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Service Manual

Internal Use Only

Service Manual GT500

Model : GT500

Date: June, 2009 / Issue 1.0

Table Of Contents
1. INTRODUCTION ............................................... 5
1.1 Purpose ......................................................................5 1.2 Regulatory Information .................................................5 4.19 Checking Front End Module Block input logic ..........133 4.20 Checking WCDMA Block ........................................144 4.21 Checking GSM Block .............................................157

2. PERFORMANCE............................................... 7
2.1 System Overview .........................................................7 2.2 Usable environment .....................................................8 2.3 Radio Performance ......................................................8 2.4 Current Consumption .................................................16 2.5 RSSI .........................................................................16 2.6 Battery Bar................................................................16 2.7 Sound Pressure Level ................................................17 2.8 Charging ...................................................................18

5. Download ................................................... 169


5.1 Requirements..........................................................169 5.2 GT500 / GT505 Download .......................................170

6. Block Diagram ........................................... 178 7. CIRCUIT DIAGRAM ...................................... 179 8. BGA Pin Map .............................................. 189 9. PCB LAYOUT ............................................... 195 10. CALIBRATION ............................................ 203
10.1 General Description ...............................................203 10.2 Environment ..........................................................203 10.3 Calibration Environment .........................................204 10.4 Program Operation ................................................205

3. Technical Description .................................. 19


3.1 Digital Baseband (DBB) & Multimedia Processor ..........19 3.2 Visual part.................................................................39 3.3 Audio Part .................................................................47 3.4 GPADC (General Purpose ADC) and AUTOADC2 ...........54 3.5 Charger control .........................................................55 3.6 Voltage Regulation .....................................................61 3.7 RF Technical Description ............................................62

11. EXPLODED VIEW & REPLACEMENT PART LIST ................................................. 211


11.1 EXPLODED VIEW ...................................................211 11.2 Replacement Parts ................................................213 11.3 Accessory .............................................................243

4. TROUBLE SHOOTING ..................................... 73


4.1 Power ON Trouble ......................................................73 4.2 USB Trouble ..............................................................74 4.3 SIM Detect Trouble ....................................................75 4.4 MicroSD card Trouble ................................................76 4.5 Key and Touch Screen Trouble ....................................77 4.6 Camera Trouble .........................................................81 4.7 Main LCD Trouble ......................................................87 4.8 Keypad Backlight Trouble ...........................................90 4.9 Audio Trouble Shooting ..............................................93 4.10 Charger Trouble Shooting .......................................108 4.11 Bluetooth Trouble...................................................111 4.12 Wi-Fi Trouble .........................................................114 4.13 GPS Trouble ..........................................................116 4.14 RF Component ......................................................119 4.15 Procedure to check ...............................................120 4.16 Checking Common Power Source Block..................121 4.17 Checking VCXO Block ............................................128 4.18 Checking Front End Module Block ..........................132

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1. INTRODUCTION

1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information


A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

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1. INTRODUCTION

E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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2. PERFORMANCE

2. PERFORMANCE
2.1 System Overview
Item Shape Size Weight Power Talk Time Specification GSM850/900/1800/1900 & WCDMA Band 1, 8 Bar type - Dual Mode Handset 107 x 54.5 x 11.8 mm 98g (with standard battery) 1000mAh Li-ion Over 200 Min (WCDMA, Tx=10 dBm, Voice) Over 200 Min (GSM, Tx=Max, Voice) Over 300 hrs (WCDMA, DRX=7) Standby Time Antenna Main LCD Main LCD BL Vibrator Speaker MIC Receiver Earphone Jack SIM Socket Volume Key Camera Key External Memory I/O Connect Over 300 hrs (GSM, Paging period=5) Intenna type 3"(400x240), 262K TFT Color LCD White LED Backlight Yes (Coin Type) Yes Yes (SMD Type) Yes Yes Yes(SIM Block Type) : 3.0V & 1.8V Push Type ( + , - ) Push Type Micro SD Socket 5 Pins

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2. PERFORMANCE

2.2 Usable environment


1) Environment
Item Voltage Operating Temp. Storage Temp. Humidity Spec. 3.7 (Typ), 3.4 (Min), (Shut Down: 3.2) -20 ~ + 60 -30 ~ + 85 max. 85 Unit V C C %

2) Environment (Accessory)
Item Power Spec. Available power Min 100 Typ. 220 Max 240 Unit Vac

* CLA : 12~24V (DC)

2.3 Radio Performance


1) Transmitter GSM Mode
No Item GSM 100k ~ 1GHz MS allocated Channel 1G ~ 12.75GHz Conducted Spurious Emission Idle Mode 100k ~ 880MHz 880M ~ 915MHz 915M ~ 1000Mz 1G ~ 1.71GHz 1.71G ~ 1.785GHz 1.785G ~ 12.75GHz -33dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm -39dBm DCS/PCS 9k ~ 1GHz 1G ~ 1710MHz 1710M ~ 1785MHz 1785M ~ 12.75GHz 100k ~ 880MHz 880M ~ 915MHz 915M ~ 1000MHz 1G ~ 1.71GHz 1.71G ~ 1.785GHz 1.785G ~ 12.75GHz -39dBm -33dBm -39dBm -33dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm

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2. PERFORMANCE

No

Item

GSM 30M ~ 1GHz -36dBm

DCS/PCS 30M ~ 1GHz -36dBm -30dBm -36dBm -30dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm

MS allocated Channel Radiated 1 Spurious Emission Idle Mode

1G ~ 1710MHz 1710M ~ 1785MHz 1785M ~ 4GHz 30M ~ 880MHz 880M ~ 915MHz 915M ~ 1000MHz 1G ~ 1.71GHz 1.71G ~ 1.785GHz 1.785G ~ 4GHz 0.1ppm 5(RMS) 20(PEAK)

1G ~ 4GHz 30M ~ 880MHz 880M ~ 915MHz 915M ~ 1000Mz 1G ~ 1.71GHz 1.71G ~ 1.785GHz 1.785G ~ 4GHz

-30dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm

2 3

Frequency Error Phase Error

0.1ppm 5(RMS) 20(PEAK) 3dB below reference sensitivity

3dB below reference sensitivity RA250: 250Hz HT100: 250Hz TU50: 150Hz TU1.5: 200Hz

Frequency Error Under Multipath and Interference Condition 4

RA250: 200Hz HT100: 100Hz TU50: 100Hz TU3: 150Hz 0 ~ 100kHz 200kHz 250kHz +0.5dB -30dB -33dB -60dB -66dB -69dB -71dB -77dB -19dB -21dB -21dB -24dB

0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 6000kHz 6000kHz

+0.5dB -30dB -31dB -33dB -60dB -60dB -73dB

Due to Output RF Spectrum modulation

400kHz 600 ~ 1800kHz 1800 ~ 3000kHz 3000 ~ 6000kHz 6000kHz

5 Due to Switching transient

400kHz 600kHz 1200kHz 1800kHz

400kHz 600kHz 1200kHz 1800kHz

-22dB -24dB -24dB -27dB

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No

Item

GSM

DCS/PCS Frequency offset 800kHz

Intermodulation attenuation

Intermodulation product should be Less than 55dB below the level of Wanted signal Tolerance (dB) 3 3 3 3 3 3 3 3 3 3 3 5 5 5 5 Power control Level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Power (dBm) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Mask IN Tolerance (dB) 3 3 3 3 3 3 3 3 3 4 4 4 4 4 5 5

Power control Level 5 6 7 8 9 10 8 Transmitter Output Power 11 12 13 14 15 16 17 18 19

Power (dBm) 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5

Burst timing

Mask IN

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2. PERFORMANCE

2) Transmitter WCDMA Mode

No 1 2 3

Item Maximum Output Power Frequency Error Open Loop Power control in uplink

Specification Class3: +24dBm(+1/-3dB) Class4: +21dBm(2dB) 0.1ppm 9dB@normal, 12dB@extreme Adjust output cmd 1dB +1 +0.5/1.5 0 -0.5/+0.5 -1 -0.5/-1.5 group(10equal +1 +8/+12 (TPC command) 2dB 3dB +1/3 +1.5/4.5 -0.5/+0.5 -0.5/+0.5 -1/-3 -1.5/-4.5 command group) +

Inner Loop Power control in uplink

Minimum Output Power

-50dBm(3.84MHz) Qin/Qout:DPCCH quality levels Toff@DPCCH/lor:-22->-28dB Ton@DPCCH/lor:-24->-18dB -56dBm(3.84M) 25us PRACH, CPCH, uplink compressed mode

Out-of-synchronization handling of output power

Transmit OFF Power

Transmit ON/OFF Time Mask

Change of TFC

25us power varies according to the data rate DTX: DPCH off (minimize interference between UE) 3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(f-2.5)dBc@f=2.5~3.5MHz, 30k -35-1*(f-3.5)dBc@f=3.5~7.5MHz, 1M -39-10*(f-7.5)dBc@f=7.5~8.5MHz, 1M -49 dBc@f=8.5~12.5MHz, 1M

10 11

Power setting in uplink compressed Occupied Bandwidth(OBW)

12

Spectrum emission Mask

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2. PERFORMANCE

No 13

Item Adjacent Channel Leakage Ratio(ACLR)

Specification 33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1k BW -36dBm@f=150KHz~30MHz, 10k -36dBm@f=30~1000MHz, 100k -30dBm@f=1~12.75GHz, 1M -41dBm*@1893.5~1919.6MHz, 300k -67dBm*@925~935MHz, 100k -79dBm*@935~960MHz, 100k -71dBm*@1805~1880MHz, 100k -31dBc@5MHz, Interferer -40dBc -41dBc@10MHz, Interferer -40dBc 17.5% (>-20dBm) (@12.2k, 1DPDCH+1DPCCH) -15dB@SF=4, 768kbps, multi-code transmission

14

Spurious Emissions *: additional requirement

15

Transmit Intermodulation

16

Error Vector Magnitude(EVM)

17

Transmit OFF Power

3) Receiver - GSM Mode


No Item GSM -105dBm C/Ic=7dB C/Ia1=-12dB C/Ia2=-44dB Wanted Signal: -98dBm 1st interferer: -44dBm 2st interferer: -45dBm Wanted Signal: -101dBm Unwanted Signal: Depend on freq. DCS/PCS -105dBm C/Ic=7dB C/Ia1=-12dB C/Ia2=-44dB Wanted Signal: -96dBm 1st interferer: -44dBm 2st interferer: -44dBm Wanted Signal: -101dBm Unwanted Signal: Depend on freq.

