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82599 10 GbE Cont roller Checklist s for pull- up values. Refer t o t he reference
schemat ics for implement at ion det ails.
Reser v ed Pi n Name Bal l # Ty pe Name and Funct i on
VCC1P2
1. 2V Power supply.
W14, W11, W9, V14, V11, V9, U16, U14, U11, U9, T16, T14, T11, R16, R14, R13, R12,
R11, P14, P11, N14, N11, M14, M11, L14, L11, K16, K14, K13, K12, K11, J16, J14,
J11, H16, H14, H11, H9, G16, G14, G11, G9, F16, F14, F11, F9, U18, T18, R18, P18,
P16, N18, N16, M18, M16, L18, L16, K18, J18, H18, K9, K7, J9, T9, R9, R7, M9, M7,
L9, L7, P9, P7, N9, N7
VCC3P3
3. 3V Power supply.
AD19, AD15, AD10, AD6, A19, A15, A10, A6, E7, Y7, L5, P5
VSS
0V Ground
AD16, AD9, W18, W17, W15, W13, W12, W10, W8, W7, V17, V15, V13, V12, V10, V8,
U15, U13, U12, U10, T15, T13, T12, T10, R15, R10, P15, P13, P12, P10, N15, N13,
N12, N10, M15, M13, M12, M10, L15, L13, L12, L10, K15, K10, J15, J13, J12, J10,
H15, H13, H12, H10, G17, G15, G13, G12, G10, G8, F18, F17, F15, F13, F12, F10, F8,
F7, A16, A9, K8, K6, J8, J5, J4, H8, H6, G7, G6, G5, G4, F6, E6, E5, E4, D6, C6, C5,
C4, B5, B3, A5, A3, AD5, AD3, AC5, AC3, AB6, AB5, AB4, AA6, Y6, Y5, Y4, W6, V7, V6,
V5, V4, U8, U6, T8, T5, T4, R8, R6, M8, M6, M5, M4, M3, L8, L6, L3, K5, K4, K3, K2,
K1, J3, H3, H2, H1, G3, F3, F2, F1, E3, D3, D2, D1, C3, B2, B1, A2, A1, AD2, AD1,
AC2, AC1, AB3, AA3, AA2, AA1, Y3, W3, W2, W1, V3, U3, U2, U1, T3, R5, R4, R3, R2,
R1, P8, P6, P3, N8, N6, N3, AD24, AD23, AD22, AC24, AC23, AC22, AB22, AB21,
AB20, AA24, AA23, AA22, Y22, Y21, Y20, Y19, W24, W23, W22, W19, V22, V21, V20,
V19, V18, U24, U23, U22, U19, U17, T22, T21, T20, T19, T17, R24, R23, R22, R19,
R17, P22, P21, P20, P19, P17, N23, N22, N19, N17, M23, M22, M19, M17, L22, L21,
L20, L19, L17, K24, K23, K22, K19, K17, J22, J21, J20, J19, J17, H24, H23, H22, H19,
H17, G22, G21, G20, G19, G18, F24, F23, F22, F19, E22, E21, E20, E19, D24, D23,
D22, C22, C21, C20, B24, B23, B22, A24, A23, A22
Reser v ed
Pi n
Name
Reser v ed
I nt er nal Pul l Up at
Pow er Up
I nt er nal Pul l Up at
Nomi nal Act i v e St at e
PUP Comment PUP Comment
EE_DI N N
EE_DO Y Y
EE_SK N N
EE_CS_N N N
FLSH_SI Y N
FLSH_SO Y Y
FLSH_SCK Y N
FLSH_CE_N Y N
SMBCLK N N
SMBD N N
SMBALRT_N N N
SCL0/ SCL1 N N
I nt el
Config Dat a
LSB
I nt el
D
Q
120
D
Q
7
D
Q
127
Descriptor
Queues
Weighted
Strict Priority
Weighted
Strict Priority
Data read
request
Data
MAC
Traffic Class 0 Traffic Class 7
VM Arbiters,
one per TC
Weighted
Round-Robin
Weighted
Round-Robin
Descriptor Plane
TC Arbiter
Packet Plane
TC Arbiter
D
Q
8
D
Q
15
I nt el
D
Q
31
D
Q
120
D
Q
127
Descriptor
Queues
Weighted
Strict Priority
Weighted
Strict Priority
Data read
request
Data
MAC
Traffic Class 0 Traffic Class 7
Queues Arbiters,
one per TC
Round-Robin
Round-Robin
Descriptor Plane
TC Arbiter
Packet Plane
TC Arbiter
D
Q
1
D
Q
121
I nl i ne Funct i ons I nt el
D
Q
3
Descriptor
Queues
Strict Priority
Data read
request Data
MAC
D
Q
1
Pool 0
Round-Robin
D
Q
4
D
Q
7
D
Q
5
Pool 1
D
Q
124
D
Q
127
D
Q
125
Pool 31
VM Arbiter
Weighted
Round-Robin
Queues Arbiters,
one per VF
Round-Robin Round-Robin
I nt el
D
Q
63
Descriptor
Queues
Round-Robin
Strict Priority
Data read
request Data
MAC
Queues Arbiter
D
Q
1
I nl i ne Funct i ons I nt el
E
I
C
R
2
(
r
e
f
l
e
c
t
c
a
u
s
e
s
)
0
63
Queue
Related
causes:
Rx 0...127
Tx 0...127
Timer
and all
Other
Interrupt
causes
.
.
.
.
.
.
I
V
A
R
_
M
I
S
C
Other
Interrupt
causes
TCP timer
16
30
EICR
MSI-X
Vectors
0...63
EITR 0...63
I nl i ne Funct i ons I nt el
MSI-X 62
MSI-X 63
PF
Vectors
EITR 1
EITR 63
EITR 2
EITR 128
EITR 127
EITR 0
EITR 64
PF EITR
Registers
VF EITR
Registers
EITR 0
EITR 0
EITR 1
EITR 1
EITR 0
EITR 1
VF 0
VF 32
VF 63
Sel
EITRSEL
MSI-X 2 on each VF has no associated EITR register. It is useful
for the mailbox interrupts that do not require interrupt moderation.
