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NUC10i3FN/NUC10i5FN/
NUC10i7FN
Technical Product Specification
Regulatory Models: NUC10FNK (Slim Kit/Mini PC)
NUC10FNH (Tall Kit/Mini PC)
NUC10FNB (Board)
Nov 2019
Rev 001
Intel NUC Products NUC10i3FN, NUC10i5FN and NUC10i7FN may contain design defects or errors known as errata that may cause the product to
deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Products
NUC10i3FN/NUC10i5FN/NUC10i7FN Specification Update.
Revision History
Revision Revision History Date
001 First release of Intel NUC Products NUC10i3FN/NUC10i5FN/NUC10i7FN Technical Nov 2019
Product Specification
Disclaimer
This product specification applies to only the standard Intel NUC Board, Kit or System with BIOS identifier
FNCML357.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR
ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC
or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.
may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
order.
Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
ii
Board Identification Information
Note: For this Technical Product Specification, the use of Intel NUC Products
NUC10i3FN/NUC10i5FN/NUC10i7FN refers to Intel NUC 10 Performance Kit NUC10i3FNH,
Intel NUC 10 Performance Kit NUC10i5FNH, Intel NUC 10 Performance Kit NUC10i7FNH, Intel
NUC 10 Performance Kit NUC10i3FNK, Intel NUC 10 Performance Kit NUC10i5FNK, Intel NUC
10 Performance Kit NUC10i7FNK, Intel NUC 10 Performance Mini PC NUC10i3FNKx, Intel NUC
10 Performance Mini PC NUC10i5FNKx, Intel NUC 10 Performance Mini PC NUC10i7FNKx, Intel
NUC 10 Performance Mini PC NUC10i3FNHx, Intel NUC 10 Performance Mini PC NUC10i5FNHx,
Intel NUC 10 Performance Mini PC NUC10i7FNHx, and Intel NUC Boards NUC10i3FNB,
NUC10i5FNB and NUC10i7FNB.
Notes:
1. Where, v = version, y = year, d = date, t = time
2. The AA number is found on a small label on the SO-DIMM sockets.
3. The Intel® Core™ i3-10110U processor is used on this AA revision consisting of the following component:
Device Stepping S-Spec Numbers
Intel Core i3-10110U V0 SRGL0
Notes:
1. Where, v = version, y = year, d = date, t = time
2. The AA number is found on a small label on the SO-DIMM sockets.
3. The Intel® Core™ i5-10210U processor is used on this AA revision consisting of the following component:
Device Stepping S-Spec Numbers
Intel Core i5-10210U V0 SRGKY
Notes:
1. Where, v = version, y = year, d = date, t = time
2. The AA number is found on a small label on the SO-DIMM sockets.
3. The Intel® Core™ i7-10710U processor is used on this AA revision consisting of the following component:
Device Stepping S-Spec Numbers
Intel Core i7-10710U A0 SRGP2
iii
Product Identification Information
Notes:
The maximum supported memory speed of the Intel NUC Board NUC10i[x]FNB is 2666 MHz.
iv
Preface
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for Intel® NUC Board NUC10i3FNB, Intel®
NUC Board NUC10i5FNB and Intel® NUC Board NUC10i7FNB.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel® NUC Board
NUC10i3FNB, Intel® NUC Board NUC10i5FNB and Intel® NUC Board NUC10i7FNB and its
components to the vendors, system integrators, and other engineers and technicians who need
this level of information. It is specifically not intended for general audiences.
v
Preface
Typographical Conventions
This section contains information about the conventions used in this specification. Not all these
symbols and abbreviations appear in all specifications of this type.
