System-Level ESD/EMI

Protection Guide

www.ti.com/esd 2010
 System-Level ESD/EMI Protection Guide
➔ Table of Contents/Introduction
Introduction
System-level electrostatic discharge
(ESD) protection has become very
important in today’s world as devices
become portable, contain multiple
interface connectors, have touch-
screens, and are continually exposed
to the external world. It only takes one
ESD strike to permanently damage
a product, making ESD protection a
critical component of system design.
Electromagnetic interference (EMI)
is another challenge often faced
in system design. EMI is a radio
frequency (RF) (800 MHz to 2 GHz)
disturbance that affects an electrical
circuit due to electromagnetic
conduction from an external source.
EMI can be avoided by using EMI
filters that eliminate RF noise and
maintain signal integrity.
*Featured section within this guide.
System-Level ESD/EMI Protection Guide 2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Why External ESD? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
ESD Protection for USB Charger Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ESD Protection for High-Speed USB 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ESD Protection for Super-Speed USB 3.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ESD Protection for VGA and DVI-I Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ESD Protection for HDMI/DVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
ESD Protection for Portable HDMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ESD Protection for High-Speed Video and Data Interface . . . . . . . . . . . . . . . . . . 11
ESD Protection for 1394 Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ESD Protection for Keypads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
EMI Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Resources
Packaging Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
ESD/EMI Protection Device List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
TI Worldwide Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
ESD/EMI Protection Solutions Applications
• USB 2.0/3.0*
TI produces ESD/EMI devices with
• HDMI*
solutions that protect the majority
of external connections to the outside • DVI*
world. Learn more about our ESD/EMI • DisplayPort
product portfolio. • eSATA
• 1394*
• LVDS
• Gigabit Ethernet*
• Audio headphones
• Microphone ports
• Speaker ports
• SDIO
• SIM
www.ti.com/esd
Texas Instruments 2010
 System-Level ESD/EMI Protection Guide
➔ Why External ESD?
Semiconductor devices based off
of advanced processes only offer
device-level ESD specifications like
the charge device model (CDM)
and the human body model (HBM)
shown below. Device-level ESD
specifications are not sufficient to
protect devices in a system.
The energy associated with a system-
level ESD strike is much higher than
a device-level ESD strike. In order to
protect against this excess energy,
a more robust design is required.
The silicon area required to design
system-level ESD protection is much
larger than is required for HBM or
48 A
24 A
50 ns
ESD models.
VCC
CH N
CH6 CH4 CH2
GND
Typical circuit diagram for N number of channels.
System-Level ESD/EMI Protection Guide 3
CDM. This difference in silicon area
translates to additional cost. As
technology nodes become smaller,
it becomes more difficult and costly
to integrate robust system-level ESD
protection with microcontroller or core
chipsets. This is illustrated below.
System-level ESD protection can
be implemented using discrete
diodes or capacitors. However,
in many applications, discrete
solutions consume board space,
complicate layout, and compromise
signal integrity at high data rates.
Texas Instruments stand-alone
ESD devices provide space-saving,
Legend
Charge Device Model (CDM)
Human Body Model (HBM)
System Level IEC
Standard Model
100 ns
CH N-1
CH1 CH3 CH5
Silicon die areas for system-level ESD (IEC 8-KV contact).
cost-effective solutions to protect
system interconnects from external
ESD strikes while maintaining signal
integrity.
Often ESD protection is considered at
the last phase of system design.
Designers need flexibility to select
an ESD component that does not
compromise the PCB layout or
consume additional board space.
Texas Instruments ESD solutions
with flow-through packaging allow
designers to add ESD components
in the final stages of a design without
any change in the board layout.
Pad
Silicon die areas for device-
level ESD (I2 KV HBM).
Pad
Texas Instruments 2010
 System-Level ESD/EMI Protection Guide
➔ ESD Protection for USB Charger Interface
4-Channel USB ESD Solution with Power Clamp
TPD4S012
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD4S012

Key Features The TPD4S012 is a single-chip ESD protection solution for the USB charger
• Integrated ESD clamps for D+, interface. Many after-market chargers generate more than 5 V at the USB VBUS pin.
D–, VBUS and ID pins to provide A common industry solution is to use a high-voltage clamp for the VBUS line. The
single-chip ESD protection TPD4S012 offers a combination of two separate clamps: a 6-V clamp for the D+,
• IEC 61000-4-2 (level 4) system-level D– and ID pins and a 20-V clamp for the VBUS pin.
ESD compliance measured at the
D+, D– and ID Pins The TPD4S012 allows single-layer flow-through PCB layout. This simplifies
PCB design and allows for flexible design with a small form factor. It supports
±10-kV contact discharge
data rates in excess of 480 Mbps. Snap-back technology allows high-voltage
±10-kV air-gap discharge
tolerance during normal operation while reducing the clamp voltage during
• 3 amps peak pulse current system-level ESD stress.
(8/20-µs pulse)
• USB signal pins (D+, D–, ID)
0.8-pF line capacitance
Tolerates 6-V signal
VBUS = 20 V
• VBUS line (VBUS)
11-pF line capacitance
Tolerates 20-V signal VBUS
USB
IO D+
Charger/Controller
Applications IO
D-
IO
• Cellular phones GND
• Digital cameras
• Global positioning systems (GPS)
• Portable digital assistants (PDAs) TPD4S012 in a USB charger application.
GND

1.8

1.6
TPD4S012 DRY Package TPD4S012 YFP Package
1.4
(Top View) (Top View)
1.2
D+ 1 6 VBUS
D+ GND
Current (A)

A1 A2
1.0

D– 2 5 N.C. D– B1
0.8 B2 ID

VBUS C1
0.6 C2 VBUS
ID 3 4 GND
0.4

0.2

0
0 5 10 15 20 25 30
Voltage (V)

VBUS clamp voltage under ESD event.