EITR 66
EITR 65
EITR 1
EITR 0
VF 31
. . .
VF 0
MSI-X 0
MSI-X 1
MSI-X 2
VF 31
MSI-X 0
MSI-X 1
MSI-X 2
VF 32
MSI-X 0
MSI-X 1
MSI-X 2
. . .
VF 63
MSI-X 0
MSI-X 1
MSI-X 2
I nt el
82599 10 GbE Cont roller ( soft ware reset ) result ing in a st at e nearly
approximat ing t he st at e following a power- up reset or int ernal PCI e reset , except for t he
syst em PCI configurat ion. Normally 0b, writ ing 1b init iat es t he reset . This bit is self-
clearing. Also referred t o as MAC reset .
Reser ved 25: 4 0b Reserved
RST 26 0b
Device Reset
This bit performs a complet e reset of t he 82599, result ing in a st at e nearly
approximat ing t he st at e following a power- up reset or int ernal PCI e reset , except for t he
syst em PCI configurat ion. Normally 0b, writ ing 1b init iat es t he reset . This bit is self-
clearing. Also referred t o as a soft ware reset or global reset .
Reserved 31: 27 0x0 Reserved
Tabl e 8. 2. Regi st er Summar y ( Cont i nued)
Of f set / Al i as Of f set Abbr ev i at i on Name Bl ock RW
Reset
Sour ce
Page
I nt el
- -
- - - -
Advanced
receive
enable
14
0x0E
MAC
addr.
MSB
MAC
addr.
LSB
I P addr.
MSB
I P addr.
LSB
BMC
SMBus
addr.
I nt erf.
dat a
byt e
Alert
value
byt e
Fi el d Bi t ( s) Descr i pt i on
RCV_EN 0
Receive TCO Enable.
0b = Disable Receive TCO packet s. Rx Packet s are not direct ed t o BMC and Aut o ARP response is not
enabled.
1b = Enable Receive TCO packet s. Set t ing t his bit enables all manageabilit y receive filt ering
operat ion. The enable of t he specific filt ering is done t hrough loading t he Receive Enable 1 word in t he
EEPROM, or t hrough special configurat ion command ( see Sect ion 10. 5. 2. 1. 6) .
RCV_ALL 1
Receive All Enable. When set t o 1b, all LAN packet s received over t he wire t hat passed L2 filt ering are
forwarded t o t he BMC. This flag is meaningful only if t he RCV_EN bit is set as well.
EN_STA 2 Enable St at us report ing when set t o 1b.
EN_ARP_RES 3
Enable ARP Response.
0b = Disable. The 82599 t reat s ARP packet s as any ot her packet . These packet s are forwarded t o
BMC if it passes ot her ( non-ARP) filt ering.
1b = Enable. The 82599 aut omat ically responds t o all received ARP request s t hat mat ch it s I P
address. Not e t hat set t ing t his bit doesn t change t he Rx filt ering set t ings. Appropriat e Rx filt ering t o
enable ARP request packet s t o reach t he manageabilit y unit should be set by t he BMC or by t he
EEPROM.
The BMC I P address is provided as part of t he Receive Enable message ( byt es 8- 11) . I f short version
of t he command is used t he 82599 uses I P address configured in t he most recent long version of t he
command in which t he EN_ARP_RES bit was set . I f no such previous long command exist s, t hen t he
82599 uses t he I P address configured in t he EEPROM as ARP response I Pv4 address in pass- t hrough
LAN configurat ion st ruct ure. I f CBDM bit is set t he 82599 uses t he BMC dedicat ed Et hernet MAC
address in ARP response packet s. I f t he CBDM bit is not set , BMC uses t he host Et hernet MAC
address.
Set t ing t his bit requires appropriat e assert ion of bit s RCV_EN and RCV_ALL. Ot herwise, t he command
abort s wit h no processing.
Manageabi l i t y I nt el
Et hernet MAC
Address LSB
Funct i on Command By t e Count Dat a 1
Management Cont rol Request 0xC1 1 Paramet er Number
Funct i on Command
Read Management Paramet er 0xD1
Funct i on By t e Count
Dat a 1 ( Op-
Code)
Dat a 2 Dat a 3 Dat a N
Read Management Paramet er N 0xD1
Paramet er Number
( PN# )
Paramet er Dependent
Manageabi l i t y I nt el
Dat a
8
Dat a
9
Dat a
12
Dat a
13
Dat a
14
Dat a
15
Read
Receive
Enable
15
( 0x0F)
0xDA
Receiv
e
Cont r ol
Byt e
Et hern
et MAC
Addres
s MSB
Et hern
et MAC
Addres
s LSB
I P
Addres
s MSB
I P
Address
LSB
BMC
SMBus
Address
I nt erfac
e Dat a
Byt e
Aler t
Value
Byt e
I nt el
3. 1
specificat ion.
I nt el
82599 10 GbE Cont r ol l er Desi gn Consi der at i ons and Gui del i nes
782
12. 1. 3 PCI e Ref er ence Cl ock
For LOM designs, t he device requires a 100 MHz different ial reference clock, denot ed PE_CLK_p and
PE_CLK_n. This signal is t ypically generat ed on t he syst em board and rout ed t o t he PCI e port . For add-
in cards, t he clock is furnished at t he PCI e connect or.
The frequency t olerance for t he PCI e reference clock is + / - 300 ppm.
