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Process Capability Index (PCI) and SPC Control Limits

INTRODUCTION
PCI is common metric in industry to measure and predict capability of manufacturing processes Communication tool:
Shop floor personnel Company management Customer, and certification organizations

SPC is a primary tool for process capability analysis SPC can detect cause of output in real time Control limits - critical decisions for control charts Common control charts: X-bar and Range charts

Proceedings of NAMRI/SME, Vol. 39, 2011

Manufacturing Process Capability


Process Capability ratio (Cp) is the ability of the process to manufacture the product that meets engineering specifications. Cp = (USL LSL) / 6 Process Capability:
= Standard Deviation (sigma) = Mean USL = Upper Specification Limit LSL = Lower Specification Limit Cp = Process Capability Ratio Cpk= Process Capability Index

Process Capability Index (Cpk) determinates the efficiency of the process. It measures how close the process is to target.

Proceedings of NAMRI/SME, Vol. 39, 2011

Manufacturing Control Charts

Proceedings of NAMRI/SME, Vol. 39, 2011

CMM and SPC Analysis


Results from CMMs are automatically sent to Statistical Software , such as ProLink QC CALC Real time or MINITAB.

Proceedings of NAMRI/SME, Vol. 39, 2011

CMM - Part Alignment


Localization is known as a relationship between part and CMM coordinate system. Six contact 3-2-1 approach is required. 3 points define XY plane primary datum 2 points define a line which lies on the XZ plane secondary datum. final point defines YZ plane tertiary datum. point of intersection of these 3 planes is the origin of the system X=0, Y=0, and Z=0.

Six touch points needed to create coordinate system.

Proceedings of NAMRI/SME, Vol. 39, 2011

CMM - Measurement
Machine Components (CMM Errors) Part Component (feature form error)

Repeatability Component Environmental Factors

Task-Specific Measurement Uncertainty

Sampling Patterns

Probe Components (probe system error)

Fitting Algorithms

Proceedings of NAMRI/SME, Vol. 39, 2011

EXPERIMENTAL WORK
OBJECTIVE Three experiments have been conducted to evaluate the effect of this decision on some important parameters and metrics used in the industrial community such as: the process capability index (Cpk), and Statistical Process Control (SPC) control limits. Estimate and compare the calculations of Process Capability Index (PCI) and Statistical Process Control (SPC) limits. INSPECTION TOOLS Coordinate Measuring Machine (CMM), Computer Aided Design (CAD) based software PC-DIMIS to generate and simulate the inspection program. Digital Height gage (accuracy 0.000050 inch) Digital caliper (accuracy 0.0005 inch)
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Experimental Work 3 CASES

Proceedings of NAMRI/SME, Vol. 39, 2011

Set up and Alignment CASE 1


The data collection for 19 parts was measured with CMM and Height Stand Indicator for 2 critical characteristics. Diameter 3.812 +/- .002 Center Line 2.120 +/- .005

Fixturing - CMM

Part Alignment - CMM

Proceedings of NAMRI/SME, Vol. 39, 2011

CASE 1 Sampling Strategy CMM


Diameter 3.812 was measured with two levels with off set of .100 form the bottom and the top surface of cylinder. 8 probing samples were taken to establish diametrical shape of each level.
Center Line 2.120 was established by measuring diameter .752 +/- .001, and line (datum K ) that was established during the alignment.

-K-

3.812 .002

2.120 .002

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Set Up and Alignment CASE 2


The data collection for 19 parts was measured with CMM and Height Stand Indicator for 2 critical characteristics. True Position .004 to datum DEAPerpendicularity .001 to datum D- (at datum L)

Fixturing - CMM

Part Alignment - CMM


-D-

-A-

-E-

-F-

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CASE 2 Sampling Strategy CMM


Perpendicularity .001 to datum D- (at datum L) - 17 probing samples were taken to establish Plane of datum - D - , and 16 points to establish perpendicularity relationship between datum D- and - L -L-

-DTrue Position .004 to datum DEA - 10 probing samples taken to establish slot contour of datum - F-

-D-

-E-AProceedings of NAMRI/SME, Vol. 39, 2011 12

Set up and Alignment CASE 3 (Rear Penal)


The data collection for 30 parts was measured with CMM and caliper for defined characteristics. The BOSS Cylinder .52.005 Inside Diameter .940.005 Inside Packet Square DIM 1.20.005 Extruded Square DIM 1.360.005

Fixturing - CMM

Part Alignment - CMM

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CASE 3 Sampling Strategy CMM


Boss Cylinder measured with two levels with off set of .100 form the bottom & top, 8 probing samples were taken at each level. Inside Diameter .940.005 was established with 8 probing hit samples

Inside Packet Square was established with 2 probing hits on each side of square

Extruded Square DIM was established with 2 probing hits on each side of square

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CASE 3 Sampling Strategy Caliper


Boss Cylinder was measured 60 apart at the top and bottom average recorded. Inside Diameters was measured at 3 locations 60 apart, average recorded.

Inside Packet Square measured at two locations (top & bottom) average recorded.

Extruded Square measured at two locations (top & bottom) average recorded.