GND
Core PMU ID
Chip/USB Controller
D+
VBUS D-

System-Level ESD/EMI Protection Guide 4 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for High-Speed USB 2.0

Low-Capacitance, Multiple-Channel ESD Protection Arrays for High-Speed Interfaces

TPD2E001, TPD3E001, TPD4E001, TPD6E001
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features The TPD2E001, TPD3E001, TPD4E001 and TPD6E001 are designed to protect
• 2-, 3-, 4- and 6-channel ESD I/O lines bearing the sensitive capacitive loads of USB 2.0, Ethernet LAN,
solutions FireWireTM and video VGA interfaces with rail-to-rail diodes. They are compliant
• IEC 61000-4-2 (level 4) ESD with IEC 61000-4-2, with a ±15-kV HBM, a ±8-kV contact discharge and a
protection ±15-kV air-gap discharge.
±8-kV contact discharge Vcc
The TPDxE001 is a low-capacitanceTPD2E001 ESD protection diode array designed to
±15-kV air-gap discharge .1µF
protect sensitive electronics attached to communication lines. Each channel
±15-kV human body model consists of a pairR- of diodes that steers ESD current pulses to VCC or VGND. The
BUS
IO1
• Low 1.5-pF input capacitance TPDxE001
USB protects against ESD pulses up to ±15-kV human-body model D+ (HBM),
RT
• Low 1-nA supply and leakage Controller
±8-kV contact discharge, and ±15-kV air-gap discharge, as specified D- in IEC
currents 61000-4-2. This device has a typical IO2 1.5-pF capacitance per channel, making it
GND

• 0.9 V to 5.5 V supply voltage range ideal for use in high-speed data I/O interfaces. The TPDxE001 comes in two-,
three-, four- or six-channel solutions making it ideal for Ethernet and FireWireTM
Applications applications. GND

• USB 2.0
VBUS
• Ethernet .1µF D+
Vcc
• FireWireTM (IEEE 1394) TPD4E001
D-
• Video GND
• Cell phones
USB IO4 IO1
• SVGA connections Controller/
µProcessor
• Blood glucose meters
IO3 IO2

VBUS

D+
GND
D-
TPD4E001 in USB 2.0 (480-Mbps) applications protecting two ESD. GND

RJ 45

TPD2E001 DRY Package

(Top View) TPD6E001 RSE Package
TX+
(Top View)
Vcc 1 6 IO2
Vcc

N.C. 2 5 N.C.
10 +V CC
TPD4E001
IO1 3 4 GND N.C. TX-
IO1 1 9
IO1 VCC
IO2 2 8 IO6 .1µF
IO2 IO3
TPD4E001 DRL Package Ethernet
IO3 3 7 IO5 Transceiver
(Top View) GND IO4
N.C 4 6 IO4
IO1 1 6 Vcc
5
IO2 2 5 IO4
GND

RX+
GND 3 4 IO3

RX-

TPD4E001 Ethernet ESD protection.

System-Level ESD/EMI Protection Guide 5 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for High-Speed USB 2.0
2-Channel ESD Solution with Series-Resistor Isolation
TPD2S017
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD2S017

Key Features The TPD2S017 is a two-channel ESD solution with series resistor isolation to
• Ultra-low clamp voltage ensures provide two-stage ESD protection for ultra-ESD-sensitive IOs. This architecture
the protection of low voltage core allows the device to generate very low clamp voltage during system-level ESD
chipsets during ESD events strikes and provides a controlled filter roll-off for spurious EMI suppression and
• Exceeds IEC61000-4-2 (level 4) signal integrity. This device offers flow-through pin mapping for ease of board
ESD Protection layout. The monolithic silicon technology allows matching component values,
including clamp capacitance and series resistor matching between the differential
±11-kV contact discharge
signal pairs. Tight matching of the line capacitance and series resistors ensure
±15-kV human body model
that the differential signal distortion due to the added ESD clamp remains minimal,
• 0.02 pF (typ) differential channel while also allowing the part to operate at high-speed differential data rates (in
input capacitance excess of 1.5 Gbps).
• ±1% deviation of series resistors
(±8 mΩ)

Applications Vcc
TPD2S017
• High-speed USB
• IEEE 1394 VBUS
1Ω
• LVDS
• Mobile Digital Display Interface D+
(MDDI)/Mobile Industry Processor USB
Interface (MIPI) Controller
1Ω D-

GND

Usage model for TPD2S017.

0
6-DBV
(Top View) -1

Ch1_Out Ch2_Out -2
-3-dB data = 2.74G Hz
GND Vcc -3

Ch1_In Ch2_In -4

-5

-6

-7

-8

-9
1.000E+06 1.000E+07 1.000E+08 1.000E+09 1.000E+10
Frequency (Hz)
TPD2S017DBVR insertion loss data (S21).

System-Level ESD/EMI Protection Guide 6 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for Super-Speed USB 3.0

2- or 4-Channel ESD Solution for Super-Speed USB 3.0 Interface

TPDxEUSB30
Get samples, datasheets and evaluation modules at: www.ti.com/sc/device/PARTnumber

Key Features The TPDxEUSB30 provides two ESD clamp circuits with flow-through pin
• Single-pair differential lines to mapping for ease of board layout. This device has been designed to protect
protect the differential data and sensitive components that are connected to ultra high-speed data and
clock lines of the USB 3.0, eSATA, transmission lines. The TPDxEUSB30 offers protection from stress caused by
or LVD interface ESD. This device also offers 5-A (8/20-µs) peak pulse current ratings per IEC
• ESD protection meets or exceeds 61000-4-5 (lightning) specification.
IEC 61000-4-2 (level 4)
This device has 0.05-pF matching capacitance between differential lines and pin
±8-kV contact discharge
capacitance less than 0.7 pF. These features enable the TPDxEUSB30 to support
±8-kV air-gap discharge
data rates in excess of 6 Gbps supporting applications such as USB 3.0, eSATA or
• 5-A peak pulse current (8/20-µs LVDS interface.
pulse) for D+, D– lines
• 0.05-pF matching capacitance The TPDxEUSB30 conforms to IEC61000-4-2 (level 4) ESD protection.
between the differential signal pair
• Supports data rates in excess of
6 Gbps

Applications
• USB 3.0 high-speed TX+
• eSATA VRUS
• HDMI D+ 1
TX-

• LVDS 3 GND
USB 3.0 D-
Host/
1.05 mm

D- 2
GND 8 mm
Controller D+
RX+
1.05 mm

GND
RX-

Three TPD2EUSB30 to protect USB 3.0 Class A connector (requires only one layer of routing).

