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www.springerlink.com/content/1738-494x(Print)/1976-3824(Online)
DOI 10.1007/s12206-017-0138-9
Stress analysis and optimization of Nd:YAG pulsed laser processing of notches for
fracture splitting of a C70S6 connecting rod†
Shuqing Kou, Yan Gao*, Yong Zhao and Baojun Lin
Roll Forging Research Institute, Jilin University, Changchun 130022, China
(Manuscript Received June 13, 2016; Revised August 16, 2016; Accepted September 29, 2016)
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Abstract
The pulsed laser pre-processing of a notch as the fracture initiation source for the splitting process is the key mechanism of an ad-
vanced fracture splitting technology for C70S6 connecting rods. This study investigated the stress field of Nd:YAG pulsed laser grooving,
which affects the rapid fracture initiation at the notch root and the controlled crack extension in the critical fracture splitting quality, to
improve manufacturing quality. Thermal elastic-plastic incremental theory was applied to build the finite element analysis model of the
stress field of pulsed laser grooving for fracture splitting based on the Rotary-Gauss body heat source. The corresponding numerical
simulation of the stress field was conducted. The changes and distributions of the stress during pulsed laser grooving were examined, the
influence rule of the primary technological parameters on the residual stress was analyzed, and the analysis results were validated by the
corresponding cutting experiment. Results showed that the residual stress distribution was concentrated in the Heat-affected zone (HAZ)
near the fracture splitting notch, which would cause micro-cracks in the HAZ. The stress state of the notch root in the fracture initiation
direction was tensile stress, which was beneficial to the fracture initiation and the crack rapid extension in the subsequent fracture split-
ting process. However, the uneven distribution of the stress could lead to fracture splitting defects, and thus the residual stress should be
lowered to a reasonable range. Decreasing the laser pulse power, increasing the processing speed, and lowering the pulse width can lower
the residual stress. Along with the actual production, the reasonable main technological parameters were obtained.
Keywords: Connecting rod; Pulsed laser; Notch; Fracture splitting; Stress field
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workpiece during laser cutting. The irradiated position of the (5) Effects of viscosity and creep were ignored;
workpiece is rapidly melted and evaporated and reaches the (6) The material mechanical behavior conformed to the
ignition point. The molten material is blown away by the high- plastic flow and hardening criteria in the plastic zone;
speed airflow coaxial with the laser beam, which then obtains (7) Elastic, plastic, and temperature strain types were in-
the fracture splitting notch. separable;
Thermal stress in the entire pulsed laser cutting process is (8) Changes in temperature-related material mechanical
produced by the thermal expansions and interaction between properties and the stress and strain in small time increments
the different workpiece parts. The gradual increase in thermal were linear with the temperature.
stress is caused by the ever increasing thermal expansion as
the material temperature increases under the action of the laser
3.4 Thermal elastic-plastic constitutive equation
heat source. Elastic and plastic deformations are observed in
the workpiece when the local material thermal stress exceeds Thermal elastic-plastic theory states that the materials’
the material yield strength. This part of the materials that de- complete strain increment includes the elastic, plastic, and
form plastically is restricted by the surrounding conditions and temperature strain increments in the entire process of pulsed
is difficult to shrink freely during cooling. Phase transforma- laser processing. The strain increment at each time step is
tion, nonlinearity, and other effect factors exist in processing a described as follows:
fracture splitting notch. Therefore, the stress field of the
pulsed laser processing of notches is a complex thermal elas- d e ij = d e ije + d e ijp + d e ijT , (1)
tic-plastic problem. Thermal elastic-plastic incremental theory
was applied for the Finite element analysis (FEA) of the stress where the superscripts e, p and T represent elasticity, plasticity,
field of the laser processing of notches for accurate calculation and temperature, respectively.
and analysis. The strain increment of the element in the elastic zone is
composed of the elastic and thermal strain increments as
3.2 Thermal-mechanical coupling process shown in Eq. (2).
The stress and temperature fields interact during the pulsed
d {e } = d {e e } + d {e T } . (2)
laser processing of notches. The laser beam transfers energy to
the processed workpiece, and then the local temperature of the
workpiece changes severely, thus leading to a large tempera- As material properties depend on temperature, the stress-
ture gradient. Thermal stress is produced by the non-uniform strain increment relationship in the elastic zone is shown as
temperature of the different workpiece parts. A part of the follows:
work conducted by the thermal stress deformation is con-
verted into heat, which affects the temperature field distribu- d {s } = ëéD ûùe d {e } - {C}e dT , (3)
tion. Compared with the heat effect caused by temperature
change and the absorption or release of the phase transforma- where [D]e is the elasticity matrix, and {C}e is the tempera-
tion latent heat, the heat effect caused by the stress deforma- ture-related vector in the elastic zone.
