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LED LCD TV
SERVICE MANUAL
CHASSIS : LA92E
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS ............................................................................................. 2
SPECIFICATION ....................................................................................... 6
Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.
Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No Item Specification Remark
1. Receiving System 1) ATSC / NTSC-M
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)
Mark : 220V,60Hz (Korea)
4. Market NORTH AMERICA 55LH95-UA
KOREA 55LH95QD-NB/55LH93QD-NA
5. Screen Size 55 inch Wide(1920 ◊ 1080) FHD 55LH95-UA/55LH95QD-NB/55LH93QD-NA
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module LC550WUL-SBT1 LGD 55LH95-UA/55LH95QD-NB/55LH93QD-NA
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma & Brightness
No Item Min Typ Max Unit Remark
1. Max Luminance 55LH95-UA / 55LH95QD-NB
400 500 cd/m
(Center 1-point / Full White Pattern) / 55LH93QD-NA
2. Luminance uniformity 77 % Full white
3. Color RED X Typ. 0.644 Typ.
4. coordinate Y -0.03 0.332 +0.03
5. GREEN X 0.284
6. Y 0.630
7. BLUE X 0.148
8. Y 0.060
9. WHITE X 0.279
10. Y 0.292
11. Color coordinate uniformity N/A
12. Contrast ratio Local Dimming ON
900 1300
Copyright LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
6. Component Video Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.500 60 148.50 HDTV 1080P
10. 1920*1080 67.432 59.94 148.352 HDTV 1080P
11. 1920*1080 27.000 24.000 74.25 HDTV 1080P
12. 1920*1080 26.97 23.976 74.176 HDTV 1080P
13. 1920*1080 33.75 30.000 74.25 HDTV 1080P
14. 1920*1080 33.71 29.97 74.176 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
8. HDMI input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA O
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4. 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1280*768 47.776 59.870 79.5 CVT(WXGA) O
7. 1360*768 47.712 60.015 85.50 VESA (WXGA) O
8. 1280*1024 63.981 60.020 108.00 VESA (SXGA) O
9. 1600*1200 75.00 60.00 162 VESA (UXGA) O
10. 1920*1080 67.5 60 148.5 HDTV 1080P O
DTV
1 720*480 31.47 60 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.432 59.939 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.976 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P
9. Mechanical Specification
1) Media Box
Copyright LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
2) 55LH95-UA
Copyright LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Object 3. Adjustment list
This specification sheet applied to LA92E Chassis applied • Check the TOOL OPTION prior to adjustment. If the TOOL
LCD TV all models manufactured in TV factory. OPTION is incorrect, correct it then execute the power
off/on to apply the modification (refer to 7.3 TOOL
OPTION)
• In case of this chassis,
2. Notes Set the Media-box option in connection with Wireless or Wire.
Set the TV option in HDMI5 mode. (remove the wired HDMI
1) Because this is not a hot chassis, it is not necessary to use cable)
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order. 3.1 Board-level adjustment
3) The adjustment must be performed in the circumstance of •ADC adjustment (Media-Box ONLY)
25±5°C of temperature and 65±10% of relative humidity if •EDID/DDC download
there is no specific designation.
4) The input voltage of the receiver must keep 100~240V, * Manual ADC Confirmation : [IN-START] -> [1.Adjust Check]
50/60Hz. •After Board level adjustment, set volume setting value 0
5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15°C.
3.2 Final assembly adjustment
In case of keeping module is in the circumstance of 0°C, it •White Balance adjustment
should be placed in the circumstance of above 15°C for 2 •RS-232C functionality check
hours. •EYE-Q TEST
In case of keeping module is in the circumstance of below - •Wireless Pairing (it is worked in the Wired status)
20°C, it should be placed in the circumstance of above •Shipment mode setting (In-Stop)
15°C for 3 hours.
Copyright LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
4.1.3 Adjustment 4.2. EDID(The Extended Display Identification
4.1.3.1 Method
•Using RS-232C, adjust items listed in 3.1 in the order shown Data)/DDC(Display Data Channel) download
in”4.1.3.3”.
4.2.1 Overview
4.1.3.2 Adj. protocol •It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
Protocol Command Set ACK necessity of user input. It is a realization of “Plug and
Play”.
Enter adj. mode aa 00 00 a 00 OK00x
Confirm adj. ad 00 99 NG 03 00x (Fail) * For HDMI5 EDID D/L, Change the TV input mode into
HDMI5 mode then using Adj. R/C, download the HDMI5
NG 03 01x (Fail) EDID.
NG 03 02x (Fail) * HDMI5 / RGB can be downloaded by JIG and cable
OK 03 03x (Success)
4.2.4 EDID DATA
End adj. aa 00 90 a 00 OK90x • HDMI
Ref.) ADC adjustment RS232C Protocol_Ver1.0
EDID Block 0 table =
4.1.3.3 Adj. order 0 1 2 3 4 5 6 7 8 9 A B C D E F
•ad 00 00 [Enter ADC adj. mode] 0 00 FF FF FF FF FF FF 00 1E 6D 02 00 01 01 01 01
•kb 00 04 [Component1 input mode] 10 VV WW 01 03 80 73 41 78 0A CF 74 A3 57 4C B0 23
•ad 00 10 [Adjust 480i Comp1] 20 09 48 4C A1 08 00 A9 40 81 80 61 40 45 40 31 40
•kb 00 06 [RGB-DTV input mode] 30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
•ad 00 10 [Adjust 1080p Comp1/RGB] 40 45 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
•ad 00 90 [End adj.] 50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 39
60 3F 1F 52 10 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 XX
Copyright LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
•HDMI 1 5. Final assembly adjustment
- VV: 01
- WW: 13 5.1 White Balance adjustment
- XX: 1D (Block 0) / CC (Block1) 5.1.1 Overview
- YY: 10 00 •W/B adj. : Objective & How-it-works
- Objective: To reduce each panel’s W/B deviation.
•HDMI 2 - How-it-works: When R/G/B gain in the OSD is at 192, it
- VV: 01 means the panel is at its Full Dynamic Range. In order to
- WW: 13 prevent saturation of Full Dynamic range and data, one of
- XX: 1D (Block 0) / BC (Block1) R/G/B is fixed at 192, and the other two is lowered to find the
- YY: 20 00 desired value.
Copyright LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
•RS-232C Command used during auto-adj. 5.1.5 Adj. method
5.1.5.1 Auto-adj. method
RS-232C COMMAND
1) Set TV in adj. mode using POWER On key.
Meaning
[CMD ID DATA] 2) Zero calibrate probe then place it on the center of the
Display.
wb 00 00 White Balance adjustment start.
