners. and is intended for
of lead-free solder alloy / parts with leaded solder alloy / parts is but PHILIPS recommends strongly to
Corporation and other rights
n, and is limites
intended somente
home forand com otherautorização
limited viewing da Macrovision
isuses
/ partstechnology
Corporation.
only unless
possible but PHILIPSotherwise A lhos Philips.
recommends stronglyavoid
heat. mixed solder alloy types (leaded and lead-free).
to
Use
desmontagem of this écopyright
proíbida. protection must beengineering  x Mix of lead-free solderoralloy
nly unless authorized
otherwise
authorized by
by Macrovision
Macrovision avoidCorporation.
mixed
Corporation,
Reverse
solder
and alloy
is types
intended (leaded
for and lead-free). If one cannot avoid does/ not parts withwhether
know leaded solderproduct alloy
is
n. Reverse engineering or disassembly is prohibited. Você /encontra
parts
lead-free, is estas
possible e mais
but informações
PHILIPS técnicas
recommends
clean carefully the solder-joint from old solder em “magazine”,
strongly to
home and other limited If one uses
viewing cannot avoid
only unlessor does not know whether product
otherwise is
2.3 Solda sem chumbo capítuloavoid “workshop
alloy mixed
and re-solder news”.
solder alloy
withtypesnew solder (leaded and(SAC305).
alloy lead-free).
authorized by Macrovisionlead-free, Corporation. clean carefully
Reverse the solder-joint from old solder
engineering If Use
one only cannot avoidspare-parts
or does notlisted knowinwhether product is
2.3 orLead Free
disassembly Requirement
is prohibited. alloy and re-solder with new solder alloy (SAC305).  x original the Service-Manuals.
A Philips CE está produzindo aparelhos sem chumbo (PBF) de Para lead-free,
questões
Not listedadicionais,
clean carefully
standard-material por favor, contate o from
the solder-joint
(commodities) helphas desk
old local.
solder
to be
 x Use only original spare-parts listed in the Service-Manuals.
1.1.2005 para frente. alloy
purchasedand re-solder at with new
external companies.solder alloy (SAC305).
Information Not listed
about Lead-free produced sets standard-material (commodities) has to be
2.3 Lead Free Requirement purchased at external companies.
  xxUseSpecialonly original
information spare-parts
for BGA-ICs: listed in the Service-Manuals.
ed sets Identificação: A etiqueta de modelo tem um número de série de 14 3. Instrução
Not listed destandard-material
Usothe 12nc-recognizable (commodities) has to be

Philips CE is starting x Special information
production of lead-freefor setsBGA-ICs:
from - always use soldering temperature
dígitos. Os dígitosabout
Information 5 e 6 Lead-free
referem-seproduced ao ano desets produção, os dígitos purchased
pro le of at external
the speci c companies.
BGA (for de-soldering always use the
d-free sets 1.1.2005 onwards. - always use the 12nc-recognizable soldering temperature
7 efrom8 referem-se à semana de produção (no exemplo abaixo, é  Veja x oSpecial
Manualinformation
lead-free no GIP. for BGA-ICs:
prole of the specic BGA (for de-soldering always use the temperature prole, in case of doubt)
1991Philips
na semana
CE is 18).starting production of lead-free setsprofrom - always
- lead free useBGA-ICs
the 12nc-recognizable
will be delivered soldering
in so-calledtemperature
‘dry-
INDENTIFICATION: lead-free temperature le, in case of doubt)
1.1.2005 onwards. pro le of the speci c BGA (for
packaging’ (sealed pack including a silica gel pack) de-soldering always useto the
- lead free BGA-ICs will be delivered in so-called ‘dry-
lead-free
protect the temperature
IC againstpro le, in case
moisture. Afterofopening,
doubt) dependent
packaging’ (sealed pack including a silica gel pack) to
Regardless of special logo (not always indicated) - lead free BGA-ICs willindicator-label
be delivered ininso-called
INDENTIFICATION: protect the IC against moisture. After opening, dependent of MSL-level seen on the bag, ‘dry- the
s indicated) packaging’ (sealed pack including a silica gel pack) to
of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture
One must treat all sets from 1 Jan 2005 onwards, according protect the IC against moisture. After opening, dependent
Regardless of special logoBGA-IC (not always possibly still has to be baked dry. (MSL=Moisture
indicated) Sensitivity Level). This will be communicated via AYS-
05 onwards,
Apesar next
do rules.
according
logo especial sem chumbo (que nem sempre é ofwebsite.
MSL-level seen on indicator-label in the bag, the
Sensitivity Level). This will be communicated via AYS-
indicado),todos os aparelhos desta data pra frente de acordo com BGA-IC
Do not possibly re-use BGAs still has to be baked dry. (MSL=Moisture
at all.
Example OneS/N:must treat all sets from website.
1 Jan 2005 onwards, according
as regras descritas abaixo. Sensitivity Level). This will be communicated via AYS-
next rules. Do not re-use BGAs at all.
 xwebsite.
For sets produced before 1.1.2005 (except products of
Do not re-use BGAsleaded at all. solder-alloy and components,
Example S/N:  x For sets produced before 1.1.2005 (except products 2004), of containing
2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the
 x For sets produced before
repair1.1.2005
of such (except products of
all needed spare-parts will be available till the end ofservice-period. the For sets nothing changes.
2004), containing leaded solder-alloy and components,
service-period. For repair of such sets nothing changes.
 xallOn neededour websitespare-parts will be available till the end of theyou
www.atyourservice.ce.Philips.com
service-period. For repair to:of such sets nothing changes.
 x On our website www.atyourservice.ce.Philips.comyou nd more information
nd more information to:
  xƒOn our website www.atyourservice.ce.Philips.com
BGA-de-/soldering (+ baking instructions) you
nd more information
Heating-pro les of to: and other ICs used in Philips-sets
BGAs
 ƒBGA-de-/soldering (+ baking instructions)  ƒ
 ƒHeating-proles of BGAs and other ICs used in Philips-sets
Com a tecnologia sem chumbo, algumas regras devem ser respei-  ƒBGA-de-/soldering
You will nd this and (+ baking
more technicalinstructions) information within the
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
tadas pelo posto autorizado durante o reparo:  ƒHeating-pro
“magazine”, les of BGAs
chapter “workshop and other ICs used in Philips-sets
news”.
6 is the the week
year, digitnumber,
7&8 is so in this case 1991 You wkwill18 nd this and more technical information within the
• Use apenas ferramentas de solda sem chumbo Philips SAC305
“magazine”, chapter “workshop news”.
Socom
Bottom from o0501
line código
of onwards
typeplatede pedido
= from
gives 10622 149
Jan 2005
a 14-digit S/N.00106.
onwards
Digit 5&6 Seisathepasta
year,dedigitsolda
7&8 is sem You will nd this and more technical information within the
chumbo
the week for necessária,
number, so in this casepor 1991favor
wk 18 contate o fabricante do equi- “magazine”,
For additional questions chapter
please “workshop
contact your news”. local repair-helpdesk.
pamento de solda. No geral, o uso de pasta de solda em postos
SoImportant
from 0501 onwards =
For
from 1
additional
Jan 2005
questions
onwards
please contact your local repair-helpdesk.
deve note:
ser evitada
In fact alsopois a pasta
products of yearnão
2004émustfacilmente
be treated manuseada
in this way as longnem as you
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
armazenada.
ated in this way as long as you For additional questions please contact your local repair-helpdesk.
temperatures belong to this.
ys use• SAC305
Useand the higher
apenas ferramentas de solda aplicáveis para ferramenta de
Important note: In fact also products of year 2004 must be treated in this way as long as you
solda sem chumbo. A ferramenta de solda deve:
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
temperatures
- Alcançarbelong tonathis.
ponta da ferramenta a temperatura de pelo menos
400o
- Estabilizar o ajuste de temperatura na ponta da solda.
- Troque a ponta de solda para diferentes aplicações.
• Ajuste sua ferramenta de solda para que a temperatura de 360o
- 380o seja alcançada e estabilizada na junção da solda. O tempo
de aquecimento da junção da solda não deve exceder ~ 4s. Evite
temperaturas acima de 400o , ou então "wear-out" das pontas
irá aumentar drasticamente e o fluxo- fluido será destruído. Para
evitar "wear-out" de pontas, desligue o equipamento quando não
usado ou reduza a temperatura.
• Misturar parte/ ferramenta de solda sem chumbo com partes/
ferramentas de solda com chumbo é possível mas a PHILIPS
recomenda que se evite isso. Se não puder ser evitado, cuidado-
samente limpe a solda da antiga ferramenta e re-solde com uma
nova ferramenta.
• Use apenas peças originais listadas no Manual de Serviço. Mate-
riais padrão não listados (comodities) devem ser comprados em
 DVP3320 

