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R2J20657CNP R07DS0584EJ0100
Rev.1.00
Integrated Driver - MOS FET (DrMOS) Jul 20, 2012
Description
The R2J20657CNP multi-chip module incorporates a high-side MOS FET, low-side MOS FET, and MOS-FET driver
in a single QFN package. The on and off timing of the power MOS FET is optimized by the built-in driver, making this
device suitable for large-current buck converters. The chip also incorporates a high-side bootstrap switch, eliminating
the need for an external SBD for this purpose.
Features
Based on Intel 6 6 DrMOS Specification.
Built-in power MOS FET suitable for Desktop, Server application.
Low-side MOS FET with built-in SBD for lower loss and reduced ringing.
Built-in driver circuit which matches the power MOS FET
Built-in tri-state input function which can support a number of PWM controllers
High-frequency operation (above 1 MHz) possible
VIN operating-voltage range: 20 Vmax
Large average output current (Max.40 A)
Achieve low power dissipation
Controllable driver: Remote on/off
Support Mid-Voltage PWM signal to enter zero current detection
Built-in Thermal Warning
Built-in bootstrapping Switch
Small package: QFN40 (6 mm 6 mm 0.95 mm)
Terminal Pb-free/Halogen-free
Outline
40 11
THWN Driver High-side
Pad MOS Pad
DISBL#
MOS FET Driver VSWH
LSDBL#
Low-side MOS Pad
PWM
31 20
CGND GL PGND 30 21
(Bottom view)
Block Diagram
Driver Chip
UVL
THWN THWN Boot
SW VIN
Reg5V
DISBL#
2 μA
High-side
Supervisor MOS FET
CGND
Level Shifter
20 k
Reg5V
160 k VSWH
Zero
Current
LSDBL# Det.
Overlap
Protection. 3 state signal
& Logic
Input Logic
PWM (TTL Level)
35 k
(3 state in)
3 state signal
PGND
CGND GL
Notes: 1. Truth table for the DISBL# pin 2. Truth table for the LSDBL# pin & PWM pin
DISBL# Input Driver Chip Status LSDBL# PWM
"L" Shutdown (GL, GH = "L") Input Input GL Status
"Open" Shutdown (GL, GH = "L") "L" * "L"
"H" Enable (GL, GH = "Active") "Open" "L" or "H" "Continuous
or "H" Conduction Mode"
"Open" "Zero Current
or "Mid" Detection" Mode
3. Output signal from the UVL block 4. Output signal from the THWN block
For active
"H" "H"
UVL output Normal Thermal
For shutdown Thermal Warning
Logic Level operating Warning
"L" VCIN Logic Level
"L" TIC(°C)
VL VH
TwarnL TwarnH
Pin Arrangement
LSDBL#
Reg5V
VSWH
CGND
BOOT
VCIN
VIN
VIN
VIN
GH
10 9 8 7 6 5 4 3 2 1
VIN 11 40 PWM
VIN 12 39 DISBL#
VIN CGND
VIN 13 38 THWN
VIN 14 37 CGND
VSWH 15 36 GL
PGND 16 35 VSWH
PGND 17 34 VSWH
VSWH
PGND 18 33 VSWH
PGND 19 32 VSWH
PGND 20 31 VSWH
21 22 23 24 25 26 27 28 29 30
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
VSWH
VSWH
(Top view)
Note: All die-pads (three pads in total) should be soldered to PCB.
Pin Description
Pin Name Pin No. Description Remarks
LSDBL# 1 Low-side gate disable When asserted "L" signal, Low-side gate disable
Reg5V 2 +5 V logic power supply output
VCIN 3 Control input voltage Driver Vcc input
BOOT 4 Bootstrap voltage pin To be supplied +5 V through internal switch
CGND 5, 37, Pad Control signal ground Should be connected to PGND externally
GH 6 High-side gate signal Pin for monitor
VIN 8 to 14, Pad Input voltage
VSWH 7, 15, 29 to 35, Pad Phase output/Switch output
PGND 16 to 28 Power ground
GL 36 Low-side gate signal Pin for monitor
THWN 38 Thermal warning Thermal warning when over 150°C
DISBL# 39 Signal disable Disabled when DISBL# is "L".
This Pin is pulled low when internal IC over the
thermal shutdown level, 150°C.