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
vi
Preface
vii
Contents
Contents
Preface ............................................................................................................................... v
Intended Audience ................................................................................................................................................. v
What This Document Contains ......................................................................................................................... v
Typographical Conventions .............................................................................................................................. vi
viii
Contents
ix
Contents
x
Contents
Figures
Figure 1. Major Board Components (Top) .......................................................................................................... 3
Figure 2. Major Board Components (Bottom) ................................................................................................... 4
Figure 3. Block Diagram.............................................................................................................................................. 6
Figure 4. Memory Channel and SO-DIMM Configuration.......................................................................... 10
Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... 17
Figure 6. LAN Connector LED Locations........................................................................................................... 18
Figure 7. Thermal Solution and Fan Header ................................................................................................... 20
Figure 8. Location of the Standby Power LED ............................................................................................... 25
Figure 9. Front Panel Connectors........................................................................................................................ 29
Figure 10. Back Panel Connectors ...................................................................................................................... 29
Figure 11. Headers and Connectors (Top) ....................................................................................................... 30
Figure 12. Connectors and Headers (Bottom) ............................................................................................... 31
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................ 37
Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch) 39
Figure 15. Location of the CIR Sensor ............................................................................................................... 39
Figure 16. Location of the BIOS Security Jumper ........................................................................................ 41
Figure 17. Board Dimensions ................................................................................................................................ 43
Figure 18. Board Height Dimensions ................................................................................................................. 44
Figure 19. Localized High Temperature Zones ............................................................................................. 46
Figure 20. Installation Area of Thermal Pad for Intel NUC Kits .............................................................. 47
Figure 21. Installation area of Thermal Pad for Intel NUC Kits
NUC10i3FNH/NUC10i5FNH/NUC10i7FNH ............................................................................................. 48
Figure 22. Intel NUC Kit NUC10i3FNH/NUC10i5FNH/NUC10i7FNH Features – Front .................. 59
Figure 23. Intel NUC Kit NUC10i3FNK/NUC10i5FNK/NUC10i7FNK Features – Front ................... 60
Figure 24. Intel NUC Kit NUC10i3FNH/NUC10i5FNH/NUC10i7FNH Features – Rear .................... 61
Figure 25. Intel NUC Kit NUC10i3FNK/NUC10i5FNK/NUC10i7FNK Features – Rear ..................... 62
Figure 26. VESA Bracket Installation................................................................................................................... 63
Tables
Table 1. Feature Summary ........................................................................................................................................ 1
Table 2. Components Shown in Figure 1 ............................................................................................................ 3
Table 3. Components Shown in Figure 2 ............................................................................................................ 5
Table 4. Supported Memory Configurations .................................................................................................. 10
Table 5. DisplayPort Multi-Streaming Resolutions ...................................................................................... 12
Table 6. Multiple Display Configuration Maximum Resolutions ............................................................ 13
Table 7. Audio Formats Supported by the HDMI and USB Type C Interfaces.................................. 13
Table 8. LAN Connector LED States ................................................................................................................... 18
Table 9. Effects of Pressing the Power Switch............................................................................................... 21
Table 10. Power States and Targeted System Power................................................................................. 22
Table 11. Wake-up Devices and Events ........................................................................................................... 23
Table 12. Headers and Connectors Shown in Figure 11 ........................................................................... 30
Table 13. Connectors and Headers Shown in Figure 12 ........................................................................... 32
xi
Contents
xii
Product Description
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of Intel® NUC Board NUC10i3FNB, Intel® NUC Board
NUC10i5FNB and Intel® NUC Board NUC10i7FNB.
continued
1
Product Description
2
Product Description
NOTE
Actual thermal solution may differ from picture.
3
Product Description
4
Product Description
A DC Input Jack
B HDMI connector
C LAN connector
D Dual USB 3.1 ports (blue)
E Digital Microphones (DMICs) header
F Front Panel header
G Coin Cell Battery connector
H RGB LED header
I Intel® Wi-Fi 6 + Bluetooth 5 AX201 module
J Standby LED
K M.2 connector (key type M) for 2242 and 2280 modules
L Single-port USB 2.0 header (1.25 mm pitch)
M Consumer Infrared (CIR) sensor
N HDD Activity LED
O Single-port USB 2.0 header (1.25 mm pitch)
P Front panel USB 3.1 Type-C connector (charging)
Q SATA HDD connector (0.5 mm pitch)
R Front panel USB 3.1 connector (blue)
S BIOS security header & jumper
T Front panel stereo microphone/headphone jack
U Front panel power button
V Consumer electronics control (CEC) header
W DDR4 SO-DIMM1 socket
X DDR4 SO-DIMM2 socket
5
Product Description
6
Online Support
7
Online Support
CAUTION
Disconnect the attached power cord before you open or service the device.
8
Processor / System Memory
1.3 Processor
One of the following:
A soldered-down 10th generation Intel® Core™ i3-10110U dual-core processor with up to a
maximum 25 W TDP (if thermal margin is available).
