EUPRAXIA ’09

Welcome Click to edit Master text styles

Second level
to the PCB ● Third level

● Fourth level

● Fifth level

workshop
 SYNOPSIS

PCB cleaning
Ironing layout
Marking
Etching
Drilling
Tinning
Components-placing
Soldering
 PCB CLEANING

The PCB is wiped with a Click to edit Master text styles

soft cloth and then Second level
scrubbed using sandpaper ● Third level
to remove the dust ● Fourth level
particles.
● Fifth level

Rinse the PCB and scrub

once more.
This abrasion will yield a
chemically and
mechanically activated
surface that is ready for
subsequent processing.
 IRONING THE LAYOUT

The printout of the

layout is obtained from Click to edit Master text styles
the EAGLE board file. Second level
Third level
●

Fourth level
The sheet is aligned
●

● Fifth level

with the PCB and is

ironed with uniform
pressure for about 10-
15minutes.
 LAYOUT AFTER THE
IRONING
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Second level
● Third level
 After ironing, the ● Fourth level

paper is carefully ● Fifth level

removed.
 The PCB looks like
the image shown.
 Do’s and Don’t’s

Do’s : Don’t’s:
 The PCB should be
Do not apply
moderately moist excessive pressure
before ironing: this while ironing: it
ensures that the might damage the
toner particles copper coating over
adhere to the PCB. the PCB.
 The Iron box should
Handle the PCB with
be set at moderate
care: copper is
heat.
metal, and ironing
makes it HOT- you
 Do’s and Dont’s …

Do’s…. Don’t’s:
Apply uniform pressure Take care to avoid any
over the entire area. Misalignment of the
paper, else the Layout
If any part of the track
will get smudged.
is not clearly
impinged, use a
permanent marker to
complete the track.
 ETCHING
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A small hole is drilled Second level
at one corner of the ● Third level

PCB. A wire is ● Fourth level

● Fifth level
inserted and the PCB
is lowered into a
trough containing the
Etching solution.
The PCB is shaken
vigorously
 ETCHING…
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After a while, the Second level
copper begins to ● Third level

dissolve into the ● Fourth level

solution. ● Fifth level

The time for etching

depends on the
concentration of
etching solution.
When etching is
complete, the PCB
looks as shown.
 CAUTION !!

Do not leave the PCB in the etching solution

for too long: the circuit track might begin to
dissolve causing discontinuities in the
circuit.
 DRILLING

The through-holes for

various circuit
components are Click to edit Master text styles
drilled using the Second level
● Third level
hand-driller or the ● Fourth level
rotary machine. ● Fifth level

(Hand drillers are

much more
economical and
easily available.)
 DRILLING ….
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Drill-bits of various Second level
diameters are used ● Third level

to drill holes for ● Fourth level

● Fifth level
various circuit
components.
A few are mentioned:
Ø Resistors:0.6-0.8
mm
Ø Capacitors: 0.6
mm
Ø Diodes: 1.2 mm
 TINNING

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Second level
The track on the PCB ● Third level

is greased ● Fourth level

completely with flux. ● Fifth level

The track is tinned

using the soldering
rod as shown.
lick to edit Master text styles
econd level
● Third level
WHY TINNING ?
● Fourth level

● Fifth level

 Although the copper track on the PCB is

sufficient to conduct electricity, copper is
prone to oxidation on exposure to air,
which reduces its conductivity with time.
 Hence, tinning is essential in order to
maintain conductivity of the track.
 CAUTION

Extra care should be taken while tinning thin

and closely spaced tracks, so as to avoid any
short-circuiting by mistake.
It is advised that tinning is not done near the
component-through-holes: the soldering of
the component leads (later) will suffice.
(If you tin the through-holes, you are liable
to blocking the holes.)
 COMPONENTS-PLACING

A printout of the mirror-

image of the circuit is Click to edit Master text styles
obtained from the EAGLE Second level
file. ● Third level

● Fourth level
Based on this circuit, ● Fifth level
components are
positioned on the PCB.
The Leads of the
components should
emerge on the side
where tinning has been
done.
 SOLDERING

After the components have Click to edit Master text styles

been inserted in their
respective positions, turn the Second level
PCB over, and the leads of ● Third level

the components are soldered. ● Fourth level

While soldering ICs, a very ● Fifth level

small quantity of the solder is

melted onto the soldering rod
and is then targeted at the
lead from a distance: this
ensures that the quantity and
time of heat transfer to the
leads (and hence to the IC) is
minimal: thereby minimizes
the risk of damaging of the IC
due to undesirable heat.
THANK YOU