En LG-P350 SVC ENG Nasirahmed

Internal Use Only
Service Manual
LG-P350
Date: January, 2011 / Issue 1.0
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Copyright 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
Table Of Contents
1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................ 3
1. Regulatory Information ......................................................................... 3
1.3 Abbreviations............................................................................................. 5
2. PERFORMANCE ...................................................................... 7
.1 Product Name ............................................................................................ 7
. Supporting Standard .............................................................................. 7
.3 Main Parts : GSM Solution ..................................................................... 7
.4 HW Features ............................................................................................... 8
.5 SW Features ............................................................................................. 10
.6 HW SPEC. ................................................................................................. 13
3. TECHNICAL BRIEF ................................................................ 19
3.1 GENERAL DESCRIPTION ...................................................................... 19
3. GSM MODE .............................................................................................. 1
3.3 UMTS MODE ............................................................................................ 3
3.4 GPS RECEIVER.......................................................................................... 6
3.5 LO GENERATION and DISTRIBUTION CIRCUIT............................ 6
3.6 OFF-CHIP RF COMPONENTS ............................................................. 7
3.7 Digital Baseband(DBB/MSM77) .................................................. 3
3.8 Hardware Architecture ........................................................................ 33
3.9 Subsystem (MSM77) ....................................................................... 35
3.10 Power Block ........................................................................................... 38
3.11 External memory interface ............................................................. 43
3.1 H/W Sub System .................................................................................. 44
3.13 Audio and sound ................................................................................ 51
3.14 Display ..................................................................................................... 57
3.15 Vibrators (Q-Coin Motor) ................................................................. 59
3.16 Compass Sensor .................................................................................. 60
3.17 Motion Sensor ...................................................................................... 6
3.18 Main Features ....................................................................................... 63
3.19 Main component ................................................................................ 64
4. TROUBLE SHOOTING .......................................................... 71
4.1 RF Component ....................................................................................... 71
4. SIGNAL PATH ........................................................................................... 73
4.3 Checking TCXO Block ........................................................................... 76
4.4 Checking GSM TX Module(GSM PAM + FEM) Block ................ 78
4.5 Checking WCDMA Block .................................................................... 81
4.6 Checking GSM Block ............................................................................ 91
4.7 GPS/WIFI/BT RF Component ............................................................ 99
4.8 GPS/WIFI/BT SIGNAL PATH .............................................................. 101
4.9 GPS/WIFI/BT Trouble shooting ...................................................... 103
4.10 Power ON Troubleshooting .......................................................... 109
4.11 Charging Trouble shooting ........................................................... 113
4.1 3M FF Camera trouble .................................................................... 117
4.13 Audio Trouble .....................................................................................10
4.14 Main LCD trouble .............................................................................. 13
4.15 Motion Sensor on/of trouble ...................................................... 134
4.16 Compass Sensor on/of trouble .................................................. 136
4.17 Q coin Motor ....................................................................................... 138
5. DOWNLOAD ....................................................................... 140
6. BLOCK DIAGRAM ............................................................... 153
7. CIRCUIT DIAGRAM ............................................................ 158
8. BGA Pin Map ...................................................................... 166
9. PCB LAYOUT ....................................................................... 170
10. CALIBRATION ................................................................... 172
10.1 General Description ......................................................................... 17
10. Requirement .......................................................................................17
10.3 Setup for RF calibration .................................................................. 173
10.4 Tachyon Software Installation ..................................................... 173
10.5 Tachyon Start ...................................................................................... 174
10.6 Overview of RF Calibration ........................................................... 179
11. STAND ALONE TEST ........................................................ 183
12. EXPLODED VIEW & REPLACEMENT PART LIST ............. 190
1.1 EXPLODED VIEW ................................................................................ 190
1. Replacement Parts ........................................................................... 191
1.3 Accessory .............................................................................................15
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1. INTRODUCTION
1. INTRODUCTION

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.

1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your companys employees, agents, subcontractors, or person working on your
companys behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common carrier telecommunication service of
facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that
result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

1. INTRODUCTION
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1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

Service personnel should ground themselves by using a wrist strap when exchange system boards. When
repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are
used.
When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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1. INTRODUCTION

6/140
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked Loop OPLL
Light Emitting Diode LED
Low Drop Output LDO
Liquid Crystal Display LCD
Intermediate Frequency IF
International Portable User Identity IPUI
Global System for Mobile Communications GSM
General Purpose Interface Bus GPIB
Gaussian Minimum Shift Keying GMSK
Flexible Printed Circuit Board FPCB
Electrostatic Discharge ESD
Electrical Erasable Programmable Read-Only Memory EEPROM
Digital Signal Processing DSP
dB relative to 1 milli watt dBm
Digital Communication System DCS
Digital to Analog Converter DAC
Constant Current Constant Voltage CC-CV
Bit Error Ratio BER
Baseband BB
Automatic Power Control APC
1. INTRODUCTION
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1. INTRODUCTION

7/140
Wireless Application Protocol WAP
Voltage Control Temperature Compensated Crystal Oscillator VCTCXO
Voltage Controlled Oscillator VCO
Universal Asynchronous Receiver/Transmitter UART
Time Division Multiple Access TDMA
Time Division Duplex TDD
Travel Adapter TA
Side Tone Masking Rating STMR
Pseudo SRAM PSRAM
Static Random Access Memory SRAM
Sending Loudness Rating SLR
Subscriber Identity Module SIM
Surface Acoustic Wave SAW
Real Time Clock RTC
Root Mean Square RMS
Receiving Loudness Rating RLR
Radio Frequency RF
Public Switched Telephone Network PSTN
Phase Locked Loop PLL
Programmable Gain Amplifier PGA
Printed Circuit Board PCB
Power Amplifier Module PAM
1. INTRODUCTION
2. PERFORMANCE
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2. PERFORMANCE

2.1 Product Name
LG-P350 : WCDMA900/2100+EGSM/GSM850/DCS/PCS
(HSDPA 3.6Mbps GPRS Class 12 / EDGE Class 12)

2.2 Supporting Standard
Item Feature Comment
Supporting Standard WCDMA(FDD1,8)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit: Class 1, 2, 3, C-E

Frequency Range WCDMA(FDD1) TX : 1920 1980 MHz
WCDMA(FDD1) RX : 2110 2170 MHz
WCDMA(FDD8) TX : 880 915 MHz
WCDMA(FDD8) RX : 915 960 MHz
EGSM TX: 880 915 MHz
EGSM RX: 925 960 MHz
GSM850 TX: 824 849 MHz
GSM850 RX: 869 894 MHz
DCS1800 TX : 1710 1785 MHz
DCS1800 RX: 1805 1880 MHz
PCS1900 TX: 1850 1910 MHz
PCS1900 RX: 1930 1990 MHz

Application Standard WAP 2.0

2.3 Main Parts : GSM Solution
Item Part Name Comment
Digital Baseband MSM7227 : Qualcomm
Analog Baseband PM7540 : Qualcomm
RF Chip RTR6285 : Qualcomm

2. PERFORMANCE
2. PERFORMANCE
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2.4 HW Features
Form Factor DOP type
1) Capacity
Standard : Li-Ion , 1280mAh

Battery
2) Packing Type : Soft Pack
Size
Standard :
108 x 57.5 x 12.2mm

Weight 108g With Battery
Volume TBD
PCB L1B1 type, 8 Layers , 0.8t
Stand by time
2G Up to 580 hrs
3G Up to 510 hrs
@ Paging Period 9 (2G)
@ DRX 8 (3G)
Charging time 3 hrs @ Power Off / 1280mAh
Talk time
2G Up to 450mins
3G Up to 420mins
@ Power Level 10 (2G)
@ Tx = 0dBm (3G)
RX sensitivity
WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD8) : -103.7 dBm
EGSM : -105 dBm
GSM850 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm

WCDMA/
GSM/
GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM : 33dBm
GSM850 : 33 dBm
DCS 1800 : 30 dBm
PCS 1900 : 30 dBm
Class3(WCDMA)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
TX
output
power
EDGE
GSM 900 : 27 dBm
DCS 1800 : 26 dBm
PCS 1900 : 26 dBm
E2 (GSM900)
E2 (PCS)
E2 (DCS)
GPRS compatibility GPRS Class 12
EDGE compatibility EDGE Class 12
SIM card type
Plug-In SIM
3V /1.8V

2. PERFORMANCE
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Display
Main LCD
TFT Main LCD(2.8, 320 x 240)

Built-in Camera 3M FF CMOS Camera
Status Indicator No
Keypad
Function Key : 4
Side Key : 2
Function Key:
Home, Back, Menu, Search
Side Key :
Volume up/down
ANT Main : Internal Fixed Type
System connector 5 Pin
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory
NAND Flash : 4Gbit
SDRAM : 2Gbit

Speech coding FR, EFR, HR,AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
Blue Tooth V2.1+ EDR
MIDI(for Buzzer Function) SW Decoded 72Poly
Music Player MP3/ WMA/AAC/HE-AAC/EAAC+
Video Player MPEG4, H.263, H.264
Camcorder MPEG4, H.263, H.264
Voice Recording Yes
Speaker Phone mode
Support
Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable Yes
T-Flash
(External Memory)
Yes
2. PERFORMANCE
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2.5 SW Features
RSSI 0 ~ 4 Levels
Battery Charging 0 ~ 6 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 15 Level
Time / Date Display Yes
Multi-Language Yes
English/French/German/Spanish/Italia
n/Danish/Dutch/Korean
Quick Access Mode
Dialing/ Contact / Menu / Message /
Camera

PC Sync No
Speed Dial No Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes
Phone Book
Name / Number / Email / Chat Id/
Website/Postal
addresses/Organizations/Groups/
BirthdayNotes / Ringtone
There is no limitation on the number
of items.
It depends on
available memory amount.
Last Dial Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Last Received
Number
Yes
Last Missed Number Yes
Search by Number
/ Name
Name
Group Yes
of items. It depends on
available memory amount.
Fixed Dial Number Yes
2. PERFORMANCE
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Service Dial Number No

Own Number Yes
Read only
(add/edit/delete are not
supported)
Voice Memo Yes
Call Reminder No
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) Yes
Call Duration Yes
SMS (EMS)
There is no limitation on the
number of items. It depends on
available memory
amount.
EMS does not support.
SMS Over GPRS No
EMS Melody / Picture No
Send / Receive / Save No
MMS MPEG4
Send / Receive / Save
Yes
Long Message MAX 459 characters SMS 3pages
Cell Broadcast Yes
Download Over the Web
Game Yes
Calendar Yes
Memo Yes
of items.
It depends on available memory
amount.
World Clock No
Unit Convert No
Stop Watch No
Wall Paper Yes
2. PERFORMANCE
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WAP Browser No
Support only web browser based on
webkit. WAP stack and wml are not
supported.
Download Melody /
Wallpaper
Yes Over web browser
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1, 2, 3, C
MMS Yes Google MMS Client
EONS Yes
CPHS Yes V4.2
ENS No
Camera Yes
3M FF /
Digital Zoom : x4
JAVA Yes
CLDC V1.1 / MIDP V2.1
Download Over Web
Voice Dial No
IrDa No
Bluetooth Yes
Ver. 2.1+EDR
(HSP,HFP,A2DP,AVRCP)
FM radio Yes
GPRS Yes Class 12
EDGE Yes Class 12
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad No
TTY No
AMR Yes
SyncML Yes
IM Yes
Email Yes

2. PERFORMANCE
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2.6 HW SPEC.
1) GSM transceiver specification
Item Specification
Phase Error
Rms : 5
Peak : 20
Frequency Error
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance)
GSM/DCS : < -28dBm
Transmitter Output power and Burst
Timing
GSM : 5dBm 33dBm 3dB
DCS/PCS : 0dBm 30dBm 3dB
Burst Timing <3.69us
Spectrum due to modulation out to
less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to
larger than 1800kHz offset to the
edge of the transmit band
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection Speech
channels
800kHz, 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
T GSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance 0.5T

2. PERFORMANCE
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2) WCDMA transmitter specification

Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band8 : 880MHz ~ 915MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within 0.1 PPM
Open Loop Power Control Normal Conditions : within 9 dB,
Extreme Conditions : within 12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ 5 MHz,
> 43 dB @ 10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz f 894 MHz
< -67 dBm / 100 kHz RW @ 925 MHz f 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz f 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout -20 dBm
Peak Code Domain Error < -15 dB at Pout t -20 dBm

2. PERFORMANCE
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3) WCDMA receiver specification

Item Specification
Receive Frequency Band1 : 2110 ~ 2170 MHz
Band8 : 925 ~ 960 MHz
Reference Sensitivity Level Band1 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz
Band8 : BER < 0.001 when or = -103.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when or = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity
(ACS)
ACS > 33 dB where BER < 0.001 when
or = -92.7 dBm / 3.84 MHz
& Ioac = 52 dBm / 3.84 MHz @ 5 MHz
Blocking Characteristic BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = 10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = 15 MHz
Spurious Response BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation BER < 0.001 when or= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = 20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz f 12.75 GHz

Inner Loop Power Control
In Uplink
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24

2. PERFORMANCE
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4) HSDPA transmitter specification

Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band8 : 880MHz ~ 915 MHz
Maximum Output Power Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
HS-DPCCH
Sub-test
in table
C.10.1.4
Power
step
Power step slot
boundary
Power step
size, P [dB]
Transmitter power step
tolerance [dB]
1 Start of Ack/Nack 6 +/- 2.3
2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
5
4 End of CQI 5 +/- 2.3

Spectrum Emission Mask
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Frequency offset
from carrier f
Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15(f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1(f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10(f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ 5 MHz
> 43 dB @ 10 MHz
Error Vector Magnitude < 17.5 %, when Pout -20 dBm

2. PERFORMANCE
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5) HSDPA receiver specification

Item Specification
Receive Frequency

Band1 : 2110 ~ 2170 MHz
Band8 : 925 ~ 960 MHz
Maximum Input Level
(BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps

6) WLAN 802.11b transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level 20dBm under (Europe), 30dBm under (USA)
Frequency Tolerance within 25 PPM
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz
-50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time 2us
Carrier Suppression -15dB
Modulation Accuracy
(Peak EVM)
35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Max input Sensitivity -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Adjacent Channel
Rejection
35dB @FER 8%,
interference input signal -70dBm@fc25MHz(11Mbps)

2. PERFORMANCE
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7) WLAN 802.11g transceiver specification

Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level 20dBm under (Europe), 30dBm under (USA)
Frequency Tolerance within 25 PPM
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask -20 @ 11MHz offset (9Mhz ~ 11MHz)
-28 @ 20MHz offset (11MHz ~ 20Mhz)
-40 @ 30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
-5dB
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER 10%
Rx Adjacent Channel
Rejection
PER 10%,
ACR 16dB@6Mbps, ACR 15dB@9Mbps,
ACR 13dB@12Mbps, ACR 11dB@18Mbps,
ACR 8dB@24Mbps, ACR 4dB@36Mbps
ACR 0dB@48Mbps, ACR -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

8) GPS receiver specification
Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite -142dBm, 7 satellites -147dBm at coarse time aiding

3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF

3.1 GENERAL DESCRIPTION
The LG-P350 supports UMTS-900, UMTS-2100, GSM-850, GSM-850, GSM-900, GSM-1800, and GSM-1900
based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture
to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band
GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates
the GMSK-modulated or 8-PSK-modulated signal to RF.

[Figure 1-1] Block diagram of RF part

3. TECHNICAL BRIEF
P350 RF Block Diagram RF
3. TECHNICAL BRIEF
- 0 -
A generic, high-level functional block diagram of LG-P350 is shown in Figure 1-1. One antenna collects base
station forward link signals and radiates handset reverse link signals. The antenna connects with receive and
transmit paths through a ASM(Antenna-Switch-Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the
signal directly from RF-to-baseband using radioOne ZIF techniques. The RFICs Rx analog baseband outputs,
for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same
inputs to the MSM IC.
For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to
an RF signal using an internal LO generated by integrated onchip PLL and VCO. The RTR6285 IC outputs
deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective
UMTS PAs. In the GSM receive path, the received RF signals are applied through their band-pass filters and
down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with
the UMTS receiver and routed to the MSM IC for further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is
divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to
a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier
from a DAC within the MSM. LG-P350 power supply voltages are managed and regulated by the PM7540
Power Management IC. This versatile device integrates all wireless handset power management, general
housekeeping, and user interface support functions into a single mixed signal IC.
It monitors and controls the external power source and coordinates battery recharging while maintaining the
handset supply voltages using low dropout, programmable regulators.
The devices general housekeeping functions include an ADC and analog multiplexer circuit for monitoring
on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as
temperature, RF output power, and battery ID.
Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters
such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against
detrimental conditions.

3. TECHNICAL BRIEF
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3.2 GSM MODE

3.2.1 GSM RECEIVER
The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected directly to the
transceiver front-end Module. GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential
configurations to improve common-mode rejection and second-order non-linearity performance. For
example Figure 1-2 shows receiver input topologies for DCS and PCS (GSM-850/900 have the same receiver
input topologies). The balance between the complementary signals is critical and must be maintained from
the RF filter outputs all the way into the IC pins.

[Figure 1-2] DCS and PCS Receiver Inputs Topologies

Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only
receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency
duplexers this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900
receive signals are routed to the RTR6285 through band selection filters and matching networks that
transform single-ended 50-G sources to differential impedances optimized for gain and noise figure. The
RTR input uses a differential configuration to improve second-order intermodulation and common mode
rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize
receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The
downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having
passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC
offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing
asshown in Figure 1-2.
3. TECHNICAL BRIEF
- -
3.2.2 GSM TRANSMITTER

The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching
inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The
capacitor value may be optimized for specific applications and PCB characteristics based on pass-band
symmetry about the band center frequency as shown in Figure 1-3.

[Figure 1-3] GSM Transmitter Outputs Topologies

The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design
guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive
pads to ensure that the load presented to the outputs remains close to 50ohm.
3. TECHNICAL BRIEF
- 3 -
3.3 UMTS MODE

3.3.1 UMTS RECEIVER
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device as shown in Figure 1-
4. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter
that provides differential downconverter as shown in Figure 1-5. This second stage input is configured
differentially to optimize secondorder intermodulation and common mode rejection performance. The gain
of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM
control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF
ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS Rx baseband outputs
are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing.
These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared
with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6285 is
downconverting GSM signals and on when the UMTS is operating.

[Figure 1-4] UMTS Receiver Inputs Topologies

3. TECHNICAL BRIEF
- 4 -
3.3.2 UMTS TRANSMITTER

The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog
input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter
output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is
filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that
simplifies the external matching network to a single series capacitor to achieve the desired 50- interface.
The RTR6285 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-
level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the
antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with
the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for
multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback
divider, and digital logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine
different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal
directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this
without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850
mode transmitting. This design guideline shows only UMTS 2100 applications.

3. TECHNICAL BRIEF
- 5 -

[Figure 1-5] RTR6285 IC Functional Block Diagram

3. TECHNICAL BRIEF
- 6 -
3.4 GPS RECEIVER

The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from
the GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally
matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in
Figure 1-6.

[Figure 1.6] GPS Input Network Topology

3.5 LO GENERATION and DISTRIBUTION CIRCUIT
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes
to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS up-converters
and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture
is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RFto-
baseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop
filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS
operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS
transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and
GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver.
For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The
third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input
signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency
locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip
loop filter-series capacitors, which significantly reduces off-chip component requirement. With the
integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop
bandwidth control, fast lock time, and low-integrated phase error.

3. TECHNICAL BRIEF
- 7 -
3.6 OFF-CHIP RF COMPONENTS

3.6.2. UMTS PAM (U1002, ACPM-5281)
The ACPM-5281 is a dual-band PAM (Power Amplifier Module) designed for UMTS Band1 and Band8. The
ACPM-5281 meets stringent UMTS linearity requirements. The 4mmx5mm form factor 14-pin surface mount
package is self contained, incorporating 50ohm input and output matching networks.
The ACPM-5281 features 5th generation of CoolPAM circuit technology which supports 3 modes bypass,
mid and high power modes. The CoolPAM is stage bypass technology which enables power amplifier to
lower power consumption. Active bypass feature is added to 5th generation to enhance power added
efficiency at low output range and this technology extends talk time of mobiles more by further saving
power amplifiers current consumption.
The power amplifier is manufactured on an advanced InGaP HBT (hetero-junction Bipolar Transistor) MMIC
(microwave monolithic integrated circuit) technology offering state-of-the-art reliability, temperature
stability and ruggedness.
The Module is housed in a cost effective, small and thin 4x5mm package.

ACPM-5281 (W2100,W900)
3. TECHNICAL BRIEF
- 8 -

3.6.2 19.2MHz VCTCXO (X300, DSA321SCL-19.2M)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference
frequency for all RFIC synthesizers as well as clock generation functions within the MSM6285 IC. The oscillator
frequency is controlled by the MSM6285 ICs.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ.
A two-pole RC lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval
before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is
enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power
the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits
within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting
the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This
sensitive analog signal needs a 0.1 F low frequency filter near to MSM side, and isolate from digital logic and
clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3. TECHNICAL BRIEF
- 9 -
3.6.3 ASM + GSM PAM (U1001, SKY77544)

SKY77544 is a transmit and receive Front End Module (FEM) designed in a very low profile (0.9 mm), compact
form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation a
complete transmit VCO-to-Antenna and Antenna-toreceive SAW filter solution.
The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar
Modulation. WCDMA switch-through support is provided by three dedicated high-linearity ports.
The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedancematching circuitry for
50 input and output impedances, Tx harmonic filtering, high linearitylow insertion loss switches, and a
CMOS Power Amplifier Control (PAC) block.
A custom silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low
current external control interface. An integrated temperature sensor provides an analog voltage based on
the temperature of the module.
Fabricated in InGaP/GaAs, the Heterojunction Bipolar Transistor (HBT) PA blocks support the GSM850/900
bands and DCS1800/PCS1900 bands. Both PA blocks share common power supply pads to distribute current.
The output of the PA block and the outputs to the seven receive pads connect to the antenna pad through a
highly linear antenna switch.
The WCDMA and Rx ports feature a 0 volts DC offset level, which eliminates any need for external blocking
capacitors. The InGaP/GaAs die, switch die, Silicon (Si) controller die, and passive components are mounted
on a multi-layer laminate substrate and the entire assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77544 are internally matched to a 50 load to reduce the number of
external components for a quad-band design. Extremely low leakage current of the FEM maximizes handset
standby time. Band selection and control of transmit and receive RF signal flows are performed by use of four
external control pads. See Figure 1.9 shown on overleaf.
Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is controlled with 4 logic inputs: BS1,
BS2, Mode, and TxEN. Proper timing of the TxEN input and the VAPC input ensures high isolation between
the antenna and Tx-VCO while the VCO is being tuned prior to the transmit burst. The Enable input controls
the initial turn-on of the PAC circuitry to minimize battery drain.
The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing
sensitivity to input drive, temperature, power supply, and process variation.

3. TECHNICAL BRIEF
- 30 -

[Figure 1.9] SKY77544 Block Diagram

[Figure 1.10] SKY77544 Control Logic

3. TECHNICAL BRIEF
- 31 -
3.6.4 GPS LNA (U1003, RF2815)

The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along
with high gain, achieved by the RF2815 makes it ideal for GPS recievers requiring high sensitivity. This
module builds upon RFMDs leading edge pHEMT process and integrates input matching and low loss high
rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of
implementation simplifies the reciever design.
The RF2185 is packaged in a compact 3.3 mm x 2.1 mm x 1.0 mm package with low external component
count required to achieve the best-in-class performance.
3. TECHNICAL BRIEF
- 3 -
3.7 Digital Baseband(DBB/MSM7227)

3.7.1 General Description
A. Features(MSM7227)
The basic MSM7227 system solution consists of the MSM7227, RTR6285, and PM7540 ICs, plus AMSS
system software with the SURF7227 platform available for development. General features include:
-WCDMA Rel 99 plus HSDPA and HSUPA
-GSM/GPRS/EDGE
-High-performance ARM1136JF-S application processor at up to 600 MHz; QDSP5000 at 320 MHz
-High-performance ARM926EJ-S modem processor at up to 400 MHz; QDSP4000 at 122.88 MHz
-Java hardware acceleration for faster Java-based games and other applets
-Support for Bluetooth 2.1 EDR via an external Bluetooth System-on-Chip (SoC)
-High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost
between the MSM device and the LCD panel
-Receive diversity support for WCDMA mode, thereby providing improved capacity and data throughput
-USB 2.0 compliant high-speed USB core with limited OTG capabilities
-Integrated high-speed USB PHY
-Integrated wideband stereo codec for digital audio applications
-Direct interface to digital camera module with video front-end (VFE) image processing
-GPS position location capabilities
-Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)
-Advanced 12 12 1.05 mm, 0.4 mm pitch, 560 NSP

3. TECHNICAL BRIEF
- 33 -
BT_UART
BT PCM
Bluetooth v2.1
Wi-Fi 802 11b/g
BT &
Wi-Fi
System HW Block Diagram All System
CPUInterface
CPU Interface
Capacitive Touch
(Melpas + ELK)
LCD Backlight IC
BL I2C
TX IQ, PRX IQ
BT_PCM
FM_L&R
RF I/F
PRX_IQ
WLAN_SDIO
LINE_L& R
BCM43291
Wi-Fi 802.11b/g
FM Radio
FM
Tx Module
GSM & WCDMA
TOUCH I2C
2.8" QVGA
240*320
TOUCH INT
TCXO_
38.4MHz
FM_L&R
F_CLK_IN
CLK_REQ
Transceiver
(RTR6285)
Transceiver
(RTR6285)
LCD Backlight IC
AAT2862
BL_I2C
DDR SDRAM(2G)
NAND FRESH (4G)
EBI1 (DDR)
_ Q, _ Q
RF I/F
GPS
Tx Module
(SKY77544) DRX_IQ
DRX_IQ
GPIO59
GPS
MCP(Hynix)
SBDT
TCXO
NAND FRESH (4G)
CAM I/F
CAM_I2C
MSM7227
EBI2 (NAND)
CAM 3M
MCP(Hynix)
Q-Motor
(WHVM-1030Q10)
Q-Motor
(WHVM-1030Q10)
GPIO_28
LIN_PWM_FREQ
H8BCS0UN0MCR-4EM
MIC
MIC
Speaker &
R i
TCXO_19.2MHz
(Kyocera)
RTR_TRK_LO_ADJ
TCXO_RTR_19.2MHz
TCXO_PM_19.2MHz
MOTION_I2C
MOTION Sensor
(KR3DH)
MOTION INT
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_L
SPK_RCVP, N
Receiver
3.5 pi
Earjack
EAR_L, R
COMPASS_I2C Digital Compass
(AMI304) COMPASS_INT
Audio Sub
WM9093ECS-R
GPIO_27
AUDIO_I2C
TCXO IN
MMC SIM
USIM
KPD_PWR_N
MOTION_INT
USIM
USIM I/F
GPIO106
SBDT_SSBI
PMIC_SSBI
AMUX_OUT
HKAIN2 AMUX_OUT
AMUX_OUT
PM_INT_N
MSM_INT_N GPIO24
PWR/End Key
Vol. up
Send Key
Vol. Down
USIM
Key COL, Key ROW
_
Key LED
MUIC_I2C
USBPHY
UART3
I2C
UART3
MPP3,4
PM7540
KPD_DRV_N
PON_RESET_N
PS_HOLD
GPIO25
RESIN_N
JTAG
PS_HOLD
MUIC
(TS5USBA)
i
n
_
U
S
B
n
n
e
c
t
o
r
Backlight_Key
USBH DM & DP
Array TP
REMOTE_PWR_ON
nJTAG_RESOUT
JTAG_PS_HOLD
JTAG CONN.
JTAG(TCK,TDI,TDO)
UART3_TX/RX
5
p
i
C
o
3.8 Hardware Architecture
<System HW Block>
Figure. Block Diagram
3. TECHNICAL BRIEF
- 34 -
<Power Block>

Figure. Simplified Block Diagram

3. TECHNICAL BRIEF
- 35 -
3.9 Subsystem (MSM7227)

3.9.1. ARM Microprocessor Subsystem
The MSM7227 device uses an embedded ARM1136JF-S, ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM, including control of the
external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices. Through a QUALCOMM
proprietary single-wire SBI (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6285
and PM7540 devices.

3.9.2. WCDMA Subsystem
The WCDMA subsystem performs the data conversions and signal processing necessary to maintain the
WCDMA air interface between the handset and the base station (and also the WCDMA network). The
subsystem components include:
-Searcher engine
-Demodulating fingers
-Combining block
-Frame deinterleaver
-Viterbi decoder
-Reverse link subsystem
-Turbo decoder
On the forward link traffic channel, the WCDMA subsystem searches, demodulates, and decodes incoming
pilot, sync, paging, and traffic channel information. It extracts low bit-rate packet data from the forward link
traffic channel and sends the packet data to the vocoder for processing. On the reverse link, the WCDMA
subsystem processes the packet data from the vocoder and modulates the reverse traffic channel.

3.9.3. GSM Subsystem
The GSM subsystem performs the data conversions and signal processing necessary to maintain the GSM air
interface, including PA gain control for GPRS support. For GSM, the power profile ramps up before the burst
and ramps down afterward. For GPRS, transmit bursts can occur in as many as four sequential slots and the
PA must be ramped up and down smoothly between each slot, holding the desired output power level
during each burst. GSM support includes:
-GSM release 99 (circuit switching)
-GPRS (packet switching)
-EDGE E2 power class for 8 PSK

3. TECHNICAL BRIEF
- 36 -
3.9.4. RF Interface
The RF interface communicates with the mobile stations external RF and analog baseband circuits. Signals to
these circuits control signal gain in the Rx and Tx signal path and maintain The systems frequency reference.

3.9.5. Single-wire serial bus interface (SSBI)
The MSM7227 devices SSBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMMs RTR6285 and PM7540 ASICs. Using the SSBI, the RTR6285 and PM7540 devices can be
configured for different operating modes and for minimum power consumption, extending battery life in
Standby mode. The SBI also controls DC baseband offset errors.

3.9.6. Audio function
MSM7227 audio functions include the analog Rx and Tx paths (or stereo wideband codec), audio digital
signal processing (DSP) that provides adjustable gains and filtering, PCM circuits for interfacing with external
devices, and additional audio DSP that actually implements encoding and decoding. Other key features
include:
-The wideband codec supports stereo music/ringer melody applications in addition to the 8 kHz voice
band applications on the forward link.
-A PCM interface allows an external codec to be used instead of the internal codec; this supports inter-IC
Sound (I2S) modes that allow an external stereo DAC or SADC to be used.
-Currently in AMSS baseline only I2S output mode is supported (SDAC-only, no SADC support).
-Audio decoder summing and headset switch detection are included.
-Audio DSP includes the Rx and Tx filters needed to meet ITU-T G.712 requirements.
-A programmable sidetone path provides for summing part of the Tx audio into the Rx path.
-Many codec parameters are configurable via SBI registers.
-The audio processing is configured through QDSP5 command types and is not directly controlled by the
microprocessor.

3.9.7. Vocoder Subsystem
The MSM7227 devices QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to
support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls,
Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC),
Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx
compensation filters. The MSM7227 devices integrated ARM9TDMI processor downloads the firmware into
the QDSP4000 and configures QDSP4000 to support the desired functionality.

3. TECHNICAL BRIEF
- 37 -
3.9.8. Mode Select and JTAG Interfaces

The mode pins to the MSM7227 device determine the overall operating mode of the ASIC. The options under
the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode,
which enables the built-in trace mode, and test mode for factory testing. The MSM7227 device meets the
intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects
between devices within the mobile station during manufacture.

3.9.9. General-Purpose Input/Output Interface
The MSM7227 IC includes 133 general purpose input/output (GPIO) pins, and each can be configured as a
digital input or digital output. Inputs can be set to have a pull-up, pull-down, keeper, or no-pull. Output drive
strength is also programmable. Software assigns functions to the GPIOs and their configurations are set
accordingly. Some of the GPIO pins have alternate functions supported on them. The alternate functions
include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART
interface. The function of these pins is documented in the various software releases.