3) Connect Cable(RS-232C).
wb 00 10 Start of adjust gain (Inner white pattern) 4) Select the model in adj. program and begin adjustment.
wb 00 1f End of gain adjust 5) When adj. is completed (OK sign), check adj. status per
mode. (Warm / Medium / Cool)
wb 00 20 Start of offset adjust(Inner white pattern)
6) Remove the probe and RS-232C cable to complete adj.
wb 00 2f End of offset adjust
Copyright LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
5.2 EYE-Q function check 6. GND and Internal Pressure(I/P) check
Step 1) Turn on TV
6.1 Inspection method
Step 2) Press EYE key of Adj. R/C 1) GND & Internal Pressure auto-check preparation
Step 3) Cover the Eye Q II sensor on the front of the using - Check that Power cord is fully inserted to the set.
your hand and wait for 6 seconds (If loose, re-insert)
Step 4) Confirm that R/G/B value is lower than 10 of the “Raw 2) Perform GND & Internal Pressure auto-check
Data (Sensor data, Back light )” . If after 6 seconds, - Unit with fully inserted POWER CORD, TUNER CABLE
R/G/B value is not lower than 10, replace Eye Q II and A/V CABLE arrives to the auto-check process.
sensor - Connect D-terminal AV JACK TESTER
Step 5) Remove your hand from the Eye Q II sensor and wait - Auto CONTROLLER(GWS103-4) ON
for 6 seconds - Perform GND TEST
Step 6) Confirm that “ok” pop up. - If NG, BUZZER will sound to inform the operator
If change is not seen, replace Eye Q II sensor - If OK, changeover to I/P check automatically
(Remove CORD, A/V from AV JACK BOX)
- Perform I/P TEST
- If NG, BUZZER will sound to inform the operator
5.3 Wireless Pairing - If OK, Good lamp will lit up and the stopper will allow the
5.3.1 Overview pallet to move on to next process
•For the wireless connection between TV and Media-Box,
Select the communication channel and fix the Mac address.
* The adjustment should be executed with being Wired.
(HDMI cable connection)
6.2 Check point
• TEST voltage
5.3.2 Method - GND:1.5KV/min at 100mA
1) Press IN-START key on adj. R/C then select [9.Wireless - SIGNAL:3KV/min at 100mA
Check]. • TEST time:1 sec.
2) After Choosing the LRP Channel, Set OK in Paired Status. • TEST POINT
3) Remove the HDMI cable and turn off/on TV and Media-box. - GND TEST = POWER CORD GND & SIGNAL CABLE
4) Check the Wireless status. METAL GND
- I/P TEST = POWER CORD GND & LIVE & NEUTRAL
• LEAKAGE CURRENT: set to 0.5mArms
5.4 Shipment mode check(In-stop)
• After final inspection, press IN-STOP key of the Adj. R/C and
check that the unit goes to Stand-by mode.
Copyright LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
7. Etc. 7.2 TOOL OPTION
7.2.1 Overview
7.1 USB S/W Download (option) •The model name and spec. will be confirmed and modified by
7.1.1 Overview adj. menu.
• USB download allows fast S/W upgrade in SVC areas or •No Modification at discretion
during Board-level production.
7.2.2 Confirm/Modify method
7.1.2 Dowunload method 1) By Pressing ADJ key, [EZ ADJUST] -> [0.Tool Option1].
1) After Set on, confirm that image is displayed. 2) In the Tool Option1, It is possible to modify the Inch/ Tool/
2) Insert USB memory stick that contains the S/W and after a Module maker/ Module revision.
few seconds, Upgrade OSD is displayed. 3) Contents of Tool Option 1~4 are like the section 7.2.3.
(If the version of download file in USB is lower than the
current version, Upgrade OSD is not displayed) * Entering into IN-START mode, [1.Adjust Check] shows Tool
3) After download is finished, automatically Power off/on is Options.
executed. (If auto power on/off is not executed, perform the
power off/on manually) 7.2.3 Contents of Tool Option
4) S/W upgrade is completed and eject USB Memory Stick 7.2.3.1 Tool Option1
form USB jack. •Inch
5) By pressing IN-START key on the adj. R/C, check the S/W •Tool
version. •Maker
•Module Rev.
Copyright LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
300 200
800
400
801
530 802
531
540 541
532
542
510
301
120
121
500 803
340
310 320
550
900
LV2
LV1 700 Media Box
A2
A10
710
770
780
720
730
790
740
750
760
Copyright LG Electronics. Inc. All right reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
WIRELESS TV’S OPERATING PRINCIPLE
Thus, when there is an object at an electric wave progressing direction between media box and TV, due to high-frequency signal’s
characteristic, it could be penetrated or reflected according to the kind of an object and then the signal’s diminution can happen.
(In case of an electric wave of a mobile phone, it is similar to the fact that the quality of a telephone call lowers because stuff consisting
of a metal does not pass through.)
If you install TV and media box toward the same direction like a picture, you can watch wireless TV with an optimal picture quality.
Please install making the number of an antenna to be more than three as you move media box.
Wireless
Signal
When you need to install media box’s front side slightly uplifted to match wireless
connection intensity, please raise it by using provided rubber support.
Rubber support
(accessories)
When you install media box inside of a cabinet, a wireless TV might not operate normally if the
cabinet door is sealed up.
Installation example
Handling method Please check if an antenna of wireless Please install media box outside of a
connection intensity is more than three. cabinet.
PLEASE CHECK BEFORE REPORTING A DEFECT.
• This is the case that TV power is switched on by a remote controller but the power of media box is not switched on.
Q. If switching on the power by a remote controller, I keep seeing the guidance of “It is connecting to a media box. Please wait for a
moment.”
• This is the case that a connection between TV or media box is cut because wireless receiving environment is affected.
Q. I keep seeing the guid-ance of “It is connecting to a media box. Please wait for a moment.” while watching TV through a wireless
connection.
A. Please do not let an object or person directly obstruct media box or TV’s front side.
A. Please do not make any obstacles between media box and TV.
• This is the case that a wireless conditiongets bad b an obstacle around or moving object.
WIRELESS MODEL
OSD OSD
a b c d e f g
Wireless
Analog LVDS SIGNAL HDMI HDMI LVDS LCD
INPUT MAIN IC TX MODULE RX MODULE MAIN IC
Digital CONVERTER MODULE
MEDIA-BOX TV SET
Service Wired
only HDMI5
HDMI CABLE
HDMI JACK HDMI JACK
Defect block Symptoms Wireless connection Check
a Bad (noise) image / No image No effect directly ▶ Check the EDID of HDMI & RGB
- osd is good ▶ Check cable & contact error
Bad sound / No sound
b Bad image No effect directly ▶ Check main ic basic power & power
- IC’s cold soldering or memory defect accompanied noise on osd sequence
Bad sound / No sound No effect directly ▶ Control line check (I2C & etc)
Wireless connecting osd is displayed continually No connection ▶ Check input/output video & audio
- There is no video signal from Rx module to TV main ic, so TV signal
understand this time like disconnection state and display
connecting
osd continually. And then, if TV is not activated rightly within
15min,
it will go to st-by mode.
C Bad image / Bad or No sound No effect directly ▶ Check power & control line
Wireless connecting osd is displayed continually No connection ▶ Check input/output signal
- No image ▶ Check inner HDMI cable connection
status
*Focused on Wireless connection (There can be cable’s defect.)
Trouble shooting
WIRELESS MODEL
OSD OSD
a b c d e f g
Wireless
Analog LVDS SIGNAL HDMI HDMI LVDS LCD
INPUT MAIN IC TX MODULE RX MODULE MAIN IC
Digital CONVERTER MODULE
MEDIA-BOX TV SET
Service Wired
only HDMI5
HDMI CABLE
HDMI JACK HDMI JACK
WIRELESS MODEL
OSD OSD
a b c d e f g
Wireless
Analog LVDS SIGNAL HDMI HDMI LVDS LCD
INPUT MAIN IC TX MODULE RX MODULE MAIN IC
Digital CONVERTER MODULE
MEDIA-BOX TV SET
Service Wired
HDMI5
only HDMI CABLE
HDMI JACK HDMI JACK
※ Check first when Wireless connection is disable!