TX+
D1+ N.C.
VRUS

D1- N.C.
TX-
D-
USB 3.0
GND
GND GND 2.5 mm
Host/ 8 mm
D+
Controller
D2+ N.C. RX+

GND
D2- N.C.
RX-
1 mm

TPD4EUSB30 package. One TPD4EUSB30 and one TPD2EUSB30 to protect USB 3.0 Class A connector (two-layer routing).

System-Level ESD/EMI Protection Guide 7 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for VGA and DVI-I Ports
Integrated 7-Channel ESD Solution for the VGA Port
TPD7S019
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD7S019

Key Features The TPD7S019 is TI’s first integrated ESD solution for the VGA port. The
• Integrated 7-channel ESD solution device incorporates all of the necessary items for VGA lines: level shifting, ESD
with level shifting, buffering and protection, buffering and impedance matching. All of this combined gives the
sync impedance designer a single-chip device for the VGA port, eliminating the need for additional
• Exceeds IEC61000-4-2 (level 4) ESD ICs to complete the same functions that the TPD7S019 performs.
protection
±8-kV contact discharge
±15-kV human body model
• 4-pF loading cap on video lines
Level Level
• Buffer and impedance matching Shifting Shifting
resistor option for SYNC signals
15 Ω
EDS ESD
65 Ω Protection Protection TPD7S019
55 Ω

Applications Impedance Impedance

Matching Matching
• VGA and DVI-I ports in:
PCs
Graphics cards Signal Signal
Buffering Buffering
Set top boxes
TVs

Preview: TPD7S019-15
RSV Package
(Top View)
VCC_VIDEO
SYNC_Out2
VCC_VIDEO
VCC_SYNC

SYNC_IN2

16 15 14 13

VIDEO1 1 12 SYNC_Out1 VIDEO1 VIDEO2 VIDEO3

VIDEO2 2 11 SYNC_IN1

VIDEO3 3 10 DDC_Out2

GND 4 9 DDC_IN2 GND

5 6 7 8

BYP VBYNC
VCC_DDC
BYP
DDC_IN1

DDC_Out1

VCC_DDC

DDC_IN1 DDC_Out1 SYNC_IN1 SYNC_Out1

VCC_SYNC 1 16 SYNC_Out2
VCC_VIDEO 2 15 SYNC_IN2
VIDEO1 3 14 SYNC_Out1
VIDEO2 4 13 SYNC_IN1
DDC_IN2 DDC_Out2 SYNC_IN2 SYNC_Out2
VIDEO3 5 12 DDC_Out2
GND 6 11 DDC_IN2
VCC_DDC 7 10 DDC_IN1
BYP 8 9 DDC_Out1

System-Level ESD/EMI Protection Guide 8 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for HDMI/DVI

HDMI Receiver/Transmitter Port Protection and Interface Devices

TPD12S520/1
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features The TPD12S520 and TPD12S521 are single-chip ESD solutions for HDMI receiver
• TPD12S520: single-chip ESD and transmitter ports. In many cases, the core ICs, such as the scalar chipset,
solution for HDMI reveiver ports may not have robust ESD cells to sustain system-level ESD strikes. In these
• TPD12S521: single-chip ESD cases, the TPD12S520 and TPD12S521 provide the desired system-level ESD
solution for HDMI transmitter ports; protection, such as the IEC61000-4-2 (level 4) ESD, by absorbing the energy
offers on-chip regulator with 55-mA associated with the ESD strike.
current limit feature
While providing ESD protection, these devices add little to no glitch in the high-
• Meets IEC61000-4-2 (Level 4) ESD
speed differential signals due to the low I/O capacitance. Both of these devices
protection
offer a pin layout that is mapped to an HDMI connector, eliminating routing and
±8-kV contact discharge
reducing board layout complexity and cost. These devices also support Ioff
• Integrated level shifting for control (backdrive) protection for current in-rush events.
pins with additional LV supply
• Supports HDMI 1.3 data rate The TPD12S521 for transmitter ports provides an on-chip regulator with current
• 0.8-pF ultra-low cap for I/O output ratings of 55 mA for pin 38. This current enables HDMI receiver detection
• 0.05-pF matching cap between even when the receiver device is powered off. This enables the TPD12S521 to
TMDS provide ESD protection and line-drive capabilities on a single-chip solution.
• Backdrive protection
ESD_BYP
5-V_SUPPLY
Applications
• PCs TMDS_D2+ TMDS_D1+ TMDS_D0+ TMDS_CK+ Ioff
• Consumer electronics TMDS_GND TMDS_GND TMDS_GND TMDS_GND

• Set-top boxes TMDS_D2– TMDS_D1– TMDS_D0– TMDS_CK–

• DVDRW players
• HDTVs
LV Supply LV Supply

DDC_DAT_IN
1 38
CE_REMOTE_IN CE_REMOTE_OUT DDC_DAT_OUT

D2+
GND LV Supply LV Supply
D2–
D1+
GND
TPD12S520 D1– DDC_CLK_IN DDC_CLK_OUT HOTPLUG_DET_IN HOTPLUG_DET_OUT
D0+
GND
HDMI D0–
Core Chip CLK+
GND TPD12S520/1 electrical schematic.
CLK–
CE_R
NC
D_CK VCC VCC
19 20 D_DT
GND
5OUT
HTDT Off
Board layout example for TPD12S520. HDMI VCC = 0
Connector Connector
and
Cable
HDMI
HDMI
(Active)
Power Down
I (Backdrive) Power On

Ioff (backdrive protection) is very important for any data-cable connection where one side may
be in power-on mode while the other is in power-down mode. This prevents the current back-
flows to the power-down circuit from any damage, eliminating the need for an external diode.

