1.

0 INTRODUCTION

1
1.0 INTRODUCTION
1.1 Placement
For the industrial training, I was placed at an international semi-conductor
factory known as STATS ChipPAC (Malaysia) Sdn. Bhd. (SCM) This 488,000
square foot facility in Kuala Lumpur provides a full range of integrated test and
assembly services.
There are several departments in the firm such as Human Resource, IC
Assembly, Power and IC Test. As for me, I was placed at the IC Assembly Front of
Line (FOL) as a trainee in preventive maintenance group. Here, I have gain lots of
important knowledge on maintenance, parts, measurements, and cautions for the
machine used in the factory especially the gold wire bonding machine.
My task is mostly on preventive maintenance activities for the gold wire
bonding machine where I must do some servicing for once every three month which
applied to each machine. This can assure the efficiency percentage of the machine
maintains or better if it is increased. I also get to do other tasks such as helping
other engineer with their works.

1.2 Objective
The works that I have exposed/involved along the training period mostly are
following the underlying objectives of industrial training that are:
 Manufacturing / production process and or its optimization process.
 Mechanical design and product/system development.
 Maintenance and repair of machineries or equipments.
 Product testing and quality control.

2
 2.0
ORGANIZATION
BACKGROUND

3
2.0 ORGANIZATION BACKGROUND
2.1 History & Milestone
STATS History
2004 STATS and ChipPAC agree to merge creating world's premiere
semiconductor test and assembly solutions company
2003 Entered into strategic alliance with SimmTech for substrate support and
technology
2003 Installed 100th Teradyne Catalyst platform
2003 Announced integrated turnkey solution for the Wireless market
2002 FastRamp acquired Conexant test operations in San Diego, California
2002 Launched mySTATS enterprise portal
2001 Launched FastRamp Test Services, a high-end test laboratory
2001 Acquired majority stake in Taiwan test house, Winstek Semiconductor
Corporation
2001 Expanded unique thermal simulation service
2000 Listed on NASDAQ and the Singapore Exchange
1995 Expanded into full turnkey services with assembly operations
1995 Established test operations

ChipPAC History
2004 STATS and ChipPAC agree to merge creating world's premiere semiconductor
test and assembly solutions company
2003 ChipPAC first to market with six Stacked-Die CSP
2003 ChipPAC offers industry's thinnest four chip Stacked-Die CSP products
2002 Announcement of China expansion, extending leadership
2002 ChipPAC engineers five Stacked Chips in a 1.4mm thick package
2002 ChipPAC standardizes on eRoom solution; deploys global automated design
scheduling system
2001 ChipPAC introduces industry’s first advanced package design and
characterization system
2001 ChipPAC recognized as a Top Exporter in China marketplace
2000 Initial public offering
2000 Acquisition of Malaysia plant
1999 Leveraged buyout by Management, Bain & CVC
1997 ChipPAC brand initiated
1995 Start of China operations

4
 1994 Start of merchant assembly and test of high volume Intel BGA

Tan Lay Koon

President and Chief Executive Officer
Tan Lay Koon is President and Chief
Executive Officer of STATS ChipPAC Ltd.
Previously, Mr. Tan served as Chief Financial
Officer for STATS, Ltd. and was promoted to
his current position in June 2002. Prior to
joining the company, Mr. Tan was an investment banker with Salomon Smith
Barney, the global investment banking unit of Citigroup Inc. He has also held
various positions with the Government of Singapore, Times Publishing Limited
and United Overseas Bank Limited in Singapore. Mr. Tan graduated with a
Bachelor of Engineering (First Class Honors) from the University of Adelaide
Australia as a Colombo Plan Scholar. He also holds a Master of Business
Administration (Distinction) from the Wharton School of the University of
Pennsylvania where he was elected a Palmer Scholar.

STATS ChipPAC (Malaysia) Milestone

• Factory operations began as RCA 1974 and
Harris 1975
1974
o Harris and RCA/GE merged in Dec 1988
o Spin-off into Intersil in Aug 1999
o 1989 Acquired by ChipPAC in July 2000
o Merged into Stats Chippac August 2004

ChipP
2000
1999
Figure 2.0: STATS ChipPAC (M) Milestone

5
2004
2.2 Organization Chart
STATS ChipPAC Malaysia

Figure 2.1: STATS ChipPAC (M) Organization Chart

2.3 Company Information
STATS ChipPAC Ltd. is a premier service provider of semiconductor
packaging design, assembly, test, and distribution solutions. A trusted partner
supplier to leading semiconductor companies worldwide, STATS ChipPAC's
unique value to its customers is fully integrated, multi-site, end-to-end assembly
and testing solutions that bring products to market and volume production faster.

STATS ChipPAC is a leader in mixed signal testing and advanced

packaging technology for semiconductors used in diverse end market
applications including communications, power, digital consumer, and
computing. Our customers comprise some of the largest wafer foundries,
integrated device manufacturers (IDMs) as well as fables companies in the
United States, Europe and Asia.

6
 With a strategic manufacturing presence spanning Singapore, China,
Malaysia, South Korea, Taiwan and the United States, and customer support
offices throughout the United States, Europe, and Asia, STATS ChipPAC
provides customers with total supply chain solutions tailored to their needs.
Technology development centers are located in California, Arizona and South
Korea. Corporate headquarters are located in Singapore

STATS ChipPAC's 488,000 square foot facility in Kuala Lumpur

provides a full range of integrated test and assembly services. In addition to
being the primary high volume site for BCC (Bump Chip Carrier) packaging
and test, the Malaysian facility specializes in power management technology
with a wide range of discrete power packaging and test services. Its portfolio
includes LFCSP (Lead-frame Chip Scale Packaging) packaging as well as RF
signal testing. The Kuala Lumpur facility features a state of the art automated
product distribution centre and is certified to IS09002, ISO14001 and
ISO/TS16949:2002 quality standards.