- Pairing
- S/W version check
- Fan defect
▷ TV Rx module fan defect: Check Fan error of TV In-start menu
▷ Media-Box fan defect: Check the red led’s blinking of Media-Box front
- Wireless interference check
▷ Refer to the installation method guide
- Inner HDMI cable’s connection status (From Rx/Tx module to Main)
※ Check Tip
- TV set & Media-Box is just 1:1 connection. (No multiple device connection)
- In order to download TV set, you must change the mode to HDMI5 or turn off Media-Box.
- Rx/Tx module’s performance is very sensitive to temperature. So, When you repair the defect, should keep up with
the original assembly state.
Trouble shooting
HDMI CABLE
3. Enter the [IN START(Media Box)] menu and go to sub-title [9.Wireless check]
Enter menu and Push the left or right remote-controller button.
Check the Paired Status if changed from NG to OK
※ If s/w version of Tx/Rx module & TV/Media-box main isn’t matched, Wireless can’t be
connected, So at that time check the version and upgrade by usb
Apply model
Circuit diagram
TV SET
1. TV MAIN(SD/BD) 2. RX module (SD/BD)
/ /
EAX52983302_SD EAX52983302_BD EAX60691303_SD EAX60691303_BD
Media-Box
1. Box MAIN(SD/BD) 2. TX module (SD/BD)
/ /
EAX60692502_SD EAX60692502_BD EAX52967903_SD EAX52967903_BD
Total programmable IC
NORMAL MODEL
AV MSTAR LGD
Component BCM AUO
HDMI CMO
RGB
TV SET
WIRELESS MODEL
Wireless
Analog LVDS SIGNAL HDMI HDMI LVDS LCD
INPUT MAIN IC TX MODULE RX MODULE MAIN IC
Digital CONVERTER MODULE
MEDIA-BOX TV SET
About Wireless TV
TX Module
HDMI Cable
From Media-Box Main b/d
SIL9125
SB9120 SB9110
[B/B] [RF]
RX Module
TV SET
Media-Box
TX module
RX module
About Wireless TV
HR HR
Unused Unused
Wireless
LRP
TX module RX module
HRP
Wireless TV is similar to the walkie-talkie. We must match the channel of Tx & Rx module.
There are 4 HRP channel(A1~A4). We use only A2 channel and 3 LRP channel like this [60.32㎓],
[60.48㎓],[60.64㎓].
First thing, the LRP channel setting has to be matched in wired mode. There are not only channel
but also mac address that Tx/Rx modules have it’s own for preventing wireless interference.
Set the LRP channel and share the mac address each other, that’s called pairing.
After pairing, Antenna search and set the wireless path by LRP and then send video & audio data to
HRP channel.
Block Diagram TV SET
DDR2 (1Gb)
NVRAM
DDR(512Mb)
DDR(512Mb)
DDR2(512Mb)
24C512 DDR2(512Mb)
KIA7427F
Re
se
t
S-Flash
(32Mb) LGE7329 FHD 120HZ MODULE
Ursa
NAND-Flash
(512Mb)
MCLK
LGE3159GV
X100 S5
X-tal(12㎒) NTP3100L
I2S (D-AMP)
NOT FOR USER
Connect to Rx b/d For wireless
HDMI5
For wired I2C
HDMI CABLE & wide use
EEPROM
24C16
USB RS-232 WT61P8 IR & Local KEY
Micom
Only for service
8p wafer
HDMI 3.3V_L
5.0V
Transmitter 1.8V_L
[SiI9134] X900
24 X-tal(24㎒)
2.5V_L
RF 1.5V_L
Transceiver
1.2V_L
[SB9111]
1.0V_L
Wireless RX Module
Block Diagram MEDIA-BOX(SIMPLE)
Service
HDMI Splitter only
(PI3HDMI1210)
Can Tuner Demodulator
(TDVW-H154F) (LGDT3305)
IF TS_DATA[0:7]
I2S
I2C EEPROM
AT24C512
IR (For test)
3.3V_VSB 1.2V_VSB
5.0V_TU I2C_CH6
VSB/QAM
IF
ANT/ NTSC/VSB Demodulator I2C_CH2
CABLE Half-NIM [LGDT3305]
IN TUNER
TS
Composite ANALOG
VIDEO
Video INPUT
IN
FE_VMAIN
AV2_CVBS_IN DIGITAL TV
COMP1-Y/Pb/Pr
PROCESSOR DUAL
LVDS 30 HDMI
Transmitter
HDMI HDMI
COMP2-Y/Pb/Pr Receiver DeMUX
LVDS
Component DSUB-R/G/B [DTC30LM36] [SiI9134] [PI3HDMI1210] SERVICE
(Y,Pb,Pr) only
IN [LGE3369A] TX_SEL
I2C_CH2
TX_SEL
HDMI
DIGITAL
VIDEO
SiBEAM I/F
INPUT I2C_CH4
1.26V_1 1.8V_DDR 3.3V_1
RGB HDMI 3.3V_L
IN DDC_RGB Receiver 1.8V_L
5.0V_ST
[SiI9125]
24
I2C_CH4 3.3V_L
BACK I2C_CH2
Wireless TX Module
Block Diagram MEDIA-BOX(AUDIO)
5.0V_TU I2C_CH6
VSB/QAM
IF
ANT/ NTSC/VSB Demodulator I2C_CH2
CABLE Half-NIM [LGDT3305]
IN TUNER
TS
S/PDIF
Composite
ANALOG OUT
Video AUDIO
IN INPUT
3.3V_2 1.8V_1
FE_SIF 3.3V_2 5.0V_1
S/PDIF
A/V Audio-1 LCD/PDP
A/V Audio-2 DIGITAL TV I2S
HDMI HDMI HDMI
Transmitter
COMP Audio-1
COMP Audio-2
PROCESSOR DeMUX
SERVICE
[SiI9134] [PI3HDMI1210]
Component RGB Audio only
(Y,Pb,Pr)
IN [LGE3369A] I2C_CH2 TX_SEL
TX_SEL
HDMI
