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– Review
• MOSFETs I/V operation and characteristics
summary
• 2nd order effects
• Scaling theory
• Short-channel effects
– CMOS processing technology
– Latch-Up
– Questions:
• Threshold voltage? Resistance between S
and D for On/Off? Speed?
Qdep
Vth0 = φ MS + 2φ F +
Cox
kT Nsub φF: Bulk potential
φF = ln φMS: Contact potential between poly and bulk
q ni
Nsub: Substrate carrier concentration
ni: Carrier concentration in undoped Si
Qdep = 4q ⋅ ε Si ⋅ Nsub ⋅ φ F
Qdep: Charge in depletion region
Cox: Gate-oxide capacitance per unit area
29/09/2005 EE6471 (KR) 70
CMOS/Mosfets/Mosfet IV Characteristics
• What happens if Vd is increased?
– As the drain voltage increases, the voltage drop across the oxide near the drain terminal
decreases. The induced inversion charge density near the drain decreases. As Vd increases to
the point where the potential difference across the oxide at the drain terminal is equal to Vth
the induced inversion charge density at the drain terminal is zero. For this condition the
incremental channel conductance at the drain is zero, which means that the slope of Id vs Vd
is zero (in theory…)
3
2.722
– Saturation region
0.5
0
0 1 2 3 4 5 6
0 Vds 6
2
(Vgs − Vth )Vds − 2 Vds
W 1
Id = µn ⋅ Cox ⋅
L
W
Id = µn ⋅ Cox ⋅ (Vgs − Vth)Vds
L
1 In the deep triode region mosfet can operate as a
Ron = resistor whose value is controlled by the overdrive
µn ⋅ Cox ⋅ (Vgs − Vth )
W
L voltage
µn: Mobility of electrons
L: Effective channel length
W: Channel width
2 L'
p+ n+ n+
L’: Channel length to pinch-off point
p-substrate L'
• Transconductance gm
A Mosfet in saturation produces a current in
response to its gate-source voltage
gm = µn ⋅ Cox ⋅
W
(Vgs − Vth)
L
δId
gm = gm = 2 µn ⋅ Cox ⋅
W
Id
δVgs Vds =const L
2 Id
gm =
Vgs − Vth
29/09/2005 EE6471 (KR) 73
CMOS/Mosfets/Mosfet IV Characteristics
• P-channel devices
µp = 25..50% of µn
• Mobility of holes is less than mobility of electrons. PMOS devices suffer from lower
“current drive”. Use NMOS wherever possible.
• NMOS and PMOS devices must be fabricated on the same wafer, i.e. the same
substrate. One device must be placed in a “local substrate” or “well”. Typically the
PMOS device is fabricated in an n-well. The n-well must be connected to a potential
such that the S/D junction diodes of the PMOS transistor remain reverse-biased under
all conditions. In most circuits the n-well is tied to the most positive supply voltage
using a well-tie.
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p-substrate
– Channel-Length Modulation p+ n+ n+
The length of the inverted channel gradually
decreases as the potential difference between
p-substrate L'
gate and drain increases.
2 L'
∆L
1+
1 L ∆L
L ' = L − ∆L ≈ = λ ⋅Vds
L' L L
Vgs
Id ≈ Id 0 ⋅ exp Valid for Vds>200mV
ζ ⋅Vt
ζ: nonideality factor
With typical values for ζ, at room temperature Vgs must decrease by about 80mV for Id
to decrease by one decade. Sub-threshold conduction is a serious challenge for further
lowering operating voltages of ICs.
Assume: Vcc=1V. Vth=0.32V. When Vgs is reduced from 0.32V to 0V the drain current decreases
only my a factor of 104
Source: TSMC
p-substrate
p-substrate
p-substrate
n-well
p-substrate
PR (positive)
Si3N4
SiO2
n-well
p-substrate
n-well
p-substrate
Channel-stop implant
n-well
p-substrate
n-well
p-substrate
n-well
p-substrate
TOX
n-well
p-substrate
Threshold-adjust implant
n-well
p-substrate
Poly
n-well
p-substrate
Neg. PR
n-well
p-substrate
N-type implant
n-well
p-substrate
n+ n+ n+
n-well
p-substrate
n+ n+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
Oxide spacer
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
Passivation
p+ n+ n+ p+ p+ n+
n-well
p-substrate
p+ n+ n+ p+ p+ n+
n-well
p-substrate
Nichrome several k
Mixed signal IC resistor material. Stable and laser-trimmable
ρ: Material resistivity in Ω m Polysilicon (undoped) several Meg
Rs: Sheet resistance in Ω
Example process:
0.8um CMOS + HV module.
Data source: Process Parameter
Spec
p+ n+ n+ p+ p+ n+
n-well
p-substrate
M2 M1
p+ n+ n+
Q2 p+ p+ n+
n-well
p-substrate R1
R2 Q1
29/09/2005 EE6471 (KR) 116
Vcc Vcc
CMOS/Latch-Up/Physical Origin
– Parasitic circuit redrawn R1
M2 M1
p+ n+ n+
Q2 p+ p+ n+
n-well
p-substrate R1
R2 Q1
29/09/2005 EE6471 (KR) 117
Vcc Vcc
CMOS/Latch-Up/Feedback
– Feedback loop R1
CMOS/Latch-Up/Causes
R1
– Various sources can trigger a “latch-up” Q1
• The bases of Q1 and Q2 are capacitively coupled to node Y
node X
the drains of M1 and M2. Large drain dV/dt’s can
Q2
inject significant displacement currents into the n-
well or substrate R2