• 2.10 GHz base frequency, 4.10 GHz turbo frequency, 4 threads
• 4 MB Intel® Smart Cache
• Intel® UHD Graphics
• Integrated memory controller
• Integrated PCH
A soldered-down 10th generation Intel® Core™ i5-10210U quad-core processor with up to a
maximum 25 W TDP (if thermal margin is available).
• 1.60 GHz base frequency, 4.20 GHz turbo frequency, 8 threads
• 6 MB Intel® Smart Cache
• Intel® UHD Graphics
• Integrated memory controller
• Integrated PCH
A soldered-down 10th generation Intel® Core™ i7-10710U six-core processor with up to a
maximum 25 W TDP (if thermal margin is available).
• 1.10 GHz base frequency, 4.70 GHz turbo frequency, 12 threads
• 12 MB Intel® Smart Cache
• Intel® UHD Graphics
• Integrated memory controller
• Integrated PCH
NOTE
There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on
page 44 for information on power supply requirements.
The board has two 260-pin SO-DIMM sockets and supports the following memory features:
• 1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided SO-DIMMs
• 64 GB maximum total system memory (with 16 Gb memory technology). Refer to Section
2.1.1 on page 28 for information on the total amount of addressable memory.
• Minimum recommended total system memory: 4096 MB
• Non-ECC SO-DIMMs
• Serial Presence Detect
• DDR4 2666 MHz SDRAM SO-DIMMs
• Supports 8 Gb and 16 Gb memory technology (SDRAM density)
9
System Memory
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This
allows the BIOS to read the SPD data and program the chipset to accurately configure memory
settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to
correctly configure the memory settings, but performance and reliability may be impacted or the
SO-DIMMs may not function under the determined frequency.
NOTE
Intel NUC Boards NUC10i3FNB, NUC10i5FNB and NUC10i7FNB support only 8 Gb and 16 Gb
memory technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM
configurations.
10
Processor Graphics Subsystem
NOTES
Intel Quick Sync Video is enabled by an appropriate software application.
HDMI 2.0b is enabled by LSPCON (DP 1.2 to HDMI 2.0b protocol converter); Stereo 3D (S3D)
technology is not supported.
HDMI 2.0b supports High Dynamic Range (HDR) and 10-bit sampling. HDR requires use of
appropriate software and display hardware.
11
Processor Graphics Subsystem
DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple
independent video streams (daisy-chain connection with multiple monitors) over a single
DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this
feature.
Table 5 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream
Transport.
12
Processor Graphics Subsystem
1.5.1.7 Integrated Audio Provided by the HDMI and USB Type C Interfaces
The HDMI and USB Type C interfaces from the processor support audio. The processor supports
two High Definition audio streams on two digital ports simultaneously (the DMA controllers are in
PCH). The integrated audio processing (DSP) is performed by the PCH.
Table 7. Audio Formats Supported by the HDMI and USB Type C Interfaces
Audio Formats HDMI USB Type C
AC3 – Dolby* Digital Yes Yes
Dolby Digital Plus Yes Yes
DTS-HD* Yes Yes
LPCM, 192kHz/24-bit, 8-channel Yes Yes
Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc Audio Yes Yes
Format)
13
USB / SATA Interface
1.6 USB
The USB port arrangement is as follows:
• USB 3.1 Gen 2 (10 Gbps) Type C port implemented via the external back panel Type C
connector (maximum current is 3A @5V or 2A @9V)
• USB 3.1 Gen 2 (10 Gbps) Type A ports (maximum current is 900 mA for each port):
Two ports are implemented with external front panel connectors (blue)
Two ports are implemented with external back panel connectors (blue)
• USB 2.0 ports (maximum current is 500 mA for each port of the white header (1 A total):
Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)
One port is reserved for the M.2 2230 Wireless module
All the USB ports are high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets
the requirements for full-speed devices.
14
SATA Interface
NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows* 10 includes
the necessary AHCI drivers without the need to install separate AHCI drivers during the operating
system installation process; however, it is always good practice to update the AHCI drivers to the
latest available by Intel.
NOTE
Intel Rapid Storage Technology / SATA RAID is only supported if an M.2 SATA SSD module is used
with the onboard SATA interface. RAID is not available when using M.2 PCIe SSD module and
onboard SATA interface.
NOTE
In order to use supported RAID and Intel Next Generation Storage Acceleration with Intel®
Optane™ Technology features, you must first enable RAID in the BIOS.
