SPEL Semiconductor Ltd

An IC assembly & Test Company

Corporate Presentation

January 2010
Defining The Future Through Partnerships
Agenda

1. About SPEL
2. SPEL’s Services
3. Logistics
4. Customers
5. Quality Systems
6. Assembly
7. Test
8. Highlights
9. Contacts

Defining The Future Through Partnerships

About SPEL
• First & Only IC Assembly & Test facility in India

• Established in 1988 in Chennai, India

• New Management team at the helm since 2000

• Achieved 22.70% CAGR in revenue for the last 8 years

• Shares listed on the BSE

• ISO 9001, ISO 14001 & TS 16949 Certified

• High Yields, over 99.70%

• 100% Export Oriented – Tax Incentives & Easy

Logistics
Defining The Future Through Partnerships
Values & COs
Values
a. Business Ethics - defines us as a Company
b. Professionalism - defines us as Individuals
c. Citizenship - defines our Contribution to Society

Corporate Objectives
a. Profit - Generate sufficient profit that enables our
remaining three Corporate Objectives.
b. Competence - Widen product portfolio to cover New Packages,
make Process Improvements and improve effectiveness of
Manpower by Training.
c. Stakeholders - Strengthen relationship with all stakeholders -
Customers, Employees, Vendors, Investors and Lenders.
d. Growth - Achieve growth by Market spread & distribution,
Customer spread, Revenue and Technology improvements.

Defining The Future Through Partnerships

 SPEL Semiconductor Limited

SPEL’s 900,000 square foot facility, with a clean room area

Of 20,600 square feet, is located in Chennai, India

Defining The Future Through Partnerships

Vision
To be the Natural Destination for Global Customers
Seeking Cost-Effective Offshore Turnkey
IC Assembly & Test Services.

Mission
SPEL Semiconductor Limited, an IC Assembly & Test Subcontractor
for over 20 years, works as one Team to achieve Zero defect, Just-in-
time, Cost-effective solutions with Service that is uncompromised.

SPEL’s Partners Customers, Suppliers, Employees &

Shareholders, are confident in the knowledge that we are
consistently meeting and exceeding their expectations.

Defining The Future Through Partnerships

Manpower

• Qualified Technicians, Skilled Engineers &

Experienced Management

• Technicians choose not to have a Union

• Low Attrition Rate

• Over 55% of the Employees have over 10 yrs

Service

• Low Direct Labor Cost

Defining The Future Through Partnerships

Communication

• English is the standard Business Language

• Ease of Communicating with the Factory

• Quick Responses, Complete Answers

• Time Difference : 13 ½ Hrs (PST)

Defining The Future Through Partnerships

Technical Capabilities
• Minimum Die Size : 10 Mils Square
• 8” Wafer Backgrinding
• Epoxy Screen Printing
• Copper Wire Bonding
• Bond Pad Pitch : 45 microns
• Low Loop Bonding : 4 mils
• Ultra Thin Packages : 0.5mm
• Dual Row LMP
• Wafer Mapping at Die Attach

Defining The Future Through Partnerships

Cost Competitive
Packaging Cost
• Substantial Cost Savings

• Low Cost for new package development in LMP

• Attractive amortization proposals for new package tooling

Test Cost
• Low Development Charges – Onsite or Offshore

• Low Production Costs

• Attractive pricing for the consigned testers

Defining The Future Through Partnerships

Logistics
• One Stop Turnkey Destination :
Probe B/G Assembly Test T&R

• Fast Turnaround

• Factory Schedule : 24 x 7

• Drop Ship to End-Customers

• Daily Direct Flights to US, Europe & Asia Pacific

• STAR eWIP (STAR electronic Work-In-Progress), an online

Semiconductor Tracking And Resourcing Software to widen
its communication channel with Customers.

