Reverse EDM - Sachin Mastud VJTI

Micro-EDM processes and Application of micro-reverse EDM process for microscale fabrication
Presented by Sachin A. Mastud VJTI, Mumbai

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Outline

Principle of EDM process Characteristics of EDM process Control of Discharge location Micro-manufacturing Scope of micromachining Classification of micromachining processes Role of micro-EDM in micromachining Micro-reverse EDM Research issues in micro-EDM related processes Experiments I micro-reverse EDM Future of micromachining
Principle of EDM
Elecro-mechanical Theory Thermo-mechanical Theory Thermo-electric Theory
10 MHz
Preparation Phase
Phase of Discharge
Interval Phase
Electrode gap monitoring and control

10 MHz
Mathematical adaptive control theory Advances in computer technology and advanced algorithms for machine control (Artificial intelligence, ANN)
4
Electrode gap monitoring and control
Debris gathering at Bubble boundary Debris and Bubble particles generated by single spark
Difficult to understand the EDM gap phenomena Even in steady state conditions
Characteristics of EDM
Arc Machining and Spark Machining Any difference? Criteria of selection of dielectric Air as a dielectric Dry EDM Flushing Suction, pressurized, interrupted, two-way, internal, oxidized dielectric Forces during EDM
Expansion, dissociation, and contraction of the bubbles formed during process Variation from maximum positive to minimum negative, negligible in case of sinking EDM however quantifiable in WEDM and Micro-EDM
Control of discharge location Measurement of discharge location Factors affecting the discharge position Discharge location
Nano-powders (Mirror surface finish) One voltage pulse for bundle of electrode Multi-spark EDM process
Interaction of parameters
Pulse conditions Pulses with longer peak current and duration achieves high MRR and less tool wear Formation of carbon layer Rough conditions Low current and low pulse duration brings high surface finish, less tool wear and low MRR High current and low pulse on time results in higher MRR, and EDM efficiency; however high tool wear Removal Rate
Time
Factors influencing the tool wear Influence of polarity normal EDM tool-positive micro-EDM Workpiece positive Influence of thermal properties to tool and workpiece material - Thermal conductivity - Higher melting or boiling point
8
Discharge Current
Surface Roughness
Tool Wear
No waveform which can satisfy all the constraints
MicroMicro-Manufacturing - What is it?

Manufacture of products with the following features:
about 100 m to about 10 mm in size contain very complex 3-D (free-form) surfaces (freeemploy a wide range of engineering materials possess extremely high relative accuracies in the 10-3 to 10-5 range
Micro-milling Fanuc - Japan
70 m - Human Hair 25 m - Characters
Zeiss - Germany Micro-parts
Micro-structures manufactured by microSLA Japan
Klocke Nanotechnik Micro-Motor
Micro-EDM NTU - Taiwan
Why Miniaturization?
Minimizing energy and materials used for the manufacture of devices Integration with electronics; simplifying systems Cost/performance advantages Faster devices Increased selectivity and sensitivity Drawback-Size effect in mechanical micromachining
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Scope of micromachining processes

MICRO MACHINING
Micro Machining
Removal of material at micro level Macro components but material removal is at micro/nano level Micro/nano components and material removal is at micro/nano level Unfortunately, the present day notion is
Definition Material removal is micro/nano level with no constraint on the size of the component
Machining of highly miniature components with miniature features NOT CORRECT

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Classification of micromachining processes