3.9.10. UART
The MSM7227 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share
multiplexed pins.
-UART1 for Bluetooth
-UART2 for USIM interface
-UART3 for data
.
3.9.11. USB
The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed
USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:
-The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is
also capable of supporting USB operations at low-speed and full-speed.
-The secondary controller is the FS USB-UICC port, which only supports host mode functionality.
3. TECHNICAL BRIEF
- 38 -
3.10 Power Block

3.10.1. General
MSM7227, included RF, is fully covered by PM7540 (Qualcomm PMIC). PM7540 cover the power of MSM7227,
MSM memory, RF block, Bluetooth, USIM and TCXO.
Major power components are :
PM7540 (U403) : Phone main PMIC

3.10.2 PM7540
The PM7540 device (Figure) integrates all wireless handset power management. The power management
portion accepts power from all the most common sources battery, external charger, adapter, coin cell back-
up and generates all the regulated voltages needed to power the appropriate handset electronics.
It monitors and controls the power sources, detecting which sources are applied, verifying that they are
within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the
handset electronics supply voltages.
Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a
common trimmed voltage reference.
A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage
lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM
device controls and statuses the PM7540 IC using Single-wire SBI(SSBI) supplemented by an Interrupt
Manager for time-critical information.
Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
3. TECHNICAL BRIEF
- 39 -
Figure. PM7540 functional block diagram
3. TECHNICAL BRIEF
- 40 -
3.10.3. Charging control

A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the
charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin
(VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For
additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping
ADC via the analog multiplexer.
PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be
used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and
Drain (or collector) contacts of the pass transistor respectively.
3.10.3.1. Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the
PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to
pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance
specified below (3.2V). The charging current is set to 80mA.

Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA

Figure. PM7540 Charging Flow (TC Charging)
3. TECHNICAL BRIEF
- 41 -

3.10.3.2. Constant Current Charging
The PM7540 IC supports constant current charging of the main battery by controlling the charger pass
transistor and the battery transistor. The constant current charging continues until the battery reaches its
target voltage, 4.2V.

Figure. PM7540 Charging Flow (CC Charging)

u|z\\ZW
3. TECHNICAL BRIEF
- 4 -
3.10.3.3. Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.
The end of constant voltage charging is commonly detected 10% of the full charging current.
3.10.3.4. LGP350 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 700mA
-Nominal Battery Capacity : 1280mAh
-Charging time : Max. 3h
- Full charge indication current (icon stop current) : 50mA
3.10.3.5. LGP350 battery bar icon display
Battery Bar Number Specification
BAR 6 (Full) 90% over
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Level change popup (No call)
POWER OFF 0%
Remain %
Table. LG-P350 battery bar specification
3. TECHNICAL BRIEF
- 43 -
3.11 External memory interface

3.11.1. MSM7227
The MSM7227 device was designed to provide two distinct memory interfaces. EBI1 was targeted for
supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous
devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-bandwidth, high-density, and
low-latency requirements of the advanced on-chip applications, the MSM7227 IC has two high-speed, high-
performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface
(SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple
commands for the external memory
device. The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters
arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The bus
masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (or global
interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge
provides the arbitration logic for all of the bus masters.
EBI1 Features
- Support for only low-power memories at 1.8-V I/O power supply voltage
- AXI bus frequencies up to 133 MHz
- A 16-bit/32-bit static and dynamic memory interface
DDR SDRAM interface features include:
- Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed
- Supports auto precharge and manual precharge
- Supports partial refresh
- Separate CKE pin per chip-select to support partial operation mode
- Idle power down to save idling power consumption
EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)

3.11.2.LG-P350 External memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-2Gbit Mobile DDR SDRAM / 4Gbit NAND Flash

Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
NAND 1.8V 42ns H8BCS0UN0MCR-
4EM SDRAM
HINIX
1.8V 200MHz
3. TECHNICAL BRIEF
- 44 -
3.12 H/W Sub System

3.12.1. RF Interface
3.12.1.1. RTR6285 (WCDMA_Tx, GSM_Tx/Rx)
MSM7227 controls RF part(RTR6285) using these signals.
-RTR6285_SSBI : SSBI I/F signals for control Sub-chipset
-RTR_TXON : Power AMP on RF part
-RTR_RX_I/Q_M/P, RTR_TX_I/Q_M/P : I/Q for T/Rx of RF
-RTR_DAC_REF : Reference input to the MSM Tx data DACs
3.12.1.2. the others
TRK_LO_ADJ : TCXO(19.2M) Control
PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable
ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
GSM_PA_RAMP : Power Amp Gain Control of APC_IC
3.12.1.3. RF2815 (GPS LNA)
* GPS_LNA_EN : GPS LNA Enable Signal (GPS LNA Shutdown)

3. TECHNICAL BRIEF
- 45 -
3.12.1.4. BCM43291SKUBG (BT / WiFi chip )

WiFi
* WLAN_CMD : WLAN SDIO Command Line.
* WLAN_CLK : WLAN SDIO Clock Input.
* WLAN_SDIO[3:0] : WLAN SDIO Data Line.
* WLAN_RESET_N : Low asserting reset for WLAN core.
* WLAN_WAKEUP : WLAN Wakeup Input.
* WLAN_HOST_WAKEUP : WL_HOST_WAKEUP signal output.
BT
* BT_UART_RXD : Bluetooth UART Serial Input.
* BT_UART_RTS : Bluetooth UART Request to Send. Active-low request.
* BT_UART_CTS : Bluetooth UART Clear to Send. Active-low clear.
* BT_UART_TXD : Bluetooth UART Serial Output.
* BT_PCM_CLK : BT PCM clock, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DIN : BT PCM data input.
* BT_PCM_SYNC : BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DOUT : BT PCM data output.
* BT_WAKEUP : BT Wakeup Input.
* BT_HOST_WAKEUP : BT Host Wakeup Output
* BT_RESET_N : Low asserting reset for BT core.
Common
* SLEEP_CLK : LPO clock (32.768kHz) input. Used for low-power mode timing.
* CLK_IN : Crystal amplifier input or frequency reference input.
* CLK_REQ : Crystal Circuit / Reference Clock Enable (active-high)
FM Radio
* FM_ANT : FM RF input.
* SLEEP CLK : External reference oscillator input. (32.768KHz)
* FM_R : Right audio line output digital input data.
* FM_L : Left audio line output digital frame synchronization.

3. TECHNICAL BRIEF
- 46 -
Figure. Wif/BT/FM Interface Block Diagram
FM R
LG-P350 WiFi/BT/FM Interface
3.5
Ear-Jack
FM_ANT
WLAN_HOST_WAKEUP
FM_R
FM_L
FM_ADOUT2
FM_ADOUT1
FM_RX
WL_GPIO_0
LINE_R_IP
LINE_L_IP
GPIO94
E
a
r
-
j
a
c
k
WLAN WAKEUP
WLAN_CMD
WLAN_CLK
WLAN_RESET_N
SDIO_CMD
SDIO_CLK GPIO62
TX_WLBG
GPIO63
BT_RFOP
WL_GPIO_1
WLAN_WAKEUP
GPIO122
DEA162450BT
TX_WLBG
TX_BT
RX BG
WLAN_SDIO [3:0]
BT_UART_RXD
BT_UART_TXD
BT_UART_RXD
BT UART TXD
WL_RST_N
SDIO_DATA [3:0]
GPIO93
GPIO46
2
2
7
GPIO45
GPIO[64:67]
RX_BG
GMODE_EXT_
LNA_GAIN
RF_SW_CTRL
DEA162450BT
RF5501
_
SW_CTRL
EXT_LNA_GAIN
BT_RESET_N
BT_UART_CTS
BT_UART_RTS
BT_UART_TXD
BT_UART_RST_N
BT_UART_CTS_N
2
9
1
S
K
U
B
G
M
S
M
7
2 GPIO45
GPIO44
GPIO43
G O 23
PM7540
SLEEP_CLK(LPO Clock:
32.768KHz)
_ _
BT_PCM_SYNC
BT_PCM_DIN
BT PCM DOUT
BT_RST_N
BT_PCM_SYNC
BT_PCM_OUT
B
C
M
4
3
GPIO123
GPIO70
GPIO69
WRF_EXTREFIN
38 4MHz
32.768KHz
PM7540
BT_PCM_DOUT
BT_PCM_CLK
BT_WAKEUP
BT HOST WAKEUP
BT_GPIO_0
BT_PCM_IN
BT_PCM_CLK
GPIO68
GPIO71
GPIO42
CLK IN 38.4MHz
TCXO
BT_HOST_WAKEUP
BT_GPIO_1 GPIO83 OSCIN
CLK_IN
3. TECHNICAL BRIEF
- 47 -
3.12.2 MSM Sub System

3.12.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
-USIM_CLK : USIM Clock
-USIM_Reset : USIM Reset
-USIM_Data : USIM Data T/Rx

3.12.2.2. UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map Name Note
GPIO_86 UART3_RX Data_Rx
GPIO_87 UART3_TX Data_Tx
Table. UART Interface

USIM CLK
USIM Reset
USIM Data
VREG_RUIM_ .85V
USIM CLK
USIM Reset
USIM Data
MSM7227 PM7540 USIM
Figure. SIM Interface
3. TECHNICAL BRIEF
- 48 -
3.12.2.3. HS-USB
The High-Speed USB module contains an embedded UTMI+ core with a built-in transceiver eliminating the
need for an external PHY. The HS-USB port is a standard 4-pin interface that connects directly to the USB
connector (USBPHY_DP, USBPHY_DN, USBPHY_ID and USBPHY_VBUS).
Two additional pins are required for PHY operations which include an external reference resistor pin
(USBPHY_REXT) and a USB system clock pin which the USB PHY uses to lock its internal PLL (SYS_CLK)

Figure. HS-USB connections and architecture

3. TECHNICAL BRIEF
- 49 -
3.12.3 KEY
3.12.3.1 Side key
There are 2 side key , Send, and END buttons that are controlled by MSM7227.
Refer to the circuit.

Figure. Volume Side key

Figure. End key

Figure. Send key

CN800
4
3
2
1 R810
100
R811
100
R813
100
ZD801 ZD800
ZD802
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
VOL_UP
VOL_DOWN
VA801
R814
100K
KB800
PM_ON_SW
END
ZD805 ZD803
KB801
R816
100
R812
100
KEY_ROW[0]
KEY_COL[1]
SEND
3. TECHNICAL BRIEF
- 50 -
3.12.3.3 KEY Backlight

There are 2 White side view LED, 2 white LED in key backlight circuit

Figure. KEY Backlight

VA800
R809
100
R808
100
7
1
8
R
1
5
1u
C805
LD801
EDLH0005901
LEWW-S14
LD800
+VPWR
KEY_LED_DRV_N
+VPWR
1608 TOP VIEW LED
3. TECHNICAL BRIEF
- 51 -
PCM
BT_PCM_IN WIFI&FM&BT
BT_PCM_SYNC
BCM43291
BT_PCM_OUT
BT_PCM_CLK
FM_ANT
PCM
_ _
FM_R
FM_L
LNE_P_P
LNE_L_P
MSM7227
MC
MC_!P
MC_!N
MICBIAS
HS_MC
FM ANT
Head Sel
EAP P
EAPMC_P
EAPCN
EAPCP
HPH_L
HPH_P
AUDIO
SUBSYSTEM
Head Sel
3.5 headsel ack
EAP_P
EAP_L
LNE_CP
LNE_CN
SPK_PCV
SPK_PCV
SPKiPCV
AUOC_2C_SCL
AUOC_2C_SOA
TPA2055D3
1
3.13 Audio and sound
3.13.1. Overview of Audio path
Figure. Block diagram of Audio & Sound path
3. TECHNICAL BRIEF
- 5 -
3.13.2. Audio signal processing & interface

3.13.2.1 MSM7227 audio interface
The MSM7227 audio front end comprises the stereo wideband codec, PCM interface, and additional DSP
audio processing. The stereo wideband codec allows the MSM7227 device to support stereo music/ringer
melody applications in addition to the 8 kHz voice band applications on the forward link.
In the audio transmit path, the device operates as 13-bit linear converter with software, selectable 8 kHz and
16 kHz sampling rate. In the audio receive path, the device operates as a software-selectable 13-bit or 16-bit
linear converter with software selectable 8 kHz,16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz
sampling rate.
Through software, the Rx path can be configured as either a mono or stereo output. New to the MSM7227
device is a transmit (Tx) ADC path that now supports stereo wideband sampling.
The integrated codec contains all of the required conversion and amplification stages for the audio front end.
The codec operates as a 13-bit linear codec with the transmit (Tx) and receive (Rx) filters designed to meet
ITU-T G.712 requirements.
The codec includes a programmable side tone path for summing a portion of the Tx audio into the Rx path.
An on-chip voltage/current reference is provided to generate the precise voltages and currents required by
the codec. This circuit requires a single capacitor of 0.1 F to be connected between the CCOMP and GND
pins. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser
microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 V DC
while delivering as much as 1 mA of current.
Audio decoder summing and headset switch detection are included. The codec interface includes the
amplification stages for both the microphone and earphone. On the transmit (Tx) path, the interface
supports two differential microphone inputs, a differential auxiliary input, and a stereo line input.
On the receive (Rx) path the interface supports one differential earphone output, a stereo single-ended
headphone output, one differential auxiliary output, and stereo single-ended line outputs. The codec is
configured by the codec SBI registers. The codec interface is shown in Figure.
Also part of the audio front end is the PCM interface. The PCM interface allows for an external codec to be
used instead of the internal codec. This interface can be used in I2S mode which will allows for an external
stereo DAC to be used. Finally, the audio front end includes additional DSP audio processing that does gains,
filtering and other audio processing.
The DSP audio processing is configured through the QDSP5000 command types and is
not directly controlled by the microprocessor.

3. TECHNICAL BRIEF
- 53 -
Figure. Detailed diagram of MSM7227 audio interface
3. TECHNICAL BRIEF
- 54 -
3.13.2.2 TPA2055D3 audio interface

The.TPA2055D3 is an audio subsystem with a mono class-D power amplifier, a stereo class-G DirectPath
TM

headphone amplifier, and bypass switches. Class-G improves MP3 playback time while DirectPath eliminates
the need for external dc-blocking output capacitors. The headphone amplifier drives up to 35mW into 16-
ohm speakers form a 1.8-V supply.
The subsystem includes two stereo single-ended(SE) inputs. The stereo inputs are also configurable as
differential mono inputs. Each input channel has an independent volume control. Inputs can be individually
selected or mixed together. Input impedances remain constant over all input and output gains.
Operating mod and volume levels are controlled over an I
2
C interface. The i
2
C interface is compatible over a
1.5V to 5.5V digital supply range.
The TPA2055D3 uses SpeakerGuard
TM
Limiter technology to prevent output clipping distortion and
excessive power to the speakers and headphones. The speaker and headphone amplifier outputs have
independent limiter levels, allowing optimum loudness and protection for each output.
The TPM2055D3 is available in a 0.5 mm pitch 20-bump WCSP with less than 0.8 mm height.

Figure. Detailed diagram of TPA2055D3 audio interface

3. TECHNICAL BRIEF
- 55 -
2
0
6
R
I
N
D
MIC600
4
3
2
1
P
G1
G2
O
C601
1800 FB600
MIC_1P
MIC_1N
MIC_BIAS
MIC
TP602
R630
47
HS_MIC_BIAS_TEMP
R628
DNI
C637
DNI
5
0
6
R
K
2.
2
R629 47K
HS_MIC_BIAS
1800
FB606
C617
33p
2.2u
C606
1800
FB603
C607
33p
C615
47p
1n
C618
SC600
1
2
1
6
R
K
0
1
J600
2
3
4
5
6
1
M5
M4
M3
M4F
M1
M6
1
1
6
R
K
0
1
FB605
1800
Q600
D
G
S
0
0
6
D
2
0
6
D
3
0
6
D
C616
47p
1
0
6
D
4
0
6
R
M
1
C619
22p
4
0
6
D
270n
L600
VREG_MSMP_2.6V
1800 FB604
3
0
6
R
K
1
6
0
6
R
K
0
0
1
EAR_SENSE
EAR_L
EAR_R
EARMIC_P
HOOK_ADC
FM_ANT
3.5pi EAR JACK
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
ENJE0008001
3. TECHNICAL BRIEF
- 56 -
0
2
6
C
u
2
.
2
U600
3
D
1
C
2
E
2
A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4
D
2
D
D
D
V
P
H
D
D
V
P
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
S
A
I
B
D
D
V
P
C
S
S
V
P
C
D
N
G
C636
0.1u 0.1u
C605
u
2
.
2
1
2
6
C
2.2u
C614
u
2
.
2
2
2
6
C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33n C613
R610 K
7
.
4
R609 K
7
.
4
VREG_MSMP_2.6V
33n C612
FB601 600
FB602 600
C608
1n
470n C611
C610 470n
10 R608
C609
1n
10 R607
RCV_N
RCV_P
HPH_R
HPH_L
AUDIO_I2C_SCL
AUDIO_I2C_SDA
SPK_RCV-
SPK_RCV+
EAR_L
EAR_R
LINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
3. TECHNICAL BRIEF
- 57 -
3.14 Display
LCD module is connected to Main PCB with 40-pin connector.
The LCD is controlled by CPU Interface in MSM7227.

Figure. Schematic of LCD connector (Main Board)

VREG_LCD_1.8V
FL702
15pF 0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
U701 EUSY0391601
NLSV1T244MUTBG
4 3
5 2
6 1
VCCA VCCB
A B
GND OE_
15pF
FL701
0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
15pF
ICVE10184E150R101FR FL704
0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
C705
2.2u
FL703 SFEY0010501
15pF 0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
GB042-40S-H10-E3000
ENBY0036001
CN700
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
VREG_LCD_1.8V
FL700
15pF 0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
VA700
VREG_LCD_2.8V
1u
C710
1u
C700
R702
100
VREG_MSMP_2.6V VREG_LCD_1.8V
0
1
7
R
K
0
0
1
LCD_RESET_N
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
EBI2_DATA[9]
nNAND_OE
nNAND_WE
WLED_PWR
MLED[2]
MLED[3]
MLED[1]
MLED[4]
MLED[5]
LCD_RS
LCD_CS
LCD_VSYNC_O LCD_VSYNC_LS
LCD_VSYNC_LS
LCD_MAKERID_HIGH
LCD Filter(EMI 100 ohm, 15pF)
Maker IF Maker ID
TOVIS H H
3. TECHNICAL BRIEF
- 58 -

Table. Interface between LCD Module and MAIN Board

3. TECHNICAL BRIEF
- 59 -
3.15 Vibrators (Q-Coin Motor)

The strength of vibration is determined by the duty cycle of PWM (LIN_PWM_FREQ)
U601 : EUSY0404001 is Q-Coin motor driver IC.

Figure. Q-Coin Moter IC Schematic

Figure. Vibrator Block Diagram
R623
1K
C634
0.1u
Q601
C
B
E
100K R627
R613
100K
U601
B2 C1
A1 B1
B3 C2
A3 C3
IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3V
C633
0.1u
VREG_MOTOR_3.3V
R622
4.7K
51K
R624
R626
1K
C635 10n
51K
R625
LIN_PWM_FREQ
MOTOR_N
MOTOR_P
1%
1%
1%
1%
1%
1%
3. TECHNICAL BRIEF
- 60 -

3.16 Compass Sensor
If a customer buy the application SW, The Sensor Support a Eletric Compass function
U604 : AMI304 IC used I2C interface to MSM7227

Figure. Compass Sensor Schematic
U604
12
11
10
9
5
4
6
3
7
2
8
1
D
D
V
D
G
E
R
V
A
D
N
G
S
D
N
G
D
D
V
A
ADDR
SCL
NC1
T
N
I
VPP
DRDY
SDA
C627
10n
VREG_MOTION_3.0V
TP601
R617
2.2K
VREG_MSMP_2.6V
C628
470n
R618
2.2K
COMPASS_DRDY
COMPASS_I2C_SDA
COMPASS_I2C_SCL
3. TECHNICAL BRIEF
- 61 -

Figure. Compass Sensor Block Diagram

3. TECHNICAL BRIEF
- 6 -

3.17 Motion Sensor
According to tilt the cell phone, the screen is had rotated automatically.
U603 : KR3DH IC used I2C interface to MSM7227

Figure. Motion Sensor Schematic

Figure. Motion Sensor Block Diagram
C639
10u
TP600
R619 K
2
.
2
R620 K
2
.
2
C624
10u
VREG_MOTION_3.0V
U603
6
1
7 6
5
4
8
3
9
2
10
1
11
12
13
4
1
5
1
2
D
E
V
R
E
S
E
R
D
D
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
S
C
SCL_SPC
GND1
O
D
S
_
I
D
S
_
A
D
S
0
A
S
_
O
D
S
4
D
N
G
C623
0.1u
VREG_MSMP_2.6V
C638
0.1u
MOTION_I2C_SDA
MOTION_I2C_SCL
MOTION_INT
3. TECHNICAL BRIEF
- 63 -

3.18 Main Features
- DOP Type design
- UMTS 2100 + UMTS 900 + GSM 900 + DCS 1800 + PCS 1900 + GSM850 based GSM/GPRS/EDGE/UMTS
- HSDPA 3.6Mbps
- TFT Main LCD(2.8 QVGA, 280 x 320)
- Capacitive/Electrostatic Touch Window
- 3M FF Camera
- 3.5Phi Stereo Headset & Speaker phone
- Mobile XMF Mobile DLS / Scaleable Polyphony
- MP3/AMR/AAC/AAC/WAV/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g)
- Supports FM Radio
- 1280 mAh (Li-Ion)

3. TECHNICAL BRIEF
- 64 -
3.19 Main component

3.19.1. LG-P350 Main component (bottom)

Main Board Bottom

Logic
RF
PMIC
WLAN
GPS
SD memory
soket
3. TECHNICAL BRIEF
- 65 -

3.19.2. LG-P350 Main component (bottom & Sub carrier)

Main Board Bottom & Sub carrier
Vibrator Camera
3. TECHNICAL BRIEF
- 66 -
3.19.3. LG-P350 Main component (Top)

Main Board Top

Back-up Battery
Dome key
3. TECHNICAL BRIEF
- 67 -
3.19.4. RF of LG-P350

Reference Description Reference Description
U1000 RTR6285(Transceiver) FL1000 EGSM/850 Rx saw filter
U1001 GSM TX Module
(ASM + GSM/EDGE PAM)
FL1001 DCS/PCS Rx saw filter
U1002 WCDMA Dual (I,VIII) PAM X300 VCTCXO(19.2MHz)
FL1005 WCDMA (I) TX SAW Filter SW1000 RF Antenna Connector
FL1003 WCDMA (VIII) TX SAW Filter FL1002 WCDMA (I) RX SAW Filter
FL1007 WCDMA (I) Duplexer FL1004 WCDMA (VIII) Duplexer

SW1000
X300
U1000
U1002
FL1004
U1001
FL1001
FL1007
FL1000
FL1005
FL1003
FL1002
3.19.4. RF of LG-P350
3. TECHNICAL BRIEF
- 68 -
3.19.5. BaseBand AND Power of LG-P350

CN702 Camera Connector U603 Motion Sensor
U600 Audio Sub System CN700 LCD Connector
U401 Memory U701 Level shifter
U300 MSM7227 CN501 I/O Connector
X500 Crystal U504 MUIC
U501 PMIC U503 OVP IC
CN701 Touch Connector Q500 Charging IC
U700 Charge Pump IC
U700
U603
CN700
U701
U504
U503
Q500 U501
X500
U401
U300
U600
CN702
CN701
CN501
3. TECHNICAL BRIEF
- 69 -

3.19.6. GPS WIFI of LG-P350

U201 WiFi(11bg)+BT+FM(Rx) Chip U1003 GPS LNA
U200 SP3T+LNA FL1006 SAW Filter

U1003
U201
U200
FL1006
3. TECHNICAL BRIEF
- 70 -
3.19.7. Audio of LG-P350

U600 TPA2055D3 CN701 Touch Connector
CN702 Camera Connector

U600
CN701
CN702
4. TROUBLE SHOOTING
- 71 -
TROUBLE SHOOTING
4.1 RF Component
G

FL1007
W2100 Duplexer
FL1004
W900 Duplexer
U1002
W2100/900
PAM
FL1005
W2100
Tx saw
FL1000
EGSM/850
Rx saw
FL1001
DCS/PCS
Rx saw
FL1002
W2100 Rx saw
FL1003
W900
Tx saw
U1001
GSM PAM+ASM
U1000
RF Transceiver
X300
VCTCXO
U1003
GPS LNA
FL1006
GPS Rx saw
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
- 7 -
RF component (WCDMA / GSM)

U1000 RTR6285(Transceiver) FL1002 WCDMA (I) RX SAW Filter
U1001
GSM TX Module
(ASM + GSM/EDGE PAM)
FL1000 EGSM/850 Rx saw filter
U1002 WCDMA Dual (I,VIII) PAM FL1001 DCS/PCS Rx saw filter
FL1005 WCDMA (I) TX SAW Filter X300 VCTCXO(19.2MHz)
FL1003 WCDMA (VIII) TX SAW Filter U1003 GPS LNA
FL1007 WCDMA (I) Duplexer FL1006 GPS RX SAW Filter
FL1004 WCDMA (VIII) Duplexer SW1000 RF Antenna Connector

4. TROUBLE SHOOTING
- 73 -
4.2 SIGNAL PATH

WCDMA I and VIII Band TX Signal PATH
D2. WCDMA 2100 TX PATH
E2. WCDMA 900 TX PATH
F1. COMMON TX/RX PATH
4. TROUBLE SHOOTING
- 74 -

G

WCDMA BAND I and VIII RX Signal PATH
D1. WCDMA 2100 RX PATH
E1. WCDMA 900 RX PATH
F1. COMMON TX/RX PATH
4. TROUBLE SHOOTING
- 75 -

GSM850/GSM900/DCS/PCSs RX/TX Signal PATH
A. GSM850/GSM900/DCS1800/PCS1900 RX PATH
B. GSM850/GSM900/DCS1800/PCS1900 TX PATH
C. COMMON TX/RX PATH

4. TROUBLE SHOOTING
- 76 -
4.3 Checking TCXO Block

The output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal
VCO.
G
G
G
G
G
G
Schematic of the Crystal Part (19.2MHz)
TP3
TP2
TP1
TP2
TP3
TP1
C308
10n
R310 33
100
R303
19.2MHz
KT3225L19200DCW28RA0
X300
4 2
3 1
VCONT OUT
GND VCC
C301
0.1u
C320 330p
C307 330p
R319
1
C309 330p
C300
1n
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C310
0.1u
U301
3
2
4
1
5
VCC
GND
R311 100K
TCXO_PM_19.2MHZ
TCXO_EN
TCXO_RTR_19.2MHZ
USBH_SYSCLK
RTR_TRK_LO_ADJ
FFA Rev.C(220Ohm@100MHz)
1.0T
TCXO Circuit
Clesed to TCXO
TP2
TP1
TP3
4. TROUBLE SHOOTING
- 77 -
Check TP1
VCC of TCXO
VCC .8V Check the PM7540
No
Yes
Check TP
.4V Voltage 0.4V Check the MSM77
No
Yes
Check TP3
19. MHz Signal
Check soldering and
components
No
Yes
TCXO is OK
4. TROUBLE SHOOTING
- 78 -
4.4 Checking GSM TX Module(GSM PAM + ASM) Block

G
VBATT(TP1)
ANT_SEL0
ANT_SEL3
ANT_SEL2
ANT_SEL1
4. TROUBLE SHOOTING
- 79 -
G
G
Schematic of the Antenna Switch Block
G
G
TP1
C1018
39p
1
9
9
0
0
1
R
C1045
1n
C1049
1n
C1046
1n
C1042
47p
1
9
8
0
0
1
R
C1106
DNI
75
R1006
VBATT
0
3
1
5
0
0
1
R
47
R1003
0
3
1
4
0
0
1
R
R1002
2.2K
U1001
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
C1043
1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0
ANT_SEL2
ANT_SEL1
GSM_TX
DCS_PCS_TX
8
0
6
1
0603
0603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)
GSM850(824-849MHz)
7dB
11dB
2mm TP1
4. TROUBLE SHOOTING
- 80 -
Check ANT_SEL 0, 1, , 3
High Level
1.V < Voltage < 3V Check the TP1(VBATT)
No
Yes
Check the Logic in each mode
Checking Switch Block Power Source
4. TROUBLE SHOOTING
- 81 -
4.5 Checking WCDMA Block
START
1. Check TCXO 19.MHz
6. Ro-download SW & Cal.
. Check FEM Block
Refer to 1.4
3. Check RF Tx Level
4. Check PAM Block
Refer to 1.5.4
5. Check RF Level
4. TROUBLE SHOOTING
- 8 -
4.5.1Checking TCXO Block

Refer to 1.3
4.5.2. Checking Tx Module Block
Refer to 1.4
4.5.3. Checking RF TX Level
G
G
Test Point (TX Level)
TP1
TP2
TP3
TP4
4. TROUBLE SHOOTING
- 83 -
R1001
DNI
SW1000
4 2 1 3
1
G A C
2
G
C1018
39p
1
9
9
0
0
1
R
C1045
1n
C1049
1n
3.9p
L1040
C1004
15n
R1000
100p
ANT1000
C1046
1n
L1042
DNI
C1042
47p
1
9
8
0
0
1
R
L1000
100n
ANT1001
C1001
2.7n
C1106
DNI
75
R1006
VBATT
0.5p
L1001
0
3
1
5
0
0
1
R
47
R1003
0
3
1
4
0
0
1
R
R1002
2.2K
U1001
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
L1041
DNI
ANT1004
C1043
1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0
ANT_SEL2
ANT_SEL1
WCDMA_900_RTX
WCDMA_2100_RTX
GSM_TX
DCS_PCS_TX
8
0
6
1
0603
0603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)
GSM850(824-849MHz)
7dB
11dB
2mm
C1080
6.8n
FL1007
1950MHz, 2140MHz
9 5
8 4
7 2
3
6 1
RX ANT
TX
GND1 GND4
GND2 GND5
GND3 GND6 C1105 2.2n
C1095 1.8p
C1083 1.8p
1.2n
L1025
L1024
10n
1950MHz
FL1005
5 2
4 1
3
G3
IN OUT
G1 G2
p
0
0
1
7
8
0
1
C
6
8
0
1
C
p
0
0
1
p
0
0
1
4
8
0
1
C
C1104
DNI
10u
C1071
VBATT
L1021
2.2p
1n
C1091
L1037
DNI
C1088 33n
DNI L1036
DNI
L1022
U1002
5
1
8 7
9 6
10 5
11 4
12 3
13 2
14 1
RFIN_LOW RFOUT_LOW
VMODE GND3
VBP VCC2
VCC1 GND2
VEN_LOW RFOUT_HI
VEN_HI GND1
RFIN_HI CPL
D
N
G
P
FL1004
897.5 MHz,942.5 MHz
9 5
8
4 7
2
3
6
1
RX1
ANT
TX
GND1
GND4 GND2
RX2
GND3 GND6
C1070
330p
C1069
1n
C1092
4.7n
C1082
3p
C1078
33p
33p L1023
1.2p
C1094
C1077
3.9n
C1089
DNI
C1079
1n 3.3n
L1018
FL1003
897.5 MHz
5 3 2
4 1
IN OUT
G1 G2 G3
5
8
0
1
C
p
0
0
1
L1035 33p
L1026
DNI
33p
C1090 8
1
0
1
R
0
0
1
L1032
0.75p DNI
L1033
L1039
3p
C1097
33p
R1016
62
0
0
1
7
1
0
1
R
PA_R0
PA_ON0
PA_ON1
PA_R1
WCDMA_900_TX_OUT
WCDMA_900_RTX
RX_WCDMA_900_M
RX_WCDMA_900_P
PDET_IN
RX_WCDMA_2100
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
1mm
Near to 4 Pin Near to 12 Pin
Near to 12 Pin
0603
W900
W2100
W2100 TX(1920 - 1980 MHz)
BAND 1/2
Band 8
BAND2(2520) : ACMD-7407
SDMY0001901
BAND8(2520) : B7953 (SDMY0002801)
W900 TX(880 - 915 MHz)
Band 1
SDMY0002801
BAND1(2520):SAYP1G95AA0B00
W900 RX(925 - 960 MHz)
0603
TP1
TP2
TP2
TP3
TP3
TP4
TP4
4. TROUBLE SHOOTING
- 84 -
For testing, Max power output is needed.
Check ANT_SEL 0, 1,
(High, Low, Low)
Check TP1 Over 1dBm? RF Tx Level is OK
Yes
No
Check PAM Block
Refer to 1.5.4
Check TP Over 1dBm? Check TX Module
Yes
No
Check TP3 Over 1dBm? Check Duplexer
Yes
No
Check TP4 Over 7dBm? Check RTR685
Yes
No
RTR685 Maximum output Power = 7 dBm
RTR685 minimum output Power = -80 dBm
PAM(ACPM-581) = Maximum input Power = 10 dBm
4. TROUBLE SHOOTING
- 85 -
4.5.4. Checking PAM Block

PAM control signal
W_PA_ON (W_1700_PA_ON(C1115), W_2100_PA_ON(C1095) and) : PAM Enable
W_PA_RO: PAM Gain Control
W_PA_ON must be HIGH (over 2.6V)
G
PAM IN/OUT Signal :
When PAM is under the operation of high power mode (WCDMA_PA_R0(C1929):Low),
PAM OUT power must be over 21 dBm
PAM IN power must be under 10 dBm

