Rework procedure for BGA modules

Application Note
80000NT10003a Rev. 0 - 29/09/06
 Rework procedure for BGA modules Application Note
80000NT10003a Rev. 0 - 29/09/06
APPLICABILITY TABLE

PRODUCT PART NUMBER APPLICABILITY

EZ10-QUAD-PY 3990150467
GT863-PY 3990250466
GM862-GPRS 3990250631
GM862-QUAD 3990250655
GM862-QUAD-PY 3990250656
GM862-GPS 3990250657
GM862-QUAD-PY 3990250658
GM862-QUAD 3990250659
GC864-QUAD 3990250675
GC864-PY 3990250676
GC864-QUAD-C2 3990250681
GE863-QUAD 3990250664 √
GE863-PY 3990250665 √
GE863-QUAD 3990250653 √
GE863-PY 3990250654 √
GE863-GPS 3990250660 √
GE863-PY 3990250661 √
GE863-QUAD 3990250662 √
GE864-PY 3990250650 √
GE864-QUAD 3990250648 √

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 2 of 8
 Rework procedure for BGA modules Application Note
80000NT10003a Rev. 0 - 29/09/06

Contents
1 INTRODUCTION................................................................................................................4
2 PROCEDURE ....................................................................................................................5
2.1 Module preparation ................................................................................................................5
2.2 Prebaking ................................................................................................................................5
2.3 Part Removal...........................................................................................................................6
2.4 Site Preparation ......................................................................................................................6
2.5 Solder Past Application .........................................................................................................6
2.6 BGA Placement and Reflow ..................................................................................................6
2.7 Cleaning ..................................................................................................................................7
2.8 Inspection................................................................................................................................7
3 Document Change Log ....................................................................................................8

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 3 of 8
 Rework procedure for BGA modules Application Note
80000NT10003a Rev. 0 - 29/09/06

1 INTRODUCTION
The rework concept of a Telit BGA GPRS module is basically the same of a
common plastic Ball Grid Array package component. To rework a BGA Telit
module, a rework machine should be used. There are a lot of different kinds
of machines in the market; Telit for example is using an APR series machine
by Metcal. The principle consists in a metallic box (nozzle) to be used as an
oven in which the BGA balls reflow, and a vacuum system lifts up the
component.
Consider that after rework, the Telit module is no longer usable. Please
follow the below procedure in order to rework correctly the Telit modules.
Precautions have to be taken in order to not damage the neighbour
components. Below the typical BGA rework process flow diagram:

Prebake • Prebake the entire board at 125° for at least 12 hours

• Optimised reflow temperature/time profile

BGA Removal
• No overheating on neighbour components

• Removal of high lead solder balls or any residue

Site Preparation • Planarization
• Cleaning

Solder Past
• Solder past dispensing or flux only application
Application

BGA Placement • Optimised reflow temperature/time profile

and Reflow • No overheating on neighbour components

• No clean vs. clean

Cleaning
• Residue under BGA

• Visual
Inspection
• Type of defects: opens, shorts, misorientation

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 4 of 8
 Rework procedure for BGA modules Application Note
80000NT10003a Rev. 0 - 29/09/06

2 PROCEDURE
2.1 Module preparation
Select the correct size of nozzle referring to the dimensions of the module (could be that a standard
type is not suitable for the module, but in most cases the supplier of the rework machine is able to
build custom size). Put some SMT glue points between the module PCB and the metallic frame of the
shield (see the rows in the picture below).
Use a hot air solder to have a correct polymerisation of the glue. After the glue is hardened, unsolder
the module by using the rework machine (the glue should permit to raise the module without remove
the metallic frame).

2.2 Prebaking
Since the BGA packages are quite moisture sensitive, pre-rework precautions must be taken to avoid
the “popcorning” phenomenon. If the board has been exposed to “out of dry-pack” environment for
more time than allowed, the entire board must be baked at 125°C for at least 12 hours.

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 5 of 8
 Rework procedure for BGA modules Application Note
80000NT10003a Rev. 0 - 29/09/06

2.3 Part Removal

An accurate thermal profile needs to be established for the component removal process. This will
determine the exposure duration and the maximum component/board temperatures. The profile
should be adapted to each board and component to be removed. Although the typical profile should
provide a peak temperature between 240°C to 245°C for a maximum of 30 seconds. It is best,
however, to consult with equipment manufacturer for the recommended profile. It is also important to
ensure that the component and the board are not overheated and that all balls are reflowed on the
module being removed. In general, preheat the entire board to a minimum of 85°C to avoid large
temperature differentials and potential board warpage. In terms of the equipment and tools available,
hand-held as well as automatic hot gas rework systems with vacuum suction have been developed for
BGA removal. First, position the nozzle around the component and apply heat from the top side using
the rework profile developed. Finally, remove the component using a vacuum tip. Do not attempt to
remove a partially reflowed component from a board by prying it off as this could likely damage the
component and potentially destroy the board.

2.4 Site Preparation

After the reworked module has been removed, some excess solder might remain on the board. The
excess solder can be removed using a vacuum desoldering system or a soldering iron with a solder
wick. Special care must be taken to avoid damaging the solder mask material and the solder pads. As
a final step, alcohol can be used with a brush to clean the rework area. Allow the board to dry and
inspect to ensure a clean solderable surface. The specific steps used here can be different from board
to board and from company to company. As a minimum, the removal of the excess solder is an
essential requirement.

2.5 Solder Past Application

There are several options available to apply the solder paste to the component site. The application
PCB can be screened with paste prior to placement. In addition, the site can receive solder paste or
only flux with a dispensing method.

2.6 BGA Placement and Reflow

The next step is to replace the module on the board. The replacement module should be baked prior
to assembly to the board if the component has been exposed to the environment for more than the
allotted time. Place the component on the site observing all the alignment precautions (most rework
equipment comes with a vision system). The new module is placed by manually aligning the balls on
the pads with the aid of a microscope. Reflow the balls using hot air in a manner similar to the removal
process. Again observe total board temperature to avoid any thermal gradients that can result in board
warpage. Allow the board to sufficiently cool before lifting the nozzle to avoid any chances of
misalignment. It is critical to minimize the temperature gradient on the part. A high temperature
gradient creates thermal shock that brings to package warpage. The temperature delta between the
following locations should be 5°C or less than the solder balls on the corners, the solder balls at the

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 6 of 8
 Rework procedure for BGA modules Application Note
80000NT10003a Rev. 0 - 29/09/06
centre of the package, and the top surface side of the package. To achieve a minimal temperature
gradient, a slower ramp up rate (0.5°C/s) and a lower peak reflow temperature is recommended.
Additionally, the parts should be allowed to cool down by ambient air instead of blowing cool air on the
parts with the nozzle. Blowing cool air on the component while it is still hot at the solder ball locations
creates an undesired temperature gradient which might brings to package warpage.

2.7 Cleaning
Remove all residues from the board. However, if no-clean solder paste/flux is used, cleaning is not
required.

2.8 Inspection
This is the final step in the process. Visually inspect the outer rows of the solder joints to check for
gross misalignment, joint quality, wrong orientation, board delamination, and damage of adjacent
components.

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 7 of 8
 Rework procedure for BGA modules Application Note
80000NT10003a Rev. 0 - 29/09/06

3 Document Change Log

Revision Date Changes
ISSUE#0 29/09/06 Release First ISSUE# 0

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 8 of 8