12. 1. 4 PCI e Anal og Bi as Resi st or
For proper biasing of t he PCI e analog int erface, a 24.9 O 0.5% resist or needs t o be connect ed from t he
PE_RBI AS t o t he VCC1P2 supply. The PE_RSENSE pin should be connect ed direct ly t o PE_RBI AS, as
close as possible t o t he 24.9 O resist or pad. To avoid noise coupled ont o t his reference signal, place t he
bias resist or close t o t he 82599 and keep t races as short as possible.
12.1. 5 Mi scel l aneous PCI e Si gnal s
The 82599 signals power management event s t o t he syst em by pulling low t he PE_WAKE# signal. This
signal operat es like t he PCI PME# signal. Not e t hat somewhere in t he syst em, t his signal has t o be
pulled high t o t he auxiliary 3. 3 V supply rail.
The PE_RST# signal, which serves as t he familiar reset funct ion for t he 82599, needs t o be connect ed
t o t he host syst ems corresponding signal.
12. 1. 6 PCI e Lay out Recommendat i ons
For informat ion regarding t he PCI e signal rout ing, refer t o t he I nt el
82599 10 GbE Cont r ol l er Desi gn Consi der at i ons and Gui del i nes
784
12.2. 5 Tr ace Geomet r i es
Two t ypes of t races are included: Microst rip* or St ripline* t races. St ripline t ransmission line
environment s offer advant ages t hat improve performance. Microst rip t race geomet ries can be used
successfully, but it is our recommendat ion t hat st ripline geomet ries be followed.
Sect ion 12.1 list s t he height pair- t o- pair spacing differences t hat are recommended bet ween St ripline
and Microst rip geomet ries. Cont act your I nt el sales represent at ive for more det ails.
Tabl e 12- 1. Mi cr ost r i p Tr ace Di mensi ons f or SFI Usi ng Di f f er ent Di el ect r i c Mat er i al s
Tr ace
Type
Di el ect r i c
Mat er i al
Di el ect r i c
Const ant
( dk or Er )
2.5 GHz t o
5 GHz
Di ssi pat i on
Fact or ( df
or Loss
Tangent )
Di el ect r i c
Lay er
Thi ck ness ( or
Hei ght )
( mm)
Copper Tr ace
Thi ck ness
Af t er Pl at i ng
1
( mm)
1. Post - plat ing copper t hickness t olerance 0. 3 mils ( 0. 00762 mm) .
Max SFI Tx
Tr ace
Lengt h
( mm)
Max SFI Rx
Tr ace
Lengt h
( mm)
2
2. Short er SFI + t races are preferred; however, longer t races might be t olerable depending on t he dielect ric mat erial. Cont act your
I nt el sales represent at ive for det ailed informat ion about maximum SFI + t race lengt hs and about various suit able dielect ric
mat erials.
Mai n SFI
Rout i ng Tr ace
Wi dt h
( mm)
Mai n SFI
Rout i ng I n-
Pai r Tr ace
Separ at i on
( mm)
SFI Br eak out
Rout i ng Tr ace
Wi dt h
3
( mm)
3. For SFI t races t hat are 9 mils wide or less wit h 12 mils separat ion or less: Narrow breakout t race widt hs wit h smaller in- pair
t race separat ion dist ances are discouraged. Narrow SFI t races and/ or less in- pair separat ion should NOT be required when t he
main t race rout e is 9 mils wide or less. This is especially t rue for t he SFI Tx t race rout es.
SFI Br eak out
Rout i ng I n- Pai r
Tr ace Separ at i on
( mm)
3
Microst r ip
Nelco
N4000- 13
3. 7 0. 009
0. 1905
( 7. 5 mils)
0. 0508
( 2. 0 mils)
41. 148
( 1620 mils)
43. 434
( 1710 mils)
0. 3048
( 12 mils)
0. 4064
( 16 mils)
0. 1778
( 7 mils)
0. 1397
( 5. 5 mils)
Microst r ip
Nelco
N4000- 13
3. 7 0. 009
0. 1524
( 6. 0 mils)
0. 0508
( 2. 0 mils)
32. 385
( 1275 mils)
34. 036
( 1340 mils)
0. 2286
( 9. 0 mils)
0. 3048
( 12 mils)
0. 1880
2
( 7. 4 mils)
0. 1905
( 7. 5 mils)
Microst r ip
Panasonic
Megt ron6
3. 6 0. 003
0. 2032
( 8. 0 mils)
0. 0508
( 2. 0 mils)
41. 148
( 1620 mils)
43. 434
( 1710 mils)
0. 3302
( 13 mils)
0. 4064
( 16 mils)
0. 2083
( 8. 2 mils)
0. 1524
( 6 mils)
Microst r ip
Panasonic
Megt ron6
3. 4 0. 003
0. 1524
( 6. 0 mils)
0. 0508
( 2. 0 mils)
36. 739
( 1450 mils)
38. 780
( 1530 mils)
0. 2667
( 10. 5 mils)
0. 4572
( 18 mils)
0. 2032
( 8 mils)
0. 1905
( 7. 5 mils)
Microst r ip I sola FR408 3. 63 0. 013
0. 1534
( 6. 04 mils)
0. 0508
( 2. 0 mils)
24. 384
( 960 mils)
25. 654
( 1010 mils)
0. 2540
( 10 mils)
0. 4318
( 17 mils)
0. 1905
( 7. 5 mils)
0. 1854
( 7. 3 mils)
Microst r ip I sola FR406 3. 76 0. 0186
0. 1839
( 7. 24 mils)
0. 0508
( 2. 0 mils)
19. 05
( 750 mils)
20. 32
( 800 mils)
0. 2921
( 11. 5 mils)
0. 4064
( 16. 0 mils)
0. 1778
( 7 mils)
0. 1448
( 5. 7 mils)
Microst r ip I sola FR406 3. 76 0. 0186
0. 1636
( 6. 44 mils)
0. 0508
( 2. 0 mils)
17. 018
( 670 mils)
18. 034
( 710 mils)
0. 2540
( 10 mils)
0. 3683
( 14. 5 mils)
0. 1905
( 7. 5 mils)
0. 1803
( 7. 1 mils)
Microst r ip
FR4 2116,
2- ply
4. 2
4
0. 02
3
0. 2286
3
( 9. 0 mils)
0. 0508
( 2. 0 mils)
19. 558
( 770 mils)
20. 574
( 810 mils)
0. 3175
( 12. 5 mils)
0. 3759
( 14. 8 mils)
0. 1778
( 7. 0 mils)
0. 1422
( 5. 6 mils)
Microst r ip
FR4 2116,
2- ply
4. 2
3
0. 02