Defining The Future Through Partnerships

Quick Customs Clearance

• Green Channel Status for Imports & Exports

• Zero Duty

• No Open Inspection

• Our Own Custom clearance office in Airport

premises

• Clearance within 6 Working Hrs

• Easy Equipment Consignment In & Out of factory

Defining The Future Through Partnerships

Customers

Defining The Future Through Partnerships

Quality Policy

Consistently provide products and services that will

exceed the quality expectations of our Customers.

Implement process improvement programs which will

enable each Employee to do their job

Right the first time.

Work towards continual quality improvement through

training and teamwork.

Defining The Future Through Partnerships

Quality Certifications

In compliance with :

ISO 9001 : 2000

ISO 14001 : 2004
ISO TS16949 : 2002

Certified by BVQI, UK

Also Certified for SONY Green Partner

Defining The Future Through Partnerships

Site Area 856,550 Sq Ft
Built Up Area 92,191 Sq Ft
Clean Room Area 20,600 Sq Ft

Defining The Future Through Partnerships

Standard & Green Packages
Package Type Lead Count JEDEC Std

150 MIL SOIC 8/14/16 MS-012

300 MIL SOIC 16/20 MS-013

150 MIL QSOP 16/20/24/28 MO-137

150 MIL VSOP 40/48 MO-154

173 MIL TSSOP 8/20/24/38 MO-153

240 MIL TSSOP 48/56 MO-153

300 MIL SSOP 48/56 MO-118

150 MIL MILLIPAQ 80 MO-154

300 MIL PDIP 8/14/16 MS-001

225 MIL SIP 8 N/A

Defining The Future Through Partnerships

LMP Capability

Type Dual / Quad

Singulation Saw Singulated

Thickness 0.50 mm, 0.75 mm & 0.90 mm

Body Size 1 mm2 to 12 mm2

Lead Pitch 0.4mm, 0.5mm and 0.65mm

Lead Count 4 ~ 156 leads

Conforms to Jedec Outline MO-220I and MO-229B

Can support Custom Body Size

Defining The Future Through Partnerships

LMP (0.90mm Thickness)

Package Package Size (mm) Lead Pitch (mm)

12L DLMP 3.00 x 1.35 x 0.90 0.50
16L QLMP 4.00 x 4.00 x 0.90 0.65
24L QLMP 4.00 x 4.00 x 0.90 0.50
20L QLMP 5.00 x 5.00 x 0.90 0.65
24 QLMP 5.00 x 5.00 x 0.90 0.65
40L QLMP 6.00 x 6.00 x 0.90 0.50

Defining The Future Through Partnerships

TLMP (0.75mm Thickness)
Package Package Size (mm) Lead Pitch (mm)
6L TDLMP 1.80 x 2.00 x 0.75 0.5
8L TDLMP 1.35 x 1.70 x 0.75 0.40
8L TDLMP F 1.35 x 1.70 x 0.75 0.40
8L TDLMP 2.00 x 2.00 x 0.75 0.50
8L TDLMP 3.00 x 3.00 x 0.75 0.50
10L COL 1.30 x 1.60 x 0.75 0.50
10L TDLMP 3.00 x 3.00 x 0.75 0.50
12L COL 1.00 x 3.00 x 0.75 0.50
12L TDLMP 2.50 x 1.35 x 0.75 0.40
12L TDLMP 1.35 x 3.00 x 0.75 0.50
12L TDLMP 3.00 x 3.50 x 0.75 0.50
16L TDLMP 2.50 x 2.50 x 0.75 0.40
16L TDLMP 1.35 x 3.30 x 0.75 0.40
16L TDLMP 4.00 x 1.60 x 0.75 0.50
16L TDLMP 4.00 x 1.70 x 0.75 0.50

