Appendix 1

Calculation of Stoichiometric Weight of Curing Agent

Epoxy Equivalent Weight (EEW)
Epoxy Equivalent Weight (EEW) is a ratio of the weight of a polymer
molecule (molecular weight) to its number of epoxy groups. Since molecular weight
is a very small quantity, we express it in terms of “mole”. All substances will have
6.023 x 1023 molecules in a mole.
Weight of a polymer molecule
EEW = g / mol (1)
Number of epoxy groups in that polymer molecule
When EEW is expressed in terms of mole, it becomes,
Weight of a polymer molecule
EEW = 6.023×1023g/mol (2)
Number of epoxy groups in that polymer molecule

Similarly, Amine Hydrogen Equivalent Weight (AHEW) in terms of mole is,

Weight of a curing agent moleculepolymer molecule
AHEW = ×6.023×1023g/mol (3)
Number of hydrogen groups in that molecule
To maintain stoichiometric equivalency (proper cross-linking), the number of
moles of epoxy should be same as the number of moles of curing agent.

Calculation of stoichiometric weight of curing agent

Single epoxy resin system
Let, weight of epoxy resin = wm1 g, weight of curing agent = wcu g,
EEW of epoxy resin = EEWm1 g/mol, AHEW of curing agent = AHEWcu g/mol
To maintain stoichiometric equivalency (proper cross-linking), the number of
moles of epoxy should be same as the number of moles of curing agent.
Therefore,
Wm1 Wcu
(4)
EEWm1 AHEWcu
When WE, EEWE and AHEWC are known, the weight of curing agent required
can be calculated from the equation,
AHEWcu
Wcu= wm1 (5)
EEWm1

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 Appendix 2
Calculation of Volume fraction of nanofillers

In this analysis, four constituents are considered. Properties of these materials

are represented by subscripts: f for filler, m1 for matrix1, m2 for matrix2 and cu for
curing agent.
Let,
Vc = volume of composite, Vf = volume of filler, Vm1 = volume of matrix1, Vm2 =
volume of matrix2, Vcu = volume of curing agent, c=density of composite, f =
density of filler, m1 = density of matrix1, m2 = density of matrix2, cu = density of
curing agent, Wf = weight fraction of filler, Wm1 = weight fraction of matrix1,Wm2 =
weight fraction of matrix2, Wcu = weight fraction of curing agent, Vf = volume
fraction of filler, Vm1 = volume fraction of matrix1, Vm2 = volume fraction of matrix2
and Vcu= volume fraction of curing agent.
The volume of composite is defined as the sum of the volume of four
constituents - filler, matrix1, matrix2 and curing agent.
vc = vf + v m1 + v m2 + vcu (1)
Equation 1 can be rewritten as,
wc wf w w w
= + m1 + m2 + cu (2)
ρc ρf ρ m1 ρ m2 ρcu

Dividing equation 2 by wc,

1 wf w m1 w m2 w cu
= + + + (3)
ρ w cρf w cρ m1 w cρ m2 w cu ρcu
Now,
wf w m1
Wf = is the weight fraction of filler, Wm1 = is the weight fraction
wc wc
of matrix1.
w m2 w cu
Wm2 = is the weight fraction of matrix2 and Wcu = is the weight
wc wc
fraction of curing agent.
Therefore, the density of the composite is,
1
c = (4)
Wf Wm1 Wm 2 Wcu
f m1 m2 cu

The volume fraction of filler is defined as the ratio of volume of filler to the
volume of composite. This is represented as,
vf
Vf (5)
vc

Equation 5 can be written as,

vf wf / f
Vf (6)
vc wc / f

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 wf
Since, Wf , equation 6 becomes,
wc
c
Vf Wf (7)
f

Knowing the weight fraction of filler in the composite (Wf), density of filler
(ρf) and the density of composite (ρc) as calculated from equation 4, the volume
fraction of filler in the composite can be calculated from equation 7.

Designation of fabricated nanocomposite samples ID in the present research

work

Sample Designation Nanofiller Filler size

epoxy epoxy/0 wt.% - -
epoxy-5 wt.% SiO2 5% 21nm
epoxy-10 wt.% SiO2 10% 21nm
epoxy - SiO2
epoxy-15wt.% SiO2 15% 21nm
epoxy-20wt.% SiO2 20% 21nm
epoxy-5 wt.% Al2O3 5% 21nm
epoxy-10 wt.% Al2O3 10% 30-45nm
epoxy - Al2O3
epoxy-15wt.% Al2O3 15% 30-45nm
epoxy-20wt.% Al2O3 20% 30-45nm
epoxy-5 wt.% ZnO 5% 30-45nm
epoxy - ZnO epoxy-10 wt.% ZnO 10% 30-45nm
epoxy-15 wt.% ZnO 15% 30-45nm

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 Appendix 3
List of Acronyms

