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Window 8 capacitor touch chip GT9113

GT9113
GT9113


Window 8 capacitor touch chip
Rev.04 2013-12-30
Rev.04—2013-12-30


====== Disclaimer======
Application information and similar contents concerning the device in this publication are only intended for you
and they may be substituted by updated information. It is your responsibility to ensure its application complies
with technical specifications. GOODIX makes no representation or guarantee for this information, either express
or implied, written or verbal, statutory or in any other manner, including but not limited to representation or
guarantee for their application status, quality, performance or suitability for special purpose. GOODIX shall
assume no responsibility for this information and relevant subsequences arising from use of such information.
Without written approval GOODIX, it is prohibited to use GOODIX product as critical parts in any life support
system. With GOODIX intellectual property protection, it is prohibited to transfer any license in any disguised
manner or any other manner.

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Window 8 capacitor touch chip GT9113

Contents
1. Overview.............................................................................................................................................. 3
2. Product features.................................................................................................................................... 3
3. System chart......................................................................................................................................... 4
4. Pin definition........................................................................................................................................ 5
4.1. GT9113 pin definition................................................................................................................5
4.2. GTM802 pin definition.............................................................................................................. 6
5. Sensor design........................................................................................................................................8
5.1. Sensing channel layout.............................................................................................................. 8
5.2. Driving channel layout...............................................................................................................8


5.3. Parameter requirements for sensor design................................................................................. 8
5.4. Touch-screen Homekey design.................................................................................................. 9
6. I2C&USB communication................................................................................................................. 10
6.1. I2C communication.................................................................................................................. 10
6.2. USB communication................................................................................................................ 12
6.3. GT9113 register information....................................................................................................16
a) Real-time command..............................................................................................................16

b) Configuration information....................................................................................................16
7. Function description........................................................................................................................... 21
7.1. I2C working mode.................................................................................................................... 21
a) Normal Mode........................................................................................................................21
b) Green Mode.......................................................................................................................... 21
c) Sleep Mode...........................................................................................................................21
7.2. USB working mode..................................................................................................................22
a) Normal Mode........................................................................................................................ 22

b) Green Mode...........................................................................................................................22
c) Sleep Mode............................................................................................................................22
7.3. Interrupted trigger mode.......................................................................................................... 22
7.4. Solidifying configuration function...........................................................................................22
7.5. Automatic calibration...............................................................................................................23
a) Initial calibration.................................................................................................................. 23
b) Automatic thermal drift compensation.................................................................................23

8. Reference circuit diagram...................................................................................................................24


9. Electrical characteristics.....................................................................................................................26
9.1. Extreme electrical parameter................................................................................................... 26
9.2. Recommended working conditions..........................................................................................26
9.3. AC characteristics.................................................................................................................... 26
9.4. DC characteristics.................................................................................................................... 27
10. Product packaging....................................................................................................................... 28
10.1. GT9113 packaging............................................................................................................... 28
10.2. GTM802 Packaging..............................................................................................................29
11. Revision Record.......................................................................................................................... 30
12. Contact Information.....................................................................................................................31

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Window 8 capacitor touch chip GT9113

1. Overview
As a new generation 10-point capacitive touch solution designed for WIN8 tablets, GT9113 consists of
up to 42 Driving channels and 30 Sensing channels to ensure high-precision touch for tablets.
GT9113 can simultaneously identify the real-time accurate location, motion locus and touch area of 10
touch points, and read touch information for relevant points based on MCU requirements.

2. Product features


� Built-in apacitance detection circuit and high-performance MCU
� Touch scanning frequency: >100Hz
� Real-time output of touch point coordinates
� Unified software version, applicable to capacitive screens of multiple sizes
� Flash process, supports online burning
� Capacitive screen sensor: 专
� Test channel: 42(Driving channel)*30(Sensing channel)
� Range of sizes for capacitive screen: <=10.1"
� Support Win8 Standard Homekey design
� Support both ITO glass and ITO film
� Cover Lens thickness support: 0.7mm≦Glass≦2mm /0.5mm≦Acrylic≦1.2mm
� Built-in frequency hopping function, support OGS full bonding
� Environmental adaptability

� Initializing automatic calibration
� Automatic thermal drift compensation
� Operating temperature: -40℃~+85℃; humidity: ≦95%RH
� Storage temperature: -55℃~+125℃; humidity: ≦95%RH
� Communication interface
� Standard USB, 2.0 Fullspeed communication interface

� Standard I2C communication interface


� Slave unit working mode
� I2C support 2.8 ~3.3V interface level
� Response time
� Green mode: <48ms
� Sleep mode: <200ms
� Initialization: <200ms
� Power voltage:

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Window 8 capacitor touch chip GT9113
� Single power supply:
a) I2C solution: 2.8V ~3.3V
b) USB solution: 5V
� Power ripple:
� Vpp≦50mV
� Packaging: GT9113:88 pins, 10mm*10mm QFN
GTM802:32 pins, 5mm*5mm QFN
� Application development support tool


� Touch screen module parameter detection and automatic configuration parameter
generation
� Overall performance test tool for touch screen module
� Modular production test tool
� Reference drive code and documentary guide for main control software development

3. System chart 专
ICE burning &
adjustment port

I C E _C K I C E _D A T

D+

USB I2C D riving




D- communication channels
Host SCL GTM802 G T 9113
I2C S ensing

channels
SDA

X0 X1

1 2 MHz

G T 9113 hardware system chart

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Window 8 capacitor touch chip GT9113

4. Pin definition
4.1. GT9113 pin definition

DRV10
DRV11
DRV12
AGND

DRV9
DRV0
DRV1
DRV2
DRV3
DRV4
DRV5
DRV6
DRV7
DRV8
SEN7
SEN6
SEN5
SEN4
SEN3
SEN2
SEN1
SEN0
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
SEN 8 1 66 DRV 1 3
SEN 9 2 65 DRV 1 4


SEN 1 0 3 64 DRV 1 5
SEN 1 1 4 63 DRV 1 6
SEN 1 2 5 62 DRV 1 7
SEN 1 3 6 61 DRV 1 8
SEN 1 4 7 60 DRV 1 9
SEN 1 5 8 59 DRV 2 0
SEN 1 6 9 G T9113 58 DRV 2 1
SEN 1 7 10 57 DRV 2 2
Q F N 1 0 ×1 0 _8 8 L_0.4P
SEN 1 8
SEN 1 9
SEN 2 0
SEN 2 1
SEN 2 2
11
12
13
14
15
专 D4 2 × S 3 0
E P -G N D
56
55
54
53
52
DRV 2 3
DRV 2 4
DRV 2 5
DRV 2 6
DRV 2 7
SEN 2 3 16 51 DRV 2 8
SEN 2 4 17 50 DRV 2 9
SEN 2 5 18 49 DRV 3 0