System-Level ESD/EMI Protection Guide 9 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for Portable HDMI

HDMI Companion Chip with Step-Up Converter, I2C Level Shifter and High-Speed ESD Clamps
TPD12S015
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD12S015

Key Features
• Integration of DC/DC charge pump,
voltage translation level shifter and
ESD protection reduces 76% board
space and 30% cost compared to
discrete solutions.
• Pin layout matches HDMI type C/D
connector which allows for single-
board layout design
• The DDC and CEC control lines
can drive a 750-pF load, resulting in
longer cable lengths
• Meets IEC 61000-4-2 (level 4)
system-level ESD protection
±8-kV contact discharge
• 1-pF I/O capacitance for 8-channel
ESD protection
• Differential matching capacitance The CEC_B pin has an internal 27 kΩ pullup to an internal 3.3 V.
of .05 pF
The TPD12S015 integrates a unique combination of eight low-capacitance ESD
clamps, I2C level shifters, and a power-saving DC/DC converter, saving system
designers almost three times the board space and significantly reducing overall
system cost. The integrated ESD clamps and resistors provide good matching
between each differential signal pair to provide an advantage over discrete ESD
clamp solutions, where variations between ESD clamps degrade the differential
signal quality. The TPD12S015 allows HDMI 1.3 data rates and provides
IEC61000-4-2 (level 4) ESD protection.
The TPD12S015 has an internal boost converter circuit. This DC/DC converter
generates a steady 5-V output from a 2.3 to 5.5-V source to drive the HDMI
5V_Out pin. This eliminates the need for an external DC/DC converter for portable
applications. The TPD12S015 also has a directionless level shifter with integrated
pull-up resistors and one-shot circuits. There are three non-inverting bidirectional
translation circuits for the SDA, SCL and CEC lines. Each has a common power
rail (VCCA) on the A side from 1.1 V to 3.6 V. On the B side, the SCL_B and SDA_B
each have an internal 1.75 kΩ pullup connected to the regulated 5-V rail (5VOUT).
The SCL and SDA pins meet the I2C specification and drive up to 750-pF loads.
5V 3.5 V (internal)

ERC ERC
Applications 1.75 kΩ 26 kΩ±15%
• Smart phones
SCL_A SCL_B CEC_A CEC_B
• Multimedia phones
5V
• Digital camcorders
ERC
• Digital still cameras 1.75 kΩ
• Portable game consoles
SDA_A SDA_B
YFF Package
(Top View)

1 2 3 4

A TPD12S015 directionless level shifter with integrated pull-ups +5-V Power

B and one-shot circuits.
C

E
CLK- CLK+ D2- D2+ D1- D1+ D0- D0+
F

YFF Package Pin Mapping

1 2 3 4 GND

VBAT DC/DC
A LS_OE VCCA D2+ D2–
Converter
+5-V Power
B SCL_A CEC_A GND D1+ CT_CP_HPD*
C SDA_A HPD_A GND D1–
LS_OE*
D CT_CP_HPD GND CEC_B D0+ LDO
3.3 V (internal)
E FB GND SCL_B D0– VCCA 5-V
HPD_A HPD_B
F 5VOUT SW SDA_B CLK+
G PGND VBAT HPD_B CLK– 10 kΩ

TPD12S015 internal boost converter circuit.

System-Level ESD/EMI Protection Guide 10 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for High-Speed Video and Data Interface

Ultra-Low, 0.8-pF Capacitance for High-Speed Differential Interface Applications

TPD8S009, TPD4S009, TPD4S010
Get samples, datasheets and evaluation modules at: www.ti.com/sc/device/PARTnumber

Key Features
• Complies with the HDMI 1.3 and
DisplayPort data rate
• System-level IEC-61000-4-2 (level 4)
ESD protection
±8-kV contact discharge
• Differential matching of less than
0.05 pF
• Pin capacitance less than 0.8 pF
• Ioff feature for TPD8S009 and
TPD4S009
The TPD8S009, TPD4S009 and TPD4S010 provide ESD protection for high-speed
differential bus interfaces. These devices are ideal for any high-speed application
up to 6 Gbps.
These interfaces provide ESD protection with ultra-low, 0.8-pF capacitance
for less distortion during data transfer. They also provide ultra-low matching
capacitance to help improve the signal quality. All of these devices except for
the TPD4S010 support Ioff (backdrive) protection circuits with an additional diode
on the VCC line.
D0+ 1 D1+ 1 6 D1– D1+ 1 10 N.C.

GND 2 D1– 2 9 N.C.

Applications D0– 3
GND 2 5 VCC
GND 3 8 VCC
15 VCC
• LVDS D1+ 4 D2+ 4 7 N.C.
D2+ 3 4 D2–
• HDMI/DVI GND 5 D2– 5 6 N.C.

• DisplayPort D1– 6 TPD4S009 (PGV or DCK)

14 N.C. TPD4S009 (DGS)
• eSATA interface D2+ 7

• Serial link GND 8 D1+ 1 6 D1– D1+ 1 10 N.C.

D2– 9
• Ethernet 13 VCC 2 5 VCC
D1– 2 9 N.C.
GND
10
• PCI Express® D3+
GND 3 8 GND
GND 11 3 4 D2–
D2+ 4 7 N.C.
D2+
D3– 12
TPD4S009 (DRY)
D2– 5 6 N.C.
TPD8S009 (DSM)
TPD4S010 (DQA)
Package options.