Instruções Mecânicas e Desmontagem

Instruções de Desmontagem

O guia a seguir mostra como desmontar o aparelho.

Passo 1: Remova os 5 parafusos da Tampa Superior e retire-a. (Figura 1).

Figura 1

Passo 2: Se for necessário desmonte o Painel Frontal ou o Carregador, a porta Frontal deve ser removida primeiro. (Figura 2)
Nota: Certifique-se de operar gentilmente ou o guia pode ser danificado.

Certifique-se de desmontar a porta frontal cuidadosamente

para não danificar a bandeja e a porta frontal. Figura 2
  DVP3320 3-2

Mechanical and Dismantling Instructions

Instruções
Dismantling de Desmontagem
Instruction Detailed information please refer to the model set.

Passo
Step3: If the3:tray
Se can’t
a bandeja não
open in pode way,
normal ser aberta normalmente,
you can podemos
make it through abri-la seguindo
the instruction as belowas(Figure
instruções
3). abaixo (Figura 3).
Note:Nota:
MakeCertifique-se de operar
sure to operate gentilmente
gently otherwise thepara nãowould
guider danificar o guia.
be damaged.

Figura 3
Figure 3

Passo
Step4: 4: Desmontagem
Dismantling do disconnect
Front Panel, Painel Frontal, solte os conectores
the connectors (XP1),
(XP1), need solte 4assnaps
release 4 travas do Painel
of Front PanelFrontal
and 2e snaps
as 2 travas do gabinete
of bottom cabinet ,inferior, então
then gently retire
pull the oPanel
Painel
outdofrom
aparelho.
the set.(Figura
(Figure44- -Figura
Figure6)6)

XP7 XP5

XP6

XP8
XP10 XP2
XP9
XP1

FigureFigura
4 4
 DVP3320 

Figura 5

Passo 5 : Desmontagem do Carregador, solte os 3 conectores (XP7, XP8, XP9 ) conforme a figura abaixo e remova o parafuso que
conecta o carregador e o gabinete frontal. (Figura 5 & 6)

Figura 6
 DVP3320

Passo 6: Desmontagem do Painel Principal, primeiro desconecte (XP2), e remova os 4 parafusos. (Figura 7)
Passo 7: Remova os 4 parafusos do Painel Power para desmontá-lo. (Figura 7)

Figura 7
 DVP3320 

Atualização do Software
Como atualizar o software B. Lendo a versão do Firmware para confirmar a
1) Grave os dados em um disco CD-R ou RW virgem. atualização
1) Ligue o aparelho e Abra a porta da bandeja.
2) Pressione as teclas <9><6><6> para checar as
A. Procedimentos para atualização do software: informações do software.
1) Ligue o aparelho e insira o CDR de atualização A versão do software e as outras informações aparecem
preparado. na tela do TV como segue:
2) O aparelho ligará lendo o disco e aparecerá Versão BE: DVP33XX_XX.XX
a seguinte tela no TV: Versão FE: XXXX.XXXXXX
Loading Versão DSP: DSP.XX
Firmware Upgrade Erase and program. Código da Região: X
OK Cancel
Selecione OK para iniciar a atualização.
3) Pressione a tecla <OK> para confirmar, a tela
mostrará :
Firmware Upgrade Programming, Please Wait...
Atenção: O aparelho não deve ser desligado
Do not Switch the Player Off !
durante a atualização, pois o Painel Principal
4) O disco de atualização dairá automaticamente quando
será danificado inteiramente.
estiver completada a cópia dos arquivos, retire o disco.
5) Após 1 minuto, a bandeja fechará automaticamente
quando a atualização estiver completa.

Troca do Código da Região

1) Ligue o aparelho e abra a porta da bandeja;

2) Pressione "9" "8" "7" "9" e o número código da
região (0-6) no controle remoto.