3
0. 2286
3
( 9. 0 mils)
0. 04572
( 1. 8 mils)
19. 30
( 760 mils)
20. 32
( 800 mils)
0. 3200
( 12. 6 mils)
0. 3683
( 14. 5 mils)
0. 1778
( 7. 0 mils)
0. 1372
( 5. 4 mils)
Microst r ip
FR4 2113,
2- ply
4. 0 0. 021
0. 2032
( 8. 0 mils)
0. 04826
( 1. 9 mils)
17. 02
( 670 mils)
18. 03
( 710 mils)
0. 292
( 11. 5 mils)
0. 356
( 14. 0 mils)
0. 1674
( 6. 6 mils)
0. 1371
( 5. 4 mils)
Microst r ip
FR4 2113,
2- ply
4. 05 0. 021
0. 2032
( 8. 0 mils)
0. 04572
( 1. 8 mils)
17. 53
( 690 mils)
18. 54
( 730 mils)
0. 305
( 12. 0 mils)
0. 419
( 16. 5 mils)
0. 1701
( 6. 7 mils)
0. 1397
( 5. 5 mils)
Desi gn Consi der at i ons and Gui del i nes I nt el
82599 10 GbE Cont r ol l er Desi gn Consi der at i ons and Gui del i nes
786
12.2. 6 Ot her Hi gh- Speed Si gnal Rout i ng Pr act i ces
These layout and rout ing recommendat ions are applicable for t he MAUI int erfaces of t he t he 82599.
I n order t o keep impedance cont inuit y consist ent around signal via ant i- pad regions, I nt el recommends
adding t he ant i- pad diamet er requirement of 9t o 12 mils clearance t o vias t o ground and power. This
ensures t hat t he impedance variance is minimized. On plane layers, pairs of signal vias should share
t he same enlarged ellipt ical or oval ( merged) ant i- pads.
Enforce different ial symmet ry, even for grounds. Along wit h ensuring t hat t he MAUI int erface is rout ed
symmet rically in t erms of signal rout ing and balance, we also recommend t hat ground pat hs be rout ed
symmet rically. This helps reduce t he imbalance t hat can occur in t he different ret urn current pat hs.
I n cases where t here is a via and an AC coupling capacit or on t he same t race, t he signal t race bet ween
t he via and t he AC coupling capacit ors on t he MAUI int erface, t here is an int rinsic impedance mismat ch
because of t he required capacit ors. To minimize t he overall impact of having vias and AC coupling
capacit ors, we recommend t hat bot h via and capacit or layout pad be placed wit hin 100 mils of each
ot her.
Not e: For KR int erfaces, t his is not recommended unless simulat ions are performed and t he result s
confirm minimal impact t o impedance, insert ion loss, insert ion loss deviat ion, and crosst alk.
I t is best t o use a 0402 capacit or or smaller for t he AC coupling component s on t he MAUI int erface. The
pad geomet ries for a 0402 or smaller component s lend t hemselves t o maint aining a more consist ent
t ransmission line environment . For 10 Gb/ s KR, t he recommended package size for t he required AC
coupling capacit ors is t he 0201 package size. Not e t hat SFI + board t races normally do not require AC
coupling capacit ors. Cont act your I nt el sales represent at ive for more det ails.
Not e: To reduce shunt capacit ance from t he AC capacit ors solder- pads t o t he reference plane
beneat h t he solder- pads, we recommend t hat you void t he reference plane t hat is direct ly
under t he capacit or. The reference plane void should have t he same shape as t he capacit or
and it s solder pads. The size of t he reference plane void should be slight ly larger t han t he
size of t he capacit or and it ' s solder pad. I f you have access t o a 3- dimensional field solver, it
can and should be used t o det ermine t he opt imal size and shape for t he reference plane void
under each capacit or. To prevent noise problems, be careful not t o rout e any t races across t he
capacit or- shaped voids in t he reference plane.
Desi gn Consi der at i ons and Gui del i nes I nt el
82599 10 GbE Cont r ol l er Desi gn Consi der at i ons and Gui del i nes
788
12. 2. 6. 1 Vi a Usage
Use vias t o opt imize signal int egrit y. Figure 12- 3 shows correct via usage. Figure 12- 4 shows t he t ype
of t opology t hat should be avoided.
Fi gur e 12- 3. Cor r ect Vi a Usage
Fi gur e 12- 4. I ncor r ect Vi a Usage
Desi gn Consi der at i ons and Gui del i nes I nt el
82599 10 GbE Cont r ol l er Desi gn Consi der at i ons and Gui del i nes
790
12. 2. 7 Ref er ence Pl anes
Do not cross plane split s wit h t he MAUI high- speed different ial signals. This causes impedance
mismat ches and negat ively affect s t he ret urn current pat hs for t he board design and layout . Refer t o
Figure 12- 6.
Traces should not cross power or ground plane split s if at all possible. Traces should st ay seven t imes
t he dielect ric height away from plane split s or voids. I f t races must cross split s, capacit ive coupling
should be added t o st it ch t he t wo planes t oget her in order t o provide a bet t er AC ret urn pat h for t he
high- speed signals. To be effect ive, t he capacit ors should be have low ESR and low equivalent series
induct ance.