The customers of STATS ChipPAC are IBM, Intel, Fujitsu, AMD,

nVIDIA, Fairchild and many more. Almost all of the big company of
semiconductor is STATS ChipPAC customer.

2.4 Quality at STATS ChipPAC

STATS ChipPAC - Malaysia (Kuala Lumpur)
• ISO / TS16949:2002 - May 2004
• SO 9001:2000 - May 2004
• Sony Green Partner - September 2003
• OHSAS 18001:1999 - December 2001
• ISO 14001:1997 - December 1999

7
8
 3.0 IC ASSEMBLY FOL
DEPARTMENT

3.0 IC ASSEMBLY FOL DEPARTMENT

3.1 Introduction
IC Assembly is one of the departments that available in STATS ChipPAC
Malaysia. This department involve in dealing with BCC (Bump Chip Carrier),
QFNp (Quad Flat No Lead Punch) and QFNp (Quad Flat No Lead Sawn) IC
packages. There are two main sections in IC Assembly which are Front of Line
(FOL), and End of Line (EOL). For the FOL, this section started from handling
the die bank until the 3rd Opt inspection.
3.2 Process Flow

9
 Coverlay
Die Bank (QFNs)

Wafer Thickness Die

Wafer Tapping Die Attach

Wafer Back Grind Laser Strip ID

Pre Bond
Wafer Detapping Plasma
Cleaning

Wafer Thickness Wire

Post Bond
Wafer Mount Plasma
Cleaning
Wafer 3rd Optical

2nd Optical Inspection

Figure 3.0: IC Assembly FOL Process Flow Chart

3.3 Gold Wire Bonding Machine

The gold wire bonder machine (ex: K&S 8028 Gold Ball Bonding Platform)
was designed to make gold wire interconnections on semiconductor integrated
circuit (IC) devices. The machine makes wire connections by means of a thermo-
sonic ball bonding process that uses heat, force and ultrasonic energy to form an

10
inter-metallic bond between a gold wire and an aluminized surface on a
semiconductor device.

Figure 3.1: Gold (Ball) Wire Bonding Machine

The term ‘ball bonding’ refers to the process whereby the leading edge of
each wire (i.e.; the first bond) is melted to form a ball prior to bonding.
This machine consists of SVGA monitor, upper console, microscope, XY
table, Material Handling System (MHS), control panel, lower console, signal tower
and optics assembly.

Figure 2.1 11
Wire bonder
machine
 The XY table (figure 3.2) consists of sliders, mechanical couplings and drive
systems mounted on a large casting. Individual linear servomotors are responsible
for “X” (left-right) and “Y” (front-back) motions. The bond head and optical
systems are mounted on the XY table. During operations, the two servo motors
move them in X and Y axes to target reference points and bond locations. During
automatic operation, the servo motors are controlled by bonder software. In
teaching and in manual operation, they are driven by trackball on the operator
control panel.

Figure 3.2
XY table

The bond head (figure 3.3) consists of the transducer/capillary assembly and
Z-drive. A linear servo motor is responsible for the up-down motion of the
transducer/capillary. This motor applies all of the pressure needed to make the bond.
While pressure is applied, ultrasonic energy from the transducer is coupled through
the capillary to promote the formation of the bond between the wire and the work
surface. After the bond is completed, the capillary lifts off of the work surface and
the XY table moves to position the capillary above the second bond. The bond head
moves vertically and horizontally as needed to shape the wire before descending to
make second bond.

12
 The bond head also includes the Electronic Flame-Off (EFO) wand used to
form the wire ball, wire clamps to hold the wire it is being broken loose from
second bond and the mechanism to feed wire from a spool to the capillary.

Figure 3.3
Bond head
The lower console (figure 3.4) of the bonder contains power supply and
distribution systems, PC boards for the bonder, air pressure input filter, disk drives
and cooling systems. The power systems consists of a power cord, power supply
assembly and cabling that connects the power supply outputs to alternating current
(AC) or direct current (DC) powered electrical devices. A hard disk drives that
contains all of the software for the machine operation, device programming and
bonding is mounted in the lower console. The hard disk drives are used primarily
for storage of process programs and machine operating software.

13
 Figure 3.4
Lower console

For the upper console (figure 3.5), the bonder uses a 2” (51mm) diameter
wire spool that is mounted on the front face of the upper console. A motor turns the
spool to feed wire as needed. Wire feed is controlled by an optical sensor, which
maintains a constant length of wire between the spool and the capillary. When the
gold wire moves away from in front of optical sensor, motor operation is enabled.
The motor is disabled when the wire triggers the sensor or after a minimum duration
feed.

Figure 3.5
Upper console

14
 The pneumatic system components mounted in the upper console regulate
and control application of compressed air and vacuum used in the wire feed
systems. Compressed air is also routed to a solenoid valve assembly at the MHS and
to a vacuum pump that creates vacuum to secure leadframe die paddles at the
workholder heat block. Pressure is used in the MHS to maintain gripping force on
leadframes during indexing operations. Other uses of compressed air include X, Y
and Z axes servo motor cooling, stabilization of the bond site video image during
PRS eye point find operations and modulated cooling of bond head components to
limit bond location drift during operations.

