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KEYWORDS
degradation mechanism, aging, environmental conditions, long-term behavior, power connections, stationary electrical
connections,
In many countries the most promising potentials for The degradation or aging of electrical connections is caused
renewable energy generation are located far away from by a number of different degradation mechanism (Fig. 1),
demanding consumption centers. In order to connect load namely interdiffusion, force reduction, electromigration,
and generation areas, electric energy has to be transmitted sliding wear and fretting as well as chemical reactions [2]–[4]
and distributed over long distances. Often transport,
generation and even the distribution occurs in areas with
prevailingly harsh natural environmental conditions.
Furthermore, large upcoming energy projects, such as
hydropower projects or the electrification in emerging
countries focus on regions with insufficient energy
infrastructure. All electrical applications used in such
regions have to withstand extreme conditions. They also
have to maintain a good performance in order to assure the
reliable and efficient supply of energy. Electrical connections
are typically applied everywhere in electric power systems.
An electrical contact is defined as a current carrying Fig. 1: Overview of aging mechanism and interaction with electrical contacts [5]
junction between two conductors [1]. In power engineering
the contact interface of two metallic conductors consists of The connection resistance eventually rises through the
many individual contact spots. An individual measurement degradation mechanism and results in higher Joule losses
of the contact resistance is not possible for the majority of as well as in higher temperature. This process is designated
typical power connections. Usually the measured resistance as aging and continues until both the resistance and the
contains the contact resistance as well as some bulk material temperature are too high so that the connection will fail.
and is therefore defined as connection resistance RJ [2].
Intensive research on electrical connections and has been
Stationary electrical connections applied in electric power carried out at the Technische Universität Dresden (TUD)
systems have to fulfill high reliability requirements in order for many years. The long-term behavior of stationary
to prevent power black outs or failures in other components connections in power engineering, dependent on the
of the power system. In terms the operating conditions, the degradation mechanism chemical reactions, is still not fully
environment can affect the performance of stationary electrical understood. Despite this fact the degradation mechanism
connections. The impact of other connection parameters on chemical reactions is often considered as the cause for
the connections resistance, for instance number of bolts or connection failure of stationary electrical connections
contact pressure, is the subject to other studies [3], [4] applied in electric power systems [6]–[11].
Typical materials applied in power connections are copper In terms of electrical connections chemical reactions, such
and aluminum and its alloy. The contact properties can be as corrosion or oxidation, can result in a film development
improved by coatings. This study aims to investigate the within the contact interface. For an electrical connection it
long-term performance of stationary electrical connections is not important whether the film is produced by corrosion
applied in electric power systems dependent on time, or oxidation. Corrosion and oxidation may affect the
of gas components is difficult and depends on the location. In general, the aging of stationary electrical connections
The key points of several studies reviewed in [17] and [18] applied in electric power systems can be divided into three
was that the air composition of tropical rainforest might phases.
have a higher concentration of reaction accelerators than
that of a desert environment. However, this fact is strongly Within the formation phase (Fig. 4), initial physical
dependent on the location and may alter if additional processes such as creep, thermal-induced softening,
influences, such as local industrial pollution, also occur. embedding or stress relaxation, influence the size of
the current carrying area Ac and therefore the initial
1.3. Long-term Performance of Busbar Joints performance factor ku,0. The nature of this change depends
on the material, force, shape, dimension, temperature
Several different types and sizes of busbars joints are and time. Eventually, the aging proceeds with a low but
common applications used in power engineering. The status increased slope of the performance factor ku during the
of stationary electrical connections can be evaluated can be phase of relative stability. This results in a temperature
evaluated by regular measurement dependent on time. The increase at the contact interface area. The temperature
connection resistance directly influences the connection at the interface increases considerably if the current
temperature. Moreover, the performance factor ku ((1) and carrying area Ac falls below a critical level. At this point
Fig. 3) can be used to evaluate the electrical performance of the generated heat of the interface cannot be transferred
busbar joints. ku is defined as a ratio between the resistance away from the contact area to reach a thermal steady state.
(or voltage or power losses) of the busbar joint RJ and the The aging proceeds into the phase of the accelerated aging
busbar sequence Rbusbar [2]. until the critical performance factor ku,crit is reached. If the
temperature exceeds the melting point of the material, the
contact spots at the interface will melt. Subsequently new
contact spots will develop. The melting stops process only
stops when the conducting area Ac is large enough that
Busbars of the same shape and dimensions but made out of the power losses fall below a limit at which the melting
different materials (coated and uncoated) can be compared temperature is not reached. This whole process does not
with each other. In theory, the lower boundary of the establish the initial performance factor such as in the
performance factor for busbar connections with quadratic formation phase. Indeed this process alternates at higher
apparent contact area is 0.5. The lower the factor, the better levels until the thermal destruction / runaway is finished.
the electrical and thermal performance of the connection.