1 Sensitivity (TCH/FS Class II) 2 3 Co-Channel Rejection (TCH/FS Class II, RBER, TUhigh/FH) Adjacent Channel Rejection 200kHz 400kHz

Intermodulation Rejection

Blocking Response (TCH/FS Class II, RBER)

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2. PERFORMANCE

4) Receiver WCDMA Mode

No 1

Item Reference Sensivitivity Level

Specification -106.7dBm(3.84M) -25dBm(3.84MHz) -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(class3) 33dB UE@+20dBm output power(class3) -56dBm/3.84MHz@10MHz UE@+20dBm output power(class3)

Maximum Input Level

Adjacent Channel Selectivity(ACS)

In-band Blocking -44dBm/3.84MHz@15MHz UE@+20dBm output power(class3) -44dBm/3.84MHz@f=2050~2095 & 2185~2230MHz, band a) UE@+20dBm output power(class3) -30dBm/3.84MHz@f=2025~2050 & 2230~2255MHz, band a) UE@+20dBm output power(class3) -15dBm/3.84MHz@f=1~2025 & 2255~12500MHz, band a) UE@+20dBm output power(class3)

Out-band Blocking

Spurious Response

-44dBm CW UE@+20dBm output power(class3) -46dBm CW@10MHz & -46dBm/3.84MHz@20MHz UE@+20dBm output power(class3) -57dBm@f=9KHz~1GHz, 100k BW -47dBm@f=1~12.75GHz, 1M

Intermodulation Characteristic

Spurious Emissions

-60dBm@f=1920~1980MHz, 3.84MHz -60dBm@f=2110~2170MHz, 3.84MHz

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2. PERFORMANCE

5) Bluetooth Mode 5.1) Transmitter


No 1 2 3 Out Power Power Density Power Control Item Class 2 : -6~4dBm Power density < 20dBm per 100kHz EIRP Option 2dB step size 8dB fmax & fmin @ below the level of -30dBm (100khz BW) within 2.4GHz~2.4835GHz 1MHz -20dBm @ C/I = 2MHz -40dBm @ C/I 3MHz 140kHz delta f1 avg 175kHz delta f2max 115kHz at least 99.9% of all deltaf2max delta f2avg/deata f1avg0.8 75KHz 1 slot : 25kHz 3 slot : 40kHz 5 slot : 40kHz Maximum drift rate 20KHz/50usec Freq.Range 30MHz~1GHz 10 Out of Band Spurious Emissions Above 1GHz~12.75GHz 1.8~1.9GHz 5.15~5.3GHz Operating -36dBm -30dBm -47dBm -47dBm Standby -57dBm -47dBm -47dBm -47dBm Specification

4 5 6

TX Output Spectrum -Frequency range TX Output Spectrum -20dB Bandwidth Tx Output Spectrum -Adjacent channel Po

Modulation Characteristics

Init. Carrier Freq. Tolerance

Carrier Frequency Drift

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2. PERFORMANCE

5.2) Receiver
No 1 2 Item Sensitivity single slot packets Sensitivity multi slot packets BER0.1%@-70dBm BER0.1%@-70dBm BER 0.1%@ (Low,Mid,High Frequency) 2405MHz, 2441MHz, 2477MHz Interference Co-Channel interference, C/I co-channel 3 C/I performance Adjacent(1MHz)interference, C/I 1MHz Adjacent(2MHz)interference, C/I 2MHz Adjacent(3MHz)interference, C/I 3MHz Adjacent(3MHz)interference to in band mirror frequency, C/I image 1MHz BER 0.1%@wanted signal -67dBm interfering Signal Frequency 30MHz~2000MHz 4 Blocking Characteristic 2000MHz~2400MHz 2500MHz~3000MHz 3000MHz~12.75GHz -27dBm -27dBm -10dBm Power Level -10dBm Ratio 11dB 0dB -30dB -40dB -9dB -20dB Specification

Intermodluation Performance

BER 0.1%@wanted signal -64dBm static sinwave signal at f1=-39dBm a BT modulated signal f2=-39dBm(payload PRBS15) BER 0.1%@-20dBm

Maximum Input Level

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2. PERFORMANCE

2.4 Current Consumption


(VT test : Speaker off, LCD backlight On)
Stand by 310 Hours = 3.2mA WCDMA (DRX=7) 300 Hours = 3.3 mA GSM (paging=5period) (Tx=Max) (Tx=10dBm) 205 Min = 290 mA (Tx=10dBm) Voice Call 210 Min = 280 mA VT 150 Min = 400 mA

2.5 RSSI
GSM BAR 7 BAR 5 BAR 4 BAR 2 BAR 1 BAR 0 -922 =< RSSI -972 =< RSSI -1002 =< RSSI -1032 =< RSSI -1052 =< RSSI -1052 > RSSI WCDMA -902 =< RSSI -1052 =< RSSI -1092 =< RSSI -1112 =< RSSI -1132 =< RSSI -1132 > RSSI

2.6 Battery Bar


Indication BAR 3 (100%) : level full BAR 3 (40%) -> 2 (12%) BAR 2 (12%) -> 1 (3%) BAR 1 (3%) -> Icon Blinking & Alerting Sound POWER OFF Voltage 4.17V 0.05V 3.72 0.05V 3.62 0.05V 3.53 0.05V

3.20 0.05V

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2. PERFORMANCE

2.7 Sound Pressure Level


No 1 2 3 4 5 6 7 8 A C O U S T I C 9 10 11 12 13 14 15 16 Test Item Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) TDMA NOISE GSM: Power Level: 5 DCS: Power Level: 0 (Cell Power: -90 ~ -105dBm) Acoustic(Max Vol.) MS/HEADSET SLR: 83dB MS/HEADSET RLR: -131dB/15dB (SLR/RLR: mid-Value Setting) GSM MS DCS GSM Headset DCS SEND REV. SEND REV. SEND REV. SEND REV. -62dBm under HEAD SET MS NOM MAX NOM MAX NOM MAX NOM MAX Specification 83dB -13dB -153dB 17dB over 40dB over

refer to TABLE 30.3 refer to TABLE 30.4 NOM MAX NOM MAX NOM MAX NOM MAX NOM MAX NOM MAX -64dBm0p under -47dBPA under -36dBPA under 83dB -13dB -123dB 25dB over 40dB over

refer to TABLE 30.3 refer to TABLE 30.4 NOM MAX NOM MAX -55dBm0p under -45dBPA under -40dBPA under

17

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2. PERFORMANCE

2.8 Charging
Normal mode: Complete Voltage: 4.2V Charging Current: 700mA Await mode: In case of During a Call, should be kept 3.9V (GSM: It should be kept 3.9V in all power level WCDMA: It will not be kept 3.9V in some power level) Extend await mode: At Charging prohibited temperature(0C under or 45C over) (GSM: It should be kept 3.7V in all power level WCDMA: It will not be kept 3.7V in some power level)

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3. Technical Description

3. Technical Description
3.1 Digital Baseband (DBB) & Multimedia Processor
3.1.1 General Description
Access subsystem - Access Central Processing Unit (CPU) subsystem ARM926, Joint Test Action Group (JTAG), Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM - Access peripheral subsystems Subscriber Identity Module (SIM) interface, IrDA, Universal Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on - Digital Signal Processor (DSP) subsystem CEVA-X1620, JTAG, Static Random Access Memory (SRAM), and Program Data Read Only Memory (PDROM) - EDGE/GSM/GPRS (EGG) subsystem EGG hardware accelerators -WCDMA subsystem WCDMA hardware accelerators -Application subsystem - Application CPU subsystem containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM - Application peripheral subsystems I2C, keypad, UART, and so on - Graphics subsystem XGAM subsystem - Audio Processing Execution (APEX) and video encoder subsystems In addition to the two subsystems above, there is also a test block, chip control block, and a pad multiplexing block residing at the top level DSP - The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 KiB instruction RAM and a 64 KiB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz. - The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB. Image Signal Processor(MV9319) - MV9319 is high-end Image Signal Processor (ISP) supporting image sensors up to 5 mega pixels. Its powerful image processing fuctions such as edge enhancement, color correction, advance interpolation, Auto White Balancing increases the quality of sensor image. MV9319 also supports serial interfaces to Flash LED control. WCDMA subsystem - The digital baseband controller WCDMA subsystem incorporate a WCDMA modem - An interface to the WCMDA together with memory control and an internal single port RAM. The WCDMA subsystem has three AHB slave interfaces. - The Ericsson DB 3200 also includes HSDPA class 6 functionality. - The WCDMA subsystem is handled and provided by Ericsson. XGAM subsystem - The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. - The XGAM subsystem is handled and provided by Ericsson. Operation and Services - I2C Interface - SIM Interfaces - General Purpose I/O (GPIO) Interface - External Memory Interface that supports NAND, NOR, PSRAM, SDRAM, - JTAG - RTC - ETM9

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3. TECHNICAL DESCRIPTION

GT500 Block Diagram

Figure 3-1-1 GT500 Block Diagram

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3. TECHNICAL DESCRIPTION

Data Communication - IrDA (SIR) - UARTs (ACB, EDB (RS232)) - USB Package - 12 by 12 mm 376 balls, 0.5mm pitch TFBGA Production Package

3.1.2 External memory interface


RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory area. A. GT500 2Gb NAND flash memory + 1Gb SDRAM
Dev ice Part Name Maker Item Time Size Speed

Program speed 200s 1 page = 528 Byte 2.64MByte/s NAND flash K5D1G12ACD-D075 Samsung Erase speed 2ms 1 Block = 16K Byte 8MByte/s

Table 3- 1- 1. External Memory Interface Spec. of GT500

Figure 3- 1- 2. External Memory Configuration of GT500

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3. TECHNICAL DESCRIPTION

3.1.3 Hardware Architecture


A. Block Diagram
g

Figure 3-1-3. Access system of Ericsson DB3200

Figure 3-1-4. Application system of Ericsson DB3200

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3. TECHNICAL DESCRIPTION

B. CPU Subsystem - Access CPU subsystem The digital baseband controller includes an access CPU subsystem, which includes the submodules described below. 32 KiB I-cache 32 KiB D-cache Page table Memory Management Unit (MMU) JTAG ETM9 26 KiB I-TCM 8 KiB D-TCM - Application CPU subsystem The digital baseband controller includes an Application CPU subsystem, which includes the submodules described below. 32 KiB I-cache 32 KiB D-cache Page table MMU JTAG ETM9 8 KiB I-TCM 8 KiB D-TCM C. Peripheral Hardware Subsystem The digital baseband controller includes hardware that supports mobile terminal peripherals such as a MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the Peripheral subsystem. The functional blocks of the Peripheral subsystem connect to the peripheral bus through four separate bridges, which provide a simple interface to support different timing and memory access arrangements. D. DSP Hardware Subsystem The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kiB instruction RAM and a 64 kiB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz. The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.

E. XGAM Subsystem The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. The XGAM subsystem is handled and provided by Ericsson.

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3. TECHNICAL DESCRIPTION

F. System Control Subsystem The SYSCON is responsible for clock generation and clock and reset distribution within the digital baseband controller, as well as to external devices. The digital baseband controller chip-ID number is readable from the SYSCON. The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON controls the fundamental modes of operation within the digital baseband controller. Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control registers.

