STM-x_win32.

exe Manual
for use with STM-1 and STM-2

2008 Sycon Instruments STM-x_win32.exe manual 08/06/08 Page 1 of 28

Introduction
This manual describes how to operate the STM-1 or STM-2 in conjunction with the
Windows program STM-x_win32.exe.
STM-x_win32.exe is the user interface for the Sycon STM-1 or STM-2. The STM-1 is an
RS-232 or RS-485 based QCM, whereas the STM-2 is USB based. Both instruments have the same
high accuracy and high speed measurement engine. STM-x_win32.exe is an improvement over the
previous generation in the following ways:

Thickness is accurate even if the STM-1 or STM-2, the host PC, or both reboot. Even if the
reboot occurs during a deposition, once the STM and this STM-x_win32.exe are back on-line
the thickness will be accurate

Uses far fewer CPU resources that previous generations, which improves performance

instrument finder allows easy connection to STM-1 or STM-2.

Built-in materials library for faster and easier setup

Revision History
Date

Decription

2008-08-06

Initial revision

2008-09-16

Added details of # samples parameter

Minimum System Requirements

Processor

Pentium III/Celeron 866 MHz or equivalent

Ram

128 MB

Screen

1024 x 768 pixels

OS

Windows Vista/XP/2000

Disk Space

1M

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Table of Contents
Introduction................................................................................................................................................2
Minimum System Requirements................................................................................................................2
Typical Vacuum System Installation Diagrams.........................................................................................5
Illustration 1: System Diagram using STM-1............................................................................................5
Illustration 2: System Diagram using STM-1X.........................................................................................5
Illustration 3: System diagram using STM-2 and it's internal oscillator....................................................6
Illustration 4: System diagram using STM-2 and external oscillator (OSC-100)......................................6
Using STM-x_win32.exe with the STM-1 or STM-2................................................................................7
STM-1 and STM-2 LEDs description........................................................................................................8
STA(STM-1) or Power (STM-2)..........................................................................................................8
COM(STM-1) or USB(STM-2)............................................................................................................8
Illustration 5: Setup tab..............................................................................................................................9
FindInst..................................................................................................................................................9
Sim Rate hz/sec.....................................................................................................................................9
Display mode.........................................................................................................................................9
Multi-layer mode.................................................................................................................................10
Run#....................................................................................................................................................10
Datalog controls.......................................................................................................................................10
Off/On.................................................................................................................................................10
Log period...........................................................................................................................................10
Logfile Naming...................................................................................................................................10
Delimiter..............................................................................................................................................11
Logfile folder.......................................................................................................................................11
View Log.............................................................................................................................................11
Illustration 6: Operate tab........................................................................................................................12
Zero film Thk......................................................................................................................................12
Zero Timer...........................................................................................................................................12
Pause....................................................................................................................................................12
New Run..............................................................................................................................................13
New Layer...........................................................................................................................................13
Change Film........................................................................................................................................13
Layer Stackup......................................................................................................................................13
Illustration 7: films tab.............................................................................................................................14
Description of film parameters.................................................................................................................14
Name...................................................................................................................................................14
Density.................................................................................................................................................14
Z-ratio..................................................................................................................................................15
Tooling................................................................................................................................................15
Notes....................................................................................................................................................15
Illustration 8: The film editor...................................................................................................................16
Illustration 9: graphs tab..........................................................................................................................17
Autoscale and manual scaling.............................................................................................................17
Exporting a picture of the graph..........................................................................................................17
Illustration 10: help/about tab..................................................................................................................18
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Location of current logfile...................................................................................................................18

(Advanced) Location of config file.....................................................................................................18
Com Success........................................................................................................................................18
Com Errors..........................................................................................................................................19
SVR Build...........................................................................................................................................19
#instances............................................................................................................................................19
Last Comm (ms)..................................................................................................................................19
Last Error.............................................................................................................................................19
Logfile Format.........................................................................................................................................20
Calibration and Theory............................................................................................................................22
Thickness Reading Calibration...........................................................................................................22
Initial density, Z-ratio settings.............................................................................................................22
Initial tooling setting...........................................................................................................................22
Empirical Density Determination........................................................................................................23
Empirical Z-Factor Determination......................................................................................................23
Empirical Tooling Determination.......................................................................................................23
Illustration 11: Empirical Tooling Determination....................................................................................24
Materials reference...................................................................................................................................25

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Typical Vacuum System Installation Diagrams

Illustration 1: System Diagram using STM-1

Illustration 2: System Diagram using STM-1X

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Illustration 3: System diagram using STM-2 and it's internal oscillator

Illustration 4: System diagram using STM-2 and external oscillator (OSC-100)

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Using STM-x_win32.exe with the STM-1 or STM-2

STM-x_win32.exe is the main user interface for the STM-1 or STM-2 QCM. Below list the
steps required to use STM-x_win32.exe with the STM-1 or STM-2.