4. TROUBLE SHOOTING
- 86 -

TP3
TP1
TP2
4. TROUBLE SHOOTING
- 87 -
Set the phone Tx is On and
PDM is 10
Check TP3 Over 1dBm? RF Tx Level is OK
Yes
No
Change the board
Check TP PA_RO .6V Check MSM77
Yes
No
Check TP1 Over 10 dBm? Check RTR685
Yes
No
4. TROUBLE SHOOTING
- 88 -
4.5.5. Checking RF Rx Level

Test Point (RF Rx Level)

TP1
TP2
TP3
TP4
Bias
4. TROUBLE SHOOTING
- 89 -
R1001
DNI
SW1000
4 2 1 3
1
G A C
2
G
C1018
39p
1
9
9
0
0
1
R
C1045
1n
C1049
1n
3.9p
L1040
C1004
15n
R1000
100p
ANT1000
C1046
1n
L1042
DNI
C1042
47p
1
9
8
0
0
1
R
L1000
100n
ANT1001
C1001
2.7n
C1106
DNI
75
R1006
VBATT
0.5p
L1001
0
3
1
5
0
0
1
R
47
R1003
0
3
1
4
0
0
1
R
R1002
2.2K
U1001
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
L1041
DNI
ANT1004
C1043
1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0
ANT_SEL2
ANT_SEL1
WCDMA_900_RTX
WCDMA_2100_RTX
GSM_TX
DCS_PCS_TX
8
0
6
1
0603
0603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)
GSM850(824-849MHz)
7dB
11dB
2mm
TP1
FL1007
1950MHz, 2140MHz
9 5
8 4
7 2
3
6 1
RX ANT
TX
GND1 GND4
GND2 GND5
C1095 1.8p
C1083 1.8p
L1024
10n
C1104
DNI
L1037
DNI
C1088 33n
DNI L1036
FL1004
897.5 MHz,942.5 MHz
9 5
8
4 7
2
3
6
1
RX1
ANT
TX
GND1
GND4 GND2
RX2
GND3 GND6
33p L1023
C1089
DNI
L1035 33p
L1039
3p
WCDMA_900_RTX
RX_WCDMA_900_M
RX_WCDMA_900_P
RX_WCDMA_2100
WCDMA_2100_RTX
W2100 TX(1920 - 1980 MHz)
BAND 1/2
Band 8
BAND2(2520) : ACMD-7407
SDMY0001901
BAND8(2520) : B7953 (SDMY0002801)
W900 TX(880 - 915 MHz)
Band 1
SDMY0002801
W900 RX(925 - 960 MHz)
TP2
TP2
TP3
TP3
4. TROUBLE SHOOTING
- 90 -
Set the phone Rx is On
Check BIAS over .1V Check bias block soldering
No
Yes
Change the board
Check TP1 Signal exist? Check RF Switch (M/S)
No
Yes
Check TP Signal exist? Check TX Module Refer 1.4
No
Yes
Check TP3 Signal exist? Check Duplexer
No
Yes
Check TP4 Signal exist? Check RTR685 and Rx SAW flter
No
Yes
1.2n
L1019
C1075
3.3n
2140MHz
FL1002
4 5
1
3 2
G1 O1
IN
G2 O2
33p C1074
L1017
1.2n
VDD_RX
C1076
DNI
C1081
3.9p
DNI
C1073
2n
L1016
3.9p
C1072
p
0
0
1
8
6
0
1
C
7
6
0
1
C
u
1
.
0
R1015
DNI
R1021
0
K
1
4
1
0
1
R
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_1900_LNA_OUT WB2100_MIX_INP
WB2100_MIX_INM
WCDMA RX 2100 LNA Circuit
W2100 RX(2110 - 2170 MHz)
0603
TP4
Bias
4. TROUBLE SHOOTING
- 91 -
Start
1. Check TCXO Block
4. Ro-download SW & Cal.
. Check Tx Module
3. Check RF TRX Level
4.6 Checking GSM Block
4. TROUBLE SHOOTING
- 9 -
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
1
2,3
4. TROUBLE SHOOTING
- 93 -
4.6.1 Checking TCXO Block

Refer to 1.3
4.6.2 Checking Tx module Block
Refer to 1.4
4.6.3 Checking RF TX level

TP1
TP2
TP3
4. TROUBLE SHOOTING
- 94 -
G
Schematic of GSM/DCS/PCS Tx Block
TP1
TP3
TP2
R1001
DNI
SW1000
4 2 1 3
1
G A C
2
G
C1018
39p
1
9
9
0
0
1
R
C1045
1n
C1049
1n
3.9p
L1040
C1004
15n
R1000
100p
ANT1000
C1046
1n
L1042
DNI
C1042
47p
1
9
8
0
0
1
R
L1000
100n
ANT1001
C1001
2.7n
C1106
DNI
75
R1006
VBATT
0.5p
L1001
0
3
1
5
0
0
1
R
47
R1003
0
3
1
4
0
0
1
R
R1002
2.2K
U1001
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
L1041
DNI
ANT1004
C1043
1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0
ANT_SEL2
ANT_SEL1
WCDMA_900_RTX
WCDMA_2100_RTX
GSM_TX
DCS_PCS_TX
8
0
6
1
0603
0603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)
GSM850(824-849MHz)
7dB
11dB
2mm
TP1
TP3
TP2
4. TROUBLE SHOOTING
- 95 -
Check TCXO Block Refer to 1.3
Check TP1
If GSM over 31 dBm?
If DCS/PCS over 8 dBm?
GSM/DCS/PCS Tx is OK
Check other part
Yes
No
Change the board
Check TP, 3
If GSM(TP) under 6 dBm?
If DCS/PCS(TP3) over 6 dBm?
Check ANT SW Block (ASM+EDGR PAM)
Refer to 1.4
Yes
No
Check RTR & PAD Check soldering and components
No Problem
Still exist Problem
START
No
4. TROUBLE SHOOTING
- 96 -
4.6.4 Checking RF Rx Block

G
G
G
G
G
G
G
G
G
G
G
G
G
G
TP1
TP2
4. TROUBLE SHOOTING
- 97 -

Schematic of GSM/DCS/PCS Rx Block
TP1
TP2
DNI
L1011
33p
C1039
DNI
L1008
33p
C1037
DNI
L1005
33p
C1015
33p
C1007
DNI
L1002
881.5MHz,942.5MHz
FL1000
10 3
5 2
8 1
9
6
7 4
IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
SW1000
4 2 1 3
1
G A C
2
G
12n
L1013
2.2p
C1003
2.2p
C1010
22n
L1009
C1021
4.7p
L1000
100n
L1007
18n
C1016
4.7p
5.6n
C1033
C1052
6.8n
5.6n
C1038
C1040
6.8n
C1001
2.7n
1842.5MHz,1960MHz
FL1001
10 3
5 2
8 1
9
6
7 4
IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
18n
L1004 0.5p
L1001
DNI
L1012
0.5p
L1010
82n
L1006
L1003
82n
U1001
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
GND
RX_PCS_P
RX_DCS_P
RX_GSM_900_P
RX_GSM_850_P
WCDMA_900_RTX
RX_GSM_850_M
RX_GSM_900_M
RX_DCS_M
RX_PCS_M
WCDMA_2100_RTX
GSM(869-894 MHz)
GSM(925-960 MHz)
PCS(1930-1990 MHz)
DCS(1805-1880 MHz)
TP1
TP2
4. TROUBLE SHOOTING
- 98 -
Set the phone Rx is On
Check TP1 Signal exist? Check RF Switch (M/S)
No
Yes
Change the board
Check TP Signal exist? Check FEM Block Refer 1.4
No
Yes
4. TROUBLE SHOOTING
- 99 -
4.7 GPS/WIFI/BT RF Component

RF Components(GPS)

Reference Description
ANT1003
ANTENNA PAD
connected to Carrier type antenna
ANT1002 GND PAD
FL1006 GPS SAW FILTER
U1003 GPS LNA
ANT1002
ANT1003
FL1006
U1003
4. TROUBLE SHOOTING
- 100 -
G
RF component (WiFi / BT )
Reference Description
ANT200 ANTENNA PAD
connected to Carrier type antenna
ANT201 GND PAD
FL200 WiFi / BT Filter
U200 SP3T + LNA for WiFi / BT
U500 WiFi / BT chip

ANT201
ANT200
U201
FL200
U200
4. TROUBLE SHOOTING
- 101 -
4.8 GPS/WIFI/BT SIGNAL PATH

GPS Signal PATH (main board bottom)

GPS Rx PATH
4. TROUBLE SHOOTING
- 10 -

WiFi / BT Signal PATH

WiFi / BT Tx and Rx PATH
BT Tx
WiFi Tx
4. TROUBLE SHOOTING
- 103 -
4.9 GPS/WIFI/BT Trouble shooting

4.9.1 A-GPS Block

Schematic of the A-GPS block

TP2
TP1
TP1
TP2
Set the phone GPS is ON
Check TP1 About .7V? Check power LRC flter soldering
No
Yes
Change the board
Check TP About .6V? Check SW and NV item
No
Yes
8.2n
L1038
C1101 100p
5.6n
L1027
ANT1002
VREG_RF_2.7V
C1096
100p
ANT1003
100n
L1030
C1099
18p
U1003
3
2
5
4
1
N
I
_
F
R
FIL_OUT
VDD
S_D
GND
L1034
3.3n L1028
6.8n
R1020
1K
L1029
DNI
12
R1019
1575.42 MHz
FL1006
5 2
4 1
3
G3
IN OUT
G1 G2
C1100
0.1u
GPS_MODE
GPS_IN
Near To LNA
0603
0603
TP1
TP2
4. TROUBLE SHOOTING
- 104 -
4.9.2 WLAN/BT/FM Block

Checking Flow

1
2
3
4
START
Component Change
1. Check the Power
. Check the Clock
3. Check the SP3T+LNA
4. Check the WiFi/BT chip
4. TROUBLE SHOOTING
- 105 -
Main chip part

[Figure] Schematic of WiFi/BT/FM
R200 15K
FB200 600
FB202 600
600 FB201
10p C224
3.3u L208
u
7 .
4
3
0
2
C
U201
4
H
9
D
5
D
6
E
9
A
8
D
8
B
3
C
6
B
2
E
2
D
2
C
2
A
1
G
3
F
2
F
1
F
2
H
1
H
4
E
5
E
2
1
P
1
1
P
8
P
1
1
F
3
1
G
0
1
G
0
1
F
2
1
D
2
1
E
0
1
J
2
1
K
3
1
L
0
1
K
1
1
D
0
1
D
0
1
A
2
1
C
5
P
4
M
7
J
R1
F13
F14
M5
N9 L5
P7
K11 N7
K14 L4
K13 N6
K9 M6
L9 L2
J8
H8 R4
G7 R2
L14 T2
L11 R7
M9 R6
L10 T7
T1
N8 P6
B11
A11 P10
H9 N12
M8 T12
M7 R13
P13
L8 T14
G6 N13
K8 N14
J9 R12
T11
M11 R11
M12 P14
M14 R14
M13 T13
T10
H12 R10
G12
E14 R8
C14 N10
D14 R9
C13 T8
D13 N11
G11 T9
H14 P9
G14
H3
P1 E3
N1 D4
N2 E8
N4 B9
N5 A8
A5
M2 A4
M1 A7
K4 C1
K1 E1
L6
K2
K5
K6
J5
H6
4
1
B
0
1
E
3
1
E
3
1
H
4
P
2
1
F
4
T
1
L
8
G
5
R
2
P
7
L
7
K
6
T
5
T
3
G
2
G
4
F
7
C
7
E
8
C
5
C
1
A
1
D
9
C
5
B
3
A
6
D
0
1
M
2
1
L
1
1
C
6
J
7
H
0
1
C
2
1
A
3
1
A
O
C
V
D
D
V
_
T
B
F
T
D
D
V
_
T
B
F
R
D
D
V
_
T
B
1
O
D
D
V
_
T
B
2
O
D
D
V
_
T
B
F I
D
D
V
_
T
B
1
C
D
D
V
_
T
B
2
C
D
D
V
_
T
B
2
P
1
_
O
C
V
D
D
V
_
F
R
W
2
P
1
_
X
T
D
D
V
_
F
R
W
2
P
1
_
X
R
D
D
V
_
F
R
W
2
P
1
_
P
C
D
F
P
D
D
V
_
F
R
W
3
P
3
_
G
A
P
D
D
V
_
F
R
W
3
P
3
_
A
A
P
D
D
V
_
F
R
W
2
P
1
_
O
L
D
D
V
_
F
R
W
2
P
1
_
D
D
D
V
_
F
R
W
2
P
1
_
B
A
C
D
D
V
_
F
R
W
2
P
1
_
A
D
D
V
_
F
R
W
2
_
2
P
1
_
D
D
V
_
L
L
P
B
B
_
F
R
W
C
D
A
X
R
_
D
D
V
A
_
E
F
A
_
F
R
W
X
U
A
_
D
D
V
A
_
E
F
A
_
F
R
W
1
_
D
S
_
O I
D
D
V
2
_
D
S
_
OI
D
D
V
1
_
F
R
_
OI
D
D
V
2
_
F
R
_
OI
D
D
V
1
OI
D
D
V
2
OI
D
D
V
1
D
D
V
2
D
D
V
3
D
D
V
L
A
T
X
_
D
D
V
5
2
D
D
V
_
P
T
O
D
D
V
A
N
A
_
M
F
O
C
V
D
D
V
_
M
F
L
L
P
D
D
V
_
M
F
X
R
D
D
V
_
M
F
RF_SW_CTRL_N_0
RF_SW_CTRL_P_0
RF_SW_CTRL_N_1
RF_SW_CTRL_P_1
RF_SW_CTRL_N_3
RF_SW_CTRL_P_3
WRF_RFOUTP_G AMODE_TX_PU
WRF_RFOUTP_A GMODE_TX_PU
WRF_RFINP_G1 AMODE_EXT_LNA_GAIN
WRF_RFINP_A1 GMODE_EXT_LNA_GAIN
WRF_RFINN_A1_XFMR
WRF_RFINN_G1_XFMR WL_GPIO_0
WRF_RES_EXT WL_GPIO_1
WRF_EXTREFIN WL_GPIO_2
WRF_EXTCOUPLE_AIN WL_GPIO_3
WRF_AFE_TSSI_G WL_GPIO_8
WRF_AFE_TSSI_A
FM_TXADCIN2
VREF_LDO FM_TXADCIN1
VOUT_LNLDO1 FM_TXADCVCM
VOUT_LDO2 FM_TXP
VOUT_CLDO FM_TXN
VDD_LNLDO1 FM_RXP
VDD_LNLDO2 FM_RXN
VDD_CLDO FM_CVAR
FM_ADOUT2
SR_PALDO_1 FM_ADOUT1
SR_PALDO_2
SR_VDDNLDO BT_UART_TXD
SR_VLX1_1 BT_UART_RXD
SR_VLX1_2 BT_UART_RTS_N
SR_VDDBAT3_1 BT_UART_CTS_N
SR_VDDBAT3_2
SR_VDDBAT2 BT_TM0
SR_VDDBAT1_1 BT_TM1
SR_VDDBAT1_2 BT_TM3
SR_VSSPLDO BT_TM6
SR_PVSS_1
SR_PVSS_2 BT_SDA
SR_AVDD2P5 BT_SCL
SR_TESTSWG BT_RST_N
SR_PNPO BT_RFOP
BT_RFON
SDIO_CMD BT_REG_ON
SDIO_DATA_0
SDIO_DATA_1 BT_PCM_SYNC
SDIO_DATA_2 BT_PCM_OUT
SDIO_DATA_3 BT_PCM_IN
SDIO_CLK BT_PCM_CLK
UART_TX_0 BT_GPIO_0
UART_RX_0 BT_GPIO_1
BT_GPIO_2
TMS BT_GPIO_3
TDO BT_GPIO_4
TDI BT_GPIO_5
TCK BT_GPIO_6
TAP_SEL_0 BT_GPIO_7
TAP_SEL_1
JTAG_TRST_L WL_REG_ON
WL_RST_N
OSCIN
OSCOUT
XTAL_PU
1
S
S
V
2
S
S
V
3
S
S
V
O
C
V
S
S
V
_
T
B
F
R
S
S
V
_
T
B
FI
S
S
V
_
T
B
P
FI
S
S
V
_
T
B
1
C
S
S
V
_
T
B
2
C
S
S
V
_
T
B
1
T
U
O
_
X
E
O
C
_
T
B
0
T
U
O
_
X
E
O
C
_
T
B
O
C
V
S
S
V
_
M
F
X
R
S
S
V
_
M
F
L
L
P
S
S
V
_
M
F
F
L
D
N
G
B
_
M
F
S
S
V
A
N
A
_
M
F
L
A
T
X
_
S
S
V
O
D
L
_
S
S
V
A
S
S
V
A
P
_
R
S
S
S
V
A
_
R
S
2
T
U
O
_
O I
P
G
_
F
R
W
1
T
U
O
_
O I
P
G
_
F
R
W
P
O
_
T
S
E
T
_
E
F
A
_
F
R
W
N
O
_
T
S
E
T
_
E
F
A
_
F
R
W
P I
_
T
S
E
T
_
E
F
A
_
F
R
W
NI
_
T
S
E
T
_
E
F
A
_
F
R
W
F
E
R
V
_
C
D
A
QI
_
E
F
A
_
F
R
W
C
D
A
X
R
_
S
S
V
A
_
E
F
A
_
F
R
W
1
_
3
P
3
_
A
A
P
D
N
G
_
F
R
W
2
_
3
P
3
_
A
A
P
D
N
G
_
F
R
W
3
_
3
P
3
_
G
A
P
D
N
G
_
F
R
W
4
_
3
P
3
_
G
A
P
D
N
G
_
F
R
W
2
P
1
_
X
R
D
N
G
_
F
R
W
2
_
2
P
1
_
X
T
D
N
G
_
F
R
W
2
P
1
_
D
D
N
G
_
F
R
W
2
P
1
_
A
D
N
G
_
F
R
W
2
P
1
_
B
A
C
D
N
G
_
F
R
W
2
P
1
_
O
C
V
D
N
G
_
F
R
W
2
P
1
_
O
L
D
N
G
_
F
R
W
2
P
1
_
P
C
D
F
P
D
N
G
_
F
R
W
2
P
1
_
D
N
G
_
L
L
P
B
B
_
F
R
W
u
7.
4
9
2
2
C
DNI
C221
u
7 .
4
0
3
2
C
4
0
2
C
n
0
2
2
V
6.
2
_
P
M
S
M
_
G
E
R
V
C244 10p
15p C245
4.7u C235
10p C223
C239 220n
C232 3.3n
VREG_MSMP_2.6V
VDD_RADIO_PLL
VDD_BT
VDD_PLL
VDD_AFE
C234 0.1u
C231
u
0
1
8
2
2
C
u
1
C226 5p
9
0
2
C
u
1.
0
8
0
2
C
u
1.
0
7
0
2
C
u
1.
0
6
0
2
C
u
1.
0
5
0
2
C
n
0
1
3
1
2
C
u
1.
0
0
1
2
C
u
1
VDD_BT
C238
22p
C243 1u
0
0
2
C
u
1.
0
2
0
2
C
u
1.
0
C236
47p
1
0
2
C
u
1.
0
C242 220n
L206
47n
C233 1n
C237
47p
L207
100n
C211
0.1u
2
1
2
C
p
2.
8
4
1
2
C
u
1.
0
VDD_RADIO_PLL
VDD_CORE
VDD3.3V
+VPWR
VDD_2.5V
C241
u
1 .
0
u
7.
4
0
4
2
C
VDD_FM
L
L
P
_
D
D
V
L
L
P
_
OI
D
A
R
_
D
D
V
E
R
O
C
_
D
D
V
E
F
A
_
D
D
V
V
3 .
3
D
D
V
E
R
O
C
_
D
D
V
VDD_XTAL
L
A
T
X
_
D
D
V
V
5.
2
_
D
D
V
M
F
_
D
D
V
600 FB203
R201
0
0
0
6
4
0
2
B
F
V
6
.
2
_
P
M
S
M
_
G
E
R
V
V
6
.
2
_
P
M
S
M
_
G
E
R
V
SLEEP_CLK
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]
BT_RESET_N
WLAN_CMD
WLAN_CLK
BT_PCM_DIN
BT_PCM_DOUT
BT_HOST_WAKEUP
BT_UART_RTS
BT_UART_CTS
BT_UART_RXD
BT_UART_TXD
BT_PCM_SYNC
BT_PCM_CLK
BT_WAKEUP
WLAN_RESET_N
FM_R
FM_L
WLAN_HOST_WAKEUP
WLAN_WAKEUP
CLK_REQ
SW_BT_TX
SW_WL_TX
SW_WL_BT_RX
EXT_LAN_GAIN
VDD_FM
RX_BG
TX_BT
TX_WLBG
V
3
.
3
D
D
V V
3
.
3
D
D
V
CLK_IN
FM_ANT
1%
0: SDIO / N.C : SPI
TP for TSSI Calibration
ANT200 ANT201
2.2n
L205
15p
L201
C225
0.1u
0
2
2
C
DNI
V
3 .
3
D
D
V
C227
0.1u
U200
7
8
9
0
1
1
1
2
1
2
3
1
1
5 4 6
3
GND2
D
D
V
N
E
_
A
N
L
T
U
O
_
X
R
TX_IN
D
N
G
P
GND1
X
T
_
C
X
R
_
C
T
N
A
C_BT
BT
GND3
C222
10p
9
1
2
C
DNI
L209
3n
FL200 2450 MHz
3
2
1
IN D
N
G
OUT
DNI
C217
100p L202
DNI
C218
SW_BT_TX
X
T
_
L
W
_
W
S
X
R
_
T
B
_
L
W
_
W
S
N
I
A
G
_
N
A
L
_
T
X
E
G
B
_
X
R
TX_BT
TX_WLBG
4. TROUBLE SHOOTING
- 106 -

Checking Flow

Board change
TP1, 2 is OK?
SDIO OK?
UART OK?
Check the power block
WiFi / BT chip check
u
u
START

TP1
TP2
START
TP1 1, is OK? Check the power block
No
Yes
Board change
SDIO OK?
UART OK?
WiFi/BT chip check
Yes
No
4. TROUBLE SHOOTING
- 107 -
Main clock part

TP1 TP2
TP1
TP2
C248
1u
38.4MHz
KT3225L38400UCW28TA0
X200
3 2
4 1
GND1 VCC
GND2 OUT
3
0
2
R
K
0
0
1
U202
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
C246 100p
VDD_TCXO
VDD_TCXO
C247
1u
+VPWR
CLK_REQ
CLK_IN
38.4MHz TCXO
LDO for TCXO
TP1
TP2
4. TROUBLE SHOOTING
- 108 -

- Bluetooth RF Test procedure
1. Set phone to Bluetooth test-mode.
- Blue tooth ON: Enter Test Mode(277634#*#) Module test set BT DUT BT DUT ON
2. Insert a phone in a TEMCELL (in case of radiation test)
3. Set discover after push menu button of the tester and select the link analyzer.
4. After set test mode, confirm the connection state.
5. Measure the power of full channel after hopping mode is selected to ON
6. You can select wanted test cases after getting an optimized power
7. Blue tooth On/Off
- Menu KeysettingsWireless controlsBluetoothTurn on/Turn off
4. TROUBLE SHOOTING
- 109 -

4.10 Power ON Troubleshooting
Power On sequence of P350 is :
Power key press TP1 go to low PM7540 Power Up TP3(C525), TP7(C526), TP2(C527), TP4(C542),
TP5(C541), TP6(C546) power ON Phone booting and TP9(D501) go to High

Slarl
Ballery vollaqe. hqher
lhan 3.70V(CCV)?
TP! or TP9 hqh lo low
when key press?
TP2. TP3. TP4. TP5.
TP6. TP7 power up?
s clock ok?
TP8 !9.2M i TP!0 32.768kHz
Chanqe or charqnq lhe
Ballery
!. Check correclly worknq
power key
Chanqe lhe Man board
Chanqe lhe Man board
NC
YES
YES
YES
YES
NC
NC
NC
Pedownload sw maqe
START
Battery voltage higher than
3.70V(OCV)?
Change or charging the Battery
No
Yes
Redownload SW image
TP1 or TP9 hight to
low when key pness?
Check correctly working powerkey
No
Yes
TP, TP3, TP4, TP5
TP6, TP7 power up?
Change the Main board
No
Yes
is clock OK?
TP8: 19.M/TP10:3.768kHz
No
Yes
4. TROUBLE SHOOTING
- 110 -

TP1 : KPD_PWR_N go to low
VA801
R814
100K
KB800
PM_ON_SW
END
TP1: KPD_PWR_N go to low
4. TROUBLE SHOOTING
- 111 -
VREG_HPVDD_1.8V
HS_MIC_BIAS
HS_MIC_BIAS_TEMP
1u
C571
4.7u L504
L503 4.7u
4.7u L502
2.2u C535
VREG_LCD_1.8V
C546
1u
L501 4.7u
C528
4.7u
DNI C536
CM315_12_5PF
X500
32.768KHz
2
1
0.1u C549
VREG_MSME_1.8V
C540
2.2u
VREG_TOUCH_3.0V
VREG_RF_2.7V
E10
F10
C12
M12
K7
N13
M13
G10
D9
H12
C13
A13
A12
G12
G1
M1
D13
E12
N11
A3
A10
A8
H13
G13
A11
K13
E13
B13
A9
N12
J13
A2
M4
N4
M9
N10
M6
N6
M8
N8
J1
K1
VSW_5V
VREG_5V
VSW_MSMC1
VREG_MSMC1
VSW_MSMC2
VREG_MSMC2
VSW_MSME
VREG_MSME
VSW_PA
VREG_PA
VREG_GP1
VREG_GP2
VREG_GP3
VREG_GP4
VREF_GP5
VREG_GP6
VREG_MMC
VREG_MSMA
VREG_MSME2
VREG_MSMP
VREG_RFRX1
VREG_RFRX2
VREG_RFTX
VREG_RUIM1
VREG_SYNT
VREG_TCXO
VREG_USB
VREG_WLAN
MIC_BIAS
REF_ISET
REG_GND
REF_BYP
TCXO_IN
TCXO_EN
TCXO_OUT
XTAL_IN
XTAL_OUT
SLEEP_CLK
AMUX_OUT
KPD_PWR_N
PON_RESET_N
PS_HOLD
121K
R509
D501
22p C515
VREG_TCXO_2.85V
51 R510
1n
C524
2.2u
C537
2.2u
C539
C521
1n
C544
2.2u
VREG_MSMC1_1.25V
R515
200K
1n
C523
VREG_RUIM_3.0V
C526
4.7u
C547
2.2u
C538
2.2u
VREG_MSMA_2.6V
4.7u
C527
1u
C548
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C522
1n
1u
C545
10u
C520
VREG_MSMP_2.6V
4.7u
C542
22u
C525
C543
2.2u
VREG_MMC_3.0V
4.7u
C541
C500 22p
VREG_AUX2_2.9V
VREG_MOTION_3.0V
VREG_LCD_2.8V
C570
33p
C566
1u
D500
+VPWR
L500
2.2u
+VPWR_AUDIO
10u C530
1n C529
SLEEP_CLK
TCXO_PM_19.2MHZ
PS_HOLD
AMUX_OUT
PMIC_TCXO
TCXO_EN
PM_ON_SW
JTAG_PS_HOLD
VSNS_MSME_1.8V
VSNS_MSMC2_1.25V
nPON_RST
VSNS_MSMC1_1.25V
0.5mm
Place crystal and load caps close to PM7540
1%
Local Ground Plan
Place in PM7540 room at shield edge
0.6mm
0.6mm
These CAPs close to inductors
0.6mm
Route together
0.3mm
0.3mm
C308
10n
R310 33
100
R303
19.2MHz
X300
4 2
3 1
VCONT OUT
GND VCC
C301
0.1u
C320 330p
C307 330p
R319
1
C309 330p
C300
1n
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C310
0.1u
U301
3
2
4
1
5
VCC
GND
R311 100K
TCXO_PM_19.2MHZ
TCXO_EN
TCXO_RTR_19.2MHZ
USBH_SYSCLK
RTR_TRK_LO_ADJ
1.0T
TCXO Circuit
Clesed to TCXO
TP2
TP7
TP3
TP5 TP4
TP10
TP9
TP6
TP8
4. TROUBLE SHOOTING
- 11 -

TP7
TP2
TP4
TP6
TP8
TP5
TP3
TP9
TP10
4. TROUBLE SHOOTING
- 113 -
4.11 Charging Trouble shooting
Charging Procedure
- Connect TA or u-USB Cable
- Control the charging current by PM7540 IC
- Charging current fows into the battery
Check Point
- Connection of TA or USB Cable
- Charging current path(NUS5530MIN)
- Battery
Troubleshooting Setup
- Connect TA and battery to the phone
Troubleshooting Procedure
- Check the charger (TA or USB Cable) connector
- Check the OVP Circuit
- Check the charging current Path
- Check the battery
MAX14528
U503
EUSY0374601
9 6
5 3
4
8 2
7 1
IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
D
N
G
D
N
G
P
22p
C561 C562
1u
SC500
1
CN501
11
10
9
5
4
3
2
1
8
7
6
ZD502
VCHG_VBUS
22p
C564
FL500
IN OUT
GND1 GND2
USB_ID
USB_DM
USB_DP
OVP
change circuit at REV B
MicroUSB
2mm
C531
100u
C532
10n
VCHG_VBUS
VBATT
Q500 NUS5530MN
EQFP0008601
5
6 4
7 3
8 2
9 1
10
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
1
.
0
6
0
5
R
CHG_CTL_N
BATT_FET_N
ISNS_P
+VPWR
2mm
1608
Charging IC
10V
2mm
1%
ISNS_M
TA
(5.1V)
Main
Battery
Charging Current Flow
4. TROUBLE SHOOTING
- 114 -
Check the pin and battery
Connect terminals of I/O connector
Connection OK?
No
Yes
Is the u- USB Cable)
voltage 4.8V (or 5.0V)?
No
Yes
Is it charging properly
After turning on TP
START
Check PMIC SMT status by X-ray
Exchange TP1 or Change the
main board and Retest
Change I/O connector
Change TA (or u-USB cable)
END
Yes
No
4. TROUBLE SHOOTING
- 115 -
VREG_HPVDD_1.8V
HS_MIC_BIAS
EUSY0407201
U500
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
USB_3.3V
HS_MIC_BIAS_TEMP
1u
C571
C502
1n
+VPWR
4.7u L504
L503 4.7u
4.7u L502
K
0
5
1
2
0
5
R
VREG_MSMP_2.6V
2.2u C535
VREG_MSME_1.8V
R504
47K
VREG_LCD_1.8V
C546
1u
C507 DNI
L501 4.7u
C528
4.7u
DNI C536
K
1
3
0
5
R
DNI C508
C516
1u
+VPWR
CM315_12_5PF
X500
32.768KHz
2
1
0.1u C549
VREG_MSME_1.8V
10u C519
C540
2.2u
VREG_TOUCH_3.0V
VREG_RF_2.7V
M
_
S
N
S
I
U501
EUSY0342201
PM7540
9
J
8
J
7
J
6
J
5
J
9
H
8
H
7
H
6
H
5
H
9
G
8
G
7
G
6
G
5
G
9
F
8
F
7
F
6
F
5
F
9
E
8
E
7
E
6
E
5
E
H1
E10 F1
F10 E1
C12 N2
B1
M12 B2
K7
A5
N13 A4
M13 B5
B4
G10 A7
D9 A6
H12 B7
B6
C13
A13 D10
A12 K10
H10
G12 J10
G1
M1 K4
D13 J4
E12 H4
N11 M2
A3 L2
A10 H2
A8
H13 K2
G13 J2
A11 G4
K13 F4
E13 D5
B13 B3
A9 M5
N12 N3
J13 N1
A2 M3
K6
M4 K5
N4 K9
M9 K8
N10 M11
M6 L12
N6 A1
M8 D4
N8 B12
J1 D8
K1 N5
M7
2
G
2
1
D
7
D
8
B
0
1
M
6
D
9
B
2
1
J
3
1
F
2
1
F
2
1
K
7
N
9
N
0
1
B
3
1
L
1
1
B
2
F
4
E
2
C
1
C
1
D
1
L
2
D
2
E
G
H
C
V
N
_
L
T
C
_
G
H
C
S
U
B
V
_
B
S
U
N
_
L
T
C
_
B
S
U
P
_
S
N
SI
M
_
S
N
SI
N
_
T
E
F
_
T
A
B
T
A
B
V
NI
O
C
V
P
U
K
C
A
B
_
V
A
N
A
_
D
D
V
E
_
1
C
_
D
D
V
A
P
_
2
C
_
D
D
V
2
P
G
_
D
D
V
6
P
G
_
D
D
V
2
E
M
S
M
_
D
D
V
P
M
S
M
_
D
D
V
1
F
R
_
D
D
V
2
F
R
_
D
D
V
MI
U
R
_
D
D
V
R
K
P
S
_
L
_
D
D
V
R
K
P
S
_
R
_
D
D
V
O
X
C
T
_
D
D
V
N
A
L
W
_
D
D
V
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
5
D
N
G
6
D
N
G
7
D
N
G
8
D
N
G
9
D
N
G
0
1
D
N
G
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
4
1
D
N
G
5
1
D
N
G
6
1
D
N
G
7
1
D
N
G
8
1
D
N
G
9
1
D
N
G
0
2
D
N
G
1
2
D
N
G
2
2
D
N
G
3
2
D
N
G
4
2
D
N
G
5
2
D
N
G
121K R509
D501
0.1u C514
1n C517
22p C515
VREG_TCXO_2.85V
C513 0.1u
C512 0.1u
1
0
5
R 10K
0.1u
C534
51 R510
1n
C524
2.2u
C537
C568
33p
2.2u
C539
C521
1n
C544
2.2u
VBATT
VREG_MSMC1_1.25V
VCHG_VBUS
R515
200K
1n
C523
VREG_MSMP_2.6V
1n C518
0.1u C511
VREG_RUIM_3.0V
2.2u
C509
C526
4.7u
C547
2.2u
C538
2.2u
0.1u C510
VREG_MSMA_2.6V
4.7u
C527
1u
C548
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C522
1n
1u
C545
10u
C520
VREG_MSMP_2.6V
4.7u
C542
0.1u C506 R500
4.7
22u
C525
C543
2.2u
VREG_MMC_3.0V
TP502
0.1u C505
4.7u
C541
0.1u C504
C503 0.1u
C500 22p
C501 0.1u
VREG_AUX2_2.9V
VREG_MOTION_3.0V
VREG_LCD_2.8V
C570
33p
C566
1u
TP501
0
3
5
R
K
0
0
3
R505
1K
D500
+VPWR
L500
2.2u
+VPWR_AUDIO
10u C530
1n C529
USIM_CLK
USIM_DATA
KEY_LED_DRV_N
SLEEP_CLK
REMOTE_PWR_ON
TCXO_PM_19.2MHZ
PS_HOLD
PM_INT_N
GSM_PA_DAC_REF
AMUX_OUT
PMIC_TCXO
TCXO_EN
PMIC_SSBI
PM_ON_SW
JTAG_PS_HOLD
P
U
_
K
C
A
B
V
USB_LDO_EN
USB_LDO_EN
PCB_REVISION
PCB_REVISION
N
_
L
T
C
_
G
H
C
N
_
T
E
F
_
T
T
A
B
P
_
S
N
SI
VBAT_TEMP
VSNS_MSME_1.8V
VSNS_MSMC2_1.25V
nPON_RST
VSNS_MSMC1_1.25V
VBAT_SENSE
USIM_RST
MSM_USIM_CLK
MSM_USIM_RST
MSM_USIM_DATA
R
W
P
V
+
1.30V
close to MSM
USB 3.3V LDO
150K
150K
150K
ADC
150K
TEST&E
150K
0.5mm
R2
2.13V
10K
68K
47K
150K
150K
REV
1.93V
C&H
B&G
1%
Local Ground Plan
PM7540
A&F
Rev.1.1
150K
150K
PCB Revision Check ADC
Route together
0.16V
Rev.1.0
D&I
0.6mm
Rev.1.2 680K
0.81V
0.6mm
100K
1.73V
0.62V
300K
R1
0.6mm
1.04V
430K
Route together
Place close to PM7540 pins
PMIC
1608
close to each other
m
m
5
.
0

9
N

,
7
N
0.3mm 0.3mm
C531
100u
C532
10n
VCHG_VBUS
VBATT
Q500 NUS5530MN
EQFP0008601
5
6 4
7 3
8 2
9 1
10
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
1.
0
6
0
5
R
CHG_CTL_N
BATT_FET_N
ISNS_P
+VPWR
2mm
1608
Charging IC
10V
2mm
1%
ISNS_M
MAX14528
U503
EUSY0374601
9 6
5 3
4
8 2
7 1
IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
D
N
G
D
N
G
P
22p
C561 C562
1u
SC500
1
CN501
11
10
9
5
4
3
2
1
8
7
6
ZD502
VCHG_VBUS
22p
C564
FL500
IN OUT
GND1 GND2
USB_ID
USB_DM
USB_DP
OVP
MicroUSB
2mm
TP1
TP2
TP3
TP4
4. TROUBLE SHOOTING
- 116 -

TP2 TP1 TP3 TP4
4. TROUBLE SHOOTING
- 117 -
4.12 3M FF Camera trouble

3M camera control signals are generated by MSM7227.