ζac ac conductivity
Ea Activation energy
ATH Alumina trihydrate
AlN Aluminium nitride
Al2O3 Aluminium oxide or alumina
ASTM American society for testing and materials
AHEW Amine hydrogen equivalent weight
NH4Cl Ammonium chloride
A Ampere(s)
Angular frequency
AFM Atomic force microscopy
BN Boron nitride
BaTiO3 Barium titanate
BST Barium strontium titanate
BTDA Benzophenonetetracarboxylic acid dianhydride
C Capacitance
CO Carbon monoxide
cm Centimeter(s)
CTE Co-efficient of thermal expansion
CTI Comparative tracking index
Conductivity
G Conductance
XLPE Cross-linked polyethylene
ρdc dc electrical resistivity
dB Decibel(s)
ρ Density
Dielectric constant
DES Dielectric strength
DSC Differential scanning calorimeter
DGEBA Diglycidylether of bisphenol A
DA Dimensional analysis
DM Direct mixing
tanδ Dissipation factor or loss tangent
DMONT Dodecyl-montmorillonite
DMA Dynamic mechanical analysis
EP Electrode polarization
EDAX Energy dispersive X-ray
EEW Epoxy equivalent weight
ESHR Epoxy silica hybrid resins

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EPR Ethylene propylene rubber
EPDM Ethylene propylene diene monomer
EVA Ethyl vinyl acetate
E-Ion1.150 Na-ionic-graft-copolymer
FEA Finite element analysis
FTIR Fourier transform infrared spectroscopy
f Frequency
FDS Frequency domain spectroscopy
FS Fumed silica
GaN Gallium nitride
GPa Giga Pascal
Tg Glass transition temperature
HDT Heat deflection temperature
Hz Hertz
HTV High temperature vulcanized
h Hours
-OH Hydroxyl groups
″ Imaginary dielectric constant
Z Impedance
IPT Inclined plane tracking
IGBT Insulated gate bipolar transistor
IVM Interface volume model
LMD Langmuir-type model for diffusion
PZT Lead zirconate titanate
LC Leakage current
LDPE Linear density polyethylene
LFD Low frequency dispersion
E" Loss modulus
MQT Macroscopic quantum tunneling
MgO Magnesium oxide
MA Maleic anhydride
MLE Maximum likelihood estimation
MPa Mega Pascal
m Meter(s)
m Micrometer(s)
mm Millimeter(s)
min Minute(s)
Mobility
MMT Montmorillonite
AEAPS N-(2-aminoethyl)3-aminopropyl-trimethoxysilane
nm Nanometer(s)
N Newton
Ω Ohm(s)

230
OTMS Octyltrimethoxysilane
SPN Oligo(oxypropylene) diethyl methyl ammonium chloride
oMMT Organomodified montmorillonite
OMLS Organically modified layered silicate
o-Ps Ortho-positronium
PD Partial discharge
phr Parts per hundred gram
ε0 Permittivity of vacuum
Phase angle
PA Polyamide resin
PLA Polyactide
PBT Poly butylene terephthalate
PE Polyethylene
PMMA Poly methyl methacrylate
PP Polypropylene
PS Polystyrene
PALS Positron annihilation lifetime spectrometer
PDC Polarization and depolarization current
PC Polycarbonate
PDMS Polydimethylsiloxane
PET Polyethylene terephthalate
PEO Poly (ethylene oxide)
PVDF Poly vinylidene fluoride
PVA Poly vinyl alcohol
PVP Poly (vinyl pyrrolidone)
PTFE Poly tetra fluoro ethylene
KBr Potassium bromide
PMDA Pyromelliticdianhydride
o Pre-exponential factor
QDC Quasi - direct conduction
RF Radio frequency
' Real dielectric constant
Relaxation time
RH Relative humidity
rpm Revolutions per minute
RTV Room temperature vulcanized
η Scale parameter
s Second(s)
S Siemens
SEM Scanning electron microscopy
Shape parameter
Si-OH Silanol groups

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SiO2 Silicon dioxide or silica
SiC Silicon carbide
SiR Silicone rubber
Ks Specific wear rate
E´ Storage modulus
s Surface conductivity
Shore D Surface hardness
s Surface resistivity
T Temperature
Thermal conductivity
TGA Thermal gravimetric analysis
TMA Thermal mechanical analysis
TSC Thermally stimulated current
TiO2 Titanium dioxide
TI Tracking index
TR Tracking resistance
TEM Transmission electron microscope
TETA Tri-ethylene-tetra-amine
UTM Universal testing machine
USB Universal serial bus
VMT Vermiculite
V Volts
ζV Volume conductivity
Vf Volume fraction
ρV Volume resistivity
Wf Weight fraction
H2O Water
WAXD Wide-angle-x-ray diffractometer
XRD X-ray diffraction
ZnO Zinc oxide

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 Appendix 4
Research publications