FABRICATION
Macro-fabrication Hybrid Processes Mechanical - machining USM AJM AWJM WJM
Micro-fabrication Micro-machining Beam energy based - machining EBM LBM EDM IBM PBM -nano finishing Chem. & EC - machining PCMM ECMM
Micromachining processes
Energy Used
Principle Material removal via highly concentrated force Material removal via melting and/or vaporization and debris by high pressure gas
Processes and Features Cutting, grinding, sandblasting. UR ~ 100 nm, edge radius<1 m EDM, LBM, EBM. Small UR by reduced the pulse energy, concentration of energy via ultra short pulse duration and/or sharply focused beam by optics Excimer/Femto second laser. High dimensional accuracy, less HAZ but low machining speed and high cost of equipment Injection molding, die casting, etc. curing may be required after molding and porosity
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Mechanical Force Melting and vaporization
Ablation
Decomposition of atoms using incident photon energy or direct vaporization of material via high energy pulses Liquid or paste is solidified in a mold and shape of the mold is replicated
Solidification
Micromachining processes
Energy Used
Principle Chemical or electrochemical reaction based ionic dissolution Shape of the product specified by die/punch/mold
Processes and Features Chemical, PCM and ECM. Small UR, negligible force. Inter-electrode gap, flow of electrolyte influences accuracy Micro-punching, extrusion, etc. No UR is involved, high speed, spring-back and difficulties in die or mold making Stereolithography, internal as well as external profiles can be formed easily.
Dissolution
Plastic Deformation
Lamination
Material in solid powder or liquid form is solidified layerby-layer.
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Role of EDM in micromachining

Non-contact machining 3D machining Physical characteristics such as hardness, brittleness dose not affect the process Use of deionized water as dielectric Absence of Size Effect
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Comparison of EDM and micro-EDM

The Resistance Capacitance Relaxation (RCrelaxation) circuit used in EDM is replaced by the RCpulse circuit in micro-EDM. In the RC-relaxation circuit, current and gap voltage are controlled at a pre-defined level throughout the pulse on-time but in modeling attempts in microEDM based on RC pulse circuits, the current and voltage are frequently assumed to be constant. On the other hand, in a single discharge of RC-pulse generator, the voltage and current are not maintained to any pre-defined level but depend upon the capacitor charge state at any instant. E = V I Duty cycle E = CV^2
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Comparison of EDM and micro-EDM

EDM Circuitry Elements RC relaxation type Single spark process Forced process for constant voltage and current User defined pulse on time Interelectrode gap is 10s of m Low efficiency RC single pulse discharge Single spark process Single capacitance discharge, no const V and I No control gap characteristics Interelectrode gap is 1-5 m High efficiency Micro-EDM
Scaling Effects
Typical single spark crater
17
Micro-analysis of Debris
Large number of Spherical particles with few nonspherical particles Spherical particles are rich in workpiece material and non-spherical particles are rich in tool material Understanding of Erosion Mechanism and Oxide free power production Important parameters affecting Debris morphology are
Current
Voltage Pulse On-time Capacitance
Input Energy
Micro-analysis of Debris
Micro analysis reveals that there is movement of material from workpiece to cathode and vice-versa Normal distribution of particle size (Stochastic nature) Structures of Debris Large Size & Small Size Hollow & Solid Debris Satellite structure Hollow Spheres Dents Burnt Cores
Low Energy
High Energy
EDM process stability

Effect of Tool Rotation Effect of Ultrasonic Vibrations Effect of workpiece-tool material combination Effect of polarity PMEDM Effect of dielectric
How will you measure? Ignition delay time
Group Number Planetary Motion External material layer
Group 1 Yes Yes
Group 2 No Yes
Group 3 No No
Micro-EDM process stability

Indication of constantly moving spark Importance of eroded material in inter-electrode gap Discharge conduction through debris chain Effect on surface cracks Process stability primarily depends on discharge transitivity rather than breakdown strength Yo et al. Absence of metallic particles can be one of the causes of arching
1 Low energy 2 High Energy
Variants of micro-EDM
Figure : Micro rods machining processes
Process
BEDG Micro-WEDG Micro-WEDM
Capability
Min. 3 m diameter electrode, maximum 10 aspect ratio, 0.6 Ra surface finish Min. 5 m diameter electrode, maximum 10 aspect ratio, 0.8 Ra surface finish Best results obtained are 10x10 square array (23 m width, 700 m height), minimum machining size achievable is 20 m, surface finish 0.07-0.35 m Ra, and maximum aspect ratio 100 micro tower of 1 mm in height and 25 m square
Limitation
Only single electrodes can be machined Cylindrical electrodes as well as arrayed electrodes cant be machined Cylindrical arrayed structures cant be machined
Diamond milling
Mechanical process involves machining 22 stresses
Research issues in micro-EDM