Check the camera Conn.
and reconnect the camera
Camera is OK?
No
END
Yes
Check IOVDD(TP5),
DVDD(TP6), AVDD(TP7)
START
Yes
Check the EMI Filter(FL601, FL60)
Camera is OK
No
No
Yes
MSM 77 output signal check
MCLK(TP1), PCLK(TP),
Reset(TP3), Standby(TP4)
Change the camera
Yes
END
Change the Filter(FL601, FL60)
No
No
Yes
4. TROUBLE SHOOTING
- 118 -
R312
47
7.5p
C321 C322
7.5p
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
GPIO_18
GPIO_19
GPIO_20
GPIO_21
GPIO_22
GPIO_23
GPIO_24
GPIO_25
CAM_PCLK
CAM_MCLK
CAM_VSYNC
CAM_HSYNC
AUDIO_I2C_SDA
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
PS_HOLD
PM_INT_N
MUIC_INT
PA_ON1
MUIC_I2C_SDA
MUIC_I2C_SCL
RC Filter of CAM_MCLK close to MSM
TP1
FL705 ICVE10184E070R101FR
7.5pF
0
1
5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
FL707 SFEY0011401
7.5pF
0
1
5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
7.5pF
0
1
5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
CAM_PCLK
CAM_VSYNC
CAM_HSYNC
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[0]
CAM_HSYNC_F
CAM_VSYNC_F
CAM_DATA[0]_F
CAM_DATA[1]_F
CAM_DATA[2]_F
CAM_DATA[3]_F
CAM_DATA[4]_F
CAM_DATA[5]_F
CAM_DATA[6]_F
CAM_DATA[7]_F
CAM_PCLK_F
MSM77
EMI FILTER
4. TROUBLE SHOOTING
- 119 -

TP1
TP2
TP7
TP6
TP3 TP4 TP5
C713
2.2u
4.7u
C714
GB042-24S-H10-E3000
CN702
ENBY0034201
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
1 R706
4
0
7
R
K
2
.
2
5
0
7
R
K
2
.
2
CAM_IOVDD_2.6V
C715
DNI
C712
2.2u
3
0
7
A
V
4
0
7
A
V
1
0
7
A
V
2
0
7
A
V
FB700
120
CAM_AVDD_2.7V
CAM_IOVDD_2.6V
CAM_DVDD_1.8V
CAM_MCLK
CAM_PWDN
CAM_RESET_N
CAM_I2C_SDA
CAM_I2C_SCL
CAM_HSYNC_F
CAM_VSYNC_F
CAM_DATA[0]_F
CAM_DATA[1]_F
CAM_DATA[2]_F
CAM_DATA[3]_F
CAM_DATA[4]_F
CAM_DATA[5]_F
CAM_DATA[6]_F
CAM_DATA[7]_F
CAM_PCLK_F
TP2
TP6
TP7
TP3
TP4
TP5
4. TROUBLE SHOOTING
- 10 -
4.13 Audio Trouble

4.13.1. Receiver. path
Voice Receiver path as below:
MSM7227 RCV_N / RCV_P TP1(R607), TP2(R608) U600 (Audio Subsystem) TP3( FB601), TP4(FB602)
SPK/RCV Pad.

Slarl
Connecl lhe phone lo nelwork
Hear lhe lone lo lhe recever?
Chanqe lhe Pecever
The Sne wave appear al
Selup !KHz lone oul
Eoupmenl and selup call
ENO
Cr Chanqe lhe Man board
Chanqe lhe U600
ENO
YES
YES
NC
NC
TP3(FB60!). TP4(FB602)?
Pesolder al TP! and TP2
NC
TP!(P607) and TP2(P608)?
Change the Receiver
The Sine wave appear at
TP1(R607) and TP(R608)?
No
Yes
TP3(FB601), TP4(FB60)?
START
END
Re-solder at TP1 and TP
or Change the Main board
No
Yes
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Change the U600
Hear the tone to the receiver?
END
Yes
4. TROUBLE SHOOTING
- 11 -

G
G
G
G
G
G

{wZS[G {wXSYG
TP3, TP4
TP1, TP2
0
2
6
C
u
2
.
2
U600
3
D
1
C
2
E
2
A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4
D
2
D
D
D
V
P
H
D
D
V
P
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
S
A
I
B
D
D
V
P
C
S
S
V
P
C
D
N
G
C636
0.1u 0.1u
C605
u
2
.
2
1
2
6
C
2.2u
C614
u
2
.
2
2
2
6
C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33n C613
R610 K
7
.
4
R609 K
7
.
4
VREG_MSMP_2.6V
33n C612
FB601 600
FB602 600
C608
1n
470n C611
C610 470n
10 R608
C609
1n
10 R607
RCV_N
RCV_P
HPH_R
HPH_L
AUDIO_I2C_SCL
AUDIO_I2C_SDA
SPK_RCV-
SPK_RCV+
EAR_L
EAR_R
LINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
TP1,2
TP3,4
4. TROUBLE SHOOTING
- 1 -

4.13.2. Headset path (Voice & Multimedia play)
Voice path & Multimedia play for headset as below:
MSM7227 HPH_R, HPH_L TP1(C610),TP2( C611) U600(audio subsystem) TP3(FB603), TP4(FB604)
J600(Earjack connector)

Slarl
The sqnal appears al TP!(C6!0).
TP2(C6!!)?
Can you hear lhe lone
Selup !KHz lone oul
Chanqe lhe Man Bd
Cr Chanqe U600
TP3(FB603) and TP4(FB604)?
ENO
YES
YES
YES
NC
or sound?
The sqnal appears al
Pesolder al TP3 and TP4
NC
Check lhe 3.5p Earack
NC
And nserl headsel.
And nserl headsel.
Cr play mullmeda conlenls
The signal appears at
TP3(FB603) and TP4(FB604)?
No
Yes
Can you hear the tone
or sound?
START
END
Re-solder at TP3 and TP4
or Change U600
No
Yes
Setup 1KHz tone out
and insert headset.
Or play multimedia contents
and insert headset.
Check the 3.5pi Earjack
The signal appears at TP1(C610),
TP(C611)?
Change the Main Bd
Yes
No
4. TROUBLE SHOOTING
- 13 -
0
2
6
C
u
2
.
2
U600
3
D
1
C
2
E
2
A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4
D
2
D
D
D
V
P
H
D
D
V
P
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
S
A
I
B
D
D
V
P
C
S
S
V
P
C
D
N
G
C636
0.1u 0.1u
C605
u
2
.
2
1
2
6
C
2.2u
C614
u
2
.
2
2
2
6
C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33n C613
R610 K
7
.
4
R609 K
7
.
4
VREG_MSMP_2.6V
33n C612
FB601 600
FB602 600
C608
1n
470n C611
C610 470n
10 R608
C609
1n
10 R607
RCV_N
RCV_P
HPH_R
HPH_L
AUDIO_I2C_SCL
AUDIO_I2C_SDA
SPK_RCV-
SPK_RCV+
EAR_L
EAR_R
LINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
TP1,2
TP602
R630
47
HS_MIC_BIAS_TEMP
R628
DNI
C637
DNI
5
0
6
R
K
2.
2
R629 47K
HS_MIC_BIAS
1800
FB606
C617
33p
2.2u
C606
1800
FB603
C607
33p
C615
47p
1n
C618
SC600
1
2
1
6
R
K
0
1
J600
2
3
4
5
6
1
M5
M4
M3
M4F
M1
M6
1
1
6
R
K
0
1
FB605
1800
Q600
D
G
S
0
0
6
D
2
0
6
D
3
0
6
D
C616
47p
1
0
6
D
4
0
6
R
M
1
C619
22p
4
0
6
D
270n
L600
VREG_MSMP_2.6V
1800 FB604
3
0
6
R
K
1
6
0
6
R
K
0
0
1
EAR_SENSE
EAR_L
EAR_R
EARMIC_P
HOOK_ADC
FM_ANT
3.5pi EAR JACK
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
ENJE0008001
TP3
TP4
4. TROUBLE SHOOTING
- 14 -

J600
TP3, TP4
TP1, TP2
4. TROUBLE SHOOTING
- 15 -
4.13.3. Loud speaker path (voice speaker phone & multimedia play)

Loud speaker path as below:
MSM7227 LINE_OP, ON TP1( C612),TP2( C613) U600(Audio subsystem) TP3(FB601), TP4(FB602)
SPK/RCV Pad.

Slarl
Hear lhe lone lo lhe recever?
Chanqe lhe Speaker
Selup !KHz lone oul
ENO
Cr Chanqe lhe Man board
Chanqe lhe U600
TP!(C6!2) and TP2(C6!3)?
ENO
YES
YES
NC
NC
TP3(FB60!). TP4(FB602)?
The Sne wave appear al Pesolder al TP! and TP2
NC
Change the Receiver
TP1(C61) and TP(C613)?
No
Yes
TP3(FB601), TP4(FB60)?
START
END
Re-solder at TP1 and TP
or Change the Main board
No
Yes
Setup 1KHz tone out
Change the U600
Hear the tone to the receiver?
END
Yes
4. TROUBLE SHOOTING
- 16 -

G
G
G
G
G
G

mi]WXSGmi]WYG
j]XYSGj]XZG
TP1, TP2
TP3, TP4
0
2
6
C
u
2
.
2
U600
3
D
1
C
2
E
2
A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4
D
2
D
D
D
V
P
H
D
D
V
P
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
S
A
I
B
D
D
V
P
C
S
S
V
P
C
D
N
G
C636
0.1u 0.1u
C605
u
2
.
2
1
2
6
C
2.2u
C614
u
2
.
2
2
2
6
C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33n C613
R610 K
7
.
4
R609 K
7
.
4
VREG_MSMP_2.6V
33n C612
FB601 600
FB602 600
C608
1n
470n C611
C610 470n
10 R608
C609
1n
10 R607
RCV_N
RCV_P
HPH_R
HPH_L
AUDIO_I2C_SCL
AUDIO_I2C_SDA
SPK_RCV-
SPK_RCV+
EAR_L
EAR_R
LINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
TP1,2
TP3,4
4. TROUBLE SHOOTING
- 17 -

4.13.4. Microphone for Main MIC

Main Microphone path as below:
MIC TP1(FB600) TP2(C315) MSM7227

Slarl
Make a Call
MCBAS(C305) s !.8V?
Make some sound lo MC
The sqnal appear al
Cr Chanqe lhe Man MC
Chanqe lhe Man Bd
TP!(FB600)?
ENO
YES
YES
YES
NC
TP2(C3!5)?
The sqnal appear al Pesolder al TP!
NC
Chanqe lhe Man Bd
NC
Make some sound to MIC
The signal appear at
TP1(FB600)?
No
Yes
TP(C315)?
START
END
Re-solder at TP1
or Change the Main MIC
No
Yes
Change the Main Bd
MICBIAS(C305) is 1.8V?
Yes
Make a Call
No
Change the Main Bd
4. TROUBLE SHOOTING
- 18 -
2
0
6
R
I
N
D
MIC600
4
3
2
1
P
G1
G2
O
C601
1800 FB600
MIC_1P
MIC_1N
MIC_BIAS
MIC
TP1
D301
1
1
3
C
F
u
1
u
1
.
0
4
1
3
C
u
1
.
0
5
1
3
C
u
1
.
0
7
1
3
C
u
1
.
0
6
1
3
C
K
2
.
2
7
0
3
R
F
u
1
3
1
3
C
u
1
.
0
8
1
3
C
u
1
.
0
2
1
3
C
8
F
8
E
7
F
7
E
7
C
7
B
6
C
5
C
6
B
5
B
P
I
_
R
_
E
N
I
L
N
I
_
R
_
E
N
I
L
P
I
_
L
_
E
N
I
L
N
I
_
L
_
E
N
I
L
P
1
C
I
M
N
1
C
I
M
P
2
C
I
M
N
2
C
I
M
P
I
X
U
A
N
I
X
U
A
P
1
_
C
I
M
R
_
M
F
L
_
M
F
N
1
_
C
I
M
GND|MIC_1N
P
_
C
I
M
R
A
E
(MIC_1N)
TP2
4. TROUBLE SHOOTING
- 19 -
G
G
G
G

TP1
MIC60

TP2
4. TROUBLE SHOOTING
- 130 -
4.13.5. Microphone for headset

MIC for Headset path as below:
Insert Headset Interrupt which are the signal of Headset detecting arise in EAR_SENSE
HS_MIC_BIAS:1.2~1.4V (MICBIAS) MIC signal TP1(FB605) TP2( C317) MSM7227
G

Slarl
& Make a Call
MCBAS(C606) s !.2!.4V?
Make some sound lo MC
The sqnal appear al
Cr Check lhe J600
Cr Chanqe lhe Man Bd
TP!(FB605)?
ENO
YES
YES
YES
NC
TP2(C3!7)?
The sqnal appear al Pesolder al TP!
NC
Check lhe Q600
nserl Headsel
Cr Chanqe lhe Man Bd
Check lhe TP2
NC
Make some sound to MIC
TP1(FB600)?
No
Yes
TP(C317)?
START
END
Re-solder at TP1
or Check the J600
No
Yes
MICBIAS(C606) is 1.~1.4V?
Yes
Insert Headset & Make a Call
No
Check the Q600 or Change the Main Bd
Check the TP
or Change the Main Bd
4. TROUBLE SHOOTING
- 131 -
G
G
G
G
G
G

Q600
TP1
TP2
4. TROUBLE SHOOTING
- 13 -
Press END key to tun the power On
Is the circuit powered?
Yes
END
Follow the Power ON
trouble shooting
No
LCD display OK?
START
No
Check Power
VREG_LCD_1.8V(TP1)
VREG_LCD_.8V(TP)
No
Disconnect and reconnect
LCD connector
Change the LCD module
The LCD works
Yes
Yes
Yes
4.14 Main LCD trouble
Main LCD control signals are generated by MSM77.
Those signals path are : MSM77 -> LCD Module
4. TROUBLE SHOOTING
- 133 -

G
G

.
TP1
TP2
TP1(LCD_2.8V)
TP2(LCD_1.8V)
VREG_LCD_1.8V
FL702
15pF 0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
U701 EUSY0391601
NLSV1T244MUTBG
4 3
5 2
6 1
VCCA VCCB
A B
GND OE_
15pF
FL701
0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
15pF
0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
C705
2.2u
FL703 SFEY0010501
15pF 0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
GB042-40S-H10-E3000
ENBY0036001
CN700
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
VREG_LCD_1.8V
FL700
15pF 0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
VA700
VREG_LCD_2.8V
1u
C710
1u
C700
R702
100
0
1
7
R
K
0
0
1
LCD_RESET_N
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
EBI2_DATA[9]
nNAND_OE
nNAND_WE
WLED_PWR
MLED[2]
MLED[3]
MLED[1]
MLED[4]
MLED[5]
LCD_RS
LCD_CS
LCD_VSYNC_LS
LCD_MAKERID_HIGH
Maker IF Maker ID
TOVIS H H
TP1
TP2
4. TROUBLE SHOOTING
- 134 -
4.15 Motion Sensor on/off trouble

Motion Sensor is worked as below :
Accelerometer Sensor function On Tilt the phone (90) The screen is had rotated automatically.

Measurement
VREG_MOTION_3.0V(TP1)
MOTION_INT(TP2)
MOTION_I2C_SDA(TP3)
MOTION_I2C_ SCL(TP4)

Tilt the phone
The screen is ratated
No
TP1 check
No
Yes
TP3, TP4 check
START
END
Change the PMIC
No
Yes
Accelerometer Sensor function On
Change the Motion senser U603
Yes
TP check
No
Change the Main Board
Yes
Work well?
No
Yes
4. TROUBLE SHOOTING
- 135 -

G
TP2 (TP600)
TP3
TP1
TP4
TP2
TP4
TP3
TP1
C639
10u
TP600
R619 K
2
.
2
R620 K
2
.
2
C624
10u
VREG_MOTION_3.0V
U603
6
1
7 6
5
4
8
3
9
2
10
1
11
12
13
4
1
5
1
2
D
E
V
R
E
S
E
R
D
D
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
S
C
SCL_SPC
GND1
O
D
S
_
I
D
S
_
A
D
S
0
A
S
_
O
D
S
4
D
N
G
C623
0.1u
VREG_MSMP_2.6V
C638
0.1u
MOTION_I2C_SDA
MOTION_I2C_SCL
MOTION_INT
TP1
TP2
TP4
TP3
4. TROUBLE SHOOTING
- 136 -

4.16 Compass Sensor on/off trouble
Compass Sensor is worked as below :
Compass Sensor function On

Measurement
VREG_MOTION_3.0V(TP1)
COMPASS_DRDY(TP2)
PROX_COMPASS_I2C_SCL(TP3)
PROX_COMPASS_I2C_SDA(TP4)
Change the position of the phone
The direction is correct?
No
TP1 check
No
Yes
TP3, TP4 check
START
END
Change the PMIC
No
Yes
Compass Sensor function On
Change the Motion senser U604
Yes
TP check
No
Yes
Work well?
No
Yes
4. TROUBLE SHOOTING
- 137 -

TP1
TP2 (TP601)
TP1
TP2 TP4
TP3
TP4
TP3
U604
12
11
10
9
5
4
6
3
7
2
8
1
D
D
V
D
G
E
R
V
A
D
N
G
S
D
N
G
D
D
V
A
ADDR
SCL
NC1
T
N
I
VPP
DRDY
SDA
C627
10n
VREG_MOTION_3.0V
TP601
R617
2.2K
VREG_MSMP_2.6V
C628
470n
R618
2.2K
COMPASS_DRDY
COMPASS_I2C_SDA
COMPASS_I2C_SCL
TP1
TP3
TP4
TP2
4. TROUBLE SHOOTING
- 138 -
4.17 Q coin Motor

Q coin Motor is worked as below :
touch touch-window Vibration feedback
U601 : Used the PWM pulse

Measurement
VREG_MOTOR_3.3V(TP1)
MOTOR_P(TP2) / MOTOR_N(TP3)
LIN_PWM_FREQ(TP4)

TP1, TP is OK?
Yes
No
TP3 is 3.3V?
TP4 is working?
START
Check SW
Change the
Q coin Motor
Yes
No
Reboot
Check an U60 SMT status by X-ray, Exchange it
Work well?
Yes
No
END
Measurement
VREG_MOTOR_3.3V(TP1)
MOTOR_P(TP) / MOTOR_N(TP3)
LIN_PWM_FREQ(TP4)
4. TROUBLE SHOOTING
- 139 -
G
G

