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Features
11A, 200V rDS(ON) = 0.500 Single Pulse Avalanche Energy Rated SOA is Power Dissipation Limited Nanosecond Switching Speeds Linear Transfer Characteristics High Input Impedance Related Literature - TB334, Guidelines for Soldering Surface Mount Components to PC Boards
Ordering Information
PART NUMBER IRF9640 RF1S9640SM PACKAGE TO-220AB TO-263AB BRAND IRF9640 RF1S9640
Symbol
D
NOTE: When ordering, use the entire part number. Add the suffix 9A to obtain the TO-263AB variant in the tape and reel, i.e., RF1S9640SM9A.
Packaging
JEDEC TO-220AB
SOURCE DRAIN GATE DRAIN (FLANGE) GATE SOURCE
JEDEC TO-263AB
DRAIN (FLANGE)
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright Intersil Corporation 1999
IRF9640, RF1S9640SM
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specied IRF9640, RF1S9640SM -200 -200 -11 -7 -44 20 125 1 790 -55 to 150 300 260 UNITS V V A A A V W W/oC mJ oC
oC oC
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single Pulse Avalanche Energy Rating (Note 3, 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specication is not implied.
Electrical Specications
PARAMETER Drain to Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current On-State Drain Current (Note 2) Gate to Source Leakage Current
TC = 25oC, Unless Otherwise Specied SYMBOL BVDSS VGS(TH) IDSS ID(ON) IGSS rDS(ON) gfs td(ON) tr td(OFF) tf Qg(TOT) Qgs Qgd CISS COSS CRSS LD Measured From the Contact Screw on Tab To Center of Die Measured From the Drain Lead, 6mm (0.25in) from Package to Center of Die Modified MOSFET Symbol Showing the Internal Devices Inductances
D LD
TEST CONDITIONS ID = -250A, VGS = 0V (Figure 10) VGS = VDS, ID = -250A VDS = Rated BVDSS, VGS = 0V VDS = 0.8 x Rated BVDSS, VGS = 0V, TC = 125oC VDS > ID(ON) x rDS(ON)MAX, VGS = -10V VGS = 20V ID = -6A, VGS = -10V (Figures 8, 9) VDS > ID(ON) x rDS(ON)MAX, ID = -6A (Figure 12) VDD = 0.5 x Rated BVDSS, ID -11A, RG = 9.1 VGS = -10V (Figures 17, 18) RL = 8.4 for VDSS = -100V RL = 6.1 for VDSS = -75V MOSFET Switching Times are Essentially Independent of Operating Temperature VGS = -10V, ID = -11A, VDS = 0.8 x Rated BVDSS Ig(REF) = -1.5mA (Figures 14, 19, 20) Gate Charge is Essentially Independent of Operating Temperature VDS = -25V, VGS = 0V, f = 1MHz (Figure 11)
UNITS V V A A A nA S ns ns ns ns nC nC nC pF pF pF nH
Drain to Source On Resistance (Note 2) Forward Transconductance (Note 2) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge (Gate to Source + Gate to Drain) Gate to Source Charge Gate to Drain Miller Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Internal Drain Inductance
4.5
nH
LS
Measured From the Source Lead, 6mm (0.25in) from Header to Source Bonding Pad
G LS S
7.5
nH
1.0 62.5
oC/W oC/W
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IRF9640, RF1S9640SM
Source to Drain Diode Specications
PARAMETER Continuous Source to Drain Current Pulse Source to Drain Current (Note 3) SYMBOL ISD ISDM TEST CONDITIONS Modified MOSFET Symbol Showing the Integral Reverse P-N Junction Diode
G D
MIN -
TYP -
UNITS A A
Source to Drain Diode Voltage (Note 2) Reverse Recovery Time Reverse Recovery Charge NOTES:
TJ = 25oC, ISD = -11A, VGS = 0V (Figure 13) TJ = 150oC, ISD = -11A, dISD/dt = 100A/s TJ = 150oC, ISD = -11A, dISD/dt = 100A/s
300 1.9
-1.5 -
V ns C
2. Pulse Test: Pulse width 300s, duty cycle 2%. 3. Repetitive Rating: Pulse width limited by Max junction temperature. See Transient Thermal Impedance curve (Figure 3). 4. VDD = 50V, starting TJ = 25oC, L = 9.8mH, RG = 25, peak IAS = 11A. See Figures 15, 16.
-15
-10
-5
1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 10-4 10-3 10-2 10-1 t 1, RECTANGULAR PULSE DURATION (s) t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 1 10 PDM
0.01 10-5
4-35
-50
VGS = -11V
VGS = -10V PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = -9V VGS = -8V
-10
10s
-40
-30
-1 TC = 25oC
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) TJ = MAX RATED SINGLE PULSE
-20
DC
-10
-0.1 -1
0 -10 -1000 0 -10 -20 -30 -40 VDS, DRAIN TO SOURCE VOLTAGE (V)
-20
-16
PULSE DURATION = 80s VGS = -10V DUTY CYCLE = 0.5% MAX VGS = -9V
VDS I D(ON) x rDS(ON) PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
-4
VGS = -10V, ID = -6A PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
VGS = -10V 0.6 0.5 0.4 0.3 VGS = - 20V 0.2 0 0 -15 -30 -45 -60 -75 ID, DRAIN CURRENT (A)
2.0
1.5
1.0
0.5
NOTE:
Heating effect of 5s pulse is minimal. FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
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2000 VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS CDS + CGD CISS
1200
800
400
COSS CRSS
-40
40
80
120
160
10
20
30
40
50
10
-100 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX TJ = -55oC TJ = 25oC TJ = 125oC ISD, DRAIN CURRENT (A)
-0.1 0 -10 -20 -30 -40 -50 -0.4 -0.6 I D , DRAIN CURRENT (A) -0.8 -1.4 -1.0 -1.2 -1.6 VSD, SOURCE TO DRAIN VOLTAGE (V) -1.8
ID = -11A
-5
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VDD VDD
0V VGS
DUT VGS RG
VDD
+
VDS VGS 0
90%
90%
CURRENT REGULATOR
0 VDS
DUT 12V BATTERY 0.2F 50k 0.3F Qgs D G 0 Ig(REF) IG CURRENT SAMPLING RESISTOR S +VDS ID CURRENT SAMPLING RESISTOR 0 DUT VDD Qgd
VGS
Qg(TOT)
Ig(REF)
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IRF9640, RF1S9640SM
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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