Micro-EDM Research Areas
Handling Electrode and workpiece preparation Off-machine electrode preparation Drilling, threading holes (WEDM) Machining Process Process Parameters Sources of Errors Machine Electrode Jigs and Fixture Electrode wear and machining strategies Multi electrode Z-compensation Wear monitoring system 23 Measurement Surface quality Dimensions
Electrode Parts
Mfg. Micro 3D electrode
On-machine electrode Rotating Disk Stationery block Guided running wire
Uniform wear method
Applications
Machining of mould and die in high strength materials (Carbides, die steel, conducting ceramics) Recently replaced by high speed milling process Chemical aspects of EDM
Production of fine particle powders RESA (for ultrafine powders)- Reactive Electrode Submerged Arc EDM Diamond like carbon and nano-tubes (solidification of evaporated material) Large amount of energy is consumed in the chemical action during EDM Supplying oxygen can enhance the MRR during the process
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Machining of arrayed micro-structures by REDM

Reverse replication of arrayed hole on the plate electrode to the bulk material by change in the polarity Machined structures have a dimensions equal to the original dimension of pocket minus interelectrode gap Important operating parameters are voltage , capacitance, threshold, and the feed
aa) Normal EDM
Bulk Rod
ab) Reverse EDM
Micro-rods
Figure : Working of micro and reverse micro EDM processes
Figure : a) array of 4 microrod machined, b) plate used as a tool during machining
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Machining of arrayed micro-structures by REDM
Problem Statement : Machining of high aspect ratio arrayed microstructures by micro reverse EDM process.
Figure : set up of the micro-REDM process
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Applications of micro-REDM
Process is capable of achieving
Machining of arrayed structures with varying shapes (Replication of initial geometry) High aspect ratio structures (aspect ratio of 33 has been achieved) Reduced errors due to tool position and tool wear (Less error due to no need of positioning) Increase in productivity Thin and long wall structures
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Applications of micro-REDM
Applications
Mechanical
Micromachining As a electrode in arrayed hole/cavity machining Mask preparation As a tool for generating stable plasma Heat Exchanging Hexagonal and thin wall structures Automobile Micronozzels
MEMS
Arrayed holes for passing wires in MEMS devices Thin wall structures as a cooling devices in MEMS system Shaft for micro robots micro actuator
Biomedical
As a interface device for capturing neural signals Brain neural activity recording Arrayed microholes as a spray nozzels in the biotechnology applications Microneedels- syringe Holding sights for the testing reagents
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Review of work done in micro-REDM

Authors
Kim et. al. (2006)
Results Achieved
Methodology
V and C as parameters, array of 3 microrods each micro-EDM to fabricate the microholes of 35 m in diameter and 1.5 mm in length formed on a plate and then plate was used as a on WC bulk rod tool
Yi et. al. (2007)
3X3 and 4X4 array of 80m square, height 600 m, Single electrode machined by microwall thickness was 15 m. WEDM, arrayed holes are machined on SS plate by micro-EDM
Zeng et. al. (2008)
AgW 5X5 electrode array, average diameter 35 Block micro-WEDG to fabricate single rod, m, length 250 m, 100 m hole spacing. Use of ultrasonic vibrations at 20 KHz frequency. machining arrayed holes on plate by machining individual hole
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Cu plate thickness = 200 m Bulk WC rod of 300 m initial diameter Operating parameters were 80 and 100 V voltage and 50, 650, 5000 pF capacitance
Figure : Fabricated arrayed microrods (30 m dia., 1.5 mm height) [2].
Figure : Effect of voltage at the constant capacitance on machining time [2]
Figure : Effect of capacitance on machining time [2]
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Components fabricated by micro-REDM
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V = 100 V C = 4700 pF Amplitude = 0.4 m
300
Effectof Voltage
M achining T im e (M in)
250 200 150 100 50 0 60 80 100 150
Voltage Effect of Amplitude of vibration