TP1
TP2
TP4
TP3
TP1
TP2
TP4
TP3
R623
1K
C634
0.1u
VA604
DNI
Q601
C
B
E
100K R627
R613
100K
U601
B2 C1
A1 B1
B3 C2
A3 C3
IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3V
C633
0.1u
VREG_MOTOR_3.3V
R622
4.7K
51K
R624
R626
1K
C635 10n
51K
R625
L602
1.2n
VB600
2
1
VA605
DNI
L601
1.2n
LIN_PWM_FREQ
MOTOR_N
MOTOR_N
MOTOR_P
MOTOR_P
1%
(Q-Coin)
1%
MOTOR
1%
Q-coin MOTOR
1%
1%
1%
TP4
TP1
TP2
TP3
5. DOWNLOAD
- 140 -
5. DOWNLOAD
- 164 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
5. DOWNLOAD
5. DOWNLOAD
LG-P350
LG-P350
5. DOWNLOAD
- 141 -
LGE Internal Use Only - 165 -
5. DOWNLOAD
LG-P350
LG-P350
LG-P350
5. DOWNLOAD
- 14 -
- 166 -
5. DOWNLOAD
LG-P350
LG-P350
5. DOWNLOAD
- 143 -
5. DOWNLOAD
LG-P350
LG-P350
LG-P350
5. DOWNLOAD
- 144 -
- 168 -
5. DOWNLOAD
LG-P350
5. DOWNLOAD
- 145 -
5. DOWNLOAD
5. DOWNLOAD
- 146 -
- 170 -
5. DOWNLOAD
5. DOWNLOAD
- 147 -
5. DOWNLOAD
5. DOWNLOAD
- 148 -
- 172 -
5. DOWNLOAD
5. DOWNLOAD
- 149 -
5. DOWNLOAD
5. DOWNLOAD
- 150 -
- 174 -
5. DOWNLOAD
LG-P350
LG-P350
LG-P350
LG-P350
LG-P350
LG-P350
LG-P350 LG-P350
5. DOWNLOAD
- 151 -
5. DOWNLOAD
LG-P350 LG-P350
LG-P350 LG-P350
LG-P350
LG-P350 LG-P350
5. DOWNLOAD
- 15 -
- 176 -
5. DOWNLOAD
LG-P350 LG-P350
LG-P350
LG-P350
6. BLOCK DIAGRAM
- 153 -
BT_UART
BT PCM
Bluetooth v2.1
Wi-Fi 802 11b/g
BT &
Wi-Fi
System HW Block Diagram All System
CPUInterface
CPU Interface
Capacitive Touch
(Melpas + ELK)
LCD Backlight IC
BL I2C
TX IQ, PRX IQ
BT_PCM
FM_L&R
RF I/F
PRX_IQ
WLAN_SDIO
LINE_L& R
BCM43291
Wi-Fi 802.11b/g
FM Radio
FM
Tx Module
GSM & WCDMA
TOUCH I2C
2.8" QVGA
240*320
TOUCH INT
TCXO_
38.4MHz
FM_L&R
F_CLK_IN
CLK_REQ
Transceiver
(RTR6285)
Transceiver
(RTR6285)
LCD Backlight IC
AAT2862
BL_I2C
DDR SDRAM(2G)
NAND FRESH (4G)
EBI1 (DDR)
_ Q, _ Q
RF I/F
GPS
Tx Module
(SKY77544) DRX_IQ
DRX_IQ
GPIO59
GPS
MCP(Hynix)
SBDT
TCXO
NAND FRESH (4G)
CAM I/F
CAM_I2C
MSM7227
EBI2 (NAND)
CAM 3M
MCP(Hynix)
Q-Motor
(WHVM-1030Q10)
Q-Motor
(WHVM-1030Q10)
GPIO_28
LIN_PWM_FREQ
H8BCS0UN0MCR-4EM
MIC
MIC
Speaker &
R i
TCXO_19.2MHz
(Kyocera)
RTR_TRK_LO_ADJ
TCXO_RTR_19.2MHz
TCXO_PM_19.2MHz
MOTION_I2C
MOTION Sensor
(KR3DH)
MOTION INT
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_L
SPK_RCVP, N
Receiver
3.5 pi
Earjack
EAR_L, R
COMPASS_I2C Digital Compass
(AMI304) COMPASS_INT
Audio Sub
WM9093ECS-R
GPIO_27
AUDIO_I2C
TCXO IN
MMC SIM
USIM
KPD_PWR_N
MOTION_INT
USIM
USIM I/F
GPIO106
SBDT_SSBI
PMIC_SSBI
AMUX_OUT
HKAIN2 AMUX_OUT
AMUX_OUT
PM_INT_N
MSM_INT_N GPIO24
PWR/End Key
Vol. up
Send Key
Vol. Down
USIM
Key COL, Key ROW
_
Key LED
MUIC_I2C
USBPHY
UART3
I2C
UART3
MPP3,4
PM7540
KPD_DRV_N
PON_RESET_N
PS_HOLD
GPIO25
RESIN_N
JTAG
PS_HOLD
MUIC
(TS5USBA)
i
n
_
U
S
B
n
n
e
c
t
o
r
Backlight_Key
USBH DM & DP
Array TP
REMOTE_PWR_ON
nJTAG_RESOUT
JTAG_PS_HOLD
JTAG CONN.
JTAG(TCK,TDI,TDO)
UART3_TX/RX
5
p
i
C
o
6.Block diagram
6. BLOCK DIAGRAM
- 154 -
P350 RF Block Diagram RF
6. BLOCK DIAGRAM
- 155 -
6. BLOCK DIAGRAM
- 156 -
FM R
LG-P350 WiFi/BT/FM Interface
3.5
Ear-Jack
FM_ANT
WLAN_HOST_WAKEUP
FM_R
FM_L
FM_ADOUT2
FM_ADOUT1
FM_RX
WL_GPIO_0
LINE_R_IP
LINE_L_IP
GPIO94
E
a
r
-
j
a
c
k
WLAN WAKEUP
WLAN_CMD
WLAN_CLK
WLAN_RESET_N
SDIO_CMD
SDIO_CLK GPIO62
TX_WLBG
GPIO63
BT_RFOP
WL_GPIO_1
WLAN_WAKEUP
GPIO122
DEA162450BT
TX_WLBG
TX_BT
RX BG
WLAN_SDIO [3:0]
BT_UART_RXD
BT_UART_TXD
BT_UART_RXD
BT UART TXD
WL_RST_N
SDIO_DATA [3:0]
GPIO93
GPIO46
2
2
7
GPIO45
GPIO[64:67]
RX_BG
GMODE_EXT_
LNA_GAIN
RF_SW_CTRL
DEA162450BT
RF5501
_
SW_CTRL
EXT_LNA_GAIN
BT_RESET_N
BT_UART_CTS
BT_UART_RTS
BT_UART_TXD
BT_UART_RST_N
BT_UART_CTS_N
2
9
1
S
K
U
B
G
M
S
M
7
2 GPIO45
GPIO44
GPIO43
G O 23
PM7540
SLEEP_CLK(LPO Clock:
32.768KHz)
_ _
BT_PCM_SYNC
BT_PCM_DIN
BT PCM DOUT
BT_RST_N
BT_PCM_SYNC
BT_PCM_OUT
B
C
M
4
3
GPIO123
GPIO70
GPIO69
WRF_EXTREFIN
38 4MHz
32.768KHz
PM7540
BT_PCM_DOUT
BT_PCM_CLK
BT_WAKEUP
BT HOST WAKEUP
BT_GPIO_0
BT_PCM_IN
BT_PCM_CLK
GPIO68
GPIO71
GPIO42
CLK IN 38.4MHz
TCXO
BT_HOST_WAKEUP
BT_GPIO_1 GPIO83 OSCIN
CLK_IN
6. BLOCK DIAGRAM
- 157 -
PCM
BT_PCM_IN WIFI&FM&BT
BT_PCM_SYNC
BCM43291
BT_PCM_OUT
BT_PCM_CLK
FM_ANT
PCM
_ _
FM_R
FM_L
LNE_P_P
LNE_L_P
MSM7227
MC
MC_!P
MC_!N
MICBIAS
HS_MC
FM ANT
Head Sel
EAP P
EAPMC_P
EAPCN
EAPCP
HPH_L
HPH_P
AUDIO
SUBSYSTEM
Head Sel
3.5 headsel ack
EAP_P
EAP_L
LNE_CP
LNE_CN
SPK_PCV
SPK_PCV
SPKiPCV
AUOC_2C_SCL
AUOC_2C_SOA
TPA2055D3
1
- 158 - Copyright 2011 LG Electronics. Inc. All right reserved.
7. CIRCUIT DIAGRAM
C1080
6.8n
4.7u
C1036
R1001
DNI
1.2n
L1019
FL1007
1950MHz, 2140MHz
9 5
8 4
7 2
3
6 1 RX ANT
TX
GND1 GND4
GND2 GND5
C1095 1.8p
C1083 1.8p
8.2n
L1038
C1101 100p
33p C1006
C1008 33p
C1075
3.3n
DNI
L1011
33p C1039
DNI
L1008
33p C1037
DNI
L1005
33p
C1015
33p
C1007
DNI
L1002
1.2n
L1025
881.5MHz,942.5MHz
FL1000
10 3
5 2
8 1
9
6
7 4 IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
C1030
0.1u
SW1000
4 2 1 3
1G A C 2G
L1024
10n
1950MHz
FL1005
5 2
4 1
3
G3
IN OUT
G1 G2
5.1 R1011
C1053
0.1u
C1061
0.1u
C1028
0.1u
C1009 10n
5.6n
L1027 ANT1002
VREG_RF_2.7V
DNI C1050
C1096
100p
ANT1003
C1029
22p
C1027
22p
C1026
0.1u
p001
7801C
6801C
p001
p001
4801C
C1104
DNI
C1019 DNI
VDD_RX
10u
C1071
VBATT
DNI C1020
L1021
2.2p
1n
C1091
L1037
DNI
C1088 33n
DNI L1036
DNI
L1022
C1011 10n
C1022 DNI
2140MHz
FL1002
4 5
1
3 2
G1 O1 ING2 O2
100n
L1030
U1002
51
8 7
9 6
10 5
11 4
12 3
13 2
14 1 RFIN_LOW RFOUT_LOW
VMODE GND3
VBP VCC2
VCC1 GND2
VEN_LOW RFOUT_HI
VEN_HI GND1
RFIN_HI CPL
DNGP
FL1004
897.5 MHz,942.5 MHz
9 5
8
4 7
2
3
6
1 RX1
ANT
TX
GND1
GND4 GND2
RX2
GND3 GND6
C1018
39p
C1099
18p
33p C1074
L1017
1.2n
VDD_RX
L1015
6.8n
C1076
DNI
19
9 0 01 R
C1070
330p
C1069
1n
U1003
3
2
5
4
1
NI_FR
FIL_OUT
VDD
S_D
GND
C1081
3.9p
DNI
C1073
C1092
4.7n
2n
L1016
C1045 1n
u01
8401C
L1034
3.3n
C1082
3p
3.9p
C1072
C1049 1n
R1022
0
3.9p
L1040
C1004
15n
R1000
100p
DNI C1031
12n
L1013
C1078
33p
ANT1000
C1032 DNI
C1051 33p
L1028
6.8n
33p L1023
C1046 1n
L1042
DNI
C1042
47p
1 9
800 1 R
2.2p
C1003
2.2p
C1010
1.2p
C1094
p001
86 0 1C
C1077
3.9n
C1055
0.1u
C1057
0.1u
C1054
4.7u 4.7u
C1056
22n
L1009
C1021
4.7p
C1058
0.1u
C1059
0.1u
C1034
1n
C1025
22p
R1013 12K
L1000
100n
C1014
68p
76 0 1C
u 1 .0
VREG_MSMP_2.6V
C1012 33p
R1015
DNI
ANT1001
R1020
1K
R1012 5.1
C1089
DNI
L1007
18n
C1016
4.7p
C1013 1n
5.6n
C1033
C1052
6.8n
VREG_RF_2.7V
R1021
0
5.6n
C1038
U1000
32 92 82 53 43 96
62
61
60
54
43 36
37 38
27 68
25 52
21 42
8
7 45
1 44
53 47
22 46
10
6 49
4 48
3
51
67 50
19 39
40
18
17 41
16
15 33
32
13 31
14 30
12
11 59
58
9 56
24
5 57
55
65
66 20
63 2
64 26 RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12 DNGP
TUO_2ESXRPW
TUO_1ESXRPW
PNI_XM_BW
MNI_XM_BW
MDDV
C1040
6.8n
C1001
2.7n
K 1
41 0 1R
1842.5MHz,1960MHz
FL1001
10 3
5 2
8 1
9
6
7 4 IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
C1106
DNI
C1044 33p
C1023
22p
C1024
0.1u
C1060
0.1u
C1063
0.1u
18n
L1004
C1017 33p
VREG_SMPS_2.1V
75
R1006
VBATT
C1079
1n
0.5p
L1001
3.3n
L1018
FL1003
897.5 MHz
5 3 2
4 1 IN OUT
G1 G2 G3
03 1
50 0 1R
47
R1003
031
4001R
10 R1010
2.2 R1007
5801C
p001
L1035 33p
L1014
100p
DNI
L1012
0.5p
L1010
82n
L1006
L1003
82n
L1029
DNI
R1002
2.2K
U1001
31
30
29
44
43
42
41
40
39
38
73 63 53
16
15
41 31 21 11 01
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
32
3
42
2
52 62 72 82
1 DCS_PCS_IN
11DNG
01DNG
9DNG
8DNG
GND1
7DNG
GSM_IN
6DNG
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
EDOM
WCDMA3
PGND4
PGND5
PGND6 PMET
4XR
3XR
2XR
1XR
WCDMA1
WCDMA2
7DNGP
8DNGP
9DNGP PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
L1026
DNI
C1064
22p
12
R1019
33p
C1090
1575.42 MHz
FL1006
5 2
4 1
3
G3
IN OUT
G1 G2
L1041
DNI
8101R
001
ANT1004
L1032
0.75p DNI
L1033
L1039
3p
C1097
33p
R1016
62
001
7101R
C1043 1n
C1065
100p
C1066
0.1u
7401C
n01
C1005
68p
C1100
0.1u
RTR6285_SSBI
GPS_MODE
RX0_Q_P
RX0_Q_M
RX0_I_M
RX0_I_P TX_Q_M
TX_Q_P
TX_I_M
TX_I_P
DAC_REF
PA_R0
PA_ON0
PA_ON1
TX_ON
GSM_PA_RAMP
TCXO_RTR_19.2MHZ
ANT_SEL3
ANT_SEL0
ANT_SEL2
ANT_SEL1
GND
RX1_Q_P
RX1_Q_M
RX1_I_P
RX1_I_M
VREG_SMPS_2.1V|VSNS_RF_SMPS
VSNS_RF_SMPS
PA_R1
RX_PCS_P
RX_PCS_P
RX_DCS_P
RX_DCS_P
RX_GSM_900_P
RX_GSM_900_P
RX_GSM_850_P
RX_GSM_850_P
WCDMA_900_TX_OUT
WCDMA_900_TX_OUT
WCDMA_900_RTX
WCDMA_900_RTX
PNI_XIM_0012BW
WB2100_MIX_INP
MNI_XIM_0012BW
WB2100_MIX_INM
RX_WCDMA_900_M
RX_WCDMA_900_M
RX_WCDMA_900_P
RX_WCDMA_900_P
PDET_IN
PDET_IN
RX_WCDMA_2100
RX_WCDMA_2100
RX_GSM_850_M
RX_GSM_850_M
RX_GSM_900_M
RX_GSM_900_M
RX_DCS_M
RX_DCS_M
RX_PCS_M
RX_PCS_M
WCDMA_2100_RTX
WCDMA_2100_RTX
GSM_TX
GSM_TX
DCS_PCS_TX
DCS_PCS_TX
GPS_IN
GPS_IN
WCDMA_2100_TX_OUT
WCDMA_2100_TX_OUT
0.5mm
1mm
8 06 1
HIGH HIGH
Near to 4 Pin
0603
Near to 12 Pin Near to 12 Pin
Near To RTR
Near To LNA
5001
0603
0603
0603
0603
0603
0603
0603
0603
W1700 LOW
5001
0603
WCDMA RX 2100 LNA Circuit
W2100 RX(2110 - 2170 MHz)
LNA for the GPS
WCDMA Triple
W900
W2100
W2100 TX(1920 - 1980 MHz)
BAND 1/2
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
LOW
HIGH
LOW
GSM900(880-915MHz)
HIGH
HIGH
HIGH
DCS1800/PCS1900 TX
+2.7V
GSM850/GSM900 TX
PCS1900 RX
HIGH
1%
GSM850(824-849MHz)
+2.1V
HIGH
HIGH
LOW
LOW
LOW LOW
HIGH
HIGH
7dB
HIGH
HIGH
LOW(X)
W900(W850)
EUSY0344001
LOW(X)
LOW(X)
GSM(869-894 MHz)
LOW(X)
LOW
GSM(925-960 MHz)
PCS(1930-1990 MHz)
DCS(1805-1880 MHz)
LOW
11dB
2mm
LOW
LOW LOW LOW
LOW HIGH HIGH
LOW
ANTENNA SWITCH MODULE LOGIC(SKY77544)
LOW
ANT_SEL3
0.5mm
VDDA2 : Pin 1,7,8,21,25,27,37,43,54,60,61,62 = +2.1V VDC
DCS1800 RX
GSM900 RX
ANT_SEL2 ANT_SEL1 ANT_SEL0
GSM850 RX
LOW
GSM Quad
VDDA1 : Pin 3,4,6,10,22,53 = +2.7V VDC
W2100
0603
0603
8061
Band 8
BAND2(2520) : ACMD-7407
SDMY0001901
BAND8(2520) : B7953 (SDMY0002801)
W900 TX(880 - 915 MHz)
Band 1
SDMY0002801
W900 RX(925 - 960 MHz)
0603
0603
0603
(RX_WCDMA_1900)
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
7. CIRCUIT DIAGRAM
7. CIRCUIT DIAGRAM
R200 15K
FB200 600
FB202 600
600 FB201
10p C224
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
ANT200 ANT201
2.2n
L205
15p
L201
3.3u L208
u7.4
302C
U201
4H 9D 5D 6E 9A 8D 8B 3C 6B 2E 2D 2C 2A 1G 3F 2F 1F 2H 1H 4E 5E 21P
11P
8P 11F
31G
01G
01F
21D
21E
01J
21K
31L
01K
11 D
01 D
0 1A
2 1 C
5P 4M 7J
R1
F13
F14
M5
N9 L5
P7
K11 N7
K14 L4
K13 N6
K9 M6
L9 L2
J8
H8 R4
G7 R2
L14 T2
L11 R7
M9 R6
L10 T7
T1
N8 P6
B11
A11 P10
H9 N12
M8 T12
M7 R13
P13
L8 T14
G6 N13
K8 N14
J9 R12
T11
M11 R11
M12 P14
M14 R14
M13 T13
T10
H12 R10
G12
E14 R8
C14 N10
D14 R9
C13 T8
D13 N11
G11 T9
H14 P9
G14
H3
P1 E3
N1 D4
N2 E8
N4 B9
N5 A8
A5
M2 A4
M1 A7
K4 C1
K1 E1
L6
K2
K5
K6
J5
H6
41B
01E
31E
31H 4P
21F 4T 1L 8G 5R 2P 7L 7K 6T 5T 3G 2G 4F 7C 7E 8C 5C 1A 1D 9C 5B 3A 6D
01M
21L
11C 6J 7H
01C
2 1A
31A
O CVD DV_TB
F TD DV_TB
FRDDV_TB
1ODDV_TB
2ODDV _ TB
FIDDV_TB
1CDDV_TB
2CDDV_TB
2P1_OCVDDV_FRW
2P1_XTDDV_FRW
2P1_XRDDV_FRW
2P1_PCDFPDDV_FRW
3P3_GAPDDV_FRW
3P3_AAPDDV_FRW
2P1_OLDDV_FRW
2P1_D D DV_FRW
2P1_BACDDV_FRW
2P1_ADDV_FRW
2 _2P 1 _D DV _L LPBB _ F RW
CDAXR_DDVA_EFA_FRW
XUA_DDVA_EFA_FRW
1_DS_OIDDV
2_DS_OIDDV
1_FR_OIDDV
2_FR_OIDDV
1OIDDV
2OIDDV
1DDV
2DDV
3DDV
LATX_DDV
52DDV_PTO
DDVANA_MF
OCVDDV_MF
LLPDDV_MF
XRDDV_MF
RF_SW_CTRL_N_0
RF_SW_CTRL_P_0
RF_SW_CTRL_N_1
RF_SW_CTRL_P_1
RF_SW_CTRL_N_3
RF_SW_CTRL_P_3
WRF_RFOUTP_G AMODE_TX_PU
WRF_RFOUTP_A GMODE_TX_PU
WRF_RFINP_G1 AMODE_EXT_LNA_GAIN
WRF_RFINP_A1 GMODE_EXT_LNA_GAIN
WRF_RFINN_A1_XFMR
WRF_RFINN_G1_XFMR WL_GPIO_0
WRF_RES_EXT WL_GPIO_1
WRF_EXTREFIN WL_GPIO_2
WRF_EXTCOUPLE_AIN WL_GPIO_3
WRF_AFE_TSSI_G WL_GPIO_8
WRF_AFE_TSSI_A
FM_TXADCIN2
VREF_LDO FM_TXADCIN1
VOUT_LNLDO1 FM_TXADCVCM
VOUT_LDO2 FM_TXP
VOUT_CLDO FM_TXN
VDD_LNLDO1 FM_RXP
VDD_LNLDO2 FM_RXN
VDD_CLDO FM_CVAR
FM_ADOUT2
SR_PALDO_1 FM_ADOUT1
SR_PALDO_2
SR_VDDNLDO BT_UART_TXD
SR_VLX1_1 BT_UART_RXD
SR_VLX1_2 BT_UART_RTS_N
SR_VDDBAT3_1 BT_UART_CTS_N
SR_VDDBAT3_2
SR_VDDBAT2 BT_TM0
SR_VDDBAT1_1 BT_TM1
SR_VDDBAT1_2 BT_TM3
SR_VSSPLDO BT_TM6
SR_PVSS_1
SR_PVSS_2 BT_SDA
SR_AVDD2P5 BT_SCL
SR_TESTSWG BT_RST_N
SR_PNPO BT_RFOP
BT_RFON
SDIO_CMD BT_REG_ON
SDIO_DATA_0
SDIO_DATA_1 BT_PCM_SYNC
SDIO_DATA_2 BT_PCM_OUT
SDIO_DATA_3 BT_PCM_IN
SDIO_CLK BT_PCM_CLK
UART_TX_0 BT_GPIO_0
UART_RX_0 BT_GPIO_1
BT_GPIO_2
TMS BT_GPIO_3
TDO BT_GPIO_4
TDI BT_GPIO_5
TCK BT_GPIO_6
TAP_SEL_0 BT_GPIO_7
TAP_SEL_1
JTAG_TRST_L WL_REG_ON
WL_RST_N
OSCIN
OSCOUT
XTAL_PU 1SSV
2SSV
3SSV
OCVSSV _ TB
FRSSV_TB
FISSV_TB
P FISSV _ TB
1CSSV_TB
2CSSV_TB
1TUO_XEOC_TB
0TUO_XEOC_TB
OCVSSV_MF
XRSSV_MF
LLPSSV_MF
FLDNGB_MF
SSVANA_MF
LATX_SSV
ODL_SSVA
SSVAP _RS
SSVA_RS
2TUO_O IP G _ F R W
1TUO_OIPG_FRW
PO_TSET_EFA_FRW
N O _ TSE T _E FA _ FRW
PI_TSET_EFA_FRW
NI_TSET_EFA_FRW
FERV_CDAQI_EFA_FRW
CDAXR_SSVA_EFA_FRW
1_3P3_AAPDNG_FRW
2_3P3_AAPDNG_FRW
3_3P3_GAPDNG_FRW
4_3P3_GAPDNG_FRW
2P1_XRDNG_FRW
2_2P1_XTDNG_FRW
2P1_DDNG_FRW
2P1_ADNG_FRW
2P1_BACDNG_FRW
2P1_OCVDNG_FRW
2P1_OLDNG_FRW
2P1_PCDFPDNG_FRW
2P1_DNG_LLPBB_FRW
u 7.4
9 2 2C
DNI
C221
u7.4
032C
402C
n022
V6.2_PMSM_GERV
C244 10p
15p C245
4.7u C235
10p C223
C239 220n
C232 3.3n
VREG_MSMP_2.6V
VDD_RADIO_PLL
VDD_BT
VDD_PLL
VDD_AFE
C234 0.1u
C231
u 0 1
822C
u1
C226 5p C225
0.1u
902C
u1.0
802C
u1.0
702C
u1.0
602C
u1.0
502C
n01
3 12 C
u 1.0
012C
u1
VDD_BT
C238
22p
C243 1u
002C
u1.0
202C
u1.0
C236
47p
10 2 C
u 1. 0
C242 220n
L206
47n
C233 1n
C237
47p
L207
100n
C211
0.1u
212C
p2.8
412C
u1.0
VDD_RADIO_PLL
VDD_CORE
VDD3.3V
+VPWR
VDD_2.5V
022C
DNI
C241
u1.0 u7.4
042C
VDD_FM
LLP_DDV
LLP_OIDAR_DDV
EROC_DDV
EFA_DDV
V3.3DDV
EROC_DDV
VDD_XTAL
LATX_DDV
V5.2_DDV
MF_DDV
600 FB203
V3.3DDV
C227 0.1u
U200
7
8
9
01 11 21
2
31
1
5 4 6
3 GND2
DDV
NE_ANL
TUO_XR
TX_IN
DNGP
GND1
XT_C
XR_C
TNA
C_BT
BT
GND3
C222
10p
912C
DNI
C248
1u
L209
3n
FL200 2450 MHz
3
2
1 IN DNG
OUT
DNI
C217
100p L202
DNI
C218
38.4MHz
KT3225L38400UCW28TA0
X200
3 2
4 1 GND1 VCC
GND2 OUT
302R
K001
U202
5
3 2
4 1 VOUT VIN
GND STBY DNGP
C246 100p
VDD_TCXO
VDD_TCXO
R201
0
C247
1u
+VPWR
006
402BF
V 6. 2 _P M SM _G E RV
V6.2_PMSM_GERV
SLEEP_CLK
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]
BT_RESET_N
WLAN_CMD
WLAN_CLK
BT_PCM_DIN
BT_PCM_DOUT
BT_HOST_WAKEUP
BT_UART_RTS
BT_UART_CTS
BT_UART_RXD
BT_UART_TXD
BT_PCM_SYNC
BT_PCM_CLK
BT_WAKEUP
WLAN_RESET_N
FM_R
FM_L
WLAN_HOST_WAKEUP
WLAN_WAKEUP
CLK_REQ
CLK_REQ
SW_BT_TX SW_BT_TX
XT_L
W_
WS
SW_WL_TX
X R_TB_ L
W _
WS
SW_WL_BT_RX
NIAG_NAL_TXE
EXT_LAN_GAIN
VDD_FM
GB_XR
RX_BG
TX_BT
TX_BT
TX_WLBG
TX_WLBG
V3.3DDV V3.3DDV
CLK_IN CLK_IN
FM_ANT
1%
WiFi&BT&FM(BCM43291)
0: SDIO / N.C : SPI
TP for TSSI Calibration
38.4MHz TCXO
LDO for TCXO
7. CIRCUIT DIAGRAM
K01 413R
D301
C303
47p
C308
10n
003R
K051
R310 33
103R
K003
VREG_MSMP_2.6V
603R
K01
C328
47p
C306
2.2n
1 13 C
Fu1
503R
K1
2K R313
403R
K02
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
u1.0
413C
u 1 .0
5 1 3C
u1.0
713C
0.1u
C304
u 1 . 0
61 3 C
C302
47p
VREG_MSMP_2.6V
100
R303
TP303
TP302
713R
00 1 001
813R
K 2 .2
7 03 R
19.2MHz
X300
4 2
3 1 VCONT OUT
GND VCC
C325
33n
VREG_TCXO_2.85V
0.1u
C324
C301
0.1u
C320 330p
TP301
U302
EUSY0408201
4 3
5 2
6 1 D VCC
CP NC
GND Q
VREG_MSMA_2.6V
VREG_MSMP_2.6V
Fu1
313C
C327
47p
C323
33p
R315
49.9
C307 330p
u1.0
813C
22u
C305
IND
903R
K001
613R
u 1 . 0
2 13 C
203R
15
0.1u
C319
R312
47
7.5p
C321 C322
7.5p
R319
1
TP305
TP306
TP307
TP300
0406
803R
SUBV_GHCV
C309 330p
003D
IND
C300
1n
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C310 0.1u
U301
3
2
4
1
5
VCC
GND
R311 100K
AXT614124
ENBY0045901
CN300
16 15
8 7
9 6
10 5
11 4
12 3
13 2
14 1
18 17
VREG_MSMP_2.6V
VCHG_VBUS
UAT300
12
11
10
9
8
7
6
5
4
3
2
1 GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G 2.5G
VBATT
MIC_BIAS
U300
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
U9
AF4
AE2
AB7
AE4
AE3
AD3
L2
L8
L3
L9
AD2
AC6
AC3
AC2
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
6M 8M 9M 8EA
7FA
8CA
6FA
7CA
6EA
11R
81BA
81W
11Y
71C
71B
61H
81H
71M
62G
01Y
11T
01W
61EA
8FA
61FA
5FA
31F
21C
21B
11H
11J
21H
21J
11E
21F
11F
21E
91EA
91FA
02BA
51C
61F
31H
41H
41J
31J
11C
41L
3F 2F 3E 2E 2D 5 2G
61L
91C
91B
91H
62F
02H
81J
71J
32 H
22F
32F
61 J
71E
51J
71 F
61 B
61C
51H
81B
52 B
12F
02B
0 2F
71H
02E
02C
81C
8 1F
B21
B22
C21
E21
C22
C24
E26
B24
F25
C26
D26
C23
B23
C25
D25
E23
W20
AD26
N17
T20
J25
M20
N25
V26
H26
L25
P20
U26
V19
AC25
U19
U20
AB23
W25
W26
R19
T19
W22
AC26
V23
AB26
AB25
AA23
AA25
Y26
Y23
T17
Y22
W23
AA26
V20
J26
K20
J20
J23
J22
K19
K26
L22
L19
L23
L20
M19
L26
M26
M22
M23
N26
N19
N20
P26
R26
P19
R25
T26
R22
R23
R20
T23
T22
U25
U23
U22
4C 6G 5G 6N 3N 2N 2W 6W 3M 8T 2K 3K 2J 3J 2H 3H 2G 3G 6R 2P 3P 2R 3R
11B
41FA
31FA
21FA
11FA
5BA
3BA
2BA
3AA
2AA 2Y
6AA 2M 3U
11W
9EA
9CA
6BA 3Y
71W
91BA
51E
41C
3 1C
51B
41B
31B 8H 6F 5F
01J
01H 9H
01C
01B 9C 9B 8F 8E 7F 7E 7C 7B 6C 5C 6B 5B
PI _ R_ E NIL
N I_ R _ENIL
PI_L_ENIL
NI_L_ENIL
P 1C I M
N1 C IM
P2CIM
N2CIM
P IX U A
NI X UA
PO_ENIL
NO _ EN I L
PO_1 R AE
NO_1RAE
TUOXUA
R _H P H
L_ H PH
PMOCC
S A I B_CI M
FERV_HPH
KLCSYS_YHPBSU
PD_YHPBSU
ND_YHPBSU
DI_YHPBSU
SUBV_YHPBSU
TXER_YHPBSU
N_NISER
N_TUOSER
NE_GODW
0_EDOM
1_EDOM
2_EDOM
3_EDOM
OXCT
JDA_OL_KRT
KLC_PEELS
IDT
SMT
N_TSRT
ODT
KCT
KCTR
P_ATAD_IDDM
N_ATAD_IDDM
P_BTS_IDDM
N_BTS_IDDM
KLCP_CDCL
P_TUO_I
N_TUO_I
P_TUO_Q
N_TUO_Q
FER_CAD
0HC_PI_I
0HC_MI_I
0HC_PI_Q
0HC_MI_Q
1HC_PI_I
1HC_MI_I
1HC_PI_Q
1HC_MI_Q
NO_XT
JDA_CGA_XT
0 N O_AP
0EGNAR_AP
LTC_RWP_AP
M_ L TC_RWP _ A P
FER_GB_MSG
0NI AK H
1NIAKH
2NIAKH
EBI1_DQ_0
EBI1_DQ_1
EBI1_DQ_2
EBI1_DQ_3
EBI1_DQ_4
EBI1_DQ_5
EBI1_DQ_6
EBI1_DQ_7
EBI1_DQ_8
EBI1_DQ_9
EBI1_DQ_10
EBI1_DQ_11
EBI1_DQ_12
EBI1_DQ_13
EBI1_DQ_14
EBI1_DQ_15
EBI1_DQ_16
EBI1_DQ_17
EBI1_DQ_18
EBI1_DQ_19
EBI1_DQ_20
EBI1_DQ_21
EBI1_DQ_22
EBI1_DQ_23
EBI1_DQ_24
EBI1_DQ_25
EBI1_DQ_26
EBI1_DQ_27
EBI1_DQ_28
EBI1_DQ_29
EBI1_DQ_30
EBI1_DQ_31
EBI1_ADR_0
EBI1_ADR_1
EBI1_ADR_2
EBI1_ADR_3
EBI1_ADR_4
EBI1_ADR_5
EBI1_ADR_6
EBI1_ADR_7
EBI1_ADR_8
EBI1_ADR_9
EBI1_ADR_10
EBI1_ADR_11
EBI1_ADR_12
EBI1_ADR_13
EBI1_CKE0
EBI1_CKE1
EBI1_DCLK
EBI1_DCLKB
EBI1_WE_N
EBI1_CS0_N
EBI1_CS1_N
EBI1_BA_0
EBI1_BA_1
EBI1_DQS_0
EBI1_DQS_1
EBI1_DQS_2
EBI1_DQS_3
EBI1_DM_0
EBI1_DM_1
EBI1_DM_2
EBI1_DM_3
EBI1_RAS_N
EBI1_CAS_N
EBI1_RESOUT_N
EBI1_CAL
EBI2_DATA_0
EBI2_DATA_1
EBI2_DATA_2
EBI2_DATA_3
EBI2_DATA_4
EBI2_DATA_5
EBI2_DATA_6
EBI2_DATA_7
EBI2_DATA_8
EBI2_DATA_9
EBI2_DATA_10
EBI2_DATA_11
EBI2_DATA_12
EBI2_DATA_13
EBI2_DATA_14
EBI2_DATA_15 0_R DA_ 2IBE
1_R D A_2IBE
2_RDA_2 I BE
3_RDA _ 2IBE
4 _R DA _ 2I B E
5 _R DA _ 2I BE
6 _ RDA_2IBE
7_RD A _2IBE
8 _R DA _ 2I BE
9 _R DA _ 2I BE
01_RDA_2IBE
11_RD A _2IBE
2 1 _R DA _ 2I BE
3 1 _R DA _ 2I BE
41_RDA_2IBE
51_RD A _2IBE
61 _R DA _ 2I B E
N_0SC_2IBE
N_1S C _2IBE
N _4 SC _ 2I B E
N_5SC_2IBE
N_6SC_2IBE
N_7S C _2IBE
KLC_2IBE
N_EW_2IBE
N_E O _2 I BE
N_BU_2IBE
N_BL_2IBE
N_0YSUB_2IBE
REPIW
RL_ST
LL_ST
RU_ST
LU_ST
231_OIPG
131_OIPG
031_OIPG
921_OIPG
821_OIPG
721_OIPG
621_OIPG
521_OIPG
421_OIPG
321_OIPG
221_OIPG
121_OIPG
021_OIPG
911_OIPG
811_OIPG
711_OIPG
611_OIPG
511_OIPG
411_OIPG
311_OIPG
211_OIPG
111_OIPG
011_OIPG
901_OIPG
801_OIPG
701_OIPG
601_OIPG
501_OIPG
401_OIPG
301_OIPG
201_OIPG
101_OIPG
001_OIPG
99_OIPG
89_OIPG
79_OIPG
69_OIPG
59_OIPG
49 _ OI P G
39_OIPG
29_OIPG
19 _ OI P G
09_OIPG
98_OIPG
8 8 _O I PG
78_OIPG
68_OIPG
5 8 _O I PG
GPIO_0
GPIO_1
GPIO_2
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
GPIO_18
GPIO_19
GPIO_20
GPIO_21
GPIO_22
GPIO_23
GPIO_24
GPIO_25
GPIO_26
GPIO_27
GPIO_28
GPIO_29
GPIO_30
GPIO_31
GPIO_32
GPIO_33
GPIO_34
GPIO_35
GPIO_36
GPIO_37
GPIO_38
GPIO_39
GPIO_40
GPIO_41
GPIO_42
GPIO_43
GPIO_44
GPIO_45
GPIO_46
GPIO_47
GPIO_48
GPIO_49
GPIO_50
GPIO_51
GPIO_52
GPIO_53
GPIO_54
GPIO_55
GPIO_56
GPIO_57
GPIO_58
GPIO_59
GPIO_60
GPIO_61
GPIO_62
GPIO_63
GPIO_64
GPIO_65
GPIO_66
GPIO_67
GPIO_68
GPIO_69
GPIO_70
GPIO_71
GPIO_72_GRFC_9
GPIO_73_GRFC_8
GPIO_74_GRFC_7
GPIO_75_GRFC_6
GPIO_76_GRFC_5
GPIO_77_GRFC_4
GPIO_78_GRFC_3
GPIO_79_GRFC_2
GPIO_80_GRFC_1
GPIO_81_GRFC_0
GPIO_82
GPIO_83
GPIO_84
