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Finite Element Analysis of
Bonded Repairs and
Analysis Methods for the
ASIP Engineer
02
DEC
2015
Lawrence “Charlie” Stoker
AFLCMC/WWAEJ
801-586-7161
lawrence.stoker@us.af.mil
Distribu(on
A:
Approved
for
Public
Release.
Distribu(on
is
unlimited
(Reference
#
2015-‐09-‐14_WWA-‐011
Case
Number:
75ABW-‐2015-‐0034).
Outline
n Background
n Star(ng
Points
n Method
of
Repair
n Method
of
Analysis
n 3D
FEM
with
Bonded
Repairs
• NX
Glue
and
Extrac(on
n Point
Loads
(TLAP)
n SIF
Calcula(on
and
Extrac(on
n Future
Development
n Ques(ons
2
Acknowledgements
n B-‐1
SPO
n Bob
Lee
(Boeing)
n Ryan
Rowten
(USAF)
n SwRI
n Sco^
Carlson
n A-‐10
ASIP
n Mark
Thomsen
(USAF)
n Bob
Pilarczyk
(USAF)
3
Acronyms
4
Background
5
Background
6
Starting Points
7
Starting Points
8
Method of Repair
n Bond
Material
n EA
9696
9
Method of Repair
Repair doubler
Tab repair
Repair doubler
Bond layers
10
Method of Repair
Bond regions
n Assump(ons
n A
“good
bond”
which
is
homogenous
and
evenly
distributed.
n Residual
stresses
imparted
by
the
hea(ng
and
curing
process
are
ignored.
• This
has
been
incorporated
in
other
analyses.
n The
bond
layer
behaves
elas(cally
within
limit
loads
(necessary
for
NX’s
“Glue”
command).
n Sodware
n Siemens
NX
8.5.3
n NX
Nastran
8.5
12
Method of Analysis
n Solid
Model
n For
the
sake
of
modeling,
model
repairs
with
coincident
faces
(i.e.
it
is
not
necessary
to
model
the
space
between
components).
n Cut
faces
are
used
to
parse
the
model
into
smaller,
manageable
sizes
for
SIF
extrac(on
later.
n Other
geometric
idealiza(ons
or
edits
(split
faces,
omission
of
certain
fasteners)
are
incorporated
for
data
extrac(on
with
the
end
goal
in
mind.
13
Method of Analysis
14
Method of Analysis
15
NX Glue
16
NX Glue
17
NX Glue
18
Extracting Bond Forces
19
Extracting Bond Forces
21
Extracting Bond Forces
22
Extracting Bond Forces
n StressCheck TranslatePoints
23
Point Loads
24
TLAP Setup
26
TLAP Setup
29
TLAP Setup
NX
StressCheck
31
TLAP Validation
Deforma(on
(in) NX StressCheck
X -‐0.01 -‐0.01
Point
1 Y -‐0.032 -‐0.033
Z 0.0004 -‐0.0001
X -‐0.01 -‐0.0095
Point
2 Y -‐0.033 -‐0.032
Z 0.0004 0.0005
Reasonable
agreement
between
methods.
Differences
arise
due
to
the
glue
force
“idealiza(on.”
32
SIF Calculation and Extraction
33
Future Development
34
Questions?
35
BACKUP SLIDES
36
TLAP Validation
NX
StressCheck
37
Value Added to the USAF