Not e: Even wit h plane split st it ching capacit ors, crossing plane split s is ext remely high risk for
10 Gb/ s KR and 10 Gb/ s SFI + designs.
Fi gur e 12- 6. Do Not Cr oss Pl ane Spl i t s
Differential signals should
not cross splits in either
GND or PWR plane
reference.
Desi gn Consi der at i ons and Gui del i nes I nt el
82599 10 GbE Cont r ol l er Desi gn Consi der at i ons and Gui del i nes
792
The cent er- t o- cent er pit ch of t he t races wit hin t he diff pairs can be mat ched t o t he weave pit ch of
t he dielect ric mat erial. I f you plan t o uses a woven glass/ epoxy dielect ric mat erial, check wit h t he
mat erial supplier t o find out t he glass weave pit ch prior t o doing final different ial t race rout ing.
Traces can be rout ed t o include a series of 45 degree bends, wit h bends separat ed by several t ent hs
of an inch, t o shift t he t races in st eps by a few millimet ers each t ime. There should be an equal
number left t urns and right t urns along t he lengt h of t he t races. Trace segment s bet ween each pair
of bends should be different lengt hs ( if t hey are all t he same lengt h it could creat e an undesirable
resonance in t he line) .
I f different ial t races must be st raight and ort hogonal t o t he out line of t he circuit board for most of
t heir rout ed lengt hs, t hen rot at e CAD art work by 15, wit h respect t o t he weave of t he circuit
boards dielect ric weave.
12.2. 9 I mpedance Di scont i nui t i es
I mpedance discont inuit ies cause unwant ed signal reflect ions. Minimize vias ( signal t hrough holes) and
ot her t ransmission line irregularit ies. A t ot al of six t hrough holes ( a combinat ion of vias and connect or
t hrough holes) bet ween t he t wo chips connect ed by t he MAUI int erface is a reasonable maximum
budget for each different ial signal pat h. For example, if a backplane syst em has a t ot al of t hree boards
( blade server, mid- plane, and swit ch blade) in t he different ial signal pat h, t hen SFI + Tx must not have
any signal vias and SFI + Rx should not have more t han one signal via per SFI + signal t race. For t his
purpose, signal pin t hrough- holes for board connect ors are also count ed as signal vias. Signal via pads
on unconnect ed plane layers can be removed t o reduce capacit ance bet ween t he signal via and t he
surrounding met al plane. Alt ernat ively, t he ant i- pad diamet er can be increased t o provide 9t o 12 mils
clearance bet ween signal via ( pads) and power or gound.
12.2. 10 Reduci ng Ci r cui t I nduct ance
Traces should be rout ed over a cont inuous reference plane wit h no int errupt ions. I f t here are vacant
areas on a reference or power plane, t he signal conduct ors should not cross t he vacant area. Rout ing
over a void in t he reference plane causes impedance mismat ches and usually increases radiat ed noise
levels. Noisy logic grounds should NOT be locat ed near or under high- speed signals or near sensit ive
analog pin regions of t he LAN silicon. I f a noisy ground area must be near t hese sensit ive signals or I C
pins, ensure sufficient decoupling and bulk capacit ance in t hese areas. Noisy logic and swit ching power
supply grounds can somet imes affect sensit ive DC subsyst ems such as analog t o digit al conversion,
operat ional amplifiers, et c.
All ground vias should be connect ed t o every ground plane; and similarly, every power via should be
connect ed t o all equally pot ent ial power planes. This helps reduce circuit induct ance. Anot her
recommendat ion is t o physically locat e grounds t o minimize t he loop area bet ween a signal pat h and it s
ret urn pat h. Rise and fall t imes should be as slow as possible while st ill meet ing t he relevant elect rical
requirement s. Because signals wit h fast rise and fall t imes cont ain many high frequency harmonics,
which can radiat e significant ly. The most sensit ive signal ret urns closest t o t he chassis ground should
be connect ed t oget her. This result s in a smaller loop area and reduces t he likelihood of crosst alk. The
effect of different configurat ions on t he amount of crosst alk can be st udied using elect ronics modeling
and simulat ion soft ware.
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I f different ial t races must be rout ed on anot her layer, t hen t he signal vias should carry t he signal t o
t he opposit e side of t he circuit board ( t o be near t he t op of t he circuit board) ; AND if t he high- speed
signals are being rout ed bet ween t wo connect ors on t he same board, t hen before t he signal t races
reach t he second connect or, t hey must ret urn t o t he original signal layer ( before reaching t he
connect or pin) . This st rat egy keeps via st ubs short wit hout requiring back drilling.
Each t ime different ial t races make a layer t ransit ion ( pass t hrough a pair of signal vias) , t here must
be at least one ground via locat ed near each signal via. Two ground vias near each signal via is
bet t er. See Figure 12- 8 and Figure 12- 9.
Fi gur e 12- 8. Good Gr ound Vi as f or Si gnal Ret ur n Pat hs One Ret ur n Pat h Vi a Per Si gnal Vi a
GND vias
are located
near each
signal via to
improve the
current
return path.
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On met al layers where signal vias need t o have via pads, it is desirable t o reduce capacit ance bet ween
t he signal vias and ground plane layers. The ant i- pad diamet ers should be up t o 20 mils larger t han t he
via pad diamet ers. See Figure 12- 12. Clearance bet ween t he pad and t he surrounding met al should be
> = 10 mils.
Fi gur e 12- 10. Undesi r abl e: For Si gnal Vi as t o Have Pads on t he Unused Met al Layer s
Fi gur e 12- 11. Si gnal Vi a I mpr oved by Removi ng Unused Met al Layer Pads
These unused via pads degrade the signal
integrity of the signal path and should be
removed if possible.
The unused via pads have been
removed to improve signal quality.
