Documente Academic
Documente Profesional
Documente Cultură
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
VCE(sat)
Low EMI
Low Gate Charge
Very soft, fast recovery anti-parallel Emitter Controlled HE Diode
Qualified according to JEDEC1 for target applications
Pb-free lead plating; RoHS compliant
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage VCE 1200 V
DC collector current (Tj=150°C) IC A
2
TC = 25C 75
TC = 110C 40
Pulsed collector current, tp limited by Tjmax ICpuls 160
Turn off safe operating area - 160
VCE 1200V, Tj 175C
DC Diode forward current (Tj=150°C) IF
TC = 25C 752
TC = 110C 40
Diode pulsed current, tp limited by Tjmax IFpuls 160
Gate-emitter voltage VGE 20 V
3)
Short circuit withstand time tSC 10 s
VGE = 15V, VCC 600V, Tj,start 175C
Power dissipation Ptot 480 W
TC = 25C
Operating junction temperature Tj -40...+175 C
Storage temperature Tstg -55...+150
Soldering temperature, 1.6mm (0.063 in.) from case for 10s - 260
Wavesoldering only, temperature on leads only
1
J-STD-020 and JESD-022
2
Limited by bond wire
3)
Allowed number of short circuits: <1000; time between short circuits: >1s.
Thermal Resistance
Parameter Symbol Conditions Max. Value Unit
Characteristic
IGBT thermal resistance, RthJC 0.31 K/W
junction – case
Diode thermal resistance, RthJCD 0.53
junction – case
Thermal resistance, RthJA 40
junction – ambient
Dynamic Characteristic
Input capacitance Ciss V C E =2 5 V , - 2360 - pF
Output capacitance Coss V G E =0 V , - 230 -
Reverse transfer capacitance Crss f =1 M H z - 125 -
Gate charge QGate V C C =9 6 0 V , I C =4 0 A - 192 - nC
V G E =1 5 V
Internal emitter inductance LE - 13 - nH
measured 5mm (0.197 in.) from case
Short circuit collector current1) IC(SC) V G E =1 5 V , t S C 1 0 s - - A
VCC = 600V,
Tj, start = 2 5C 220
Tj. start = 1 75C 156
1)
Allowed number of short circuits: <1000; time between short circuits: >1s.
2)
Leakage inductance L a n d Stray capacity C due to dynamic test circuit in Figure E.
1)
Leakage inductance L a n d Stray capacity C due to dynamic test circuit in Figure E.
tp=3µs
100A
160A
140A TC=80°C
10µs
IC, COLLECTOR CURRENT
80A 150µs
TC=110°C
60A 500µs
Ic 1A
40A 20ms
Ic DC
20A
0A 0.1A
10Hz 100Hz 1kHz 10kHz 100kHz 1V 10V 100V 1000V
f, SWITCHING FREQUENCY VCE, COLLECTOR-EMITTER VOLTAGE
Figure 1. Collector current as a function of Figure 2. Safe operating area
switching frequency (D = 0, TC = 25C,
(Tj 175C, D = 0.5, VCE = 600V, Tj 175C;VGE=15V)
VGE = 0/+15V, RG = 12)
70A
400W
60A
IC, COLLECTOR CURRENT
POWER DISSIPATION
50A
300W
40A
200W 30A
Ptot,
20A
100W
10A
0W 0A
25°C 50°C 75°C 100°C 125°C 150°C 25°C 75°C 125°C
TC, CASE TEMPERATURE TC, CASE TEMPERATURE
Figure 3. Maximum power dissipation as a Figure 4. Maximum collector current as a
function of case temperature function of case temperature
(Tj 175C) (VGE 15V, Tj 175C)
150A 150A
20V 20V
125A 125A VGE=17V
VGE=17V
IC, COLLECTOR CURRENT
11V 11V
75A 75A
9V 9V
7V 7V
50A 50A
25A 25A
0A 0A
0V 1V 2V 3V 4V 5V
0V 1V 2V 3V 4V 5V
140A
3.5V
120A
IC=80A
3.0V
IC, COLLECTOR CURRENT
100A
2.5V
80A
2.0V IC=40A
60A
1.5V
IC=20A
40A
1.0V
IC=8A
TJ=175°C
20A
25°C 0.5V
0A
0.0V
0V 2V 4V 6V 8V 10V 12V
-50°C 0°C 50°C 100°C 150°C
VGE, GATE-EMITTER VOLTAGE TJ, JUNCTION TEMPERATURE
Figure 7. Typical transfer characteristic Figure 8. Typical collector-emitter saturation
(VCE=20V) voltage as a function of junction
temperature
(VGE = 15V)
1000ns
td(off) 1000 ns
td(off)
t, SWITCHING TIMES
t, SWITCHING TIMES
100ns tf
tf
100 ns
td(on)
10ns tr
td(on)
tr
10 ns
1ns
20A 40A 60A
IC, COLLECTOR CURRENT RG, GATE RESISTOR
Figure 9. Typical switching times as a Figure 10. Typical switching times as a
function of collector current function of gate resistor