SEN 2 6 19 48 DRV 3 1
SEN 2 7 20 47 DRV 3 2
SEN 2 8 21 46 DRV 3 3
SEN 2 9 22 45 DRV 3 4
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Wake
/ARM_RST

/RSTB
NC
SYNC
DGND
AVDD28
AVDD18
DVDD12

Sensor_OPT1
Sensor_OPT2

DRV41
DRV40
DRV39
DRV38
DRV37
DRV36
DRV35
VDDIO
I2C_SDA
I2C_SCL
CLK_ADJ

Pin No. Name Function description Remarks


1~22 SENS8~SENS29 Touch analog signal input
23 AVDD28 Analog power positive To 2.2uF filter capacitor
24 AVDD18 To 2.2uF filter capacitor
25 DVDD12 To 2.2uF filter capacitor
26 DGND Digital signal ground
GT9113 clock calibration
27 CLK_ADJ
pin
28 Sensor_OPT1 Module ID port

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Window 8 capacitor touch chip GT9113
Module ID port
29 Sensor_OPT2 External pull down required
(Optional)
GTM802 communication
30 I2C_SDA I2C data signal interface
GTM802 communication
31 I2C_SCL I2C clock signal interface
32 NC NC
GT9113 interrupted signal
33 SYNC
output pin
To 2.2uF filter capacitor
34 VDDIO GPIO level control Suspend: 1.8V
Connect AVDD: AVDD
35 /ARM_RST ARM Reset control pin


36 Wake Wake GT9113 control pin
External 10K pull up required,
37 /RSTB GT9113 reset pin lower down to reset
38~79 DRV41~DRV0 Drive signal output
Analog power supply
80 AGND
ground
81~88 SEN0~SEN7 Touch analog signal input

4.2. GTM802 pin definition


专 GT_Wake
XT1_OUT
/RESET
XT1_IN

AVDD
GND

INT
NC
32
31
30
29
28
27
26
25

S YN C 1 24 IC E _C K

SCL 2 23 IC E _D A T
SDA 3 22 G TC K _A D J
G TM 802
NC 4 21 I2C1_S C L
NC 5
Q F N 5×5_3 2 L_0.5P 20 I2C1_S D A
LDO 6 E P -G N D 19 NC
VDD 7 18 NC
GN D 8 17 NC

10
11
12
13
14
15
16
9

D+

Boot
OPT
/GT_RST
D-

NC
VDD33
VBUS

Pin No. Name Function description Remarks


1 SYNC GTM802 interrupted wake GT9113 uses the pin to wake
pin GTM802
2 SCL I2C clock signal I2C scheme master control
communication interface
3 SDA I2Cdata signal I2C scheme master control
communication interface
4 NC NC

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Window 8 capacitor touch chip GT9113
5 NC NC
6 LDO Built-in LDO output Filter capacitor grounding
required
7 VDD Digital power supply Filter capacitor grounding
required
8 GND Ground
9 VBUS From USB Host or USB
HUB power supply

10 VDD33 Built-in LDO decoupling Filter capacitor grounding


capacitor connecting pin required

11 D- USB communication USB scheme master control


interface interface


12 D+ USB communication USB scheme master control
interface interface
13 NC NC
USB scheme: Suspend; I2C
14 OPT USB, I2C scheme selection scheme: Short connection
grounding
15 /GT_RST Control GTM9113 reset pin
16 Boot Upgrading port, internal pull Test bonding pad reserved
up
17
18
19
20
NC
NC
NC
I2C1_SDA
专 NC
NC
NC
GT9113 I2C communication
data port
21 I2C1_SCL GT9113 I2C clock data port

22 GTCK_ADJ GT9113 I2C address select


pin

23 ICE_DAT Burning port Test bonding pad reserved
24 ICE_CK Burning port Test bonding pad reserved
25 AVDD Analog circuit power supply Filter capacitor grounding
required
26 INT Interrupted output Master control
communication interface
27 GT_Wake Wake GT9113 output port
28 NC NC

29 XT1_OUT Crystal oscillator output pin


30 XT1_IN Crystal oscillator input pin
31 /RESET Reset External pull up required,
valid when low
32 GND Grounding

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Window 8 capacitor touch chip GT9113

5. Sensor design
5.1. Sensing channel layout

SENS0~SENS29 represents 30 capacitance detection input channels directly connected with the 30
sensing ITO channels of the touch screen module. The ITO channels on the module are connected with
SENS0 to SENS29 on the chip in sequence or reversed sequence. When there are fewer ITO channels
than test channels on the chip, please use “Channel selector” to select channels.
� Layout example: Sensing ITO channels connected with SENS0 to SENS29 on the chip



5.2. Driving channel layout

DRV0~DRV41 represents 42 drive signal output channels for capacitance detection directly connected

with 42 ITO drive channels of the touch screen module. When there are fewer ITO drive channels than
drive channels on the chip, please use “Channel selector” to select channels. After deciding layout mode,
it is required to provide relevant register with GT9113 chips to ensure the logical position relation of
drive channels is consistent with their physical position relation and make output coordinates match
physical coordinates.
For more information about sensor design, please refer to specific layout guide.

5.3. Parameter requirements for sensor design


DITO

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Window 8 capacitor touch chip GT9113
GT9113
Drive channel wiring impedance ≦3KΩ
Drive channel impedance ≦10KΩ
Sensing channel wiring impedance ≦10KΩ
Sensing channel impedance ≦40KΩ
Node capacitor ≦4pF
SITO
GT9113
Drive channel wiring impedance ≦3KΩ
Drive channel impedance ≦10KΩ
Sensing channel wiring impedance ≦10KΩ


Sensing channel impedance ≦10KΩ
Node capacitor ≦4pF

1. For specific Sensor Design, please refer to Goodix “Sensor Design Specifications”.
2. When metal wire is used for channel wiring, wire may become oxidated and impedance tends to

become greater due to such factors as process control, thus leading to difference between
different channels in wiring. When using ITO material for wire, though efforts can be made in
design to ensure consistency in channel wiring through length and width matching, yet diference
still exists to some extent. To ensure data consistency and uniformality for the entire screen, it is
required to ensure wiring impedance complies with the above requirements.
3. When driver wiring and sensor wiring are adjacent and parallel to each other, grounding should
be provided in between, and grounding width should be at least twice the width of channel

wiring or no less than 0.2mm. To provide better touch effect, it is recommended to provide
wiring on both sides.