2. Experimental Field Test
2.1. Experimental Design
The surfaces at the contact interface are either bare or were bolted on site except the joints in Brazil. Most of
coated with silver, tin or nickel. Before connecting process the busbar joints were bolted on site while the joints in
the busbar surfaces were cleaned by ethanol and with a Brazil having partially been assembled in Dresden before
wire brush (about 30 strokes with approximately 50 N transportation.
compression force each) or an abrasive pad (grid size 200
and 1000) dependent on the material system (Tab. 2) [2], The experimental research was carried out at the
[13]. In the field, inhibitors and lubricants are commonly Botanical Garden of the Technische Universität Dresden
used for switching-, plug-in-, sliding- and other moveable in Germany (DE), at the Suez Canal University Ismailia
contacts. For some stationary connections such as press in Egypt (EG) and at the Universidade Federal do Pará
connectors, inhibitors are used for conservational in Belém, Brazil (BR). All samples were exposed to local
issues and easier assembling. Using inhibitors is not environmental conditions. During the test duration,
necessary for force-fitted stationary connections, such environmental parameters, such as ambient temperature
as busbar joints. The long-term performance of busbar and relative humidity were recorded (Fig. 5 and Fig. 6).
joints would not be significantly improved by the use of The measurement of the air composition would have
inhibitors [22], [23]. Moreover, using inhibitors would been of interest, it could not taken because of insufficient
require a detailed study on different inhibitors and its resources. Although the highest temperatures of > 45 °C
properties. The true influence chemical reactions might as well as the highest spread between daily min. and
have on films would be blurred if inhibitors were utilized. max. temperature of about 30 K was measured in
Ismailia, EG. Fig. 5 shows that the lowest gap between
One material combination was set up with bare copper min. and max. temperature for the tropical environment
and aluminum alloy busbars using a single-sided in Belém, BR was there. The relative humidity in this
aluminum-copper sheet (AlCu, d = 2 mm) between particular environment is very high and stays at a high
the two busbars. The aluminum-copper sheet consists level all year round. When the relative humidity exceeds
of a cold rolled, single-side, composite material [24] 100 %, supersaturation of the air with fog formation
(dAl | 1.4 mm, dCu | 0.6 mm). After cleaning of the and condensation occurs. Moreover, even in desert
busbar surfaces, the busbars were bolted with galvanized environments the relative humidity might be 100 %.
or stainless steel M12x40-8.8 screws and M12 washers by During night time, the temperature decreases and the air
using a torque of 70 Nm. Each busbar combination was cools down which results in a distinct dew formation in
assembled with five or more single samples. The busbars the morning hours of the following day.
2.2. Experimental Setup and Operating Conditions considered connections. The current was adjusted as
such to keep the connection temperatures at 90 °C.
The experimental research was conducted both with However, the daily change in weather affected the
current (EG, BR) and currentless (DE, BR). Test temperature of the tested connections. The temperature,
series with not current are indicated by supplement measured at the connections in operation, was in the
“currentless”. As can be seen in Fig. 7 – Fig. 9, the range of (30…90) °C in EG, (20…90) °C in BR and
busbar joints were connected in test circuits. A high (15…45) °C in DE, dependent on local environmental
current transformer RUE6500 So. 6.5 kVA and a variable conditions such as day / night, rain, wind and further.
transformer RRSP2512 26-400-400-17 was used for each
current-fed test circuit in BR and EG. 2.3. Long-Term behavior of Busbar Connections
The permitted temperature of the considered busbar joints In order to obtain the resistance of a busbar
depends on the material combination and the ambient sequence Rbusbar, the resistivity of the used materials was
temperature. According to IEC 62271-1:2007+A1:2011 determined (Tab. 3). The resistivity was measured at
[25] and the material combination, the permitted busbar ambient temperature and corrected to 20 °C by (2).
joint temperature would be (90…105) °C for ambient
temperatures of 40 °C. A max. operating temperature
of 90 °C was set for comparability reasons between the
Fig. 6: Exemplary monthly min. and max. relative humidity course of different environments
During the field work, the resistance measurement 2.3.1. Bare Aluminum Busbar Joints
was conducted regularly with a microohmeter LoRe
mobile (Werner Industrielle Elektronik). Before the In the first 1000 h within the formation phase, (Fig. 10)
measurement was taken, the test circuits were switched the measured resistance of some of the busbar joints rises.