This machine using 15” colour SVGA monitor (figure 3.6) (for model 8028)
that uses 110 Vac from the main power supply convenience outlet panel. The
monitor operates at 1024 x 768 screen resolution with a 70 Hz screen update rate.
Displays on the monitor screen include virtual “keys” and menus of software
options that can be selected using the trackball, definitions of operator panel
function keys, an area or “window” that contains a graphical representation of the
device being processed and a window that shows live video from the camera.
SVGA screen graphics are generated by the vision system assembly as requested by
the bonder control system and mixed with camera video for display on the monitor.

Figure 3.6
Monitor

15
 A charge-coupled device (CCD) video camera system is currently used in
the 8028 vision system (figure 3.7). The camera system consists of one or two
remote camera heads mounted on the optics assembly and a camera control box
mounted beneath the video monitor on the upper console. The vision system
supplies operating power and synchronization signals to the camera system, and the
camera system returns composite video to the vision system, through a single cable
connected to an analog camera port connector on the vision system assembly face
plate (labeled cam 1). Internally, the remote camera head has ½” format CCD
sensor. When compared to cameras used on earlier K&S bonders, this camera
system offers light sensitivity.

Figure 3.7: vision system

Other assemblies enclosed within the upper console are the wire feed/bond
integrity test system (BITS) circuit board, which operates the wire feed system and
detects non stick bonds; the EFO electronics that create a high voltage charge at the
bond head EFO wand for ball formation and an upper machine interface board that
provides connection points for upper console cables. The upper machine interface
also has sensor interface circuitry for XY table limit sensors.

16
 User interface components mounted on the lower console include the control
panel assembly and a power control. The control panel assembly consists of a
trackball pointing device with three key switches, an operator’s keypanel, and a
programmer’s keyboard (figure 3.8). The main power is located at the right-front of
the lower console. The operator’s keypanel has keys that move the screen cursor or
X, Y and Z axes of motion, numbered keys for entry of numeric data and twelve
function keys whose function are defined in the graphical user interface (GUI)
display on the video monitor. The QWERTY keyboard, mounted within a drawer
below the operator’s keypanel and trackball, may be used to make mode/function
selections or enter alphanumeric data when required.

Figure 3.8
Control panel

17
 Communications between the control panel and 8028 control system are
handled by the vision system assembly (mounted in the lower section of the card
rack assembly). At the control panel, the trackball assembly, keyboard and the
trackball key switches (3 keypad assembly) are each connected by short cables to
the operator’s keypanel assembly circuit board. This allows them to be easily
disconnected in the event that any control panel subassembly needs to be replaced.
A single cable carries data from the control panel assembly to the vision system via
an asynchronous serial interface per RS232 and provides operating power for the
control panel components. At the vision system, the control panel communications
cable is connected to the serial port connector on the vision system face plate
(labeled COM 1).

The machine software communicates with the operator through a graphical

user interface (GUI) (figure 3.9) displayed on the screen of the video monitor. The
GUI has virtual keys that can be selected to perform machine functions and gain
access to programming, operation and configuration menus. Two “windows” in the
GUI show live bond site video and a graphical representation of the current process
program. Other information is constantly displayed for the operator’s convenience
(MHS heater temperatures, X, Y and Z axes positions, operating prompts, etc.)

Figure 3.9
GUI

18
 Other indicators include the signal light tower and audible alarm (also
mounted on the upper console) that inform the operator of machine status (normal
operation, material equipment, or error condition) during production operations.

Targeting of devices is accomplished by the vision system and optics (figure

3.10). The electronic optical system includes a single or dual magnification optics
(figure 3.11) assembly (objective lens and mirror systems) on which is mounted one
or two solid state video camera head and bond site illuminators (vertical and
oblique). All are mounted on the front Y slide above the bond head. The single
magnification optics assembly is standard on the 8028; the dual magnification/ dual
camera optics assembly is available as an option; two camera head are cabled to the
camera control box, one for each of the two magnification of the bond site; low
power (2x) and high power (6x).each of the optical paths provides a different
magnification of the bond site; one equal to that of the single magnification optics
(2x or low magnification), the other at a higher magnification (6x or high
magnification). They can also be individually set to different focus height range.
The electronic crosshair in the video window of the GUI display corresponds to the
position of the capillary over the device during bonding operations. Some optical
parameters (lightings, etc) are software adjustable.

19
Figure 3.10:Vision system and optics location

Figure 3.11:Vision system and optics

20
 A camera control box (figure 3.11) is mounted on top of the upper console
Figure 2.10 beneath the video monitor. In a single magnification optics system, a single video
camera head is connected to the box. In dual magnification system, two camera
heads are connected to the control box. The control box sends composite video to
the vision system for image processing and monitor display.

The vision system (figure 3.11) assembly is an independent image

processing system that allows the bonder to operate without user attention by
automatically finding device reference points (“eye points”) before each device is
bonded. The bonder can compensate for variations in die position from package to
package based on the location of the found reference points. The Video Lead
Locator (VLL), a subsystem of the vision system, operates in a similar manner. It
finds the exact taught location of bond positions on the outer leads of each device to
ensure accurate second bond placement.

The VLL maintains informations about each taught lead, which includes the
position angle, width and illumination levels. When running in Auto Mode, the VLL
will locate the leads as part of the package alignment process and will return any
lead displacement to the bonder to ensure correct bond placement.

The vision system takes its video image directly from the camera control
box. This makes it easier to adjust lighting for optimum effect. Image are stored,
processed and analyzed by a dedicated processor and memory system which is part
of the vision system. Other machine functions performed by the vision system
include generating monitor graphics and displays, controlling the LED bond site
illuminators and providing an interface for the operator control panel. Video output
of the vision system, which includes colour graphics displays and live bond site
video, is displayed on a video graphics adapter (VGA) monitor mounted at the top
of the upper console assembly. A microscope with zoom capability is provided for
general purpose inspection of the device.

