Santa Clara Valley Chapter, CPMT Society

10/12/2010

Greetings from Georgia Tech PRC

All-Silicon System with All-Sili S ih Highest Functionality, Lowest Cost in Smallest Size with Nano-packaging NanoCPMTCPMT-SCV Chapter Meeting
October 12 O t b 12, 2010

NMDC, Monterey, CA NMDC,

O t b 13, 2010 October 13

Co Contributor: Dr. Raj Pulgurtha

Prof. Rao R. Tummala

Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology Atlanta, GA USA 1

What is Nanopackaging? Nanopackaging?

Materials and processes at nanoscale for:

Interconnecting g Powering Cooling Protecting

Devices and Systems. g nano-p g nano-p g Leading to nano-packaged devices and nano-packaged systems with highest functionality at lowest cost in smallest size

2 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Georgia Tech PRC Vision

PC
100000 Functional Density or Component Density / cm3) y

W/S

Vo olume(cm3)

10000

Laptop

SINGLE FUNCTION
Digital
1000

Notebook Cellular SMART Watch & Bio-sensor

MULTI -FUNCTION FUNCTION

Digital, RF, MEMS, analog, video

100

MEGA-FUNCTION-Vision of GT PRC
all the above and 1000s sensors
1970
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1980

1990

2000

Current Smart Systems

LG Video Phone Watch Featuring:

Apples iPhone 4 Featuring:

Full touch screen Camera Speaker Bluetooth Play music Take photos Schedule appts Read text messages Make video calls

Multi-touch display MultiDual cameras Three-axis gyroscope ThreeCamera and LED

Bionic gadget can:

Bionic gadget can:

Play music, movies Take photos Record videos Stream TV shows Locate nearest Metro station in Paris Over 200,000 applications

4 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

3D ASSM Vision with Nanoscale Packaging

1010 108 109

Moores Law For ICs

108

3D All Silicon System

*Pwr Inductors (2010-)

107

106

Component Density or C Fu unctional Density/cm2

Transistors/cm2

107

*Batteries (2011-)105

106

*Nanobio pkg (2009-) *Antennas (2008-)

*DECAPS (2007-)

104

105

103

104

*RF Caps and Ind.s p (2006-) *Interconnections (2004-).

102

50 103 1971 PTH 1980 SMT 1990 MCM 1995 2020 Sources: IBM, Intel 10

5 | STMicroelectronics, Oct 2010

All Silicon System with Nanopackaging

NANOMATERIALS
OPTO SOP
LASER PD/TIA PHOTODETECTOR
CHIP-LAST EMBEDDED IC

EMBEDDED COMPONENTS
DIGITAL SOP
THERMAL SOP

INTERCONNECTIONS
EBG & Isolation

SUBSTRATES & SYSTEM INTEGRATION

SENSORS

ANALOG & RF SOP

GaAs RFIC
ANTENNAS & FILTERS

MEMS PACKAGING
MEMS

Waveguide NANOMAGNETICS

SYSTEM ON CHIP (SOC)

Bio-Sensor

Silicon with TPV

3D CAPACITORS

POWER POWER & BATTERIES MECHANICAL DESIGN FOR RELIABILITY

HIGH DENSITY I/O MIXED SIGNAL ELECTRICAL DESIGN

3D ICs

THERMAL

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

NanoNano-Packaging Requirements

Improved properties Miniaturization LowLow-temperature for organic packaging compatibility

7 | NMDC

3D ASSM Strategy in Micro to Nanocomponents

Power
High-density capacitors and inductors High Super-capacitors Super Thin film batteries

RF
Capacitors Inductors Antennas

Digital
Capacitors

Thermal
TIM (Thermal Interface Materials)

Interconnections
Bonding layers: Adhesives and nanoparticle bonding layers Nanoscale interconnections

8 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

NanoNano-materials to Nano-systems NanoMaterials Chemistry

Chemical Processing

Electrical Structures

Components

Microstructures

Properties

Systems

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NanoNano-packaging Strategy
Function
Power Components

Component
High density capacitors High density inductor Supercapacitors Batteries