TPD8S009

1
2
3
4
5
6
7
8
9
Core Scalar/
10
Switch
11
12
13
14
TPD4S010
15
16
17
18
19
20

TPD8S009 and TPD4S010 in DisplayPort application.

System-Level ESD/EMI Protection Guide 11 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for 1394 Ports
Firewire ESD Clamp with Live-Insertion Detection Circuit
TPD4S1394
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD4S1394

Key Features
• Integrated late Vg detection 1394 port along with a live insertion detection mechanism for high-speed lines
mechanism generates FWPWR_EN
flag
• System-level IEC 61000-4-2 ESD
protection for high-speed
applications
Passes 8 KV in 1394 system
interface
±15-kV human body model
• Low I/O capacitance
1.5 pF pin capacitance
• On-chip 600-ms timer delay
mechanism
• Flow-through, single-in-line pin
mapping
Applications
• IEEE 1394 live insertion protection
• LVDS
The TPD4S1394 provides a robust system-level ESD solution for the IEEE
interfacing a low-voltage, ESD-sensitive core chipset. This device protects and
monitors up to two differential input pairs. The optimized line capacitance allows
it to protect the data lines with data rates in excess of 1.6 GHz without degrading
signal integrity.
The TPD4S1394 incorporates a live insertion circuit whose output state changes
when improper voltage levels are present on the input data lines. The FWPWR_EN
signal controls an external FireWireTM port power switch. During the live insertion
event, if there is a floating GND or a high-level signal at the D+, D– pins, the
internal comparator will detect the changes and pull the FWPWR_EN signal to
low state. When FWPWR_EN is driven low, there is an internal delay mechanism
preventing it from being driven to the high state regardless of the inputs to the
comparator.
Additionally, it performs ESD protection on the four input pins: D1+, D1–, D2+ and
D2–. It conforms to the IEC61000-4-2 (level 4) ESD protection and ±15-kV HBM
ESD protection. The TPD4S1394 is characterized for operation over ambient air
temperatures of –40°C to 85°C.

D1+
Vcc

D1–
GND
1394
Controller TPD4S1394
VCLMP
D2+
FWPWR_EN
D2–

1394 Connector.

System-Level ESD/EMI Protection Guide 12 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for Keypads
8-Channel ESD Clamp Array
TPD8E003
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD8E003

Key Features
• Eight-channel ESD clamp array to
enhance system-level ESD
protection
• Exceeds IEC61000-4-2 (level 4) ESD
protection
± 12-kV contact discharge
± 15-kV air-gap discharge
• 3.5-A peak pulse current (8/20 µsec)
• Low breakdown voltage of 6 V
The TPD8E003 is an array of eight ESD clamps in a space-saving SON (DQD)
package. This integrated transient voltage suppressor device is designed for
applications requiring system-level ESD robustness. It is intended for use
in space-constrained equipment such as portable computers, cell phones,
communication keypad systems and other applications. Its integrated design
offers superior matching between multiple lines over discrete ESD clamp
solutions.
The TPD8E003 includes ESD protection circuitry that prevents damage to the
application when subjected to ESD stress exceeding IEC 61000-4-2 (level 4). The
TPD8E003 is specified for –40°C to 85°C operation.

Applications
• Keypad
• Touch-screen interface
• Memory interface
• Docking connector interface

A Through via (6 mils)

B GND via (6 mils)

C Top layer trace (4 mils wide)

DQD Package
D Bottom layer trace (4 mils wide)
(Top View) E
F
IO1 1 8 IO8
G
IO2 2 7 IO7 Keypad H
GND Controller I
IO3 3 6 IO6
J
D2+
IO4 4 5 IO5 K
D2–
L
M
N
O
P

Y
Z
TPD8E003DQDR at keypad interface.

System-Level ESD/EMI Protection Guide 13 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ EMI Filters
2-Channel EMI Filter for Audio Headphones
TPD2F702
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD2F702

Key Features
• 2-channel EMI filtering for audio
ports
AVIF connector, headphone
• Exceeds level 4 ESD protection on
connector
±30-kV contact discharge
±30-kV air-gap discharge
• Pi-style (C-R-C) filter configuration
with -3-dB bandwidth at 1.2 MHz
(R=15 Ω, CTOTAL = 5000 pF)
• Low 10-nA leakage current
• WCSP packages and flow-through
pinout
The TPD2F702 is a two-channel EMI filter for audio interface applications. With
the integration of a 5000-pF capacitor in a space-saving low-noise WCSP
package, the TPD2F702 offers superior EMI noise suppression (2 MHz to 6 GHz)
compared to discrete implementation. The device is optimized for AVIF connector
or speaker port interfaces. This low-pass filter array also provides system level
ESD protection to eliminate the need for external ESD clamps. The TPD2F702
exceeds ±30-kV ratings per IEC61000-4-2 contact and air-gap specifications.
The TPD2F702 is a highly integrated device designed to suppress EMI/RFI noise
in all systems subjected to electromagnetic interferences. This filter includes ESD
protection circuitry, which prevents damage to the application when subjected to
ESD surges far exceeding IEC 61000-4-2 (level 4).

Applications
• Mobile phones
• Headsets TPD2F702

• PDAs Out R
• Portable gaming 5000 pf
Audio Amp/
Audio Codec 5000 pf
Out L

SGND

Sample TPD2F702 application.

0.0
3dB drop/bias of 0.0V
TPD2F702 YFK Package -5.0 -3dB = 1.18 MHz
(Top View)
3dB drop/bias of 2.5V
-10.0
0.9 mm -3dB = 1.28 MHz

-15.0 Legend
(DC Bias @ 0.0V)
Insertion Loss (dB)

-20.0 (DC Bias @ 2.5V)

1.3 mm
-25.0

-30.0

0.625 mm -35.0

-40.0
0.9 mm

-45.0

-50.0
1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09
Frequency (Hz)
Frequency vs. dB for TPD2F702.