80
a)
1200
Figure : 5x5 arrayed electrode (35 m diameter, 8 aspect ratio) [13]

Effect of Cpacitance
Machining Time (Min)
70 60 50 40 30 20 10 0 0.2 0.4 0.6 0.8
Machining Time (Min)
1000 800 600 400 200 0
Amplitude
b)
Capacitance Level
c)
Figure : Effect of a) voltage, b) amplitude of vibration , and c) capacitance on machining rate . [13]
32

Machining of 3x3 and 4x4 microarrayed structure with each square rod of 80 m Micro-REDM is done at 100V and 500 pF capacitance No characterization of microREDM process
Figure : a) hole array on plate prior to machining, b) after the machining
Figure : a) machined electrode array , b) used electrode array for micro-EDM of holes
33
Review of work in Reverse-micro Wire EDM
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No detailed study which characterize the micro-REDM process indicating the process capability is done Process responses like surface finish, erosion rate and the geometrical accuracies are not quantified No data on the process mechanics difference between the micro-EDM and the micro-REDM process is reported Only plausible reasons are given in the literature for process instability in micro REDM process No mathematical model is available which can predict the process responses in arrayed structure machining via reverse EDM
35
Issues in micro-REDM
Issues in micro-REDM process
Issues related to tool electrode Tool wear Thin plates, more pocket enlargement Accurate machining of pockets on plate
Issues related to process stability and accuracy Formation of short bridge Less positional accuracy compared with number of pulses Spark formation on single rod even though it is simultaneous processing No tool rotation Less MRR
Issues related to fabricated structures Tapered surface Surface burning Non uniform surface morphology High surface roughness Delicate structures Deflection of microrods Redeposit layer Gas entrapment Deformation of electrode due to power of arc
36
Experiments in micro-REDM
Measured Response Geometrical accuracy Surface roughness Zero error length Erosion rate Surface finish Surface morphology
Operating parameters and selected levels
Level 1 2 Voltage (V) 80 100 Capacitance (nF) 1 10 Threshold (%) 25 50 Feed (m/sec) 5 15
Scheme of experimentation
Column Expt. run 1 2 3 4 5 6 7 8 A Voltage 1 1 1 1 2 2 2 2 B Capacitance 1 1 2 2 1 1 2 2 C Threshold 1 2 1 2 1 2 1 2 D Feed 1 2 2 1 2 1 1 2 37
Experiments in micro-REDM
Workpiece geometry : Machining of 400 m square and 200 m cylindrical electrodes, machined length 1 mm
Images of the micro rods machined in each run of experiment
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Machining Time
39
Main effect plot for dimensional accuracy- cylindrical rod

Main Effects Plot (data means) for %Error in Diameter Cylindriacal Rod at 0%L
-30 -40 GapVoltage Capacitance 8 6
Main Effects Plot (data means) for %Error in Diameter at 100%L

GapVoltage Capacitance
Mean of % Error in Diameter
-50 -60 080V -30 -40 -50 -60 25% 50% 05micron/s 15micron/s Threshold 100V 01nF Feed 10nF
Mean of % Error in Diameter
4 2 0 080V Threshold 8 6 4 2 0 25% 50% 05micron/s 15micron/s 100V 01nF Feed 10nF
Operating Parameter Parameter Setting Change in Response (at 0% L) Change in Response (at 25% L) Change in Response (at 50% L) Change in Response (at 75% L) Change in Response (at 100% L)
Voltage 80-100 V 48% 36% 33% 48% Not Significant
Capacitance 1-10 nF 16% 27% 30% 25% 110%
Threshold 25-50 %
Feed 5-15 m/sec
40
Preliminary experiments- Geometrical accuracy
Figure : % Error in diameter of Cylindrical Rod at varying a) voltage, b) capacitance, c) threshold , and d) feed
41
Main effect plot for geometrical accuracy- Square rod