Goal
High surface area Thinner dielectrics or electrolytes Low-loss and high-frequency magnetic materials High K and Low loss Low TCC Thinner dielectrics High permittivity Low melting point Enhanced strength and fatigue resistance Moisture resistance Biocompatibility Hermeticity High thermal conductivity Low CTE

RF Components

Capacitors Inductors Antennas Decoupling capacitors Bump Bonding layers Barriers Hermetic coatings Encapsulants Adhesives Molding compounds

Digital Interconnections

Reliability

Thermal Structure

TIM

10 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Power Supply Components

Capacitors Inductors Supercapacitors Thi fil b tt i Thinfilm batteries

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Power Supply Capacitors

Goal:
Voltage conversion:

Charge pumps Linear regulators

Filtering power supply noise DC blocking

HIGH SURFACE AREA ELECTRODES

Approach:
High-surface-area electrodes High-surface Conformal dielectrics

Properties:
50-100 uF/cm2 50uF/cm 20 V 1 uA/uF leakage uA/ Integration in package
BOTTOM COPPER SILICON
Capacitance density: 30 uF/cm2 ; Withstands 30 V; (GT-PRC)

12 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Nanoscale Power Inductors

Goal:
Inductors for Power convertors

Approach:
Nano-layered or Nanonanocomposite magnetic core for suppressed loses Permalloy wires in polymer matrix

Properties:
1 mH/mm2 mH/mm 50-100 micron device 50 10-100 MHz 10-

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Nanoscale Supercapacitors

Goal:
Miniaturized components for:

Power boost in short duration Power conversion Pulsed power supply

Nanocomposite electrodes (Yushin, GT)
105
Target

Approach:
High surface area oxide or CNT networks for volumetric efficiency Novel designs and fabrication routes to eliminate the need for separator Reduce the electrolyte thickness by 1010-100X for faster charge and discharge

10
Capacitance Density F/cc

104

Nanoelectrodes (High surface area) Conformal thin dielectrics (Fast Charge-Discharge)

Properties:

103

Low ESR and leakage for high efficiency

500-1000 F/g 500 100 mF/cm2 for 100um thickness Stable charge-discharge after charge500,000 cycles 14 | NMDC

102 10 1 10-2 10-4 Charge-discharge time (s)

0.1 10-6

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Energy Density J/c cc

Santa Clara Valley Chapter, CPMT Society

10/12/2010

Batteries

15 | NMDC

Goal: Thin film power source integrated in the package Approach: Lithium intercalation with higher active surface area for fast electrode kinetics Shorter diffusion lengths for rapid transport with Advanced electrolytes Thin film packaging compatible for battery integration Properties: Thin film and nano-batteries nanowith 1 mAhr/cm2 mm at 3 V mAhr/cm (equivalent to 30,000 W hr/liter) 1000-2000 mAhr/g 1000mAhr/g

(Meilin Liu, GT-PRC)

Nano SnO2

Porous Lithium cathodes

(Meilin Liu, GT-PRC)

(Jud Ready, GTRI GT)

Si-decorated CNT

RF Components
Capacitors Inductors Antennas

16 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

RF Inductors

Goal:
High Q and high-density highinductors for: for:

RF filters Oscillators Matching networks

Inductor design

Approach:
Multilayered design for high Q Materials: Low loss dielectrics Low-Cost Multilayered processes LowLowdrilling, Low-cost drilling wet metallization Thin form factors

RF Inductor demo.

Properties:
10-100 nH/mm2 (50 microns) 10nH/mm Q of above 100 Frequency: 1-10 GHz 1Q >100 of RF inductors

GT-PRC

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Nanoscale Magneto-Dielectric MagnetoAntennas

Goals:
1-10 GHz (ex. WiFi and WiMAX) WiMAX) Size reduction by 10X Enhance bandwidth and gain
Size scales as/ rr

Approach:
Nanoscale magnetic composites

Antenna miniaturization with magneto-dielectrics

(Swaminathan, GT PRC)
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 State-of-the-art PRC Status

Standard FR-4

Magneto-dielectric

Properties:
Frequency: 1-10 GHz 1 Permeability: 10-100 10 Permittivity: 5-15 5Permeability

1.0E+07

1.0E+08
Frequency

GHz permeability demo. with polymer composites

(GT PRC))