Defining The Future Through Partnerships

TLMP (0.75mm Thickness)
Package Package Size (mm) Lead Pitch (mm)
16L TDLMP 4.00 x 6.00 x 0.75 0.65
16L TQLMP 2.50 x 2.50 x 0.75 0.40
16L TQLMP 3.00 x 3.00 x 0.75 0.50
24L TQLMP 4.00 x 4.00 x 0.75 0.50
24L TQLMP 6.00 x 6.00 x 0.75 0.80
32L TQLMP 5.00 x 5.00 x 0.75 0.50
36L TQLMP 5.00 x 6.00 x 0.75 0.50
42L TQLMP 3.50 x 9.00 x 0.75 0.50
48L TQLMP 7.00 x 7.00 x 0.75 0.50
56L TQLMP 5.00 x 11.00 x 0.75 0.50
64L TQLMP 9.00 x 9.00 x 0.75 0.50
68L TQLMP 11.00 x 11.00 x 0.75 0.50
72L TQLMP 5.00 x 11.00 x 0.75 0.40
80L TQLMP 12.00 x 12.00 x 0.75 0.50
80L TQLMP 3.50 x 14.50 x 0.75 0.40

Defining The Future Through Partnerships

ULMP (0.50mm Thickness)

Package Package Size (mm) Lead Pitch (mm)

6L COL 1.00 x 1.25 x 0.50 0.40
6L COL 1.00 x 1.45 x 0.50 0.50
8L UDLMP 1.35 x 1.70 x 0.50 0.40
8L UDLMP F 1.35 x 1.70 x 0.50 0.40
10L COL 1.00 x 2.50 x 0.50 0.50
12L UDLMP 1.20 x 2.50 x 0.50 0.50
12L UDLMP 1.35 x 2.50 x 0.50 0.40
10L UDLMP F 2.70x1.00x0.50 0.50,0.60
16L UDLMP 1.35 x 3.30 x 0.50 0.40
156L UQLMP (Dual Row) 12.0 x 12.0 x 0.50 0.50

Defining The Future Through Partnerships

ROHS/Green Packaging
• ROHS compliant since 2005

• Over 97% of the production are ROHS compliant

• Provide Green Packages

• Qualified Green Die attach Epoxy / mold

compound material

• Green Packages are ROHS compliant and are

halogen-free

Defining The Future Through Partnerships

Green BOM

Bill of Materials

• Silver Epoxy
Sumitomo CRM1076NS
Ablestik Screen print Epoxy 8006 & 8008

• Molding Compound
Sumitomo EME G500, G600 & G770
Hitachi CEL 8240, CEL 9220

Defining The Future Through Partnerships

Materials

Leadframes C7025, C151, Olin 194 & NiPdAu Pre-

plated
Die Attach Standard & Green packages:
Epoxy Sumitomo CRM1076NS
Ablestik Screen Print Epoxy 8006 & 8008
Gold Wire 0.8 to 2.0 mil
Copper Wire 1.0 to 2.0 mil
Mold Compound Standard packages:
Nitto MP8000AN
Green packages:
Sumitomo EME G500, G600 & G770HCD
Hitachi CEL 8240 & CEL 9220

Defining The Future Through Partnerships

Assembly & Packaging Equipment
No Equipment Manufacturer
1 Back Grinder Disco, Japan

2 Taper & Detaper Nitto, Japan

3 Wafer Mounter Nitto & Disco, Japan

4 Dicing Saws Disco, Japan

5 Die Bonders Alphasem, Switzerland

ASM, Singapore
6 Wire Bonders Shinkawa, Japan,
K & S, USA
7 Mold Presses ASA Automold, Singapore
Towa Automold, Japan
Yamada, Japan & Fuse,
Korea
8 Mold Die-sets Yamada, Japan
Pascon, Hong Kong
Formosa, Malaysia
Jade, Singapore
Precision Tool, Malaysia

Defining The Future Through Partnerships

Assembly & Packaging Equipment

No Equipment Manufacturer
9 Trim & Form Systems Yamada, Japan
Liteon, Japan
Pascon, Hong Kong
Ji-Cheng, Taiwan
Sunyang, Korea
10 Electrolytic Deflashing Meco, Holland