5.4. Touch-screen Homekey design

GT9113 supports Win8 standard Homekey and Homekey functions consist of 4-5 touch keys which
are accomplished as shown below:

Sensor extension mode: Drive channel serves as common port for touch keys where one drive channel
are connected with 4-5 sensing channels to form 4-5 keys. Drive channels used as keys cannot be used
in duplex on screen but sensing channels used as keys must be used in duplex on screen;
See Goodix “Win8_Homekey Graphic Design Specification” for specific rules for Homekey design.

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Window 8 capacitor touch chip GT9113

6. I2C&USB communication
6.1. I2C communication

GT9113 provides standard I2C HID communication interface for SCL and SDA to communicate with
CPU. GT9113 invariably serves as slave unit and all communication is initiated by master CPU. It is
recommended to adopt 400Kbps or lower communication speed. Its supported I2C hardware circuit
supports the following sequence:


SD A

tf th d 1 th d 2 ts t2 ts t 1 ts t 3 tr tb u f

SCL

tf tl o tr th i tr tr

Test condition 1: 1.8V communication interface, 400K bps communication speed, pull-up
400Kbps
resistor 2K
Parameter
SCL low period
SCL high period
SCL setup time for START condition
Symbol
tlo
thi
tst1
专 Min.
1.3
0.6
0.6
Max.
-
-
-
Unit
us
us
us
SCL setup time for STOP condition tst3 0.6 - us
SCL hold time for START condition thd1 0.6 - us
SDA setup time tst2 0.1 - us

SDA hold time thd2 0 - us
Test condition 2: 3.3V communication interface, 400K bps communication speed, pull-up
400Kbps
resistor 2K
Parameter Symbol Min. Max. Unit
SCL low period tlo 1.3 - us
SCL high period thi 0.6 - us
SCL setup time for START condition tst1 0.6 - us

SCL setup time for STOP condition tst3 0.6 - us


SCL hold time for START condition thd1 0.6 - us
SDA setup time tst2 0.1 - us
SDA hold time thd2 0 - us
GT9157 I2C slave unit address includes two groups: 0xBA/0xBB and 0x28/0x29.

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Window 8 capacitor touch chip GT9113

a) Data transmission
(0xBA/0xBB as device address)
Communication is always initiated by master CPU and effective start signal is: When SCL remains “1”,
hopping from “1” to “0” occurs on SDA. Address information or data flow is transmitted after start
signal.
All slave devices connected on I2C bus have to test 8-bit address information sent on test bus after start
signal and launch correct response. When receiving compatible address information, GT9113 changes
SDA as output port at the 9th clock cycle and resets to “0” as ACK signal. If address information
received is incompatible, i.e., it is neither 0XBA nor 0XBB, GT9113 will maintain idle status.


Data on SDA port sends 9-bit data in series based on 9 clock cycles: 8-bit effective data and 1-bit ACK
signal or NACK signal sent back by recipient. Data transmission is effective when SCL is “1”.
When communication is complete, master CPU will send stop signal. Stop signal means when SCL is
“1”, SDA status hops from “0” to “1”.

b) Capture report descriptor



Operating sequence for capturing report descriptor
The diagram above shows the operating procedures for master device to capture report descriptor. First,

master device generates a start signal; then, it sends device address information and read/write bit
information.
After receiving ACK, master device sends 16-bit report descriptor address.
After slave device responds, master device begins to capture data from slave device; master device
replies with an ACK to slave device for every BYTE and replies with NACK for the last BYTE. Finally,
it sends end mark.

c) Capture HID descriptor


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Window 8 capacitor touch chip GT9113
The operating procedures for capturing HID descriptor are similar to those for capturing report
descriptor. After sending device address information and read-write bit information, master device
receives ACK from slave device and sends a 16-bit HID descriptor address. After slave device replies
with ACK, master device begins to capture data; master device replies with an ACK to slave device for
every BYTE and replies with NACK for the last BYTE. Finally, it sends end mark.

d) R/W operating procedures and feature message


When slave device needs to capture data from master device, it first pulls INT trigger interruption. After
master device receives interruption, it sends device address information and read/write bit; after slave
device replies with ACK, master device begins to capture data; master device replies with an ACK to
slave device for every BYTE and replies with NACK for the last BYTE. Finally, it sends end mark.


Now, slave device releases INT pin.
When sending data, master device first sends device address information and read/write bit. After slave
device replies with ACK, master device begins to send data; master device waits for slave device to
reply with an ACK for every BYTE. After master device sends the last BYTE and receives ACK from
slave device, master device sends end mark to complete the sending process.
Feature message is a two-way message sent between master device and slave. For example, it is used for
master device to change the status of slave device, such as Reset.

6.2. USB communication



When the format for USB to report data is ID + coordinate data, ID is 1; When the format for USB
to report data is ID + coordinate point, ID is 2.

GT9113 USB is transmitted to MCU in data packet format compliant with WIN8 protocol. GT9113 supports a

maximum of 10 fingers. When the number of touch fingers is less than or equal to 6, only one data packet (first 64

bytes) is transmitted at a time; When the number of touch fingers is greater than 6, two data packets (128 bytes) are

transmitted. Specific format for data packet is as shown below:


0 ReportID
1 valid_point_flag

2 track id
3 point 1 x coordinate (low byte)
4 point 1 x coordinate (high byte)
5 point 1 y coordinate (low byte)
6 point 1 y coordinate (high byte)
7 point 1 rect_x_size(low byte)
8 point 1 rect_x_size(high byte)
9 point 1 rect_y_size(low byte)
10 point 1 rect_y_size(high byte)
11 valid_point_flag

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Window 8 capacitor touch chip GT9113
12 track id
13 point 2 x coordinate (low byte)
14 point 2 x coordinate (high byte)
15 point 2 y coordinate (low byte)
16 point 2 y coordinate (high byte)
17 point 2 rect_x_size(low byte)
18 point 2 rect_x_size(high byte)
19 point 2 rect_y_size(low byte)
20 point 2 rect_y_size(high byte)