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12.2. 13 KR and SFI + Recommended Si mul at i ons
KR and SFI + signaling frequencies ext end above 5 GHz: relat ively short st ubs, small discont inuit ies,
and fairly small in- pair t race lengt h differences can cause an undesirable increase in bit errors. Before
ordering circuit boards, verify t hat :
Planned KR signal t race rout ing on t he circuit board complies wit h t he int erconnect charact erist ics
recommended in I EEE 802. 3ap sect ions 69.3 and 69.4.
Fi gur e 12- 14. Bet t er Di f f er ent i al Si gnal s Vi a Ant i - Pads
Fi gur e 12- 15. Best Di f f er ent i al Si gnal s Vi a Ant i - Pads
Via Anti-pad
Via pad
Better differential signal
anti-pad via usage.
Via Anti-pad
Via pad
Best differential signal
anti-pad via usage.
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SFI + t race lengt hs and t race geomet ry: To meet t he st ringent t ransmit t er elect rical requirement s,
some t race geomet ry guidance is list ed in Figure 12- 16 and Figure 12- 17 show examples.Cont act your
I nt el sales represent at ive for more det ails.
Not e: Grey is t he ground plane.
Fi gur e 12- 16. Voi di ng t he Ref er ence Pl anes Under t he SFI + Connect or Pi n Sol der Pads
1
1
0
m
i
l
s
10mil
10mil
74 mils
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12. 3. 1 Suppor t ed EEPROM Dev i ces
Table 12- 2 list s t he SPI EEPROMs t hat operat e sat isfact orily wit h t he t he 82599. SPI EEPROMs used
must be rat ed for a clock rat e of at least 2 MHz.
Tabl e 12- 2. Suppor t ed SPI EEPROM Devi ces
Use a 128 Kb EEPROM for all applicat ions unt il an appropriat e size for each applicat ion is det ermined.
Not e: Refer t o Sect ion 11. 6. 1 and Sect ion 11. 6. 2 for minimum and recommended EEPROM sizes.
For more informat ion on how t o properly at t ach t he EEPROM device t o t he t he 82599, follow t he
example provided in t he 82599 reference schemat ics. Cont act your I nt el sales represent at ive for
access.
12.4 Connect i ng t he Fl ash
The 82599 provides support for an SPI Flash device t hat is made accessible t o t he syst em t hrough t he
following:
Flash Base Address regist er ( PCI e Cont rol regist er at offset 0x14 or 0x18) .
An address range of t he I OADDR regist er, defined by t he I O Base Address regist er ( PCI e) Cont rol
regist er at offset 0x18 or 0x20) .
Expansion ROM Base Address regist er ( PCI e Cont rol regist er at offset 0x30) .
12.4. 1 Suppor t ed Fl ash Devi ces
The 82599 support s SPI Flash t ype. All support ed Flashes have address size of 24 bit s. Table 12- 4 list s
t he Flash t ypes support ed.
Tabl e 12- 3. Fl ash Ty pes Suppor t ed
Densi t y ( Kb) At mel * PN STM* PN Cat al y st * PN
16 AT25160AN- 1DSI - 2. 7 M9516DWMN6T CAT25C16S-TE13
32 AT25320AN- 1DSI - 2. 7 M9532DWMN6T CAT25C32S-TE13
64 AT25640AN- 1DSI - 2. 7 M9564DWMN6T CAT25C64S-TE13
128 AT25128AN- 1DSI - 2. 7 M951286DWMN6T CAT25C9128-TE13
256 AT25256AN- 1DSI - 2. 7 M95256DWMN6T
Densi t y At mel * PN STM* PN
512 Kb AT25F512N- 10SI - 2. 7 M25P05-AVMN6T
1 Mb AT25F1024N- 10SI - 2. 7 M25P10-AVMN6T
2 Mb AT25F2048N- 10SI - 2. 7 M25P20-AVMN6T
4 Mb AT25F4096N- 10SI - 2. 7 M25P40-AVMN6T
8 Mb M25P80-AVMN6T
16 Mb M25P16-AVMN6T
32 Mb M25P32-AVMN6T
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12. 6 NC- SI
12.6.1 NC- SI Desi gn Requi r ement s
12.6. 1.1 Net w or k Cont r ol l er
The NC- SI I nt erface enables net work manageabilit y implement at ions required by informat ion
t echnology personnel for remot e cont rol and alert ing via t he LAN. Management packet s can be rout ed
t o or from a management processor.
12.6. 1.2 Ex t er nal Management Cont r ol l er ( MC)
An ext ernal MC is required t o meet t he requirement s called out in t he lat est NC- SI specificat ion as it
relat es t o t his int erface.
12.6. 1.3 Ref er ence Schemat i c
The following reference schemat ic ( provides connect ivit y requirement s for single and mulit - drop
applicat ions. This configurat ion only has a single connect ion t o t he MC. The net work device also
support s mult i- drop NC- SI configurat ion archit ect ure wit h soft ware arbit rat ion support from t he MC.
Refer t o t he NC- SI specificat ion for connect ivit y requirement s for mult i- drop applicat ions.
Fi gur e 12- 19. NC- SI Connect i on Schemat i c: Si ngl e- Dr op Conf i gur at i on
100
100
100
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12.6. 2.2 Tr ace Lengt h Rest r i ct i ons
The recommended maximum t race lengt hs for each circuit board applicat ion is dependent on t he
number drops and t he t ot al capacit ive loading from all t he t race segment s on each NC- SI signal net .
The number vias must also be considered. Circuit board mat erial variat ions and t race et ch process
variat ions affect t he t race impedance and t race capacit ance. For each fixed design, highest t race
capacit ance occurs when t race impedance is lowest .For t he FR4 board st ack- up provided in direct
connect applicat ions, t he maximum lengt h for a 50 O NC- SI t race would be approximat ely 9 inches on
a minus 10% board impedance skew. This ensures t hat signal int egrit y and qualit y are preserved and
enables t he design t o comply wit h NC- SI elect rical requirement s.