DIGITAL
SiBEAM I/F
AUDIO I2C_CH4
INPUT HDMI 3.3V_L
1.26V_1 1.8V_DDR 3.3V_1
RGB Receiver 1.8V_L
IN 5.0V_ST
[SiI9125]
I2C_CH4 3.3V_L
Network 3.3V_L
FRONT Processor 2.5V_L
[SB9120] 1.0V_L
HDMI MiCOM
IN
[WT61P8S]
(x4) HDMI 2.5V_L
Switch RF 1.5V_L
(4-to-1) Transceiver
3.3V_2 1.2V_L
[TDA9996] [SB9110]
1.8V_1 1.0V_L
BACK I2C_CH2
Wireless TX Module
Block Diagram TX MODULE
ADCI_P/N
D[35:0] ADCQ_P/N
H/VSYNC PCLK_P/N
DDC(2line)
HDMI DE
TMDS(8line) OSC
CABLE (54MHz)
SiI9125 SB9120 SB9110
IDCK
HDMI Network SLEEP RF
MCLK/SCK/W
XTAL S XTAL
Receiver Processor (3.6864MHz) Transceiver
(28.322MHz)
I2S
DACI_P/
SPDIFI N
DACQ_P/N
Embedded RF Control
CPU
I2C(2line)
SPI Bus(4line)
Control
HDMI_INT 3.3V
&
SiBEAM_INT MX1605 2.5V
Power
Power
Serial Flash
CABLE HDMI_RST# 1.5V
(12p) SiBEAM_RST#
1.2V
1.0V
Power Source
(5V)
Block Diagram RX MODULE
XTAL XTAL
(27MHz) (27MHz)
VCXO VCXO
H/VSYNC PCLK_P/N
DDC(2line)
I2C(2line)
SPI Bus
INT 3.3V
RST#
INT MX1605 2.5V
Power
Micom Serial Flash Power
RST# 1.5V
I2C(2line) (PIC32MX340F256H)
Source
1.2V
1.0V (5V)
Wireless TV Receiver Board
1.Title Sheet
2.RFIC
3.Power
4.Power Supply1
5.Power Supply2
6.BBIC IF
7.BBIC Clock Recovery
8.BBIC Audio / Video Out
9.BBIC Control
10.BBIC Misc
11.BBIC Power/Ground
12.HDMI Tx
13.uController
29
28
27
26
25
6:Y11
6:Y10
6:Y11
6:Y11
6:Y12
6:Y12
6:Y12
6:Y12
6:Y13
6:Y13
6:Y14
6:Y13
6:Y14
6:Y14
AL12;6:Y15
24
RFMODE_STBY
HSCLK_P
HSCLK_N
HSCS_P
HSCS_N
HSD0_P
HSD0_N
HSD1_P
HSD1_N
HSD2_P
HSD2_N
HSD3_P
HSD3_N
HSDOUT
23
XO_EN
DVDDIO_VCC3.3V
22
C239 OPT
0.1uF
VCC1.0V(RF) 16V C203
1005 0.1uF VCC1.2V
16V
21 1005
VCC1.2V
R202
C206 C205
4.53K 100pF 0.1uF
1% 50V 16V
20 C201 C204 C202 1005 1005
A10
B10
A11
B11
A12
B12
A13
B13
A14
B14
A15
B15
A16
B16
A17
B17
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
A9
B9
100pF 0.1uF 4.7uF
50V 16V 6.3V
NC_1
VSSA_2
REXT
VSSA_3
SYNTHCAPP
SYNTHCAPN
HSCSP
HSCSN
HSCLKP
HSCLKN
HSD0P
HSD0N
HSD1P
HSD1N
HSD2P
HSD2N
HSD3P
HSD3N
HSDOUT
VDD_1
VDDIO
VSS_4
VSS_1
VDD_2
STBY
XOEN
VSS_2
VSS_5
VSS_3
VSS_6
VSSA_1
VSSA_4
NC_2
VSSA_5
VCC1.2V VCC1.2V 1005 1005 1608
VCC1.2V VCC1.2V
19
C1 C16
VDDARF_1 VDDARF_3
C2 C17
C229 C231 C230 VDDARF_2 VDDARF_4 C208 C207 C211 C209 C210
100pF 0.1uF 4.7uF D1 D16 100pF 0.1uF 100pF 0.1uF 4.7uF
VDDARF_5 VDDARF_7
50V 16V 6.3V D2 D17 50V 16V 50V 16V 6.3V
1005 1005 C233 C232 VDDARF_6 VDDARF_8 1005 1005 1005
18 1608 E1 E16 1005 1608
100pF 0.1uF
VSSA_6 VSSA_8
50V 16V E2 E17
1005 1005 VSSA_7 VSSA_9
F1 F16
VDD_+2.5V_RxicM VDDAPL_1 VDDARF_9
F2 F17
VDDAPL_2 VDDARF_10
G1 G16
17 VDDHARF_1 VDDARF_11
G2 G17
C234
100pF C236 C235
H1
VDDHARF_2
VSSA_10
IC201 VDDARF_12
VSSA_12
H16 VCC1.2V
H2 H17
50V
1005
0.1uF
16V
22uF
10V
6:Y17 BBINI_N
J1
VSSA_11 SB9111 VSSA_13
J16
1005 3216 BBINI_N VDDARF_13
OPT J2 J17
6:Y17 BBINI_P BBINI_P VDDARF_14
16 K1 K16
VSSA_14 VSSA_16 C213 C212
VCC1.0V(RF) K2 K17 100pF 0.1uF
VSSA_15 VSSA_17
L1 L16 50V 16V
6:Y16 BBINQ_P BBINQ_P VDDABB_1 1005 1005
L2 L17
6:Y16 BBINQ_N BBINQ_N VDDABB_2 VCC1.2V
M1 M16
15 VSSA_18 VSSA_20
C246 C237 C238 M2 M17
4.7uF 100pF 0.1uF VSSA_19 VSSA_21
N1 N16
6.3V 50V 16V 6:Y18 BBOUTI_N BBOUTI_N PCLK_P PCLK_P 6:Y16
1608 1005 1005 N2 N17
6:Y18 BBOUTI_P BBOUTI_P PCLK_N PCLK_N 6:Y16 C218 C217 C245
P1 P16 100pF 0.1uF 4.7uF
VSSA_22 XTALIN
P2 P17 50V 16V 6.3V
14 VSSA_23 XTALOUT 1005 1005 1608
R1 R16
6:Y18 BBOUTQ_P BBOUTQ_P VDDXO_1
R2 R17
6:Y17 BBOUTQ_N BBOUTQ_N VDDXO_2
REFRESTRIM
VDDARF_15
VDDARF_19
VDDARF_16
VDDARF_20
VDDARF_17
VDDARF_21
VDDARF_18
VDDARF_22
AVDD_XO_+3.3V
VSSA_24
VSSA_25
VSSA_31
VSSA_26
VSSA_32
VSSA_27
VSSA_33
VSSA_34
VDDHA_1
VDDHA_2
VSSA_28
VSSA_35
VSSA_29
VSSA_36
VSSA_30
REFRES
ATB_N
ATB_P
NC_6
NC_7
NC_3
NC_8
NC_4
NC_5
NC_9
13
DVDDIO_VCC3.3V
C214
T1
U1
T2
U2
T3
U3
T4
U4
T5
U5
T6
U6
T7
U7
T8
U8
T9
U9
T10
U10
T11
U11
T12
U12
T13
U13
T14
U14
T15
U15
T16
U16
T17
U17
100pF C216 C215
X203
50V 0.1uF 22uF VDD TRISTATE/OPEN
1005 16V 10V 4 1 XO_EN V22;6:Y15
12 OPT 1005 3216 OUTPUT GND
C244 3 2
VCC1.2V
54.0000MHz
0.1uF PARTRON
1005
VCC1.2V
11
C224 C225 C226
100pF 0.1uF 4.7uF
TP302
TP301
50V 16V 6.3V
1005 1005 1608 C219 C221 C220 R206