11 Lead Finish Equip Meco, Holland

12 Automatic Laser Marker Sunyang, Korea

13 Lead Scanner TI, USA

14 Tape & Reel Systemation, USA

(with 3D inspection) Intotest, Malaysia

Defining The Future Through Partnerships

LMP Assembly Equipment
No Equipment Manufacturer

1 Back Grinder Disco, Japan

2 Screen Printer DEK, Switzerland

3 Dicing Saws Disco, Japan

4 Die Bonders Alphasem, Switzerland

5 Wire Bonders K & S, USA

6 Auto Mold ASA, Singapore

7 Saw Singulation Disco, Japan & ADT, Israel

8 Pick & Place Hanmi, Korea

Defining The Future Through Partnerships

QC Equipment
No Equipment Manufacturer
1 Universal Bond Tester Royce, USA

2 Die Shear Tester HMP, USA

3 Wire Pull Tester HMP, USA

4 Real Time X-Ray Phoenix, Germany

5 Profile Projector Mitutoyo, Japan

6 XRF Oxford, USA

7 Cross Sectioning Buehler, USA

8 Tape Peel Analyzer Systemation, USA

9 Z Scope (Hisomet) Union, Japan

In-house Lab for Bond-Pad Crater & Mark
Permanency Check

Defining The Future Through Partnerships

Reliability Equipment

No Equipment Manufacturer
1 Burn-in Blue-M, USA
2 Temperature & Humidity Blue-M, USA & LR, USA
3 Temperature Cycler Blue-M, USA & ESPEC, Japan
4 Dry Heat (Class 100) Oven Labline, USA
5 HAST Hirayama, Japan
6 Autoclave Hirayama, Japan
7 Steam Ager Mountain Gate, Singapore
8 Solder Pot HMP, USA
9 Lead Integrity Tester HMP, USA
10 Reflow Oven Reflow Oven
11 Drop Test Avex, USA

Defining The Future Through Partnerships

Reliability Capability

No Reliability Test Test Specifications

1 Burn-in Test 125°C +/- 3° C, 1000 Hrs
2 Temperature & Humidity 85°C +/- 2° C, 85% +/- 5% RH, 168 Hrs

3 Temperature Cycling Test - 65°C +/- 5°C to 150°C + 5°C / - 0° C, 500 cycles

4 Dry Heat (Class 100) Oven 150°C + 5°C / - 0° C, 1000 Hrs

5 HAST 130°C +/- 2°C, 85% +/- 5% RH, 96 Hrs
6 Autoclave Test 100% RH, 121°C,168 Hrs

7 Moisture Sensitivity Per JESD-020

8 Drop Test Per JESD22-B111

Defining The Future Through Partnerships

FA Equipment

No Equipment Manufacturer
1 LCR Meter HP, USA
2 Data Acquisition Unit HP, USA
3 RF MUX HP, USA
4 40 Channel MUX HP, USA
5 V/I Source Meter Keithley, Germany
6 Oscilloscope Keithley, Germany
7 Pulse Generator HP, Singapore
8 Real Time X-Ray Phoenix, USA
9 De-Capping Nisene, USA
10 C-Sam Sonix, USA

Defining The Future Through Partnerships

Test Product Capability
• Logic

• Memory

• Clock Drivers & Low-skew Clock Buffers

• Power Management Products

• PLLs & VCOs

• IPDs (R, RC & RCD Networks)

• Industrial Analog Devices

• Audio, Video & Telecom ICs

Defining The Future Through Partnerships

Test Equipment
No Equipment Manufacturer Model
1 Testers Verigy 93K
Eagle ETS364
Credence ASL1000
Sentry S21
MCT 2010, 2020
ATR MTS2010
2 Handlers Micro Comp Tech MCT 3608E, 5105
Micro Handling Corp MHA 240, 245
Tesec SOT23 / SOT 143 9718-HT
Tesec Mapper & Picker 3270-IH & 3572-PK
Multitest MT8704, MT9928
SRM XD248
Synax 1211
3 Wafer Prober Electroglas EG 2001X / 4080X

Defining The Future Through Partnerships

SPEL Highlights
• Low Cost Turnkey Services
• Package Portfolio covering major application Segments
• New Package Development
• Test Engineering
• Reliability Evaluation
• Continuous Improvement
• Excellent Customer Service
• On-Time Delivery
• Excellent Value Proposition

Defining The Future Through Partnerships

CSR (Corporate Social Responsibility)

SPEL Employees Social Service Organization (SESSO)

undertakes the following community welfare initiatives.