21 valid_point_flag
22 track id
23 point 3 x coordinate (low byte)
24 point 3 x coordinate (high byte)
25 point 3 y coordinate (low byte)
26 point 3 y coordinate (high byte)

27 point 3 rect_x_size(low byte)
28 point 3 rect_x_size(high byte)
29 point 3 rect_y_size(low byte)
30 point 3 rect_y_size(high byte)
31 valid_point_flag
32 track id
33 point 4 x coordinate (low byte)

34 point 4 x coordinate (high byte)
35 point 4 y coordinate (low byte)
36 point 4 y coordinate (high byte)
37 point 4 rect_x_size(low byte)
38 point 4 rect_x_size(high byte)
39 point 4 rect_y_size(low byte)

40 point 4 rect_y_size(high byte)


41 valid_point_flag
42 track id
43 point 5 x coordinate (low byte)
44 point 5 x coordinate (high byte)
45 point 5 y coordinate (low byte)
46 point 5 y coordinate (high byte)
47 point 5 rect_x_size(low byte)
48 point 5 rect_x_size(high byte)

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Window 8 capacitor touch chip GT9113
49 point 5 rect_y_size(low byte)
50 point 5 rect_y_size(high byte)
51 valid_point_flag
52 track id
53 point 6 x coordinate (low byte)
54 point 6 x coordinate (high byte)
55 point 6 y coordinate (low byte)
56 point 6 y coordinate (high byte)
57 point 6 rect_x_size(low byte)


58 point 6 rect_x_size(high byte)
59 point 6 rect_y_size(low byte)
60 point 6 rect_y_size(high byte)
61 ScanTime(low byte)
62 ScanTime(high byte)
63 专 TouchCount
64 ReportID
65 valid_point_flag
66 track id
67 point 7 x coordinate (low byte)
68 point 7 x coordinate (high byte)
69 point 7 y coordinate (low byte)
70 point 7 y coordinate (high byte)

71 point 7 rect_x_size(low byte)
72 Point 7 rect_x_size(high byte)
73 point 7 rect_y_size(low byte)
74 point 7 rect_y_size(high byte)
75 valid_point_flag
76 track id

77 point 8 x coordinate (low byte)


78 point 8 x coordinate (high byte)
79 point 8 y coordinate (low byte)
80 point 8 y coordinate (high byte)
81 point 8 rect_x_size(low byte)
82 point 8 rect_x_size(high byte)
83 point 8 rect_y_size(low byte)
84 point 8 rect_y_size(high byte)
85 valid_point_flag

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Window 8 capacitor touch chip GT9113
86 track id
87 point 9 x coordinate (low byte)
88 point 9 x coordinate (high byte)
89 point 9 y coordinate (low byte)
90 point 9 y coordinate (high byte)
91 point 9 rect_x_size(low byte)
92 point 9 rect_x_size(high byte)
93 point 9 rect_y_size(low byte)
94 point 9 rect_y_size(high byte)


95 valid_point_flag
96 track id
97 point 10 x coordinate (low byte)
98 point 10 x coordinate (high byte)
99 point 10 y coordinate (low byte)
100 point 10 y coordinate (high byte)

101 point 10 rect_x_size(low byte)
102 point 10 rect_x_size(high byte)
103 point 10 rect_y_size(low byte)
104 point 10 rect_y_size(high byte)
105 0x00
106 0x00
107 0x00

108 0x00
109 0x00
110 0x00
111 0x00
112 0x00
113 0x00

114 0x00
115 0x00
116 0x00
117 0x00
118 0x00
119 0x00
120 0x00
121 0x00
122 0x00

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Window 8 capacitor touch chip GT9113
123 0x00
124 0x00
125 ScanTime(low byte)
126 ScanTime(high byte)
127 0x00

Some description:
1. ReportID: ID for report descriptor, 0x01 here;
2. valid_point_flag: Whether the point is valid, valid when it is 0x01 and 0x00 means key is
released;


3. ScanTime: Time stamp, unit is 100us.

6.3. GT9113 register information

a) Real-time command
(Write Only)
Addr name 专 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
0: Read coordinate status 1: Original deviation value 2: Software resetting 3:
Benchmark update (Internal test) 4: Benchmark calibration (Internal test) 5:Screen
0x8040 Command
off
Other value invalid

b) Configuration information
(R/W)
Register Config Data bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0

The version number of configuration documents (To be saved when the version number of
Config_ new release is greater than the original version or equal to the version number of the original
0x8047 Version version but there is some change in contents; Normal range of version number: 'A'~'Z'; Send
0x00 to initiate version number as ‘A’)
X Output Max
0x8048 (Low Byte)
Max value from X coordinate output
X Output Max
0x8049 (High Byte)
Y Output Max
0x804A

(Low Byte)
Max value from Y coordinate output
Y Output Max
0x804B (High Byte)
0x804C Touch Number Reserved Maximum output touch points: 1~10

X2Y Sito
Module_ (X, Y
0x804D Switch1
Reserved Stretch_rank coordinate ((Software Reserved
interchang noise
e) reduction)

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Window 8 capacitor touch chip GT9113
New_
Green
Module_ Reserve Reserve Reserve Reserve Reserv Touch_
0x804E switch2 d
Reserved _Mode
d d d ed key
_
EN
Debouncing count when finger presses
0x804F Shake_Count Reserved
down/releases
Normal_Filter(Coefficient of filter value for original coordinate
0x8050 Filter First_Filter
window: 1)
0x8051 Large_Touch Large-area touch point count
Noise_ Noise elimination value (Valid when
0x8052 Reduction
Reserved
coefficient is 1,0-15)
Screen_
0x8053 Touch_Level
Threshold of touch points on screen from none to availability


Screen_
0x8054 Leave_Level
Threshold of touch points on screen from availability to none
Low_Power_
0x8055 Control
Reserved Enter low consumption time (0~15s)

0x8056 Refresh_Rate Reserved Coordinate reporting rate (Cycle: 5+N ms)


0x8057 x_threshold
Reserved
0x8058 y_threshold
0x8059 X_Speed_Limit
Reserved
0x805A
0x805B
0x805C
0x805D
Y_Speed_Limit

Space

Mini_Filter

Space at upper frame (32 as coefficient)
Space at left frame (32 as coefficient)