3.1.4 RF Interface
A. GSM Radio Link Interface DB3200 controls GSM RF part using these signals through GSM RF chip-RF3300. RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB
RF_DATA_A RF_DATA_B RF_DATA_C TX_ADC_STRB RF_DATA_STRB B15 B16 C15 D15 A16 QDATA_AMP_MSB IDATA_FREQ_MSB AMP_FREQ_LSB TX_ADC_STRB DATA_STR

Figure 3-1- 5. Schematic of GSM RF Interface

B. WCDMA Radio Link Interface RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_EN

RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_E ADC_I_NEG ADC_I_POS ADC_Q_NEG ADC_Q_POS TX_POW DAC_I_NEG DAC_I_POS DAC_Q_NEG DAC_Q_POS

B14 D14 B13 C13 D9 C9 C8 D8 B6 E7 D7 E6 D6

WTX_BAND_1_EN WTX_BAND_2_EN WTX_BAND_8_5_EN WPOW_DET_EN WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P WPOW_DET WTX_I_N WTX_I_P WTX_Q_N WTX_Q_P

Figure 3-1-6. Schematic of WCDMA RF Interface

LGE Internal Use Only

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Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.1.5 SIM Interface


SIM interface scheme is shown in Figure3-1-7. SDAT, SCLK, SRST ports are used to communicate DBB(DB3200) with ABB(AB3100) and filter. SIM (Interface between DBB and ABB) SDAT SCLK SRST SIM card bidirectional data line SIM card reference clock SIM card async/sync reset Table 3-1-2. SIM Interface DB3200 SIMVCC AB3100 10K SDAT SCLK SRST SDAT SCLK SRST SIMDAT SIMCLK SIMRST DAT CLK RST CARD 10K VDD

VDDE_1V8

Figure 3-1-7. SIM Interface

3.1.6 UART Interface


UART signals are connected to DB3200 GPIO through IO connector UART0 Resource ACC_GPIO_2 ACC_GPIO_3 Name ACC_UART0_RX ACC_UART0_TX UART1 APP_GPIO_0 APP_GPIO_1 APP_UART_RX APP_UART_TX APP Receive Data APP Transmit Data Note ACC Receive Data ACC Transmit Data

Table 3-1-3. UART Interface

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.1.7 GPIO (General Purpose Input/Output) map


In total 60 allowable resources. This model is using 35 resources. GPIO Map, describing application, I/O state are shown in below table. Access GPIO GPIO ACC_GPIO_0 ACC_GPIO_1 ACC_GPIO_2 ACC_GPIO_3 ACC_GPIO_4 ACC_GPIO_5 ACC_GPIO_10 ACC_GPIO_11 ACC_GPIO_12 ACC_GPIO_13 ACC_GPIO_16 ACC_GPIO_17 ACC_GPIO_20 ACC_GPIO_21 ACC_GPIO_22 ACC_GPIO_26 ACC_GPIO_27 ACC_GPIO_28 ACC_GPIO_29 ACC_GPIO_30 ACC_GPIO_31 ACC_GPIO_32 Assigned Name ACC_USB_HS_STP ACC_USB_HS_DIR ACC_UART0_RX ACC_UART0_TX ACC_USB_HS_IN_CLK ACC_USB_HS_NXT ACC_USB_HS_DATA(4) ACC_USB_HS_DATA(5) ACC_USB_HS_DATA(6) ACC_USB_HS_DATA(7) ACC_UART3_RX ACC_UART3_TX ACC_UART3_CTS ACC_UART3_RTS ACC_SPI_3AXIS_CSn Not used ACC_GP_USB_CS ACC_GP_SPI_WLAN_IRQn ACC_GP_GPS_RESETn ACC_GP_WLAN_RESETn ACC_GP_WLAN_EN ACC_GP_WLAN_PWR_DOWNn Output Output Input Output Input Input Input Input Input Input Input Output Input Output Output Output Output Input Output Output Output Output Init Status

Table 3-1-4. DB3200 ACC GPIO Map Table

LGE Internal Use Only

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Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.1.8 GPIO (General Purpose Input/Output) map

Application GPIO GPIO APP_GPIO_0 APP_GPIO_1 APP_GPIO_2 APP_GPIO_4 APP_GPIO_7 APP_GPIO_8 APP_GPIO_10 APP_GPIO_11 APP_GPIO_12 APP_GPIO_13 APP_GPIO_14 APP_GPIO_16 APP_GPIO_17 APP_GPIO_21 APP_GPIO_22 APP_GPIO_23 APP_GPIO_24 APP_GPIO_25 Assigned Name APP_UART_RX APP_UART_TX APP_GP_ISP_FLASH_SET APP_GP_VGA_SDN APP_GP_TOUCH_SCL APP_GP_TOUCH_SDA input APP_GP_TOUCH_LDO_EN APP_GP_ISP_LDO_EN APP_GP_LCD_ID Not used APP_GP_MOTORLDO_EN APP_MMC_FB_CLK APP_GP_LCD_IF1 APP_GP_USW_SCL APP_GP_USW_SDA input DCON (Dedicated) Input Output Output Output Output Output/ Output Output Output Input Output Output Input Output Output Output/ Input/Output Output Init Status

Table 3-1-5. DB3200 APP GPIO Map Table

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.1.9 USB
The USB block supports the implementation of a High-speed" device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention. The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in RAM within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO register access. High-speed (high throughput) endpoints can use DMA while slower endpoints can use FIFO register access. The USB block can request up to six DMA channels, three for IN endpoints and three for OUT endpoints.

USB Function USB_STP USB_DIR USB_CLK USB_NXT USB_DAT0 USB_DAT1 USB_DAT2 USB_DAT3 USB_DAT4 USB_DAT5 USB_DAT6 USB_DAT7 USB_CS_PD VBUS

Note ULPI stop signal ULPI direction signal USB clock ULPI next signal USB data0 USB data1 USB data2 USB data3 USB data4 USB data5 USB data6 USB data7 USB chip select Power supply for Asta USB block Table 3-1-6. USB Signal Interface of DB3200

LGE Internal Use Only

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Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

USB_DATA(0) USB_DATA(1) USB_DATA(2) ACC_USB_HS_STP ACC_USB_HS_DIR ACC_UART0_RX ACC_UART0_TX ACC_USB_HS_IN_CLK ACC_USB_HS_NXT ACC_USB_HS_DATA(4) ACC_USB_HS_DATA(5) ACC_USB_HS_DATA(6) ACC_USB_HS_DATA(7) ACC_UART3_RX ACC_UART3_TX ACC_UART3_CTS ACC_UART3_RTS

J2 USB_SE0_VM K2 USB_DAT_VP L3 USB_OE J3 K3 L8 G1 K8 F1 J8 G3 H3 G2 H9 E1 H10 D1 F3 D4 C3 G5 E4 G4 ACC_GPIO_0 ACC_GPIO_1 ACC_GPIO_2 ACC_GPIO_3 ACC_GPIO_4 ACC_GPIO_5 ACC_GPIO_6 ACC_GPIO_7 ACC_GPIO_8 ACC_GPIO_9 ACC_GPIO_10 ACC_GPIO_11 ACC_GPIO_12 ACC_GPIO_13 ACC_GPIO_14 ACC_GPIO_15 ACC_GPIO_16_USBPRB ACC_GPIO_17 ACC_GPIO_18

ACC_GP_USB_CS ACC_GPS_START ACC_USB_HS_DATA(3)

Figure 3-1-8. Schematic of DB3200 USB block

High Speed USB Interface


VBAT 10V R641 VDDE_1V8

R500

51K

R655

C500 0.1u

C501 4.7u

VCC NC2 NC1

F3 F2 F1

ACC_GP_USB_CS ACC_USB_HS_IN_CLK USB_DATA(0) USB_DATA(1) USB_DATA(2) ACC_USB_HS_DATA(3) ACC_USB_HS_DATA(4) ACC_USB_HS_DATA(5) ACC_USB_HS_DATA(6) ACC_USB_HS_DATA(7) ACC_USB_HS_NXT ACC_USB_HS_STP ACC_USB_HS_DIR

C3
TP500 A4

GND3 E4 GND2 D2 GND1 C5

B1 TP501 A1 A2 A3 A5 A6 B6 C6 D5 D6 E5 E1 E6

TEST CHIP_SEL VCC_IO1 CLOCK VCC_IO2 DATA0 RREF DATA1 DM DATA2 U502 DP DATA3 ISP1508AET FAULT DATA4 ID DATA5 CFG2 DATA6 DATA7 CFG1 NXT PSW_N STP VBUS DIR REG3V3 XTAL1 CFG0 XTAL2 REF1V8

C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6 0.1u 4.7u 0.1u 12K

USB_DM USB_DP

R509 VBUS
TP502

1K

USB_XTAL1

C512 4.7u

C513 0.1u

1%

C514

C515

C516

USB Transceiver
Figure 3-1-9. Schematic of USB Transceiver

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

R510

C517

2.2u

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LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.1.11 Bluetooth Interface


GT500 supports Bluetooth operation using STs STLC2593C Bluetooth module. A. General Description The Bluetooth interface utilizes the SPI interface for control signals going to and from the Bluetooth module. The SPI is also used for data transmissions. It uses the PCM interface for transmitting audio to and from the Bluetooth module. The Bluetooth module uses both the 26 MHz master clock signal and the 32,768 kHz low-frequency clock signal for internal timing within the Bluetooth module. The intention is to use the low-frequency clock as a low-power timing provider and to use the 26 MHz as a high precision timing reference used mainly by the Bluetooth radio during operation. The clock request mechanism is used to minimize current consumption for the total system. The intention is to use the CLKREQ signal to ask for the master clock when needed, for example, when the Bluetooth radio is operating. B. SPI Interface The physical SPI interface is made up of 5 signals : clock, chip select, data in, data out and interrupt. When the SPI mode is selected , these signals are available through the BT_UART/BT_SPI and BT_HOST_WAKEUP pins. The SPI interface is Master at the Host side, and Slave at the BT Controller side. It is designed to work with the H4 and enhanced H4 protocol. Also synchronous data packet transfer (sSCO) over HCI is supported. The SPI data length and endianness are configurable. The SPI interface can only operate in half duplex mode. C. PCM Interface The PCM interface is used to send audio to and from the Bluetooth module. The interface is a synchronous interface using a PCM clock and a PCM sync signal for synchronization. Two data signals are used for data, one in each direction. The PCM clock signal operates at frequencies as high as 1 MHz. The word length of the audio data can be 8 or 16 bits. Furthermore, the PCM interface has a function known as MP-PCM, which is an addressing scheme, used to have more than two devices talking on the bus. To add this function, the data pins have to be bi-directional. Additionally, the position of the audio data relative to the frame sync pulse must be selectable. During the periods within a frame that a device is not transmitting audio data, it must put both PCM data signals in a high-impedance state to allow other devices access. D. Master Clock and Clock Request Interface The master clock (MCLK) is a 26 MHz signal used as the high precision clock signal for the Bluetooth module. The signal can be switched on and off by the platform. The master clock request (CLKREQ) is used by the Bluetooth module to ask for the master clock. If the Bluetooth module asserts the signal high, it gets the master clock. The other alternative for the Bluetooth module is to set the clock request output to high impedance state, indicating that it does not need the master clock. The Bluetooth module receives the master clock, if other parts of the chipset request it. E. Low Frequency Clock Interface The low-frequency clock signal (RTCCLK) is used by the Bluetooth module as a low-power clock. The clock is used in different Bluetooth modes, like sniff and park, to have a correct timing on the Bluetooth air interface without having the master clock running.