Install the STM-1 or STM-2 as per diagram.

Install STM-x_win32.exe on the PC

Run STM-x_win32.exe and press find inst. Select your instrument.

At this point, the indicators should start moving and the com success counter on the help/about tab
should be incrementing. This means you are connected and ready to go

Program some films. When STM-x_win32.exe is installed, there is only the default film
programmed. See the films tab help page for more information

Set any other controls on the setup tab as required. See the setup tab help page for more
information

At this point, you are ready to monitor a deposition

Go to the operate tab. Most operations that you'll perform during the monitoring of a deposition
are done from this tab

Press New Run. Select the appropriate film

Perform the deposition. You will probably press zero film just before you open the source
shutter.

If you are doing a multi-layer deposition, you will press new layer when you are finished with
one material and are about to deposit the next. STM-x_win32.exe keeps track of the layers and
total thickness for you.

When you are finished with the substrate, you can press new run to end the current substrate
and start a new one.

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STM-1 and STM-2 LEDs description

STA(STM-1) or Power (STM-2)
Condition

What it means

LED is on solid

Basically everything is OK. The STM-1/STM-2

is powered up and is connected to a good crystal,
and the host computer has initialized the
STM-1/STM-2.

LED is blinking fast (too fast to count)

The STM-1/STM-2 is powered up but the crystal

is no good.

LED is blinking slow (about once per second)

The STM-1/STM-2 is powered up and the crystal

is good, but the PC has not initialized the STM-1/
STM-2. Once the PC initializes the
STM-1/STM-2 the light will go on solid.

LED is OFF

STM-1/STM-2 does not have power. Check the

power and USB connection

COM(STM-1) or USB(STM-2)
Condition

What it means

LED is on solid

STM-1/STM-2 is connected and communicating

to a host PC

LED is blinking or flickering

The STM-1/STM-2 is connected and

communicating to a host PC, but the
communication is erratic. This occurs when the
PC is overloaded (running too many other
programs)

LED is OFF

STM-1/STM-2 is not communicating to the PC at

all. Verify the USB or serial connection and use
the find inst button on the STM-x_win32.exe
application to connect to the instrument.

The following sections detail all of the controls of STM-x_win32.exe. Furthermore, information on any
of the controls can be displayed by right clicking on the control and selecting Description and tip...

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Illustration 5: Setup tab

This tab has the controls that set up how STM-x_win32.exe operates, how it connects to an
instrument, and how and where it logs the data.

FindInst
Press to find an instrument to connect to. STM-x_win32.exe can connect to a STM-1, STM-2, or a
simulated instrument. The simulated instrument exactly simulates a STM-2; to provide a rate you need
to adjust the "Sim Rate hz/sec" control, which is on the setup tab (and only visible if you are connected
to a simulated instrument). See the description of the "Sim Rate hz/sec" control for more information

Sim Rate hz/sec

This adjusts the simulated "rate" in Hz per second. A negative value provides a positive thickness/mass
accumulation.

Display mode
This sets the display mode for the STM-x_win32.exe. In other words, this controls the operative units
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for deposition. It is not recommended to change this during a run, as the charts and logfile will
contain mixed units.
Mass mode units:
Mass in ug/cm (micrograms per square centimeter)
Rate in ug * s/cm (micrograms per square centimeter per second)
Thickness mode units:
Thickness in Angstroms
Rate in Angstroms per second

Multi-layer mode
If this box is checked, STM-x_win32.exe will operate in "multi-layer" mode, keeping track of substrate
thickness across multiple layers. STM-x_win32.exe will keep track of the individual thicknesses of all
layers as well as the total substrate thickness

Run#
The current run number. Note that you can change the run number, even during a deposition. If you do,
STM-x_win32.exe will make a new log which will not contain any information that occurred before the
run number was changed.