off and opened at one position. A measurement current Both material and temperature depending processes
was fed into the circuit by the measurement device. provoke force reduction and smaller contact areas. The
Punch marks were used as potential taps (Fig. 3). contrary resistance drop for the current-fed samples in
For comparability reasons, the measured connection BR could be possibly caused by mechanical distortion.
resistance RJ was corrected to 20 °C. The temperature Higher initial connection resistance may result in
of the busbar joints was measured together with the enhanced aging [2]. The highest connection resistance
resistance at ambient temperature. The resistances for AlMgSi was measured for currentless busbar joints in
results are in the range of a few μΩ. This is typical for the BR (Fig. 10), possibly due to film formation. In addition
kind of power connections tested. to the native aluminum oxide layer found in humid
Tab. 3: Bulk resistivity of copper, aluminum and aluminum alloy at 20 °C, measurement done with a microohmeter MO2A
(Rasmus & Kühne)
atmospheres, a separate cover layer might develop to Compared with AlMgSi the difference of the measured
eventually increase the film’s thickness. Prevailingly high connection resistances of Al99.5 (Fig. 11) in between
temperatures in the contact area would not only reduce the different environments are lower. There is no clear
the humidity locally but may also prevent a strong highest resistance graph based on the test environment.
growth of such films. The connection resistances of the Eventually the spans overlap each other. Indeed, the
samples measured at the Botanical Garden are lower than mean connection resistances of Al99.5 are lower than
the connection resistances of the currentless samples in for AlMgSi. This is a result of the better conductivity
BR. Possibly, this might stem from the film’s reduced of Al99.5. However, the performance factor is nearly
impact by a lower mean relative humidity. The stronger the same and indicates a similar quality of the electrical
scattering of the connection resistances measured at connection. No significant difference in performance
the Botanical Garden is caused by the simultaneous factor of Al99.5 was observed between the samples with
scattering of the ambient temperature. current or without current. It is therefore likely that the
temperature’s influence on the considered operating
After being in the field for two years, the surface parameters is might be negligible for AlMgSi.
of the AlMgSi-busbars (Fig. 10) appears somewhat
matted. In the desert environment of Ismailia, EG, After two years of experimental field work, the visual
on the other hand, the surface is partially covered by inspection of the busbar surface yields the same results
dust particles. as for AlMgSi (Fig. 11).
Fig. 11: Measured connection resistance of bolted Al99.5 busbar joints in different environments depending on
time, ϑmax d 90 °C
2.3.2. Bare Copper Busbar Joints material. Therefore the measured connection resistances
of AlMgSi-Ni-Sn are slightly higher. No significant
The resistance of the bare copper joints (Fig. 12) remains increase in resistance was observed during the long-
stable during the testing time and is lower than that for term tests of tin-coated busbar joints. The dimensionless
aluminum. No difference visible was noticed among the performance factor is equal for both. After two years the
different environments. A visible oxide film develops surfaces have tarnished and changed color from bright to
on the surface of the copper busbars (Fig. 12). The film matt. Small frizzles and especially dust particles occurred
appears darker for samples with current and also in the on the surface.
tropical environment of Belém, BR. Temperature and
humidity both influence the film development on the 2.3.4. Nickel coated Busbar Joints
copper busbar surfaces. Nevertheless no influence on the
connection resistance was observed. The measured connection resistances of Ni coated Cu
and AlMgSi busbars (Fig. 15 and Fig. 16) are relatively
2.3.3. Tin coated Busbar Joints close to each other. The higher connection resistance of
AlMgSi-Ni Botanical Garden, currentless, DE (Fig. 16)
It appears evident that the measured connection is caused by two individual busbar joints. Applicable to
resistance of Cu-Ni-Sn and AlMgSi-Ni-Sn busbars (Fig. the samples in Ismailia, EG, a decrease of the measured
13 and Fig. 14) only differ by the conductivity of the base connection resistance can be observed during the first
Fig. 13: Measured connection resistance of bolted Cu-Ni-Sn busbar joints in different environments depending on
time, ϑmax d 90 °C
1000 h of the formation phase. At this time, material and EG to that of Belém, BR (Fig. 15 and Fig. 16). In Ismailia,
temperature-dependent processes create larger contact EG and Dresden, DE, no additional surface cleaning
areas and therefore lower connection resistances. The using an abrasive pad was done prior to the tests. There
connection resistance of the AlMgSi-Ni busbars in the performance factor shows stronger scattering, which
Ismailia, EG (Fig. 16) was evaluated at approximately is induced by more or less penetrated films.