Notas: reinicie após os passos acima.

 10 DVP3320

FLUXOS SOLUÇÃO DE PROBLEMAS

Motor Spindle não funciona

Motor não funciona

Acesse

Cheque o conector FFC Não

Faça a conexão correta
de 24P no carregador

Sim

Cheque se “RFA5V” Não Cheque a alimentação

RFA5V
tensão (+5V) esta normal

Sim

Cheque se tensão de laser

Não Cheque/Troque Q4,Q5
(2,3V para DVD & 1,9V para CD)
no Coletor de Q4 e Q5

Sim

1.Se tensão no pino 97 do

U2 varia entre 0 e 3.3V
Não Cheque/troque U2.
(3.3V para CD e 0V para DVD),
2. Se componentes periféricos estão
corroídos ou mal soldados

Sim

Não 1. Cheque U2 pino 89, sinais

Não tem foco FOCUS_PWM
2.Se existe sinais F+, F-, T+ e T-
nas saídas de U4.

Sim
forma de onda FOCUS_PWN
Cheque/troque o carregador
 DVP3320 11

Não é possível ligar ou desligar

Não é possível ligar ou

desligar

Acesse

Cheque se a alimentação Não

Repare o painel power
no painel power esta normal

Sim

Cheque se o CON2 no painel Não

Yes
frontal do XP6 no painel decodificador Cheque/Faça a conexão correta
esta com bom contato.

Sim

Cheque se XP1 no painel deco- Não

dificador para XS301 no painel fron- Faça a conexão correta
tal esta com bom contato.

Sim
12 DVP3320

Todas as saídas de tensões do painel power estão 0V ou erradas.

Todas as saídas de tensões

do painel power estão 0V ou
erradas

Sim

Cheque se Sim
F1 está queimado Troque F1

Não

Cheque se existe Não Troque C1 e C2 se D1, D2, D3, D4

300V no C1 ou C2. estiverem normal.

Sim

Cheque se sinal do oscilador Não

Cheque/troque U1.
de 100KHz no Pino 6 do U1

U1(PINO 3 - RC forma de onda) U1(PINO 8 - Desenho da forma de onda)

Sim

Cheque se +5V e +12V Não

Cheque se U2 está corroído
estão em curto

Sim

Cheque se os componente na tensão do

curto-circuito estão defeituosos ou corroídos.
 DVP3320 13

Disco não pode ser lido

Disco não pode ser lido

Sim

Cheque a conexão FFC de Não

Cheque o circuito carregador
24P até o carregador

Sim

1.Cheque se a tensão no pino 97 de

Cheque se existe tensão
laser (2,3V para DVD
e 1,9V para CD) no
coletor de Q4 e Q5
U2 varia entre 0 e 3.3V:
Não 3.3V para CD
0V para DVD
2. Cheque se componentes periféri-
cos estão corroídos ou defeituosos.

Sim

Cheque U2, U4,e com- Não

ponentes periféricos estão Re-solde ou troque as partes defeituosas
corroídos ou mal soldados

Sim

Cheque se existe sinal RFO Não

no pino 10 do XP7. (O Cheque U1 e componentes periféricos
sinal normal RFO é uma onda
reticulada limpa)

Sim

Cheque a conexão Não

Faça a conexão correta
de U2

Sim

Troque U2 ou o carregador
14 DVP3320

Somente disco DVD ou somente disco exceto DVD é reproduzido

Somente disco DVD ou

somente disco exceto DVD é reproduzido

Acesse

Cheque a conexão FFC Não

Cheque o circuito carregador
de 24 pinos até o carregador

Sim

Cheque a
tensão de saída do laser (2,3V) no Não Cheque a solda em U2 e componentes
coletor de Q4 e se o pino 87 de U2 periféricos
está em nível baixo

Sim

Cheque se existe tensão Não

Cheque se solda esta ruim em U2 e
variavel no pino 88
do U2. componentes periféricos

Sim

Cheque se os pinos
Não Troque as partes defeituosas
de U2 e componentes periféricos estão
mau soldados ou defeituosos

Sim

Cheque s e Q4 Não
está em boas condições Faça a conexão correta

Sim

Troque U2 ou o carregador
 DVP3320 15

Sem display e teclas não funcionam

Sem display e
teclas não funcionam

Sim

Cheque se existe contato

Não
correto entre XS301 e
Faça a conexão correta
XP1

Sim

Cheque a tensão VCC Não

(+5v) no painel Troque o painel power
power e no painel frontal

Sim

Não Cheque os pinos 48, 95, 96 do U2

Cheque se existem os sinais
CS,DATA e CLK no XS301 no cheque as condições do conector
painel frontal XP1.

XP1 (PINO 1 CLK) XP1 (PINO3 DOUT)

Sim

1.Cheque
se solda esta ruim em U600 e pinos
do LED, Não
2.Cheque se os circuitos conectados em
Faça a conexão correta
K301, K302 estão quebrados,
3.Cheque se R303, R301 e R302
estão com circuito aberto.

Sim

Troque U301 ou LED

16 DVP3320

Distorção do áudio e ruído alto

Distorção no áudio
e ruído alto

Sim

Não
Cheque as tensões de alimentação +12V Cheque se a saída do painel
Power esta normal.
Se anormal, troque painel Power.

Sim

Cheque se os transistores Não

mute R73, R77 Troque R77, R73
estão normais

Sim

Cheque se os transistores Não

mute Q8, Q10,Q12 Troque Q8, Q10,Q12
estão normais

Sim

Cheque os fios U5 Não

não estão quebrados ou Faça a conexão correta
abertos

Sim

Cheque se a alimentação Não

de U7 ou U8 estão normais Cheque U7, U8

Sim

Troque U7 ou U8
 DVP3320 17

Cor anormal da imagem

Cor anormal da
imagem

Sim

Cheque se o sinal de saída Não

Cheque Y2, R28, C31 e C33
de 27MHz está normal

Sim

Cheque se as tensões 3.3V

e 1.8V da alimentação Não Cheque outros circuitos elétricos da
no painel decodificador alimentação
estão normais

Sim

Cheque se o circuito da
Não
rede do filtro de vídeo Faça a conexão correta
esta normal

Sim

Cheque se o sinal de vídeo nos Não

Troque U2
pinos 58,60,61,63 de U1 estão
normais
18 DVP3320

Recepção remoto está insensível ou falhando.