LGE Internal Use Only

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Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

The low-frequency clock is always present, in some applications even when the chipset is powered down. F. STLC2593C Based on Ericsson Technology Licensing Baseband Core (EBC) Bluetooth specification compliance: V2.1 + EDR.(Lisbon) Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability Support ACL and SCO links Entended SCO (eSCO) links Faster Connection HW support for packet types ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3,2-DH5,3-DH1,3-DH3, 3-DH5 SCO: HV1, HV3 and DV eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5 Adaptive Frequency Hopping (AFH) Channel Quality Driven Data Rate (CQDDR) Lisbon Feature Encryption Pause/Resume (EPR) Entended Inquiry Response (EIR) Link Supervision Time Out (LSTO) Secure Simple Pairing Sniff Subrating Quality of Service (QoS) : Packet Boundary Flag, Erroneous Data Delivery Transmit Power Power Class 2 and Power Class 1.5 (above 4 dBm) Programmable output power Power Class 1 compatible HCI HCI H4 and enhanced H4 Transport Layer HCI proprietary commands (e.g. peripherals control) Single HCI command for patch/upgrade download eSCO over HCI supported Supports Pitch-Period Error Concealment (PPEC) Efficient and flexible support for WLAN coexistence scenarios Low power consumption Ultra low power architecture with 3 different low power levels Deep Sleep modes, including Host-power saving feature Dual Wake-up mechanism: initiated by the Host or by the Bluetooth device Communication interfaces Fast UART up to 4 MHz Flexible SPI interface up to 13 MHz PCM interface Up to 10 additional flexibly programmable GPIOs External interrupts possible through the GPIOs Fast I2C interface as master Clock support System clock input (digital or sine wave) at 9.6, 10, 13, 16, 16.8, 19.2, 26, 33.6 or 38.4MHz Low Power clock input at 3.2, 32 and 32.768 kHz ARM7TDMI CPU Memory organization On chip RAM, including provision for patches On chip ROM, preloaded with SW up to HCI Ciphering support up to 128 bits key11

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL DESCRIPTION

G. GT500 Bluetooth Schematic


VDD_BT VDDE_1V8

BT_CLKREQ_n MCLKSEC

U730 SN74LVC1G125DRLR 5 1 _OE VCC 2 A 4 3 GND Y R731 C730 0.1u C731 4.7u 100K

VDD_BT R730 BT_CLK 33

VDDE_1V8

RF GND: Isolate from Common GND on L1, L2 and L3 Analog GND must be Isolated from Common GND on L1, L2 and L3

R732

Careful routing of BT_CLK Keep away from noise signals U731


RESOUT2_n BT_CLK RTCCLK K7 BT_RESETN F6 BT_REF_CLK_IN K9 BT_LP_CLK L9 ACC_SPI_MOSI ACC_SPI_CLK PCM_SYNC PCM_CLK PCM_DLD PCM_ULD BT_WAKEUP BT_RFP BT_RFN BT_VIO_A BT_VIO_B BT_VIO_C BT_VIO_D BT_VIO_E BT_VSSDIG1 BT_VSSDIG2 BT_VSSDIG3 BT_VSSDIG4 BT_VSSDIG5 BT_VSSANA1 BT_VSSANA2 BT_VSSANA3 BT_VSSANA4 BT_VSSANA5 BT_VSSANA6 BT_VSSANA7 BT_VSSANA8 BT_VSSANA9 BT_VSSANA10 BT_VSSANA11 BT_VSSANA12 BT_VSSRF1 BT_VSSRF2 BT_VSSRF3 BT_VSSRF4 BT_HVA1 BT_HVA2 BT_HVA3 BT_HVA4 BT_HVA5 BT_TEST1 BT_TEST2 BT_AF_PRG

100K

STLC2593
BT_CLK_REQ_OUT_1 BT_UART_TXD BT_UART_RTS J7 G7 J6 K1 J1

ACC_SPI_MISO ACC_GP_SPI_BT_CSn

FL730 5 4 VDDE_1V8 BP1 BP2

DEA212450BT-7043C1 1 U_BP BP_DC 2

C732 100p BT_TXRX

N4 BT_PCM_SYNC M4 BT_PCM_CLK K5 BT_PCM_A M5 BT_PCM_B M3 K3 K4 J3 L3 BT_GPIO_9 BT_GPIO_11 BT_GPIO_10 BT_GPIO_16 BT_GPIO_8

M6 J9 N3 N5 G8 H6 H7 H8 K8 L8 D1 D2 E3 F1 F2 F3 F4 G1 G3 G4 H3 H4 H1 L1 J2 K2 L2 D3 E1 E2 E4 H2 G2 G6 VSS_BT_ANA

FB730 60

VSS_BT_RF

PTA_BT_PRIO PTA_BT_STATE PTA_WLAN_ACTIVE WLAN_SLEEPn R733 DNI VDDE_1V8 VDDE_1V8 ACC_GP_SPI_BT_IRQ

C733 0.1u

G9 BT_GPIO_0 E7 BT_CLK_REQ_IN_1 F9 BT_CLK_REQ_IN_2 E8 BT_HOST_WAKEUP L7 BT_CONFIG_1 M7 BT_CONFIG_2 N6 BT_CONFIG_3 J8 B2 C3 M8 C1 C2 M2 J4 BT_CLK_REQ_OUT_2 BT_RSVR_CL1 BT_RSVR_CL2 BT_RSVR_D BT_RSVR_DSM BT_RSVR_N BT_RSVR_RF BT_REG_CTRL

VSS_BT_ANA

R734

100K

VDDK_2V75

BT_CLKREQ_n VDD_BT VDDK_2V75

R735

VSS_BT_RF

R742

N7 BT_HVD E6 BT_VDD_CLD 0.1u

C734 0.1u

VDDE_1V8

C736

0.1u

VDDE_1V8

VBAT

VDDE_1V8

C735

R738

R740

100K

D4 F7 F8 L4 L5 L6

NC1 NC2 NC3 NC4 NC5 NC6

R737 0 C737 C738 1u 1u FM_RP FM_LP APP_I2C_SDA

FM_ROUT FM_LOUT FM_VIO FM_SDIO FM_GND1 FM_GND2 FM_GND3 FM_GND4 FM_GND5 FM_GND6 FM_GND7 FM_GND8 FM_RFGND

C5 B5 D6 D8 A3 B4 B6 B7 C4 C6 C7 D5 C8

R739 110 C739 0.1u

APP_GP_FM_GPIO2

RESOUT1_n RTCCLK R741 APP_I2C_SCL 110 22n 22n 10p

A4 B3 A7 A6 A5 B8 C9 D7 D9 E9

FM_VA FM_VD FM_GPIO1 FM_GPIO2 FM_GPIO3 FM_FMIP FM_RSTB FM_RCLK FM_SENB FM_SCLK

C740

C741

C742

6 3

H9 BT_UART_RXD K6 BT_UART_CTS

G2 G1

C743 120p

FM_ANT

Figure 3-1-11. Schematic of STLC2593C Clock - Clock request Connected to CLKREQ of DB3200 and AB3100, input to RF3300 - Fast clock : 26MHz Supplied MCLK from RF3300 Frequency deviation : 20ppm - Low power clock : 32.768kHz Supplied RTCCLK from AB3100 Power - Supplied 2.75V, 1.8V from internal regulators of AB3100 Reset - RESOUT2n signal of DB3200 controls STLC2593C reset. SPI - Connected to SPI of DB3200 - HCI interface between DB3200 and STLC2593C PCM - Audio signal interface between DB3200/AB3100 and STLC2593C ANT - 2.4GHz, 50 ohm matching

LGE Internal Use Only

- 32 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.1.12 MicroSD Interface card


GT500 supports the MicroSD card interface as external memory card. MicroSD card has 4-data line, so GT500 uses 4-data lines. All control and data lines are connected to DB3200. Cause of the difference between DB3200 and MicroSD card, a level shifter should be added. MicroSD card Interface APP_GP_MMC_DETn MICROSD_CMD_2V7 MICROSD_CLK_2V7 MICROSD_DAT[3:0]_2V7 VDDG_2V85 Card detection, connected to GPIO of DB3200 Command/Response Clock Data line Supply voltage from AB3100 internal LDO Table 3-1-7. MicroSD card Interface Card detection - When there are no card in MicroSD card socket, APP_GP_MMC_DETn pin is high cause of an external pull-up. - If card is inserted in socket, APP_GP_MMC_DETn pin is changed to Low cause of the mechanical switch in the socket. - If card is removed, APP_GP_MMC_DETn pin changes high.
VDDE_1V8 VDDG_2V85

2 4 6 8 100K R637

RA400

100K

U403 A5 C5 B2 C1 A2 B4 A4 B5 B1 A3 A1 B3 C3 C409 0.1u VCCA DAT0_DIR DAT0A DAT123_DIR DAT1A DAT2A DAT3A CMD_DIR CMDA CLKA CLK_F GND1 GND2

SN74AVCA406EZXYR D5 VCCB DAT0B DAT1B DAT2B DAT3B D2 D1 C4 D4 MICROSD_DAT0_2V85 MICROSD_DAT1_2V85 MICROSD_DAT2_2V85 MICROSD_DAT3_2V85

MICROSD_DAT0 MICROSD_DAT_DIR MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_CMD_DIR MICROSD_CMD MICROSD_CLK APP_MMC_FB_CLK

1 3 5 7

C2 CMDB D3 CLKB C410 0.1u

MICROSD_CMD_2V85 MICROSD_CLK_2V85

VDDG_2V85

GND MICROSD_DAT2_2V85 MICROSD_DAT3_2V85 MICROSD_CMD_2V85 MICROSD_CLK_2V85 MICROSD_DAT0_2V85 MICROSD_DAT1_2V85 VA400 VA401 VA402 VA403 VA404 VA405 1 2 3 4 5 6 7 8
SWA SWB

R416

2.2

S400 DM3AT-SF-PEJ Hirose ( Micro-SD Socket, Normal ,T= 1.68) ENSY0020901

VDDE_1V8 EVLC18S02015 EVLC18S02015 EVLC18S02015 EVLC18S02015 EVLC18S02015 EVLC18S02015

1608 C408 10u

R419 APP_GP_MMC_DETn

220K

MICROSD SOCKET

VA406 EVLC18S02003

Figure 3-1-12. Micro SD card and Schematic of Micro SD card Interface

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 33 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.1.13 Power On Sequence


User presses END key and then ONSWAn signal is changed to Low. AB3100 initiates the internal oscillator and powers on the regulators. AB3100 generates power for DB3200. AB3100 releases the power reset signal (PWRRSTn) and generates an interrupt(IRQ0n) to DB3200.