Datalog controls
Off/On
This enables or disables logging. You can change this at any time

Log period
This controls how often a record will be written to disk. Any information captured in between writes to
disk is discarded.

Logfile Naming
This controls how the log file will be named.
If you choose "Run#", STM-x_win32.exe will create a new and unique file for each run
(named RUN#00001.txt for run 1).
If you choose "STMxlog.txt", STM-x_win32.exe will put information about all runs in the
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same log file.

Delimiter
This sets the delimiter for the logfile.
Tab delimiter is recommended because tab delimited files properly open up in Microsoft
Excel and OpenOffice Calc without any resistance.
Comma delimited files are available as an option for compatibility with older programs

Logfile folder
Use this control to select the folder where the logfile(s) will be placed. Press the folder icon button on
the right to launch a browse window.

View Log
This pops open a notepad window of the current log file. Note that you'll only see the file as it looked
when you pressed view log; you will not see records go into the file live.

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Illustration 6: Operate tab

This tab is used to operate the instrument. Use this tab to perform the operations required
during a deposition.

Zero film Thk

Zeros film Thickness or mass

Zero Timer
Zeros film timer

Pause
Pauses logging & graphing. The data is still polled from the instrument, however, and displayed in the
indicators, but the charts and log file are frozen. The background for runtime data indicators will be red
while paused
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New Run
Starts a new run by
1) (Multi-layer mode) Empties the layer stackup
2) Zero all thicknesses and timers
3) Prompts for a new film
3) Increments run#

New Layer
Adds a new layer to the substrate by:
1) Moves the current film into layer stackup
2) Prompts for new film for this layer
3) zeros the film thickness and timer
Note that this option is only available in multi-layer mode

Change Film
Changes the active film. Pressing this launches a dialog that allows you to choose a film to run. Not
that the existing thickness is not zeroed. If using the STM-2, the thickess is re-computed from the new
z-ratio and tooling; but if you are using the STM-1 the thickness is not recomputed; the thickness will
not change. If you do not see the film you want to run, you will need to add it via the film editor.

Layer Stackup
This displays the "stackup" of materials on the current substrate. To add a new layer to the substrate,
you click on "New Layer"
The "newest", and therefore current, layer is on the bottom of this table,
You cannot remove layers from this indicator, but you can clear the entire stackup by selecting "New
Run"

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Illustration 7: films tab

This page displays all of the films you have created and stored. To edit this list, click on "Edit
films" to launch the film editor.

Description of film parameters

Name
The name of the film. You can name the film anything you choose.

Density
The density of the material being deposited, in gm/cc. This really only matters if you are using the
thickness mode. "Bulk" density numbers can be found in the manual for common materials. For
uncommon materials, a procedure for empirical determination can be found in the calibration section of
this manual.
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Z-ratio
The Z-ratio of the material being deposited. "Bulk" density numbers can be found in the manual for
common materials. For uncommon materials, a procedure for empirical determination can be found in
the calibration section of this manual.

Tooling
This is the "tooling" factor and relates to the physical construction of your deposition chamber. A
tooling of 100% means that the crystal sensor sees the same amount of material as the substrate. A
procedure for empirical determination of tooling can be found in the calibration section of this manual.

#Samples
This is the number of samples/measurements to place in the measurement filter. The filter is a boxcar
FIR filter, where the samples are evenly weighted and averaged. More samples means higher rate
resolution, so very low rate films will need to average some samples. The downside of averaging is that
there is a delay (time constant) introduced by averaging samples. The time constant is
#samples averaged
0.135 / s
seconds and the rate resolution is
for aluminum (density
10
#samples averaged
= 2.73, zratio = 1.08, xtal life=95%). In general the rate resolution for a new crystal is:
0.368 / s
#samples averagedDensity gm/ cc

Note: The STM-1 has a fixed averaging (#samples) set at 20, and therefore changing this
parameter has no effect.

Notes
Just a field that allows you to make notes about a material

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The film editor

Illustration 8: The film editor

The film editor allow you to add, delete, and change film programs. The film editor includes a built in
materials library simplifying setup.

To add a pre-pregrammed material, simply press the materials tab.

To delete a film, right click in any cell in the film's row ans select delete row
To add a film, you can 'tab' or click to an empty cell and type in the parameters of the new film
To add a film in the middle of the table, right click in a cell and select add row before

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Illustration 9: graphs tab

This pages shows just one of the three graphs. The graphs hold about an hours worth of data,
and but the X and Y scales adjust automatically.