Recepção do remoto está

insensível ou falhando

Acesse

Cheque se o controle remoto Não Cheque as pilhas

funciona apropriadamente

Sim

Cheque se a tensão da Não

alimentação para o sensor do Cheque L2
remoto está normal

Sim

Use um osciloscópio para checar Não

se existe saída da forma de onda do IR600 (pino1-forma de onda do
primeiro pino IR do sensor do remoto controle remoto)
após pressionar um botão

Sim

Cheque se existe sinal Sim

Troque U2
IR no pino 49 do U2

IR forma de onda

Não

Faça a conexão
correta
 DVP3320 19

Sem vídeo e sem áudio

Sem vídeo
e sem áudio

Cheque se todas as tensões Não Cheque o circuito

do painel power para o painel carregador
decodificador estão normais
CVBS(ponto R1) forma de onda

Sim

Cheque se o circuito de reset

(CE3, D2 e R21) está normal Não
Troque CE3, D6 e R21
(no nível alto para milisegundos, está
constante no 3,3V).

Sim
27Mhz forma de onda

Não Oscilador Cristal Y2 e

Cheque se existe sinal de componentes periféricos
saída 27MHz estão defeituosos ou
corroídos
Sim

Não Cheque se existe

Cheque se existe sinal de
curto-circuito ou solda
saída 135MHz em R31
ruim em U1,U3

SDRAM(R31 PCLK) forma de onda

Não

Sim

Cheque se existe curto- Não

circuito e solda ruim no pino 60 Cheque U2.

Sim

Reconecte o componente
 20 DVP3320DVD703 /XX

ANOTAÇÕES:
 DVP3320 21

DIAGRAMA DE LIGAÇÕES 6-1 6-1

A B C D E

DVP3320(2CH+USB) WIRING DIAGRAM

4 4

Pr Y COAX R

Pb CVBS L
XP5

DOWN-LOAD P1 P2

ASA + SANYO DV38 AUDIO

AMP&LPF
24 VIDEO LPF&DRIVE
DVD LOADER

3
XP7
POWER 3

24PIN*0.5
1 1 SUPPLY
ZR36966XE2/XF2 +5V
CON2
+5V

XP2 5PIN*2.5
GND 5PIN*2.5

64M/16M
+12V
1

SDRAM
G ND
SP-
1
6PIN*2.0

SP+
LIMIT 5 5

DRIVER
MOTER
GND
XP8

SL-

AM5888S
SL+

6
1 8M/16M
LOAD+ FLASH
LOAD- XP9
TROUT 5PIN*2.0 XP11
GND XP1
2 TRIN
6PIN*2.0 4PIN*2.0 2

5 1 4
1 6
MAIN BOARD
5V
IR
CLK
CS
DATA
GND

MP-1

1
4

4PIN*2.0
XP601 (4-7PIN)
6 1

USB
4 1 XS301 (3-8PIN)
SWITCH LED+
LED- XS302
6PIN*2.0
XP1
BOARD 4PIN*2.0 POWER+
POWER-K 4PIN*2.0

1 4
1 1

A B C D E
 22 DVP3320

PAINEL FRONTAL - ESQUEMA ELÉTRICO 7-1 7-1

5 4 3 2 1

Front Board Electric Diagram for DVP3320:

VCC U5V
D R315 D

REM301 LED+ U5V

100 ohm R318 1 LED- STB_LED
)5200$,1%2$5' 5 5 VCC
GND
3
2
2
3
POWER_K1
4 1 IR 100R/NC POWER_K
4 IR + 4
REM XS302
XS301 C306 CE301 CON4(2.0)
C315 0.1u 47uF
WAKE_SW 47p C316 C307 C308
1 U5V 100p 100p 100p
for dvp331x IR 2 R320 0R IR
VCC 3 V CC
GND 4
DATA 5 DATA
CS 6 CS VCC
CLK 7 CLK
8
9 POWER_K
10 STB_LED R303 R304 R305 5VL
11

CON11(2.0) LED-

C309 C310 R306 R317 33R

0.1uF 0.1uF
4K7 4K7 4K7 51K
U301
C ET6202 GRID[1:7] LED1 C
1 28 GRID1 1
DATA R300 100 OSC GND GRID1 GRID2 GRID1
2 DI/O GRID1 27 2 GRID2
CLK R301 100 3 26 GRID2 GRID3 3
CS R302 100 CLK GRID2 GRID4 GRID3
4 STB GND 25 4 GRID4
R307 10K R309 1K 5 24 GRID3 GRID5 5
R308 10K R310 1K KEY1 GRID3 GRID4 GRID6 GRID5
6 KEY2 GRID4 23 6 GRID6
7 22 GRID7 7
C300 C301 C302 SEG1 VDD GND 5VL SEG1 GRID7
8 SEG1/KS1 VDD 21 8 SEG1
SEG2 9 20 GRID7 SEG2 9
100P 100P 100P SEG3 SEG2/KS2 SEG14/GRID5 GRID6 SEG3 SEG2
10 SEG3/KS3 SEG13/GRID6 19 10 SEG3
SEG4 11 18 GRID5 SEG4 11
CE300 SEG5 SEG4/KS4 SEG12/GRID7 LED+ SEG5 SEG4
12 SEG5/KS5 SEG10/KS10 17 12 SEG5
C303 + SEG6 13 16 SEG6 13
SEG6/KS6 SEG9/KS9 R316 33R SEG6
14 SEG7/KS7 SEG8/KS8 15
0.1u
47uF JDD350501AG

SEG[1:6]
K302
K301 play/pause
open/close
1N4148 D301 R312 1K R313 1K WAKE_SW

KEY1
KEY2
B 1N4148 D302R311 1K KS2 POWER_K B

R314 0R/nc

R319 0R POWER_K1

C304 C305
100p 100p

A A

5 4 3 2 1
 DVP3320 23

PAINEL SWITCH - ESQUEMA ELÉTRICO 7-2 7-2

A B C D E

Switch Board Electric Diagram for DVP3320:

1 1

K303
POWER

1
2 2 2
3 LED3
4
XP1
CON4(2.0) C319 C317 C318
47p 47p 47p

SWITCH BOARD

3 3

4 4

A B C D E
 24 DVP3320

7-3 7-3
PAINEL OK - ESQUEMA ELÉTRICO
1 2 3 4 5

OK Board Electric Diagram for DVP3320:

