Service Manual

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 Contents

1. OUTLINE..................................................................................................................3

1.1. Mobile Introduction..................................................................................................................................3

1.2. Motherboard Components Distribution.................................................................................................5

2. SIGNAL FLOW AND FAULT ANALYSIS..............................................................5

2.1. RF Part.......................................................................................................................................................5
2.1.1. Block Diagram of the RF Section.......................................................................................................5
2.1.2. Signal flow of the RF Transmitting Part.............................................................................................6
2.1.2.1. Transmitting Path...............................................................................................................................6
2.1.2. Signal Flow of the RF Receiving Part................................................................................................7
2.1.3.1. Receiving Path Components...........................................................................................................7

2.2. Baseband part..........................................................................................................................................10

2.2.1 Block diagram of the Baseband part.....................................................................................................10
2.2.2 Power Management...............................................................................................................................11
2.2.3 Audio Section........................................................................................................................................12
2.2.3.1 Audio Codec Circuit.....................................................................................................................12
2.2.3.2 MIC& Receiver Loop...................................................................................................................13
2.2.3.3 Headset Loop................................................................................................................................13
2.2.4 Baseband Fault issues...........................................................................................................................14
2.2.4.1 Analysis of the keyboard fault......................................................................................................15
2.2.4.2 Analysis of Display module circuit..............................................................................................15
2.2.4.3 FM Module...................................................................................................................................16
2.2.4.4 Camera Module............................................................................................................................16
2.2.4.5 IO Interface...................................................................................................................................17
2.2.4.6 SIM Card Circuit..........................................................................................................................17
2.2.4.7 BT/WIFI/GPS Circuit...................................................................................................................18
2.2.4.8 Accerometer-sensor Circuit.........................................................................................................18
2.2.4.9 M-sensor Circuit.......................................................................................................................18
2.2.4.10 Gyroscope Circuit....................................................................................................................19

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 1. Outline

1.1. Mobile Introduction

Product Hardware Definition

BB MT6795W/L
PMIC MT6331P/A、MT6332P/B
Transceiver MT6169V/A
Camera DSP/MMP NA
RFPA SKY77621-11、SKY77814-11
FM NA
Base Chip Set
BT MT6630QP
Audio
TFA9887UK/N2
CODEC&PA
SAMSUNG，KLMCG8WEBD-
Memory
B031、SAMSUNG，K3QF6F60MM-FGCF
TP IC Synaptics，S3718AR
LCD SAMSUNG，5.96"
Backlight driver TI，TPS65633BK
Peripheral
CAMERA 24.0MP AF rear + 8.0MP AF camera
Configuration
Memory card YES
Antenna IFA
Leakage current ≤ 120uA
Standby current ≤ 7mA
Call current as
TBD
maximum power
GSM 32.5dbm
Basic Board-level power
DCS 29.5dbm
Performance
Board-level receiver GSM -109dbm
Indicators
sensitivity DCS -109dbm
GSM 27dbm
TRP
DCS 25dbm
GSM -103.5dbm
TIS
DCS -105dbm

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 CAMERA SKY77621-11 、
SKY77814-11

FM 、BT 、
WiFi 、GP MT6169V/A

S
CPU
LCD&CTP MT6795W/L
TFA9887UK
/N2 SPK

HP

KEYPAD REC

MIC

Dual SIM
CARD
MEMORY

PMIC
MT6331P/A 、MT6332P/B

BATTRY

System Block Diagram

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1.2. Motherboard Components Distribution

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 2. Signal Flow and Fault Analysis

2.1. RF Part

2.1.1. Block Diagram of the RF Section

RF Block Diagram

GGG
CPU
PA &
A
Ant Switch MT6795W
N
SKY77621-11 、SKY77814-11 /L
T
SKY13418-485LF 、 SKY13492- Transceiver
21 、SONY ， CXA2946GC 、SON MT6169V/A
Y ， CXA4403GC

2.1.2.Signal flow of the RF Transmitting Part

2.1.2.1. Transmitting Path

WCDMA&FDD

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Maintenance Flow Chart of the Transmitting Issue:

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 （ NO launch ） Connect the PC and the phone with maintenance line,
then making the phone into the RF state with META software

N
Check Transceiver to Check CPU
see if IQ signals exist.
`

Check the PA output to

see if there is RF signal N
in the path.

Check the
Transceiver to see if
Y Y there is RF signal
output.

VBAT,PA_EN,BA N
NDSW_DCS,VAP N
C 是否 OK?
Y
N

Check Transceiver if
LE 、SCLK/SDAT 、RF
VCOEN 、VCXOEN
N have the correct signal.