21
 The MHS performs all functions necessary to move and position leadframes
and their magazines during the wire bonding process. The MHS consists of three
major subsystems:
• Input magazine handler (handles input magazines)
• Workholder
• Output magazine handler (handles output magazines)

Figure 3.12: Input magazine handler

The input magazine handler (figure 3.12) stages several multi slot extruded
aluminium magazines that contain die-bonded leadframes. Multiple magazines are
used to provide sufficient storage capacity of these devices to minimize material
replacement time. Each magazine has a fixed pitch (distance) between leadframe
slots, but the number of magazine pitches between adjacent leadframes stored in the
magazine may vary. Magazine dimensions and slot pitches must be constant in the
same process batch or lot.

22
 Workholder (figure 3.13) contains the mechanisms and assemblies required
to remove leadframes from the input magazine handler, advance (index) them under
the bonding tool, then eject them into the output magazine handler. In addition, the
workholder provides heating (preheat, bond site and post heat zones), locating and
clamping for each device on the leadframe during the bonding operation. The
workholder is capable of locating each device on the leadframe at the bond site with
a high degree of repeatability while providing a high transfer rate to maintain high
throughputs. Three independently programmable heaters are located:
• Prior to the bond site (Preheat)
• At the bond site (Bond site)
• After the bond site (Post heat)
Each heater location has an independent thermocouple and temperature
controller circuit to program, measure and control heater performance. The
temperature controller circuit are all part of a circuit board assembly housed in the
lower console card rack.

Figure 3.13:
Work-holder

23
 The clamping system (part of workholder) registers and clamps the
leadframe at the bond site to ensure a consistent bonding process. Clamping action
requires the coordinated motion of a heated lower support block and a clamping
frame, parts of which are customized for a particular leadframe design.

The output magazine handler (figure 3.14) stages multiple slot extruded
magazines for ejection of bonded devices. Output magazines are initially empty and
accept the wire bonded leadframes into the magazine slots as they are removed from
the workholder.

Figure 3.14: output magazine handler

The software is organized by “modes” with related or interdependent

procedures grouped together within each mode. Software is menu driven with
options displayed on the video monitor. The keyboard and trackball are used to
respond when appropriate. The monitor will also display error messages in the event
of a system error.

Specification for machine:-

Facility requirement
• Electrical
Line voltage: 100, 115, 200, 220, 230, 240 Vac, Single Phase, 50/60Hz (+/-
3Hz)

24
 Power Consumption: 2.0 kVA (nominal)
• Compressed Air
Minimum pressure: 65 psi (4.6kg/cm2)
Air Consumption: 65psi
Filtration: 0.3µm
Dew point: 41ºF @65psi (5ºC @ 4.6kg/cm2)

Operating Environment
• Temperature
59ºF - 86ºF (15ºC - 30ºC)
• Atmospheric Pressure
540-810mm Hg
• Relative Humidity
30-70% RH (non-condensing)

Material Handling Capability

• Leadframe Dimensions
Length: 3.5 to 10.5 in. (90 to 267 mm)
Width : 0.60 to 3.2 in. (15.2 to 81.3mm)
Thickness: 0.004 to 0.035 in. (0.10 to 0.89mm)
Die Pad Down Set: Up to 0.090 in. (2.3mm)
Die Site Pitch: 0.1 to 3.5 in. (2.5 to 90mm)
Lead Pitch (min.): 0.0026 in. (66µm) with 1 mil (25µm) wire
Lead Width (min.): 0.0016 in. (40µm) with 1 mil (25µm) wire
Min. Lead Spacing: 1 mil (25µm)
• Magazine Dimensions
Width: 0.7 to 3.75 in. (20 to 95.3mm)
Length: 5.00 to 10.75 in. (127 to 237mm)
Height: 2.0 to 7.0 in. (127 to 273mm)

25
 In this IC Assembly Department, about 5 model of machine (K&S 1488,
K&S 8028, K&S 8028 PPS (Precision Plus Speed), Maxµm Plus and Maxµm
Ultra). Maxµm Ultra is the latest model. The differences between these 5 models
are its bond pad opening and bond pad pitch. Bond pad pitch is distance (pitch)
from center of the pad to the center of adjacent pad. Bond pad opening is distance of
the pad.
Table 3.0: Difference on Bond Pad Opening & Pitch for K&S & Maxµm Ultra
Machine Bond Pad Opening Bond Pad Pitch
K&S 1488 80 – 100 µm 80µm - 100µm
K&S 8028 PPS 60 – 80 µm 60 – 70 µm
Maxµm Ultra 40 – 50 µm 40µm - 50µm

Figure 3.15: Die/Device

3.4 Outfit/Gauge/Equipment/Item
Figure 3.16: K&S 8028
o Outfit:

26
To enter the factory, one must wear some items as a proper outfit that has
been set by the company’s rules.

Conductive Shoe/heel strap/Shoe cover

Figure 3.17: Heel Strap Figure 3.18: Conductive Shoe

- Must wear to remove ESD (Electro Static Discharge) from body

- Act as grounding for the user body

Name tag

Figure 3.19: Name Tag

- For personal identification

The proper outfits are important before entering the clean room to make sure
that the body is covered with the ESD protection

27
Finger cots:

Figure 3.20: Finger Cots

- Must be wear on each finger

- To protect for direct electric shock

Jumpsuit:

Figure 3.21: Jumpsuit

- Must be wear properly according to do’s and don’ts

- Protect from ESD shock to product and the user
- Included ESD booties that act as groundings.
-

Wrist straps:

28
 Figure 3.22: Wrist Strap

- Must be test the effectiveness before doing any work or even nearing any
equipments
- Will be connected to grounding cord to remove ESD from our body

o Equipment/Item:

Figure 3.23: Kimwipes tissue

Kimwipes tissue:
- Use for delicate task

29
- Did not produce small particle or dust

Hex Key/ Allen Key:

Figure 3.24: Hex Key

- To loosen/tighten hex screw

Screw Driver:

Figure 3.25: Screw Driver

- To loosen/tighten screw

30
Vacuum cleaner:

Figure 3.26: Vacuum Cleaner

- Suck all contaminating item or dust from the machine

NSK Grease:

Figure 3.27: NSK Grease

- Applied to the slide for smoother movement

31
Methanol Chemical

Figure 3.28: Methanol

- To clean the stains on parts, machines, and equipment

Multi-meter:

Figure 3.29: Multi-meter

- To check the groundings of machines

32
Heat Block Base & Heating Element:

(i) (ii) (iii)

Figure 3.30: (i) small base, (ii) wide base, (iii) heating element

- Heat Block Base: to balance and hold the heat block when bonding
process
- Heating Element: to be insert into HBB, heat the heat block
Scope meter:

Figure 3.31: Scope meter

- Calibrating the Z-encoder voltage

- Connecting the wire to the Z encoder terminal at the cards slot

33
 Capillary:

Figure 3.32: Various types of Capillaries

- Wire inserted to perform bonding

- Forming ball shape and wire cutting when bonding
- Different characteristic for different color (Appendix A)

o Calibration Gauge:
Calibration gauge is use to help in calculating the measurement to get the
default or program requirement for a machine

34
 (2)
(1)
(3)

(5)
(4)

Figure 3.33: Calibration Gauge

(1) Calibration Heat Block insert gauge

To set the center for the bond head and rails
(2) Bond Force gauge
To be used in bond force calibration and clamp calibration
(3) Clamp gauge
To be used in clamp calibration
(4) Perpendicular gauge
To be use in Z-axis Adjustment calibration
(5) Calibration wafer
To be use in indexer and x-sensor calibration

35
4.0 TRAINING
ACTIVITIES

36
4.0 TRAINING ACTIVITIES
The difficulties along the training period are to get use of the industrial life especially
for the first month but recover from time to time. Another difficulty is photo for some
the activities done cannot be taken because of the rule restriction by the company.
Therefore some of the training activities did not have the appropriate photo.
4.1 Orientation
For every newcomer, they will be enter an orientation to ensure that they can
follow the company rules ad regulation and also have the safety awareness for
themselves, the machines, the products, and the company it-self.
4.1.1 Safety Awareness & Proper Protection Equipment (PPE)
- Give awareness on accident at job, recognize type of PPE, and how to
use & taking care of PPE
- learning all about the safety and proper equipment for different task
- learning the cautions sign that generally use in industry

37
 Figure 4.0: Various types of PPE

4.1.2 Electro Static Discharge (ESD) Awareness

- ESD is static charge that transfer from one item to other item
- ESD occur from movement, physical contact, or when item rubbing each
other and separate
- Happen when high static charge flow to low static charge

Figure 4.1: How ESD produce

- General voltage that produce by ESD

• Walking across carpet: 1,500 - 35,000 volts
• Walking on floor: 250 - 12,000 volts
• Worker sit and get up from seat: 700 - 6,000 volts
• Pulling sticking tape to be use: 9,000 - 15,000 volts
- ESD can cause damage to the small component (mostly damage occur
with only 50 volts)
- Must always use ESD protection
- ESD protection equipment must be test every time entering the factory
and into the production floor

38
Figure 4.2: Testing the ESD protection equipment

4.1.3 Data Login & Error Correction (DLEC)

Like a special format on writing the production data and correcting
when errors in data occur.
- Only black ball pen are use and no other pens are allowed
- Writing must be clear and no double write on the same side
- Short cut (“) are not allowed
S/N LOT NO DEVICE NO QUANTITY TIME
1. FE. 100 AB A 05881A3 2000 7.00AM
2. " AC A 05842A3 2000 7.40AM
3. " AD A 05863A3 " 8.00AM
4. " AE A 05845A3 " 8.15AM
5. " AF A 0582173 " 8.45AM
Figure 4.3: Incorrect data login

- For error correction, one can only correct by draw a line to the error and
corrected near the error with employee number and date

QUANTITY087015524
IN :
379 397 03APR03
Figure 4.4: correcting errors in data login

- The date can only be write by 2 places of day, 3 places of moth (in
English), and 2 places of year (i.e. 02 APR 08)

39
 From the orientation program, I get to learn the way of working in the factory
where I can assume that each company has their own work style and all of it
must be followed properly to make sure that all task are well manage. This is
importance where a well manage company result to healthy economical status.
When all are manage systematically and safely, customer will have the
confidence to trust the company
4.2 Preventive Maintenance
The task given is to do preventive maintenance (PM) especially on gold wire
bonding machine. Preventive maintenance includes cleaning machine areas,
searching for any problem potentials, servicing the machine, repairing major
problem, change any faulty parts, correcting minor errors (Appendix B) and also
calibrating machine to it optimal status. It is quite difficult to the PM works in
the early month because most of the parts of the machine are fragile and
sensitive, and problem can occur if the task does not being handled properly.