Autoscale and manual scaling

If you would rather not have the graph automatically scale the X and/or Y axis, simply right click on
the graph and de-select autoscale x and/or autoscale y. Once autoscaling is turned off, simply click
on the scales and change the numbers to the desired range.

Exporting a picture of the graph

You can also export the data from the charts in multiple formats by right-clicking on the chart and
selecting Export Simplified Image or Copy Data

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Illustration 10: help/about tab

This page shows some diagnostic information, such as where the logfile is or how well the
instrument is communicating with the PC

Location of current logfile

Shows the current log file being built by STM-x_win32.exe. This log file contains the runtime
information like rate, thickness, etc. See a sample of the log file in appendix ss

(Advanced) Location of config file

Shows the configuration file in use by STM-x_win32.exe. The configuration file contains all of the
settings for the STM-x_win32.exe, including all of the films.

Com Success
Shows how many times STM-x_win32.exe communicated with an instrument successfully.
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Com Errors
Shows how many times STM-x_win32.exe tried to communicate to an instrument and failed

SVR Build
The build/version of the communication server

#instances
Shows how many clients are using the communication server. It is possible to have multiple instances
of STM-x_win32.exe are running, and furthermore it is possible to have other programs running that
access the same instrument without conflict.

Last Comm (ms)

Shows how long it took for the instrument to respond to a command, in milliseconds. This includes the
time that it took to receive all of the data.

Last Error
Shows the status of the last communication error. The error code and source describe the error.

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Logfile Format
The log file is a tab (or comma) delimited text file that contains the runtime data and status
information. When the log file is created, a header is placed into the file so that the data in the columns
can be identified. Note that if you change the display mode (mass/thickness) during a run, the
header is not changed, so the data will not match the header. A record is placed into the log file
periodically based on the 'Log Period' control. The logfile is designed to easily import into Microsoft
Excel, OpenOffice Calc, and other spreadsheet programs. The following describes the data contained in
the log file.
Timestamp
The time of the record data in ISO 8601 format. This format was chosed because it readily
imports into all popular spreadsheets and databases, and sorts well.
StatusLine
The status line as it was shown on the screen. This contains:
The program status, running or paused (see the pause button on the operate tab)
The running film timer
Crystal Life
The run number
The datalogging status (On or off)
The name of the active film
Rate
The deposition rate of the current film in /S or ug.s/cm
Thickness/mass
The thickness or mass of the current film in Angstroms () or ug/cm
Substrate thickness/mass
The total substrate thickness/mass in Angstroms () or ug/cm. Note that this number is only
meaningful in multi-layer mode
Frequency
The frequency of the crystal in Hz

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Example Logfile (thickness mode)

Timestamp StatusLine

Rate (/S) Film

Thickness
(k)

Substrate
Thickness
(k)

Frequency
(Hz)

2008-07-29 RUNNING | 0:00:21 | Life 0.35

T21:54:54 50% | RUN# 0 |
LOGGING OFF | Film
DEFAULT

0.000

0.000

6000000.04

2008-07-29 RUNNING | 0:00:22 | Life 0.06

T21:54:55 50% | RUN# 0 |
LOGGING ON | Film
DEFAULT

0.000

0.000

6000000.02

2008-07-29 RUNNING | 0:00:23 | Life -0.13

T21:54:56 50% | RUN# 0 |
LOGGING ON | Film
DEFAULT

0.000

0.000

6000000.06

Example Logfile (mass mode)

Timestamp StatusLine

Rate
Film Mass Substrate
Frequency
(ug.s/cm) (ug/cm) Mass (ug/cm) (Hz)

2008-08-06
T22:36:31

RUNNING | 0:00:03 | Life

50% | RUN# 1 | LOGGING
OFF | Film F1

0.01

0.043

0.043

5989938.46

2008-08-06
T22:36:36

RUNNING | 0:00:08 | Life

50% | RUN# 1 | LOGGING
ON | Film F1

0.01

0.104

0.104

5989888.40

2008-08-06
T22:36:37

RUNNING | 0:00:10 | Life

50% | RUN# 1 | LOGGING
ON | Film F1

0.01

0.117

0.117

5989878.06

Although it is shown in table format, the log data file is ASCII text, with tab characters separating the
table columns and the newline character separating the rows. Also note that the only difference
between the two different modes is the header.

