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Transistors

2SC2377
Silicon NPN epitaxial planar type

For high-frequency amplification Unit: mm

6.9±0.1 2.5±0.1
(1.0)
■ Features (1.5)

(0.4)

(1.0)
(1.5)
• Optimum for RF amplification of FM/AM radios
• High transition frequency fT

3.5±0.1

4.5±0.1
R 0.9
• M type package allowing easy automatic and manual insertion R 0.7

2.0±0.2
as well as stand-alone fixing to the printed circuit board

4.1±0.2
2.4±0.2
1.0±0.1
■ Absolute Maximum Ratings Ta = 25°C (0.85) 0.45±0.05
0.55±0.1

1.25±0.05
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 30 V
Collector-emitter voltage (Base open) VCEO 20 V 3 2 1
1: Base
(2.5) (2.5)
Emitter-base voltage (Collector open) VEBO 3 V 2: Collector
3: Emitter
Collector current IC 15 mA
M-A1 Package
Collector power dissipation PC 200 mW
Junction temperature Tj 150 °C
Storage temperature Tstg −55 to +150 °C

■ Electrical Characteristics Ta = 25°C ± 3°C


Parameter Symbol Conditions Min Typ Max Unit
Base-emitter voltage VBE VCB = 6 V, IE = −1 mA 720 mV
Collector-base cutoff current (Emitter open) ICBO VCB = 10 V, IE = 0 100 nA
Collector-emitter cutoff current (Base open) ICEO VCE = 20 V, IB = 0 10 µA
Emitter-base cutoff current (Collector open) IEBO VEB = 3 V, IC = 0 1 µA
Forward current transfer ratio * hFE VCB = 6 V, IE = −1 mA 65 260 
Transition frequency fT VCB = 6 V, IE = −1 mA, f = 100 MHz 450 650 MHz
Noise figure NF VCB = 6 V, IE = −1 mA, f = 100 MHz 3.3 5.0 dB
Power gain GP VCB = 6 V, IE = −1 mA, f = 100 MHz 20 24 dB
Reverse transfer capacitance Cre VCB = 6 V, IE = −1 mA, f = 10.7 MHz 0.8 1.0 pF
(Common emitter)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank C D
hFE 65 to 160 100 to 260

Publication date: January 2003 SJC00113BED 1


2SC2377

PC  Ta IC  VCE IC  I B
250 12 12
Ta = 25°C Ta = 25°C
Collector power dissipation PC (mW)

IB = 100 µA
10 10
200 VCE = 10 V

Collector current IC (mA)


Collector current IC (mA)
80 µA 6V
8 8
150
60 µA
6 6

100
40 µA
4 4

50 20 µA
2 2

0 0 0
0 20 40 60 80 100 120 140 160 0 4 8 12 16 0 40 80 120 160
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V) Base current IB (µA)

IC  VBE VCE(sat)  IC hFE  IC


30 100 360
IC / IB = 10
Collector-emitter saturation voltage VCE(sat) (V)

VCE = 6 V VCE = 6 V

25°C
25 300

Forward current transfer ratio hFE


Collector current IC (mA)

10
Ta = 75°C −25°C
20 240

Ta = 75°C
15 1 180
25°C

−25°C
10 120
25°C Ta = 75°C
0.1
5 −25°C 60

0 0.01 0
0 0.4 0.8 1.2 1.6 2.0 0.1 1 10 100 0.1 1 10 100
Base-emitter voltage VBE (V) Collector current IC (mA) Collector current IC (mA)

fT  I E Zrb  IE Cre  VCE


1 200 120 2.4
Ta = 25°C IC = 1 mA
f = 2 MHz f = 10.7 MHz
Ta = 25°C Ta = 25°C
Cre (pF)
Reverse transfer impedance Zrb (Ω)

1 000 100 2.0


Transition frequency fT (MHz)

VCB = 10 V
Reverse transfer capacitance

800 80 1.6
6V

1.2
(Common emitter)

600 60

400 40 0.8

200 20 VCE = 6 V 0.4

10 V
0 0 0
− 0.1 −1 −10 −100 − 0.1 −1 −10 0.1 1 10 100
Emitter current IE (mA) Emitter current IE (mA) Collector-emitter voltage VCE (V)

2 SJC00113BED
2SC2377

Cob  VCB GP  IE NF  IE
1.2 40 12
IE = 0 f = 100 MHz
C (pF)

f = 100 MHz
f = 1 MHz Rg = 50 Ω Rg = 50 kΩ
Ta = 25°C 35 Ta = 25°C Ta = 25°C
(Common base, input open circuited) ob

1.0 10
30
VCE = 10 V

Noise figure NF (dB)


Power gain GP (dB)
0.8 8
25 6V
Collector output capacitance

0.6 20 6

15
0.4 4 VCE = 6 V, 10 V

10
0.2 2
5

0 0 0
0 5 10 15 20 25 30 − 0.1 −1 −10 −100 − 0.1 −1 −10 −100
Collector-base voltage VCB (V) Emitter current IE (mA) Emitter current IE (mA)

bie  gie bre  gre bfe  gfe


20 0 0
yie = gie + jbie 150 10.7 10.7
yre = gre + jbre − 0.4 mA 25
VCE = 10 V −4 mA 25
18
−7 mA VCE = 10 V −1 mA 58

Forward transfer susceptance bfe (mS)


Reverse transfer susceptance bre (mS)

100
100 −1 −20
16 −1 mA 150
−4 mA
Input susceptance bie (mS)

−2 mA IE = −7 mA −2 mA
14
100 −2 −40 −4 mA
58 150 100
12
f = 150 MHz 58
58
−60
IE = − 0.5 mA

10 −1 mA −3
IE = −7 mA
8 100
58 −4 100 −80
6
25
4 25 −5 −100
2 yfe = gfe + jbfe
f = 10.7 MHz VCE = 10 V
f = 150 MHz
0 −6 −120
0 3 6 9 12 15 − 0.5 − 0.4 − 0.3 − 0.2 − 0.1 0 0 20 40 60 80 100
Input conductance gie (mS) Reverse transfer conductance gre (mS) Forward transfer conductance gfe (mS)

boe  goe
1.2
−1 mA
IE = − 0.5 mA

150
−2 mA
1.0
−4 mA
Output susceptance boe (mS)

100

0.8
−7 mA

0.6
58

0.4
25
0.2
f = 10.7 MHz yoe = goe + jboe
VCE = 10 V
0
0 0.1 0.2 0.3 0.4 0.5
Output conductance goe (mS)

SJC00113BED 3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL
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