- Preventive Maintenance Activities

40
 Machine on PM
due date

Stop production &

clearing workholder
(MA)

Cleaning

Calibrating

Setup

Test bond Data from

calibration
taken are
wrote into
Ready for production Check List
(MA) (Appendix C)
Figure 4.5: SCM Preventive Maintenance procedures

a) PM is start by checking the machine PM due date in the computer data

or in the printed machine for PM schedule.
b) After founded the machine that need to be PM, I then ask for the
Manufacturing Assistance (MA) to stop the machine from continuing
running the production (If it running the production) and clear the work-
holder area from any lead-frames. The stopped production is transferred
to other machine to make sure that productivity is not largely disturbed.
c) Cleaning:
Cleaning is important to ensure the cleanliness of the machine and to
prevent contamination to the product/device and the gold wire when
bonding process running. Any contaminated process may result to
bonding error (i.e. EFO Open)
The process flow of cleaning is:

41
• The motor stop button are pushed
• Acknowledge PM status for the machine at the host computer
(located on each row of machine), and the machine is switch Off
Note: If there are no computer connected to the machine, the
program must be save in to the machine’s hard disk before
switching it Off
• The covers for the work-holder, upper-back, and lower-back are
removed.
• Previous PM activities include taking out the work-holder to be
service at the PM room. For servicing the work-holder, the
pneumatic 3/2 way solenoid control valve and lead screw that
controlling the indexer movement are removed and separate to
parts to be clean using methanol chemical. Later the parts are
attached back and the work-holder is blown using air gun to
remove particles and dust at every inch of it. The air flow system
of the work-holder is test buy inserting the air gun nozzle into an
air hole and blow. The system must be clear from any blocks or
leaks. After that the work-holder is attached back to the machine.
Current PM does not need to taken the work-holder out except if
problems occur to it.
• The whole areas of the machine are vacuumed especially at the
work-holder, inside XY table areas (Bond-head), filters, and, the
power supply. These places area important for making sure the
machine is away for any potential problems (i.e. over heating
due to the filters full of dust, and contamination of the lubricated
parts and gold wire)
• Any sliding element areas are wipes using special tissue to
remove the old applied grease before applying new one on it.
Grease is important to ensure the smoothness of the slides when
movement happens. It also important to reduce friction that can

42
 cause heat that later produce wears of the slide’s surface. Old
grease are contaminated with dust and other particle and can
resolve to overheat when friction.
• Markers from pen on the machine are accidentally happen when
any of the pen users slide the pen on the machine surface. The
markers can be clean using methanol chemical and wipe it of
using tissues. This is to ensure that the machine looks neat and
not messy.
• After all cleaning are finished, and the wires and covers are
attached back, the machine is then switched On
d) Calibration:
Calibration is done to make sure that the machine will be working in it
specified measurement. This is to ensure that it can perform in the
optimal or increasing efficiency. Wrong calibration can resolve to
problem for the machine and the production. Thus, each calibration must
be done correctly to prevent any errors or major problems occur.
The calibration procedures can be preformed individually and have no
strict sequence. For the PM, we have done the calibration according
general needs of the machine (begin after removing heat block insert,
clamp insert configure heat block width, detach EFO wand, and wire
removed from capillary)

43
 After Configure heat block, Calibrate Z-
cleaning remove EFO wand, & Encoder using
Remove wire from Scope meter
capillary (Motor Stop
status)

Check
grounding
Calibrate bond
force, USG,
Calibrate
EFO height
Calibrate Rails,
(Wand
clamp indexer, x-
attached back) Calibrate sensor, jam
Z-axis detect, &
adjustment tucker eject
Attach
heat block
insert and Calibration
clamp finished
insert

Figure 4.6: SCM Calibration Sequence

I. Work-holder menu
o Rails
Purpose: to teach front and rear rail home positions
with respect to center of bond in Y axis
Procedures:
• Select CALIBRATION>WORK HOLDER>
RAILS
• Align horizontal crosshair with front edge of
the heat block insert die cavity. Select OK
• Align horizontal crosshair with back edge of
the heat block insert die cavity. Select OK
• Remove heat block insert. Select OK. Indexer
rails close.
• Align horizontal crosshair with the back edge
of the notch on the vertical lead frame

44
 stopping surface at rear indexer rail. Select
OK
• Bench straight edge against the lead frame
stopping surface at front rail. Align horizontal
crosshair with the straight edge to locate the
lead frame stopping surface. Select OK
o Clamp
Purpose: to set bond plane height
Tool: Clamp calibration gauge
Procedures:
• Select CALIBRATION>WORK HOLDER>
CLAMP
• Insert clamp calibration gauge near to
capillary position when prompted
• Remove clamp calibration gauge
• Place heat block insert when prompted. Target
at flat-non cavity area of the heat block and
press OK. The capillary will contact with heat
block to calibrate height
• Place clamp insert when prompted. Target at
flat-non cavity area of the clamp and press
OK. The capillary will contact with clamp
block to calibrate height
o Indexer
Purpose: to teach indexer home position with respect
to center of bond in X axis
Tool: calibration wafer
Procedures:
• Select CALIBRATION>WORK HOLDER>
INDEXER

45
 • Align vertical crosshair with left edge of the
heat block die cavity. Select OK
• Align vertical crosshair with right edge of the
heat block die cavity. Select OK
• Remove the heat block insert. Select OK
• Place the calibration wafer on the rail,
benching it against the rear rail and the left
side of the close indexer gripper jaws. Select
OK
• Align vertical crosshair with left edge side of
the calibration wafer. Select OK
• Remove calibration wafer. Select OK
o X – sensor
Purpose: to teach distance between X registration
sensor and bond site in X axis
Tool: calibration wafer
Procedures:
• Select CALIBRATION>WORK HOLDER> X
SENSOR
• Align vertical crosshair with left edge of the
heat block die cavity. Select OK
• Align vertical crosshair with right edge of the
heat block die cavity. Select OK
• Remove the heat block insert. Select OK
• Place calibration wafer on top of the X
registration sensor. Select OK.
• The indexer will pick up the calibration wafer
and place it somewhere on top of the head
block area