PWM 40 PWM drive logic input 5 V logic input
45
40
Average Output Current (A)
35
30
25
20
15
VIN = 12 V
10 VCIN = Reg5V = 5 V
VOUT = 1.3 V
5 fPWM = 1 MHz
L = 0.45 μH
0
0 25 50 75 100 125 150 175
PCB Temperature (°C)
Electrical Characteristics
(Ta = 25°C, VCIN = 12 V, VSWH = 0 V, unless otherwise specified)
Item Symbol Min Typ Max Units Test Conditions
Supply VCIN start threshold VH 7.0 7.4 7.8 V
VCIN shutdown threshold VL 6.6 7.0 7.4 V
UVLO hysteresis dUVL — 0.4 — V VH – VL
VCIN operating current ICIN — 63 — mA fPWM = 1 MHz,
Ton_pwm = 120 ns
VCIN disable current ICIN-DISBL — — 1.2 mA DISBL# = 0 V,
PWM = LSDBL# = Open
PWM PWM input high level VH-PWM 4.1 — — V 5.0 V PWM interface
input PWM input low level VL-PWM — — 0.8 V
PWM input resistance RIN-PWM 3.5 7.5 15 k 4V – 1V
IPWM(VPWM=4V) – IPWM(VPWM=1V)
PWM input tri-state range VIN-tri 1.4 — 3.3 V 5.0 V PWM interface
DISBL# Enable level VENBL 2.0 — — V
input Disable level VDISBL — — 0.8 V
Input current IDISBL — 2.0 5.0 A DISBL# = 1 V
LSDBL# Low-side activation level VLSDBLH 2.0 — — V
input Low-side disable level VLSDBLL — — 0.8 V
Input current ILSDBL –52 –26 –12 A LSDBL# = 1 V
Thermal Warning temperature TTHWN *1 135 150 165 °C Driver IC temperature
warning Temperature hysteresis THYS *1 — 15 — °C
THWN on resistance RTHWN *1 0.2 0.5 1.0 k THWN = 0.2 V
THWN leakage current ILEAK — — 1.0 A THWN = 5 V
5V Output voltage Vreg 4.95 5.2 5.45 V
regulator Line regulation Vreg-line –10 0 10 mV VCIN = 12 V to 16 V
Load regulation Vreg-load –10 0 10 mV Ireg = 0 to 10 mA
Note: 1. Reference values for design. Not 100% tested in production.
Typical Application
Desktop/Server Application
+12 V
VCIN BOOT
THWN VIN
DISBL#
Reg5V VSWH
R2J20657CNP
PWM PGND
CGND LSDBL# GH GL
+5 V VCIN BOOT
THWN VIN
DISBL#
Reg5V VSWH
R2J20657CNP
PWM PGND
CGND LSDBL# GH GL
PWM1
VCIN BOOT
THWN VIN
DISBL#
PWM PGND
CGND LSDBL# GH GL
VCIN BOOT
THWN VIN
DISBL#
Reg5V VSWH
R2J20657CNP
PWM PGND
CGND LSDBL# GH GL
Pin Connection
0.1 μF 1.0 μF
CGND
0 to 10 Ω
VIN
1.0 μF
12 V Low-side Disable Signal INPUT
CGND
10 μF × 4 10 9 8 7 6 5 4 3 2 1
VIN
VSWH
GH
CGND
BOOT
VCIN
Reg5V
LSDBL#
11 PWM 40 PWM INPUT
12 VIN CGND DISBL# 39 Thermal Shutdown
13 PAD PAD THWN 38
PGND
14 VIN CGND 37
10 kΩ
15 VSWH
R2J20657CNP GL 36 VCIN
16 PGND VSWH 35
10 kΩ
17 VSWH 34 VCIN
18 PAD 33
Thermal Warning
19 32
20 31
VSWH
PGND
21 22 23 24 25 26 27 28 29 30
Power GND Signal GND 0.45 μH
Vout
PGND PGND
0.1 μF
1.0 μF
0 to 10 Ω
VIN
Low-side Disable Signal INPUT
12 V
5.0 V
External
CGND Power Supply
10 μF × 4 10 9 8 7 6 5 4 3 2 1
VIN
VSWH
GH
CGND
BOOT
VCIN
Reg5V
LSDBL#
20 31
VSWH
PGND
21 22 23 24 25 26 27 28 29 30
Power GND Signal GND 0.45 μH
Vout
PGND PGND
Test Circuit
IIN
Vinput A
V VIN
ICIN
Vcont A
VCIN V
VCIN BOOT
DISBL# VIN
R2J20657CNP
Reg5V VSWH
LSDBL#
Note: PIN = IIN × VIN + ICIN × VCIN Averaging Averaging Output Voltage
POUT = IO × VO V
circuit VO
Efficiency = POUT / PIN
PLOSS(DrMOS) = PIN – POUT
Ta = 27°C
Typical Data
Power Loss vs. Output Current Power Loss vs. Input Voltage
8 1.8
VIN = 12 V VCIN = Reg5V = 5 V
1.7 VOUT = 1.3 V
7 VCIN = Reg5V = 5 V
VOUT = 1.3 V 1.6 fPWM = 600 kHz
f = 600 kHz L = 0.45 μH
6 LPWM
@ VIN = 12 V
5 1.4
1.3
4
1.2
3 1.1
2 1.0
0.9
1
0.8
0 0.7