SD_MMC_CLK
SD_MMC_CMD
SD_MMC_DATA[0]
SD_MMC_DATA[1]
SD_MMC_DATA[2]
SD_MMC_DATA[3]
TNI_HCUOT
CAM_PCLK
CAM_MCLK
P1_CIM
N_VCR
P _VC R
R_HPH
L_HPH
CAM_VSYNC
CAM_HSYNC
SD_MMC_DET
AUDIO_I2C_SCL
AUDIO_I2C_SDA
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[0]
KLC_PEELS
REMOTE_PWR_ON
REMOTE_PWR_ON
TCXO_PM_19.2MHZ
PS_HOLD
PM_INT_N
FER_CAD_AP_MSG
TUO_XUMA
OXCT_CIMP
PMIC_TCXO
NE_OXCT
TCXO_EN
IBSS_CIMP
JTAG_PS_HOLD
MUIC_INT
RTR6285_SSBI
GPS_MODE
P_ Q _0X R
M_Q_0XR
M_I_0XR
P_I_0XR
M_Q_XT
P_Q_XT
M_I_XT
P_I_XT
FER_CAD
0R_AP
0NO_AP
PA_ON1
NO_XT
PMAR_AP_MSG
TCXO_RTR_19.2MHZ
ANT_SEL3
ANT_SEL0
ANT_SEL2
ANT_SEL1
MOTION_I2C_SDA
MOTION_I2C_SCL
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]
JDA_OL_KRT
TRK_LO_ADJ
COMPASS_DRDY
ADS_C2I_LB_DCL
LCS_C2I_LB_DCL
CAM_PWDN
CAM_RESET_N
SDRAM_CKE1
N_TESER_TB
N_TESER_DCL
CAM_I2C_SDA
CAM_I2C_SCL
NTSRT_MSM
MSM_TRSTN
WLAN_CMD
WLAN_CLK
KLCSYS_HBSU
USBH_SYSCLK
nSDRAM_CS0
SDRAM_DATA[16]
SDRAM_DATA[0]
SDRAM_DATA[1]
SDRAM_DATA[2]
SDRAM_DATA[3]
SDRAM_DATA[4]
SDRAM_DATA[5]
SDRAM_DATA[6]
SDRAM_DATA[7]
SDRAM_DATA[8]
SDRAM_DATA[9]
SDRAM_DATA[10]
SDRAM_DATA[11]
SDRAM_DATA[12]
SDRAM_DATA[13]
SDRAM_DATA[14]
SDRAM_DATA[15]
SDRAM_DATA[17]
SDRAM_DATA[18]
SDRAM_DATA[19]
SDRAM_DATA[20]
SDRAM_DATA[21]
SDRAM_DATA[22]
SDRAM_DATA[23]
SDRAM_DATA[24]
SDRAM_DATA[25]
SDRAM_DATA[26]
SDRAM_DATA[27]
SDRAM_DATA[28]
SDRAM_DATA[29]
SDRAM_DATA[30]
SDRAM_DATA[31]
LCD_BL_EN
LCS_C2I_HCUOT
ADS_C2I_HCUOT
BT_PCM_DIN
BT_PCM_DOUT
LIN_PWM_FREQ
BT_HOST_WAKEUP
BT_UART_RTS
BT_UART_CTS
BT_UART_RXD
BT_UART_TXD
BT_PCM_SYNC
BT_PCM_CLK
RTR_TRK_LO_ADJ
RTR_TRK_LO_ADJ
BT_WAKEUP
N_TESER_NALW
R_MF
L_MF
MOTION_INT
SDRAM_ADDR[0]
SDRAM_ADDR[1]
SDRAM_ADDR[10]
SDRAM_ADDR[11]
SDRAM_ADDR[12]
SDRAM_ADDR[2]
SDRAM_ADDR[3]
SDRAM_ADDR[4]
SDRAM_ADDR[5]
SDRAM_ADDR[6]
SDRAM_ADDR[7]
SDRAM_ADDR[8]
SDRAM_ADDR[9]
SDRAM_BA0
SDRAM_BA1
nSDRAM_CAS
SDRAM_DCLK0
SDRAM_DCLK1
SDRAM_DQM0
SDRAM_DQM1
SDRAM_DQM2
SDRAM_DQM3
SDRAM_DQS0
SDRAM_DQS1
SDRAM_DQS2
SDRAM_DQS3
nSDRAM_RAS
nSDRAM_WE
Y DAE R_HSALF_DNAN
SC_ HSA L F _DNANn
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
EBI2_DATA[9]
nRESETOUT
KCTR_MSM
MSM_RTCK
TUOSER_GATJn
TUOSER_GATJn|TSR_NOPn
nJTAG_RESOUT
TSR_NOPn
KCT_MSM
MSM_TCK
IDT_MSM
MSM_TDI
ODT_MSM
MSM_TDO
SMT_MSM
MSM_TMS
SDRAM_ADDR[13]
PUEKAW_TSOH_NALW
nSDRAM_CS1
BL_DNANn
EO_DNANn
BU_DNANn
EW_DNANn
SDRAM_CKE0
SR _ D C L
SC _DC L
EAR_SENSE
N 1 _CI M
GND|MIC_1N
PUEKAW_NALW
O_CNYSV_DCL
RF_BAND_CHECK
KCEHC_DNAB_FR
N O_EN I L
PO_ENIL
MD_HBSU
PD_HBSU
MUIC_I2C_SDA
MUIC_I2C_SCL
KEY_ROW[1]
KEY_ROW[0]
KEY_COL[0]
KEY_COL[1]
P_Q_1XR
M_Q_1XR
P_I_1XR
M_I_1XR
P_CIMRAE
XT_TRAU
UART_TX
UART_TX
UART_TX
XR_TRAU
UART_RX
UART_RX
UART_RX
ADS_C2I_SSAPMOC
LCS_C2I_SSAPMOC
MSM_USIM_CLK
MSM_USIM_RST
MSM_USIM_DATA
CDA_KOOH
HGIH_DIREKAM_DCL
1R_AP
150K
150K
150K
RC Filter of CAM_MCLK close to MSM
1.30V
ADC
150K
R2
2.13V 150K
150K
BAND
1.93V
2100 + 850
2100 + 900
1900 + 850 680K
100K
1.73V 300K
R1
1.04V
430K
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
NEST JIG
2010.01.18 updated
1.0T
ARM9&ARM11 JTAG
TCXO Circuit
Clesed to TCXO
Clesed to NC7SZ74L8X
Array TP
ARM9&ARM11 JTAG
GPS D FLIP-FLOP
MPM Port
(MIC_1N)
MODE[3:0]
0001 : Native, ARM9 + ARM11 on PJTAG
7. CIRCUIT DIAGRAM
DNI
R405
DNI
R404
TP402
TP403
R402 K01
VREG_MSMC1_1.25V
VREG_MSME_1.8V
VREG_MSME_1.8V
VREG_MSME_1.8V
304R
K001
TP400
TP401
TP404
TP405
V8.1_E
MS
M_GERV
V6.2_P
MS
M_GERV
V8.1_E
MS
M_GERV
VREG_MSMC1_1.25V VREG_MSME_1.8V VREG_MSMC2_1.25V VREG_MSMA_2.6V VREG_MSMP_2.6V
124C
u22 u01
724C
VSNS_MSME_1.8V
VSNS_MSMC1_1.25V
VSNS_MSMC2_1.25V
VREG_MSMA_2.6V
VREG_MSMC1_1.25V
VREG_MSMC2_1.25V
VREG_MSME_1.8V
VREG_MSMP_2.6V
V9.2_2XUA_GERV
V6.2_A
MS
M_GERV
V3.3_BSU
U401
01R
9R 2R 1R 01A
9A 2A 01P
1P 4M 1G 3F 01B
2B 1B
E5
H7 N5
G5 B5
J7
E7 G9
F8 F10
G6 E9
J8 D10
H2 C9
G2 N9
K1 M10
E3 L9
H8 K9
G8 J10
J2
M1
C7 P8
C8 H10
D7 H1
D8 D1
D6 B8
E8
D5 M2
F6 P9
F7 J1
E6 H9
H4 C1
H3 B9
F5 G10
E4 F9
F4 E10
G4 D9
G3 C10
J4 N10
H5 M9
H6 L10
J5 K10
J6 J9
G7 P6
K6 C5
K5
K7 C6
L8 C3
K8 C4
L7 B4
L6 B7
L5 B3
L4 B6
K2 N8
J3 M7
M3 N7
F1 P5
F2 P4
K3 N4
D4 P3
E2 P2
D3 M8
E1 N6
D2 M6
C2 P7
L3 M5
L2 N3
L1 N2
K4 N1 IO0 A0
IO1 A1
IO2 A2
IO3 A3
IO4 A4
IO5 A5
IO6 A6
IO7 A7
IO8 A8
IO9 A9
IO10 A10
IO11 A11
IO12 A12
IO13 A13
IO14 BA0
IO15 BA1
_CE DQ0
_RE DQ1
_WEN DQ2
CLE DQ3
ALE DQ4
_WP DQ5
R_B DQ6
DQ7
VSSN1 DQ8
VSSN2 DQ9
VSSQ1 DQ10
VSSQ2 DQ11
VSSQ3 DQ12
VSSQ4 DQ13
VSSQ5 DQ14
VSSQ6 DQ15
VSSQ7 DQ16
VSSQ8 DQ17
VSSQ9 DQ18
VSSQ10 DQ19
VSS1 DQ20
VSS2 DQ21
VSS3 DQ22
VSS4 DQ23
VSS5 DQ24
VSS6 DQ25
DQ26
VDD1 DQ27
VDD2 DQ28
VDD3 DQ29
VDD4 DQ30
VDD5 DQ31
VDD6
_CS
VDDQ0 CLK
VDDQ1 _CLK
VDDQ2 CKE
VDDQ3 _WED
VDDQ4 _RAS
VDDQ5 _CAS
VDDQ6 DQM0
VDDQ7 DQM1
VDDQ8 DQM2
VDDQ9 DQM3
DQS0
VCCN1 DQS1
VCCN2 DQS2
DQS3
1CN
2CN
3CN
4CN
5CN
6CN
7CN
8CN
1UND
2UND
3UND
4UND
5UND
6UND
7 UN D
C402
2.2u
004R
0
U300
L5
E10
AE22
AD25
AE18
AE15
AE11
AE7
Y5
T5
H25
E25
E22
Y25
V25
T25
P25
M25
K25
AE12
AC10
AC5
Y8
AF26
AF25
AF3
AF2
AE26
AB11
Y20
W19
U17
U11
P23
N23
M11
L17
L12
K23
K9
J19
G23
E19
C2
B26
B3
B2
T2
R8
R5
P9
N8
K6
K5
J6
J5
F9
E6
C8
C3
U6
T6
T3
R9
P8
P5
N9
K8
J9
J8
H6
H5
E9
E5
D3
B8
AE13
AE5
AB14
AB10
AA22
Y19
Y6
V22
U14
T16
T15
T14
T13
T12
R17
R16
R15
R14
R13
R12
P22
P17
P16
P15
P14
P13
P12
P11
P6
N22
N16
N15
N14
N13
N12
M16
M15
M14
M13
M12
L15
L13
L6
K22
G22
F19
F15
F10
E14
B4
7GA
6GA
5GA
4GA
3GA
72GA
62GA
52GA
42GA
32GA
22GA
12GA
02GA
2GA
91GA
81GA
71GA
61GA
51GA
41GA
3 1GA
21GA
11GA
0 1GA
1GA
72FA
1 FA
72EA
1EA
7 2 DA
1DA
72CA
1CA
72BA
1BA
7 2A A
1AA
72A
62A
5 2A
42A
32A
2 2A
1 2A
02A
91A
8 1A
7 1A
61A
5 1 A
4 1A
3 1A
21A
1 1 A
0 1A
9A 8A 7A 6A 5A 4A 3A 2A 1A
61E
41F
5AA
22H
11N 5N
81E
31E 5U 9T
72Y 1Y
72W 1W
72V 1V
72U 1U
72T 1T
72R 1R
72P 1P
72N 1 N
72M 1M
72L 1 L
72K 1K
72 J 1 J
72H 1H
72 G 1 G
72F 1F
72 E 1 E
72D 1D
72C 1C
72B 1B
9GA
8GA
56_CN
66_CN
76 _ CN
8 6 _C N
96_CN
07_CN
1 7_ C N
27_CN
37_CN
4 7 _C N
5 7_ C N
67_CN
77_CN
8 7 _C N
9 7_ C N
08_CN
18_CN
2 8 _C N
38_CN
48 _ CN
58_CN
68_CN
78_CN
88 _ CN
98_CN
09_CN
19_CN
29_CN
39_CN
49_CN
59_CN
69_CN
79_CN
8 9_ C N
99_CN
001_CN
1 01 _ CN
201_CN
301_CN
4 0 1_ C N
1DVSR
2DVSR
8P_DDV
9P_DDV
01P_DDV
GRP_ESUFQ_DDV
1C_SNS_DDV
2C_SNS_DDV
6P2_YHPBSU_DDV
3P3_YHPBSU_DDV
1 _CN
2 _CN
3_C N
4_ CN
5 _CN
6 _CN
7_ CN
8_ CN
9_CN
0 1_ CN
1 1_ CN
21_C N
31_C N
4 1_ CN
5 1_ CN
61_C N
71_C N
8 1_ CN
9 1 _CN
02_C N
12_C N
2 2 _CN
3 2 _CN
42_C N
52_C N
62_CN
72_CN
8 2_ CN
92_CN
03_CN
1 3_ CN
23_CN
33_CN
4 3 _CN
53_CN
63_CN
7 3_ CN
83_CN
93_CN
0 4_ CN
14_CN
24_CN
34_CN
44_CN
54_CN
64_CN
74_CN
84_CN
94_CN
05_CN
15_CN
25_CN
35_CN
45_CN
55_CN
65_CN
75_CN
85_CN
95_CN
06_CN
16_CN
26_CN
36_CN
46_CN
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
GND38
GND39
GND40
GND41
GND42
GND43
GND44
GND45
GND46
GND47
GND48
GND49
GND50
GND_A1
GND_A2
GND_A3
GND_A4
GND_A5
GND_A6
GND_A7
GND_A8
GND_A9
GND_A10
GND_A11
GND_A12
GND_A13
GND_A14
GND_A15
GND_A16
VDD_A1
VDD_A2
VDD_A3
VDD_A4
VDD_A5
VDD_A6
VDD_A7
VDD_A8
VDD_A9
VDD_A10
VDD_A11
VDD_A12
VDD_A13
VDD_C1_1
VDD_C1_2
VDD_C1_3
VDD_C1_4
VDD_C1_5
VDD_C1_6
VDD_C1_7
VDD_C1_8
VDD_C1_9
VDD_C1_10
VDD_C1_11
VDD_C1_12
VDD_C1_13
VDD_C1_14
VDD_C1_15
VDD_C1_16
VDD_C1_17
VDD_C1_18
VDD_C1_19
VDD_C1_20
VDD_C1_21
VDD_C1_22
VDD_C1_23
VDD_C1_24
VDD_C2_1
VDD_C2_2
VDD_C2_3
VDD_MDDI
VDD_P1_1
VDD_P1_2
VDD_P1_3
VDD_P1_4
VDD_P1_5
VDD_P1_6
VDD_P2_1
VDD_P2_2
VDD_P2_3
VDD_P3_1
VDD_P3_2
VDD_P3_3
VDD_P3_4
VDD_P3_5
VDD_P3_6
VDD_P4_1
VDD_P4_2
VDD_P7_1
VDD_P7_2
C408
1n
1n
C404
0 24 C
u1 . 0
R401 IND
C409
0.1u
C403
0.1u
VREG_MSME_1.8V
0.1u
C407 C406
0.1u 2.2u
C405
534C
n1
034C
n1
334C
n01
924C
n01
434C
u1.0
234C
u1.0
524C
n01
8 24 C
u 1 .0
624C
n1
224C
n1
814C
n1
51 4 C
n01
424C
u1.0
324C
u1.0
914C
u1 . 0
6 14 C
u 1 . 0
414C
n1
21 4 C
n1
3 14 C
n0 1 u2 2
0 14 C
114C
n 01
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
C401 0.1u
C400 0.1u
u0 1
7 14 C
134C
u01
VREG_MSME_1.8V|VSNS_MSME_1.8V
VREG_MSMC2_1.25V|VSNS_MSMC2_1.25V
IBSS_5826RTR
PMAR_AP_MSG
JDA _O L_KRT
SDRAM_CKE1
KL CSYS _HBSU
nSDRAM_CS0
SDRAM_DATA[16]
SDRAM_DATA[0]
SDRAM_DATA[1]
SDRAM_DATA[2]
SDRAM_DATA[3]
SDRAM_DATA[4]
SDRAM_DATA[5]
SDRAM_DATA[6]
SDRAM_DATA[7]
SDRAM_DATA[8]
SDRAM_DATA[9]
SDRAM_DATA[10]
SDRAM_DATA[11]
]21[ATAD_MARDS
SDRAM_DATA[12]
SDRAM_DATA[13]
SDRAM_DATA[14]
]51[ATAD_MARDS
SDRAM_DATA[15]
SDRAM_DATA[17]
]81[ ATAD_ MARDS
SDRAM_DATA[18]
SDRAM_DATA[19]
SDRAM_DATA[20]
SDRAM_DATA[21]
SDRAM_DATA[22]
SDRAM_DATA[23]
SDRAM_DATA[24]
]5 2[ ATAD_MAR DS
SDRAM_DATA[25]
SDRAM_DATA[26]
SDRAM_DATA[27]
SDRAM_DATA[28]
SDRAM_DATA[29]
SDRAM_DATA[30]
SDRAM_DATA[31]
SDRAM_ADDR[0]
SDRAM_ADDR[1]
SDRAM_ADDR[10]
SDRAM_ADDR[11]
SDRAM_ADDR[12]
SDRAM_ADDR[2]
SDRAM_ADDR[3]
SDRAM_ADDR[4]
SDRAM_ADDR[5]
SDRAM_ADDR[6]
SDRAM_ADDR[7]
SDRAM_ADDR[8]
SDRAM_ADDR[9]
SDRAM_BA0
SDRAM_BA1
nSDRAM_CAS
SDRAM_DCLK0
SDRAM_DCLK1
SDRAM_DQM0
SDRAM_DQM1
SDRAM_DQM2
SDRAM_DQM3
SDRAM_DQS0
SDRAM_DQS1
SDRAM_DQS2
SDRAM_DQS3
nSDRAM_RAS
nSDRAM_WE
NAND_FLASH_READY
nNAND_FLASH_CS
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
]9[AT AD_2I BE
EBI2_DATA[9]
nRESETOUT
SDRAM_ADDR[13]
VREG_MSMC1_1.25V|VSNS_MSMC1_1.25V
nSDRAM_CS1 SDRAM_CS1_N_4G
SDRAM_CS1_N_4G
SDRAM_CKE1_4G
SDRAM_CKE1_4G
nNAND_LB
nNAND_OE
nNAND_UB
nNAND_WE
SDRAM_CKE0
MD _HBSU
P D_HBS U
For Artwork
For Artwork
DDR SDRAM
NAND 4G / SDRAM 2G
2cs only
2cs only
8061
8061
80 6 1
8061
chip sel1 + clk1 Should be NC 4G/4G
MSM7227 Power Part
Cap for MSM7227 Power
Hynix
u 2 2 > - u 0 1 D . v e R AFF
8061
7. CIRCUIT DIAGRAM
R514
10
VREG_HPVDD_1.8V
C531
100u
MAX14528
U503
EUSY0374601
9 6
5 3
4
8 2
7 1 IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
DNG
DNGP
22p
C561
HS_MIC_BIAS
C562
1u
EUSY0407201
U500
5
3 2
4 1 VOUT VIN
GND STBY DNGP
USB_3.3V
HS_MIC_BIAS_TEMP
1u
C571
C502
1n
+VPWR
4.7u L504
L503 4.7u
4.7u L502
K 05 1
2 0 5R
VREG_MSMP_2.6V
2.2u C535
VREG_MSME_1.8V
R504
47K
VREG_LCD_1.8V
C546
1u
SC500
1
104DZ
C507 DNI
L501 4.7u
C528
4.7u
DNI C536
K1
305R
4.7K
R531
DNI C508
C516
1u
+VPWR
CM315_12_5PF
X500
32.768KHz 2
1
0.1u C549
VREG_MSME_1.8V
10u C519
C540
2.2u
VREG_TOUCH_3.0V
VREG_RF_2.7V
M_SNSI
U501
EUSY0342201
PM7540
9J 8J 7J 6J 5J 9H 8H 7H 6H 5H 9G 8G 7G 6G 5G 9F 8F 7F 6F 5F 9E 8E 7E 6E 5E
H1
E10 F1
F10 E1
C12 N2
B1
M12 B2
K7
A5
N13 A4
M13 B5
B4
G10 A7
D9 A6
H12 B7
B6
C13
A13 D10
A12 K10
H10
G12 J10
G1
M1 K4
D13 J4
E12 H4
N11 M2
A3 L2
A10 H2
A8
H13 K2
G13 J2
A11 G4
K13 F4
E13 D5
B13 B3
A9 M5
N12 N3
J13 N1
A2 M3
K6
M4 K5
N4 K9
M9 K8
N10 M11
M6 L12
N6 A1
M8 D4
N8 B12
J1 D8
K1 N5
M7
2G
21D 7D 8B
01M 6D 9B
21J
31F
21F
21K 7N 9N
01B
31L
11B 2F 4E 2C 1C 1D 1L 2D 2E
GHCV
N_LTC_GHC
S UBV _BSU
N_LTC_BSU
P_SNSI
M_SNSI
N _ TE F _ TAB
TABV
NIOCV
PUKCAB_V
ANA_DDV
E_1C_DDV
AP_2C_DDV
2PG_DDV
6PG_DDV
2EMSM_DDV
PMSM_DDV
1FR_DDV
2FR_DDV
MIUR_DDV
RKPS_L_DDV
RKPS_R_DDV
OXCT_DDV
NALW_DDV MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1DN G
2DNG
3 D N G
4DNG
5DNG
6 D N G
7 D N G
8DNG
9DNG
01DNG
11DNG
21DNG
31DNG
41DNG
51DNG
61DNG
71DNG
81DNG
91DNG
02DNG
12DNG
22DNG
32DNG
42DNG
52DNG
121K R509
D501
0.1u C514
CN501
11
10
9
5
4
3
2
1
8
7
6
1n C517
22p C515
VREG_TCXO_2.85V
C513 0.1u
C512 0.1u
10 5 R 10K
0.1u
C534
51 R510
1n
C524
2.2u
C537
C568
33p
2.2u
C539
C521
1n
C569
10n
C544
2.2u
VBATT
KQ03LV-3R
ENZY0030401
CN500
3
2
1
D1
D2
0.1u
C560
C532 10n
VREG_MSMC1_1.25V
10K
R520
VCHG_VBUS
u 00 1
4 55 C
R515
200K
VCHG_VBUS
VBATT
Q500 NUS5530MN
EQFP0008601
5
6 4
7 3
8 2
9 1
10 DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
1n
C523
1.0
605R
0.1u
C555
VREG_MSMP_2.6V
715R
K6.08
VREG_MSMP_2.6V
1n C518
0.1u C511
VREG_RUIM_3.0V
2.2u
C509
C526
4.7u
C547
2.2u
C538
2.2u
0.1u C510
VREG_MSMA_2.6V
+VPWR
TP503
2.2K
R523
VCHG_VBUS
0.1u C559
4.7u
C527
1u
C548
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C522
1n
1u
C545
EUSY0372001
TS5USBA33402YZPR
U504
4B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1B
YLPPUSV
UART_TX VBUS
UART_RX DM
DP
USB_DM ID
USB_DP
AUDIO_L R2_2K
AUDIO_R
MIC
DSS
_INT
SDA CLDO
SCL
GND TESI
10u
C520
4.7K 425R
BAT500
ZD502
VREG_MSMP_2.6V
4.7u
C542
0.1u C506 R500
4.7
22u
C525
C543
2.2u
VREG_MMC_3.0V
TP502
0.1u C505
4.7u
C541
0.1u C504
C503 0.1u
C500 22p
C501 0.1u
VREG_AUX2_2.9V
VREG_MOTION_3.0V
VREG_LCD_2.8V
C570
33p
C566
1u TP501
035R
K 00 3
VBATT
VCHG_VBUS
22p
C564
FL500
IN OUT
GND1 GND2
0.1u
C556
R505
1K
470K
R516
K086
125R
D500
+VPWR
L500
2.2u
+VPWR_AUDIO
10u C530
1n C529
VREG_MSMP_2.6V
2.2K
625R
2.2K
525R
USIM_CLK
USIM_DATA
KEY_LED_DRV_N
SLEEP_CLK
REMOTE_PWR_ON
TCXO_PM_19.2MHZ
PS_HOLD
PM_INT_N
GSM_PA_DAC_REF
AMUX_OUT
PMIC_TCXO
TCXO_EN
PMIC_SSBI
PM_ON_SW
JTAG_PS_HOLD
VBACK_UP
P U _K CABV
USB_LDO_EN
USB_LDO_EN
PCB_REVISION
PCB_REVISION
CHG_CTL_N
N_LTC_GHC
BATT_FET_N
N_TEF_TTAB
ISNS_P
P_SNSI
VBAT_TEMP
VBAT_TEMP
USB_ID
USB_ID
USB_DM
USB_DM
USB_DP
USB_DP
MUIC_INT
VSNS_MSME_1.8V
VSNS_MSMC2_1.25V
nPON_RST
VSNS_MSMC1_1.25V
VBAT_SENSE
VBAT_SENSE
USBH_DM
USBH_DP
MUIC_I2C_SDA
MUIC_I2C_SCL
USIM_RST
UART_TX
UART_RX
MSM_USIM_CLK
MSM_USIM_RST
MSM_USIM_DATA
R
WPV +
+VPWR
OVP
1.30V
close to MSM
USB 3.3V LDO
150K
150K
150K
ADC
150K
TEST&E
150K
0.5mm
R2
2.13V
10K
68K
47K
150K
150K
REV
1.93V
C&H
B&G
1%
Local Ground Plan
PM7540
A&F
Rev.1.1
150K
150K
PCB Revision Check ADC
Route together
0.16V
Rev.1.0
D&I
0.6mm
Rev.1.2 680K
0.81V
0.6mm
100K
1.73V
0.62V
300K
R1
0.6mm
1.04V
430K
Route together
Place close to PM7540 pins
BACK-UP BATTERY
2mm
Battery Conn.
MicroUSB
MUIC
2mm
PMIC
1608
close to each other
mm5.0 9N ,7N
0.3mm 0.3mm
2mm
1608
Charging IC
10V
2mm 1%
ISNS_M
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
7. CIRCUIT DIAGRAM
TP602
R630
47 CN600
2
1
026C
u2.2
U600
3D 1C 2E 2A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4D 2D
DDVPH
DDVPS IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
SAIB
DDVPC
SSVPC
DNG
C639
10u
C636
0.1u
HS_MIC_BIAS_TEMP
0.1u
C605
u2.2
12 6C
2.2u
C614
u2.2
226C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33n C613
R628
DNI
U604
12
11
10
9
5
4
6
3
7
2
8
1
DDVD
GERV
ADNG
SDNG
DDVA
ADDR
SCL
NC1
TNI
VPP
DRDY
SDA
R623
1K
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
R610 K7.4
R609 K7.4
VREG_MSMP_2.6V
206R
IND
C634
0.1u
C637
DNI
MIC600
4
3
2
1 P
G1
G2
O
VA603
C601
33n C612
VA604
DNI
Q601
C
B
E
FB601 600
506R
K2.2
OJ601
R629 47K
OJ600
VA602
FB602 600
HS_MIC_BIAS
100K R627
R613
100K U601
B2 C1
A1 B1
B3 C2
A3 C3 IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
1800 FB606
TP600
R619 K2.2
R620 K2.2
VREG_MOTOR_3.3V
C617
33p
C627
10n
C608
1n
C624
10u
VREG_MOTION_3.0V
U603
61
7 6
5
4
8
3
9
2
10
1
11
12
13
41 51
2DEVRESER
DDV
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1 ODS_IDS_ADS
0AS_ODS
4DNG
C623
0.1u
1800 FB600
VREG_MSMP_2.6V
2.2u
C606
1800 FB603
C607
33p
C615
47p
C633
0.1u
1n
C618
SC600
1
VREG_MOTOR_3.3V
C638
0.1u
R622
4.7K 51K
R624
VREG_MOTION_3.0V
216R
K01
TP601
R617
2.2K
VREG_MSMP_2.6V
C628
470n
R618
2.2K
R626
1K
470n C611
C610 470n
10 R608
C635 10n
51K
R625
C609
1n
L602
1.2n
10 R607
VB600
2
1
VA605
DNI
L601
1.2n
J600
2
3
4
5
6
1 M5
M4
M3
M4F
M1
M6
116R
K01
FB605 1800
Q600
D
G
S
006D
206D
306D
C616
47p
106D
406R M1
C619
22p
4 06 D
270n
L600
VREG_MSMP_2.6V
1800 FB604
306R K1
606R
K001
MIC_1P
RCV_N
RCV_P
HPH_R
HPH_L
AUDIO_I2C_SCL
AUDIO_I2C_SDA
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
MOTION_I2C_SDA
MOTION_I2C_SCL COMPASS_DRDY
LIN_PWM_FREQ
MOTION_INT
MOTOR_N
MOTOR_N MOTOR_P
MOTOR_P
EAR_SENSE
EAR_L
EAR_L EAR_R
EAR_R
MIC_1N
LINE_ON
LINE_OP
MIC_BIAS
EARMIC_P
+VPWR_AUDIO
COMPASS_I2C_SDA
COMPASS_I2C_SCL
HOOK_ADC
FM_ANT
SPEAKER
MIC
Audio SUB SYSTEM
Close to SPK Pad
Acceleration Sensor
Must Check Schematic
1%
(Q-Coin)
3.5pi EAR JACK
1%
MOTOR
Digital Compass
1%
Q-coin MOTOR
1%
1%
1%
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
ENJE0008001
7. CIRCUIT DIAGRAM
VREG_LCD_1.8V
FL702
15pF 01 5
6 4
7 3
8 2
9 1 INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
FL705 ICVE10184E070R101FR
7.5pF 0 1 5
6 4
7 3
8 2
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
U701 EUSY0391601
NLSV1T244MUTBG
4 3
5 2
6 1 VCCA VCCB
A B
GND OE_
FL707 SFEY0011401
7.5pF 01 5
6 4
7 3
8 2
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1 G 2G
7.5pF
01 5
6 4
7 3
8 2
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
C713
2.2u 4.7u
C714
GB042-24S-H10-E3000
CN702
ENBY0034201
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
u2.2
607C
1 R706
407R
K2.2
507R
K2.2
CAM_IOVDD_2.6V
C715
DNI
C712
2.2u
307AV
407AV
107AV
207AV
CAM_IOVDD_2.6V
15pF
FL701
01 5
6 4
7 3
8 2
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
u2.2
807C
FB700
120
15pF
01 5
6 4
7 3
8 2
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
CAM_DVDD_1.8V
1u C702
R700 K7.4
C705
2.2u
C703
2.2u
FL703 SFEY0010501
15pF 01 5
6 4
7 3
8 2
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
GB042-40S-H10-E3000
ENBY0036001
CN700
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
VREG_LCD_1.8V
FL700
15pF 01 5
6 4
7 3
8 2
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
u2.2
907C
u2.2
707C
VA700
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
GB042-10S-H10-E3000
ENBY0051001
CN701
6 5
7 4
8 3
9 2
10 1
VREG_LCD_2.8V
1u
C710
1u
C700
2.2u
C711
307R
K001
+VPWR
2.2u C704
U700
EUSY0378001
AAT2862
52 02 6
11 4
8
3
9
10 5
16
17
18
19
15
14
13
12 23
1 7
12 22 42 2
+2C
+1C
-1C
-2C
IN1 OUT
IN2 BL1
BL2
BL3
BL4
BL5
BL6
BL7_AUX1
BL8_AUX2
EN LDOA
LDOB
SDA
LDOC
SCL LDOD
DNGA
DNGP PE
CAM_AVDD_2.7V
VREG_MOTOR_3.3V
1u C701
VREG_TOUCH_3.0V VREG_MSMP_2.6V
607AV
707AV
R702
100
507AV
K7.4
807R
707R
K7.4
CAM_AVDD_2.7V
CAM_IOVDD_2.6V
CAM_DVDD_1.8V
R701 K7.4
VREG_MSMP_2.6V
TP700
017R
K 001
TOUCH_INT
CAM_PCLK
CAM_MCLK
CAM_VSYNC
CAM_HSYNC
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[0]
LCD_BL_I2C_SDA
LCD_BL_I2C_SCL
CAM_PWDN
CAM_RESET_N
LCD_RESET_N
CAM_I2C_SDA
CAM_I2C_SCL
LCD_BL_EN
TOUCH_I2C_SCL
TOUCH_I2C_SDA
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
EBI2_DATA[9]
nNAND_OE
nNAND_WE
CAM_HSYNC_F
CAM_HSYNC_F
CAM_VSYNC_F
CAM_VSYNC_F
WLED_PWR
WLED_PWR
CAM_DATA[0]_F
CAM_DATA[0]_F
CAM_DATA[1]_F
CAM_DATA[1]_F
CAM_DATA[2]_F
CAM_DATA[2]_F
CAM_DATA[3]_F
CAM_DATA[3]_F
CAM_DATA[4]_F
CAM_DATA[4]_F
CAM_DATA[5]_F
CAM_DATA[5]_F
CAM_DATA[6]_F
CAM_DATA[6]_F
CAM_DATA[7]_F
CAM_DATA[7]_F
MLED[2]
MLED[2]
MLED[3]
MLED[3] MLED[1]
MLED[1]
MLED[4]
MLED[4]
MLED[5]
MLED[5]
CAM_PCLK_F
CAM_PCLK_F
LCD_RS
LCD_CS
LCD_VSYNC_LS
LCD_MAKERID_HIGH
Backlight Charge Pump
7.0x7.0x4.1t
Touch
Camera Filter(EMI 100 ohm, 7.5pF)
Maker IF
3M MAIN CAMERA FF
Maker ID
TOVIS H H
2.8" QVGA LCD
7. CIRCUIT DIAGRAM
CN800
4
3
2
1
C802
0.1u
J800
VCC 1 GND1 4
RST 2 VPP 5
CLK 3 IO 6
GND2 7 GND5 10
GND3 8 GND4 9
VREG_RUIM_3.0V
EDTY0009801
D802
4 3
5 2
6 1
K1.5
608R
VREG_RUIM_3.0V
R804 K74
R810 100
R811 100
R813 100
ZD805 ZD803
C804
33p
VA800
VA801
KB801
C801
33p
R809
100
R808
100
VREG_MMC_3.0V
VREG_MSMP_2.6V
R803 K7 4
R816 100
R814
100K
1UF
C806
R812 100
ZD801
R802 K7 4
ZD800
R801 K74
718R
15
1u
C805
ZD802
C803
33p
S800
ENSY0023601
16 8
7
6
5
4
3
2
1 15
G5 G3 G1 CD
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
G7
LD801
EDLH0005901
LEWW-S14
008R
K0 2 2
C800
33p
LD800
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
+VPWR
KB800
D800 4
3
5
2
6
1
R805 K74
D801 4
3
5
2
6
1
1
708R
SD_MMC_CLK
SD_MMC_CMD
SD_MMC_DATA[0]
SD_MMC_DATA[1]
SD_MMC_DATA[2]
SD_MMC_DATA[3]
USIM_CLK
USIM_CLK
USIM_DATA
USIM_DATA
SD_MMC_DET
KEY_LED_DRV_N
PM_ON_SW
GND
KEY_ROW[1] KEY_ROW[0]
USIM_RST
USIM_RST
KEY_COL[0]
KEY_COL[1]
KEY_COL[1]
+VPWR
4KEY LED LIGHTING
VOL_UP
VOL_DOWN
USIM Socket
MicroSD
VOLUME KEY
1608 TOP VIEWLED
POWER KEY
SEND/END KEY
SEND
END
VOL_UP
SEND
ROW[1]
ROW[0]
VOL_DOWN
COL[1] COL[0]
Micro SD_DETECT_N
Low(Detected)
High
S/W
Close
Open
8. BGA PIN MAP
- 166 -
8. BGA PIN MAP