46
 • Align vertical crosshair with left edge side of
the calibration wafer. Select OK
• Remove calibration wafer. Select OK
o Jam Detect
Purpose: calibrate indexer jam detector
Procedures:
• Select CALIBRATION>WORK HOLDER>
JAM DETECT
• The machine performs the indexer jam control
calibration automatically
• When done, a message box is displayed
stating that calibration was successful. Select
OK to accept the calibration result.
o Tucker Eject
Purpose: to teach indexer gripper position where
tucker blade tip is aligned with outside of off-loader
side wall
Procedures:
• Select CALIBRATION>WORK HOLDER>
TUCKER EJECT
• Observe the displayed Warning, then select
OK
• Use the left/right arrow keys on the control
panel to move the index gripper in the X axis
until the right edge of the cut in the tucker
blade in flush with the outside surface of the
output magazine handler side wall. Select OK
II. Bond Head menu
o Z-Axis adjustment

47
Purpose: to set the perpendicular level for the
transducer with the heat block
Tool: perpendicular gauge, bond force gauge (as
weight)
Procedures:
• Select CALIBRATION>BOND HEAD> Z-
AXIS ADJUSTMENT
• Select Z-axis Alignment. Select Continue
• Adjust the position of the transducer so that it
can be calibrated with out problems or
breaking the capillary. Select Continue
• Place perpendicular gauge under the
transducer (Y axis position). Measure the
height from both perpendicular peaks using
Shim.
• The different of height between peaks must
not exceed 32 mils. Adjust must be done if the
value is exceed.
• Select Continue until comes to Z-axis
Adjustment back.
• Select back Z-axis Alignment and Select
Continue
• Adjust the position of the transducer so that it
can be calibrated with out problems or
breaking the capillary. Select Continue
• Place perpendicular gauge under the
transducer (X axis position). Measure the
height from both perpendicular peaks using
Shim.

48
 • The different of height between peaks must
not exceed 32 mils. Adjust must be done if the
value is exceed.
o Bond force
Purpose: To ensure that actual bond force is equal to
programmed bond force
Tool: Bond force Calibration Gauge
Procedures:
• Select CALIBTATION>BOND
HEAD>BOND FORCE
• Move the tips of the capillary over the heat
block (not on cavities)
• Select Calibrate, Capillary move down to
contact heat block
• When prompted, mount bond force
calibration gauge on front of bond head
link. Select Done
• Machine calibrates bond force. Result
displayed (scale factor and force used to
lift tool).
• Remove weight. Select OK
o Ultra-Sonic Generator (USG)
Purpose: To tune ultrasonic generator output to
resonant frequency of ultrasonic system
Procedures:
• Select CALIBRATION>BOND HEAD>USG
• The old impedance reading is taken. Select
Calibrate.

49
 • Wait until the machine finish calibrating. New
impedance reading is taken (the range must be
between 15 to 60 ohm). Select Accept
o Electro Flame-Off (EFO) Height
Purpose: to set bond position where capillary tip is
level with top of EFO wand.
Procedures:
• Select CALIBRATION>BOND HEAD> EFO
HEIGHT
• The initial height is taken
• The bond head is chess to front. Enable Z
chess (press [SHIFT] + [F9])
• Perform wand height calibration:
o Press up/down arrow keys on control
panel to align capillary tip level with
EFO wand top surface
o The height must be at height of 270
mils
o Adjust the EFO wand height to be
aligned with the capillary tip. Select
Accept
e) Setup:
Setup is done after the calibration procedures are finished. It is one of
the most important part in PM beside calibration where positioning of
the overlay with the real die/device are involve. The setup need to done
carefully so that the bonding process is correct and to ensure less or zero
waste that will produce. The setup procedures are also almost as the
same as calibration where most setup are according to the machine need.
Normal setup procedures after PM are:
• Teaching heat-block position

50
 The position of heat block is teach to ensure the center between
front and rear rail, and for the alignment of indexing the lead
frame
o Automatically enter when new program is downloaded or
select PROGRAM>MHS TEACH>TEACH HEAT
BLOCK POSITION
o The heat-block and the clamp must be is Close status
o Chess crosshair to upper left corner at one of clamp dies
cavity. Press B3,B1 (for point 1)
o Same position goes to point 2. Press B3,B1
o For point 3, the die position must be taken symmetrically
with point 1 and 2 die and chess crosshair to its lower
right corner. Press B3,B1
o Select Done
• Calibrating crosshair offset
Crosshair offset must be calibrated to make sure that the position
of bonding is as the same as the crosshair current position. Error
in calibration the offset may cause wrong bond or imprecision
bonding at the pad area
o Put dummy into magazine and place them at the pick up
area of the input elevator.
o Press Index button. The lead frame will be positioned
between clamp insert and heat block insert.
o Select CALIBRATION>BOND HEAD>CROSSHAIR
OFFSET
o Position crosshair to any where at lead frame lead area
and ‘Mark’ (B1).
o Chess the center or crosshair with the marked position.
Press ‘Calibrate’ (B3). The value of crosshair offset is

51
 shown. The value must be between 400 mils to 420 mils
only. If exceeded, the bond head top must be adjusted.
o Press OK