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Calibration and Theory

Thickness Reading Calibration
Instrument calibration is affected by three different parameters: material density, material Z-Factor, and
tooling. Tooling is a deposition system geometry correction (location of sensor relative to substrates).
Density and Z-Factor are material factors.

Initial density, Z-ratio settings

For density and z-ratios, using the bulk values are usually accurate enough. A list of Z-Factor values
may be found in the material reference table . For materials not listed in the table, Z-Factor may be
calculated by the following formula:
Dq Uq
Z Factor =

Df Uf

where:
Dq = Density of quartz
Uq = Shear modulus of quartz
Df = Density of film
Uf = Shear modulus of film
Initial tooling setting
For the initial tooling value, use the following formula:

d cos( vs )
Tooling(%) = vx
100
d
cos
(

)
vx
vs
2

where:
dvx = Distance between source and crystal/sensor
dvs = Distance between source and substrate
vs = Angle of the substrate face off a straight line to the source
vx = Angle of the crystal face off a straight line to the source
For the above angles, an angle of 0 means the face of the crystal or substrate points directly toward the
source.

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Empirical Density Determination

Use of the material bulk density value will normally provide sufficient film thickness accuracy. If
additional accuracy is required, the following procedure may be used: Using a new sensor crystal (this
eliminates Z-Factor errors) place a substrate adjacent to the sensor so that both sensor and substrate see
the same evaporant stream. Set the instrument density to the bulk value of the material (see the Material
Reference Table in section 4.3). Set the Z-Factor to 1.000 and the tooling factor to 100%. Deposit
approximately 5000 angstroms of material on the sensor and substrate. After deposition remove the
substrate and measure the film thickness with a profilometer or multiple beam interferometer. The
correct density value may be determined by the formula:
gm ( DensityParameter ) ( Reading)
Density
=
( MeasuredThickness )
cc
The calculated value may be checked by setting the density parameter to the calculated value and
observing that the thickness display shows the corrected reading. Minor value adjustments can be made
to make the measurements and calculations exactly equal.

Empirical Z-Factor Determination

Use the calibrated density value, a Z-Factor of 1.000 and a tooling of 100%. Deposit a thick film using
at least 50% of the sensor crystal life. Measure the substrate and then adjust the Z-Factor parameter
until the correct thickness is displayed.

Empirical Tooling Determination

Place a substrate in the normal holder location and deposit a film of approximately 5000 angstroms
using either bulk or calibrated density and Z-Factor values. Make sure that when doing this calibration
the tooling is set to 100%. Measure the substrate film thickness as in the density calibration method and
determine the correct tooling factor value by the following formula:
Tooling( %) = 100

( SubstrateThickness )
( DisplayedThickness )

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Illustration 11: Empirical Tooling Determination

The calculated value may be checked by setting the tooling parameter to the calculated value and
observing that the thickness display shows the corrected reading. Minor value adjustments can be made
to make the measurements and calculations exactly equal.

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Materials reference
This table shows the materials that are available in the built-in materials library. Note that
you do not have to enter this information manually; it is already in the program. It is included here for
reference.

Material

Symbol

Density

Z-Factor

Aluminum

Al

2.73

1.080

Aluminum Oxide

Al2O3

3.97

--------

Antimony

Sb

6.62

0.768

Arsenic

As

5.73

0.966

Barium

Ba

3.50

2.100

Beryllium

Be

1.85

0.543

Bismuth

Bi

9.80

0.790

Bismuth Oxide

Bi2O3

8.90

--------

Boron

2.54

0.389

Cadmium

Cd

8.64

0.682

Cadmium Selenide

CdSe

5.81

--------

Cadmium Sulfide

CdS

4.83

1.020

Cadmium Telluride

CdTe

5.85

0.980

Calcium

Ca

1.55

2.620

Calcium Fluoride

CaF2

3.18

0.775

Carbon (Diamond)

3.52

0.220

Carbon (Graphite)

2.25

3.260

Cerium (III) Fluoride

CeF3

6.16

--------

Cerium (IV) Oxide

CeO2

7.13

--------

Chromium

Cr

7.20

0.305

Chromium (III) Oxide

Cr2O3

5.21

--------

Cobalt

Co

8.71

0.343

Copper

Cu

8.93

0.437

Copper (I) Sulfide (A)

