Data Sheet No.

PD60043-N

IR2101(S)
IR2102(S)
HIGH AND LOW SIDE DRIVER
Features Product Summary
• Floating channel designed for bootstrap operation
Fully operational to +600V VOFFSET 600V max.
Tolerant to negative transient voltage
dV/dt immune
IO+/- 130 mA / 270 mA
• Gate drive supply range from 10 to 20V
VOUT 10 - 20V
• Undervoltage lockout
• 3.3V, 5V, and 15V logic input compatible ton/off (typ.) 160 & 150 ns
• Matched propagation delay for both channels
• Outputs in phase with inputs (IR2101) or out of Delay Matching 50 ns
phase with inputs (IR2102)

Description Packages
The IR2101(S)/IR2102(S) are high voltage, high
speed power MOSFET and IGBT drivers with inde-
pendent high and low side referenced output chan-
nels. Proprietary HVIC and latch immune CMOS
technologies enable ruggedized monolithic con-
8 Lead SOIC
struction. The logic input is compatible with stan-
8 Lead PDIP
dard CMOS or LSTTL output, down to 3.3V logic. The
output drivers feature a high pulse current buffer
stage designed for minimum driver cross-conduction. The floating channel can be used to drive an N-channel
power MOSFET or IGBT in the high side configuration which operates up to 600 volts.

Typical Connection
up to 600V

VCC

VCC VB
HIN HIN HO
LIN LIN VS TO
LOAD

COM LO

IR2101
up to 600V

VCC

VCC VB
HIN HIN HO
LIN LIN VS TO
LOAD
(Refer to Lead Assignments for correct pin COM LO
configuration). This/These diagram(s) show
electrical connections only. Please refer to IR2102
our Application Notes and DesignTips for
proper circuit board layout.

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IR2101/IR2102 (S)

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.

Symbol Definition Min. Max. Units

VB High side floating supply voltage -0.3 625
VS High side floating supply offset voltage VB - 25 VB + 0.3
VHO High side floating output voltage VS - 0.3 VB + 0.3
V
VCC Low side and logic fixed supply voltage -0.3 25
VLO Low side output voltage -0.3 VCC + 0.3
VIN Logic input voltage (HIN & LIN) -0.3 VCC + 0.3
dVS/dt Allowable offset supply voltage transient — 50 V/ns
PD Package power dissipation @ TA ≤ +25°C (8 lead PDIP) — 1.0
W
(8 lead SOIC) — 0.625
RthJA Thermal resistance, junction to ambient (8 lead PDIP) — 125
°C/W
(8 lead SOIC) — 200
TJ Junction temperature — 150
TS Storage temperature -55 150 °C
TL Lead temperature (soldering, 10 seconds) — 300

Recommended Operating Conditions

The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.

Symbol Definition Min. Max. Units

VB High side floating supply absolute voltage VS + 10 VS + 20
VS High side floating supply offset voltage Note 1 600
VHO High side floating output voltage VS VB
V
VCC Low side and logic fixed supply voltage 10 20
VLO Low side output voltage 0 VCC
VIN Logic input voltage (HIN & LIN) (IR2101) & (HIN & LIN) (IR2102) 0 VCC
TA Ambient temperature -40 125 °C

Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip
DT97-3 for more details).

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 IR2101/IR2102 (S)

Dynamic Electrical Characteristics

VBIAS (VCC, VBS) = 15V, CL = 1000 pF and TA = 25°C unless otherwise specified.

Symbol Definition Min. Typ. Max. Units Test Conditions

ton Turn-on propagation delay — 160 220 VS = 0V
toff Turn-off propagation delay — 150 220 VS = 600V
ns
tr Turn-on rise time — 100 170
tf Turn-off fall time — 50 90
MT Delay matching, HS & LS turn-on/off — — 50

Static Electrical Characteristics

VBIAS (VCC, VBS) = 15V and TA = 25°C unless otherwise specified. The VIN, VTH and IIN parameters are referenced to
COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO.