Reserved
Space at lower frame (32 as coefficient)
Space at right frame (32 as coefficient)
Minimum filter setting in the drawing
process
0x805E Stretch_R0 Space 1 coefficient
0x805F Stretch_R1 Space 2 coefficient
0x8060 Stretch_R2 Space 3 coefficient

0x8061 Stretch_RM Base number for various spaces

Drv_GroupA_ All_Driv
0x8062 Num ing
Reserved Driver_Group_A_number

Drv_GroupB_ Dual_F
0x8063 Num
Reserved
req
Driver_Group_B_number

0x8064 Sensor_Num Sensor_Group_B_Number Sensor_Group_A_Number


Double frequency coefficient for drive frequency of drive group A GroupA_Frequence =
0x8065 FreqA_factor
Double frequency coefficient * Base frequency

Double frequency coefficient for drive frequency of drive group B GroupB_Frequence =


0x8066 FreqB_factor
Double frequency coefficient * Base frequency
Pannel_
0x8067 BitFreqL
Base frequency of drive groups A and B (1526HZ<Base frequency<14600Hz)
Pannel_
0x8068 BitFreqH
Pannel_Sensor_Ti
0x8069 meL Time interval between two adjacent drive signal outputs (Unit: us), Reserved (beta version
Pannel_Sensor_Ti occupied. Released version invalid)
0x806A meH

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Window 8 capacitor touch chip GT9113

Pannel_Drv_output_
Pannel_DAC_Gain
Pannel_Tx_ R
0x806B Gain
Reserved
4 positions,
0:Gain max
7: Gain min
adjustable

Pannel_Rx_ Pannel_P Pannel_Rx_Vcmi (4 Pannel_PGA_Gain


0x806C Gain GA_C
Pannel_PGA_R
positions, adjustable) (8 positions, adjustable)

Pannel_Dump_ Amplification coefficient for screen


0x806D Shift
Reserved
original value (2N)
Repeat_Num
Drv_Frame_
0x806E Reserved SubFrame_DrvNum (Accumulated


Control
sampling count)
0x806F NC Reserved
0x8070 NC Reserved
0x8071 NC Reserved
0x8072 NC Reserved
0x8073 NC Reserved
0x8074 NC 专 Reserved
0x8075 NC Reserved
0x8076 NC Reserved
0x8077 NC Reserved
0x8078 NC Reserved
0x8079 NC Reserved

Freq_Hopping_Star
0x807A t
Start frequency for the range of hopping frequency (2KHz unit, such as 50 for 100KHz)

0x807B Freq_Hopping_End End frequency for the range of hopping frequency (2KHz unit, such as 150 for 300KHz)

Detect_Stay_Times
(Number of tests per Detect_Confirm_Times
Noise_Detect_Time
0x807C s
frequency point in each (Determine noise level after repeated noise test, 1-63 valid, 20
noise test, 2 recommended)
recommended)

Hoppin Range_ Dis_


Reser Detect_Time_Out
0x807D Hopping_Flag Force_
g_En Ext Ref ved (Timeout time for noise test, in second)

Fast_Hopping_Limit judgment is Hopping_Hit_Threshold


enabled only when the interference
Hoppging_ (Conditions for selecting optimal frequency,
0x807E Threshold
value of current frequency is greater
Current working frequency interference-
than Fast_Hopping_Limit*4, this Minimum interference > Set value x4, then
value is set as 5 minimum optimal frequency and hopping is selected)
Noise_ Judge threshold with interference (Deemed as free from interference if interference is below
0x807F Threshold this value at all frequency points)
0x8080 NC Reserved
0x8081 NC Reserved

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Window 8 capacitor touch chip GT9113
Hopping_Sensor
0x8082 Sections for Hopping Frequency Noise Detection (4 sections recommended).
_Group
Hopping_seg1_ Seg1 Normalize coefficient (Times this value, then divided by 128 to get eventual
0x8083 Rawdata).
Normalize
Hopping_seg1_F
0x8084 Seg1 Central Factor.
actor
Main_Clock_Ajd Fine adjustment of basic frequency configuration, range-7~+8; normally, no
0x8085 configuration is necessary, 0 for default value.
ust
Hopping_seg2_ Seg2 Normalize coefficient (Times this value, then divided by 128 to get eventual
0x8086 Rawdata).
Normalize
Hopping_seg2_F
0x8087 Seg2 Central Factor
actor
0x8088 Reserved Reserved


Hopping_seg3_ Seg3 Normalize coefficient (Times this value, then divided by 128 to get eventual
0x8089 Rawdata).
Normalize
Hopping_seg3_F
0x808A Seg3 Central Factor
actor
0x808B Reserved Reserved
Hopping_seg4_ Seg4 Normalize coefficient (Times this value, then divided by 128 to get eventual
0x808C Rawdata).
Normalize
Hopping_seg4_F
0x808D Seg4 Central Factor
actor
0x808E
0x808F

0x8090
Reserved
Hopping_seg5_
Normalize
Hopping_seg5_F
actor
专 Reserved
Seg5 Normalize coefficient (Times this value, then divided by 128 to get eventual
Rawdata).
Seg5 Central Factor.

0x8091 Reserved Reserved


Hopping_seg6_ Seg6 Normalize coefficient (Times this value, then divided by 128 to get
0x8092 Normalize eventual Rawdata).

0x8093 NC Reserved
0x8094 NC Reserved
0x8095 NC Reserved
0x8096 NC Reserved
0x8097 NC Reserved
0x8098 NC Reserved
0x8099 NC Reserved
0x809A NC Reserved

0x809B NC Reserved
0x809C NC Reserved
New_Green_Mo
0x809D de_Wake_Up_L New_Green low consumption mode wake threshold.
evel
New
0x809E Green_Dump_S 500uA dump_shift
hift
0x809F CS_PGA_R Pannel_PGA_R in CS mode
Pannel_PGA_Gain in CS mode
0x80A0 CS_PGA_GAIN
(8 position adjustable)
0x80A1 CS_DUMP_SHI Amplification coefficient for initial screen value (2N)

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Window 8 capacitor touch chip GT9113
FT
CS_NOISE_THR
0x80A2 CS noise threshold in CS mode
ESHOLD
CS_SEG1_NOR
0x80A3 Seg1 Normalize coefficient in CS mode
MALIZE
CS_SEG2_NOR
0x80A4 Seg2 Normalize coefficient in CS mode
MALIZE
CS_SEG3_NOR
0x80A5 Seg3 Normalize coefficient in CS mode
MALIZE
CS_SEG4_NOR
0x80A6 Seg4 Normalize coefficient in CS mode
MALIZE
CS_SEG5_NOR
0x80A7 Seg5 Normalize coefficient in CS mode
MALIZE