System-Level ESD/EMI Protection Guide 14 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ EMI Filters
Space-Saving EMI Filters
TPDxF003
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features The TPD4F003, TPD6F003 and TPD8F003 are four-, six-, and eight-channel EMI
• 4-, 6-, or 8-channel EMI filter with filters in space-saving 0.4-mm pitch DQD packages. The low-pass filter arrays
greater than 25-dB attenuation reduce EMI emissions and provide system-level ESD protection.
at 1 GHz
• System-level IEC 61000-4-2 ESD Because of its small package and easy-to-use pin assignments, TPDxF003 filters
protection are suitable for a wide array of applications, such as mobile handsets, PDAs,
video consoles, notebook computers, etc. In particular, these filters are ideal for
± 12-kV contact discharge
EMI filtering and protecting data lines from ESD at the LCD display, keypad and
± 20-kV air-gap discharge
memory interfaces.
± 15-kV human body model
• Pi-style C-R-C topology with 26 Pin SD Card
-3-db bandwidth at 200 MHz MicroSD Card
(R = 100 Ω, CTOTAL = 17 pF)
34 mm ExpressCard | 34 32 mm 11 mm
• Flow-through package layout
• Operating I/O voltage range up
15 mm
to 5.5 V 75 mm 24 mm
• Low 10-nA leakage current

Applications
• LCD display interface
• Keypad
• Memory interface
• Cell phones GND Memory
Memory Connector
• SVGA video connections Controller
• PDAs

TPDxF003 typical use circuit.

TPD4F003 (DQD) TPD6F003 (DQD) TPD8F003 (DQD)

Ch1_In 1 8 Ch1_Out Ch1_In 1 12 Ch1_Out Ch1_In 1 16 Ch1_Out

Ch2_In 2 7 Ch2_Out Ch2_In 2 11 Ch2_Out Ch2_In 2 15 Ch2_Out

GND
Ch3_In 3 6 Ch3_Out Ch3_In 3 10 Ch3_Out Ch3_In 3 14 Ch3_Out
GND
Ch4_In 4 5 Ch4_Out Ch4_In 4 9 Ch4_Out Ch4_In 4 13 Ch4_Out
GND
1.7mm x 1.35mm x 0.75mm Ch5_In 5 8 Ch5_Out Ch5_In 5 12 Ch5_Out
(0.4mm pitch)
Ch6_In 6 7 Ch6_Out Ch6_In 6 11 Ch6_Out

Ch7_In 7 10 Ch7_Out
2.5 mm x 1.35 mm x 0.75 mm
(0.4 mm pitch)
Ch8_In 8 9 Ch8_Out

3.3 mm x 1.35 mm x 0.75 mm

Functional TPDxF003 board. (0.4 mm pitch)

System-Level ESD/EMI Protection Guide 15 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ EMI Filters
4- and 6-Channel EMI Filters for LCD Display
TPDxF202
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features
• Low 10-nA leakage current
• Ultra-thin YFU package
1.06 mm x 1.57 mm x 0.3 mm
• Exceeds IEC 61000-4-2 system-
level ESD protection
± 25-kV contact discharge
± 25-kV air-gap discharge
• Pi-style (C-R-C) filter configuration
with greater than -32 dB attenuation
at 1 GHz (R = 100 Ω, CTOTAL = 15
pF)
• Cut-off frequency at 108 MHz
Applications
• LCD interface
The TPDxF202 is a four- and six-channel EMI filter in space-saving SON
packages. This low-pass filter array reduces EMI emissions and provides
system-level ESD protection. It is used on mobile-phone LCD or memory
interfaces. The pi-style (C-R-C) filter provides at least 30-dB attenuation in the
carrier frequency range (800 to 2700 MHz).
The TPDxF202 is a highly integrated device designed to suppress EMI/RFI noise
in all systems subjected to electromagnetic interferences. This filter includes an
ESD protection circuitry that prevents damage to the application when subjected
to ESD strikes up to IEC 61000-4-2 (level 4).
The TPDxF202 is specified for –40°C to 85°C operation.
TPD4F202 TPD6F202
YFU Packaging YFU Packaging
(Top View) (Top View)
1 2 3 Pin Mapping 1 2 3 Pin Mapping
A Pin No. Name A Pin No. Name

• Cell phones B A1 Ch1_In B A1 Ch1_In

C C
• SVGA video connections A3 Ch1_Out A3 Ch1_Out
• PDAs D B2 GND D B2 GND
E C1 Ch2_In E C1 Ch2_In
F F C3 Ch2_Out
C3 Ch2_Out

D1 Ch3_In G D1 Ch3_In

H D3 Ch3_Out
D3 Ch3_Out
I E2 GND
E2 GND
F1 Ch4_In
F1 Ch4_In
F3 Ch4_Out
F3 Ch4_Out
G1 Ch5_In

G3 Ch5_Out

H2 GND

J1 Ch6_In

J3 Ch6_Out

Display LCD
Controller

Top view of TPD6F202 usage example.

