Strategic Approaches for MEMS Test

Agenda

1) MEMS Market Requirements And Resulting Test Platform Requirements 2) Platform Solutions For Mechanical Stimulus During Test
Singulated device test

Strip test

InCarrier test

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MEMS Market
MEMS for automotive apps
Airbag activation with hi-g accelerometer Navigation with gyroscope ... Business Characteristics:
-High & predictable volumes -Long process certifications -Typically 3-temperature-test requirements -Tight specifications for test and calibration

MEMS for consumer electronic

Motion game controller low-g accelerometer Mobile navigation with gyroscope ... Business characteristics:
-Fast ramp capability for extreme high volumes -Flexibility for fast package change requests -Cost efficiency at test and calibration via
loosened device and test specification typically only ambient test requirement

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MEMS Packaging Trends

Multiple MEMS applications within one package
X axis Accelerometer Y axis Accelerometer

3 axis Accelerometer 3 axis Accelerometer & Groscope & ...

Physical test requirements Z axis Accelerometer for various mechanical stimuli Reliable package tracking between the different tests is X axis Gyroscope key for the sensor calibration Y axis Gyroscope COT (Cost of test) is skyrocketing Z axis Gyroscope (Invest & test times & yield loss) COT is getting to a critical limit to hinder this trend

Pressure

Microphone 3 axis Gyroscope

Test handler platform shall support multi-application mechanical stimulus with a modular architecture to reduce the required handling cycles
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MEMS Test Platform Requirements

1.

Universal standard handling platform Ambient and Tri-Temp capability

Consumer and Automotive test requirements Rich application portfolio (for different sensor types) Combination of various stimulus applications within one test run Robust handling of << 3x3 package sizes Capability to test chip scale packages

2.

3.

Convertibility of the MEMS stimulus

4.

Convertibility of the package type

5. 6.

Supporting highest test parallelism > 60 CS Reliable package tracking Increase the return of invest Reduce the cost of test
Chip Scale Package
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Platform Solutions

1) MEMS Market Requirements And Resulting Test Platform Requirements 2) Platform Solutions For Mechanical Stimulus During Test
Singulated device test

Strip test

InCarrier test

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Standardization at Singulated MEMS

Standard Gravity test handler MT9320 or MT9928 Singulated device handling tube to tube 4 Contact sites (suitable for automotive) Temperature conditioning (-55C to +155C at +/- 3C accuracy) Fast package conversion (with MT9928)
Standard MEMS test module:

MEMS stimulus during test Configurable for multiple MEMS applications -Accelerometer high g -Accelerometer 3 axis -Yaw-Rate (Gyro) -Pressure
-Magnetic Rotating Stimulus

Fast Package conversion

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Standardization at InMEMS
InMEMS = MEMS strip test solution on InStrip Standard InMEMS test module: MEMS stimulus during test for whole strip High parallel test (600 to 1200 signal lines) Configurable for multiple MEMS applications 1. InFlip = Accelerometer 3 axis 2. InPressure = Pressure test 3. InGyro = 6 DOF motion 4. InMagnet Fast Package conversion

Standard Platform InStrip (strip test handler) Temperature conditioning

(-40C to +135C)

Fast package conversion

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MEMS COT

Test Platform Modularity

Singulated MEMS Test InMEMS Test
MT9928 InStrip MT9320

MEMS Platforms

MEMS Applications
Accelerometer 50g Accelerometer 100g

Key COT contributor: TEST PLATFORM MODULARITY

X, Y, Z, 45 X, Y, Z Z+X, Z+Y Const. Yaw Rate 20 bar / 5 press. level Helmholz / Rot. Magnet Rot. Magnet Sinusoidal Stimulus Y, Z, X+Y X, Y, Z

Acceleration high g

Y, Z, X+Y
InFlip InGyro 6 DOF

Acceleration 3 g Accelerometer 3 axis low axis

Gyroscope Pressure Magnetic Microphon

InGyro InPressure InPressure InPressure / InBaro

InMagnet 2 DOF InPhone

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InFlip test module

InFlip test = 3axis accelerometer test, low g

Combined two axis rotation of leadframe Rotation Alpha-Axis Electrical connection via flexible wiring from the DUT board to the ATE

InFlip specification:
> 2 Axis, +/- 185 rotation angle both
> 600 / 1200 contact pins parallel from DUT to ATE (soft docking) > Rotation speed: 180/s > Rotation accuracy: +/- 0,1 > Temperature range: -40C .. +125C (at 600 contacts) > Sub-indexing of strip in one direction (test complete rows) > Full angle and Index control from ATE via GPIB (IEEE 488.2)

DUT-Board Indexing Rotation Beta-Axis

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InGyro 9 Axis Motion MEMS Test

9 Axis Motion MEMS Test = 3 Axis Gyroscope + 3 Axis low g Accelerometer + 3 Axis Compass

Architecture:
1. 2. 3. True 3 axis cardanic module a + b axis: angular orientation of strip contact with 1200 pins tester resource board g axis: vertical gyroscope drive axis 3 axis simultanious stimulus with
a + b at 45 position

4.

Homogenous magnetic field in test area

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InCarrier Singulated Device Carrier Singulated IC Test InStrip IC Test

Combined advantages of Singulated and InStrip IC Test Applied for Patent

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InCarrier Basic Technology

> Sheet-metal Sandwich architecture > Spring layer is clamping the devices and registering them precisely like on a strip > 2D dot code providing ID for device tracking

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InCarrier for Fine Pitch Devices

Field proven device registration in the carrier matrix with resulting contact accuracy:
Singulated devices with pitches of

Contact imprint LGA 3x3, 0.5pitch on InCarrier .

0.5 mm and 0.4 mm can be contacted very

reliably and up to

256 devices in parallel

in the InCarrier InStrip system.

Contacting with about 32 m offset

socket and device tolerances to be added 32 m

Device to Socket Position 99.7% Probability 3 * [m] device to InCarrier fiducial 30 fiducial to contact unit (InStrip) 12 total (quadratic addition) 32

Mercury contact 250 m contact ball device body

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InCarrier Process

Untested devices in JEDEC tray, tube, bulk, wafer frame

Untested devices in InCarrier

Tested devices in JEDEC tray, tube, bulk, tape & real

Tested devices in InCarrier

GEM HOST (Server)

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InCarrier Process
tray tube

Loader

bowl wafer ring

InStrip+(InMEMS) Handler
soak

lead frame

contact

Creat e map file

tube

Unloader
Multitest Solution
Licensed Partner Solution

tray T&R

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InCarrier Process Options

tray tube

Burn-In using
Loader

MT InCarrier sockets

bowl wafer ring lead frame

soak

InStrip+(InMEMS) Handler

contact

Creat e map file

Product Marking (Laser mark) Unloader

tube tray T&R

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InCarrier Singulated Device Carrier Summary

> InCarrier - Advantages versus strip and singulated device test:
Robust Test-Handling Smallest packages WLP, WSP, CSP Test Highest Parallel Test Temperature Test Various MEMS Test Applications Burn-In / Bake Option Test is Final Test Full Traceability 0 PPM 0 PPM down to 1x1 mm

Re-test with same tool setup Kit-less handler with standardization of carrier size Independence of assembly lead-frame layout

> InCarrier - is overcoming the constraints of strip test

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Thank you!