0x80A8 NC Reserved
0x80A9 NC Reserved
0x80AA NC Reserved
0x80AB NC Reserved
0x80AC NC Reserved
0x80AD NC Reserved
0x80AE NC Reserved
0x80AF NC Reserved
0x80B0
0x80B1
0x80B2
0x80B3
NC
NC
NC

X_Physical(Low
Byte)
专 Reserved
Reserved
Reserved

X_Physical(High
The physical resolution in X direction.
0x80B4
Byte)
Y_Physical(Low
0x80B5
Byte)

Y_Physical(High
The physical resolution in X direction.
0x80B6
Byte)
0x80B7
Sensor_CH0~
~ Sensor_CH29
Chip channel number corresponding to ITO Sensor
0x80D4
0x80D5~ Driver_CH0~
Chip channel number corresponding to ITO Driver
0x80FE Driver_CH41
Configuration information verification (Complementary code for total bytes from 0x8047 to
0x80FF Config_Chksum
0x80FE)

0x8100 Config_Fresh Configure updated tag (tag to be written by MCU)

Supplementary description for some registers:

[0x809D] X_Physical_Max_L: Low byte of actual physical length for the screen in X direction, in mm
[0x809E] X_Physical_Max_H: High byte of actual physical length for the screen in X direction, in mm
[0x809F] Y_Physical_Max_L: Low byte of actual physical length for the screen in Y direction, in mm
[0x80A0] Y_Physical_Max_H: High byte of actual physical length for the screen in Y direction, in mm

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Window 8 capacitor touch chip GT9113

7. Function description
7.1. I2C working mode

Normal
d
m an
om

To
c

Un

uc
d
ep an

h
ou
e m

tr
Sl om

ch

ig
c

ed
nd

ge
k e
Se

fo
wa


r
a

so
nd
Se

me
ti
me
Send Sleep command
Sleep Green

a) Normal Mode

When GT9113 is in Normal mode, its coordinates refreshing cycle is lower than or equal to 10ms.

When no trigger event occurs for some time in Normal mode, GT9113 will automatically switch to
Green mode to reduce power consumption. The duration when GT9113 remains untouched before
automatically entering Green mode can be set through information configuration within the range of
0~15s, 1s for increment.
b) Green Mode

In Green mode, the scanning cycle for GT9113 is around 20ms. It automatically enters Normal mode
when detecting any trigger operation.
c) Sleep Mode
When Sleep command is sent via I2C for HOST, GT9113 will enter Sleep mode. When HOST sends
Wake command via I2C, GT9113 will enter Normal mode after waking up.

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Window 8 capacitor touch chip GT9113

7.2. USB working mode

Normal
d
an
mm
co

To
d
en

Un

uc
d
p

an

h
us

ou
mm
S

tr
ch
co
s

ig
ed
d
en

ke

ge
s

fo
Wa

r
B

r
US

so
nd

me
se
B

ti
US

me
USB sends Suspend command


Sleep Green

a) Normal Mode
When GT9113 is in Normal mode, its fastest coordinates refreshing cycle is 10ms.

When no trigger event occurs for some time in Normal mode, GT9113 will automatically switch to

Green mode to reduce power consumption. The duration when GT9113 remains untouched before
automatically entering Green mode can be set through information configuration within the range of
0~15s, 1s for increment. When set as “0”, the system will not enter Green mode.
b) Green Mode
In Green mode, the scanning cycle for GT9113 is around 20ms. It automatically enters Normal mode
when detecting any triggering operation.

c) Sleep Mode
When Sleep command is sent via USB for MCU, GT9113 will enter Sleep mode. When MCU sends
Wake command via USB, GT9113 will enter Normal mode after waking up.

7.3. Interrupted trigger mode

When touched in I2C HID mode, GT9113 will give out pulse signal when passing INT pin in every

scanning cycle to notify master CPU to read coordinates information. INT initial state to a high state,
when INT is low, the host began to read coordinates, coordinates read after completion, INT recovery is
high.

7.4. Solidifying configuration function

GT9113 supports Solidifying configuration function. After capturing configuration parameter for any
item, GT9113 will solidify the configuration parameter with higher version number. After solidifying
configuration parameter, GT9113 will not receive any configuration of lower version number from
master CPU.

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Window 8 capacitor touch chip GT9113

7.5. Automatic calibration

a) Initial calibration

Difference in temperature, humidity and physical space structure may affect the benchmark value of
capacitive sensor in idle status. Within the initial 200ms, GT9113 will capture new test benchmark
depending on environmental conditions to complete initialization for touch screen test.
b) Automatic thermal drift compensation
Slow change in environmental factors such as temperature, humidity or dust may also affect the
benchmark value of capacitive sensor in idle status. GT9113 will check for any change in any data on


real-time basis, and perfrom statistic analysis of historic data to correct test benchmark and thus reduce
the impact of envirnmental change on touch screen test.



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Window 8 capacitor touch chip GT9113

8. Reference circuit diagram


VDD
Note: If host control

/ARM_RST
J5 VDD I2C bus has pull-up VDD

OSC_OUT

GT_Wake
1 resistance already, R9

OSC_IN
2 Boot 1 Boot it is no need to 10K
3 VDD design these to pull
INT /ARM_RST

INT
4 I2C_SCL ICE_DAT 1 ICE_DAT -up resistance on C5
5 I2C_SDA TP module. C6
R12 R7 1uf
6 /ARM_RST ICE_CK 1 ICE_CK U4 10nf

33

32
31
30
29
28
27
26
25
master_interf ace

EP

GND2

GT_Wake
NC

INT
RESET

AVDD
XT1_IN
XT1_OUT
Reserve test point for test port 2k 2k

SY NC 1 24 ICE_CK
I2C interface, 2 SY NC ICE_CK 23
I2C_SCL ICE_DAT
Interface order only for reference I2C_SDA 3 SCL ICE_DAT 22 GT_Clock_Trim
4 SDA GTCK_ADJ 21 GT_SCL
5 NC I2C1_SCL 20 GT_SDA


GTM802
6 NC I2C1_SDA 19
J6 S_OPT4 3 VDD 7 LDO NC 18
1 OPT 2 8 VDD NC 17
2 1 C1 C2 C3 GND NC

/GT_RST
3 +5V
R10 22 USB_DM 1uf 2.2uf 100nf

VDD33
R11

BOOT
VBUS
4 R8 22 USB_DP

OPT
5 /ARM_RST

NC
D+
D-
6 OPT chooses ports for IIC and USB.