For special applicat ions which require longer NC- SI t races, t he t ot al funct ional NC- SI t race lengt h can
be ext ended wit h non- compliant rise t ime by:
providing good clock and signal alignment
t est ing wit h t he t arget receiver t o verify it meet s set up and hold requirement s.
For mult i- drop applicat ions, t he t ot al capacit ance and t he ext ra resist ive loading affect t he rise t ime. A
mult i- drop of t wo devices limit s t he t ot al lengt h t o 8 inches. A mult i- drop of four limit s t he t ot al lengt h
t o 6.5 inches. Capacit ive loading of ext ra vias have a nominal effect on t he t ot al load.
Fi gur e 12- 21. NC- SI Tr ace Lengt h Requi r ement f or Di r ect Connect
Device MC
8 inches
NCSI_TXD[1:0]
NCSI_RXD[1:0]
NCSI_TX_EN
NCSI_CRS_DV
NCSI_CLK_IN
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Fi gur e 12- 22. Ex ampl e 2- Dr op Topol ogy
Device MC
L1
Device
NC-SI_TXD[1:0]
NC-SI_RXD[1:0]
NC-SI_TX_EN
NC-SI_CRS_DV
NC-SI_CLK_IN
L
2
L3
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Ext ending NC- SI t o a maximum 11ns rise t ime increases t he maximum t race lengt h.
12.7 Reset s
Aft er power is applied, t he t he 82599 must be reset . There are t wo ways t o do t his:
1. Using t he int ernal power on reset circuit .
2. Using t he ext ernal LAN_PWR_GOOD signal.
By default , t he int ernal power on reset will reset t he 82599.
I f t he design relies on t he int ernal power on reset , t hen t he power supply sequencing t iming
requirement bet ween t he 3. 3V and 1. 2V power rails has t o be met . I f t his requirement is impossible t o
meet , t he alt ernat ive is t o bypass t he int ernal power on reset circuit by pulling POR_BYPASS high and
using an ext ernal power monit oring solut ion t o provide a LAN_PWR_GOOD signal.
For LAN_PWR_GOOD t iming requirement s, see Sect ion 4.0 and Sect ion 5.0.
Tabl e 12- 6. Compl i ant NC- SI Max i mum Lengt h on a 50 O - 10% Sk ew - boar d w i t h Ex ampl e
St ack - up
Topol ogy
Tot al max i mum compl i ant l i near
bus si ze ( i nches)
Number of v i as
Appr ox i mat e Net t r ace
capaci t ance mi nus l oad
capaci t ance ( pf )
4 mult i- drop 6. 0 1 8. 3
4 mult i- drop 5. 5 8 8. 3
2 mult i- drop 8. 0 1 11. 1
2 mult i- drop 7. 5 8 11. 1
Point t o point 9. 0 1 12. 5
Point t o point 8. 5 8 12. 5
Tabl e 12- 7. Funct i onal NC SI max i mum l engt h on a 50 O - 10% sk ew boar d w i t h Ex ampl e
St ack - up ( based on act ual l ab- measur ed sol ut i on)
Topol ogy
Tot al max i mum f unct i onal
l i near bus si ze ( i nches)
Number of vi as
Appr ox i mat e Net t r ace
capaci t ance mi nus l oad
capaci t ance ( pf )
4 mult i- drop 19 1 26. 4
4 mult i- drop 18 8 26. 4
2 mult i- drop 20 1 27. 8
2 mult i- drop 19 8 27. 8
Point t o point 22 1 30. 6
Point t o point 21 8 30. 6
Tabl e 12- 8. Reset Cont ex t f or POR_BYPASS and LAN_PWR_GOOD
POR_BYPASS Act i v e Reset Ci r cui t
I f = 0b I nt ernal POR
I f = 1b Ext ernal Reset
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12.10 Connect i ng t he Li ght Emi t t i ng Di odes ( LEDs)
The 82599 provides four programmable high- current push- pull ( act ive high) out put s per port t o direct ly
drive LEDs for link act ivit y and speed indicat ion. Each LAN device provides an independent set of LED
out put s; t hese pins and t heir funct ion are bound t o a specific LAN device. Each of t he four LED out put s
can be individually configured t o select t he part icular event , st at e, or act ivit y, which is indicat ed on t hat
out put . I n addit ion, each LED can be individually configured for out put polarit y, as well as for blinking
versus non- blinking ( st eady- st at e) indicat ion.
The LED port s are fully programmable t hrough t he EEPROM int erface ( LEDCTL regist er) . I n addit ion,
t he hardware- default configurat ion for all LED out put s can be specified via an EEPROM field, t hus
support ing LED displays configurable t o a part icular OEM preference.
Provide separat e current limit ing resist ors for each LED connect ed.
Since t he LEDs are likely t o be placed close t o t he board edge and t o ext ernal int erconnect , t ake care t o
rout e t he LED t races away from pot ent ial sources of EMI noise. I n some cases, it might be desirable t o
at t ach filt er capacit ors.
12.11 Connect i ng Mi scel l aneous Si gnal s
12.11.1 LAN Di sabl e
The t he 82599 has t wo signals t hat can be used for disabling Et hernet funct ions from syst em BI OS.
LAN0_DI S_N and LAN1_DI S_N are t he separat ed port disable signals. Each signal can be driven from a
syst em out put port . Choose out put s from devices t hat ret ain t heir values during reset . For example,
some I CH GPI O out put s t ransit ion high during reset . I t is import ant not t o use t hese signals t o drive
LAN0_DI S_N or LAN1_DI S_N because t hese input s are lat ched upon t he rising edge of PE_RST_N or an
in- band reset end.