Cu2S (A)

5.60

0.690

Copper (I) Sulfide (B)

Cu2S (B)

5.80

0.670

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Material

Symbol

Density

Z-Factor

Copper (III) Sulfide

CuS

4.60

0.820

Dysprosium

Dy

8.54

0.600

Erbium

Er

9.05

0.740

Gadolinium

Gd

7.89

0.670

Gallium

Ga

5.93

0.593

Gallium Arsenide

GaAs

5.31

1.590

Germanium

Ge

5.35

0.516

Gold

Au

19.3

0.381

Hafnium

Hf

13.1

0.360

Hafnium Oxide

HfO2

9.63

--------

Holnium

Ho

8.80

0.580

Indium

In

7.30

0.841

Indium Intimonide

InSb

5.76

0.769

Indium Oxide

In2O3

7.18

--------

Iridium

Ir

22.4

0.129

Iron

Fe

7.86

0.349

Lanthanum

La

6.17

0.920

Lanthanum Fluoride

LaF3

5.94

--------

Lanthanum Oxide

LaO3

6.51

--------

Lead

Pb

11.3

1.130

Lead Sulfide

PbS

7.50

0.566

Lithium

Li

0.53

5.900

Lithium Fluoride

LiF

2.64

0.774

Magnesium

Mg

1.74

1.610

Magnesium Fluoride

MgF2

3.00

--------

Magnesium Oxide

MgO

3.58

0.411

Manganese

Mn

7.20

0.377

Manganese (II) Sulfide

MnS

3.99

0.940

Mercury

Hg

13.46

0.740

Molybdenum

Mo

10.2

0.257

Neodynium Fluoride

NdF3

6.506

--------

Neodynium Oxide

Nd2O3

7.24

--------

2008 Sycon Instruments STM-x_win32.exe manual 08/06/08 Page 26 of 28

Material

Symbol

Density

Z-Factor

Nickel

Ni

8.91

0.331

Niobium

Nb

8.57

0.493

Niobium (V) Oxide

Nb2O5

4.47

--------

Palladium

Pd

12.0

0.357

Platinum

Pt

21.4

0.245

Potassium Chloride

KCl

1.98

2.050

Rhenium

Re

21.04

0.150

Rhodium

Rh

12.41

0.210

Rubidium

Rb

1.53

2.540

Samarium

Sm

7.54

0.890

Scandium

Sc

3.00

0.910

Selenium

Se

4.82

0.864

Silicon

Si

2.32

0.712

Silicon (II) Oxide

SiO

2.13

0.870

Silicon Dioxide

SiO2

2.20

1.070

Silver

Ag

10.5

0.529

Silver Bromide

AgBr

6.47

1.180

Silver Chloride

AgCl

5.56

1.320

Sodium

Na

0.97

4.800

Sodium Chloride

NaCl

2.17

1.570

Sulfur

2.07

2.290

Tantalum

Ta

16.6

0.262

Tantalum (IV) Oxide

Ta2O5

8.20

0.300

Tellurium

Te

6.25

0.900

Terbium

Tb

8.27

0.660

Thallium

Tl

11.85

1.550

Thorium (IV) Fluoride

ThF4

6.32

--------

Tin

Sn

7.30

0.724

Titanium

Ti

4.50

0.628

Titanium (IV) Oxide

TiO2

4.26

0.400

Titanium Oxide

TiO

4.90

--------

Tungsten

19.3

0.163

2008 Sycon Instruments STM-x_win32.exe manual 08/06/08 Page 27 of 28

Material

Symbol

Density

Z-Factor

Tungsten Carbide

WC

15.6

0.151

Uranium

18.7

0.238

Vanadium

5.96

0.530

Ytterbium

Yb

6.98

1.130

Yttrium

4.34

0.835

Yttrium Oxide

Y2O3

5.01

--------

Zinc

Zn

7.04

0.514

Zinc Oxide

ZnO

5.61

0.556

Zinc Selenide

ZnSe

5.26

0.722

Zinc Sulfide

ZnS

4.09

0.775

Zirconium

Zr

6.51

0.600

Zirconium Oxide

ZrO2

5.6

--------

2008 Sycon Instruments STM-x_win32.exe manual 08/06/08 Page 28 of 28