• Teach bond position

This task must be done to ensure that the lead frame is indexed
with the correct position. Incorrect position may cause wrong
bond or failure when bonding.
o Make sure that the lead frame is inside the magazine and
placed at the pick up area.
o Select PROGRAM>MHS TEACH> TEACH BOND
POSITION
o Leaf frame is automatically indexed, and enter the lead
frame position menu.
o Chess the crosshair at the upper left corner (press B1) and
lower right corner symmetrically (Press B1) of the lead
frame that can be viewed at the clamp cavity. This to
center the lead frame and die with the clamp cavity. Press
Done
o Operator point is teach as the same as the previous upper
left corner position. Press B1, OK and Done
o The eye points of the lead frame are teach at the upper
left corner (press B3,OK) and the lower right corner
(press B3, OK) at one of the device/die only. Press Done
• Overlay aligning
The overlay must be aligned with the current device so that the
bond head can bond at the right place on the die by following the
overlay position.
o The position of the dummy/production must be at the
right place for bonding

52
 o The overlay is shown.
o One of the overlay point at Pad side for device #1 are
centered with the crosshair
o Select DEVICE OPERATION>MORE
SELECTOR>SELECT ALL>DONE>MOVE
o The arrow of the scroll ball must be in the camera view
side. Press B1. A red box appeared at the middle of the
crosshair
o The crosshair is pointed at the same Pad point and the
same device number but only at the real device. The
crosshair is centered at the pad side. Press B1. The
overlay is on top of same device number as it self.
o Edit Reference System selected. Press B1 (arrow inside
camera view side). The position of Pad is aligned
according to program specification. Eye points are taught
for the pads. Lighting at the pads is also being taught too.
o Crosshair is chassed at one of the Leads point.
o Select Edit Reference System. Press B1 (arrow inside
camera view side). The position of Leads is aligned
according to program specification. Eye points are taught
for the Leads. Lighting at the pads is also being taught
too.
o Align reference selected, Align entire package.
o
f) Test Bond:
Test bond is done after the overlay finished align with the current device.
It is best if done at the dummy to make sure that the bonding is correct
before the production is ran. At the test bond, crosshair offset, bond
position and ball shape will be corrected. Before the test started, gold

53
 wire must be inserted through the tensioner, wire clamp and capillary
and bond off first.
o AUTO is selected. Press Run/Stop
o The bonds at the pads are check to ensure that it is hundred
percent inside the pad box.
o Crosshair offset must be done if the bond does not hundred
percent in side the pads
o The test bond is ran again and again until all the side get accurate
bonding and no other problems occurs

Figure 4.7: Correct Bond. 100% Figure 4.8: Incorrect Bond or

inside pads misplace. Due to wrong crosshair
offset
g) Ready for Production
After all calibration and setup are completed, the program is the checked
at the host computer to ensure that the specifications are followed. The
machine is ready for continuing running the production.

54
4.3 Additional tasks
• Helping engineer with newly arrived machine
New arrived machine must be handled carefully to prevent for any
damages to the machine

Figure 4.9: New arrived machine to be sent to production line

• Set grounding to most ungrounded machines

Machine that supplied with electricity need to be ground to prevent from
damaging the machine of harming the user safety is short circuit happen
• Making pneumatic connection from supply to machine
The gold bonding machine also uses the pneumatic system. For the
machine that have problem in it air system or new machine, the
connection must be made so that the machine can he used.
• Repair wiring & PM ISP 3000 Inspection machine

Figure 4.10: ISP 3000 Inspection machine (one a year PM)

55
The machine is placed at the 3rd opt section. The PM work not only
servicing gold wire bonder machine but also other machine that closely
connected with the gold wire bonder

5.0 CONCLUSION

56
5.0 CONCLUSION
Through out the twenty weeks of industrial training in STATS ChipPAC (M) Sdn. Bhd.,
lots of things have been learnt and it was a great experience. The knowledge in the real
industries is gained and useful in the future especially after the graduation.
From the training experience, trainee will get use to the way of working in the
industries where it was a difference then the life at campus. More type of person they
will encounter and for the training experience that they manage to adjust themselves
when working someday. This is important to prevent culture shock that may bring
negative influents to their life. A successful blender can result to harmony partnership
with the other workers and that can help the company environment to be the best place
for work.
Training in STATS ChipPAC can gain lots of knowledge especially about new
machine that did not have in the university. The knowledge include on the purpose of
the machine, where does it made, cautions on handling, the important of maintenance
and many more. All of this knowledge not only for the machine that use in the factory,
but can be applied to other machine that can be found in other industries or even in the
university.
The important of maintenance is one of the useful knowledge to be gained.
Maintenance plays higher role on maintaining the efficiency of a machine. Machine that
does not go through maintenance can resolve to slow productivity or damaged. All parts
must be ensured it effectiveness so the efficiency will be increase. Maintenance can also
be applied to other then machine, even human life it self.
Most of the training activities do follow the underlying industrial training
objective where Manufacturing / production process and or its optimization process are
learnt for the maintenance activities to ensure the efficiency of the machine.
Maintenance and repair of machineries or equipments is also gained directly. For

57
 Product testing and quality control, this is the knowledge that is gained after each time
finishing the preventive maintenance.

SUGGESTIONS FOR FINAL YEAR PROJECT

For final year project, I would like to create a robot arm to pick and place the thing from
one place to another. Sometimes the thing is too heavy for human to lift it. So, robot arm
are useful in this situation. The robot arm will suitable for production environment.

The robot arm will sense the thing, pick up the pieces and grab it. The arm will holding the
piece, make a move from right to left and vice versa and put it in the right place. The arm
will consist electronics, mechanical, controls and programming. The sensors and materials
to build the arm are one of the important parts.

The arm is about basic robotic sensing and locomotion principles and controlling the arm. It
can be command to grab, release, lift, lower, rotate wrist and pilot sideway 180 degrees.
The arm provides five axes of motion.
1. Base Right / Left 180 degrees
2. Shoulder 90 degrees
3. Elbow 90 degrees
4. Wrist rotate counter clockwise and clockwise 180 degrees
5. Gripper open and close

58
59