Symbol Definition Min. Typ. Max. Units Test Conditions

VIH Logic “1” input voltage (IR2101)
3 — — VCC = 10V to 20V
Logic “0” input voltage (IR2102)
V
VIL Logic “0” input voltage (IR2101)
— — 0.8 VCC = 10V to 20V
Logic “1”input voltage (IR2102)
VOH High level output voltage, VBIAS - VO — — 100 IO = 0A
mV
VOL Low level output voltage, VO — — 100 IO = 0A
ILK Offset supply leakage current — — 50 VB = VS = 600V
IQBS Quiescent VBS supply current — 30 55 VIN = 0V or 5V
IQCC Quiescent VCC supply current — 150 270 VIN = 0V or 5V
IIN+ Logic “1” input bias current µA VIN = 5V (IR2101)
— 3 10
VIN = 0V (IR2102)
IIN- Logic “0” input bias current VIN = 0V (IR2101)
— — 1
VIN = 5V (IR2102)
VCCUV+ VCC supply undervoltage positive going 8 8.9 9.8
threshold
V
VCCUV- VCC supply undervoltage negative going 7.4 8.2 9
threshold
IO+ Output high short circuit pulsed current 130 210 — VO = 0V
mA VIN = Logic “1”
PW ≤ 10 µs
IO- Output low short circuit pulsed current 270 360 — VO = 15V
VIN = Logic “0”
PW ≤ 10 µs

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IR2101/IR2102 (S)

Functional Block Diagram

VB

Q
HV
LEVEL PULSE R HO
SHIFT
FILTER S

HIN
PULSE VS
GEN
UV
DETECT VCC

LIN
LO

COM

IR2101

VB

Q
HV
Vcc LEVEL PULSE R HO
SHIFT
FILTER S

HIN
PULSE VS
GEN
UV
DETECT VCC
Vcc

LIN
LO

COM

IR2102

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 IR2101/IR2102 (S)

Lead Definitions
Symbol Description
HIN Logic input for high side gate driver output (HO), in phase (IR2101)
HIN Logic input for high side gate driver output (HO), out of phase (IR2102)
LIN Logic input for low side gate driver output (LO), in phase (IR2101)
LIN Logic input for low side gate driver output (LO), out of phase (IR2102)
VB High side floating supply
HO High side gate drive output
VS High side floating supply return
VCC Low side and logic fixed supply
LO Low side gate drive output
COM Low side return

Lead Assignments

8 Lead PDIP 8 Lead SOIC

IR2101 IR2101S

8 Lead PDIP 8 Lead SOIC

IR2102 IR2102S

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IR2101/IR2102 (S)

HIN
LIN
50% 50%
HIN
LIN

HIN HIN 50% 50%

LIN LIN
ton tr toff tf

90% 90%
HO
HO
LO
LO 10% 10%

Figure 1. Input/Output Timing Diagram Figure 2. Switching Time Waveform Definitions

HIN
LIN
50% 50%

HIN 50% 50%

LIN

LO HO

10%

MT MT

90%

LO HO

Figure 3. Delay Matching Waveform Definitions

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 IR2101/IR2102 (S)

500 500
Turn-On Delay Time (ns)

Turn-On Delay Time (ns)

400 400

300 300 Max.

Max.
200 200
Typ.
100 100
Typ.

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) VBIAS Supply Voltage (V)

Figure 6A. Turn-On Time vs Temperature Figure 6B. Turn-On Time vs Supply Voltage

500 5 00
Turn-On Delay Time (ns

Turn-Off Delay Time (ns)

400 4 00

300 3 00

200 2 00 M ax .

100
1 00
T yp .
0
0
0 2 4 6 8 10 12 14 16 18 20
-50 -25 0 25 50 75 1 00 1 25
Input Voltage (V) Temperature (°C)

Figure 6C. Turn-On Time vs Input Voltage Figure 7A. Turn-Off Time vs Temperature

500 500
Turn-Off Delay Time (ns
Turn-Off Delay Time (ns)

400 400

300 Max. 300

Max.