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RESULTS CASE 1 Process Capability


The Cpk index varies from 0.7 to .75 for the height gage, while it ranges from 1.17 to 1.4 for the CMM. The experiment reveals that the measuring range of collected data collected from the CMM is almost half the size of data collected from the height gage and surface plate The upper and lower statistical control limits calculated from the CMM data is also half the size of the conventional tool.
Hist.of C/L 2.120 .005 (Layout), C.L. 2.120 .00
Normal 300 250 Density 200 150 100 50 0
1 2. 14 2. 11 6 11 2. 8 12 2. 0 2. 12 2 2. 12 4 2. 12 6

Variable (Layout) (CMM)

Mean StDev N 2.120 0.002550 29 2.121 0.001303 29

Data

X AND R CHART FOR THE 2, 12 C/L DISTANCE FOR CASE STUDY (H. GAGE)

X AND R CHART FOR THE 2.12 C/L DISTANCE FOR CASE STUDY (CMM)

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RESULTS CASE 2 Process Capability


The Cpk varies from 1.16 to 1.65 for CMM, while it varies from 0.65 to 0.78 for the height gage (Table). The SPC process control limits for the X and R charts were 47 % less for the CMM data.
Hist. of True Pos. .004 -D EA- (CMM), TP .004 -DEA- (Layout)
N ormal 1 00 0 80 0 Density 60 0 40 0 20 0 0 Variable True Pos. .00 4(CMM) TP .00 4 (Layout) Mean StDev N 0 .00 20 47 0.00 04 20 8 19 0 .00 22 53 0.00 06 72 0 19

35 30 25 20 15 10 0 0 .0 0 . 0 0 .0 0 .0 0 . 0 0 0 0 0 0 0 0. Data

X AND R CHART FOR THE TRUE POSITION 0.004 STUDY II (HEIGHT GAGE)

X AND R CHART FOR THE TRUE POSITION 0.004 STUDY II (CMM)

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RESULTS CASE 3 Process Capability


Cpk varies from 0.96 to 1.28 for digital caliper, while it ranges from 1.40 to 1.87 for the CMM for the same parts.

The SPC process control limits for the X and R charts shown in are 35% less for the CMM data.
Histogram of CMM O D .5 2 , Caliper O D .5 2 _ 1
Norm al 500
Variab le C M M O D .52 C alip er O D .52_1 M ean 0.5203 0.5202 S tD ev N 0.0008945 30 0.001341 30

400

Density

300

200

100

0 0.517

0.518

0.519

0.520 Dat a

0.521

0.522

0.523

XandRChartfortheOD0.52Distance forCaseStudy(Caliper)
Proceedings of NAMRI/SME, Vol. 39, 2011

FXandRChartfortheOD0.52 DistanceforCaseStudy(CMM)
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Results Discussion
For all cases that the range of the measured data is larger for the height gage and caliper compared to the CMM. This phenomenon may affect a SPC charts by either shrinking or expanding the region between the upper and lower statistical limits depending whether the measured data is collected from a CMM or conventional tool. Suggested standard deviation monitoring graph is used to insure the integrity of the Cpk calculations. Figure a shows the cumulative standard deviation for the 2.12 C/L distance (case study I) Figure b is based on a window of the last ten points. Figure c is based on a window of the last five points. The erratic behavior of the standard deviation of the height gage is noticed and this justifies the low Cpk value. Using this graph will minimize false alarms and/or the need to re-calculate the upper and lower control limits for SPC charts; since this situation should be avoided (www.itl.nist.gov).
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Results Discussion
For all cases that the range of the measured data is larger for the height gage and caliper compared to the CMM. This phenomenon may affect a SPC charts by either shrinking or expanding the region between the upper and lower statistical limits depending whether the measured data is collected from a CMM or conventional tool. Suggested standard deviation monitoring graph is used to insure the integrity of the Cpk calculations. Figure a shows the cumulative standard deviation for the 2.12 C/L distance (case study I) Figure b is based on a window of the last ten points. Figure c is based on a window of the last five points. The erratic behavior of the standard deviation of the height gage is noticed and this justifies the low Cpk value. Using this graph will minimize false alarms and/or the need to re-calculate the upper and lower control limits for SPC charts; since this situation should be avoided (www.itl.nist.gov).
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Conclusions
The analysis provided in this paper reveals that the CMM measurement proved to be more accurate than manual gages. The measurement data collected from manual gages is more spread around the mean, while in case of coordinate based metrology tool the collected data is more clustered around the mean or the target values. There is major difference when calculating the Cpk and the SPC control chart limits based on selection of the measurement device. This will effect a percentage of nonconforming products. The difference in the calculation of the X and R charts control limits may cause inconsistency, confusion, and may result in unnecessary false alarms.
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Recommendation
As a recommendation, if a checked dimension is critical to the product functionality such as: bore diameter in an engine block, a CMM would be recommended, while if the dimension is non-critical, a conventional inspection tool may be considered convenient. The suggested standard deviation monitoring graph provided in this paper is a part of larger scale study intended to provide a decision support system for the manufacturing and/or quality engineer to make better decisions regarding the control process monitoring and inspection process.
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Thank You

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