System-Level ESD/EMI Protection Guide 16 Texas Instruments 2010

 Resources
➔ Packaging Solutions
TI offers the most robust packaging layout.
solutions for ESD/EMI devices. With
over eight package types ranging from
0.18 mm2 PicoStarTM packages to
62 mm2 TSSOP, we have packaging
solutions that can fit into any design. 1 12

From the PicoStarTM package that can

2 11

3 10

be embedded into the PCB to 38-pin 4 9

Package Size
TSSOP designed for easy board layout 5 8
(6.5 mm x 2.5 mm)
6 7

(see page 9), there are options for 1

2
6

5 (2.5 mm x 1.35 mm)

every design. A1 A2
3 4
(1.053 mm x 2.35 mm)
B2
(1.45 mm x 1 mm)
C1 C2

TM
PicoStar Package Solutions: (1 mm x 1 mm) (1 mm x 1 mm)
(0.8 mm x 0.8 mm)
Portable consumer electronics (0.6 mm x 0.3 mm)

designers can save board space

Bit Width
with intergrated circuits (ICs) in the TI packages for ESD/EMI solutions.
PicoStarTM package from Texas
Instruments. The ultra-thin package,
about as thin as a human hair, is the
first to give system designers the
Normal top layer mounting
option to embed silicon components
inside the printed circuit board (PCB)
to maximize board space. Devices
in this form factor are 50 percent
thinner than similar chips in traditional 1 mm
packages and enable smaller, thinner <0.15 mm
end equipment.
PCB Metal Layers
The PicoStarTM package is thin enough PicoStarTM Package
to be embedded inside the PCB,
PicoStarTM package embedded in PCB board. Height of the total PCB board is 1 mm.
mounted under a connector, or placed
under some discrete components. The
images here show the space-saving
capabilities of this package for board

0.3 mm (height) YFU package under the Zif connector.

0.13 mm (height) PicoStarTM package under

ceramic inductor.

System-Level ESD/EMI Protection Guide 17 Texas Instruments 2Q 2010

 Resources
➔ ESD/EMI Protection Device List
General-Purpose ESD Protection
IEC61000-4-2 I/O
No. of Supply Voltage VBR (min)
Device Level 4 Diagram Cap Packages
Channels (Vdd) (V)
Protection (pF)

IO

*TPD1E14A4 Yes 1 n/a -8 to +15 4 2-0201 (YFW)

GND

VCC

TPD2E001 Yes IO 1 IO 2 5-SOT, 6-SON,

2 0.9 to 5.5 11 1.5 4-SOP

GND

IO 1 IO 2
TPD2E009 Yes 2 –0.3 to 6 9 0.8 3-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3
TPD3E001 Yes 3 0.9 to 5.5 11 1.5 5-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3 IO 4
TPD4E001 Yes 4 0.9 to 5.5 11 1.5 6-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3 IO 4 IO 5 IO 6
TPD6E001 Yes 6 0.9 to 5.5 11 1.5 10-/12-QFN

GND

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 18 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose ESD Protection (continued)

IEC61000-4-2
No. of Supply Voltage VBR (min) I/O Cap
Device Level 4 Diagram Packages
Channels (Vdd) (V) (pF)
Protection

VCC

IO 1 IO 2 IO 3 IO 4
TPD4E004 Yes 6 0.9 to 5.5 6 1.6 6-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3 IO 4 IO 5 IO 6
TPD6E004 Yes 6 0.9 to 5.5 6 1.6 8-QFN

GND

VCC

TPD4S009 Yes D1+ 6-SOT, 6-SC70,

D2+ 4 0.9 to 5.5 9 0.9 6-SON
D2– D1–

GND

D2+ D1+
TPD4S010 Yes D2– D1– 4 0.9 to 5.5 9 0.9 10-QFN

GND

IO1 IO2

4-DSLGA (YFM)
TPD2E007 Yes 2 n/a ±14 10 3-SC70 (3-DCK)

GND

System-Level ESD/EMI Protection Guide 19 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose ESD Protection (continued)

IEC61000-4-2
No. of Supply Voltage VBR (min) I/O Cap
Device Level 4 Diagram Packages
Channels (Vdd) (V) (pF)
Protection

D- D+
TPD2EUSB30 Yes 2 n/a 9 0.7 3-SOT

GND

Vcc (Optional)

Ch1_In Ch1_Out

TPD2S017 Yes 2 0 to 5 11 1 6-SOT-23

Ch2_In Ch2_Out

GND

IO1 IO2 IO3 IO4

TPD4E002 Yes 4 n/a 6 11 5-SOT

IO4
IO1
IO2 IO3 6-PicoStarTM
*TPD4E281 Yes 4 n/a 4.5 2.5 Package

GND

VBUS

D+
D+, D-, ID
D-
TPD4S012 Yes 4 –0.3 to 20 =6 0.8 6-SON
ID VBUS = 20

GND

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 20 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose ESD Protection (continued)

IEC61000-4-2
No. of Supply Voltage VBR (min) I/O Cap
Device Level 4 Diagram Packages
Channels (Vdd) (V) (pF)
Protection

VCMLP
VCC FWPER_EN
D2+ D2- D1+ D1-

TPD4S1394 Yes 4 0 to 4.6 4.2 1.5 8-SON

GND

Vcc

GND

TPD8S009 Yes 8 –0.3 to 6 9 0.8 15-SON

D3- D3+ D2- D2+ D1- D1+ D0- D0+

GND

General-Purpose EMI Protection

IEC61000-4-2 Supply I/O
No. of VBR (min) -3-dB
Device Contact Diagram Voltage Cap Packages
Channels (V) Bandwidth
(kV) (Vdd) (pF)

Ch_In 15 Ω Ch_Out

IEC 6100-4-2 30 pF IEC 6100-4-2

TPD2F702 ±8 (Level 1) ESD (Level 4) ESD 2 ±14 15 5,000 5-WCSP 1.2 MHz
5000 pF

GND

100 Ω
Ch_In Ch_Out

8.5 pF
TPD4F003 ±8 4 6 100 17 8-WSON 200 MHz
8.5 pF

GND

System-Level ESD/EMI Protection Guide 21 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose EMI Protection (continued)

IEC61000-4-2 Supply I/O
No. of VBR (min) -3-dB
Device Contact Diagram Voltage Cap Packages
Channels (V) Bandwidth
(kV) (Vdd) (pF)