MCP

8. BGA PIN MAP
8. BGA PIN MAP
- 167 -
MSM7227

8. BGA PIN MAP
- 168 -
RTR6285(Top View)

8. BGA PIN MAP
- 169 -
PM7540(PMIC)

9. PCB LAYOUT
1 0 8 A V
30 5 R
KB801
3 08 D Z
218R
4 1 8R
61 5C
BAT500
KB800
LD800
MIC600
FB600 2 0 6 R
C601
LD801 6 18 R
5 0 8 D Z
9. PCB LAYOUT
LG-P350_MAIN_SPFY0246001_1.1_TOP
BAT500 : Backup Battery
-RTC reset
MIC600 : Microphone
- no far-end voice
- no voice recording
9. PCB LAYOUT
1 4
J
T D
R
GA
D
6
0 1
5
H
G
h
F
E
D
C
B
1
K
T
R
P
N
M
L
J
A
C
B
D
E
1 4
1
24
01
A C B
72
1
C B A
12
13
H G F E D
K L M N P R J H G F E
13
M
C
L P N M K
FA U V W Y AA BA CA DA EA
N
D
H
G
F
E
L
K
J
A
B
1
4
C B
12
04
E
8 7
41
02
U300
S800
U1000
ZD401
415R
0
0
6
N
C
C 6 3 3 L 2 0 1
30 2 C
J800
R 6 2 3
C 2 2 1
R 6 2 4
R 6 1 3
C 2 3 5
0 0 0 1
T
N
A
1 0 0 1
T
N
A
4 06
C
2 1 3 C
2 4 0 1 L
FL706
R 4 0 2
TP404
3 1 6C
30 8C
C 8 0 2
C 4 0 6
10 4C
2 1 4 C
108C
7 1 3C
81 3 C
C 4 1 1
3001 L F
9 7 0 1C
71 0 1R
81 0 1 R
6 101R
C 5 4 9
C 1 1 0 6
C 6 0 7
R 6 0 5
904 C
R706
U401
4 3 5 C
305 C
8 3 5 C
U501
C 5 1 1
C 5 4 1
R509
C 3 0 1
C 3 0 8
01 5 R
FL1004
FL1007
L 1 0 3 7
C 1 0 4 9
FL700
FL704
R300
71 0 1 L
L 1 0 3 0
C639
FL703
7 1 4
C
D501
R 4 0 0
0 75 C
R502
R 3 1 7
C 3 2 7
FL500
00 5
D
R817
27 0 1C
C 1 0 7 3
C 1 0 5 1
C 1 0 5 0
C 1 0 3 2
L 1 0 1 4
ANT1002
ANT1003
1 0 5
N
C
VA800
C 8 0 5
6 50 1C
C 1 0 3 4
C 1 0 3 6
C 1 0 2 8
7 1 5 R
3 0 2 R
8 4 2 C
0 2 5 R
5 5 5C
502C 3 02 BF
4 5 5
C
ANT200
ANT201
7 1 2 C
0 0 2 L F 2 0 2 L
81 2C
0 0 8
N
C
C 2 2 7
C 2 2 3
U 2 0 2
C 2 2 0 C 2 1 9
202 C
402C
C 2 0 0
R201 0 0 2
X
C 2 4 7
C 2 0 9
C 2 0 7
1 08 D Z
R 8 1 1
0 0 8 D Z
2 08 D Z C 2 4 6
R 8 1 0
3 1 8 R
12 5 R
6 55C
61 5 R
2 2 6R
622C
4 2 2 C 0 02 R
Q 6 0 1 9 0 2 L
L 2 0 5
2 2 2 C
6 26R
U 2 0 0
C 2 4 4
C 2 4 5
U201
922 C C 2 1 3
C 2 3 0
4 0 2B F
C 2 2 5
2 3 2 C
C 2 0 8
C 2 0 6
T P 3 0 2 T P 3 0 3
50 8R
D800
3 08 R
0 08 R
4 0 8 R
4 0 0 1
T
N
A
U601
V B 6 0 0
7 2 6 R
002B F
10 2C
412C 2 1 2 C
932C
CN500
1 4 0 1 L
C 6 3 4
2 06L
4 0 6AV
5 0 6AV
106L
012 C R625
202 B F
1 0 2 B F
5 36C
60 2L
C 2 3 8
70 2 L
7 3 2C
C 2 3 3
4 32C
63 2C
8 22C
13 2C
8 02L
112 C
C 2 4 2 C 2 4 3
0 42
C
1 42C
T P 3 0 6
T P 3 0 1 T P 3 0 5
T P 3 0 7
1 0 8R
D801
2 08R
6 08 C
R 7 0 4 V A 7 0 2
10 6
B
F
2 0 6
B
F
2 26C
3 0 6C
7 8 01C
5801C
48 0 1 C 620 1 L
07 0 1C
0 401L
V A 6 0 3
R 7 0 5 V A 7 0 1
F B 7 0 0
VA703
C 7 1 4
VA704
V A 6 0 2
C 6 0 9 C 6 3 6 C 6 0 8
FL705
4 1 6C
126 C
U600
R405
216 C
R 6 1 0
R 6 0 9
0 1 6C
R401
116 C
0 2 6 C
TP402
R404 R 4 0 3
C 1 0 9 1
6 8 0 1C
5 001 L F
52 0 1 L
0 9 01C
2 9 0 1 C
4 9 0 1 C
U1002
C 1 0 6 9
1 7 0 1
C
7 9 01 C
L 1 0 3 2
L 1 0 3 3
R 1 0 0 1
8 0 6 R
20 8 D 4 0 8C
C 3 1 4
515 C
C 3 0 3
0
0
5
X
C 3 2 0 C 5 4 6
U1001
C 1 0 1 8 R1002
R 1 0 0 0
CN702
C 7 1 1
C 4 0 2 C 4 0 5 304 PT
5 0 6 C
7 0 6 R
R 8 0 6
1 24
C
0 0 8C
C 4 2 4
7 03 R
03 4C
R 3 0 8
D 3 0 1
C 3 1 5
C 3 1 6
8 24 C
C 4 3 1
503
C
9 1 3C
7 24
C
C 3 1 1
9 2 4C C 4 1 5
C 3 1 3
91 5
C
0 05C
4 03C
C 5 0 2
6 0 5C
C 5 4 4
C 5 3 9
C 5 0 1
U 5 0 0
405C
71 5C
4 0 5R
C 5 4 5 7 45 C
C 5 1 3
C 5 3 5
6 6 5 C
R311
R310 C 5 1 4
R807
2 45
C
C 5 0 5
R 5 0 5 C 5 4 0
103
U
9 1 3 R
C 3 1 0
L 1 0 1 8
70 3 C 2801 C
0801C
9 0 3C
C 1 0 7 8
12 01L
2 201L
C 1 0 7 7
10 0 1 L
C 1 0 0 1 000 1L
C 1 0 4 2
SW1000
C 1 0 0 4
5 1 7C
C 7 1 2 9 1 6 C
5401 C
34 0 1C
L 1 0 0 8
6 0 6R
C 6 0 6
30 6 D
0 0 6L
C 7 1 3
304 C
22 4 C
FL707
404 C
5 24 C
324 C
624 C
504P T
C 5 2 1 C 5 2 7
0 04 C
C 5 2 3
C525
1 05L
305L
T P 5 0 1
0 15 C C 5 1 8
C 5 7 1 C 5 1 2
TP502
X300
8 8 01 C
C 1 0 8 3
3 2 01 L
9 8 0 1C
C 1 0 9 5
L 1 0 3 6
L 1 0 1 1
C 1 0 3 7
C 1 0 3 9
L 1 0 3 5
C 1 0 1 5
C 1 0 4 6
C 1 0 0 7
L 1 0 0 5
L 1 0 0 2
Q 6 0 0
F B 6 0 6
R 6 0 4
D604
5 1 6 C
3 0 6BF
116R
7 3 6 C
9 2 6 R
0 0 6D
0 36R 50 6BF
C 6 1 7
C 6 1 8 2 0 6 D
R 6 0 3
V A 7 0 6
1 0 6D
R 6 2 8 R 6 1 2
C 6 1 6
8 0 7R
8 04 C
70 4 C
40 6BF
707R
T P 4 0 1 T P 4 0 0
425C
C 5 2 2
825
C 9 03 R C 3 0 6
C 5 2 6
2 05L
4 0 5 L
C 5 0 8
C 5 0 7 C 5 3 7 C 5 4 8
C 3 0 0
U302
C 3 2 4
C 3 2 3
5 2 3 C
3 1 3R R 3 0 3
C 1 0 3 1
C 1 1 0 5
93 0 1 L
4 2 0 1L
C 1 1 0 4
C 1 0 2 2
C 1 0 5 2
3101L
2 1 0 1 L
C 1 0 3 8
L 1 0 1 5
C 1 0 3 3 01 0 1 L
C 1 0 4 0
10 01 L
F
9 0 01 L
C 1 0 1 0
00 0 1L
F
3 0 0 1L
7 0 0 1L
C 1 0 0 3
C 1 0 2 1
6 0 0 1L
40 0 1L
C 1 0 1 6
T P 6 0 1
U604
7 1 6R
C 6 2 8 81 6R
7 2 6C
J600
0 1 4
C
0 0 5 R
0 2 5
C
40 5
U
3 0 5
U
6 0 5
R
Q500
C 1 0 6 7
0 201C
R1009 8 0 0 1R
3001R
T P 6 0 2
U1003
R 1 0 2 0
4 3 0 1 L
7 2 01 L
C 1 1 0 1
V A 7 0 5 C 7 0 3
L 1 0 3 8
70 7 A V
C 7 0 7
C 7 0 8
C 7 0 6
C 7 0 9
32 6 C
T P 6 0 0
42 6
C
U603
FL702
FL701
R304 C 4 3 3
C 4 1 4
R305
U701
D 3 0 0
T P 3 0 0
C 4 1 3
R 3 1 6
C 4 1 8
C 4 3 5
R 5 2 4
R 3 0 6
R 5 2 5
C 4 3 2
R 5 2 6
C 4 2 0
C 4 1 6
C 4 3 4
C 4 1 9
4 1 3 R
2 03C
635C
305 PT
C 3 2 8
0 3 5 R
20 3 R R 3 1 8
1 0 5R
9 5 5C
90 5C
1 35R
00 5 L 96 5C
0 3 5
C
C 5 6 8
C 5 2 9
C531
C 5 3 2
L 1 0 1 6
C 1 0 7 4
C 1 0 6 8
C 1 0 7 5
FL1002
67 0 1 C
R1022
R 1 0 1 4
910 1C
51 0 1 R
1 2 01 R C 1 0 6 1
0 6 01C
210 1C
920 1 C
6 0 0 1 C
44 0 1 C
R1006
92 0 1 L
9 9 0 1C
91 0 1 R
916R
R315
26 5
C
9 10 1 L
R1005
L 1 0 2 8
6 9 01 C
FL1006
0 0 11 C
007R
C 7 0 4 3 07R
1 0 7 R
1 07 C
2 0 7 C
U700
83 6C
0 26R
C 3 2 2
01 7R
C 3 2 1
R312
0 0 7C
103 R
5 1 5 R
20 5 DZ
4 6 5 C
3 2 5R
C 5 6 0
C 5 6 1
908R
8 0 8R
C 1 0 4 7 R1012
C 1 0 4 8
18 0 1C
C 1 0 6 5 9 50 1C C 1 0 6 6
11 0 1 C C 1 0 6 4
80 0 1 C
7 1 0 1C
R1004
C 1 0 0 5
C 1 0 5 7
C 1 0 1 4
003
N
C
5 0 7C
00 7A V
20 7R
0 1 7C
01 0 1 R
1 07
N
C
T P 7 0 0
00 7
N
C
5 5 0 1C
3 4 5C
C 1 0 5 4
C 1 0 5 3
1101 R
C 1 0 2 4
C 1 0 6 3
5 20 1C
C 1 0 1 3
C 1 0 0 9
C 1 0 2 6
C 1 0 2 7
R1007
C 1 0 2 3
C 1 0 5 8
310 1R
C 1 0 3 0
J600 : 3.5pi Ear-Jack
- no Sound
CN701 : Touch Connector
- no touch sensing
U700 : ChargePump
- no LCD backlight
U401 : Memory
- no Booting
U603 : Acceleration Sensor
- Can not detect motion
CN700 : LCD Conn.
- no Display
U300 : DBB
- no Power On
- no Servive
U504 : MUIC
- no Booting
- no USB/Serial Connection
CN501 : I/O conn.
- no USB Connection.
- no Serial Connection.
Q500 : Charging IC
- no Battery Charge
U1000 : Transceiver
- no Service
- RF Sensitivity & TX Power
U1001 : Tx module (GSM PAM + ASM)
- no Service
U604 : Compass Sensor
-Can not detect direction
CN702 : 3M Camera Connector
- no Camera
U601: Motor Driver IC
- Can not operate vibrator
U201 : WiFi+BT+FM Radio Module
-no WiFi Connection
-no BT Connection
-no FM Radio
U600 : Audio AMP Sub System &
Signal Distributor
- no Sound
J800 : SIM Conn.
- No SIM
U501 : PMIC
- no Booting
- no Power On
- no Service
X300 : 19.2Mhz X-tal
- no Power On
- no Service
U1002 : PAM
- no Service
S800 : micro-SD socket
- Can not use a micro-SD
CN500 : Battery Conn.
- no power On
LG-P350_MAIN_SPFY0246001_1.1_BOT
10. CALIBRATION
- 17 -
10. CALIBRATION
1. Calibration
1. CALIBRATION

10.1 General Description
This document describes how to install and use the RF calibration software(Tachyon) of LG 3G mobile phone with
Qualcomm Chipsets.

10.2 Requirement
Requirements for RF calibration of LGE mobile phone are outlined in the following sections.

10.2.1 Hardware
1) Desktop or laptop computer
2) Agilent 8960 Series 10 (E5515C) Testset
3) GPIB card and cable for communicating with Agilent 8960 Series 10 Testset
4) Power Supply, or 4V battery, and power cable for putting power on the mobile phone.
5) Data(USB or UART) cables for connecting the mobile phone to computers serial port
6) RF cable

10.2.2 driver
1) National Instruments GPIB & VISA driver
2) LGE mobile USB driver
3) Data cable driver(optional)

10.2.3 System
1) Windows XP SP2 or better
2) RAM 512M or grater
3) HDD 1GB of available space

10. CALIBRATION
- 173 -
10.3 Setup for RF calibration
10.4 Tachyon Software Installation

1) Install Tachyon_setup_Eng_20090326.exe to C:/LGE/Tachyon directory.
2) Unzip Tachyon_Release_20101101.zip, and overwrite all files to the same path.
3) Install OCX_Registration.bat for registering Tachyon Components in C:/LGE/Tachyon/OCX/ directory.

GPIB cable
Power supply
10. CALIBRATION
- 174 -
10.5 Tachyon Start

After hardware setup is completed successfully and Tachyon program is installed ordinarily,
RF calibration or Auto Test can be start in the following procedure.

1) Execute Tachyon.exe in C:/LGE/Tachyon directory.
2) Click login button in the following login dialog window.
10. CALIBRATION
- 175 -
3)Click model selection button in toolbar for selecting the appropriate model.
4) double click P350/ORF in model tree, and then click select button.
10. CALIBRATION
- 176 -
5) Click system option button in toolbar to connect the mobile phone to the Tachyon.

10. CALIBRATION
- 177 -
6) Click run option button in toolbar for passing over LGE factory setting.
7) Check PID write and Skip previously Phone PID check
10. CALIBRATION
- 178 -
8) Execute Hecaton.exe for setting RF cable loss to Agilent 8960. If not, Tachyon cant run.

9) Click Calibration+Auto Test button in Toolbar. Now RF calibration and autotest will start.
For more information, refer to the manual in C:/LGE/Tachyon/Manual folder.
10. CALIBRATION
- 179 -
10.6 Overview of RF Calibration

10.6.1 Supported entry of RF Calibration
As using RTR6285, P350 adopts some of calibrations in those of RTR6285. This is also supporting two band WCDMA and
Quad band GSM. Table 1-1 and Table 1-2 describes the information listed for RF calibration items used by P350.

Table 1-1. The calibration list for WCDMA

Calibration WCDMA 2100 WCDMA 900 description
Tx Sweep Calibration Tx output power measurements
Tx Hdet Calibration HDET ADC measurements vs Tx power
Tx Comp vs Freq Calibration 16-channel Tx output measurements in a
certain PDM
Tx Secondary Comp vs Freq
Calibration
Irregular Tx power measurements in a
certain PDM
Tx Lim vs Freq Calibration HDET ADC measurements in the Target
Power
Rx DVGA Gain Offset Calibration Rx DVGA gain measurements
Rx DVGA Gain Offset vs Freq
Calibration
16-channel RX DVGA gain measurements
Rx LNA Range Offset Calibration LNA gain offset measurements
Rx LNA Range Offset vs Freq
Calibration
16-channel LNA gain offset
measurements

Table 1-2. The calibration list for GSM

Calibration GSM900 GSM850 GSM1800 GSM1900 description
VCO Calibration Lowest frequency error- VCO
measurement
Thermistor Calibration Thermistor max/min ADC
measurement
Tx External Polar
Calibration
Tx output power measurements
Polar path delay Calibration PM and AM signal path delay
Carrier Suppression
Calibration
carrier power measurement
Rx Gain Range Calibration 8 or 16 channel Rx Gain
measurements

For more information, refer to RTR6285-RTR6280-RTR6237-RGR1100-MXU6219_NV_ITEMS RevD.pdf (80-VD861-12 Rev. D)

10. CALIBRATION
- 180 -
10.6.2 Feature of RF calibration
Tachyon configuration is describes in this section.
The information indicates the state of the mobile phones will become a factor.

WCDMA band
Table 1-3 describes the calibration feature of WCDMA band.

Table 1-3. Feature of Tx/Rx calibration in WCDMA 2100/900 band

Item Sub Item WCDMA 2100 WCDMA 900
Tx 9883 2863 Calibration Channel
Rx 10833 3088
Tx Target Power(dBm) 22.5 22.5
High to low gain 11.0 11.0 PAM gain switching(dBm)
Low to high gain 14.0 14.0
Max 222 227 Calibrated PDM Range
Min 160 134
PDM step 2 3
Measured data of 32 array 26 25
Up threshold 25.0 25.0
High Gain
Mode
Threshold of Power
Range(dBm)
Low threshold 6.0 6.0
Max 235 255 Calibrated PDM Range
Min 80 69
PDM step 5 6
Measured data of 32 array 27 26
Up threshold 15.0 16.0
Low Gain
Mode
Threshold of Power
Range(dBm)
Low threshold -55.0 -53.0
Lower limit 16.5 16.5 Allowable power range in HDET
range(dBm)
Upper limit 24.5 24.5
Lower limit 50 80 Allowable HDET adc range
Upper limit 160 175
DVGA Calibration Power(dBm) -74.0 -74.0
Lower limit 130 80 DVGA Calibration Range
Upper limit 300 300
Range 0-1 -66.0 -68.0
Range 1-2 -42.0 -50.0
Range 2-3 -26.0 -38.0
LNA Calibration Power(dBm)
Range 3-4 -26.0
10. CALIBRATION
- 181 -
Quad GSM band
Table 1-4 describes the calibration feature of Quad GSM bands.

Table 1-4. Feature of Tx/Rx calibration in Quad GSM band

Item Sub item GSM 900 GSM 850 GSM 1800 GSM 1900
F1 975 128 512 512 Tx Calibration channel
F2 124 251 885 810
Max 34.0 34.0 31.0 31.0 Power range in
AMAM/AMPM NVs
(dBm)
Min -20.0 -20.0 -20.0 -20.0
Range 0 -80 -80 -80 -80
Range 1 -80 -80 -80 -80
Range 2 -50 -50 -50 -50
Range 3 -50 -50 -50 -50
Rx Gain Range Calibration
Power
(dBm)
Range 4 -50 -50 -50 -50
Range 0 1900/2500 1900/2500 1900/2500 1900/2500
Range 1 1200/2300 1200/2300 1200/2300 1200/2300
Range 2 1300/1900 1300/1900 1300/1900 1300/1900
Range 3 1200/1800 1200/1800 1200/1800 1200/1800
Rx Gain Range Calibration
Range
(Lower limit/Upper limit)
Range 4 1100/1700 1100/1700 1100/1700 1100/1700
Tx External Polar
calibration
PDM table
13025,1900,1950,2000,2050,2100,2150,2200,2250,2300,2350,2400,2450,2500,2550,2
600,2650,2700,2750,2800,2850,2900,2950,3000,3075,3150,3225,3300,3375,3450,352
5,3600,3675,3750,3825,3900,3975,4050,4125,4200,4275,4350,4425,4500,4575,4650,
4725,4800,4875,4950,5025,5100,5175,5250,5325,5400,5475,5550,5625,5700,5775,58
50,5925,6025,6125,6225,6325,6425,6525,6625,6725,6825,6925,7025,7125,7225,7325
,7425,7525,7625,7725,7825,7925,8025,8125,8225,8325,8425,8525,8625,8725,8825,8
925,9025,9125,9225,9325,9425,9525,9625,9725,9825,9925,10025,10125,10225,1032
5,10425,10525,10625,10725,10825,10925,11025,11125,11225,11375,11525,11675,11
825,11975,12125,12275,12425,12575,12725,12875,13025,13175,13325,13475,13625,
13775,13925,14075,14225,14375,14525,14675,14825,14975,15125,15275,15425,155
75,15725,15875,16025,16175,16300

10. CALIBRATION
- 18 -
Channels of RF Calibration

Table 1-5 Channel of WCDMA

W2100
Tx
9621 9638 9656 9673 9691 9708 9726 9743 9761 9778 9796 9813 9831 9848 9866 9883
W2100
Rx
10571 10588 10606 10623 10641 10658 10676 10693 10711 10728 10746 10763 10781 10798 10816 10833
W900
Tx
2712 2722 2733 2743 2754 2765 2776 2787 2796 2806 2815 2825 2834 2844 2853 2863
W900
Rx
2937 2947 2958 2968 2979 2990 3001 3012 3021 3031 3040 3050 3059 3069 3078 3088