International journals/ National journal/ International conferences/

National conferences

1. M.G. Veena, N.M. Renukappa, J.M. Raj, C. Ranganathaiah, K.N. Shivakumar,

“Characterization of Nano-Silica Filled Epoxy composites for Electrical and
Insulating Applications”, Journal of Applied Polymer Science, Vol.21(5),
pp.2752-2760, 2011.
2. M.G. Veena, N.M. Renukappa, B. Suresha, K.N. Shivakumar, “Tribological
and Electrical Properties of Silica-Filled Epoxy Nanocomposites”, Polymer
Composites, Vol.32 (12), pp. 2038-2050, 2011.
3. M.G. Veena, Kunigal N. Shivakumar, N.M. Renukappa, B. Suresha,
“Influence of SiO2 content in epoxy-SiO2 nanocomposites on mechanical and
electrical resistivity behavior”, American Institute of Physics, Conference
Proceedings, Vol.1276, pp.219-226, 2010.
4. M.G. Veena, N.M. Renukappa, S. Seetharamu, P. Sampathkumaran, “Effect of
nanofiller at low frequency behavior of dielectric insulator”, IEEE
Proceedings (ICPADM), pp. 745-748, 2009.
5. M.G. Veena, N.M. Renukappa, Siddaramaiah, R.D. Sudhakersamuel,
“Electrical conducting behavior of hybrid nanocomposites containing
polyaniline, carbon nanotube and carbon black”, SPIE Proceedings, Vol.7267,
pp. 1-6, 2008.
6. M.G. Veena, N.M. Renukappa, P. B. Chethan, C. Ranganathaiah, “Evaluation
of Dielectric Properties of epoxy nanocomposites by NDT Approach”, Journal
of material science: materials in electronics (submitted), 2012.
7. M.G. Veena, N.M. Renukappa, P. B. Chethan, Siddaramaiah, K.N.
Shivakumar, “Effect of seawater ageing on dielectric properties of epoxy
nanocomposites”, Journal of materials and design., (submitted), 2012.
8. M.G. Veena, N.M. Renukappa, K.N. Shivakumar, S. Seetharamu, “Study of
interface behavior on dielectric properties of epoxy-silica nanocomposites”,
IEEE Proceedings (ICPADM), pp. 72-76, 2012.
9. N.M. Renukappa, M.G. Veena, Kunigal N. Shivakumar , B. Suresha, J.
Sundara Rajan, “Effect of addition of Nanopox F400 filler on Thermo-
mechanical Properties of Epoxy Nanocomposites” IEEE International
Conference on Solid Dielectrics, Bologna, Italy, July 1-4, 2013 (Accepted).
10. M.G. Veena, N.M. Renukappa, P.B. Chethan, Rashmi, “Effect of seawater
absorption on surface degradation of epoxy-alumina nanodielectrics for
outdoor insulation applications” International Conference on Recent Advances
in Materials Processing Technology, 2013.
11. M.G. Veena, N.M. Renukappa, J. Sundara Rajan, “Effect of Filler on Arc,
Tracking Resistance and Dielectric Strength of Epoxy-Silica

233
 Nanocomposites”, Second International Conference on Materials for the
Future, 2011.
12. M.G. Veena, N.M. Renukappa, K.N. Shivakumar, S. Seetharamu, “Dielectric
properties of nanosilica filled epoxy nanocomposites”, International
Conference on Composites in Future Trends, pp. 65, 2011.
13. M.G. Veena, N.M. Renukappa, Kunigal N. Shivakumar, “Study of Thermal
and Dynamic Mechanical properties of Nanopox F400/SC79 epoxy
composites”, International Conference on Advanced Materials,
Manufacturing, Management, and Thermal Sciences, 2010.
14. M.G. Veena, Kunigal N. Shivakumar, N.M. Renukappa, Gowthaman
Swaminathan, “Dielectric properties and Breakdown strength of uniformly
dispersed Nanosilica/Epoxy nanocomposites”, International Conference on
Electro ceramics, pp. 347, 2009.
15. M.G. Veena, B. Suresha , R.M. Devarajaiah, Kunigal N. Shivakumar “Effect
of silica sand and quartz abrasives on three-body abrasive wear behavior of
SiO2 filled epoxy nanocomposites”, International symposium on National
Metallurgist Day - Annual Technical Meeting, 2009.
16. M.G. Veena, N.M. Renukappa, Siddaramaiah “Studies on impedance and
susceptance behavior of insulator-conductor composites”, International
Conference on Recent Advances in Materials, Processing and Technology, pp.
184-188, 2009.
17. M.G. Veena, N.M. Renukappa, Kunigal N. Shivakumar, S. Seetharamu,
“Dielectric properties of nanosilica filled epoxy nanocomposites”, Indian
Academy of Sciences, (Under review), 2012.
18. M.G. Veena, N.M. Renukappa, “Impedance and dielectric Strength of Silica
Filled Epoxy Nanocomposites for Electrical Insulation”, 5th National
Conference on Plastic and Rubber Technology, 2011.
19. M.G. Veena, N.M. Renukappa, “Impedance Property and Morphology of
Silica Filled Epoxy Nanocomposites”, Workshop and National Conference on
Monte Carlo Simulation, at School of Physics, 2010.
20. M.G. Veena, N.M. Renukappa, “An effect of resistivity behavior on epoxy-
SiO2 nanocomposites”, National Conference on NANO-CRYSTAL-2009, pp.
82, 2009.

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