A A
R210
12V 12VA R202
12VA REF
150 C201 CE200
CE201 22K
0.1u
22uF R203 22uF

C205 47p 22K

R205 180K

B B
P601 R211
KARAOKE INPUT
C210

4
R201 U5A
47-EAR024-XX0

1 C211
KARAOKE

2 -
2 100K
3 1
20K 2.2uF 3 +
2.2uF/NC
R200 C203 NJM4558 OPA
ĭ3.5mm NJM4558 OPA

8
10K CE202
1000p 5 +
7 MIC_OUT
REF 12VA C208 6
10uF -
100p
U5B

4
C204
C 100p C

R206 R207 100K

20K C206 47p

C209
2.2uF

R208
MIC_OUT MIC
1
1K 12V 2
D 3 D
R209
3PIN/2.0mm
750R XP601

E E

1 2 3 4 5
 DVP3320 25

PAINEL POWER - ESQUEMA ELÉTRICO

7-4 7-4

A B C D E

Power Board Electric Diagram for DVP3320:

1 1

F1 TR1
T2AL/250ac NTC 10&20
P3
D1 D2
1N4007 1N4007

2
L1

+
AC INPUT

2
CON1

+
C N1 AC INPUT

1
RV1 680uH
AC INPUT 10K471 + C1 + C2
+
1 D3 D4
1N4007 1N4007 10uF/400V(250V/450V) 15uF/400V(250V/450V)
1

P2
L6

⺕⦴
T1 EEL19
5

D5 + C3
FR102
C5 R2 R3 10uF/50V CON2
4 6
152/1KV 1/4W120K 1/4W120K 6 -22V
5 GND
7 4 +12V
2 3
R4
3
2
GND
+5V
2
D8 9 D7 + C6 1
IN4007 FR102 1/6W10k +5V
47uF/25V
6X2.5 HEADER
C9 8
104/50V 1

D10 SR360/SR340
12
R11
11 R1 C14 L2
NU NU 6.8uH
4

10 + +
1/6W22 C7 C8
Drain

NC

BP/M

EN/UV

1000uF/16V 470uF/16V

U1
TNY176/177 R5
R10 1/6W12K 1%
1/6W100
S

R13
1/6W100k
5

1
R8
U2 1/6W1k
PC123X92
C11 R9
3

0.1uF/63V 1/6W10k

3
1
U3
TL431 R7
2

1/6W11.3k 1%
3 3

CY1
102/400Vac

* CAUTION :
THE PARTS MARKED WITH ARE IMPORTANT PARTS ON THE SAFETY.

PLEASE USE THE PARTS HAVING THE DESIGNATED PARTS NUMBER WITHOUT FAIL.

4 4

A B C D E
 26 DVP3320

7-5 7-5
PAINEL PRINCIPAL - ESQUEMA ELÉTRICO - POWER
A B C D E
R1 0R

DSPVCC33 CE1
CVBS_C L1 0R RCA_CVBS_OUT
Main Board Electric Diagram for DVP3320: Power

+
CVBS_C
C1 C2 220uF/16V
150pF 100pF
R2
4.7K

1 XP1 1
6PIN/2.0mm
CLK 1
R90 100R FPC_CLK
FPC_CLK
CS 2
R91 100R FPC_STB
FPC_STB
DAT 3
R86 100R FPC_DOUT
FPC_DOUT
GND 4
LED_5V 5
L2 500 M5V Imax 60mA Y_R_V
Y_R_V L3 0R V_OUT
IR 6
R3 33R
IRRCV C3 C4
150pF 150pF

C10
100p

C5 C6 C8 C7
0.1uF 100pF 100pF 100pF

CVBS_G_Y L4 0R Y_OUT
CVBS_G_Y
C11 C12
150pF 150pF

2 M5V 2

RFA5V
RFA5V
Imax=17mA

C13 C_B_U L6 0R U_OUT

C_B_U
10nF
C14 C15
150pF 150pF

TO POWER BOARD
Imax 800mA U11

XP2 V_OUT 1 6 RCA_CVBS_OUT

M5V
1
2 2 5
3 +P12V U_OUT Y_OUT
4 3 4
5 P1
5PIN/2.5mm RCA/AUDIO OUT
3 3
20mA R9
PESD3V3L5UY
1

47-RCA151-XX1
C16 C17 RCA_CVBS_OUT 2
0.1uF 0.1uF Y_OUT 3

RCA
[NM] U_OUT 4
V_OUT 5
Q3 6
+12V
8550D C18
47pF

1
D9 D10 D11 D12
R12

PESD5V0S(L)1BA

PESD5V0S(L)1BA

PESD5V0S(L)1BA

PESD5V0S(L)1BA
DSPVCC33 22K R13 C88
4.7K 0.1uF
R6

2
4.7K
R7
LED/PCON Q2
PCON
BT3904
4.7K

LED/PCON:
L: STBY.
4 H:
Working.
4

A B C D E
 DVP3320 27

PAINEL PRINCIPAL - ESQUEMA ELÉTRICO

7-6- VADDIS_SDRAM_FLASH 7-6
A B C D E

RESET Circuit Important power supply!

1MA
DSPVCC33I URST# Main Board Electric Diagram: Vaddis_SDRAM_Flash VDDPWM R14 4.7 DSPVCC33
INSW INSW D8
DRVSB R97 R98 R99 1N4148 C19 + CE2
IN_OUT_SW DRVSB 15k 3.3k 22k 10nF 100U/16V
IN_OUT_SW
CLOSE R100 1k
OPEN CLOSE RESET#
HOMESW OPEN R101 3.3k Q13 Q14
HOMESW

2N3904 2N3904
+ CE19 C89 120MA
R102 10uF/16v L7
4.7k CEL5-5 1uF Close to Vaddis! VDDAFE
DSPVCC33
500
1 1
C20 C21
C22 1nF 10nF 0.1U