tion work can be ignored. Therefore, the one-way sequential The strain increment of the element in the plastic zone is
coupling method was adopted to simplify this process. First, composed of the elastic, plastic, and temperature strain incre-
the temperature field of the entire process of the pulsed laser ments as shown in Eq. (4).
processing of notches for fracture splitting was calculated. The
calculation results of the temperature field were applied as the d {e } = d {e e } + d {e p } + d {e T } . (4)
thermal load for the mechanical analysis of the structure. The
entire dynamic process of the stress field was finally obtained.
The stress-strain increment relationship in the plastic zone is
shown as follows:
3.3 Basic assumptions
The following assumptions were made during the thermal- d {s } = éëD ùûep d {e } - {C}ep dT , (5)
mechanical coupling FEA based on the C70S6 steel character-
istics and processes of the pulsed laser processing of notches: where [D]ep is the elasticity-plasticity matrix, and {C}ep is the
(1) Chemical combustion between the materials and oxygen temperature-related vector in the plastic zone.
of auxiliary gases at high temperature was ignored;
(2) The mechanical properties of the materials changed with 4. Finite element modeling and key technologies
temperature; 4.1 Heat source model and loading
(3) The original materials were isotropic;
(4) The materials conformed to the Von Mises yield crite- The pulsed laser power density reached 106 W/cm2 to 107
rion; W/cm2 during the processing of fracture splitting notches.
2470 S. Kou et al. / Journal of Mechanical Science and Technology 31 (5) (2017) 2467~2476
4.5 Transformation stress The multi-linear hardening model was selected and the
hardening Von Mises yield criterion was applied in this model
The volume of C70S6 steel changes in the solid-state phase according to the material deformation characteristics of the
transformation, and transformation stress, which affects the pulsed laser grooving of C70S6 steel for fracture splitting. The
transient and residual stress fields, is produced under the con- stress-strain curve obtained from the calculation software of
straint condition. Volume changes are characterized by the material physical properties was also utilized to simulate
changes in the linear expansion coefficient. the hardening effect in this model, as shown in Fig. 4.
2472 S. Kou et al. / Journal of Mechanical Science and Technology 31 (5) (2017) 2467~2476
Fig. 7. Dynamic distribution of thermal stress at different moments: (a) t = 0.0004 s; (b) t = 0.0204 s; (c) t = 0.0404 s; (d) t = 0.0604 s; (e) t = 50 s;
(f) t = 1000 s.
part of the fracture splitting notch obtained from the experi- near the free end face of the model, much stress near the last
ment are illustrated in Fig. 6(b). The notch depth was 0.552 keyhole still occurs when the last pulse processing is com-
mm the notch width was 0.202 mm; the depth-to-width ratio pleted because of the previous heat accumulation. The work-
was large. The errors between the simulation result and the piece begins to cool after the laser cutting is completed. At
experimental value of the notch width and notch depth were 1000 s, the workpiece cools to room temperature, the stress
1 % and 2.17 %, respectively. The errors under other parame- field is entirely concentrated near the fracture splitting notch
ters could be controlled within 10 %, which proves the valid- (Fig. 7(f)), the maximum equivalent stress is 931 MPa, and the
ity and reliability of the simulation model. equivalent stress in the area away from the fracture splitting
notch is near 0. As the temperature at some nodes on the notch
surface is still larger than the melting point of C70S6 after the
5.2 Transient stress analysis
melted or gasified elements are killed, the equivalent stress in
The pulsed laser processing of notches is a dynamic process the corresponding area is larger than the C70S6 tensile
at high temperatures. Temperature changes dramatically dur- strength of 900-1050 MPa, but the equivalent stress is smaller
ing cutting and cooling, and the resultant stress is relatively than the C70S6 tensile strength as a whole.