(inductive load, TJ=175°C, VCE=600V, (inductive load, TJ=175°C, VCE=600V,
VGE=0/15V, RG=12Ω, VGE=0/15V, IC=40A,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)
VGE(th), GATE-EMITTER THRESHOLD VOLTAGE
t, SWITCHING TIMES
Eon*
10.0mJ Eon*
5.0 mJ Eoff
5.0mJ Eoff
2.5 mJ
0.0mJ 0.0 mJ
20A 40A 60A
IC, COLLECTOR CURRENT RG, GATE RESISTOR
Figure 13. Typical switching energy losses as Figure 14. Typical switching energy losses as a
a function of collector current function of gate resistor
(inductive load, TJ=175°C, VCE=600V, (inductive load, TJ=175°C, VCE=600V,
VGE=0/15V, RG=12Ω, VGE=0/15V, IC=40A,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)
*) Eon and Ets include losses *) Eon and Ets include losses
due to diode recovery due to diode recovery
7.5mJ Ets*
10.0mJ
E, SWITCHING ENERGY LOSSES
7.5mJ Eon*
5.0mJ
Eoff
Ets*
5.0mJ
Eon*
Eoff
2.5mJ
2.5mJ
0.0mJ 0.0mJ
0°C 50°C 100°C 150°C 400V 500V 600V 700V
Ciss
15V
VGE, GATE-EMITTER VOLTAGE
240V 1nF
c, CAPACITANCE
960V
10V
Coss
5V
100pF Crss
0V
0nC 50nC 100nC 150nC 0V 10V 20V
15µs 300A
SHORT CIRCUIT WITHSTAND TIME
10µs 200A
5µs 100A
tSC,
0µs 0A
12V 14V 16V 18V 12V 14V 16V 18V
VGE, GATE-EMITTER VOLTAGE VGE, GATE-EMITTER VOLTAGE
Figure 19. Short circuit withstand time as a Figure 20. Typical short circuit collector
function of gate-emitter voltage current as a function of gate-emitter
(VCE=600V, start at TJ 175°C) voltage
(VCE 600V, Tj,start = 175C)
VCE
600V 60A 60A 600V
IC VCE
0V 0A 0A 0V
0us 0.4us 0.8us 1.2us 0us 0.4us 0.8us 1.2us
t, TIME t, TIME
Figure 21. Typical turn on behavior Figure 22. Typical turn off behavior
(VGE=0/15V, RG=12Ω, Tj = 175C, (VGE=15/0V, RG=12Ω, Tj = 175C,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)
ZthJC, TRANSIENT THERMAL IMPEDANCE
D=0.5
-1
10 K/W
0.2
0.1
R,(K/W) , (s)
0.05 0.064 3.67*10-4
0.074 3.92*10-3 R,(K/W) , (s)
0.162 1.92*10-2 0.112 2.80*10-4
-2 0.010 3.40*10-1 0.163 3.27*10-3
10 K/W
0.02 0.234 1.71*10-2
0.015 2.68*10-1
0.01 R1 R2
single pulse R1 R2
C 1 = 1 /R 1 C 2 = 2 /R 2
-3
C 1 = 1 /R 1 C 2 = 2 /R 2
10 K/W
10µs 100µs 1ms 10ms 100ms
tP, PULSE WIDTH tP, PULSE WIDTH
Figure 23. IGBT transient thermal impedance Figure 24. Diode transient thermal impedance
(D = tp / T) as a function of pulse width
(D=tP/T)
8µC
600ns
TJ=175°C
500ns
TJ=175°C 6µC
400ns
300ns 4µC
TJ=25°C
200ns
TJ=25°C
2µC
100ns
0ns 0µC
400A/µs 800A/µs 1200A/µs 1600A/µs 400A/µs 800A/µs 1200A/µs 1600A/µs
diF/dt, DIODE CURRENT SLOPE diF/dt, DIODE CURRENT SLOPE
Figure 23. Typical reverse recovery time as a Figure 24. Typical reverse recovery charge as
function of diode current slope a function of diode current slope
(VR=600V, IF=40A, (VR=600V, IF=40A,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)
-1000A/µs
TJ=25°C
40A
TJ=175°C
REVERSE RECOVERY CURRENT
35A
dirr/dt, DIODE PEAK RATE OF FALL
-800A/µs
TJ=175°C
30A
TJ=25°C
25A -600A/µs
20A
-400A/µs
15A
10A
-200A/µs
Irr,
5A
0A
400A/µs 800A/µs 1200A/µs 1600A/µs -0A/µs
400A/µs 800A/µs 1200A/µs 1600A/µs
150A
2.5V
TJ = 25°C
125A IF=80A
175°C 2.0V
100A 40A
1.5V
20A
75A
1.0V 8A
50A
25A 0.5V
0A
0V 1V 2V 3V 0.0V
0°C 50°C 100°C 150°C
VF, FORWARD VOLTAGE TJ, JUNCTION TEMPERATURE
Figure 27. Typical diode forward current as a Figure 28. Typical diode forward voltage as a
function of forward voltage function of junction temperature
i,v
tr r
IF tS tF
QS QF 10% Ir r m t
Ir r m
dir r /dt VR
90% Ir r m
1 2 n
r1 r2 rn
Tj (t)
p(t)
r1 r2 rn
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the
types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or
systems and/or automotive, aviation and aerospace applications or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable
to assume that the health of the user or other persons may be endangered.