Each PHY can be disabled if it s LAN funct ion' s LAN disable input indicat es t hat t he relevant funct ion
should be disabled. Since t he PHY is shared bet ween t he LAN funct ion and manageabilit y, it might not
be desirable t o power down t he PHY in LAN disable. The PHY_in_LAN_Disable EEPROM bit det ermines
whet her t he PHY ( and MAC) are powered down when t he LAN disable pin is assert ed. Default is not t o
power down.
A LAN port might also be disabled t hrough EEPROM set t ings. I f t he LAN_DI S EEPROM bit is set , t he PHY
ent ers power down. Not e, however, t hat set t ing t he EEPROM LAN_PCI _DI S bit does not bring t he PHY
int o power down.
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The chosen oscillat or or cryst al vendor should be consult ed early in t he design cycle. Oscillat or and
cryst al manufact urers familiar wit h net working equipment clock requirement s can provide assist ance in
select ing an opt imum, low- cost solut ion.
12.12.1 Osci l l at or Ty pes
12. 12. 1. 1 Fi x ed Cr y st al Osci l l at or
A packaged fixed cryst al oscillat or comprises an invert er, a quart z cryst al, and passive component s. The
device renders a consist ent square wave out put . Oscillat ors used wit h microprocessors are supplied in
many configurat ions and t olerances.
Cryst al oscillat ors can be used in special sit uat ions, such as shared clocking among devices. As clock
rout ing can be difficult t o accomplish, it is preferable t o provide a separat e cryst al for each device.
Recommended cryst als are:
12. 12. 1. 2 Pr ogr ammabl e Cr y st al Osci l l at or s
A programmable oscillat or can be configured t o operat e at many frequencies. The device cont ains a
cryst al frequency reference and a Phase Lock Loop ( PLL) clock generat or. The frequency mult ipliers and
divisors are cont rolled by programmable fuses.
PLLs are prone t o exhibit frequency j it t er. The t ransmit t ed signal can also have considerable j it t er even
wit h t he programmable oscillat or working wit hin it s specified frequency t olerance. PLLs must be
designed carefully t o lock ont o signals over a reasonable frequency range. I f t he t ransmit t ed signal has
high j it t er and t he receiver s PLL loses it s lock, t hen bit errors or link loss can occur.
PHY devices are deployed for many different communicat ion applicat ions. Some PHYs cont ain PLLs wit h
marginal lock range and cannot t olerat e t he j it t er inherent in dat a t ransmission clocked wit h a
programmable oscillat or. The American Nat ional St andards I nst it ut e ( ANSI ) X3. 263- 1995 st andard t est
met hod for t ransmit j it t er is not st ringent enough t o predict PLL- t o- PLL lock failures. Therefore, use of
programmable oscillat ors is generally not recommended.
12.12.2 Osci l l at or Sol ut i on
Choose a clock oscillat or wit h a PECL or CML out put . When connect ing t he out put of t he oscillat or t o an
t he 82599, use t he layout informat ion shown in Figure 11.13. Also, make sure t he oscillat or meet s t he
elect rical charact erist ics list ed in Table 11.24. Not e t hat t he EuroQuart z 3HPW5761-A- 25 25MHz PECL
Out put Cryst al- Cont rolled Oscillat or has been used successfully in 82599- based designs.
12.12.3 Osci l l at or Lay out Recommendat i ons
Oscillat ors should not be placed near I / O port s or board edges. Noise from t hese devices can be
coupled ont o t he I / O port s or out of t he syst em chassis. Oscillat ors should also be kept away from
net work int erface different ial pairs t o prevent int erference.
The reference clock should be rout ed different ially; use t he short est , most direct t races possible. Keep
pot ent ially noisy t races away from t he clock t race. I t is crit ical t o place t he t erminat ion resist ors and AC
coupling capacit ors as close t o t he t he 82599 as possible ( less t han 250 mils) .
Tabl e 12- 11. Par t Number s f or Recommended Cr y st al s
Ralt ron AS- 25. 000- 20- SMD-TR- NS7
TXC 9C25000551
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12.13.3 Suppor t f or Pow er Management and Wak e Up
A designer must connect t he MAI N_PWR_OK and t he AUX_PWR signals on t he board. These are digit al
input s t o t he t he 82599 and serve t he following purpose:
MAI N_PWR_OK signals t he t he 82599 cont roller t hat t he main power from t he syst em is up and st able.
For example, it could be pulled up t o t he 3.3V main rail or connect ed t o a power well signal available in
t he syst em.
When sampled high, AUX_PWR indicat es t hat auxiliary power is available t o t he 82599, and t herefore it
advert ises D3cold wake up support . The amount of power required for t he funct ion, which includes t he
ent ire net work int erface card, is advert ised in t he Power Management Dat a regist er, which is loaded
from t he EEPROM.
I f wake- up support is desired, AUX_PWR needs t o be pulled high and t he appropriat e wake- up LAN
address filt ers must also be set . The init ial power management set t ings are specified by EEPROM bit s.
When a wake- up event occurs, t he 82599 assert s t he PE_WAKEn signal t o wake t he syst em up.
PE_WAKEn remains assert ed unt il PME st at us is cleared in t he t he 82599 Power Management Cont rol/
St at us Regist er.
12.14 Connect i ng t he JTAG Por t
The t he 82599 cont ains a t est access port ( 3.3 V only) conforming t o t he I EEE 1149.1- 2001 Edit ion
( JTAG) specificat ion. To use t he t est access port , connect t hese balls t o pads accessible by your t est
equipment .
For proper operat ion, a pull- down resist or should be connect ed t o t he JTCK and JRST_N signals and
pull- up resist ors t o t he JTDO, JTMS and JTDI signals.
A Boundary Scan Definit ion Language ( BSDL) file describing t he t he 82599 10 Gigabit Et hernet
Cont roller device is available for use in your t est environment .
Ther mal Desi gn Recommendat i ons I nt el