100pF 0.1uF 4.7uF 0
50V 16V 6.3V
3.01K
3.01K
1005
VCC1.2V
R201
1005
R203
10 1005 1005 1608 1005
1%
1%
C228 C227
100pF 0.1uF VDD_+2.5V_RxicM VCC1.2V
50V 16V
9 1005
1005
C240
100pF C241 C223 C222
50V 0.1uF 100pF 0.1uF
1005 16V 50V 16V
8 OPT 1005 1005 1005
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. RFIC 2 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
25
24
DVDDIO_VCC3.3V
VCC3.3V
23 L302
CIC21J601
22
21
VCC3.3V AVDD_XO_+3.3V
3.3uH
20 L303
C301
10uF
19 16V
3216
18
17 VCC2.5V VDD_+2.5V_RxicM
3.3uH
16 L304
VCC3.3V VCC1.8VH
IC301
C302
AZ1117R-1.8TRE1
10uF
L311 SOT89_3PIN
15 16V
3216 CIC21J601
INPUT 3 2 OUTPUT
1
C310 C311 ADJ/GND
10uF 10uF C312
14 16V 16V 10uF
3216 3216 16V
3216
13
12 L312 L308
CIC21J601 CIC21J601
C309 C306
4.7uF 4.7uF
11 10V 2012
2012 10V
10
8 L310 L309
CIC21J601 CIC21J601
C308 C307
4.7uF 4.7uF
7 2012 2012
10V 10V
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Power 3 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
1.4V/3.5A 1.0V/3A
VCC1.4V VCC1.0V
25
VCC5V VCC5V
24
NR8040T2R0N
NR8040T2R0N
C408 C407
R412
1005
R413
R402
R409
C426 C418
1005
1005
1005
10K
10K
22uF 47uF 10uF 47uF
10
10
L404
L403
10 1005
22pF 1005
10 1005
22pF 1005
2uH
10V 6.3V 16V 6.3V
2uH
23
3216 7343
R420
R419
VCC5V 7343 VCC5V 3216
C421
C422
R421 C423 R422 C424
PVIN2
PGND2
PVIN2
PGND2
21
PH3
PH2
PH1
PH3
PH2
PH1
1.2pF 1.2pF
20
19
18
17
16
20
19
18
17
16
C415 1005 C420 1005
PVIN1 1 15 PGND1 PVIN1 1 15 PGND1
R406 10K 1005 ISET SYNC/EN R417 10K 1005 ISET SYNC/EN
20 2 14 2 14
SS IC402 AGND 0.047uF SS IC401 AGND
3 13 3 13
C411 0.047uF SC4624MLTRT C401 1005 SC4624MLTRT
FS 4 12 VCC_2 FS 4 12 VCC_2
R415 1005 R418 47K 1005
12K VCC_1 FB VCC_1 FB
5 11 C412 5 11
19 C402
1uF
10
10
1uF
9
10V 10V
C414 1608 C419 1608
PGOOD
NC_1
NC_2
NC_3
COMP
PGOOD
NC_1
NC_2
NC_3
COMP
VCC5V VCC5V
10uF 10uF
AGND0 16V AGND1 16V
18 3216 3216
R414
1005
R403
1005
10K
10K
AGND1
AGND0
270pF
C416
C404
330pF
1608 C409
C413 C406
3.3pF C403
1000pF 2.7pF
VCC1.4V 1000pF VCC1.0V
R411
1005
R404
17 1608
1005
1005
18K
30K
1005 1005
R416 R410
24.9K1% 24.9K
1005 1005
R407 R408
1.8K C410 1.2K C405
16
1608 220pF 1005 270pF
1608
R401
1005
R405
20K
10K
1%
15 L405 L406
CIC21J601 CIC21J601
14
AGND0 AGND1
13
12
3.3V/2A 2.5V/2A
11 IC403 VCC3.3V IC404 VCC2.5V
SC4215ISTRT SC4215ISTRT
VCC5V VCC3.3V
4 5 L407 4 5 L408
NC_2 NC_3 NC_2 NC_3
10 CIC21J601 CIC21J601
3 6 3 6
VIN VO VIN VO
15K
1/10W
1%
R424
R423 2 7 R426 2 7
EN ADJ EN ADJ
C427 C428 4.7K C425 C417 C431 C430 4.7K C432 C429
9
0.1uF 22uF 0.1uF 47uF 0.1uF 22uF 0.1uF 47uF
16V 10V 1 8 16V 6.3V 16V 10V 1 8 16V 6.3V
NC_1 GND NC_1 GND
4.7K
1/10W
1%
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Power Supply1 4 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
25
24
23
22
21
20
VCC1.0V(RF) VCC1.2V VCC1.4V
19 IC501 VCC5V
SC338IMSTRT
Q501
DRV1 IN SI4804BDY
1 10
18 C503 C513 C514
4.7uF 0.1uF 47uF
VCC3.3V ADJ1 DRV2 S1 D1_2
2 9 1 8 10V 16V 6.3V
@compC 2012 1005 7343
R507 EN1 ADJ2 G1 D1_1
3 8 2 7
17 4.7K VCC3.3V
1005 R508
PGD1 EN2 S2 D2_2
4 7 3 6
R509
R503
1005
1005
R505 4.7K
4.7K 1005
2K
2K
1005 GND PGD2 G2 D2_1
5 6 4 5
16 R506 C506 C504
4.7K 0.01uF 0.01uF
1005
25V 25V
C505 1005 1005
R501
1005
1%
15K
0.1uF
R504
1005
16V
12K
1%
1005
15
R502
C512
1005
10K
1uF 10uF 0.1uF 47uF
1%
R510
6.3V 6.3V 16V
1005
6.3V
10K
1%
C510 C508 C509 1005 1608 1005 7343
14 C511
1uF 10uF 0.1uF 47uF
6.3V 6.3V 16V 6.3V
1005 1608 1005 7343
13
12
11
10
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Power Supply2 5 13
A B C D E F G H I J L M N O P X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
25
24
23
22
21
20
19 IC601
SB9121
Baseband I/F
R22
ADCI_P BBOUTI_P 2:N14
R21
18 ADCI_N BBOUTI_N 2:N15
U21
ADCQ_P BBOUTQ_P 2:N14
U22
ADCQ_N BBOUTQ_N 2:N14
L22
17 DACI_P BBINI_P 2:N16
Analog
L21
DACI_N BBINI_N 2:N16
N21
DACQ_P BBINQ_P 2:N15
N22
DACQ_N BBINQ_N 2:N15
N19
PCLK_P PCLK_P 2:AA15
M19
PCLK_N PCLK_N 2:AA14
R601
H19 3.01K
REFRES
1005
1%
E20
XOEN XO_EN 2:V22;2:AL12
D20
STBY RFMODE_STBY 2:V22
F20
HSDOUT HSDOUT 2:U22
D21
HSD3_P HSD3_P 2:T22
D22
HSD3_N HSD3_N 2:T22
Digital
E21