C23 1nF RF
FOCUS_PWM RF

15.4K 1%
TRACK_PWM 165MA

SPDL_SENS+

SPDL_SENS-
C24

0.1uF

RFN
R FP
33pF L8

VFE_YIN
SPDL_PWM VDD DAC

LD_DVD

MD_DVD
SLED_PWM DSPVCC33

LD_CD

MD_CD
500

R F_F

RF_E

RF_B
RF_A
R F_D
R F_C
INSW R16 1K FPC_STB

VC
FPC_STB
DUPTD0/FPC_CLK FPC_CLK

R15
C25
IN_OUT_SW R17 1K FPC_CLK C26 C27
10nF 0.1U

FOCUS_PWM

SPDL_SENS+
CD_DVD

TRACK_PWM

SPDL_SENS-
CD_DVD

SLED_PWM
SPDL_PWM
C28

VFE_YIN
9MA

MD_DVD
1nF

RESOUT
LD_DVD

MD_CD
LD _CD
VDDPLL R18 4.7

R F_D
R F_C
V REF

R F_F

R F_E

R F_B
R F_A
DSPVCC18

VC
CD_DVD_1
C29

HOMESW

FPC_STB
0.1U

VDDPWM
DRVSB
CLOSE

VDDAFE

VDDAFE

VDDAFE
OPEN
DSPVCC33
DSPVCC33 U1
S FCS 1 8 DSPVCC18
SF DI /CS VDD R19 4.7K
2 SO /HOLD 7 DSPVCC33I
R20 4.7K 3 6 SFCLK
/WP SCK SFDO C9
4 GND SI 5
C82
SPI FLASH-SOP8 0.1U

102
101
100
Atmel: AT26DF081A NC

99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
U2A
DSPVCC33

Gen_5/GPIO[0]

VDDPWM
Gen_6
VDDP
Gen_7
Gen_8
Gen_9

Gen_12/VID0
Gen_11

VDDC
GPIO[52]/PWMCO[3]/HSYNC
GPIO[51]/PWMCO[2]/FIELD
GPIO[50]/PWMCO[1]/VCLKx2

GPIO[49]/PWMCO[0]
DVD_LD
CD_LD
DVD_MD
CD_MD
VDDSAFE
GNDREF
RESOUT
VREF
VC

VFE_YIN
GND1AFE

F
K
E
J
D
C

RFP
VDDAFE
B
A

RFN
VDD1AFE

GNDDACBS2
R22
4.7K R23
392 Ohm 1% Close to
2 MUTE_CTL MUTE_CTL 103 Gen_4/VID7 RSET 64 Vaddis 2
D1 MBRX120 S FCS SFCS_0 104 63 C_B_U
SFCS DAC1 C_B_U
M5V 1 2USB5V 105 GND VDDDAC 62 VDD DAC
SFDO SFDO_0 106 61 Y_R_V
F1 [FUSE(500MA)] SF DI SFDI_0 SFDO/RS_SF DAC2 CVBS_C Y_R_V
107 SFDI/RS128_Bootsel2 DAC3 60 CVBS_C
108 59 VDD DAC
VDDC VDDDAC CVBS_G_Y
109 VDDP DAC4 58 CVBS_G_Y
SFCLK R85 33R SFCLK_0

1%
1%
1%
1%
110 SFCLK/RS128_Bootsel1 GNDC 57
111 56 OSCIN
GPIO[5] XIN

75R
75R
75R
75R
112 55 OSCOUT
SD_D/IGPIO[7] XO VDDPLL
113 PWM5 VDDPLL 54
114 SD_CMD/GPIO[6] GNDPLL 53

Vaddis-966XE/XF
RESET#

R24
R25
R26
R27
XP11 PCON 115 SD_CLK/IGPIO[7] RESET# 52
R104 27R/NC 116 51
USB_DP VDDP VDDC OSCOUT R30 100 C31 33pF
4 117 DP VDDP 50
USB_DN 118 49 IR RCV
3 DN IGPIO[44] IR RCV
RAMADD4 119 48 DU PRD0/FPC_DOUT
2 USB5V R105 27R/NC RAMADD3 RAMADD[4] GPIO[43]/DUPRD0/TDO/SSCTXD FPC_DOUT
1 120 RAMADD[3] GND 47
RAMADD5 121 46 S/PDIF_OUT
Crystal
R106 C91 R107 C92 RAMADD[5] GPIO[32]/SPDIFO S/PDIF_OUT
4PIN/2.0mm 122 VDDIP VDDP 45 VDDAPWM
C90 RAMADD2 123 44 GP-0
15K/NC 0.1U 15K/NC 0.1U RAMADD6 RAMADD[2] GPIO[29]/AMCLK/APWM0- GP-1 APWM_L- C32 Y2
124 RAMADD[6] GPIO[28]/APWM1- 43 APWM_R-
0.1U RAMADD1 125 42 0.1uF R28 27.000MHz
RAMADD7 RAMADD[1] GPIO[26]/APWM2- 220K
126 41

RAMADD[11]/GPO[64]
RAMADD[7] GPIO[25]/AOUT2/APWM3- GP-4
127 40

RAMCS1#/GPO[65]
VDDC GPIO[24]/DUPRD1/ALRCLK/APWM4- GP-5
128 GND IGPIO[23]/DUPTD1/ABCLK/APWM5- 39
RAMADD[10]

RAMDAT[10]

RAMDAT[11]

RAMDAT[12]

RAMDAT[13]

RAMDAT[14]

RAMDAT[15]
RAMADD[0]
RAMADD[8]

RAMADD[9]

RAMDAT[8]
RAMDAT[7]
RAMDAT[9]
RAMDAT[6]

RAMDAT[5]

RAMDAT[4]

RAMDAT[3]

RAMDAT[2]

RAMDAT[1]

RAMDAT[0]

GNDAPWM
VDDAPWM
OSCIN C33 33pF
RAMRAS#
RAMCAS#

GNDPCLK
RAMCS0#

VDDPCLK
RAMDQM
RAMWE#
RAMBA

VDDIP

VDDC
VDDP

VDDP

VDDP
PCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
DSPVCC33
IPCLK

3 GP-4 DUPRD1
3
R29 GP-5 DUPTD1
1K VDDAPWM DSPVCC33 DSPVCC33 XP5 DU PRD0/FPC_DOUT DUPRD0
RAMADD10

[NM] 3.30V R32 10R 4PIN/2.0mm DUPTD0/FPC_CLK DUPTD0

RAMDAT10

RAMDAT11

RAMDAT12

RAMDAT13

RAMDAT14

RAMDAT15
RAMADD0
RAMADD8

RAMADD9

RAMDAT8
RAMDAT7
RAMDAT9
RAMDAT6

RAMDAT5

RAMDAT4

RAMDAT3

RAMDAT2

RAMDAT1

RAMDAT0
RAMRAS-
RAMCAS-
RAMCS0-

RAMDQM

R31 XXmA Download & debug

RAMWE-

1
RAMBA

DUPTD0/FPC_CLK DUPTD0
IPCLK

56R 2
SF DI + CE4 DU PRD0/FPC_DOUT DUPRD0
3
1

C35 470uF/6.3V 4
HYPER

PCLK 0.1uF
.