11.000 h only. Afterwards unwanted mechanical
distortion occurred at the test site. Before assembling, the 2.3.5. Silver coated Aluminum Busbar Joints
Ni coated busbars in Belém, BR were additional treated
with an abrasive pad (grid size 1000). The reduction The connection resistance of AlMgSi-Ni-Ag busbars
of the connection resistance during formation phase is (Fig. 17) did not show significant changes during the
therefore not perceptible for the Ni coated busbars in entire testing time. Considering the resistances only, no
Belém, BR (Fig. 16). On the surface of the Ni coated significant difference can be observed between three
busbars no clear visible film developed and the surface environments.
remained bright. Typical oxide films on nickel are very
thin and may appear transparent. Appropriate surface Nevertheless, the silver surface condition significantly
cleaning is essential and could have a strong influence changed. Overall the busbar surface appears from bright
on the connection resistance. This fact is evident when to more dark and black with no uniform color. Moreover,
comparing the performance factor of Cu-Ni in Ismailia, the coating was locally spalling and heavily destroyed
Fig. 15: Measured connection resistance of bolted Cu-Ni busbar joints in different environments depending on time,
ϑmax d 90 °C
(Fig. 18 below). Possibly, leaky coatings enable layer currentless, BR), AlCu sheets (AlCu) were used
infiltration. Despite this fact the performance factor between the interfaces of the busbar surfaces (Fig. 19).
remains stable; the most likely reason for this being that The combination AlMgSi-Cu was tested in order to
the coating at the interface area is compressed by the demonstrate the difference when using no AlCu sheet.
connection force between the busbars. As a result, the The highest resistance graph was measured for the
silver coating in the apparent contact area is somehow samples in Belém, BR. In Ismailia, EG and the Botanical
protected against environmental effects and the measured Garden the connection resistances remain stable.
connection resistance also remains stable. Samples with Previous research stated that AlMgSi-Cu tend to enable
current present a stronger environmental attack on the electrochemical reactions between the materials [3],
busbar surface because of the additional influence of [4]. Possibly, the graph of AlMgSi-AlCu-Cu in Belém,
the current induced heating (Fig. 18, Ismailia EG, and BR was not stable due to the same reason as applicable
Belém, BR). The higher the temperatures, the stronger to AlMgSi-Cu. Maybe the electrochemical reaction
the possible environmental attack. between aluminum and copper can proceed along the
surface of the AlCu sheet after all. A sufficiently humid
2.3.6. Bare Copper-Aluminum Busbar Joints atmosphere, as present in Belém, BR, would be required
tough. In the future, the AlMgSi-AlCu-Cu busbar joint
For the material combinations displayed in the figure in Belém, BR will exceed the performance factor ku ≥ 1.5
above (except for the combination AlMgSi-Cu Belém, and would convert from a heat sink to a heat source.
Fig. 17: Measured connection resistance of bolted AlMgSi-Ni-Ag busbar joints in different environments depending on
time, ϑmax d 90 °C
Depending on the environment, the visible surface The environmental parameters temperature and relative
alterations are the same as those for aluminum and humidity were recorded during the field tests whereas
copper. Additionally, a greenish and whitely film can be the air composition could not be considered in this
also seen at the interface area of the AlMgSi-Cu busbar study. However, it might be of interest for future research
joint in Belém, BR. to investigate the air composition in field studies in order
to compare it with the specifications of laboratory tests
Concluding Remarks according to test standards.
The purpose of this research was to assess the long- This work has found that in areas with desert and tropical
term performance of stationary electrical connections rainforest conditions, bare busbar joints of the same
dependent on time, temperature, material and the material, either made of copper, aluminum or aluminum
environment. It was designed to determine what effect, alloy, show stable performance factors. On the other hand,
if any, the degradation mechanism chemical reactions connection resistances evaluated in long-term tests and
has on stationary electrical connections applied in real more than 20,000 hours testing time remains stable.
operating conditions.
In tropical rainforest and desert areas, tin coated busbar
This is one of the first experimental works, investigating joints based on copper or aluminum alloy (AlMgSi)
what effects, if any, the degradation mechanism chemical present stable connection resistances and performance
reactions has on the long-term behavior of stationary ratios in long-term tests conducted over two years.
electrical connections (for power engineering) in
tropical and desert environments all dependent The investigation of silver coated busbar surfaces has
on time (> 20000 h), material and temperature shown that the environmental attack is strong and
(current-fed / currentless). leads to spalling and destroying of the silver coating.
Fig. 19: Measured connection resistance of bolted AlMgSi / AlCu / Cu and AlMgSi / Cu busbar joints in different
environments depending on time, ϑmax d 90 °C