HSD2_P HSD2_P 2:T22
E22
HSD2_N HSD2_N 2:T22
F21
HSD1_P HSD1_P 2:S22
F22
HSD1_N HSD1_N 2:T22
G21
HSD0_P HSD0_P 2:S22
G22
HSD0_N HSD0_N 2:S22
H21
HSCLK_P HSCLK_P 2:S22
H22
HSCLK_N HSCLK_N 2:S22
J21
HSCS_P HSCS_P 2:R22
J22
HSCS_N HSCS_N 2:R22
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BBIC IF 6 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
25 X701 VCC3.3V
27MHz
X-TAL_1 GND_2
1 4
VCC3.3V GND_1 X-TAL_2
2 3
R708
4.7K
R709
4.7K
1005
1005
R707
4.7K
IC702
OPT
1005
VCC3.3V
CDCE925PWR
23
R720
4.7K XIN/CLK XOUT
1 16
1005 VCC1.8VH
OPT S0 S1/SDA
2 15 GPIO6 9:I14
C711
R701
4.7K
1005
R705
4.7K
R702
4.7K
1005
L701
1005
22 IC701 4.7uF
6.3V CIC21J601
AD5622BKSZ-2500RL7 VDD S2/SCL
3 14 GPIO5 9:I14
R703 R704
ADDR VOUT 1K VCTR Y1 47
1 6 4 13 VCLK_IN K17
21 1005 1005
C714 C715
SCL GND VCC3.3V GND_1 GND_2 150pF 150pF
2 5 VCC3.3V 5 12
C702 50V 50V
R706
1.2K
L703
1005
CIC21J601 1nF OPT
SDA VDD C713 C705 VDDOUT_1 Y2
3 4 50V 6 11
4.7uF 0.1uF
1005 6.3V 16V
20
1005 Y4 Y3 VCC3.3V
C703 7 10
C701
0.1uF 0.1uF
16V 16V Y5 VDDOUT_2
1005 1005 8 9
19
IC601
SB9121
1005
R721
22
C704
Clock Recovery 0.1uF
16V
C10 1005
VDAC_SDA VCLK_27 K17
18
A9
VDAC_SCL
C11
17 VCLK27 VCLK_27 Z18
B9
VCLK VCLK_IN AF21
B13
ACLK ACLK_IN AF9
A13
ACLK27 ACLK_27 Z6
A14 X702
ADAC_SDA VCC3.3V
27MHz
X-TAL_1 GND_2
C13 1 4
ADAC_SCL
VCC3.3V GND_1 X-TAL_2
2 3
MAIN: SUNNY / SUB: PARTRON
R713
4.7K
1005
R714
4.7K
1005
R717
4.7K
1005
IC704
OPT
VCC3.3V
CDCE925PWR
R719
4.7K XIN/CLK XOUT
1 16
1005
OPT VCC1.8VH
S0 S1/SDA
2 15 GPIO4 9:I14
C712 L702
R716
4.7K
R710
4.7K
R715
4.7K
1005
1005
1005
IC703 1uF
6.3V CIC21J601
AD5622BKSZ-2500RL7 VDD S2/SCL
3 14 GPIO3 9:I14
R711 R718
ADDR VOUT 14K VCTR Y1 22
1 6 4 13 ACLK_IN K15
1005 1005
SCL GND GND_1 GND_2
R712
1005 1005
OPT VCC3.3V
16K
2 5 VCC3.3V 5 12
1%
L704 C708
CIC21J601 0.1uF
SDA VDD C707 VDDOUT_1 Y2
R723
1K
16V C716
3 4 6 11
1%
1005 4.7uF 0.1uF
6.3V 16V
1005 Y4 Y3
7 10 VCC3.3V
C709 C706
0.1uF 0.1uF
16V 16V Y5 VDDOUT_2
1005 1005 8 9
C710
1005
R722
22
0.1uF
16V
1005
ACLK_27 K15
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BBIC Clock Recovery 7 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
IC601
SB9121
Audio I/O
P1
SPDIFO TP804
M3
SD3 TP805
C12 M2
TP803 CLK27 SD2 TP806
M1
SD1 TP807
L1
SD0 AUDIO_SD0 12:E17
AR806 22 2010_A4
L3
MCLKO AUDIO_MCLK 12:E17
N2
LRCK AUDIO_WS 12:E16
N1
SCK AUDIO_SCLK 12:E16
P2
MUTE TP808
IC601
SB9121
Video Out
K1 AR801 47 2010_A4
D35 VIDEO_D35 12:S14
K2
D34 VIDEO_D34 12:S15
K3
D33 VIDEO_D33 12:S15
J1
D32 VIDEO_D32 12:S15
J2 AR802 47 2010_A4
D31 VIDEO_D31 12:S15
J3
D30 VIDEO_D30 12:S15
H1
D29 VIDEO_D29 12:S16
H2
D28 VIDEO_D28 12:S16
H3 AR803 47 2010_A4
D27 VIDEO_D27 12:S17
G1
D26 VIDEO_D26 12:S17
G2
D25 VIDEO_D25 12:S17
G3
D24 2010_A4 VIDEO_D24 12:S17
F1 AR804 47
D23 VIDEO_D23 12:S17
F2
D22 VIDEO_D22 12:S18
F3
D21 VIDEO_D21 12:S18
E1
D20 VIDEO_D20 12:S18
E2 AR805 47 2010_A4
D19 VIDEO_D19 12:S18
E3
D18 VIDEO_D18 12:N23
D1
D17 VIDEO_D17 12:N23
D2
D16 VIDEO_D16 12:N23
D3 AR811 47 2010_A4
D15 VIDEO_D15 12:M23
C1
D14 VIDEO_D14 12:M23
C3
D13 VIDEO_D13 12:M23
A3
D12 VIDEO_D12 AA6;12:M23
C4 AR807 47 2010_A4
D11 VIDEO_D11 12:M23
B4
D10 VIDEO_D10 12:L23
A4
D9 VIDEO_D09 12:L23
C5
ODCK R804 47
B5
D8 VIDEO_CLK 12:L23
A5
D7 AR808 47 2010_A4
C6 VIDEO_D08 12:K23
D6 C800
B6 VIDEO_D07 12:K23
D5 150pF
A6 VIDEO_D06 12:K23 50V OPT
D4
C7 VIDEO_D05 12:K23
D3 AR809 47 2010_A4
B7 VIDEO_D04 12:K23
D2
A7 VIDEO_D03 U6;12:J23
D1
C8 VIDEO_D02 P6;12:J23
D0
B8 VIDEO_D01 12:J23
DE AR810 47 2010_A4
A8 VIDEO_D00 12:J23
HSYNC
C9 VIDEO_DE 12:E18
VSYNC
VIDEO_HSYNC 12:E18
VIDEO_VSYNC 12:E18
Note Special Routing
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BBIC Audio/Video Output 8 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
25
24
23
VCC3.3V
22
VCC3.3V
IC901
R906
4.7K
1005
MX25L1605DM2I-12G
21 VCC3.3V
CS# VCC C902
1 8 0.1uF
16V
SO/SIO1 HOLD# 1005
2 7
20 VCC3.3V
WP#/AGC SCLK
R920
1005
3 6
IC601
1005
R916
4.7K
1005
R915
4.7K
1005
R914
4.7K
R913
4.7K
1005
0
SB9121 GND SI/SIO0
4 5
19 Control
L2 Y6
TP903 RSVD_1 CS1
N3 AA4 SPI_CS0N @compC
TP904 RSVD_2 CS0 TP902