RAMADD11

TP1
RAMCS1-

C34
5P WARNING [DRC0006] Net has fewer than two connections N21830557: SCHEMATIC1, 3.Vaddis_SDRAM_Flash (165.10, 185.42) APWM_L-
Down load APWM_R-

RAMADD11
down load

Close to pin 38
Close to VSYNC_VGA
HSYNC_VGA
Vaddis
DSPVCC33
2ch internal Audio output
SFCLK XP6
VGA support
Down load 4PIN/2.0mm
RAMDAT10
RAMDAT11

RAMDAT12
RAMDAT13

RAMDAT14
RAMDAT15

RAMDAT15

RAMDAT14
RAMDAT13

RAMDAT12
RAMDAT11

RAMDAT10

RAMADD9
RAMADD8
RAMADD7
RAMADD6
RAMADD5
RAMADD4
internal KOK support
RAMDAT8
RAMDAT9

RAMDAT9

RAMDAT8

RAMDQM

RAMCKE
RAMADD4
RAMADD5
RAMADD6
RAMADD7
RAMADD8
RAMADD9

1
RAMDQM

DSPVCC18 SDRAM3V3 DUPTD1

RAMCKE

GP-5

‫ݐ‬ᆍ64Msdram ᴧ
PCLK
DSPVCC18 GP-4 2 DUPRD1
PCLK

3
C36 C37 C38 C39 C40 4
0.1U 0.1U 0.1U 0.1U 0.1U
GP-0 AMCLK
GP-1 AOUT0
Hyper Terminal
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

GP-4 ALRCLK
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
NC
DQMH
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
VSS
GP-5 ABCLK
VSS
A4
A5
A6
A7
A8
A9
NC
CKE
CLK
UDQM
NC
VDDQ
DQ8
DQ9
VSSQ
DQ10
DQ11
VDDQ
DQ12
DQ13
VSSQ
DQ14
DQ15
VSS

SDRAM3V3
L10
DSPVCC33
U3 External 2ch Audio DAC amd ADC
500 U10 NM
16Mbit: K4S161622C-TC/L70
[64Mbit:K4S641632H-UC70]
C41 C42 C43 C44
A10/AP

LDQM
VDDQ

VDDQ

VDDQ

VDDQ

DQML

0.1U 0.1U 0.1U 0.1U

VSSQ

VSSQ

VSSQ

VSSQ

CAS#
RAS#
WE#
VDD

VDD

VDD

VDD

VDD
RAS
CAS

DQ7
DQ6

DQ5
DQ4

DQ3
DQ2

DQ1
DQ0

DQ0

DQ1
DQ2

DQ3
DQ4

DQ5
DQ6

DQ7

CS#
BA0
BA1
A10
WE
CS
BA
A3
A2
A1
A0

A0
A1
A2
A3

4 4
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27

DSPVCC33

DSPVCC33I
RAMADD10

RAMADD10

RAMADD3
RAMADD3
RAMADD2
RAMADD1
RAMADD0

RAMADD0
RAMADD1
RAMADD2
RAMDAT7
RAMDAT6

RAMDAT5
RAMDAT4

RAMDAT3
RAMDAT2

RAMDAT1
RAMDAT0

RAMDAT0

RAMDAT1
RAMDAT2

RAMDAT3
RAMDAT4

RAMDAT5

RAMDAT7
RAMDAT6
RAMRAS-
RAMCAS-

RAMCAS-
RAMRAS-
RAMCS0-

RAMDQM

RAMDQM

RAMCS0-

C83 C84 C45 C46 C47 C48 C49

RAMWE-

RAMWE-
RAMBA

RAMBA

0.1U 0.1U 0.1U 0.1U 0.1U 0.1U 0.1U

RAMCS1-

R33
10K
RAMCKE SDRAM3V3

A B C D E
 28 DVP3320

PAINEL PRINCIPAL - ESQUEMA ELÉTRICO -7-7

FE_REGULADOR 7-7
A B C D E

Main Board Electric Diagram for DVP3320: FE_Regulator

EMC Close to CN201
DSPVCC33

BEMF
DV DLD

C DLD OPU R39 R40

Sony310 100R 100R
R34 + CE5 DL3 0 0 Current Type(Default)
C50
NM
C51
NM
4.7R 220uF/16V IAT510 100R 100R R35 2K
[470pF] [470pF] TOP1100S 10R 10R SP_M- SPDL_SENS-
SPDL_SENS-
SEMCO-SP1 0 0
1 Q4 R36 220R
LD_DVD
MITSM820W 91R 91R D5
1
9012
OPU HD65PS Others HD8(DV23) 0 0
DSPVCC33 R34: 3.3R 4.7R HOP1200W NM NM R37
2
DSPVCC33

R38: 3.3R 4.7R HD65/HD62 0 0 1R 0603-R 3

CN201 is used for Sanyo/Samsung/Sony OPUs 502W 91R 91R MD_DVD 1

R38 + CE6
Arima681 NM NM
MD_CD
XP7 4.7R 220uF/16V R39
SMD0.5 TOP 100R R41 2K BAT54C
OPU R270 R283 [NM] R40 SP_MOT- SPDL_SENS+
SPDL_SENS+
HOP1200W 100R 100R 100R
25
26

C52 C53 [NM]

1nF 1nF Q5 R42 220R
LD_CD
Arima681 100R 100R VR _CD
1
2 DV DLD
9012 R202=300R, for HOP1200W only Others NM NM VR_DVD
3 R43 0R [300R]
4 OPU_HFM RFA5V
5
6 C DLD C54
7 VR_DVD 1nF +
8 VR _CD CE7
9 100uF/16V
10 RF_E RFA5V
11
12
OPU5V
VC1
L11
R44
10uH
33R 2.1V U4 AM5888S(HSOP-28)
VC
13
TOP