complex. The Mises equivalent stress dynamics during the
pulsed laser processing of notches is shown in Fig. 7. 5.3 Residual stress and micro-cracks
When the first pulse processing is completed (t = 0.0004 s),
the stress is concentrated entirely around the first keyhole, as Residual stress largely affects the subsequent splitting proc-
shown in Fig. 7(a). Then, the stress field begins to change ess. At 1000 s, the normal stress distribution is in the X-, Y-
regularly until the last pulse processing is completed (t = and Z-directions, as shown in Fig. 8. Thus, X is the laser beam
0.0604 s), and the stress is mainly concentrated near the corre- moving direction, Z is the fracture splitting notch width direc-
sponding keyhole, which is only processed at the moment tion and the fracture initiation direction, and Y is the fracture
each pulse is completed, as shown in Figs. 7(b)-(d). The tem- splitting notch depth direction. The stress is mainly concen-
perature gradient near the corresponding keyhole is the highest, trated in the HAZ near the fracture splitting notch, and the
and the material expands after being heated when the pulse stress distribution is complex. The maximum tensile stress in
processing is completed. Therefore, a large thermal stress is the X-direction is 1480 MPa (σxmax = 1480 MPa), the maxi-
produced in the corresponding zone. Phase transformation can mum tensile stress in the Y-direction is 1180 MPa (σymax =
also produce transformation stress. As the first keyhole is near 1180 MPa), and the maximum tensile stress in the Z-direction
the free end surface with no constraints, most of the stress has is 1260 MPa (σzmax = 1260 MPa). The maximum compressive
been released, and thus less stress occurs around the surface of stress in the X-direction is −250 MPa (σxmax = −250 MPa), the
the first keyhole. Although the corresponding keyhole is also maximum compressive stress in the Y-direction is −361 MPa
2474 S. Kou et al. / Journal of Mechanical Science and Technology 31 (5) (2017) 2467~2476
bears the alternating loads in its work, and thus these micro-
cracks can become the fatigue crack source that leads to the
fracture if not removed. Therefore, the HAZ must be removed
by the subsequent fine machining of the cylindrical hole of a
connecting rod.
The fracture initiation point is located at the root of the frac-
ture splitting notch when fracture occurs. Therefore, the stress
distribution at the notch root is emphasized in studying the
stress field of the pulsed laser processing of notches. As
shown in Fig. 8, the stress state at the root of the fracture split-
ting notch is 3D tensile stress in the X-, Y- and Z-directions.
The corresponding principal stress state at the root of some
keyholes can satisfy the condition of micro-cracks generation,
and consequently micro-cracks can appear at the root of these
keyholes. These micro-cracks are beneficial to the brittle frac-
ture. In addition, the tensile stress of the notch root in the Z-
direction is beneficial to fracture initiation and crack extension
in the subsequent fracture splitting process. However, the un-
even distribution of the stress at the root of the fracture split-
Fig. 8. Normal stress distribution in the X-, Y- and Z-directions when t ting notch occurs because of the stress release of the initial
= 1000 s: (a) X-direction; (b) Y-direction; (c) Z-direction. fracture splitting notch. Asynchronous fracture initiation can
occur during fracture splitting, and it can lead to fracture split-
(σymax = −361 MPa), and the maximum compressive stress in ting defects. The above analysis shows that residual stress
the Z-direction is −532 MPa (σzmax = −532 MPa). The maxi- should be small in a reasonable range.
mum residual tensile stress levels in the X-, Y- and Z-
directions are larger than the C70S6 tensile strength. Accord- 6. Influence of the technological parameters of the
ingly, 3D tensile stress occurs in the principal stress directions pulsed laser processing of notches on residual
and the maximum principal stress is larger than the C70S6 stress
tensile strength in some areas. Micro-cracks can appear in 6.1 Selection of technological parameters
these areas according to first strength theory. The cutting ex-
periment proves that micro-cracks exist in the HAZ. The local Many factors affect the stress field of the pulsed laser proc-
drawing of high magnification SEM micrograph is shown in essing of notches, and they mainly include pulse power, spot
Fig. 9. Martensite transformation occurs in the HAZ during radius, processing speed, pulse width, and defocusing amount.
rapid cooling after the cutting process is completed. The mart- Pulse power, processing speed, and pulse width, which are
ensite is partially pulled apart by the large residual tensile important technological parameters for pulsed laser cutting,
stress that produces the micro-cracks. These micro-cracks can are the focus of the optimization analysis. The required depth
affect the fracture initiation and crack extension in the subse- of the fracture splitting notch of the connecting rod is 0.5-0.7
quent fracture splitting process. An engine connecting rod also mm in the actual production. According to the dimension and
S. Kou et al. / Journal of Mechanical Science and Technology 31 (5) (2017) 2467~2476 2475
Group 1 2 3
Pulse power (kW) 2.6/3.0/3.2 3.0 3.0
Spot radius (mm) 0.08 0.08 0.08
Pulse width (ms) 0.4 0.4 0.3/0.4/0.5
Processing speed (mm/s) 15 10/15/20 15
Pulse frequency (Hz) 50/50/47 50 46/50/42