15
Thunderbolt 3 / Real-Time Clock Subsystem / Audio Subsystem
1.8 Thunderbolt 3
The boards support Thunderbolt™ 3 with up to 40 Gbps of data throughput, one 4k (60Hz)
monitor output, USB3.1 (Gen 2) connection and charging capabilities up to 5V at 3A or 9v at 2A
via the back-panel USB Type C connector. Item A in Figure 10 shows the location of the rear
panel USB Type C port.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be notified
during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS
RAM (for example, the date and time) might not be accurate. Replace the battery with an
equivalent one. Figure 1 on page 3 shows the location of the battery.
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled
where possible. Disposal of used batteries must be in accordance with local environmental
regulations.
16
Audio Subsystem / LAN Subsystem
NOTE
The analog circuit of the front panel audio connector is designed to power headphones or
amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are
connected to this output.
17
LAN Subsystem / Power Management
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Table 8 describes the LED states when the board is powered up and the LAN subsystem is
operating.
18
Audio Subsystem / LAN Subsystem
19
LAN Subsystem / Power Management
Item Description
A Thermal solution
B Processor fan header
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this board requires an operating system that
provides full ACPI support. ACPI features include:
20
Power Management
Table 9 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
21
Power Management
22
Power Management
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides
full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that provides full
ACPI support.
23
Power Management
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
24
Power Management
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power
cord before installing or removing any devices connected to the board. Failure to do so could
damage the board and any attached devices.
25
Power Management
NOTES
You cannot switch between ACPI S3 and Modern Standby. Standby power model switching is only
supported with a complete operating system reinstallation. Switching from one standby power
model to another will prevent the proper functioning of sleep states.
Updating BIOS or resetting BIOS to defaults will preserve the current standby power model.
NOTE
Software with security capability is required to take advantage of Intel platform security
technologies.
NOTE
A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT
requires a computer system with a chipset, BIOS, enabling software and/or operating system,
device drivers, and applications designed for this feature.
26
Platform Security
NOTE
Support for fTPM version 2.0 requires a UEFI-enabled operating system, such as Microsoft*
Windows* 10.
CAUTION
BIOS recovery using the BIOS security jumper clears Intel® Platform Trust Technology (Intel® PTT)
keys. These keys will not be restored after the BIOS recovery. Disable HDD encryption like
BitLocker and other uses of data encryption and authentication before using BIOS recovery.
27
Technical Reference
2 Technical Reference
CAUTION
Only the following connectors and headers have overcurrent protection: back panel and front
panel USB.
The other internal connectors and headers are not overcurrent protected and should connect only
to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these
connectors or headers to power devices external to the computer’s chassis. A fault in the load
presented by the external devices could cause damage to the computer, the power cable, and the
external devices themselves.
Furthermore, improper connection of USB header single wire connectors may eventually overload
the overcurrent protection and cause damage to the board.
28
Technical Reference
This section describes the board’s connectors and headers. The connectors and headers can be
divided into these groups:
• Front panel I/O connectors
• Back panel I/O connectors
Item Description
A Front panel power button and LED
B Front panel Stereo
microphone/headphone jack
C USB 3.1 (Gen 2) Type A port (blue)
D USB 3.1 (Gen 2) Type C port
E HDD LED
F CIR
Item Description
A USB 3.1 (Gen 2) Type C port
(Thunderbolt)
B USB 3.1 (Gen 2) Type A ports (blue)
C LAN
D HDMI 2.0b connector
E 19 V DC power input jack
29
Technical Reference
30
Technical Reference
31
Technical Reference
32
Technical Reference
NOTE
Connector is Entery 6700K-J16N-00L, FPC 16 pin 0.5mm pitch SMT.
NOTE
Connector is Molex part number 53398-0471, 1.25 mm pitch PicoBlade header, surface mount,
vertical, lead-free, 4 circuits.
continued
33
Technical Reference
See section 2.2.4.11 for more information on the DMIC Array connector.
34
Technical Reference
NOTE
Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,
lead-free, 4 circuits.
See section 2.2.4.10 for more information on the RGB LED connector.
NOTE
Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,
lead-free, 4 circuits.
NOTE
Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,
lead-free, 4 circuits.
35
Technical Reference
36
Technical Reference
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch)
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from
or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive
connected to an onboard SATA connector.
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is
normally open. When the switch is closed, the board resets and runs the POST.
Pins 2 and 4 can be connected to a one- or two-color LED. Table 22 and Table 23 show the
possible LED states.
