Product Brief

X-GOLDTM616
High Performance Modem Solution for Smart Phones
Main features THe InfIneOn X-GOLD 616 is a cellular system on chip comprising of the 2G/3G digital and analogue baseband plus the power management function all monolithically integrated in 65nm CMOS technology. It is Infineons 3rd generation 3G baseband solution and is taking the next step in bringing enhanced modem features such as HSDPA and HSUPA to the mass market.
TM

Modem HSUPA 5.7Mbps HSDPA 7.2Mbps WCDMA: 386kbps DL/UL eDGe: MSC33 Speech: nB-ARM, WB-AMR SAIC

This modem solution is designed for an optimized smart phone system setup together with an application processor. In addition it addresses the market segments for cost optimized cellular modem solutions like PC modems, data cards, M2M modules and cellular automotive solutions. The X-GOLDTM616 provides the complete modem functionality offering HSDPA cat 8 (7.2Mbps), HSUPA cat 6 (5.7Mbps), eDGe multi slot class 33 and includes the latest OMTP security standards. The processing of the 2G/3G cellular protocol stack is handled by an ARM 1176 embedded microcontroller. The physical layer and the voice processing is handled by a dedicated hardware accelerator and DSP sub system. The X-GOLDTM616 enables the XMMTM6160 platform solution; a reference design with the complete Rf engine, the integrated release 6 protocol stack and modem interface SW for the inter processor communication via various HW interfaces. The integration of all baseband and PMIC functions and the combination with Infineons SMARTiTMUe Rf engine heralds lowest PCB footprint, below 700mm2 for triple band 3G and quad band eDGe and offers optimized stand-by and talk times. The solution is validated with an Inter Operability Test Program at infrastructure vendors and operators, to significantly reduce the time to market for customers end product.

CPU ARM1176 Memory LPDDR1-SDRAM nOR, nAnD flash Shared-SDRAM, Dual-Ported-SDRAM Connectivity and Interfaces Digital Rf interface DigRF Version 3.09 High-speed interface to SIM IC-USB USB 2.0 HS MIPI PTI/STP 3xUSIf 2xI2C 2xI2S SD/MMC card interface

www.infineon.com/wireless

Product Brief

X-GOLDTM 616
High Performance Modem Solution for Smart Phones
Block Diagram
Test & Debug MIPI TPI/SPT Stereo Headset Earpiece Handsfree Loudspeaker Analog/Digital Microphone SIM Memories (RAM, ROM, Cache) MMC SDC SD/ MMC 32kHz XO External Memory Interface Power Supply Direct to Battery Power Supply Audio I/F AppProc & Bluetooth IS
2

Control IC
2

Application Processor Interface USB SPI

Oscillator Test & Debug USIF UART Osc Control DAC CLK In 2G TX 2G TX
PA

X-GOLDTM616
Audio
2G DSP TEAKlite 3G/HSPA Layer 1 FE Control Digital RF Interface Digital RF v3.09 2G/3G RX 2G/3G RX FEM CTRL

ARM 1176 Timer Interrupt

FEM

SMARTiTM-UE
2G/2.5G/3G RF 3G TX 3G TX
PA

External Crystal

NOR

LPDDR1

Battery

XMMTM6160 Smartphone Platform Solution

Setup with triple band HSxPA and quad band eDGe

Platform features

Modem Area < 7cm2; ~100 components Standby current 2G: 0.9mA 3G: 1.1mA 3GPP Release 6 Protocol stack HSDPA cat 8, HSUPA cat 6 3 band HSPA, quad band eDGe Optional up to 5 band HSPA possible A-GPS interfacing

note: TeAKlite is a registered trademark of ParthusCeva, Inc.

How to reach us: http://www.infineon.com Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved.

Legal Disclaimer The information given in this Product Brief shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information for further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

Warnings Due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Order Number: B153-H9337-X-X-7600 NB08-1293

Published by Infineon Technologies AG