• Provide educational assistance to the needy people

• Conduct a voluntary Blood Donation camp.

• Provide assistance to an orphanage and old age home

located near Factory.

Defining The Future Through Partnerships

SPEL’s Environment Care

SPEL’s environmental care includes the following initiatives

• Proper treatment of Industry Waste

• Waste Water Recycling

• Vegetable Plantation inside the Factory

Defining The Future Through Partnerships

www.spel.com

Please visit our Website for:

• Package Drawings
• White Papers – Lead-Free, Green Assembly, etc
• Financials
• SPEL’s News & Events
• Indian Electronic Hardware Industry News
• Global Semiconductor Industry News

Defining The Future Through Partnerships

Contacts

Factory US Sales & Technical Support

Contact : Badri Narayanan, Head Contact : Kiran Kumar

(Planning / India Sales)
Address : 5 CMDA Industrial Estate
MM Nagar (Chennai)
603 209, India
Phone : + 91 (44) 4740-5473 / 300
Mobile : + 91 98407 40775
Fax : + 91 (44) 4740-5303 / 404
eMail : gbbadrinarayanan@spel.com
Address : 3120 De La Cruz Blvd, Ste 107
Santa Clara, CA 95054
Phone : + 1 (408) 727 - 7850
Mobile : + 1 (408) 506 - 0655
Fax : + 1 (408) 516 - 8085
eMail : jkirankumar@spel.com

www.spel.com

Defining The Future Through Partnerships

Global Assembly & Test
Working with Fabs
• IDMs used to preferably locate their Fabs close to their
Packaging – single entity & hence convenient
administration

• Fab proximity no more significant for Fabless

companies & OSAT players, in today's logistically well
connected world

• In OSAT model, Customers advise Wafer delivery from

Fabs to Subcons

• Convenient Logistics ensures zero delay

• Subcons maintain Wafer Inventory Die Bank ensuring

demand based Wafer processing

Defining The Future Through Partnerships

Global Assembly & Test
Working with Raw Material Vendors
• Key to success is effective Planning

• Most materials available in Asia Pacific at competitive

prices

• Materials readily available - considering Lead time &

Volumes, Ordering & Procurement ensured

• Effective system for easy Logistics & Just-in-Time

delivery

• Vendors maintain local inventory of bulk material

procurement

Defining The Future Through Partnerships

Indian Electronics Market

The Hardware manufacturing industry in India is poised to touch

US$155 billion by 2015

The Global market for electronics hardware is expected to grow by 30

percent to US$320 billion in 2015

Indian electronic hardware production increased from Rs 43,800 crore

in 2003-04 to Rs 80,800 crore in 2007-08, CAGR 16.6 per cent

Increased consumption of mobile phones, computers and televisions

is driving the domestic demand for the industry in India

The Sales of PCs have reached 7.3 million units a year, about 8-10
million mobile phones are sold and the market for TV is about
15million units a year

Defining The Future Through Partnerships

Location Advantage
Advantage Tamil Nadu
A booming economy - One of the fastest growing state economies in India, with
current economic size of US$62 billion

Has developed an entire network of knowledge satellite cities

and clustered industry segments

A Hi-Tech industrial eco-system with a diversified manufacturing

base.

Peaceful Labor climate – wage rates are relatively lower,

man-days lost due to labor unrest is 0.7%

Ranked #1 in terms of availability of skilled Manpower, Annual turnout of

Engineers and Technicians is about 2,43,000 plus

Chennai offers low cost of living, good social infrastructure and peaceful living
conditions

Stable Political climate and Investor-Friendly government

Defining The Future Through Partnerships