Main Effects Plot (data means) for %Error in Side of Rod at 0%L
GapVoltage -15 Capacitance 1 0
Main Effects Plot (data means) for %Error in Side of Rod at 100%L
GapVoltage Capacitance
Mean of % Error in Side of Rod
-25 -30 080V Threshold -15 -20 -25 -30 100V 01nF Feed 10nF
Mean of % Error in Side of Rod
-20
-1 -2 -3 1 0 -1 -2 080V Threshold 100V 01nF Feed 10nF
25%
50%
05micron/s
15micron/s
-3
25%
50%
05micron/s
15micron/s
Operating Parameter Parameter Setting Change in Response (at 0% L) Change in Response (at 25% L) Change in Response (at 50% L) Change in Response (at 75% L) Change in Response (at 100% L)
Voltage 80-100 V 64% 28% 46% 49% Not Significant
Capacitance 1-10 nF Not Significant 29% 31% 28% Not Significant
Threshold 25-50 % -73% Not Significant Not Significant -40% Not Significant
Feed 5-15 m/sec Not Significant Not Significant -25% -42% Not Significant
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% Error in the side of square rod
Figure : % Error in diameter of Square Rod at varying a) voltage, b) capacitance, c) threshold , and d) feed
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Main effect plot for Erosion Rate
Operating Parameter Parameter Setting Change in Response (Erosion rate)
Voltage 80-100 V 300%
Capacitance 1-10 nF 250%
Threshold 25-50 % Not Significant
Feed 5-15 m/sec Not Significant
Increase in the capacitance and voltage increases the pulse energy and flushing strength Increasing the energy content per pulse increases the crater size and the surface roughness 44
Main effect plot for Zero Error Length- Cylindrical rod
Operating Parameter Parameter Setting Change in Response (Zero error length)
Voltage 80-100 V Not Significant
Capacitance 1-10 nF -11%
Threshold 25-50 % Not Significant
Feed 5-15 m/sec 10%
None of the processing parameter is found significant for zero error length of square rod
45
Main effect plot for surface roughness

Sample 3
Value of surface roughness varies from 1.6 m Ra to as high as 6.3 m Ra under different experimental conditions. Voltage and machining time affects the surface roughness, at 80V machining time is more and at the 100V pulse energy is more
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Main effect plot for surface roughness-cylindrical rod
Operating Parameter Parameter Setting Change in Response (Surface Roughness)
Voltage 80-100 V Not Significant
Threshold 25-50 % 38%
Feed 5-15 m/sec -20%
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Main effect plot for surface roughness- square rod
Operating Parameter Parameter Setting Change in Response (Surface Roughness)
Voltage 80-100 V -50%
Threshold 25-50 % Not significant
Feed 5-15 m/sec Not significant
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Surface Morphology
Surface near tip exhibits number of craters , whereas the surface at the root is relatively smooth. Smooth surface with almost no pits is observed near the root in the magnified image of fabricated structure
Tip Surface
Root Surface
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EDS analysis O and C content

SqaureRod
25
CylindricalRod
At Tip
30
At Tip At Root
O xyg e n P e rcen ta g e
O xyg en Pe rc en atg e
At Root 20 15 10 5 0 1 2 3 4 Sample Number
25 20 15 10 5 0 1 2 3 4 SampleNumber
(a)
SquareRod
45 At Tip At Root 45
(b)
CylindricalRod
At Tip At Root
Carbon Percentage
Carbon Percentage
40 35 30 25 20 15 10 5 0 1 2 3 4 Sample Number
40 35 30 25 20 15 10 5 0 1 2 3 4 Sample Number
Element
Carbon
Oxygen 4.40
Copper 54.30
Zinc 23.68
Percentage 12.55
(d)
(c)
Element Square At Tip Maximum Minimum 18% 4%
Oxygen Cylinder At Tip 27% 5% At Root 12% 3% 42% 17% Square At Tip At Root 7% 4%
Carbon Cylinder At Tip 41% 0% At Root 15% 0%