14 R F_F R45 PDIC Control: FOCUS_S 1 28

15 RF_B 3.3K DVD=LOW
VINFC MUTE DRVSB
16 RF_A CD=HIGH TR_B1 2 27 VC2
TR_B1 BIAS
17 RF
CD_DVD REGO2 TRACK_S
R46
18 3 26 C55
CD_DVD REGO2 VINTK
19 R F_D
SLED_S TR_B2
100pF 1K
20 R F_C 4 VINSL TR_B2 25
21 TACT-
22 TACT+ REGO1 5 24
FACT+ REGO1 NC
23
24 FACT- OPEN 6 23 SPDL_S
FWD VINLD

2 CLOSE 7 REV GND 22 2

27
28

C56 C57 29 30
0.1uF 0.1uF + CE8 GND GND
47uF/16V M5V M5V
8 VCC1 VCTL 21

CE9 C58 LOAD- 9 VOTR- NC 20

100uF/16V 0.1uF
LOAD+ 10 VOTR+ VCC2 19

XP8 SL_MOT- 11 18 SP_M-

Close to Vaddis!
6PIN/2.0mm VOSL+ VOLD-
SLED- 6
SL_MOT+ SL_MOT+12
VOSL- VOLD+ 17 SP_MOT+
SLED+ 5
SL_MOT- FOCUS_S R47 51K [27K]
FOCUS_PWM
HOMESW 4
HOMESW FACT- 13 VOFC- VOTK- 16 TACT- TRACK_S R48 51K [27K]
TRACK_PWM
GND 3
SP+ 2
SP_MOT+ FACT+ 14 VOFC+ VOTK+ 15 TACT+ SPDL_S R49 22K [22K]
SPDL_PWM
SP- 1
SP_MOT- SLED_S R50 51K [33K]
SLED_PWM

C59 C60 C61 C62

1nF 1nF 27nF 27nF

M5V

DSPVCC33
XP9
5PIN/2.0mm R51 Imax=600mA
LOAD- Õǂ?540mA
1
LOAD- 2
LOAD+
LOAD+ 3 2.2 OHM 2W
OUTSW 4
R52
GND 5
4.7K Imax=300mA
INSW Õǂ?I=290mA
HOMESW
IN_OUT_SW HOMESW
INSW IN_OUT_SW 5.6 OHM 1W R53
INSW
3 3
C63 C64 C65
Imax=300mA
Õǂ?250mA Close to motor driver.
NM NM NM DSPVCC18 DSPVCC33
[1nF] [1nF] [1nF]

e
DSPVCC33
TR_B1 TR_B2 b

Q6 Q7 R54 R55

c
1K 1% 33K
SS8550D R56 SS8550D
C66 R57 VC2
+ CE10 CE11
0.1uF 220uF/16v +

20k/1% 4.7K/1% R58

REGO1 REGO2 220uF/16v 1K 1% C67
R59 R60 0.1uF

GND
10k/1% GND
12k/1%

GND GND

4 4

A B C D E
 DVP3320 29

7-8- ÁUDIO ENTRADA/SAÍDA

PAINEL PRINCIPAL - ESQUEMA ELÉTRICO 7-8

A B C D E

M5V Main Board Electric Diagram for DVP3320: Audio Input Output
Q8

R61 82K
9012
R62 39K
APWM_L- R63 4.7K C68 75pF

R64 C69

4
4.7K 1.2nF U5B
OP- LM4558 CE13 10uF/16V
1 1
6 -
7 R65 470 LMAIN_OUT
+6VA OP+ 5 +

+
R66 MUTE Q9

8
C70 10K 3904
0.1uF R67 470

R68 4.7K Q10 MUTE

R69 9012
3.3K CE14 +

220U/16V R70 82K

R71 39K
APWM_R- R72 4.7K C71 75pF

C72 U5A

4
1.2nF LM4558
R73 OP- 2 - CE16 10uF/16V
4.7K 1 R74 470 RMAIN_OUT
+6VA OP+ 3 +

+
+12VA R75 MUTE Q11

8
10K 3904
C73 R76 470
MUTE_CTL R77 4.7K Q12 0.1uF
2 MUTE_CTL 2N3904 2
R78
22K

DSPVCC33

+6VA +12VA
R103
4.7K/NC
R96 1k C74 1uF/NC XP10 +6VA R79 +12VA R80 100R +12V
VFE_YIN R81 0R MIC 1 100K
VFE_YIN
2 R82
3 + CE17 +
33K CE18
100U/16V 47uF/16V
C75 C77 C76
+

CE20 10uF/16V pitch=2.0mm*3

+12V
3300p 100p 0.1uF
THE OK USE C74 or CE20
3

R108 D7
4.7K/NC BAT54S/NC
3 DSPVCC33 3
1

P2
RCA/AUDIO OUT
R83 C78 1

47-RCA151-XX1
COAX_SPDIF LMAIN_OUT 2
S/PDIF_OUT 3
RMAIN_OUT

RCA
COAX_SPDIF 4
100 0.1uF 5
R84
6
100 C79
C80 C81
100pF 100pF 100pF

4 4

A B C D E
 7-9 7-9
30 DVP3320

PAINEL FRONTAL & SWITCH - LAYOUT INFERIOR

Front Board & Switch Board Print-layout (Bottom side):

 DVP3320 31

PAINEL OK - LAYOUT SUPERIOR E INFERIOR

OK Board Print-layout (Top side): OK Board Print-layout (Bottom side):

 32 DVP3320

PAINEL POWER - LAYOUT INFERIOR

Power Board Print-layout (Bottom side):

 DVP3320 33
7-12 7-12
PAINEL PRINCIPAL - LAYOUT SUPERIOR

Main Board Print-layout (Top side):

 7-13 7-13

34 DVP3320

PAINEL PRINCIPAL - LAYOUT INFERIOR

Main Board Print-layout (Bottom side):
 8-1
DVP3320 35

VISTA EXPLODIDA

Exploded View for DVP3320/55:

12

13
11

10

9
8
7
6
5

3
14
15
16

17
2
1 18
20 19
21

It's a general mechanical view for DVP3320/55, pls refer to the model set
for detailed information.
Assy 1 component includes:1.3.4.5.21