Replace PA
Check RF coaxial
switch or matching
network. Y
Check CPU
Replace Transceiver

2.1.2. Signal Flow of the RF Receiving Part

2.1.3.1. Receiving Path Components

Receiving path is shown in the following figure:

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Maintenance flow chart of the receiving Issues：

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 No receiving

Start the META software to connect the PC and the phone ， making the phone into the
receiving state. Signal generator is also adjusted to the correspond CH. And signal lines
connected to the phone.
的同轴开关上。
Y
Check Transceiver has
CPU IQ?
N
Y
Transceiver has N
received signal?
号？

Transceiver N PA has
SDATA 、SCLK 、LE received
、CXOEN are signal?
correct ?
N
Check to see if there has
signal in the matching
Y circuit between PA and Y
Check ANT
CPU
Whether the Check to see if there
voltage of the has signal in the
transceiver is matching circuit
normal? between PA and
N Whether transceiver
26MHZ is
Check the normal?
corresponding 正常？Y
power supply and
26MHZ resulting
circuit Replace transceiver

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2.2. Baseband part

2.2.1 Block diagram of the Baseband part

CAMERA SKY77621-11 、
SKY77814-11

FM 、BT 、
WiFi 、GP MT6169V/A

S
CPU
LCD&CTP MT6795W/L TFA9887UK
/N2 SPK

HP

KEYPAD REC

MIC

Dual SIM
CARD
MEMORY

PMIC
MT6331P/A 、MT6332P/B

BATTRY

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2.2.2 Power Management

The power management module is PMU IC：MT6331P/A、MT6332P/B.

2.2.2.1 Mobile power supply system

DC-DC:

LDO:

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2.2.3 Audio Section

2.2.3.1 Audio Codec Circuit

This phone applies TFA9887AUK which is a class D audio amplifier with a sophisticated speaker
boost and protection algorithm to drive speaker. Block diagram of the audio system is as below:

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2.2.3.2 MIC& Receiver Loop
MIC Audio path is shown below ： MIC must have a bias voltage in order to operate normally——
2.8±0.1V. When MIC is in good condition but loop MIC has no echo, then you need to check the basic
bias voltage signal of the MICBIASP and MICBIASSP, the language signals of the RECEIVER and MIC
also need to be checked.

MIC1 FPC

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Receiver loop is simple. The output of BB drive Receiver directly through Filter and ESD protected
network, as shown below:

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2.2.3.3 Headset Loop

Headset loop includes two signals: Headset speaker and MIC ， If the headset fitting were in good

condition, when the headset plug in, it appears abnormal, such as: The Headset speaker has no sound 、the

MIC is invalid. All this need to check the access conditions of the circuit above.

FPC

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2.2.4 Baseband Fault issues

Maintenance process of the download failure Issues:

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 Download Fail

Exclude the reason of Yes Check to see if it is caused by other

download failure factors such as: configuration, download
caused by other factors cable, power supply, software and PC

NO

Check if the system NO Check to see if the serial ports between

connector is poor pc and cell phone is smooth
soldered or damaged.

NO Yes Quickly disconnect the

connection, and gently
Check the resistance, Connect the download cable then touch the chip to see if it is
capacitance and the observe the Ammeter to see if it Yes hot. If not, then focus point
EDC devices between shows high current （ The normal using the multi-meter to
the system connector current generally about 30mA ） measure the short circuit.
and the CPU.

Little or no current Current normal but download fail

Check the power manager and open the Check

LDO to see if the voltage supply is VCORE 、VDRAM 、DVFS 、VIO18 、VIO2
normal and whether there is power 8 、 VTCXO 、 VRTC 、 Measure the clock
supply circuit open. signal of 26MHZ 、32KHZ.

Check CPU and MCP to see if they are OK

and the LDO is normal.

2.2.4.1 Analysis of the keyboard fault

This handset has 3 side keys. All the keyboard circuits use the scanning method to detect
except the power button .When a button is pressed the scanning signal will be triggered, then
the corresponding row and column will be detected. The function of the key can be identified
according to software definition.

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 a. The cell phone can power on ，but all the keys are invalid.
In general, this situation is caused by some key short-circuit, the equivalent of a
long pressing this button.
At this point ,you should analyze the following first：
⑴ Check the connector external exclusion and varistor to see if they are short-
circuit.
⑵ Then ,check the connector to see whether it is short-circuit when it is welded.
b. Failure of a single button
This situation needs to check whether the beneath of the DOME key is dirty. If the
problem still exists, you have to check whether the circuit is open.
c. Failure of a few buttons
This situation is usually caused by a short-circuit row or column. Checking the
interface circuit to see if it has open weld phenomena and detect the
disconnected phenomena of the resistance.

2.2.4.2 Analysis of Display module circuit

Display module use the 5.20"AMOLED LCD.

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2.2.4.3 FM Module N/A

2.2.4.4 Camera Module

This module uses the 8 million pixel front camera and 24 million pixel rear camera,
connecting to baseband chip through connector. The welding of the connector is the main
reason for the camera malfunction.

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Camera Interface Circuit:

Power supply circuit : VCAM_IO_PMU for camera I/O port, VCAMD_PMU provide1.8 V
for camera core, VCAM_AVDD for analog power ， VCAM_AF_PMU for motor
driver，VGP3_PMU provide1.2 V for camera core.

2.2.4.5 IO Interface
IO applies 5pin standard interface ， which realize the functions of USB, charging and

download.

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2.2.4.6 SIM Card Circuit
Switch of dual SIM cards is integrated into baseband.

SIM Card Tray

2.2.4.7 BT/WIFI/GPS Circuit

BT/WiFi/GPS are integrated into MT6630QP

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2.2.4.8 Accerometer -sensor Circuit

2.2.4.9 M-sensor Circuit

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2.2.4.10 Gyroscope Circuit

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