OneC-AMR GPRS baseband

Philips OneC-AMR GSM/GPRS baseband is designed to support the new Adaptive Multi-Rate (AMR) voice codec recently finalized by ETSI which offers enhanced voice quality and optimum cellular network capacity.The OneC-AMR also supports multiple frequency bands, for worldwide roaming, and E-OTD location-based services.

One-chip baseband with enhanced voice quality for 2.5G GSM/GPRS handsets

Semiconductors
VABFE PRAM PCM OAK+ PROM IT& Timer SDI DMA JTAG GPRS Cipher MMU SRAM 8k x 8 RTC SIM ICE Breaker IT & Timer IT & Timer SRAM 8k x 8 Key Pad UART lrDA Exchange Buffers Exchange Controls Viterbi Cipher & Audio DROM Mode & Conf Reg FIFO DRAM FIFO GM SK RX ADC

General information
The OneC-AMR, the latest member of the OneC single-chip baseband family is designed to enable the development of highly-integrated 2.5G GSM/ GPRS handsets. In order to further improve the OneC familys performance (power consumption, core speeds and feature sets), this IC not only includes the AMR codec but also supports up to Class 10 GPRS, enabling faster downloads in the wireless domain.

PLL & Clock DAI

PolyPhase AGC & RSSI AFC TXB

Boot ARM CSGEN SRAM 8k x 8 Aux ADC GPIO PWM 4 KByte Cache LCD GPSI

Key Blocks
SPW RFEN PLL I/F

ARM Subsystem The embedded 32-bit ARM7 processor drives the peripheral interfaces, power management, all 3 layers of the GSM protocol stack, the MMI software and some data applications. Dedicated on-chip SRAM enables the ARM7 processor to run at 52 MHz internally and so provide that extra reserve for MIPS-intensive applications and executables. DSP subsystem The Oak+DSPCore provides the processing power for all GSM-specific signal processing, (voice coding, equalization, and channel coding). The DSP can access external memory arbitrated by the ARM MMU allowing external DSP software to be downloaded into the internal DSP memory as well as allowing use of external memory as workspace extension. Peripheral blocks The OneC-AMR brings together all necessary peripheral blocks on chip, minimizing external components and reducing cost and size of handsets (minimal required PCB area). For the application system, there is a GSM timer, GPRS ciphering acceleration unit, memory protection unit; an extended interrupt controller with 16 possible sources; 2 system timers and a watchdog timer; 10 bit auxiliary ADC with 4 multiplexed input channels and asynchronous/synchronous mode and up to 16 GPIOs.

Key Features
Full GSM phase 2 speech coding Supports quad-band operation: GSM850, GSM900, GSM1800, GSM1900 Support GPRS Classes 1-10 Support E-OTD Offers GPRS Class 10 data transfer Flexible radio interface: - compatible with all established RF solutions in the market - supports Philips low-IF interface Embedded software features include: - full-duplex speech recording algorithm - long & short echo cancellation and noise suppression - polyphonic melody generation (FM synthesizer) - TeleTYpe (TTY) automatic voice-to-data translation ARM7TDMI RISC processor running at 52 MHz internally OAK+DSPCore running at 65 MHz Low power consumption through efficient power management typical standby times of > 500 hours can be achieved with a 600 mAh battery Based on 0.25 m mixed-signal technology.

OneC-AMR GPRS baseband

One-chip baseband with enhanced voice quality for 2.5G GSM/GPRS handsets

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For the user interface theres a SIM, keypad and PWM/alerter controllers; a LCD driver and a 32 KHz real-time clock (RTC). For the general purpose serial bus interface, there are 2 UARTs up to 460.8 kbaud with FIFO of 64 bytes; 2low-speed IrDA encoders/decoders up to 115.2 kbaud and 3 dedicated SPIs up to 13 Mbit/s & I C-bus interface up to 400 kbit/s.
2

analog and digital interfaces for Rx Automatic Gain Control (AGC) GMSK modulator with 10 bit I/Q DAC and low noise filter I/Q Rx 10-bit ADC multi-band Automatic Frequency Control (AFC) & synthesizer control dynamic DC-offset correction & digital Rx filtering

ARM software and DSP firmware library Philips ARM software and DSP firmware library includes all GSM Phase 2 algorithms as well as a wide set of complementary DSP features/algorithms. It consists of: voice-coding algorithms for RF, EFR, HR, AMR equalizer and channel coder algorithms. data compression/coding for T/NT data, GPRS, HSCSD echo cancellation, noise suppression & voice recognition GSM L1 modules to accelerate software integration FM synthesis

Audio interface Our advanced mixed-signal technology also allows the audio front end to be integrated on-chip.The codec meets G712 requirements and enables the direct connection of the audio transducers to the chip.The OneC programmable audio front-end control adjusts the amplitude of audio signals. Tools A wide set of development tools are available to support customers including development boards for software and RF integration, real-time trace support (for HP165xx series and Lauterbach Trace 32) and multicore development tools (including compilers, simulator, debugger and emulator).

SDI, Debug capability The Smart Debug Interface (SDI) provides full-context access to the multiprocessor core and the complete address space.The multi processor can be stopped at any stage through programmable break points in the ARM and DSP software. Once a breakpoint is reached, the system information is transferred through a serial JTAG interface to a host computer.The embedded trigger logic allows combined break points for the DSP and ARM code to be set, which forms the foundation for effective real-time multi-processor debugging. Radio interface Philips Semiconductors advanced mixed-signal technology allows the RF analog front-end to be integrated directly on-chip providing an efficient interface with the radio part of a GSM terminal.The radio interface features include: compatible with Philips new low Intermediate Frequency (low-ZIF) RF architecture and with third-party RF solutions programmable Tx power ramp (10-bit DAC) Packaging and availability The OneC-AMR is available in a 180FPBGA package with either a 12 x 12 mm, or a 10 x 10 mm footprint. Samples are available and mass production will start in the summer of 2003 (part number:VWS22140).

Philips Semiconductors
Philips Semiconductors is a worldwide company with over 100 sales offices in more than 50 countries. For a complete up-to-date list of our sales offices please e-mail sales.addresses@www.semiconductors.philips.com. A complete list will be sent to you automatically. You can also visit our website http://www.semiconductors.philips.com/sales. Koninklijke Philips Electronics N.V. 2002

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Date of release: August 2002 Document order number: 9397 750 10045 Published in The Netherlands