Magnetic composite dielectrics

18 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

RF Capacitors: Nano and Micro-polymer Composites Micro

Goal:
Components for RF

nF/cm 1010-100 nF/cm2 Q>200 Tolerance within 5%

> 10, TCC 50 ppm/C; Loss 0.005
1.01 1.00 0.99

Approach:
Nanocomposite dielectrics Oxides in Polymer matrix Polymer (5-10) um and inorganic (1um) (5 Precision tolerance for size and thickness

k/k at 25 C

0.98 0.97 0.96 0.95 0.94

Properties:
Ferroelec TCC ppm/C Perm. Loss 2000 500-1000 0.08

LTCC and Traditional RF dielec. 50 2.5-8 0.001

Nanocomp. 50 10-80 0.001

0.93 20

filler 1 filler 2 filler 3 filler 4 high Q polymer

40 60 80 100
o

120

140

Temperature ( C)

Filler chemistry selection to balance dielectric constant, Q and thermal stability

(jin Hwang, Georgia Tech)

19 | NMDC

Digital Components
Decoupling Capacitors

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Decoupling Capacitors

Goals:
Noise-free power supply NoiseSupport high power ICs (higher current demands) Support high bandwidth I/Os Thin film capacitors integrated in organic build-up layers buildSilicon integration with trench structures and conformal coatings Design for low impedance Design to route high-density I/Os highHigh capacitance density> 2 mF/cm2 Low impedance (high Self-Resonance) Selfin the GHz frequencies BDV>20 V

Approach:

High K on Silicon; 100-200 nm (GTPRC)

High K on organic packages; 300-400 nm, DuPont (left) and GTPRC (right)

Properties:

Trench capacitors in silicon 5 micron trench; 30-50 nm dielectric

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Printed Nanometal Wiring

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Printed Nano-metal Wiring Nano

Goals:
Metal wiring with low-cost printing lowtechnologies on flex and roll-to-roll roll-toprocess Organic compatible processing

Silver sintered at 200oC

Approach:
Suspensions of nanosilver (5(5-50 nm) Ink jet printing of nanosilver ink Sintering at organic or paper compatible t tibl temperatures t

Properties:
T < 250oC Conductivity close to bulk metal
Ink-jet printed antenna on low-cost LCP and PET Flex (Tentzeris, Georgia Tech)

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Interconnections
Conductive Adhesives Nanoscale Interconnections Nanoparticle Bonding

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

FineFine-pitch Interconnections with NCF & n-ACF n

Goals
Fine Pitch (30 micron) interconnections using NCF 10X reduction in pitch compared to flipchip 150 C assembly Embedding in organic packages

Approach:
Copper bumps g Bonding with NCF

IC Embedding with Cu bump and Chip-Last; Cross-section

Properties:
Contact resistance < 10 milliohms Reliable interconnections:

1400 cycles TST (-55 to 125) (125) 175 C, 72 hours HTS 192 hrs, HAST

IC Embedding, Top View

25 | NMDC

Nanoscale Interconnection Materials

Goal:
Flipchip assembly for nextnextgeneration nano and 3D ICs

100

Sn-Pb solder

Approach:
Nanocopper bump Nanocomposite solders Advanced Barriers

Cr reep (% %)
60 40 20 0

80

Nancomposite solder 10
Hours

30

40

Properties:
Current handling 106 Amp/cm2 Enhanced creep and fatigue resistance Enhanced strength Fine pitch capability with WLP: 5050-100 microns

creep resistance for traditional solder vs nanocomposite solder Crack growth rate h (mm/cycle e) 10-3 10-4 10-5 10-6 Nano Cu 100 Micro Cu

K Measure of stress intensity at crack tip (MPa m)

10

Fatigue resistance for micro and nanocopper

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Nanoscale Bonding Layer

Goal:
3D IC assembly and i t ti ith interconnections with:

Patterned nanoparticles by in-situ capture on the bonding pads

Pitch less than 20 microns T < 250 C SolderSolder-free for reliability, fine-pitch fineand low-cost process low Bonding at 250-300C

Approach
Patterning nanoparticles p Low-temperature Cu p -to-pad Lowpadpad to-p bonding