AB3100 Power for DB3200 Press END key PWRRST_N ONSWAn ONSWA_N IRQ PWRRSTn IRQ0n

DB3200

PWRRSTN IRQ0_N

Figure 3-1-13. Power On Sequence

LGE Internal Use Only

- 34 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.1.14 Key Pad


There are 8 buttons in Figure 3-1-14/15. END Key is connected ONSWAn for AB3100.
KEYIN0 KEYOUT0 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 GND VOLUME DOWN END (ONSWA_n) VOLUME UP SEND Clear Lock camera AF KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5 GND

Table 3-1-8. Key Matrix Mapping Table

SEND KEYIN3
SW1000 EVPAHBD6A

KEYOUT0 CLR ONSWA_n

END

C B D

C_ B_ A HALF SHUTTER FULL SHUTTER

KEYOUT1

KEYIN0
D1000

KEYOUT2 ONSWA_n
RB521S-30

KEYIN3

KEYOUT1

SEND CLEAR KEY

END KEY

AUTO FOCUS KEY

LOCK KEYOUT2
KEYIN0 KEYIN2

VOLUME_DOWN

VOLUME_UP

KEYIN0

TOUCH LOCK KEY

VOLUME KEY

Figure 3-1-14. Key Circuit

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 35 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.1.15 Touch Screen


When Touch button and Touch screen is touched, Interrupt is given to DB3200 than, it read the status register what coordinate is touched by I2C. I2C is realize by DB3200 GPIO..
VDD_TOUCH_2V8

R420

2.7K R421 C1 C2 C3 D1 D2 D3 U405 A1 A2 A3 B1 B2 B3 TSC2007IYZGR SDA A1 XSCL GND Y-

C411 1u

C412 0.1u

R424

R422

DNI

2.7K

APP_GP_TOUCH_PENIRQn_2V75

AUX VDD_REF X+ PENIRQA0 Y+

APP_GP_TOUCH_SDA_2V75 TOUCH_X-

APP_GP_TOUCH_SCL_2V75
TOUCH_Y-

EUSY0337101

TOUCH_Y+

TOUCH_X+ ZD401 RSB6.8CST2R ZD403 RSB6.8CST2R ZD400 RSB6.8CST2R ZD402 RSB6.8CST2R

TOUCH SCREEN DRIVER IC

VDDE_1V8

VDD_TOUCH_2V8

R642 R425 51K

B2

B1 VCCB

VCCA

A4

A4

R423 A3 A3 R426

0 APP_GP_TOUCH_SDA 0 APP_GP_TOUCH_SCL APP_GP_TOUCH_PENIRQn

B3 B4 APP_GP_TOUCH_PENIRQn_2V75 C1

OE

GND TXS0104EZXUR A2 A2 U404 B1 B2 B3 B4 A1 A1

C2

C3

APP_GP_TOUCH_SCL_2V75 APP_GP_TOUCH_SDA_2V75

TOUCH LEVEL SHIFTER

Figure 3-1-15. Touch screen schematics

LGE Internal Use Only

C4

- 36 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.1.16 A-GPS
GT500 supports A-GPS operation using Broadcom BCM4750 A-GPS module. The BCM4750 is a single chip, single die AGPS receiver that combines a high-performance RF front end with an adaptive baseband processor. The BCM4750s small footprint and minimal parts count provide significant reductions in the design, layout, manufacturing, and testing resources required to integrate AGPS technology with mobile handsets and portable devices. The BCM4750 uses a host-based integration architecture that splits processing functions between the GPS chip and the CPU on the host system. Host-based architecture enables a simplified IC design that can be executed in a much smaller and less expensive package than competing System on Chip solutions which require an onchip CPU subsystem and flash memory in addition to the RF and baseband blocks. Demands on the host CPU are minimal and no real time requirements are imposed. Feature Fully integrated GPS RF front-end and baseband processor on a single CMOS die Supports UART, I2C, and SPI host interfaces Industry-leading power consumption efficiency Synchronization input, PPS output Fractional-N Synthesizer supports reference frequencies from 10 to 40 MHz Companion software driver supports Assisted, Autonomous, and Enhanced Autonomous operating mode

Figure 3-1-16. Functional Block Diagram of BCM4750

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 37 -

LGE Internal Use Only

VDDE_1V8

GPS Power
RP101K182D 4 VDD 3 CE PGND VGPS_1V8 0 1u 1u 5 1 VOUT 2 GND R755 U752 ACC_GP_GPS_PON

VBAT

GPS Clock Buffer


ACC_GP_GPS_PON MCLKSEC OE A GND

U750

R752 10

NL17SZ126XV5T2G

VCC

C753 0.1u

C754 2.2u

R753

GPS_CNTIN

33

VGPS_1V8

VGPS_1V8 X750 1 GND1 NC1 GND2 OUT 4 C750 2.2u C751 0.1u C771 0.1u R750 0 NC2 5 VCC 2 3 KT2520F16369ACW18T 6 R757 VDDE_1V8 2.2nH L770 0

Figure 3-1-16. Schematic of BCM4750

10 R770

2.2u C770

RTCCLK ACC_GPS_START GPS_CNTIN VDDE_1V8 F2 CNTIN E7 SYNC_PPS B6 VDDIO1 G3 VDDIO2 G7 VDDIO3 A3 LPREGIN F5 RTCCLK A2 TCXO C752 1u C4 BBRFREGIN R772 0 C6 B4 C5 ACC_UART3_RX ACC_UART3_TX ACC_UART3_RTS ACC_UART3_CTS G6 G2 G1 G5 F7 ACC_GP_GPS_RESETn ACC_GP_GPS_PON G4 F3 A6 A7 C7 B7 A5 BMS0 BMS1_I2C_A0 BMS2_UARTCS_N D5 VPD F1 TESTMODE RFIN TX_SDA_MISO RX_SCL_SCK CTS_N_I2C_GRP1_SCS_N RTS_N_I2C_GRP0_MOSI INTR_N RESET_N STANDBY_N TRST_N TCK TDI TDO TMS B2 ATEST0 C3 ATEST1 R756 100K VSSD1 VSSD2 VSSD3 VSSD4 VSSD5 VSSD6 U751 BCM4750 E1 RFSREGOUT D1 VDDIFSYNTH F6 VDDLP_LPREGOUT C761 1u BBREGOUT VDDCORE1 VDDCORE2 VDDCORE3 VDDCORE4 C1 VSSRFSYNTH B3 VSSIFSUB A4 D4 D6 E3 E6 C762 1u B5 D3 D7 E4 E5 F4 C760 1u B1 1

ACC_GP_GPS_PON

10nH L771

S_D

2.2nH C755 L750 6.8nH 5 VDD 4 FIL_OUT E2 RFREGOUT D2 VDDRF C759 1u 2 RF_IN 3 GND

CN750 1

CN751 1

100p C772

3. TECHNICAL DESCRIPTION

NA

GT500 A-GPS Schematic

C756

GPS LNA block

C763 1u

C764 1u

LGE Internal Use Only

TP751

TP752

TP753

100nH

U770 ALM-1612 0.5p

C758

L772 100nH

C757

- 38 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
C766

C765

100K

R754

CLKN CLKP DATAN DATAP

VA600

8 P8 7 P7 6 P6 5 P5

1 P1 2 P2 3 P3 4 P4

ULCA2114C015FR
3 2 1 4

3.2 Visual part

FL603

P4

P3

P2

P1

CI_PCLK CI_VSYNC CI_HSYNC CI_RES_n


TP221 TP222

ICMF214P101M
P6 P7 P8

P5

5MCAM_RESET_N
6 7 8 5

D603 PRSB6.8C

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3.2.1 Camera & Camera Interface

9 3 2

12 CN603

11

10

CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7]

U21 R20 U23 T21 U19 V19 V20 W20 U20 T20 V23 W23 W22 V22 CI_PCLK CI_VSYNC CI_HSYNC CI_RES_N CI_D0 CI_D1 CI_D2_CLK0_M CI_D3_CLK0_P CI_D4_DAT0_M CI_D5_DAT0_P CI_D6_CLK1_M CI_D7_CLK1_P CI_D8_DAT1_M CI_D9_DAT1_P

Figure 3-2-1. Camera Interface (in DB3200)

ENBY0034201 GB042-24S-H10-E3000

Figure 3-2-2. 5M Camera Connector(24Pin Main Board)

- 39 22 23 CAM_DVDD_1V8 C606 FB601 C607 0.1u CAM_AVDD_2V8 24 FB600 0.1u

13

14

15

16

17

18

19

20

21

LCD_RESET_N LCD_VSYNC LCD_WE_N LCD_RS LCD_CS_N LCD_RD_N


TP223

D602 PRSB6.8C

LC Filter for power noise from GSM RF L600 47nH

ISP_SENS_I2C_SCL R614

ISP_SENS_I2C_SDA

C610 7.5p

3. TECHNICAL DESCRIPTION

C621 220p 47 ISP_SENS_MCLK

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]

K20 K23 J16 K22 K16 L22 L21 L23 L20 M22 J20 M23 K15 N22 N15

PDI_RES_N PDI_C0 PDI_C1 PDI_C2 PDI_C3 PDI_C4 PDI_C5 PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7

CAM_AFVDD_2V8

C622 2.2u

FB602 BLM15AG100PN1

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

U602 D601 PRSB6.8C CI_RES_n SYSCLK0 CI_DATA[7] CI_DATA[6] CI_DATA[5] CI_DATA[4] CI_DATA[3] CI_DATA[2] CI_DATA[1] CI_DATA[0] CI_PCLK CI_HSYNC CI_VSYNC APP_I2C_SDA APP_I2C_SCL G7 H7 H8 H6 C3 E8 F5 F4 G4 H4 F3 G3 H3 F2 E1 E2 F1 B3 A3 A8 B8 C7 C8 G1 D1 F8 B2 A2 A1 B1 A6 B6 A5 B5 4.3K 4.3K

MV9319

R632 R633

0 0

ISP_GP_FLASH_SET ISP_GP_FLASH_EN ISP_GP_FLASH_INH

SOMI_S_GPIO30 SIMO_S_GPIO31 SCLK_S_SDO9 SS_S_SDO8 NRESET MCLK SDO7 SDO6 SDO5 SDO4 SDO3 SDO2 SDO1 SDO0 PCLKO HSYNCO VSYNCO SDA_S SCL_S TCLK TCLKB TDATA TDATAB NSRESET SRESET SMCKO
SDA_M_MISO_M

GPIO25_SS_M GPIO26_MISO_M GPIO27_MOSI_M GPIO24_SCLK_M GPIO20_PWM0 GPIO21_PWM1 GPIO22_PWM2 GPIO23_PWM3 GPIO28_SCL_M GPIO29_SDA_M RXD TXD RGVDD_1_8V VDDIO_2_8V
VDDCO

F6 G6 G5 H5 H1 G2 H2 D2 C1 C2 E7 F7 E4 E5 D3 D4 D5 D6 C6 A7 B7 C5 B4 C4 D7 D8 E3 E6 A4 G8

ISP_DVDD_1V8

C608 1u

C609 0.1u

TP600 TP601

ISP_AVDD_2V8

5MCAM_RESET_N ISP_SENS_MCLK ISP_SENS_I2C_SDA ISP_SENS_I2C_SCL

VDDCO_E AVDDP AVDD VDDA_2_8RX VDDA_2_8TX VSSA_TX VSSA_RX DGND1


DGND2

R617

100ohm

C615 1u

C616 0.1u

C617 1u

C618 1u

C619 1u

C620 1u

CLKP CLKN DATAP DATAN

SCL_M_SS_M GPIO10_SCLK_M GPIO11_MOSI_M RCLK RCLKB RDATA RDATAB

DGND3 DGND4 DGND5 DGND6 TEST_0 SEL1

FB603

C623 1u

C624 0.1u

ISP_DVDD_1V8 R618 R619

Figure 3-2-3. ISP Interface (MV9319)