50
At Root 22% 0%
EDS analysis Cu and Zn content

Square Rod
70 At Tip At Root
Cylindrical Rod
90 80 70 60 50 40 30 20 10 0 1 2 3 4 Sample Number
At Tip At Root
Copper Percentage
50 40 30 20 10 0 1 2 3 4 Sample Number
Copper Percentage
60
(a)
Square Rod
40 35 At Tip At Root 40 35
(b)
Cylindrical Rod
Zinc Percentage
At Tip At Root
Zinc Percentage
30 25 20 15 10 5 0 1 2 3 4 Sample Number
30 25 20 15 10 5 0 1 2 3 4 Sample Number
Element
Carbon
Oxygen 4.40 Zinc
Copper 54.30
Zinc 23.68
(c)
(d)
Percentage 12.55
Element Square At Tip Maximum Minimum 58% 25%
Copper Cylindrical At Tip 62% 18% At Root 82% 50% 30% 5% Square At Tip At Root 34% 22% At Root 65% 45%
Cylindrical At Tip 22% 0% At Root 34% 0%

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Experiment Results
Maximum % error in dimensions are more at 80V compared with 100 V; 60% (max) error in the diameter of machined rod observed at the tip With change in voltage from 80 V to 100 V erosion rate increases 3 times while increasing capacitance from 1 nF to 10 nF, erosion rate increases by 2.5 times. Increasing the capacitance and decreasing the feed rate achieves improvement in zero error length Surface roughness (Ra ) varies between 1.6-6.3 m In general less variation in the response parameters are observed with the change in threshold and feed values Maximum oxygen content (27%) is observed at the tip of cylindrical rod, while maximum carbon (42%) is observed at the tip of square rod.
52
Conclusion
Understanding of micro-EDM machining characteristics important to achieve important response variables are
Voltage and capacitance emerges as a most influential process parameters in micro REDM Quantification of the roles played by debris during the microEDM/micro-REDM process are not reported widely Tool (plate) wear tapered surface and frequent arcing are the main causes for
Need to model the process for predicting geometrical accuracies and bridge formation mechanism
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Arrayed structures machined at MTL IIT Bombay
54
Future of micromachining
From Photonics Spectra, 1998

55
Future of micromachining
Electrical Discharge Machine Milling Machine Assembly Machine
Punching Machine
Robot
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Micro-EDM processes and Application of micro-reverse EDM process for microscale fabrication

Presented by Sachin A. Mastud VJTI, Mumbai

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Electrode gap monitoring and control

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Electrode gap monitoring and control

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No waveform which can satisfy all the constraints

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MicroMicro-Manufacturing - What is it?

70 m - Human Hair 25 m - Characters

Zeiss - Germany Micro-parts

Micro-structures manufactured by microSLA Japan

Klocke Nanotechnik Micro-Motor

Micro-EDM NTU - Taiwan

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Scope of micromachining processes

Machining of highly miniature components with miniature features NOT CORRECT

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Classification of micromachining processes

Macro-fabrication Hybrid Processes Mechanical - machining USM AJM AWJM WJM

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Mechanical Force Melting and vaporization

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Material in solid powder or liquid form is solidified layerby-layer.

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Role of EDM in micromachining

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Comparison of EDM and micro-EDM

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Comparison of EDM and micro-EDM

Typical single spark crater

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Voltage Pulse On-time Capacitance

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EDM process stability

How will you measure? Ignition delay time

Group Number Planetary Motion External material layer

Group 1 Yes Yes

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Micro-EDM process stability

1 Low energy 2 High Energy

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Figure : Micro rods machining processes

Mechanical process involves machining 22 stresses

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Research issues in micro-EDM

Mfg. Micro 3D electrode

On-machine electrode Rotating Disk Stationery block Guided running wire

Uniform wear method

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Machining of arrayed micro-structures by REDM

aa) Normal EDM

ab) Reverse EDM

Figure : Working of micro and reverse micro EDM processes

Figure : a) array of 4 microrod machined, b) plate used as a tool during machining