V3 Y4
RSVD_3 SDI
VCC3.3V W2 Y5
18 RSVD_4 SDO
W3 AA5
RSVD_5 SCLK
Y2
RSVD_6
Y3
RSVD_7
AA8
TP905 RSVD_8
R903
4.7K
1005
AB7 AB6
17 TP906 RSVD_9 SCL I2C_SCL 12:N7;12:Z14;13:W14;13:AH10
AA7
I2C_SDA 12:N7;12:Z14;13:W14;13:AH10
R923
4.7K
R925
4.7K
1005
R926
4.7K
R924
4.7K
SDA
1005
1005
1005
R927
4.7K
R928
4.7K
1005
R930
4.7K
R929
4.7K
R934
4.7K
R932
4.7K
1005
R931
4.7K
R933
4.7K
1005
1005
1005
1005
1005
1005
R935
4.7K
1005
Y8
I2CSEL
AB5
INT BB_INTN 13:W16;13:AH9
B11 Y7
TP907 GPIO[15] VSS_130 R909 4.7K 1005
A11
16 TP910 GPIO[14] R908 OPT 4.7K 1005
A10
TP909 GPIO[13] OPT 4.7K 1005
B10 R907
TP908 GPIO[12]
B15 R922 4.7K 1005
TP911 GPIO[11]
C14
TP913 GPIO[10] ADDR = 0xBx
A15
R911
4.7K
1005
GPIO[9]
OPT
15 TP912
B14
TP914 GPIO[8] VCC3.3V
Y9
TP915 GPIO[7]
AB8 B12 ADDR = 0xAx
7:AF22 GPIO6 GPIO[6] SXTALI
AA9 A12
7:AF22 GPIO5 GPIO[5] SXTALO
Y10
7:AF10 GPIO4 GPIO[4]
14 AB9 R919
7:AF10 GPIO3 GPIO[3]
AA10 1M 1%
VCC3.3V GPIO[2]
AB10 1005
GPIO[1]
Y11
300 1% 1K 1%
R921 R910
1005
GPIO[0]
13
1005
R936
4.7K AA6 X901
RST#
1005 3.68MHz
12 C904
3.3nF C901 C903
13:L9;13:AH8 BB_RSTN 50V 30pF 30pF
1005 1005
11
Crystal matching
27pF -> 30pF
10
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BBIC Control 9 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
25
24
23
22
IC601
SB9121
21
Misc
R4 C15
VSS_97 NC_11
P4 A16
VSS_83 NC_1
B16
NC_6
C16
20 NC_12
R1 A17
VSS_94 NC_2
R2 B17
VSS_95 NC_7
P3 C17
VSS_82 NC_13
T1 A18
VSS_108 NC_3
U1 B18
19 VSS_120 NC_8
T2 C18
VSS_109 NC_14
R3 A19
VSS_96 NC_4
V1 B19
VSS_123 NC_9
U2 C19
VSS_121 NC_15
W1 A20
18 VSS_125 NC_5
VCC3.3V B20
NC_10
C20
NC_16
T3 U20
VDDIO_26 NC_20
V2 V20
VDDIO_27 NC_21
Y1 W22
17 VDDIO_28 NC_24
U3 W21
VSS_122 NC_23
W20
NC_22
Y22
NC_36
NC_35
Y21 Interface is NC
M20 Y20
16 NC_17 NC_34
Y19
NC_33
AA19
NC_44
Y18
NC_32
L19 AA18
VSSA_11 NC_43
AB18
15 NC_52
Y17
NC_31
AA17
NC_42
K19 AB17
VSSA_7 NC_51
Y16
NC_30
AA16
14 NC_41
AB16
NC_50
T20 Y15
NC_19 NC_29
AA15
NC_40
AB15
NC_49
Y14
13 NC_28
R19 AA14
NC_18 NC_39
AB14
NC_48
Y13
NC_27
AA11 AA13
VSS_135 NC_38
W12 AB13
12 VSS_128 NC_47
Y12
NC_26
AA12
NC_37
AB12
NC_46
AB11
NC_45
11
10
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BBIC Misc 10 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
VCC1.0V(RF)
26
IC601 L1103
SB9121 VCC1.0V 120-ohm
11
VCC1.0V
10
C1122 C1124 C1123 C1128 C1121 C1127 C1130 C1126 C1129 C1125
10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
6.3V 16V 16V 16V 16V 16V 16V 16V 16V 16V
9 1608 1005 1005 1005 1005 1005 1005 1005 1005 1005
8
VCC1.0V
7
C1137 C1139 C1138 C1131 C1136 C1134 C1135 C1132 C1133 C1140
10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
6.3V 16V 16V 16V 16V 16V 16V 16V 16V 16V
1608 1005 1005 1005 1005 1005 1005 1005 1005 1005
VCC1.0V
C1143 C1141 C1146 C1145 C1144 C1142 C1150 C1151 C1148 C1149 C1147
10uF 10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
6.3V 10V 16V 16V 16V 16V 16V 16V 16V 16V 16V
4 1608 2012 1005 1005 1005 1005 1005 1005 1005 1005 1005
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BBIC Power/Ground 11 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
26
8:X12;8:AA6
8:P6;8:X9
8:U6;8:X9
8:AB10
8:X10
8:X10
8:X10
8:X10
8:X11
8:X11
8:X11
8:X12
8:X12
8:X12
8:X12
8:X13
8:X13
8:X9
8:X9
8:X9
25
VIDEO_D00
VIDEO_D01
VIDEO_D02
VIDEO_D03
VIDEO_D04
VIDEO_D05
VIDEO_D06
VIDEO_D07
VIDEO_D08
VIDEO_CLK
VIDEO_D09
VIDEO_D10
VIDEO_D11
VIDEO_D12
VIDEO_D13
VIDEO_D14
VIDEO_D15
VIDEO_D16
VIDEO_D17
VIDEO_D18
24
D1201 D1202
RCLAMP0524P RCLAMP0524P
23 IOVCC3.3V
20
C1205 C1201 C1207
0.1uF 10uF 0.1uF
16V 16V 16V
IOVCC33_4
1005 3216 1005
CVCC18_5
CVCC18_4
L11 Tx_2+ JK1
GND_5
GND_4
IDCK
19 YKF45-7060V
D10
D11
D12
D13
D14
D15
D16
D17
D18
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
L11 Tx_2-
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
DE D19 1
8:X8 VIDEO_DE 1 75 VIDEO_D19 8:X13
HSYBC 2 74 D20 L11 Tx_1+
8:X8 VIDEO_HSYNC VIDEO_D20 8:X13 2
18 VSYNC D21
8:X8 VIDEO_VSYNC 3 73 VIDEO_D21 8:X13
SPDIF D22 3
TP1201 4 72 VIDEO_D22 8:X14 K11 Tx_1-
MCLK 5 71 D23
8:X20 AUDIO_MCLK VIDEO_D23 8:X14 4
SD3 6 70 D24
TP1202 VIDEO_D24 8:X14 5