VBAT

U800 ISP_GP_FLASH_SET ISP_GP_FLASH_EN 1 2 3 4 5 6 7 L800 1u CT EN_SET FLEN AGND IN LX PGND

100K

100K

AAT1270IFO-T1 14 RSET 13 FLOUTA 12 FLGND 11 FLOUTB 10 FLINH 9 GND 8 OUT LD800 2.2u C807

G_SLUG

200K

R801

C801 47n

ISP_GP_FLASH_INH

CAMERA FLASH LED


VA807 EVLC14S02050 VA806 EVLC14S02050

R806

R807

C800 2.2u

C806 DNI

Figure 3-2-4. Flash LED (Sub Board)

LGE Internal Use Only

15

- 40 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

CAM_DVDD_1V8

CAM_AVDD_2V8

A2 IOVDD B6 DVDD E5 AVDD

SYSCLK0 APP_GP_VGA_SDN CI_RES_n APP_I2C_SDA APP_I2C_SCL

B5 C6 D3 C5 D6

EXTCLK PWRDWN RESET SDA SCL

U901 TCM9000MD

DCLK HSYNC VSYNC DATA0 DATA1 DATA2 DATA3 DATA4 DATA5 DATA6 DATA7 GND1 GND2 GND3 GND4

A3 D1 D2 B3 B1 B2 B4 C1 C2 C3 D4 A4 C4 E2 E3

R904

51

CI_PCLK CI_HSYNC CI_VSYNC CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7]

C901 0.1u

C900 0.1u

C913 0.1u

Figure 3-2-5. VGA Camera (TCM9001MD) (SMT type_VGA FPCB)

F1

PGND

A5 VDD15_1 E4 VDD15_2

CAM_AVDD_2V8 CN901

CAM_DVDD_1V8

1 R910 47 2 3 4 TOUCH_X+ 5 TOUCH_X6 TOUCH_Y+ 7 TOUCH_Y8 9 10 APP_GP_VGA_SDN 11 APP_I2C_SDA 12 APP_I2C_SCL 13 CI_RES_n 14 15 2 1 CN902 SPK_RCV+ SPK_RCVSPK_RCV+ 16 SPK_RCV17

34 33 32 31 30 CI_DATA[0] 29 CI_DATA[1] 28 CI_DATA[2] 27 CI_DATA[3] 26 CI_DATA[4] 25 CI_DATA[5] 24 CI_DATA[6] 23 CI_DATA[7] 22 CI_HSYNC 21 CI_VSYNC 20 19 CI_PCLK 18

SYSCLK0

PLUG
Figure 3-2-6. VGA Camera FPCB Interface with main board

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 41 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

The 5M Camera modules are connected to 24-pin main board and VGA Camera module is mounted to VGA FPCB and VGA FPCB is connected to 34-pin main board. Its interface is dedicated camera interface port in DB3200. The camera port supply 24MHz master clock to 5M ISP and 12Mhz Master clock to VGA module and receive 48MHz pixel clock(15fps) for ISP and 9.5Mhz pixel clock(15fps) for VGA camera, vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera module. The camera module is controlled by I2C port.

Table 3-2-1. Interface between Main board and 5M camera (in Main)

Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Symbol GND SYSCLK0 GND TOUCH_X+ TOUCH_XTOUCH_Y+ TOUCH_YGND GND APP_GP_VGA_SDN APP_I2C_SDA APP_I2C_SCL CI_RES_n GND SPK_RCV+ SPK_RCV GND

Description Ground VGA MCLK Ground touch signal touch signal touch signal touch signal Ground Ground VGA shutdown I2C DATA I2C Clock CAMERA RESET Ground speaker signal speaker signal Ground

Pin No. 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18

Symbol GND CAM_AVDD_2V8 GND CAM_DVDD_1V8 CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7] CI_HSYNC CI_VSYNC GND CI_PCLK GND

Description Ground Analog Voltage Ground I/O & Digital Voltage Parallel Data 0 Parallel Data 1 Parallel Data 2 Parallel Data 3 Parallel Data 4 Parallel Data 5 Parallel Data 6 Parallel Data 7 horizontal sync vertical sync Ground Camera Pixel clock Ground

Table 3-2-2. Interface between VGA Camera FPCB and main board.

LGE Internal Use Only

- 42 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.2.2 Camera Regulator


APP_GP_CAM_LDO_EN enables 1.8V & 2.8V Camera Regulator for both 5M and VGA Camera. (5M : 2.8V for analog, 2.8V for AF VDD control, 1.8V for I/O, 1.8V for digital), (VGA : 2.8V for analog, 1.8V for I/O, digital)

CAM_AFVDD_2V8 CAM_AVDD_2V8 VBAT CAM_DVDD_1V8

R634 APP_GP_CAM_LDO_EN R616 5.6K 1u 0 1u

U601 1 VIN 2 EN1 3 EN2 4 NC1

RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND

PGND

C611

C612

C613

1u

Figure 3-2-5. 1.8V and 2.8V Camera Regulator APP_GP_ISP_LDO_EN enables 1.8V & 2.8V regulator for ISP. (ISP : 2.8V for anlalog, 1.8V for I/O and digital),

C614 ISP_AVDD_2V8 ISP_DVDD_1V8

VBAT

R635 R625 APP_GP_ISP_LDO_EN 5.6K C629 1u 0

U603 1 VIN 2 EN1 3 EN2 4 NC1 C630 1u

RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND C628 1u C627 1u

Figure 3-2-6. Camera Regulator for ISP

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

PGND

1u

- 43 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.2.3 Display & LCD FPC Interface


LCD module include device in table 3-2
Device Main LCD Main LCD Backlight Type 240 RGB 400 262K Color TFT LCD 5 White LEDs

Table 3-2-3. Device in LCD Module

LCD Module is connected to Key FPCB with 40-pin Connector and key FPCB is connected to Main board with 50-pin connector. The LCD is controlled by 8-bit PDI(Parallel Data Interface) in DB3200.

LCD_AVDD_2V8

LCD_DVDD_1V8

VBAT

VDDE_1V8

4.7K

10K

DNI

R609

R608

R607

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3]

1 2 3 4

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2

9 8 7 6

R628

EVRC14S03Q030050R

FL600

EVRC14S03Q030050R LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]


1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2 9 8 7 6

FL601

EVRC14S03Q030050R LCD_RS LCD_CS_N LCD_RD_N LCD_WE_N


1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2 9 8 7 6

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 53 54

50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26

10K

10K R603

R604

10K

CN604 51 52

Close to ABB
C625 C626 47n FB604 47n FB605

CCO1 MIC1P MIC1N KEYIN0 KEYIN3 KEYIN2

10

R627 R626

100ohm 100ohm

ONSWA_n
KEY_LED1 KEY_LED2 KEYOUT0 KEYOUT1 KEYOUT2 APP_GP_LCD_ID WLED1 WLED2 WLED3 WLED4 WLED5

R610

10K

10

APP_GP_LCD_IF1

LCD_RESET_N

RSB6.8CST2R

RSB6.8CST2R

FL602 WLED_PWR PRSB6.8C PRSB6.8C

ICVS0514X350FR

10

LCD_VSYNC

R621

TRICKLE 100K R622

1u

DNI

1u

ZD605

D600 PRSB6.8C

R611

C604

Table 3-2-4. LCD module Connector

LGE Internal Use Only

ZD600

ZD601

C605

- 44 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

ZD606

VA603

3. TECHNICAL DESCRIPTION

3.2.4 LCD Module Block diagram

Data(0~7)

Figure 3-2-9. LCD Module Block diagram

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 45 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.2.5 LCD Backlight Illumination


There are 5 white LEDs in LCD Backlight circuit which is driven Charge Pump(AAT3169). APP_GP_BL_EN is used for Backlight brightness control.
VBAT

U604 R629 4 0 1u C632 5 C1+ C1-

AAT3169IFO-T1 7 C2+ C2OUTCP 8 6 1u C633 R631 0 WLED_PWR

IN D1 D2 D3 D4 D5 D6

APP_GP_BL_EN

EN_SET

R630

100K

10 GND 15 PGND C635 1u

11 12 13 14 1 2 C634 1u

WLED1 WLED2 WLED3 WLED4 WLED5

Figure 3-2-10. SUB PMIC Circuit LCD Backlight

3.2.6 Keypad Illumination


There are 4 side view white LEDs in Main board backlight circuit, which are driven by LED1, LED2 port from AB3100.

LD1000 KEY_LED1 VBAT SSC-TWH104-HL LD1001 SSC-TWH104-HL LD1002

B4

A4

D3

KEY_LED1 KEY_LED2
KEY_LED2

SSC-TWH104-HL

Figure 3-2-11. Keypad Backlight LED Interface and Backlight Circuit

LGE Internal Use Only

- 46 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LED1_N LED2_N LED3_N

SSC-TWH104-HL LD1003

C3

3. TECHNICAL DESCRIPTION

3.3. Audio Part


3.3.1 Audio Part Block Diagram

Figure 3-3-1. Audio Part Block Diagram

3.3.2 Audio Signal Processing & Interface


Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (DB3200). This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip. The downlink path amplifies the signal from DBB chip (DB3200) and outputs it to Receiver (or Speaker). The audio interface consists of PCM encoding and decoding circuitry, microphone amplifiers and earphone drivers. The PCM encoder and decoder blocks are two-channel, 16-bit circuits with programmable gain amplifiers (PGA). The decoder has a receive volume control. The audio inputs and outputs can be switched to normal or auxiliary ports.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 47 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

Figure 3-3-2. Audio Interface Detailed Diagram(AB3100)

Audio Subsystem

VBAT

C332 1u 1u C336

C333 1u

C334 0.1u

A3

B1 VDD

A4 C338 1u A5

C1N C1P

PVDD

VSS

C5

HPR HPL

A1 A2

HS_EAR_R HS_EAR_L

EAR_R EAR_L SPKRP SPKRN

C339 C342 C343 C344

1u 1u 18000p 18000p

D1 INA2 D2 INA1 C1 INB2 C2 INB1 B2 BIAS

U301 MAX9877AEWP_TG45 OUT+ OUTD5 B5 VA300 ICVL0505101V150FR VA301 ICVL0505101V150FR SPK_RCV+ SPK_RCV-

AMP_I2C_SDA AMP_I2C_SCL BEARP BEARN 1% R322 15 R323 15 1%

B3 SDA C3 SCL 22p PGND D4 RXIN+ B4 RXINC354 1u 22p

Main MIC
CCO1 C1000 47p MIC100

GND

C352

D3

C4

C353

Audio Subsystem

1 P 2 G1 3 G2 4 O SPU0410HR5H-PB

MIC1N MIC1P

Figure 3-3-3 . Audio Section scheme

LGE Internal Use Only

- 48 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.3.3 Audio Mode


Audio Mode includes three states.( Voice call, Midi.MP3). Each states is sorted by the total 7 Modes according to external Devices (Receiver,Loud Speaker,Headset). Video Telephony Mode Operate on state of the WCDMA CALL.

Mode Receiver Mode Loud Speaker Mode Voice call Headset Mode Video Telephony Mode MIDI MP3 Headset Mode Only Loud Speaker Loud Speaker Mode

AB3100 In /Out Port IN MIC1P/MIC1N MIC1P/MIC1N MIC2P/MIC2N MIC1P/MIC1N OUT BEARP/BEARN SPKRP/SPKRN AUXO1/AUXO2 SPKRP/SPKRN SPKRP/SPKRN SPKR/SPKN AUXO1/AUXO2

Table 3-3-1. Audio Mode

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 49 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.3.4 Voice Call


A. Voice call Downlink Mode(Receiver, Speaker, Headset)
This section provides a detailed description of the Voice Call RX functions.