200 200

Typ.
100 100
Typ.

0 0
10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
VBIAS Supply Voltage (V)
Input Voltage (V)

Figure 7B. Turn-Off Time vs Supply Voltage Figure 7C. Turn-Off Time vs Input Voltage

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IR2101/IR2102 (S)

500 500

Turn-On Rise Time (ns)

Turn-On Rise Time (ns)

400 400

300 300
M ax.
200 M ax. 200

100 100
Typ.
Typ.
0 0
-5 0 -2 5 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) VBIAS Supply Voltage (V)

Figure 9A. Turn-On Rise Time vs Temperature Figure 9B. Turn-On Rise Time vs Voltage

20 0 200
Turn-Off Fall Time (ns)
Turn-Off Fall Time (ns)

15 0 150

M a x.
10 0 100
M ax.

50 50
Typ.
Ty p.
0 0
-50 -25 0 25 50 75 10 0 12 5 10 12 14 16 18 20
Temperature (°C) VBIAS Supply Voltage (V)

Figure 10A. Turn-Off Fall Time vs Temperature Figure 10B. Turn-Off Fall Time vs Voltage

8 8
7 7
6
In pu t V olta g e (V )

6
Inp ut V oltage (V )

5 5
4 M in . 4 M in.
3 3
2 2
1 1
0 0
-50 -25 0 25 50 75 10 0 12 5 10 12 14 16 18 20
Temperature (°C) Vcc Supply Voltage (V)

Figure 12A. Logic "1" Input Voltage (IR2101) Figure 12B. Logic "1" Input Voltage (IR2101)
Logic "0" Input Voltage (IR2102) Logic "0" Input Voltage (IR2102)
vs Temperature vs Voltage

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 IR2101/IR2102 (S)

4 4

3 .2 3.2
In p u t V o lta g e (V )

Input V o ltag e (V )
2 .4 2.4

1 .6 1.6
M ax. M ax .
0 .8 0.8

0 0
-5 0 -2 5 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) Vcc Supply Voltage (V)

Figure 13A. Logic "0" Input Voltage (IR2101) Figure 13B. Logic "0" Input Voltage (IR2101)
Logic "1" Input Voltage (IR2102) Logic "1" Input Voltage (IR2102)
vs Temperature vs Voltage
1 1
High Level Output Voltage (V)
High Level Output Voltage (V)

0 .8 0 .8

0 .6 0 .6

0 .4 0 .4

M ax. M ax.
0 .2 0 .2

0 0
-5 0 -2 5 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) Vcc Supply Voltage (V)

Figure 14A. High Level Output Figure 14B. High Level Output vs Voltage
vs Temperature

1 1
Low Level Output Voltage (V)
Low Level Output Voltage (V)

0 .8 0 .8

0 .6 0 .6

0 .4 0 .4

0 .2 0 .2
M ax. M ax.

0 0
-5 0 -2 5 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) Vcc Supply Voltage (V)

Figure 15A. Low Level Output Figure 15B. Low level Output vs Voltage
vs Temperature

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IR2101/IR2102 (S)

500 500
Offset Supply Leakage Current (µA)

Offset Supply Leakage Current (µA)

400 400

300 300

200 200

100 100
M ax. Max.

0 0
-5 0 -2 5 0 25 50 75 100 125 0 100 200 300 400 500 600
Temperature (°C) VB Boost Voltage (V)

Figure 16A. Offset Supply Current Figure 16B. Offset Supply Current
vs Temperature vs Voltage

1 50 150
VBS Supply Current (µA)

VBS Supply Current (µA)

1 20 120

90 90

60 60
M ax . Max .