100 Ω
Ch_In Ch_Out

TPD6F002 ±20 C1 = 17 pF 6 6 100 34 12-SON 100 MHz

C2 = 17 pF

GND

100 Ω
Ch_In Ch_Out

8.5 pF
TPD6F003 ±8 6 6 100 17 12-WSON 200 MHz
8.5 pF

GND

100 Ω
Ch_In Ch_Out

8.5 pF
TPD8F003 ±8 8 6 100 17 16-WSON 200 MHz
8.5 pF

GND

ESD Protection Device List

IEC61000-4-2 IEC61000- No. Of Supply VBR (min) I/O Capacitance
Device Pin/Package   Application
Contact (kV) 4-2 Level 4 Channels   Voltage (V) (pF)

Audio, industrial, portable

*TPD1E14A4 ±15 Yes 1 n/a -8 to +15 4 2-0201 (YFW)
computer, cell phones

4-SOP (DZD) 5-SOT (DRL)

TPD2E001 ±8 Yes 2 0.9 to 5.5 11 1.5 USB 2.0, Ethernet, FireWireTM
6-SON (DRS,DRY)

4-DSLGA (YFM), 3-SC70

TPD2E007 ±8 Yes 2 n/a ±14 10 RS-232/RS-485, audio port
(3-DCK)

TPD2E009 ±8 Yes 2 n/a 7 0.7 3-SOP (DBZ), 3-SOT (DRT) FirewireTM, eSATA, LVDS signaling

TPD2EUSB30 ±8 Yes 2 n/a 7 0.7 3-SOT (DRT) USB 3.0

TPD2S017 ±11 Yes 2 0 to 5 11 1 6-SOT-23 (DBV) USB 2.0 High Speed

5-SOT (DRL)
TPD3E001 ±8 Yes 3 0.9 to 5.5 11 1.5 USB OTG
6-SON (DRS,DRY)

USB 2.0, Ethernet,

TPD4E001 ±8 Yes 4 0.9 to 5.5 11 1.5 6-SON (DRS), 6-SOT (DRL)
FireWireTM, eSATA

TPD4E002 ±15 Yes 4 n/a 6.1 11 5-SOT (DLR) USB 2.0 Full Speed

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 22 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List
ESD Protection Device List (continued)
IEC61000-4-2 IEC61000- No. Of Supply VBR (min) I/O Capacitance
Device Pin/Package   Application
Contact (kV) 4-2 Level 4 Channels   Voltage (V) (pF)

USB 2.0 High Speed, Ethernet,

TPD4E004 ±8 Yes 4 0.9 to 5.5 6 1.6 6-SON (DRY)
FireWireTM, eSATA

*TPD4E281 ±8 Yes 4 n/a 4.5 2.5 6-PicoStarTM Package (YFM) Memory, USB 2.0 High Speed

10-MSOP (DGS) 
TPD4S009 ±8 Yes 4 0 to 5.5 9 0.8 6-SC-70 (DCK), 6-SON (DRY), eSATA, LVDS signaling, HDMI
6-SOT-23 (DBV)

TPD4S010 ±8 Yes 4 n/a 9 0.8 6-SON (DQA) eSATA, LVDS signaling, HDMI

D+, D-, ID = 6 USB 2.0 High Speed (charging

TPD4S012 ±10 Yes 4 0 to 20 0.8 6-SON (DRY)
VBUS = 20 applications)

TPD4S1394 **±8 Yes 4 0 to 4.6 4.2 1.5 8-X2SON (DQL) 1394/FireWireTM

10-UQFN (RSE), USB 2.0, Ethernet,

TPD6E001 ±8 Yes 6 0.9 to 5.5 11 1.5
12-WQFN (RSF) FireWireTM, eSATA

USB 2.0, Ethernet, FireWireTM,

TPD6E004 ±8 Yes 6 0.9 to 5.5 6 1.6 8-UQFN (RSE)
eSATA
16-SSOP (DBQ),
TPD7S019 ±8 Yes 7 0 to 5.5 9 2.5 VGA DisplayPort
16-UQFN (RSE)

Keypad, touch-screen interface,

TPD8E003 ±12 Yes 8 n/a 6 7 8-WSON (DQD)
Memory, SDIO, SIM card

TPD8S009 ±8 Yes 8 0 to 55 9 0.8 15-SON (DSM) HDMI, DisplayPort, LVDS signaling

TPD12S015 ±8 Yes 12 2.3 to 5.5 9 1.3 28-DSBGA (YFP) HDMI Class C/D connector

TPD12S520 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI receiver port

TPD12S521 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI transmit port

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.
**Passes 8 KV in 1394 system interface.

EMI Protection Device List

Air-Gap Contact No. of VBR (min) Rline (typ) Ctotal (typ) -3-dB
Device Pin/Package Application
(kV) (kV) Channels (V) (Ohms)   (pF)   Bandwidth

TPD2F702 ±30 ±30 2 ±14 15 5,030 5-WCSP (YFK) 1.2 MHz Audio

TPD4F003 ±20 ±12 4 6 100 17 WSON (8-DQD) 200 MHz Memory, LCD display, keypad

TPD4F202 ±25 ±25 4 6 100 30 DSBGA (10-YFU) 108 MHz Memory, LCD display, keypad

TPD6F002 ±30 ±20 6 6 100 34 SON (12-DSV) 100 MHz Memory, LCD display, keypad

TPD6F003 ±20 ±12 6 6 100 17 WSON (12-DQD) 200 MHz Memory, LCD display, keypad

TPD6F202 ±25 ±25 6 6 100 30 DSBGA (15-YFU) 108 MHz Memory, LCD display, keypad

TPD8F003 ±20 ±12 8 6 100 17 WSON (16-DQD) 200 MHz Memory, LCD display, keypad

TPD3F303 ±15 ±8 3 6 47 20 SON (8-DQD) 300 MHz SIM interface

TPD6F301 ±15 ±8 6 6 45 12 SON (16-DQD) 300 MHz SDIO interface

Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 23 Texas Instruments 2010

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