Figure 3-3-4. Voice call Downlink Scheme

The voice decoder accepts a serial input stream of linear PCM coded speech. The receive band-pass filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in the RX path. The final step in the receive path is the auxiliary output. The auxiliary audio amplifier is intended to drive low impedance headphones. The earphone amplifier and the auxiliary audio outputs can be powered down (muted) via I2C. Both the earphone driver and one of the auxiliary drivers can simultaneously provide an output signal during voice decoding.

Receiver Mode : BEARP/N Port

Receiver(32) SPKR/N

Loud Speaker / Video Telephony Mode : AB3100 SPK Amp AUDIO AMP(TPA6205) Headset Mode : Auxiliary audio amplifier Speaker(8) AUXO1/2 Head Phone

AUDIO AMP(MAX9724D)

LGE Internal Use Only

- 50 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

B. Voice Call Uplink Mode (Receiver,Speaker,Headset) This section provides a detailed description of the Voice Call TX functions.

Figure 3-3-5. Voice call Uplink Scheme

From the audio path view point, voice call has the same structure as video telephony. The TXMIX connection enables insertion of audio into the uplink audio path. This can, for example, be used to play dictation recordings for the listener at the other party, in a voice call or video telephony call. The connection to TXMIX from the Audio Mixer must be performed in 8 kHz mono, since this is supported by the Voice mode. Due to performance reasons it may not be possible to decode every audio format during video telephony. Each Voice Uplink Mode paths shown below. Receiver Mode : C-MIC(SPM0410LR5H) AB3100 Input(MIC1N/1P) Loud Speaker Mode : C-MIC(SPM0410LR5H) AB3100 Input(SPK1N/1P) Video Telephony Mode : C-MIC(SPM0410LR5H) AB3100 Input(MIC1N/1P) Headset Mode : Headset MIC Analog Switch(FSA201) AB3100 Input(AUXI1N/1P)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 51 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.3.5 MIDI (Ring Tone Play)


This section provides a detailed description of the MIDI and WAV-file functions.

Figure 3-3-6 External MIDI path In Figure 2-4-6, External MIDI path is the same as Voice Loudspeaker downlink Mode , except source in DB3200 (DSP and Audio Mixer). MIDI : DB3200 PCM Decoder Auxiliary audio amplifier SPKRP/N Port AUDIO AMP(TPA6205A) Speaker(8)

3.3.6 MP3 (Audio Player)


This section provides a detailed description of the MP3 file functions.

Figure 3-3-7. MP3 Scheme MP3 function supports PCM 44/48KHz sampling rate.The PCM44/48 RX-path is intended to be used as a audio amp and one speaker.

LGE Internal Use Only

- 52 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.3.7 Video Telephony


This section provides a description of the Video Telephony functions.

Figure 3-3-8. Video Telephony Scheme

Video Telephony Mode has same paths with Loud Speaker Mode.

3.3.8 Audio Main Component


There are 4 components in GT500 schematic Diagram. Part Number marked on GT500 Schematic Diagram.

NO 1 2 3 4

ITEM Speaker/Receiver MIC Audio Amp Ear-jack SET

PART NUMBER SUSY0027506 SPU0410HR5H-PB MAX9877AEWP_TG45 SGEY0003741


Table 3-3-2. Audio Component List

MAKER Ki-Rin KNOWLES ACOUSTICS Maxim I-sound

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 53 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.4 GPADC (General Purpose ADC) and AUTOADC2


The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selected with the MUX and converted in the ADC. The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without software intervention. The AUTOADC2 periodically measures the battery voltage or current. (Fig.2-4-1) shows the schematic of GPADC part. The GPADC channel spec is as following (Table 2-4-1).
PCB_VERSION TESTOUT RTEMP
A9 B9 C9 B8 A8 C8 D8

B7

TP300

Fig 3-4-1. Schematic of GPADC and AUTOADC2

Fig 3-4-2. GPADC and AUTOADC2 Block diagram

ADC 2 channels Resource GPA3 GPA7 Name PCB_VERSION VBACKUP Description HW PCB Version check Backup battery

Table 3-4-1. GPADC channel spec

LGE Internal Use Only

GPA0 GPA1 GPA2 GPA3 GPA4 GPA5 GPA6 GPA7 GPA12

C7

VBACKUP

- 54 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.5 Charger control


A programmable charger in AB3100 is used for battery charging. It is possible to set limits for the output voltage at CHS- and the output current from DCIO via the sense resistor to CHS-. The voltage at CHS- and the current feed to CHS- cannot be measured directly by the GPADC. Instead, the two measuring amplifiers translate these inputs to a voltage proportional to the input and within the range of the GPADC. (Fig.3-5-1) shows the schematic of charging control part.
SRST_n SCLK SDAT BDATA FGS+
M2 M1 N3 A11 J14

SRST_N SCLK SDAT BDATA FGSENSEP

Charging Circuit
VBUS Q300
S2

VA605 varistor VBAT FGSJ13 G2 H1

SIA911DJ
G2

FGSENSEN VBAT_D CHSENSEP

D2

Charging

D4

CHS+

D3

D1

CHSG1

H2 H3

CHSENSEN CHREG

S1

CHREG

CHREG

DCIO_INT VBAT_H R314 0 USB charging path VDDE_1V8 VDD_REF VDDC_2V65 C330 22p D302
C1 1 A2 2 A1_C2 3

OTP
DCIO_INT

VBAT 2012 1/4W 1% CHS+ R316 Route as a differential pair 0.1 CHS-

VBUS VBUS TRICKLE R317 1u

D301

RSX101VA-30TR

J2 F1 E2 F2 C5 B5 C4

DCIO_INT DCIO VBUS TRICKLE DAC_DAT DAC_STR DAC_CLK

VBAT

RF_CTRL_DATA RF_CTRL_STR_1 RF_CTRL_CLK

C331 33u

Discharging

P13 P3

BDATA C337 22p R320 300K

VDD_SPKR VDD_BEAR VDD_AUDIO VDD_AUXO G1 VDD_REF


P6

P7

KDS221E_RTK

A12

VDD_IO

D12 A13 A14

CN300 D1 1 2 3 D2

Causion when PCB lLayout Direction of BAT and GND

C345 R321

SPARE1 SPARE2
B10 A2

N5

Phone ground return path

FGS+
2012 1/4W

1%

R324 0.025

Route as a differential pair FGS-

Make an Area at 8, 9 Layer

Fig. 3-5-1. Battery charging circuit

Name CHS+ CHS-

Type Analog Analog

Unused VBAT VBAT

Description Current sensing input positive Current sensing input negative

Table 3-5-1. Charger Control channel spec

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

M7

- 55 -

VSS_BEAR VSS_SPKR

C346 0.1u

C347 1u

C348 0.1u

C349 0.1u

1u 100K

TEST VREF IREF

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.5.1 Fuel Gauge


AB3100 supports the measurement of the current consumption/charging current in the GT500 with a fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel gauge block is used to determine the remaining battery capacity. The function of the fuel gauge block is schematically described in (Fig.3-5-3). A sense resistor R_FGSENSE is connected in series with the battery. The voltage across the resistor, equivalent to the current entering/leaving the battery, is integrated using an ADC block.

Fig. 3-5-2. The analog front-end of the fuel gauge block


SRST_n SCLK SDAT BDATA FGS+
M2 M1 N3 A11 J14

SRST_N SCLK SDAT BDATA FGSENSEP

Phone ground return path

FGS+
2012 1/4W

VA605 varistor VBAT FGSJ13 G2 H1

1%

R324 0.025

Route as a differential pair FGS-

FGSENSEN VBAT_D CHSENSEP

CHS+

CHSCHREG

H2 H3

CHSENSEN CHREG

Fig. 3-5-3 The Schematic of the fuel gauge block

Name FGS+ FGS-

Type Analog Analog

Unused VBAT VBAT

Description Fuel gauge current sensing input positive Fuel gauge current sensing input negative

Table 3-5-2. Fuel Gauge channel spec

LGE Internal Use Only

- 56 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.5.2 Battery Temperature Measurement


The BDATA node, the constant current source, feed the battery data output while monitoring the voltage at the battery data node with GPADC. This battery data is converted to the battery temperature. (Fig.3-5-5) shows the schematic of battery temperature measurement part.
D302
C1 1 A2 2 A1_C2 3

Disch

BDATA C337 22p R320 300K

KDS221E_RTK

SRST_n SCLK SDAT BDATA FGS+

M2 M1 N3 A11 J14

SRST_N SCLK SDAT BDATA FGSENSEP

CN300 D1 1 2 3 D2

VA605 varistor

FGS-

J13

FGSENSEN

Fig 3-5-4. Battery Temperature Measurement

Name BDATA

Type Digital Input/Output

Unused Unconnected

Description current output

Table 3-5-3 BDATA channel spec

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 57 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.5.3 Charging Part


The charging block in AB3100 processes the charging operation by using VBAT voltage. It is enabled or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are activated and deactivated depending on the level of VBAT. (Fig.3-5-6) shows the schematic of charging part.
SCLK SDAT BDATA FGS+
N3 A11 J14

SCLK SDAT BDATA FGSENSEP

Charging Circuit
VBUS Q300
S2

VA605 varistor VBAT FGSJ13 G2 H1

SIA911DJ
G2

FGSENSEN VBAT_D CHSENSEP

D2

Charging

D4

CHS+

D3

D1

CHSG1

H2 H3

CHSENSEN CHREG

S1

CHREG

CHREG

DCIO_INT VBAT_H R314 0 USB charging path VDDE_1V8 VDD_REF VDDC_2V65 C330 22p D302
C1 1 A2 2 A1_C2 3

OTP
DCIO_INT

VBAT CHS+ 2012 1/4W 1% R316 Route as a differential pair 0.1 CHS-

VBUS VBUS TRICKLE R317 1u

D301

RSX101VA-30TR

J2 F1 E2 F2 C5 B5 C4

DCIO_INT DCIO VBUS TRICKLE DAC_DAT DAC_STR DAC_CLK

VBAT

RF_CTRL_DATA RF_CTRL_STR_1 RF_CTRL_CLK

C331 33u

Discharging

P13 P3

BDATA C337 22p R320 300K

VDD_SPKR VDD_BEAR VDD_AUDIO VDD_AUXO G1 VDD_REF


P6

P7

KDS221E_RTK

A12

VDD_IO

D12 A13 A14

CN300 D1 1 2 3 D2

Causion when PCB lLayout Direction of BAT and GND

C345 R321

SPARE1 SPARE2
B10 A2

N5

Phone ground return path

FGS+
2012 1/4W

1%

R324 0.025

Route as a differential pair FGS-

Make an Area at 8, 9 Layer

Fig. 3-5-5. Charging Part When VBAT is below a certain value, 3.2V, a current generator take care of initial charging of the CHSENSE+ node and internal trickle charge signal is active. This part of the charging block is powered on and active when DCIO is asserted. The DCIO signal is asserted when its voltage is above the voltage at VBAT. As soon as generator is turned off and all parts of the charging block are functional and active. Battery block indication as shown in (Fig.3-5-7)

4.17 ~3.72 (V) 100~40 (%)

3.72 ~3.62 (V)

3.62 ~3.53 (V)

3.53 ~3.20 (V) 3~0(%)

Fig. 3-5-6 Battery Block Indication 40~12 (%) 12~3 (%)

Fig. 3-5-6 Battery Block Indication

LGE Internal Use Only

- 58 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

M7

VSS_BEAR VSS_SPKR

C346 0.1u

C347 1u

C348 0.1u

C349 0.1u

1u 100K

TEST VREF IREF

3. TECHNICAL DESCRIPTION

Trickle charging When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge signal is active. The charging current is set to 50mA. Parameter Trickle current Min 30 Typ 40 Max 60 Unit mA

Table. 3-5-4. Trickle charging spec Normal charging When the VBAT voltage is within limits or the internal regulators are turned on, the current source for trickle charging is turned off and all parts of the charging block are active. The charging method is CCCV. (Constant Current Constant Voltage) This charging method is used for Lithium chemistry battery packs. The CCCV method regulates the charge current and the VBAT voltage. This charging method prevents the battery voltage to go above the charge set in the CCCV algorithm. (Fig.3-5-8) shows the charging voltage and charging current change.