Table 1-5 Channel of GSM850/GSM900

GSM850 12 8 14 5 16 3 180 19 8 215 23 3 251
GSM900 1 31 62 92 12 4 97 5 10 00 10 23

Table 1-7 Channel of GSM/1800/GSM1900

GSM1800 512 537 562 587 612 637 662 687 712 737 762 787 812 837 862 885
GSM1900 512 532 552 572 592 612 632 652 672 692 712 732 752 772 792 810
11. STAND-ALONE TEST
- 183 -
11. STAND ALONE TEST
Hidden Menu Start
Start shortcut keys: 3845#*350#
Hidden Menu List
Start the desired menu: Menu, click
Version Info
Classifed Information representation
- 184 -
Factory Reset
Format SD Card : SD Card Data reset
Factory Reset : Changing the Factory
Delete Userdata : Disabled
Device Test List
Auto All Test :
-> Auto All Test menu click
-> Continuous information on the menu, giving you
ability test
Auto All Test Result
Auto All Test Result
-> From the factory with the ability to view the results
screen
- 185 -
Device Test List
Auto All Test : Device functionality testing at the factory to use
Auto All Test Result : Test Result
LCD Test : Display test(Color)
Proximity Test : Proximity Sensor
Vibrator Test : Vibrator test
Camera Test : Camera & Cam test
Sound Test : Sound test
RTC Test : Date/Time Setting
Touch Test : Display touch test
Motion Sensor test : Motion Sensor test
External Memory Test : SD Card Write test
Compass Test : Compass Test
GPS Test : GPS Test
IRT Test : N/A
LCD Test List
Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking
- White Display
- Black Display
- Red,Green, Blue, White Display
- Red,Green, Blue, White Display
Vibrator test
A case-by-state vibration tests
- 186 -
Camera test
Menu features disabled
This feature is part of Auto All Test replaced by
-> Auto All Test
-> Camera test
-> Cam test
Sound test
Ring : Ringtone test
Efect Sound :
Message Tone :
Loop Back test : Mic & Speak loop Back test
Audio CAL Tool : Setting
-> Ring menyujung Enabled
RTC test
Date & time : setting
- 187 -
Touch test
Finger Print : Free mode test
Grid Touch Test : Block mode on touch point mode test
Touch Key Test : key test
Grid Touch Color Change
Block Touch Test
Pinch Zoom in/out : Multi touch Test
Touch Information : Read Touch IC & Firmware Version
Motion Sensor test
Motion Sensor test
-> 4 Check the operation of the sensor in the direction
of lean
External Memory Test
SD Card test
-> Write a test check of the SD Card memory
- 188 -
Key / Compass Test
SD Card : Check Recognition
SIM Card : Check Recognition
Up/Down key : Check Recognition
End Call key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
Compass test
GPS Test
GPS test : GPS check recognition
ELT Test
Automatic Mode
Manual Mode
- 189 -
ELT Test
Automatic Mode : LCD Automatic on/of test
-> time setting
ELT Manual Test
LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
-> test on the device is working
(The ability to use plant)
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
EBD00
EAJ00 ADV00
SBPL01
ACQ02
MJN03
MCQ00 AKAC00
SUSY00 MAZ01
EAX00
ABM00
SVCY00
MAZ00
ADB00
EAA00
MBJZ01
GMEY00
SUMY00
SJMY00
MJN01
MJN00
MJN02
ACQ00
ACQ01
SAFY04
Location Description
ADV00 Frame Assembly
EAJ00 LCD,Module-TFT
AKAC00 Keypad Assembly,Main
EBD00 Touch Window Assembly
MCQ00 Damper
ACQ00 Cover Assembly,Front
MJN00 Tape,Window
MJN01 Tape
MJN02 Tape,Window
MJN03 Tape,Window
ACQ01 Cover Assembly,Rear
MBJZ01 Button
EAA00 PIFA Antenna,RF
GMEY00 Screw,Machine
SAFY04 PCB Assembly,Main
SVCY00 Camera Module
SUSY00 Speaker,Dual Mode
SJMY00 Motor,DC
EAX00 PCB,Sidekey
ABM00 Can Assembly,Shield
ADB00 Dome Assembly,Metal
MAZ00 Bracket
MAZ01 Bracket
SUMY00 Microphone,Condenser
ACQ02 Cover Assembly,Battery
SBPL01 Rechargeable Battery,LithiumIon
- 191 -
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
1 AGQ000000 Phone Assembly - APEY0992409 LGP350.ADEUSV SV:Silver -
2 MEZ002100 Label, Approval MLAA0062316
COMPLEX GU280 OREBK ZZ:Without Color
COMPLEX, (empty), , , , ,
2 ACQ100400
Cover Assembly,
EMS
- ACQ85468411 LGP350.ADEUSV SV:Silver -
3 ACQ003400
Cover Assembly,
Bar
- ACQ85334101 LGP350.APRTZY BK:Black -
4 ADV00 Frame Assembly - ADV73968301 LGP350.APRTZY SV:Silver -
5 MDQ000000 Frame MFEZ0045501 COMPLEX LG-P350 PRT SV:Silver PRESS, STS,
5 MDS000000 Gasket MDS63537101
COMPLEX LGP350.APRTZY ZZ:Without Color
LCD_FRAME
5 MDS000001 Gasket MDS63612601
COMPLEX LGP350.APRTZY ZZ:Without Color LCD
FRAME_2
4 EAJ00 LCD, Module-TFT EAJ61771701
LM283DN2A QVGA 2.8INCH 240X320 400CD COLOR
70% 4/3 500:1 60Hz Inverter N - TOVIS
4 AKAC00
Keypad Assembly,
Main
AKAC0025501 LG-P350 PRT SV:Silver -
4 EBD00
Touch Window
Assembly
EBD60946001
LGEC59 CAPACITIVE TOUCH F/F MELFAS MCS6000
2.8" B/B - ELK Corporation
4 MEZ000000 Label MLAZ0038303
COMPLEX LG-LC3200 WA:White PRINTING, PPRI
PRINTING
4 MCQ00 Damper MCQ66567501
COMPLEX LGP350.APRTZY ZZ:Without Color LCD
MODULE
4 MJN061100 Tape, Protect MJN67679701
WINDOW
COMPLEX LGP350.APRTZY ZZ:Without Color tape,
protection [bar]
4 ACQ00
Cover Assembly,
Front
- ACQ85334201 LGP350.APRTZY BK:Black -
5 MDJ000001 Filter MDJ63008601
FILTER_SPEAKER [SK4350 + PSR0.3T + SK4350 +
250MESH + SK4350]
12.2 Replacement Parts
Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
- 19 -
5 MDJ000000 Filter MDJ63008501
FILTER_MIC [250MESH + SK4350]
5 MCK032700 Cover, Front - MCJK0142601
COMPLEX LG-P350 PRT SV:Silver MOLD, PC LUPOY
SC-1004A,
6 MET099500 INSERT, NUT MICE0016907 MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,
5 MJN000001 Tape MJN67681501
COMPLEX LGP350.APRTZY ZZ:Without Color TAPE,
KEYPAD
5 MCQ000000 Damper MPBZ0367801
COMPLEX LG-P350 PRT SV:Silver MOLD, Urethane
Rubber S195A,
5 MJN00 Tape, Window MJN67681301 COMPLEX LGP350.APRTZY ZZ:Without Color -
5 MJN01 Tape MJN67681401
FPCB_TOUCH_PANEL[FD8152N]
5 MHK000000 Sheet MHK63311201
COMPLEX LGP350.APRTZY BK:Black SPEAKER
SHEET
5 MEA000000 Guide MGDZ0003001
SC-1004A,
5 MJN02 Tape, Window MJN67679601
WINDOW_BOTTOM
WINDOW_TOP
3 ACQ00
Cover Assembly,
Rear
- ACQ85334301 LGP350.APRTZY SV:Silver -
4 MBJZ01 Button MBJZ0054101
COMPLEX LGP350.APRTZY SV:Silver PC+TPU double
mold
4 EAA00 PIFA Antenna, RF EAA62405902
LS01-I-10084-A0 MULTI -2DB 3:1 Metal Stamping Type -
LS Mtron Ltd.
4 MBL000000 Cap MCCZ0052501
COMPLEX LG-P350 PRT BK:Black PC+TPU double
mold
4 MHK000000 Sheet MHK63325901
COMPLEX LGP350.APRTZY ZZ:Without Color MOBILE
SWITCH
4 MCK063300 Cover, Rear MCJN0134701
MOLD PC LG-P350 PRT SV:Silver PC+GF10% LGC
GP2102-EM59
4 MCQ015700 Damper, Connector MCQ66498001
COMPLEX LGP350.APRTZY ZZ:Without Color PSR
0.6T + SK4810
4 MCQ015701 Damper, Connector MCQ66498101
COMPLEX LGP350.APRTZY ZZ:Without Color PSR
0.6T + SK4810
4 MCQ009400 Damper, Camera MCQ66498201 COMPLEX LGP350.APRTZY ZZ:Without Color -
4 MCQ049800 Damper, Motor MCQ66498301 COMPLEX LGP350.APRTZY ZZ:Without Color -
ACQ01
- 193 -
4 MCQ015702 Damper, Connector MCQ66569301 COMPLEX LGP350.APRTZY ZZ:Without Color camera
CAMERA WINDOW
PROTECTION [VOLUME]
4 MKC009400 Window, Camera MWAE0070001
CUTTING PC SHEET LG-P350 PRT BK:Black PC
SHEET 0.2T + SK4350
3 GMEY00 Screw, Machine GMEY0014301
GMEY0014301 BH + 1.4mM 3.5mM MSWR NI PLT N -
KUMGANG SCREW CO., LTD
3 SAFY04
PCB Assembly,
Main
- SAFY0400309 LGP350.ADEUSV 1.0 MAIN
4 EBR071500
PCB Assembly,
Main, Insert
- EBR72902101 LGP350.APRTZY 1.0 MAIN
PAD_PCB_MIC
water_protection_lcd_conn
water_protection_touch_conn
5 EAA030100 PIFA Antenna, RF EAA62405802
ACB-000094 TRIPLE -2DB 3:1 - - MOBITECH
CORPORATION
5 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]
5 SVCY00 Camera Module SVCY0029201
HSIS-LM38MIFF LG-P350 PRT HANSUNG
ELCOMTEC CO., LTD.
5 SUSY00
Speaker, Dual
Mode
SUSY0028901
BRS-181213SL08-P Nd-Fe-B 700mW 8OHM 90DB
710HZ 1812*3.0T WIRE BUJEON ELECTRONICS
CO., LTD
5 SJMY00 Motor, DC SJMY0007116
WHVM-1030Q10 2 V, 65 mA, 10 *3.0T, 3V, WOOSUNG
G&T CO., LTD
5 EAX00 PCB, Sidekey EAX63985801
EAX63985801 LGP350.APRTZY 1.0 POLYI Double
2layer 1mm SIDEKEY SI FLEX CO., LTD
5 ABM00
Can Assembly,
Shield
- ABM73476101 LGP350.APRTZY SV:Silver -
6 MBK070300 Can, Shield MCBA0103901 COMPLEX LG-P350 PRT SV:Silver PRESS, STS,
6 MEZ000900 Label, After ServiceMLAB0001102
COMPLEX C2000 CGRSV WA:White C2000 USASV
DIA 4.0 PRINTING,
6 MEV000000 Insulator MEV63756401
insulator_can_shield
- 194 -
DAMPER_CAN, SHIELD
5 ADB00
Dome Assembly,
Metal
ADB73558901 LGP350.APRTZY ZZ:Without Color -
4 EBR071800
PCB Assembly,
Main, SMT
- SAFF0299003 LGP350.ADEUSV 1.0 MAIN
5 SAD010000 Software, Mobile SAD32886501 V10A - EUROPE QCT -
5 MEZ000000 Label MLAZ0038301
COMPLEX LG-VX6000 ZZ:Without Color PID Label 4
Array PRINTING,
5 SAFC00
PCB Assembly,
Main, SMT Bottom
- SAFC0161701 LGP350.APRTZY 1.0 MAIN
6 MAZ00 Bracket MAZ63011101
PRESS STS 304 0.3 LGP350.APRTZY ZZ:Without Color
-
6 MAZ01 Bracket MAZ63063201 COMPLEX LGP350.APRTZY SV:Silver EARJACK
6 SW1000 Connector, RF ENWY0007901
KMS-518(P) NONE STRAIGHT RF ADAPTER SMD
T/REEL AU 50OHM 650mDB HIROSE KOREA CO.,
LTD
5 SAFD00
PCB Assembly,
Main, SMT Top
- SAFD0159101 LGP350.APRTZY 1.0 MAIN
6 SUMY00
Microphone,
Condenser
SUMY0010609
SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42 dB,
3.76*2.95*1.1, mems smd mic KNOWLES ACOUSTICS
6 BAT500
Capacitor
Assembly
SMZY0023501
PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.
6 SPFY00 PCB, Main SPFY0246001
SPFY0246001 LGP350.APRTZY 1.0 FR-4 Stack via 8
0.8 MAIN LG Innotek.com
1 AGF000000 Package Assembly - AGF76138401
LGP350.ADEUSV ZZ:Without Color LG-P350
STD(EU1W)
2 MAY084000 Box, Unit MAY64973304
BOX Paper 120 56 90 5 COLOR LGP350.AVIPSV
ZZ:Without Color LG-P350 STD(EU1W)
2 APLY00 PALLET ASSY - APLY0003901
GD510 BALBK BK, ZZ, EU1
TYPE_Body(SW)+Cap(EU)+AL_1200EA
3 MBEC00 Box, Carton MBEC0003601 COMPLEX GD510 CZESV ZZ:Without Color -
3 MCCL00 Cap, Box MCCL0002501 COMPLEX GD510 CZESV ZZ:Without Color -
3 MPCY00 Pallet MPCY0012403 COMPLEX KG800 FRABK DB:DARK BLUE -
2 MBAD00 Bag, Vinyl MBAD0005204 COMPLEX LG-LX260 SPRAG ZZ:Without Color -
2 MBEE00 Box, Master MBEE0061001 COMPLEX GD510 CZESV ZZ:Without Color -
- 195 -
2 MLAC00 Label, Barcode MLAC0004541 COMPLEX HB620 KPNBK ZZ:Without Color -
2 MLAJ00 Label, Master Box MLAJ0004402
COMPLEX CG300 CGR ZZ:Without Color LABEL,
MASTER BOX(for CGR TDR 2VER. mbox_label)
2 MLAZ01 Label MLAZ0050901 COMPLEX KU990 GBRBK ZZ:Without Color -
1 AAD000000 Addition Assembly - AAD85729101 LGP350.ADEUSV SV:Silver -
2 ACQ00
Cover Assembly,
Battery
- ACQ85463001 LGP350.APRTZY SV:Silver -
3 MCK000000 Cover MCJZ0066801
SC-1004A,
battery_cover
ACQ02
- 196 -
6 R530 Resistor, Chip ERHZ0000284
RC1005F434CS 430KOHM 1% 1/16W 1005 R/TP -
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C531,
C554
Capacitor, TA,
Conformal
EAE62287901
251M1002107MR12A168 0.0001F 20% 10V 50UA -
55TO+125C 0.6OHM 3.2x1.6x1.1 NONE SMD R/TP
MATSUO ELECTRIC CO., LTD
6 X200 Oscillator, TCXO EXST0002301
1XTW38400FAA 384MHZ 2.5PPM 2.8V 3.2x2.5x0.9MM
; SMD R/TP DAISHINKU CORPORATION.
6 X300
Oscillator,
VCTCXO
EAW61503501
1XTV19200FAA 19.2MHZ 2PPM 2.8V 3.2x2.5x0.9MM ;
SMD R/TP DAISHINKU CORPORATION.
6
C210,
C228,
C243,
C247,
C248,
C311,
C313,
C545,
C546,
C548,
C566,
C571,
C805
Capacitor,
Ceramic, Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
55TO+85C 1005 R/TP - TDK KOREA COOPERATION
6
R1022,
R201
PCB ASSY, MAIN,
PAD SHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
6 C1001
Inductor, Multilayer,
Chip
ELCH0004708
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM
5.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
12.2 Replacement Parts
<Main component>
- 197 -
6
C1006,
C1007,
C1008,
C1012,
C1015,
C1017,
C1037,
C1039,
C1044,
C1051,
C1074,
C1078,
C1090,
C1097,
C568,
L1023,
L1035
Capacitor,
Ceramic, Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
C1043,
C1045,
C1046,
C1049,
C1069,
C300,
C404,
C408,
C412,
C414,
C418,
C422,
C426,
C430,
C435,
C502,
C517,
C518,
C521,
C522,
C523,
C524,
C529,
C608,
C609,
C615,
C616,
C618
Capacitor,
Ceramic, Chip
ECZH0025920
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
- 198 -
6
C1024,
C1026,
C1057,
C1058,
C1060,
C1061,
C1063,
C1067,
C1100,
C200,
C201,
C202,
C206,
C207,
C208,
C209,
C213,
C214,
C225,
C227,
C241,
C301,
C304,
C310,
C312,
C314,
C315,
C316,
C317,
C318,
C319,
C324,
C400,
C401
Capacitor,
Ceramic, Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
- 199 -
6
C403,
C406,
C407,
C409,
C416,
C419,
C420,
C423,
C424,
C428,
C432,
C434,
C501,
C503,
C504,
C505,
C506,
C510,
C511,
C512,
C513,
C514,
C534,
C549,
C555,
C556,
C559,
C560,
C605,
C623,
C633,
C636,
C638,
C802
Capacitor,
Ceramic, Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
6
C410,
C421,
C525
Capacitor,
Ceramic, Chip
ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C
1608 R/TP 0.8MM SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6
R1014,
R1020,
R505,
R603
Resistor, Chip ERHY0009504
MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -
ROHM.
6
R1017,
R1018,
R303,
R317,
R318,
R702,
R810,
R811,
R813
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -
ROHM.
- 00 -
6
C1072,
C1081,
L1040
Capacitor,
Ceramic, Chip
ECCH0000195
GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - MURATA MANUFACTURING
CO., LTD.
6
R623,
R626
MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -
ROHM.
6
C700,
C701,
C702,
C710,
C806
Capacitor,
Ceramic, Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
6
R1002,
R704,
R705
Resistor, Chip ERHZ0000443
MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -
ROHM.
6
L501,
L502,
L503
Inductor, Wire
Wound, Chip
ELCP0008005
CPI2520LZ4R7ME 4.7UH 20% 0V 900mA 0.3OHM 0HZ
0 SHIELD 2.5X2X1MM NONE R/TP SAMWHA
CAPACITOR CO, LTD.
6 R1016 Resistor, Chip ERHY0009531
MCR006YZPJ620 62OHM 5% 1/20W 0603 R/TP -
ROHM.
6
C402,
C405,
C509,
C535,
C537,
C538,
C539,
C540,
C543,
C544,
C547,
C603,
C614,
C620,
C621,
C622,
C704,
C706,
C707,
C708,
C709,
C711,
C712,
C713
Capacitor,
Ceramic, Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C
1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
ROHM.
- 01 -
6
R524,
R531,
R609,
R610,
R622,
R700,
R701,
R707,
R708
MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -
ROHM.
6 U603
IC, Acceleration
Sensor
EUSY0408701
KR3DH NONE NONE LGA R/TP 16P - ST
MICROELECTRONICS ASIA PACIFIC PTE LTD.
6 L1018
Chip
ELCH0001034
HK1005 3N3S-T 3.3NH 0.3NH - 300mA 0.16OHM 6GHZ
8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO., LTD
MCR01MZP5J750 75OHM 5% 1/16W 1005 R/TP -
ROHM.
6
FB200,
FB201,
FB202,
FB203,
FB204
Filter, Bead SFBH0008101
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
0.3A SMD R/TP 2P 0 MURATA MANUFACTURING
CO., LTD.
6
ZD800,
ZD801,
ZD802
Diode, TVS EDTY0009401
VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P
5 ROHM.
MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP -
ROHM.
6 R1004, R1005 Resistor, Chip ERHZ0000415
MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP -
ROHM.
MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP -
ROHM.
6
C1048,
C1071,
C231
Capacitor,
Ceramic, Chip
ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,
LTD.
6
C1036,
C1054,
C1056,
C203,
C229,
C230,
C714
Capacitor,
Ceramic, Chip
ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C
MECHANICS CO., LTD.
- 0 -
6
R504,
R629,
R801,
R802,
R803,
R804,
R805
ROHM.
6
R307,
R523,
R525,
R526,
R605,
R617,
R618,
R619,
R620
MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -
ROHM.
6
R203,
R316,
R606,
R703,
R710
ROHM.
6 FL1007
Filter, Duplexer,
IMT
SDMY0003001
B7697 2140000000 2112.4 to 2167.6 1950000000
1922.4 to 1977.6 2.2 1.8 2.5x2.0x0.89 DUAL SMD R/TP
- EPCOS PTE LTD.
6 U500
IC, LDO Voltage
Regulator
EUSY0407201
BU33TD4WNVX SSON004, 4, R/TP, 3.3V 150mA
Single LDO, IC, LDO Voltage RegulatorIC, LDO Voltage
Regulator ROHM.
6 C1082, L1039
Capacitor,
Ceramic, Chip
ECCH0000104
MCH155A030C 3pF 0.25PF 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6 C1083, C1095
Capacitor,
Ceramic, Chip
ECCH0000183
GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -
CO., LTD.
6 D500 Diode, Switching EDSY0011901
SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2
R/TP 2P 1 AUK CORP
6 U601
IC, Speaker
Amplifier
EUSY0404001
TPA6202A1ZQVR BGA, 8, R/TP, Class AB SPK Amp,
IC, Audio AmplifierIC, Audio Amplifier - BGA R/TP 8P -
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
6
C1013,
C1034,
C233
Capacitor,
Ceramic, Chip
ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C
CORPORATION
6
C1070,
C307,
C309,
C320
Capacitor,
Ceramic, Chip
ECCH0009109
C0603X7R1H331KT00NN 330pF 10% 50V X7R -
- 03 -
6
C417,
C427,
C431,
C519,
C520,
C530,
C604,
C624,
C639
Capacitor,
Ceramic, Chip
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C
MECHANICS CO., LTD.
6 C1080
Chip
ELCH0001049
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ
8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 C1079, C1091
Chip
ELCH0005020
HK1005 1N0S 1NH 0.3NH - 300mA 0.08OHM 10GHZ 8
SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO., LTD
6 U1000
IC, RF
Transceiver, 3G
EUSY0344001
RTR6285 1.8VTO3V, 2.7VTO3V 500mW QFN R/TP
68P QUALCOMM INCORPORATED.
6
R607,
R608
MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -
ROHM.
6 FB700 Filter, Bead SFBH0009901
HB-1M1005-121JT 120 ohm 1.0X0.5X0.5 25% 0.3 ohm
0.5A SMD R/TP 2P 0 CERATECH CORPORATION
RC1005J512CS 5.1KOHM 5% 1/16W 1005 R/TP -
6 L1024
Chip
ELCH0001048
1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM
6
C1028,
C1030,
C1053,
C1055,
C1059,
C1066,
C634
Capacitor,
Ceramic, Chip
ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -
6
R311,
R613,
R627
ROHM.
6 FB601, FB602 Filter, Bead SFBH0001503
HH-1M1608-601JT_1 600 ohm 1.6X0.8X0.8MM 25%
0.35 ohm 0.75A SMD R/TP 2P 0 CERATECH
CORPORATION
6 FL500 Filter, EMI/Power SFEY0015301
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP
MURATA MANUFACTURING CO., LTD.
6 C1105
Chip
ELCH0004721
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
- 04 -
6
C323,
C570,
C607,
C617,
C800,
C801,
C803,
C804
Capacitor,
Ceramic, Chip
ECZH0025916
GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C
6
C1042,
C302,
C303,
C327,
C328
Capacitor,
Ceramic, Chip
ECZH0025917
GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C
6
C1023,
C1029,
C500,
C515,
C561,
C619
Capacitor,
Ceramic, Chip
ECCH0009216
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C
6 L1016
Chip
ELCH0003844
LQG15HS2N0S02D 2NH 0.3NH - 300mA 0.1OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
6
VA701,
VA702,
VA703,
VA704,
VA705,
VA706,
VA707
Varistor SEVY0004301
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
6
C1009,
C1011,
C1047,
C205,
C308,
C411,
C413,
C415,
C425,
C429,
C433,
C569,
C627
Capacitor,
Ceramic, Chip
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6 CN501 Connector, I/O ENRY0009601
GU074-5P-SD-E1500 5P 0.65MM ANGLE
RECEPTACLE DIP R/TP - LS Mtron Ltd.
6 U1002 IC, Power Amplifier SMPY0020101
ACPM-5281-TR1 dBm, %, A, dBc, dB, 4x5, SMD, 3G
Dual PAM B1+8. Coupler Integrated, LGA, R/TP,
AVAGO TECHNOLOGIES INTERNATIONAL SALES
PTE. LIMITED
- 05 -
6
R624,
R625
ROHM.
6
C204,
C239,
C242
Capacitor,
Ceramic, Chip
ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -
55TO+85C 0603 R/TP 0.3MM MURATA
MANUFACTURING CO., LTD.
6
C1005,
C1014
Capacitor,
Ceramic, Chip
ECZH0000844
C1005C0G1H680JT000F 68pF 5% 50V NP0 -
COOPERATION
6
C1065,
C1096,
C1101,
L1014,
L202,
R1000
Capacitor,
Ceramic, Chip
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6
L1001,
L1010
Capacitor,
Ceramic, Chip
ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -
COOPERATION
6 C325
Capacitor,
Ceramic, Chip
ECCH0009203
GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C
6
C1033,
C1038, L1027
Chip
ELCH0001036
CO., LTD
MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -
ROHM.
6
C1003,
C1010, L1021
Capacitor,
Ceramic, Chip
ECCH0000901
C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -
COOPERATION
6 L1006
Chip
ELCH0004717
1005GC2T82NJLF 82NH 5% - 150mA 2.1OHM 700MHZ
ELECTRONICS LTD.
6
R808,
R809
MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
6
C211,
C234
Capacitor,
Ceramic, Chip
ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
ROHM.
6
C1004,
L1004,
L1007
Chip
ELCH0004714
1005GC2T18NJLF 18NH 5% - 200mA 0.65OHM
- 06 -
6
FB603,
FB604,
FB605,
FB606
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2
ohm 0.2A SMD R/TP 2P 0 MURATA
6 CN701 Connector, BtoB ENBY0051001
GB042-10S-H10-E3000 10P 0.4MM STRAIGHT
FEMALE SMD R/TP 1M - LS Mtron Ltd.
6 U200
Filter, Separator,
FEM
SMZY0028001
RF5501 - - - RF5501, QFN, 12p, 2.0*2.0*0.5, SP3T+LNA
for BT/WiFi with BCM4325/29/30 RF MICRO DEVICES
INC
6
R300,
R502
ROHM.
ROHM.
6
R302,
R510
MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP -
ROHM.
MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP -
ROHM.
6 L1034
Chip
ELCH0001405
LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM
9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.
6 FL1005 Filter, Saw SFSY0028101
SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5P
6 U301 IC, MCP, NOR EUSY0216301
NC7SV00P5X_NL SC70 , 5 PIN, R/TP , Single 2-Input
NAND Gate FAIRCHILD SEMICONDUCTOR
6 U501 IC, PMIC EUSY0342201
PM7540 -0.5~18 N/A 0W CSP R/TP 137P -
QUALCOMM INCORPORATED.
ROHM.
6
R309,
R401,
R404,
R405
PCB ASSY, MAIN,
PAD OPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
6
C1068,
C1084,
C1085,
C1086,
C1087,
C246
Capacitor,
Ceramic, Chip
ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R -
6 L207
Chip
ELCH0003842
LQG15HSR10J02D 100NH 5% - 150mA 1.25OHM
600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
- 07 -
6 C1088
Chip
ELCH0004725
1005GC2T33NJLF 33NH 5% - 200mA 1OHM 1.3GHZ 8
SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
FL700,
FL701,
FL702,
FL703,
FL704
Filter, EMI/Power SFEY0010501
ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD
R/TP INNOCHIPS TECHNOLOGY
6
FL705,
FL706,
FL707
Filter, EMI/Power SFEY0011401
ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD
R/TP INNOCHIPS TECHNOLOGY
6 U202
IC, LDO Voltage
Regulator
EUSY0407101
BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mA
Single LDO, IC, LDO Voltage RegulatorIC, LDO Voltage
Regulator ROHM.
6
R319,
R706,
R807
MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP -
ROHM.
6 C245
Capacitor,
Ceramic, Chip
ECCH0009212
GRM0335C1E4R7C 4.7pF 0.25PF 25V X7R -
CO., LTD.
ROHM.
6 L209
Chip
ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
6 L205
Chip
ELCH0004108
LLV0603-FH2N2S 2.2NH 0.3NH - 250mA 0.2OHM
8.5GHZ 5 SHIELD NONE 0.6X0.3X0.3MM R/TP TOKO,
INC.
6
VA602,
VA603
IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3
IEC61000-4-1 (ESD) level #4 SMD R/TP INNOCHIPS
TECHNOLOGY
MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -
ROHM.
6
VA700,
VA800
EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.
ROHM.
6
C526,
C527,
C528,
C541,
C542
Capacitor,
Ceramic, Chip
ECCH0006201
C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -
- 08 -
AXT614124 14P 0.4MM STRAIGHT HEADER SMD
R/TP 1M - BJ PANASONIC ELECTRONIC PARTS
CO., LTD
ROHM.
6 L201
Capacitor,
Ceramic, Chip
ECCH0000112
MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP -
ROHM.
6
C222,
C223,
C224,
C244
Capacitor,
Ceramic, Chip
ECCH0009514
MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6 L600
Chip
ELCH0010402
LK1005 R27K-T 270NH 10% - 25mA 0.91OHM 120MHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD
6 U503
IC, Over Voltage
Protection
EUSY0374601
MAX14528 MAX14528, TDFN, 8, R/TP, Programmable
OVP MAXIM INTEGRATED PRODUCTS INC.
6
R1010,
R514
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -
ROHM.
6 U604
IC, Geomagnetic
Sensor
EUSY0418501
AMI304 QFN, 12, R/TP, Geomagnetic Sensor, IC, A/D
ConverterIC, A/D Converter - QFN R/TP 12P - AICHI
STEEL CORPORATION
6
R1008,
R1009
MCR01MZP5J910 91OHM 5% 1/16W 1005 R/TP -
ROHM.
6 U1003 IC, RF Amplifier SMZY0025501
RF2815 3.3*2.1*1.0, FILTER+GPS LNA+FILTER
MODULE, GPS, RF MICRO DEVICES INC
6
D600,
D601,
D603,
D604,
ZD502
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
6
C236,
C237
Capacitor,
Ceramic, Chip
ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
6 Q601 TR, Bipolar EBK61592201
LTC014EEBFS8 NPN 0V 0V 50V 100mA 0A 35 150mW
EMT3 R/TP 3P ROHM Semiconductor KOREA
CORPORATION
6 U700 IC, Sub PMIC EUSY0378001
AAT2862 AAT2862, TQFN34, 24, R/TP, 3x4x0.8
Advanced Analogic Technologies HK Limited
- 09 -
ROHM.
6 FL200 Filter, Dielectric SFDY0003201
DEA162450BT-2096A1-H BPF 2.45GHZ 100MHz SMD
R/TP 3P TDK CORPORATION
6 C1092
Chip
ELCH0001035
CO., LTD
6
D800,
D801,
D802
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
6 R400 Wire Pad, Short SAFP0000501 LG-VS760 VRZ
6
C1025,
C1027,
C1064,
C238,
C564
Capacitor,
Ceramic, Chip
ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
6 C305
Capacitor, TA,
Conformal
ECTH0001903
F980J226MMA 22 uF, 6.3V, M, L_ESR, 1608, R/TP
NICHICON CORPORATION, EAST JAPAN SALES
OFFICE
6
C532,
C635
Capacitor,
Ceramic, Chip
ECCH0000155
CORPORATION
6 C705
Capacitor,
Ceramic, Chip
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C
MECHANICS CO., LTD.
6 C1077
Chip
ELCH0004712
4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
C321,
C322
Capacitor,
Ceramic, Chip
ECCH0010501
GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R)
6
L1017,
L1019,
L1025,
L601,
L602
Chip
ELCH0001411
LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM
16GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.
6
R306,
R314,
R402,
R611,
R612
ROHM.
6 R1011, R1012 Resistor, Chip ERHZ0003801
MCR01MZP5J5R1 5.1OHM 5% 1/16W 1005 R/TP -
ROHM.
- 10 -
6
C610,
C611,
C628
Capacitor,
Ceramic, Chip
ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C
1005 BK-DUP - MURATA MANUFACTURING CO.,
LTD.
SAFEB897MAM0F00 897.5MHz 1.4*1.1*0.6 SMD R/TP
5P MURATA MANUFACTURING CO., LTD.
6
C612,
C613
Capacitor,
Ceramic, Chip
ECCH0000161
CORPORATION
RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP -
6 U401 IC, MCP, NAND EUSY0363306
H8BCS0UN0MCR-4EM NAND/4G SDRAM/2G
1.7VTO1.9V 13.0x10.5x1.2 TR 137P - - - HYNIX
SEMICONDUCTOR INC.
6
C606,
C703
Capacitor,
Ceramic, Chip
ECCH0005602
GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C
6 L1030
Chip
ELCH0001430
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM
TOKO, INC.
6 C1016, C1021
Capacitor,
Ceramic, Chip
ECZH0000839
COOPERATION
6
D301,
D602
PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
6
C235,
C240
Capacitor,
Ceramic, Chip
ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C
1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
6 C226
Capacitor,
Ceramic, Chip
ECZH0000806
C1005C0G1H050CT000F 5pF 0.25PF 50V NP0 -
COOPERATION
6 FL1001 Filter, Saw, Dual SFSB0001902
SAWEN1G84CN0F00 1842.5MHz, 1960MHz
1.8*1.4*0.5 SMD R/TP 10P MURATA
6 U600
IC, Audio Sub
System
EUSY0420001
TPA2055D3 1.6~5.5V 0W WLCSP R/TP 20P - TEXAS
INSTRUMENTS INCO.
6 C1040, C1052
Chip
ELCH0004713
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ
ELECTRONICS LTD.
ROHM.
- 11 -
6 C1094
Capacitor,
Ceramic, Chip
ECCH0000701
6 J800 Card Socket ENSY0024302
KP09NC-6S-2.54SF SIM 6P ANGLE SMD R/TP Stroke :
11.25mm HIROSE KOREA CO., LTD
6 C1075
Chip
ELCH0004709
6 D501 Diode, Switching EDSY0010501
KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESC
R/TP 2P 1 KEC CORPORAITION
6 L1032
Capacitor,
Ceramic, Chip
ECCH0000196
MCH155A0R75C 0.75pF 0.25PF 50V NP0 -55TO+125C
CORPORATION
ROHM.
6 C562
Capacitor,
Ceramic, Chip
ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C
RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP -
6 L208
Inductor, Wire
Wound, Chip
ELCP0012101
CIG21L3R3MNE 0H 20% - 800mA 0.22OHM - - SHIELD
2X1.25X1MM NONE - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6 L500
Inductor, Wire
Wound, Chip
ELCP0011901
CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -
SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITOR
CO, LTD.
MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP -
ROHM.
6
R1003,
R312
MCR01MZP5J470 47OHM 5% 1/16W 1005 R/TP -
ROHM.
ROHM.
6 ZD401 Diode, TVS EDTY0008601
PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1
PROTEK DEVICES INC.
6 U1001 RF Module SMRH0006201
SKY77544 MHz, MHz, POLA EDGE QUAD TX
MODULE, SP9T, 6.0*6.0*1.0, 28p, SKYWORKS
SOLUTIONS INC.
6 L1015
Chip
ELCH0001408
LL1005-FHL6N8J 6.8NH 5% - 300mA 0.23OHM 5.6GHZ
9 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
- 1 -
ROHM.
6 L1038
Chip
ELCH0003838
LQG15HS8N2J02D 8.2NH 5% - 300mA 0.24OHM
6 L1009
Chip
ELCH0004711
1005GC2T22NJLF 22NH 5% - 200mA 0.8OHM 1.5GHZ
ELECTRONICS LTD.
6 U504 IC, MUIC EUSY0372001
TS5USBA33402YZPR TS5USBA33402, MUIC WCSP
R/TP 20P TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6 L504
Inductor, Wire
Wound, Chip
ELCP0008004
MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ
0 SHIELD 2.0X1.6X1.0MM NONE R/TP FDK
CORPORATION.
6 S800 Socket, Card ENSY0023601
SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPS
ELECTRIC KOREA CO., LTD.
6 U300
IC, Digital
Baseband
Processor, 3G
EUSY0392302
MSM7227 0VTO0V 0W 560P - BGA R/TP 560P
QUALCOMM INCORPORATED.
6 FL1000 Filter, Saw, Dual SFSB0001802
SAWEN881MCN0F00 881.5MHz, 1960MHz 1.8*1.4*0.5
SMD R/TP 10P MURATA MANUFACTURING CO.,
LTD.
6 C232
Capacitor,
Ceramic, Chip
ECCH0000149
MCH155CN332KK 3.3nF 10% 50V X7R -55TO+125C
CORPORATION
6 C212
Capacitor,
Ceramic, Chip
ECZH0000846
COOPERATION
6 FL1004
Filter, Duplexer,
IMT
SDMY0002801
B7953 942500000 925 to 960 897500000 880 to 915 3.8
2.9 2.5x2.0x0.94 DUAL SMD R/TP - EPCOS PTE LTD.
B9444 1575.42MHz 1.4*1.1*0.45 SMD R/TP 5P
EPCOS PTE LTD.
6 C1099
Capacitor,
Ceramic, Chip
ECCH0000113
MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005
6 L1000
Chip
ELCH0004727
1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM
600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
6 U302 IC, Flip Flop EUSY0408201
74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP
6P - STC CORP.
MCR006YZPJ470 47OHM 5% 1/20W 0603 R/TP -
ROHM.
- 13 -
6 L206
Chip
ELCH0001421
LL1005-FHL47NJ 47NH 5% - 200mA 1.3OHM 1.5GHZ
6 J600 Jack, Phone ENJE0008001
JAM3333-F32-7F 1P 4P ANGLE R/TP 4mM BLACK 6P
- HON HAI PRECISION INDUSTRY CO., LTD.
MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP -
ROHM.
6 U201 IC Assembly EUSY0433901
BCM43291SKUBG WLBGA , 181 , R/TP ,
WiFi(11bgn)+BT+FM(Rx), BT3.0+HS, 6.57x5.62x0.55,
182pin, 0.4p , ; , IC Assembly BROADCOM ASIA
DISTRIBUTION PTE LTD
MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -
ROHM.
6 X500 Crystal EXXY0024301
CM315(12.5PF) 32.768KHZ 20PPM 12.5PF 32*15 SMD
R/TP CITIZEN DISPLAYS CO., LTD.
6 L1013
Chip
ELCH0003819
LQG15HS12NJ02D 12NH 5% - 300mA 0.28OHM 3GHZ
8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATA
RC1005F6041CS 6.04KOHM 1% 1/16W 1005 R/TP -
6 C306
Capacitor,
Ceramic, Chip
ECCH0009230
GRM033R61A222K 2.2nF 10% 25V X5R -55TO+85C
6 Q600 FET EQFP0004501
SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A
0.28OHM 340mW SOT323 R/TP 9P VISHAY
INTERTECHNOLOGY ASIA PTE LTD
6 CN500
Connector,
Terminal Block
ENZY0030401
KQ03LV-3R 3, 2.5 mm, STRAIGHT, Gold, Twin One
board 5.4mm HIROSE KOREA CO., LTD
6 L1003
Chip
ELCH0001425
LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ
SOCKET SMD R/TP 1M ENGINEERING PLASTIC
UL94V-0 AU OVER NI LS Mtron Ltd.
6 U701 IC, Level Translator EUSY0391601
NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P -
SCG HONG KONG SAR LTD.
ROHM.
SOCKET SMD R/TP 1M - LS Mtron Ltd.
- 14 -
6 C1018
Capacitor,
Ceramic, Chip
ECCH0009226
GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C
6 Q500 FET EQFP0008601
NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A
0.07OHM 1.3W TSOP6 R/TP 8P ON
SEMICONDUCTOR
SAFEB2G14FB0F00 - - - - 2P MURATA
ROHM.
6 LD800, LD801 LED, Chip EDLH0005901
WHITE 2.85~3.15 20mA 45~60mcd
(X:Y=0.273/0.295~0.332/0.358) 75mW 1608 R/TP 2P -
6
FB603,
FB604,
FB605,
FB606
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2
ohm 0.2A SMD R/TP 2P 0 MURATA
6
R808,
R809
MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
6
VA602,
VA603
IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3
IEC61000-4-1 (ESD) level #4 SMD R/TP INNOCHIPS
TECHNOLOGY
6
R311,
R613,
R627
ROHM.
6
ZD800,
ZD801,
ZD802
VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P
5 ROHM.
6
C210,
C228,
C243,
C247,
C248,
C311,
C313,
C545,
C546,
C548,
C566,
C571,
C805
Capacitor,
Ceramic, Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
55TO+85C 1005 R/TP - TDK KOREA COOPERATION
- 15 -
2 EAY060000 Adapters SSAD0038301
100-240V, 5060 Hz, 5.1 V, 700 mA, CE, AC-DC Adaptor,
90Vac~264Vac, 5.1V, 700mA, 5060, WALL 2P, USB,
2 AFN053800
Manual Assembly,
Operation
- AFN75431803
LGP350.ADEUSV ZZ:Without Color LGP350 manual
assy for DEU
3 MBM087200 Card, Warranty MCDF0001110
COMPLEX KP202 VDG ZZ:Without Color PRINTING,
(empty),
3 MFL053800 Manual, Operation MFL67159903
COMPLEX LGP350.ADEUSV ZZ:Without Color LGP350
manual for DEU
2 SBPL01
Rechargeable
Battery, Lithium Ion
SBPL0103501
BL-42FN-WW 3.7 V, 1250 mAh, 1 CELL, PRISMATIC,
424261, INNERPACK, WW, PRISMATIC, BLACK,
TOCAD DONG-HWA CO., LTD
2 EBX000000
Accessory, Data
Cable
SGDY0016701
KCA-ET-8-0020 KCA-ET-8-0020 Micro USB, 1.2M
KSD CO., LTD
2 EAB010200 Earphone, Stereo SGEY0003744
EMB-LGE004MSKB 3mW 16OHM 115DB
85HZTO126HZ 1M BLACK 3.5 L TYPE STEREO
4POLE PLUG - CRESYN CO., LTD
12.3 Accessory

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Internal Use Only

E. Notice of Radiated Emissions

Service Dial Number No

2) WCDMA transmitter specification

3) WCDMA receiver specification

4) HSDPA transmitter specification

5) HSDPA receiver specification

7) WLAN 802.11g transceiver specification

3.2 GSM MODE

3.2.2 GSM TRANSMITTER

3.3 UMTS MODE

3.3.2 UMTS TRANSMITTER

3.4 GPS RECEIVER

3.6 OFF-CHIP RF COMPONENTS

3.6.3 ASM + GSM PAM (U1001, SKY77544)

3.6.4 GPS LNA (U1003, RF2815)

3.7 Digital Baseband(DBB/MSM7227)

3.9 Subsystem (MSM7227)

3.9.8. Mode Select and JTAG Interfaces

3.10 Power Block

3.10.3. Charging control

3.10.3.3. Constant Voltage Charging

3.11 External memory interface

3.12 H/W Sub System

3.12.1.4. BCM43291SKUBG (BT / WiFi chip )

3.12.2 MSM Sub System

3.12.3.3 KEY Backlight

3.13.2. Audio signal processing & interface

3.13.2.2 TPA2055D3 audio interface

3.15 Vibrators (Q-Coin Motor)

3.19 Main component

3.19.3. LG-P350 Main component (Top)

3.19.5. BaseBand AND Power of LG-P350

3.19.7. Audio of LG-P350

RF component (WCDMA / GSM)

4.2 SIGNAL PATH

4.3 Checking TCXO Block

4.4 Checking GSM TX Module(GSM PAM + ASM) Block

4.5.1Checking TCXO Block

4.5.4. Checking PAM Block

4.5.5. Checking RF Rx Level

4.6.1 Checking TCXO Block

4.6.4 Checking RF Rx Block

4.7 GPS/WIFI/BT RF Component

4.8 GPS/WIFI/BT SIGNAL PATH

4.9 GPS/WIFI/BT Trouble shooting

4.9.2 WLAN/BT/FM Block

Main chip part

Main clock part

4.12 3M FF Camera trouble

4.13 Audio Trouble

4.13.5. Microphone for headset

4.15 Motion Sensor on/off trouble

4.17 Q coin Motor

8. BGA PIN MAP

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