30 30
T yp . Ty p.
0 0
-50 -25 0 25 50 75 1 00 1 25 10 12 14 16 18 20
Temperature (°C) VBS Floating Supply Voltage (V)

Figure 17A. VBS Supply Current Figure 17B. VBS Supply Current
vs Temperature vs Voltage

700 700
Vcc Supply Current (µA)

Vcc Supply Current (µA)

600 600

500 500

400 400

300 M ax. 300

M ax.
200 200

100 Typ. 100

Typ.
0 0
-5 0 -2 5 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) Vcc Supply Voltage (V)

Figure 18A. Vcc Supply Current Figure 18B. Vcc Supply Current
vs Temperature vs Voltage

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 IR2101/IR2102 (S)
30 30
Logic 1” Input Current (µA)

Logic 1” Input Current (µA)

25 25

20 20

15 15

10 10 M ax.
M ax.
5 5 Typ.
Typ.
0 0
-5 0 -2 5 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) Vcc Supply Voltage (V)

Figure 19A. Logic"1" Input Current Figure 19B. Logic"1" Input Current
vs Temperature vs Voltage

5 5
Logic "0" Input Current (uA)
Logic “0” Input Current (µA)

4 4

3 3

2 2
Max. Max.
1 1

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) VCC Supply Voltage (V)

Figure 20A. Logic "0" Input Current Figure 20B. Logic "0" Input Current
vs Temperature vs Voltage

11 11
M ax.
VCC UVLO Threshold +(V)

VCC UVLO Threshold - (V)

10 10
Max.
Typ.
9 9
M in. Typ.
8 8

7 7 Min.

6 6
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

Figure 21A. Vcc Undervoltage Threshold(+) Figure 21B. Vcc Undervoltage Threshold(-)
vs Temperature vs Temperature

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IR2101/IR2102 (S)

500 500
Output Source Current (mA)

Output Source Current (mA)

400 400

Typ.
300 300

200 200
Typ.
100 Min. 100
Min.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) VBIAS Supply Voltage (V)

Figure 22A. Output Source Current Figure 22B. Output Source Current
vs Temperature vs Voltage

7 00 70 0
6 00 60 0
Output Sink Current (mA)

Output Sink Current (mA)

5 00 T yp . 50 0
4 00 40 0
Ty p.
3 00 30 0
M in .
2 00 20 0
M in.
1 00 10 0
0 0
-50 -25 0 25 50 75 1 00 1 25 10 12 14 16 18 20
Temperature (°C) VBIAS Supply Voltage (V)

Figure 23A. Output Sink Current Figure 23B. Output Sink Current
vs Temperature vs Voltage

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 IR2101/IR2102 (S)
Case outlines

01-6014
8 Lead PDIP 01-3003 01 (MS-001AB)

INCHES MILLIMETERS
D B DIM
MIN MAX MIN MAX
A 5 FOOTPRINT A .0532 .0688 1.35 1.75
A1 .0040 .0098 0.10 0.25
8X 0.72 [.028]
b .013 .020 0.33 0.51
8 7 6 5 c .0075 .0098 0.19 0.25
6 H D .189 .1968 4.80 5.00
E E .1497 .1574 3.80 4.00
0.25 [.010] A
1 2 3 4 6.46 [.255] e .050 BASIC 1.27 BASIC
e1 .025 BASIC 0.635 BASIC
H .2284 .2440 5.80 6.20
K .0099 .0196 0.25 0.50
L .016 .050 0.40 1.27
6X e 3X 1.27 [.050] 8X 1.78 [.070] y 0° 8° 0° 8°

e1 K x 45°
A
C y

0.10 [.004]
A1 8X L 8X c
8X b
7
0.25 [.010] C A B

NOTES: 5 DIMENSION DOES NOT INC LUDE MOLD PROTRUSIONS.

1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. CONTROLLING DIMENSION: MILLIMETER
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
4. OUTLINE C ONFORMS TO JEDEC OUTLINE MS-012AA.
8 Lead SOIC
MOLD PROTRUSIONS NOT TO EXC EED 0.15 [.006].
6 DIMENSION DOES NOT INC LUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXC EED 0.25 [.010].
7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO
A SUBSTRATE.
01-6027
01-0021 11 (MS-012AA)

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
Data and specifications subject to change without notice. 4/18/2003

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