0 5 10 15 20 25 30 35 40 4 6 8 10 12 14 16
Output Current (A) Input Voltage (V)
Power Loss vs. Output Voltage Power Loss vs. Switching Frequency
1.8 1.8
VIN = 12 V VIN = 12 V
1.7 VCIN = Reg5V = 5 V 1.7 VCIN = Reg5V = 5 V
1.6 fPWM = 600 kHz 1.6 VOUT = 1.3 V
L = 0.45 μH L = 0.45 μH
Normalized Power Loss
1.4 1.4
1.3 1.3
1.2 1.2
1.1 1.1
1.0 1.0
0.9 0.9
0.8 0.8
0.7 0.7
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 250 500 750 1000 1250
Output Voltage (V) Switching Frequency (kHz)
1.4 1.4
1.3 1.3
1.2 1.2
1.1 1.1
1.0 1.0
0.9 0.9
0.8 0.8
0.7 0.7
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 4.5 5.0 5.5 6.0
Output Inductance (μH) VCIN = Reg5V (V)
60
50
40
30
20
10
250 500 750 1000 1250
Switching Frequency (kHz)
Description of Operation
The DrMOS multi-chip module incorporates a high-side MOS FET, low-side MOS FET, and MOS-FET driver in a
single QFN package. Since the parasitic inductance between each chip is extremely small, the module is highly suitable
for use in buck converters to be operated at high frequencies. The control timing between the high-side MOS FET, low-
side MOS FET, and driver is optimized so that high efficiency can be obtained at low output-voltage.
12 V
VCIN > 7.4 V
VCIN VCIN
5V
IN IN
Reg5V Reg5V
OUT
OUT
To Internal To Internal
Logic Logic
Supervisor Supervisor
3.3V
PWM 1.4V
IL
GH
GL
Reg5V
DISBL# signal
18.5k
Tri-state
PWM Pin Input detection signal
PWM
Logic
SW To internal control
12.5k
The LSDBL# pin is the Low Side Gate Disable pin for "Discontinuous Conduction Mode (DCM)" when LSDBL# is
low.
This pin is internally pulled up to Reg5V with 160 k resistor.
When low side disable function is not used, keep this pin open or pulled up to VCIN.
THWN
This Thermal Warning feature is the indication of the high temperature status.
THWN is an open drain logic output signal and need to connect a pull-up resistor (ex.51 k) to THWN for Systems
with the thermal warning implementation.
When the chip temperature of the internal driver IC becomes over 150°C, Thermal warning function operates.
This signal is only indication for the system controller and does not disable DrMOS operation.
When thermal warning function is not used, keep this pin open.
Thermal
"H"
warning
THWN output Normal
Logic Level operating
"L"
MOS FET
The MOS FETs incorporated in R2J20657CNP are highly suitable for synchronous-rectification buck conversion. For
the high-side MOS FET, the drain is connected to the VIN pin and the source is connected to the VSWH pin. For the
low-side MOS FET, the drain is connected to the VSWH pin and the source is connected to the PGND pin.
Package Dimensions
JEITA Package Code RENESAS Code Previous Code MASS[Typ.]
P-VQFN40-6x6-0.50 PVQN0040KC-A ⎯ 0.10g
NOTE)
b1,c1: DIMENSION BEFORE PLATING
HD
D
2.0
2.2
30pin 21pin 21pin 30pin
0.2
0.7
40pin 2.2
11pin 40pin Reference Dimension in Millimeters
3.1 Symbol
Min Nom Max
1pin 10pin 10pin 1pin D
e 6.00
ZE
2.2
2.2
0.2
6.00
0.2
ZD A 0.95
A1 0.005
b 0.17 0.22 0.27
S b1 0.20
e 0.50
Lp 0.40 0.50 0.60
c1
S
c
A
x
b y
b1
×M S 0.05
y1
Lp t
A1
y S HD 6.20
Outer lead detail HE 6.20
ZD 0.75
ZE 0.75
c 0.17 0.22 0.27
c1 0.20
Ordering Information
Part Name Quantity Shipping Container
R2J20657CNP#G2 2500 pcs Taping Reel