NOTE
The LED behavior shown in Table 22 is default – other patterns may be set via BIOS setup.
37
Technical Reference
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch
must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or
off. (The time requirement is due to internal debounce circuitry on the board.) At least two
seconds must pass before the power supply will recognize another on/off signal.
NOTE
*Pins 10-17 added with UHS-II v4.0 specification. Not present on all SD cards.
NOTE
External power voltage, 19 V DC, is dependent on the type of power adapter used.
38
Technical Reference
NOTE
• The +5 V DC power on the USB header is fused.
• Use only an internal USB connector that conforms to the USB 2.0 specification for high-speed
USB devices.
The CIR feature is made up of the receiving sensor. The receiving sensor consists of a filtered
translated infrared input compliant with Microsoft CIR specifications.
Customers are required to provide their own media center compatible remote or smart phone
application for use with the Intel NUC. Figure 15 shows the location of the CIR sensor.
Item Description
A CIR Sensor
39
Technical Reference
• External CEC adaptor connected via CEC connector (item J in Figure 12; pinout in Table 19)
• Onboard CEC control from the embedded controller via HDMI cable and BIOS setup. Expected
behavior is provided in Table 25 below.
Table 25. HDMI CEC expected behavior
Activity Current Status Action Expected Behavior
PC1,2 TV3
Wake On TV Off Off TV on PC on
NOTE
CEC Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount,
vertical, lead-free, 4 circuits.
For information about Refer to
HDMI CEC technology http://www.hdmi.org/pdf/whitepaper/DesigningCECintoYourNextH
DMIProduct.pdf
RGB LED Activity Indicator None, Power indicator, HDD Activity or Software defined
40
Technical Reference
Table 27 describes the jumper settings for the three modes: normal, lockdown, and
configuration.
41
Technical Reference
Lockdown 2-3 The BIOS uses current configuration information and passwords for booting, except:
• All POST Hotkeys are suppressed (prompts are not displayed and keys are not accepted. For
example, F2 for Setup, F10 for the Boot Menu).
• Power Button Menu is not available (see Section 3.7.4 Power Button Menu).
BIOS updates are not available except for automatic Recovery due to flash corruption.
Configuration None BIOS Recovery Update process if a matching *.bio file is found. Recovery Update can be cancelled
by pressing the Esc key.
If the Recovery Update was cancelled or a matching *.bio file was not found, a Config Menu will be
displayed. The Config Menu consists of the following options:
[1] Suppress this menu until the BIOS Security Jumper is replaced.
42
Technical Reference
43
Technical Reference
44
Technical Reference
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design remains solely
with the system integrator. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal
performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating temperature, see
the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in shorter than expected product lifetime.
45
Technical Reference
Item Description
A Thermal solution
B Processor voltage regulator area
46
Technical Reference
A thermal pad has been installed for the bottom of the chassis to improve the thermal
performance when using M.2 devices that operate at higher temperatures. If the thermal pad
ever needs to be replaced, Figure 20 shows the installation area of the thermal pad for Intel NUC
Kit NUC10i3FNK, Intel NUC Kit NUC10i5FNK and Intel NUC Kit NUC10i7FNK.
Item Description
A Thermal Pad
B Thermal Pad Installation Area
Figure 20. Installation Area of Thermal Pad for Intel NUC Kits
NUC10i3FNK/NUC10i5FNK/NUC10i7FNK
CAUTION
Disconnect the attached power cord before you open or service the device.
47
Technical Reference
Figure 21 shows the installation area of the thermal pad for Intel NUC Kit NUC10i3FNH, Intel NUC
Kit NUC10i5FNH and Intel NUC Kit NUC10i7FNH.
Item Description
A Thermal Pad
B Thermal Pad Installation Area
Figure 21. Installation area of Thermal Pad for Intel NUC Kits
NUC10i3FNH/NUC10i5FNH/NUC10i7FNH
CAUTION
Disconnect the attached power cord before you open or service the device.
48
Technical Reference
Table 31 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to
cool the board.
To ensure functionality and reliability, the component is specified for proper operation when
Case Temperature is maintained at or below the maximum temperature listed in Table 32. This is
a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified
as the maximum sustainable power to be dissipated by the components). When the component is
dissipating less than TDP, the case temperature should be below the Maximum Case
Temperature. The surface temperature at the geometric center of the component corresponds to
Case Temperature.