OSC_IN

OSC_OUT
OPT is suspended when using USB solution; 1Meg

9
10
11
12
13
14
15
16
master_interf ace short circuit grounding for OPT when using IIC solution. Y1

/GT_RST
USB_DM
2 3

USB_DP
USB interface, Interface order only

OPT
1 4

+5V
for reference./ARM_RST is optionally If I2C solution is used, this LDO may

Boot
output based on specific needs. be omitted and VBUS for GTM802 C16 12M C17
may be suspended. C4
+5V VDD 1uf 20pF 20pF
U2
/ARM_RST VRH3301NTX
/ARM_RST 1 5
GT_Wake
GT_Wake
GT_SDA
GT_SCL
GT_SDA
GT_SCL
专 3
VIN OUT
4
VSS

GT_Clock_Trim EN NC Title GT9113_V3.0


GT_Clock_Trim C9
/GT_RST
/GT_RST 1uF
SY NC C8
SY NC
2

1uf Size Document Number Rev


Connect to GT9113
Date: Friday , December 20, 2013 Sheet 1 of 2

Up_Key
J3
1 1 2 SENS_KEY 1
SENS7
SENS6
SENS5
SENS4
SENS3
SENS2
SENS1
SENS0

DRV10
DRV11
DRV12
DRV0 2
DRV0
DRV1
DRV2
DRV3
DRV4
DRV5
DRV6
DRV7
DRV8
DRV9
DRV1 3
DRV2 4 J4
Down_Key
DRV3 5 1
DRV4 6 SENS0 2 1 2 SENS_KEY 2
DRV5 7 SENS1 3
89

88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
DRV6 8 SENS2 4 U1
DRV7 9 SENS3 5 Lef t_Key
EP

DRV0
DRV1
DRV2
DRV3
DRV4
DRV5
DRV6
DRV7
DRV8
DRV9
SENS7
SENS6
SENS5
SENS4
SENS3
SENS2
SENS1
SENS0

DRV10
DRV11
DRV12
AGND

DRV8 10 SENS4 6
DRV9 11 SENS5 7 1 2 SENS_KEY 3

DRV10 12 SENS6 8 SENS8 1 66 DRV13
DRV11 13 SENS7 9 SENS9 2 SENS8 DRV13 65 DRV14
DRV12 14 SENS8 10 Right_Key SENS10 3 SENS9 DRV14 64 DRV15
DRV13 15 SENS9 11 SENS11 4 SENS10 DRV15 63 DRV16
DRV14 16 SENS10 12 DRV_KEY 1 2 SENS_KEY 4 SENS12 5 SENS11 DRV16 62 DRV17
DRV15 17 SENS11 13 SENS13 6 SENS12 DRV17 61 DRV18
DRV16 18 SENS12 14 SENS14 7 SENS13 DRV18 60 DRV19
DRV17 19 SENS13 15 Logo_Key SENS15 8 SENS14 DRV19 59 DRV20
DRV18 20 SENS14 16 SENS16 9 SENS15 DRV20 58 DRV21
DRV19 21 SENS15 17 1 2 SENS_KEY 5 SENS17 10 SENS16 DRV21 57 DRV22
DRV20 22 SENS16 18 SENS18 11 SENS17 DRV22 56 DRV23
DRV21 23 SENS17 19 SENS19 12 SENS18 DRV23 55 DRV24
DRV22 24 SENS18 20 Homekey design specif ication: SENS20 13 SENS19 GT9113 DRV24 54 DRV25
DRV23 25 SENS19 21 1.Homekey f unctions consist of 4-5 key s and are enabled using 4-5 sensors. SENS21 14 SENS20 DRV25 53 DRV26
DRV24 26 SENS20 22 2. For DRV_KEY selection, please ref er to "GT9 Channel Selector". SENS22 15 SENS21 DRV26 52 DRV27
DRV25 27 SENS21 23 3. SENS_KEY selects any 4-5 sensors and should be used in duplex with SENS23 16 SENS22 DRV27 51 DRV28
DRV26 28 SENS22 24 screen sensors. SENS24 17 SENS23 DRV28 50 DRV29
DRV27 29 SENS23 25 4. For specif ic key design, please ref er to "Goodix Win8_Homekey Graphic SENS25 18 SENS24 DRV29 49 DRV30
30 26 Design Specif ication". 19 SENS25 DRV30 48
DRV28 SENS24 SENS26 DRV31
DRV29 31 SENS25 27 SENS27 20 SENS26 DRV31 47 DRV32
DRV30 32 SENS26 28 VDD AVDD18 SENS28 21 SENS27 DRV32 46 DRV33
Sensor_OPT1
Sensor_OPT2

33 29 22 SENS28 DRV33 45
DVDD12

DRV31 SENS27 SENS29 DRV34


/ARM_RST

DRV32 34 SENS28 30 SENS29 DRV34


CLK_ADJ

I2C_SDA
I2C_SCL
DVDD12
AVDD28
AVDD18

DRV33 35 SENS29 31
DRV41
DRV40
DRV39
DRV38
DRV37
DRV36
DRV35
VDDIO
DGND

SYNC

RSTB

36 32
Wake

DRV34
37
NC

DRV35 C10 C11 C12


DRV36 38

DRV37 39 2.2uF 2.2uF 2.2uF


23
24
25
26
GT_Clock_Trim 27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44

