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DATA SHEET
M3D065
Philips Semiconductors
Product specication
BLF244
PIN CONFIGURATION
handbook, halfpage
4 d g
MBB072
CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A, and SNW-FQ-302B.
WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
QUICK REFERENCE DATA RF performance at Th = 25 C in a common source test circuit. MODE OF OPERATION CW, class-B f (MHz) 175 VDS (V) 28 PL (W) 15 Gp (dB) >13 D (%) >50
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
UNIT V V A W C C
THERMAL CHARACTERISTICS SYMBOL Rth j-mb Rth mb-h PARAMETER thermal resistance from junction to mounting base thermal resistance from mounting base to heatsink CONDITIONS Tmb = 25 C; Ptot = 38 W Tmb = 25 C; Ptot = 38 W VALUE 4.6 0.3 UNIT K/W K/W
handbook, halfpage
10
MRA919
handbook, halfpage
50
MGP151
Ptot
ID (A)
(W) 40
(1)
(1) 1
30 (2)
(2)
20
10
101
10
VDS (V)
102
Fig.2 DC SOAR.
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
VGS group indicator LIMITS (V) MIN. A B C D E F G H J K L M N 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 MAX. 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 O P Q R S T U V W X Y Z LIMITS (V) MIN. 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 MAX. 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5
GROUP
GROUP
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
MGP152
handbook, halfpage
handbook, halfpage
MGP153
T.C. (mV/K) 0
ID (A) 4
4 2 6
8 1 10
Fig.4
Fig.5
handbook, halfpage
MGP154
handbook, halfpage
160
MGP155
RDS(on) ()
C (pF) 120
80 Cis Cos 40
0 0 10 20 30 VDS (V) 40
Fig.6
Fig.7
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
handbook, halfpage
20
MGP156
Crs (pF)
10
0 0 20 VDS (V) 40
VGS = 0; f = 1 MHz.
Fig.8
APPLICATION INFORMATION FOR CLASS-B OPERATION Th = 25 C; Rth mb-h = 3 K/W; unless otherwise specied. RF performance in CW operation in a common source class-B circuit. MODE OF OPERATION CW, class-B f (MHz) 175 175 Note 1. R1 included. Ruggedness in class-B operation The BLF244 is capable of withstanding a load mismatch corresponding to VSWR = 50 through all phases under the following conditions: Th = 25 C; Rth mb-h = 0.3 K/W; at rated load power. VDS (V) 28 12.5 IDQ PL (mA) (W) 25 25 15 6 GP (dB) >13 typ. 17 typ. 15 D (%) >50 typ. 65 typ. 60 Zi ()(1) 3.0 j4.0 3.0 j4.0 ZL () 6.3 + j9.8 4.5 + j3.3 R1 () 46.4//46.4 100
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
handbook, halfpage
30
MGP157
handbook, halfpage
20
MGP158
Gp
100
PL (W)
Gp (dB) D
D (%)
20
10
50
10 0 1 PIN (W) 2
0 0 10 20 PL (W)
0 30
Class-B operation; VDS = 28 V; IDQ = 25 mA; f = 175 MHz; Th = 25 C; Rth mb-h = 0.3 K/W.
Class-B operation; VDS = 28 V; IDQ = 25 mA; f = 175 MHz; Th = 25 C; Rth mb-h = 0.3 K/W.
Fig.9
Fig.10 Power gain and efficiency as functions of load power; typical values.
handbook, halfpage
20
MGP159
handbook, halfpage
20
MGP160
100 D (%)
Gp (dB) PL (W) 16 Gp
80
10
12
60
40
0 0 1 PIN (W) 2
4 0 4 8 12 PL (W)
20 16
Class-B operation; VDS = 12.5 V; IDQ = 25 mA; f = 175 MHz; Th = 25 C; Rth mb-h = 0.3 K/W.
Class-B operation; VDS = 12.5 V; IDQ = 25 mA; f = 175 MHz; Th = 25 C; Rth mb-h = 0.3 K/W.
Fig.12 Power gain and efficiency as functions of load power; typical values.
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
+VG R2 C6
R3
C14 C7
L6
+VD C13
L5 C2 50 input C1 L1 C5 L2 R1 L3 D.U.T. L4 L7
C8 L8
C11 C12
50 output
C9 C3 C4
C10
MGP161
f = 175 MHz.
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
CATALOGUE NO.
L2 L3, L4 L5
1 turn enamelled 1 mm copper wire stripline; note 2 6 turns enamelled 1 mm copper wire
12.2 nH 30 119 nH
L6 L7
grade 3B Ferroxcube RF choke 2 turns enamelled 1 mm copper wire 19 nH length 2.4 mm int. dia. 3 mm leads 2 5 mm length 8.5 mm int. dia. 3 mm leads 2 5 mm
L8
28.5 nH
R1 R2 R3 Notes
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality. 2. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass dielectric (r = 4.5), thickness 116 inch. 3. Refer to Application Information for value.
2003 Oct 13
Philips Semiconductors
Product specication
BLF244
150
handbook, full pagewidth
strap
rivet 70
strap
R2 +VG C2 C1 L1 C5 L2
C7 C14
MGP162
Dimensions in mm. The circuit and components are situated on one side of the epoxy fibre-glass board, the other side being unetched copper to serve as ground plane. Earth connections are made by fixing screws, copper straps and hollow rivets under the sources and around the edges to provide a direct contact between the copper on the component side and the ground plane.
2003 Oct 13
10
Philips Semiconductors
Product specication
BLF244
handbook, halfpage
60
MGP164
MGP165
handbook, halfpage
25
Zi () 40
ZL () 20
RL
MGP166
handbook, halfpage
40
Gp (dB) 36
32
28
24
20 20
40
60
80
2003 Oct 13
11
Philips Semiconductors
Product specication
BLF244
s22 18.9 36.5 65.1 85.7 99.8 109.8 117.3 123.1 127.8 131.9 135.4 142.4 147.8 152.4 156.4 162.9 168.1 172.4 176.2 179.6 177.3 171.8 166.8 162.1 157.9 162.9
2003 Oct 13
12
Philips Semiconductors
Product specication
BLF244
s22 13.8 27.1 50.1 68.2 81.7 91.9 99.9 106.4 111.8 116.6 120.8 129.3 135.8 141.4 146.3 154.2 160.5 165.7 170.1 174.1 177.6 176.1 170.6 165.5 160.9 165.9
2003 Oct 13
13
Philips Semiconductors
Product specication
BLF244
SOT123A
A F D1 q U1 C B
w2 M C M H b c
3
A
U2
U3
1 2
H
w1 M A M B M
5 scale
10 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm inches A 7.47 6.37 0.294 0.251 b 5.82 5.56 c 0.18 0.10 D 9.73 9.47 D1 9.78 9.42 F 2.72 2.31 H 20.71 19.93 p 3.33 3.04 0.131 0.120 Q 4.63 4.11 q 18.42 U1 24.87 24.64 U2 6.48 6.22 U3 9.78 9.39 w1 0.25 w2 0.51 45
EUROPEAN PROJECTION
2003 Oct 13
14
Philips Semiconductors
Product specication
BLF244
This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).
II
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Oct 13
15
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
613524/03/pp16
Oct 13