SILICON

Properties:
Sintering at T < 250oC Conductivity approaching that of bulk metals Flipchip infrastructure compatibility SILICON
Direct capturing of nanoparticles on bonding pads Bonding at low temperatures with gold, silver and copper nanoparticles

27 | NMDC

Thermal Interfaces

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

NanoNano-materials for TIM

BLT m

Goal:
Thermal management in:

250

50

Thermal grease Indium

HighHigh-power PCs and workstations Miniaturized 3D mobile systems

10 1

Nanocomposite 100 500

Approach
Advanced thermal adhesives with nanoflakes

TIM Evolution

W/mK

Metal nanocomposites as TIM CNTCNT-based TIM

p Properties:
Thermal resistance less than 0.01oC cm2/W Reliability with thin layers (<10 microns) CTE compatibility with Si and heat sink

Indium-graphite composites ( y , ) (Reddy et al., GT-PRC)

CNT Transfer (CP Wong, GT)

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Reliability
Nano-composite for Electronics Nano Packaging for Biocompatibility Nanomaterials for Bioelectronics

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Nanocomposites for Reliability

Goal:
Enhance polymer composite properties for:

Adhesives Underfills Molding compounds, Encapsulants Coatings Superhydrophobic Surfaces Contact angle > 160; Low adhesion Nanostructured morphology (C P Wong, GT PRC)

Approach:
Hybrid organic-inorganic materials for organicimproving CTE, Tg and modulus (thermomechanical properties) Nanocomposites for low moisture permeability Surface modification for hydrophobicity for low moisture permeability f l i t bilit Process compatibility for 5-10 micron 5clearance and pitch CTE: 10-20 ppm/C; TG>250 C; 10- ppm/C; Contact angle > 160 160 Low moisture permeability

Properties:

Water permeability as function of filler content (Chugang Hu, Jangkyo kim, HUST)

Claypolymer nanocomposites (Azom.com)

31 | NMDC

BioBio-compatible and Hermetic Packaging

Goals:
Hermeticity in water or saline environment Biocompatibility with tissue interface

Approach:
Biocompatible polymers such as LCP and paralyne High-density packaging with Highhermetic metal-polymer metalinterfaces Hermetic coatings
Intraocular Camera 150m Retinal Prosthesis

Properties:
Sealing with low leak rates 1000 feedthroughs in 5 mm x 5 mm
1000 Channel Feedthrough Array with <10-9 leak rates

32 | NMDC

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Summary

3D ASSM is about highest functionality at lowest cost in y y smallestsmallest- size system, enabled by
Silicon for devices, packages and boards Components at nanoscale

Silicon interposers and packages underway to enable this vision with low cost panel-based Si panelNanoscale component research is underway for
Digital RF Power Thermal Encapsulation

33 | NMDC

Thank You
Co Contributor: Dr. Raj Pulgurtha

Prof. Rao R. Tummala

Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology Atlanta, GA USA 34

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Santa Clara Valley Chapter, CPMT Society

10/12/2010

Nanocoatings for Neural Interface Compatibility

Goal:
Enhance stability of implanted electrodes to improve reliability and life-time life-

Approach:
Immobilize anti-inflammatory anticoatings on the electrode surface Coat with molecules which enable tissue integration
Anti-inflammatory Coating on silicon electrodes (Ravi Bellamkonda, GT )

Properties:
Suppress inflammation and tissue scar formation at the interfaces
Modulated Neural Interfaces Modulation of scarring around implanted electrodes using coating

35 | NMDC

Georgia Tech-PRC Vision of 3D Systems Tech3D ICs Modules Power ICs Potonics Sensors MEMS

3D ICs-CMOS and non-CMOS 200-300 mm wafers 10% System Miniaturization

3D Systems 90% System 600mm SOP

GT PRC Focus @Nanoscale

3D SYSTEMS Consumer Energy Automotive Healthcare Computer

130nm 90nm 45nm 32nm 22nm? CMOS ICs, 300nm Wafer Fabs ICs

Passives: R, L, C, Antennas Packages and Boards Thermal Materials and Interfaces

Power Sources System Interconnections & Reliability 3D Systems

36 | NMDC

System Design Tools

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