DRV38 40 SENSE_INTERFACE
DRV39 41
42
/ARM_RST

DRV40
GT_Wake
DVDD12
AVDD18

/GT_RST R2 10k
/GT_RST

43
GT_SDA

DRV41 VDD
GT_SCL

DRV41
DRV40
DRV39
DRV38
DRV37
DRV36
DRV35

44
SYNC
OPT1
OPT2

S_OPT1 C14
VDD

VDD
OPT1
10nf
DRIVE_INTERFACE
Attention: VDD
C13
Sensor_OPT1 and Sensor_OPT2 is the sensor recognition pin,
support 6 sensors,module 1-6 related to 6 different module factory number. 2.2uF
Free sensors and drivers can be floating IC pin Sensor_OPT2 does not support floating application
directly. Please refer to "GT9 Channel
Selector" to select channel. Method of COF sensor ID Connect
R3 300k 3 S_OPT2 S_OPT1 S_OPT2 Module ID
2 GND GND Module 1(default) R4 2k
OPT2
1 VDDIO GND Module 2
R5 2k VDD
NC GND Module 3
GND 300K Module 4
/ARM_RST COF OPT 2 Reference way.pay attention to Sensor ID Choice List, VDDIO 300K Module 5
/ARM_RST OPT 2 does not support floating application.
GT_Wake NC 300K Module 6
GT_Wake
GT_SDA
GT_SDA
GT_SCL
GT_SCL
GT_Clock_Trim Method f or COB sensor ID connect
GT_Clock_Trim
/GT_RST 3 S_OPT3 S_OPT1 S_OPT2 Module ID
/GT_RST
SY NC 2 OPT2 GND GND Module 1(default) Title GT9113_V3.0
SY NC 1 VDDIO GND Module 2
COB Module R6 300k COB board NC GND Module 3
GND NC Module 4 Size Document Number Rev
Connect to GTM802. COB OPT 2 reference connect method.the 300k resistance for
VDDIO NC Module 5
connecting OPT 2 should be put on board,to avoid floating of
this pin when it is connect to T P NC NC Module 6
Date: Friday , December 20, 2013 Sheet 2 of 2

GT9113 reference circuit diagram

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Window 8 capacitor touch chip GT9113
GT9113 reference circuit diagram

Notes::
Notes

1. This circuit only represents basic application. Adjustment may be required for some circuits
depending on application environments.

2. X7R material is recommended for capacitor.




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Window 8 capacitor touch chip GT9113

9. Electrical characteristics
9.1. Extreme electrical parameter
(GT9113, 25℃ for environmental temperature)
Parameter Min. value Max. value Unit
Analog power AVDD28 (Refer to AGND) 2.66 3.47 V
VDDIO (Refer to DGND) 1.7 3.47 V
Voltage acceptable to digital I/O -0.3 3.47 V
Voltage acceptable to analog I/O -0.3 3.47 V
Range of operating temperature -40 85 ℃


Range of storage temperature -60 125 ℃
Welding temperature (10s) 300 ℃
ESD protection voltage (HB Model) - ±2 KV

(GTM802, 25℃ for environmental temperature)


Parameter Min. value Max. value Unit
Power AVDD (Refer to GND)
专 -0.3 7.0 V
Voltage acceptable to digital I/O GND-0.3 VDD+0.3 V
Voltage acceptable to analog I/O GND-0.3 VDD+0.3 V
Range of operating temperature -40 85 ℃
Range of storage temperature -55 125 ℃
Welding temperature (10s) 300 ℃
ESD protection voltage (HB Model) - ±2 KV

9.2. Recommended working conditions



(GT9113)
Typical
Parameter Min. value Max. value Unit
value
AVDD28 2.8 - 3.3 V
VDDIO 1.8 - 3.3 V
Operating temperature -20 25 85 ℃

(GTM802)
Typical
Parameter Min. value Max. value Unit
value
VDD 2.5 - 5.5 V
Operating temperature -20 25 85 ℃

9.3. AC characteristics
(GT9113, 25℃ for environmental temperature, AVDD=2.8V, VDDIO=1.8V)
Typical
Parameter Min. value Max. value Unit
value
OSC oscillation frequency 59 60 61 MHz

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Window 8 capacitor touch chip GT9113
Time for I/O output to switch
- - 0.5 ns
from low to high
Time for I/O output to switch
- - 0.5 ns
from high to low

(Electrical characteristics for GTM802 full speed USB drive)


Typical
Parameter Min. value Max. value Unit
value
Ascend time (CL=50p) 4 - 20 MHz
Descend time (CL=50p) 4 - 20 ns
Ascend/Descend ratio (Ascend
90 - 111.1 %
time/Descend time)


9.4. DC characteristics
(GT9113, 25℃ for environmental temperature, AVDD=2.8V, VDDIO=1.8V)
Typical
Parameter Min. value Max. value Unit
value
Normal mode working
- 13 mA
current
Green mode working
current
Sleep mode working
current
Low level voltage value for
digital input
专 70

-0.3
4.5

0
-

120

0.45
mA

Ua

V
High level voltage value for
1.35 1.8 2.1 V
digital input

(GTM802, 25℃ for environmental temperature, VDD=3.3V, External clock=12MHz)
Typical
Parameter Min. value Max. value Unit
value
Normal mode working
3.5 5.5 mA
current
Idea mode working
2.5 4.5 mA
current
Deep Sleep mode
9 10.5 uA

working current
Low level voltage value for
-0.3 - 0.8 V
digital input
High level voltage value for
digital input 1.5 - VDD+0.2 V
(VDD=3.0V)

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Window 8 capacitor touch chip GT9113

10. Product packaging


10.1. GT9113 packaging




Dimensions in millimeters
Symbol
Min. Normal Max.
A 0.70 0.75 0.80
A1 0.00 0.035 0.05
b 0.40BSC
D 10.00BSC
D1 5.50 5.60 5.90

E 10.00BSC
E1 5.20 5.60 5.80
e 0.15 0.20 0.25
L 0.30 0.40 0.50
K 0.203BSC

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Window 8 capacitor touch chip GT9113

10.2. GTM802 Packaging


Top View Bottom View

Side View

Unit: mm

Symbol Min Typ. Value Max.
A 0.70 0.75 0.80
A1 0 0.02 0.05
A3 0.20REF
b 0.18 0.25 0.30
D 5.00BSC
D2 2.60 2.70 2.80
E 5.00BSC

E2 2.60 2.70 2.80


e 0.50BSC
L 0.30 0.40 0.50
Y 0.10

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Window 8 capacitor touch chip GT9113

11. Revision Record


Version No Date revised Revision
Rev.00 2013-03-29 Initial release
Rev.01 2013-05-07 Modified schematic diagram
Rev.02 2013-05-14 Added “Conditions for tin furnace” section
Rev.03 2013-11-05 Modify the configuration information
Rev.04 2013-12-30 Added I2C HID and Homekey




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Window 8 capacitor touch chip GT9113

12. Contact Information

Shenzhen Huiding Technology Co.,Ltd.


Floor 13, Phase B, Tengfei Industrial Building, Futian Free Trade Zone Shenzhen, 518000
TEL: +86-755-33338828 FAX: +86-755-33338828

www.goodix.com



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