SD2 7 69 D25
TP1203 VIDEO_D25 8:X14 K11 Tx_0+
17 SD1 D26
AUDIO_SD0
TP1204
SD0
8
9
IC1201 68
67 D27
VIDEO_D26 8:X14
VIDEO_D27 8:X15
6
8:X20 7
WS 10 66 IOVCC33_3 K11 Tx_0-
8:X20
8:X19
AUDIO_WS
AUDIO_SCLK
SCK 11 SIL9134CTU 65 GND_3 8
CVCC18_1 12 64 CVCC18_3
16 GND_1 D28 9
13 63 VIDEO_D28 8:X15 J11 Tx_CLK+
IOVCC33_1 14 62 D29
VIDEO_D29 8:X15 10
DCLK 15 61 D30
VIDEO_D30 8:X15 11
DR0 16 60 D31 J11 Tx_CLK-
VIDEO_D31 8:X15
DL0 17 59 D32
VIDEO_D32 8:X16 R1221
12
15 VCC3.3V DR1 D33
18 58 VIDEO_D33 8:X16 R1203 OPT 0 HDMI_CEC CEC
DL1 D34 13:W12 I2C_SCL1 13:U14 UART0_TXD 13
19 57 VIDEO_D34 8:X16 0 1005 1005
DR2 20 56 D35 R1220
VIDEO_D35 8:X16 9:AA17;N7;13:W14;13:AH10 I2C_SCL 13:U14 UART0_RXD 14
1005 R1222
R1201
DL2 CVCC18_2 0
R1213
21 55 SCL
4.7K
4.7K
1005
0
OPT
1005
R1205
0 1005
R1206
R1214
1005
1005
C1213 Tx_HPD
4.7K
4.7K
4.7K
1005
19
OPT
13 S13 Tx_HPD
AGND_1
EXT_SWG
PVCC1
AGND_2
TXC-
TXC+
AVCC18_1
TX0-
TX0+
AGND_3
TX1-
TX1+
AVCC18_2
TX2-
TX2+
AGND_4
PVCC2
AGND_5
AVCC33
DDCPWR5V
DSCL
DSDA
CSCL
CSDA
CI2CA
3.3nF
50V VCC3.3V
ESD 20
AVCC1.8V BODY_SHIELD
1K 1005
Stuff Option
R1202
OPT
12
CIC21J601
R1207
11 1608 1005
C1210 1%
0.1uF
16V
PVCC1.8V 1005
VCC3.3V
Tx_CLK-
Tx_CLK+
Tx_0-
Tx_0+
Tx_1-
Tx_1+
Tx_2-
Tx_2+
10
OPT
R1209 4.7K 1005
R1208 OPT 4.7K 1005
C1203 C1204
10uF 0.1uF R1212 4.7K 1005
10V 16V
Z15
Z16
Z17
Z17
Z18
Z18
Z19
Z19
AVCC1.8V
8
0 1005
0 1005
R1224
R1223
C1211 C1206
10uF 0.1uF
10V 16V
7 2012 1005
Tx_SCL
Tx_SDA
I2C_SCL
I2C_SDA
6
Z14
Z14
9:AA17;Z14;13:W14;13:AH10
9:AA17;Z14;13:W14;13:AH10
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.02.03
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. HTMI Tx 12 13
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO
29
28
27
VCC5V
26
UBW3216-121
L1301
25
P1302
12507WS-08L
24
R1310
LD1303 1005
1K
1
SML-201MT
VCC3.3V
2
23
R1302
1005
3
0
R1309
OPT
4
22 0 C1307 C1308 C1306 C1304
1005 0.1uF 0.1uF 150uF 150uF
6.3V 6.3V 5
7343 7343
6
21
SML-201MT C1303
C1302
22uF
R1305 LD1302 0.1uF 8
470 1005 10V
20 3216
1005 9
LD1301
R1307 SML-201MT
0 1005
R1303
470
PMWR/OC5/IC5/CN13/RD4
19 1005
PMRD/CN14/RD5
VCAP/VDDCORE
VCC3.3V
18
PMD4/RE4
PMD3/RE3
PMD2/RE2
PMD1/RE1
PMD0/RE0
CN16/RD7
CN15/RD6
OC4/RD3
OC3/RD2
OC2/RD1
ENVREG
RF1
RF0
DETECT AH7
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
17 VCC3.3V
PMD5/RE5 1 48 SOSCO/T1CK/CN0/RC14
TP1303
PMD6/RE6 47 SOSCI/CN1/RC13 R1325
2
4.7K 1005
PMD7/RE7 OC1/RD0
R1324
4.7K 1005
4.7K 1005
4.7K 1005
4.7K 1005
4.7K 1005
4.7K 1005
MCLR 7 42 IC1/RTCC/INT1/RD8
PIC32MX340F256H
R1306
R1301
R1320
R1321
R1311
R1308
AH13 /MCLR TP1302
PMA2/SS2/CN11/RG9 8 41 VSS_3
VSS_1 9 40 OSC2/CLKO/RC15
15 VDD_1 39 OSC1/CLKI/RC12
10
C1IN+/AN5/CN7/RB5 11 38 VDD_3 R1315
VCC3.3V 0 1005
C1IN-/AN4/CN6/RB4 12 37 SCL1/RG2
I2C_SCL 9:AA17;12:N7;12:Z14;AH10
C2IN+/AN3/CN5/RB3 13 36 SDA1/RG3
I2C_SDA 9:AA17;12:N7;12:Z14;AH10
C2IN-/AN2/SS1/CN4/RB2 14 35 U1RTS/BCLK1/SCK1/INT0/RF6 R1316
14 0 1005
PGC1/EMUC1/AN1/VREF-/CVREF-/CN3/RB1 15 34 U1RX/SDI1/RF2
UART0_RXD 12:AH14
PGD1/EMUD1/PMA6/AN0/VREF+/CVREF+/CN2/RB0 16 33 U1TX/SDO1/RF3
UART0_TXD 12:AH15 P1301
12507WS-15L
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PGC2/EMUC2/AN6/OCFA/RB6
PGD2/EMUD2/AN7/RB7
AVDD
AVSS
U2CTS/C1OUT/AN8/RB8
PMA7/C2OUT/AN9/RB9
TMS/CVREFOUT/PMA13/AN10/RB10
TDO/PMA12/AN11/RB11
VSS_2
VDD_2
TCK/PMA11/AN12/RB12
TDI/PMA10/AN13/RB13
PMALH/PMA1/U2RTS/BCLK2/AN14/RB14
PMALL/PMA0/AN15/OCFB/CN12/RB15
PMA9/U2RX/SDA2/CN17/RF4
PMA8/U2TX/SCL2/CN18/RF5
13
M9 UART1_TXD 4
11 R1304
1M 1005
L9 UART1_RXD 5
4.7K 1005
4.7K 1005
R1322
R1323
C1301 C1305
13pF 13pF 6
50V 50V 9:AA17;12:N7;12:Z14;W14 I2C_SCL
10
0 1005
0 1005
R1312
R1319
9:AA17;12:N7;12:Z14;W14 I2C_SDA 7
RB6/AN6
RB7/AN7
Crystal matching
22pF -> 13pF 12:E14;W16 HDMI_INTN 8
9
9:AA16;W16 BB_INTN 9
HDMI_RSTN
BB_RSTN
UART1_RXD
UART1_TXD
10
AH12
AH12
12:E13;L9 HDMI_RSTN
8
9:N12;L9 BB_RSTN 11
12:E13;AH8
9:N12;AH8
AH11
AH11
Q17 DETECT 12
7
13
14
6
15
16
2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS W-TV Rx 2009.03.21
1
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. uController 13 13