It is important to note that the temperature measurement in the system BIOS is a value reported
by embedded thermal sensors in the components and does not directly correspond to the
Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is
Tcontrol.
49
Technical Reference
2.7 Reliability
The Mean Time between Failures (MTBF) predictions are calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2,
Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare
parts requirements. The MTBF for Intel NUC10i3FNB board is 273,271 hours. The MTBF for Intel
NUC10i5FNB board is 273,153 hours. The MTBF for Intel NUC10i7FNB board is 272,416 hours.
2.8 Environmental
Table 33 lists the environmental specifications for the board.
50
BIOS Features
3.1 Introduction
The board uses Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI
Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual BIOS
Setup program, POST, the PCI auto-configuration utility, embedded controller (EC) firmware, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
production BIOSes are identified as FNCML357.
The BIOS Setup program can be used to view and change the BIOS settings for the computer.
The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test
(POST) memory test begins and before the operating system boot begins.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates
for system components. The MIF database defines the data and provides the method for
accessing this information. The BIOS enables applications such as third-party management
software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS
information. The BIOS supports an SMBIOS table interface for such operating systems. Using
this support, an SMBIOS service-level application running on a non-Plug and Play operating
system can obtain the SMBIOS information. Additional board information can be found in the
BIOS under the Additional Information header under the Main BIOS page.
51
BIOS Features
to install an operating system that supports USB. By default, Legacy USB support is set to
Enabled.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
52
BIOS Features
NOTE
Supported file systems for BIOS recovery:
• NTFS (sparse, compressed, or encrypted files are not supported)
• FAT32
• FAT16
• FAT12
53
BIOS Features
NOTE
Optical drives are not supported by the onboard SATA connectors. Optical drives are supported
only via the USB interfaces. If the optical drive is not bootable, it will be ignored during the POST
process.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key
during POST, the User Access Level in the BIOS Setup program's Security menu must be
set to “Full.”
NOTE
When no bootable disk or USB device is found, the system will default to network boot.
54
BIOS Features
The BIOS will display the following prompt and wait for a keystroke:
[ESC] Normal Boot
[F2] Intel Visual BIOS
[F3] Disable Fast Boot†
[F4] BIOS Recovery
[F7] Update BIOS
[F10] Enter Boot Menu
[F12] Network Boot
†
[F3] Disable Fast Boot is only displayed if at least one Fast Boot optimization is enabled.
If an unrecognized key is hit, then the BIOS will wait for another keystroke. If one of the listed
hotkeys is hit, the BIOS will follow the indicated boot path. Password requirements must still be
honored.
If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and reset the
system.
55
BIOS Features
The User hard disk drive password, when installed, will be required upon each power-cycle until
the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The Master Key
hard disk drive password exists as an unlock override in the event that the User hard disk drive
password is forgotten. Only the installation of the User hard disk drive password will cause a hard
disk to be locked upon a system power-cycle.
Table 36 shows the effects of setting the Hard Disk Drive Passwords.
Table 36. Master Key and User Hard Drive Password Functions
Password Set Password During Boot
Neither None
Master only None
User only User only
Master and User Set Master or User
During every POST, if a User hard disk drive password is set, POST execution will pause with the
following prompt to force the user to enter the Master Key or User hard disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system will
continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the above
prompt. The user will have three attempts to correctly enter the hard disk drive password. After
the third unsuccessful hard disk drive password attempt, the system will halt with the message:
Hard Disk Drive Password Entry Error
NOTE
As implemented on Intel NUC Board NUC10i3FNB, Intel NUC Board NUC10i5FNB and Intel NUC
Board NUC10i7FNB, Hard Disk Drive Password Security is only supported on either SATA port 0
(M.2 ) or SATA Port 1 (onboard SATA connector). The passwords are stored on the hard disk drive
so if the drive is relocated to another computer that does not support Hard Disk Drive Password
Security feature, the drive will not be accessible.
Currently, there is no industry standard for implementing Hard Disk Drive Password Security on
AHCI or NVME drives. Hard drive encryption can still be implemented and does not require Hard
Disk Drive Password Security.
56
BIOS Features
57
Error Messages & Blink Codes
58
Intel NUC Kit Features
59
Intel NUC Kit Features
60
Intel NUC Kit Features
Cooling Vents
Ethernet Port
61
Intel NUC Kit Features
Ethernet Port
62
Intel NUC Kit Features
63