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Optical Pickup Chipset with CD/DVD Recording Photodetector IC (PDIC)

Supports High-Speed Writing to both CD and DVD Media

CXA2677GA
CXA2676GA
The signal processing required for DVD is far more com- CXA2677GA
RF/Servo PDIC
plex than that for CD. ■ Supports high-speed CD/DVD write operations
Sony has now developed an optical pickup chipset, the (CD-R: ×52-speed, DVD-R: ×8-speed)
CXA2677GA and CXA2676GA, that is appropriate for this ■ WPP1 (A + B) and WPP2 (C + D) outputs, which are
optimal for DVD address bit detection
complex signal processing. ■ Band limiter function for write operations
These devices adopt a newly-developed LGA type small ■ Eight-section photodiode for DPP
■ 16-pin LGA COB small package
package and can contribute to the development of ul-
trathin pickups.
CXA2676GA
Laser front monitor PDIC
■ Two-channel structure (Vin1, Vin2)
■ Chip capacitors (1005) included
■ 8-pin LGA COB small package

CXA2677GA low gain mode settings. LGA COB (chip on board)


The band limiter function used in write Small Package
The CXA2677GA is a photodetector IC
mode provides an average value signal To increase the number of pins while re-
(PDIC) that was developed as the photo-
with high precision. taining the package dimensions (4.5 × 3.2
detector element for optical pickups used
in DVD ±R/RW drives. It features two mm) of the earlier chip on board (COB)
additional pins: WPP1 (A + B) and WPP2
CXA2676GA package, Sony developed a new land grid
(C + D). This allows the generation of the The CXA2676GA adopts a two-channel array (LGA) package that positions the
WRF signal used in earlier (CXA2660N) structure to allow the power of the CD contacts in a two-dimensional array on the
CD-R/RW systems with the WPP1 + laser and the DVD laser to be set individu- reverse side of the package. This allows
WPP2 signal and the detection of address ally. It achieves fast response characteris- these devices to provide increased func-
bit signal unique to DVD ±R/RW with the tics, namely a slew rate of 250 V/µs and a tionality without increasing the mounting
WPP1 – WPP2 signal. Also, it adopts a settling time of 7 ns. These characteristics area. This package is optimal for devel-
three-stage structure with a write mode are adequate to support write speeds of ×52 oping ultrathin pickups, that is, pickups
and two read modes with high gain and for CD-R and ×8 for DVD-R. for use in 9.5 mm ultrathin drives.

V O I C E
Despite our busy schedule, we are
confident that we succeeded in re-
sponding to our customers’ input
to the greatest extent possible in
the development of these new
products. Even though the design
period was short, we put careful
detailed attention into every single
element in these products. We are
sure our customers will be fully sat-
isfied. It’s good to be able to relax
again now that this project is done.

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High A'
×3
Vcc 2 6 Vout
Ao 3 ×3 6 Vcc
A
Vc
B'
3 SW 9 Vc
Low Bo 4 ×3
B
Vc 8 5 Vc
Vin1 C'
4
Vin2 ×3
1 GND
VR1 Co 14
C
VR2 Vc
Photodiode D' Vc 10 SW
GND 1 7
IVout Ao
Do 13 ×3 11 RF+
D Bo
Vc Co
Do

Eo 15 ×3.5 Ao
E Bo
■ Figure 1 CXA2676GA Block Diagram Vc Co
Do
Vcc 16 RF–
Fo 5 ×3.5
F Vc
Vc
Go Do Co Eo RF– Vc

Go 12 ×3.5
12 13 14 15 16 G B'
7 IVout Vc 8 8 WPP1
Vc C'
Vc SW RF+ Vc
Vin1 5 6 Vout 9 10 11
Vcc WPP2 WPP1 Ho 2 ×3.5 A'
H D' 7 WPP2
SW 3 4 Vin2 6 7 8 Vc

1 GND Vcc 2 1 2 3 4 5
■ Figure 2 CXA2677GA Block Diagram
GND Ho Ao Bo Fo

■ Figure 3 CXA2676GA Pin ■ Figure 4 CXA2677GA Pin


Configuration Configuration

120 35 120 35 120

φ0.7 mm

D C
120

150

H G F E
A B

Photosensitive area position:


At the package center Unit: µm

■ Figure 5 CXA2676GA Acceptance Pattern Dimensions ■ Figure 6 CXA2677GA Acceptance Pattern Dimensions

Top view Bottom view Top view Bottom view


4.5 ±0.1 1.6 4.5 ±0.1
0.8

Acceptance area
0.8

3.2 ±0.1
3.2 ±0.1

D C
H G F E
A B
.5
φ0

16
ND

.5
0.35 ±0.2

φ0

0.8
LA
0.35 ±0.2

0.8

Colorless transparent resin


16

Transparent resin
ND

Chip (includes scattering materials) Chip


LA
1.25 ±0.1

Unit: mm Unit: mm
1.25 ±0.1

Back side contact Substrate


Back side contact Substrate
(LGA) (LGA)

■ Figure 7 CXA2676GA Package Dimensions ■ Figure 8 CXA2677GA Package Dimensions

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This datasheet has been downloaded from:

www.DatasheetCatalog.com

Datasheets for electronic components.

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