Fig. 3-5-7. CCCV charging method

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 59 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

Charging Method : CCCV (Constant Current Constant Voltage) Maximum Charging Voltage : 4.2V Maximum Charging Current : 700mA Nominal Battery Capacity : 950 mAh Charger Voltage : 5.1V Charging time : Max 3.5h Full charge indication current (icon stop current) : 80mA Low battery POP UP : Idle - 3.43V, Dedicated 3.43V Low battery alarm interval : Idle - 3 min, Dedicated - 1 min Cut-off voltage : standby : 3.25V, Call : 3.25V

Charging of Extended Temperature When the battery temperature is outside the normal charging specification, the battery voltage, VBAT, is maintained at 3.7V. Under 0 C : Extended temperature From 0 C to 45 C : Normal charging temperature Over 45 C : Extended temperature

LGE Internal Use Only

- 60 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.6. Voltage Regulation


The LDO regulators and the BUCK converter generate a range of programmable voltages, each optimized for its load. When the analog baseband controller boots up or down, internal signals activate or deactivate the LDO regulators and the BUCK converter. In active mode, the LDO regulators and the BUCK converter are activated and deactivated through I2C. The low power regulator is on all the time and has extremely low power consumption with limited output current. It provides power for the 32 kHz oscillator and the real-time clock (RTC).

LDO LDO_A LDO_D LDO_E LDO_C LDO_H LDO_F LDO_G LDO_K LDO_LP BUCK

Net Name VDDA_2V8 VDDD_2V65 VDDE_1V8 VDIGRAD_1V8 VDDC_2V65 VDDH_2V75 VDDF_2V5 VDDG_2V85 VDDK_2V75 VBACKUP VCORE

Output Voltage 2.8V 2.65V 1.8V 1.8V 2.65V 2.75V 2.5V 2.85V 2.75V 2.2V 1.2V

Output Current 150mA 200mA 200mA 200mA 200mA 30mA 100mA 200mA 6.5mA 600mA

Usage RF Tranceiver AB3100 analog Memory, I/O RF3300 Digital AB3100 Audio Block 3Axis DB3200 analog SD card, LCD Bluetooth Backup Battey DB3200 core

Table. 3-6-1. LDO and Buck

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 61 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.7. RF Technical Description


3.7.1. General Description
The RF platform of GT500 supports two different communication modes (WCDMA/GSM modes) including four communication bands (WCDMA2100/WCDMA900/GSM850/900/1800/1900). The all the RF blocks can be divided into three main parts, which are a WCDMA part, a GSM, and a RF front-end. Different from other general solutions, the RF front-end of GT500 consists of an antenna switch and an EDGE power amplifier module (PAM). The simplified block diagram is shown in Figure 3-7-1.

U330
VBAT

WCDMA/GSM/GPRS/EDGE TRX
1930 1990 MHz
GSM/EDGE HB GSM/EDGE HB GSM/EDGE LB GSM/EDGE LB WRxIA

LNA LNA LNA LNA LNA

WRxIB

1805 1880 MHz

0 90
WRxQA WRxQB

925 960 MHz

869 894 MHz

WCDMA HB

EDataStr

A
VAPC
WCDMA HB

EDataA

LNA LNA
VCO VCO

D
EDataC

WCDMA LB

A D
N.M

EDataB

ANT

ESD

PA

GSM850/ 900 Input

824 915 MHz

GSM/ EDGE LB

2.75 V VRAD

PA

DCS/PCS Input

1710 1910 MHz VBAT


PWM/PFM WDCDCREF

GSM/ EDGE HB

+
DAC DAC

LPF

ChP

PhD

XO

GSM/EDGE PA + Ant Sw.

VccWPA

DAC 1.8 V VIO

Switch Control Logic

En RFCtrl1

GSM/EDGE AM

UL: 1920 1980 MHz DL: 2110 2170 MHz

+
RFCtrl1

DAC
CLK RADCLK RADDAT RADSTR

FB

VccWPA

RFCtrl1

LPF
RFCtrl2

ChP

PhD

Serial Control

DATA STROBE

Power coupler UL: 1749.9 1784.9 MHz DL: 1844.9 1879.9 MHz

RFCtrl2

DET

Bias

En

VCO
WCDMA HB

N.M
WTxIA

VccWPA

WCDMA HB

WTxIB

WCDMA HB

0 90
WTxQA WTxQB

Power coupler UL: 830 840 MHz DL: 875 885 MHz

DET

Bias

En

WCDMA LB

MCLK

VccWPA
XOn MCLKSec

2.75 V VRAD
26MHz X-tal DET Bias En

XOp

XO
CLKREQ

RF Pow det Det


En
WPOW_DET_EN

Figure 3-7-1. Block diagram of RF part

3.7.2. WCDMA Part


The W-CDMA transceiver uses differential analog in-phase and quadrature-phase interfaces, that is an IQ-interface, both in the receiver and transmitter information path. The transceiver has the following general features: . Power class : Power class 3 (+24dBm) in Band I . Power class : Power class 3 (+24dBm) in Band VIII . Zero-IF Receiver.No IF filter needed . Direct IQ modulation transmitter

LGE Internal Use Only

- 62 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.7.2.1. Transmitter Part


The W-CDMA transmitter architecture is an on frequency linear direct up-conversion IQ-modulator. The TX IQ modulator has differential voltage I and Q inputs. It converts input signals to RF output frequency and is designed to achieve LO and image suppression. The in-phase and quadrature-phase reconstruction filters are fully integrated and a programmable gain amplifier implements the gain control. The transmit output stage provides at least +5 dBm at maximum power control at the single-ended 50 output. Gain is set through the 3-wire bus. An external SAW filter between the W-CDMA circuit and the power amplifier is used to improve noise performance. Two 10-bit DACs are used to control the DC/DC converter and the PA gain. After the power amplifier, the signal is sent through an isolator and through the duplex filter, which directs the transmit signal to the antenna connector through the antenna switch. The supply voltage and bias of the power amplifier are adapted depending on the output power to achieve high efficiency at every transmitter power level. A high efficiency DC/DC converter regulates the supply voltage and the bias operation point is controlled by a D/A-converter in the W-CDMA radio circuit. These DACs are controlled through the 3-wire-bus

VBAT

WCDMA/GSM/GPRS/EDGE TRX
1930 1990 MHz
GSM/EDGE HB GSM/EDGE HB GSM/EDGE LB GSM/EDGE LB WRxIA

LNA LNA LNA LNA LNA

WRxIB

1805 1880 MHz

0 90
WRxQA WRxQB

925 960 MHz

869 894 MHz

WCDMA HB

EDataStr

A
VAPC
WCDMA HB

EDataA

LNA LNA
VCO VCO

D
EDataC

WCDMA LB

A D
N.M

EDataB

ANT

ESD

PA

GSM850/ 900 Input

824 915 MHz

GSM/ EDGE LB

2.75 V VRAD

PA

DCS/PCS Input

1710 1910 MHz VBAT


PWM/PFM WDCDCREF

GSM/ EDGE HB

+
DAC DAC

LPF

ChP

PhD

XO

GSM/EDGE PA + Ant Sw.

VccWPA

DAC 1.8 V VIO

Switch Control Logic

En RFCtrl1

GSM/EDGE AM

UL: 1920 1980 MHz DL: 2110 2170 MHz

+
RFCtrl1

DAC
CLK RADCLK RADDAT RADSTR

FB

VccWPA

RFCtrl1

LPF
RFCtrl2

ChP

PhD

Serial Control

DATA STROBE

Power coupler UL: 1749.9 1784.9 MHz DL: 1844.9 1879.9 MHz

RFCtrl2

DET

Bias

En

VCO
WCDMA HB

N.M
WTxIA

VccWPA

WCDMA HB

WTxIB

WCDMA HB

0 90
WTxQA WTxQB

Power coupler UL: 830 840 MHz DL: 875 885 MHz

DET

Bias

En

WCDMA LB

MCLK

VccWPA
XOn MCLKSec

2.75 V VRAD
26MHz X-tal DET

XOp

XO
CLKREQ

Figure 3-7-2. WCDMA Transmitter Architecture

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 63 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.7.2.2. Receiver Part


The W-CDMA receiver architecture is a direct down-conversion Zero Intermediate Frequency (ZIF) receiver with integrated low-pass channel filter, i.e. the front-end receiver converts the aerial RF signal from W-CMDA band I down to a ZIF. The first stage consists of one single-ended low noise amplifier (LNA) with a 16 dB gain step. This LNA is followed through an external filter by an IQ down-mixer which consists of a mixer in parallel driven by quadrature out-of-phase LO signals. The In phase (I) and Quadrature phase (Q) ZIF signal are then low pass filtered to provide protection from high frequency offset interferer fed into the channel filter. The front-end zero IF I and Q outputs are applied to the integrated low-pass channel filter with a provision for 4 x 8 dB gain steps in front of the filter. The filter is a self-calibrated 6 pole, 2 zero filter with a cut-off frequency around 2.15 MHz and a second order group delay compensation (2 poles, 2 zeroes). Once filtered, the zero IF I and Q signals are further amplified with provision of 31 x 1 dB steps and DC offset compensation. The zero IF output buffer provides close rail-to-rail outputs signal.

WCDMA/GSM/GPRS/EDGE TRX
1930 1990 MHz
GSM/EDGE HB GSM/EDGE HB GSM/EDGE LB GSM/EDGE LB WRxIA

LNA LNA LNA LNA LNA

WRxIB

1805 1880 MHz

0 90
WRxQA WRxQB

925 960 MHz

869 894 MHz

WCDMA HB

EDataStr

A
VAPC
WCDMA HB

EDataA

LNA LNA
VCO VCO

D
EDataC

WCDMA LB

A D
N.M

EDataB

ANT

ESD

PA

GSM850/ 900 Input

824 915 MHz

GSM/ EDGE LB

2.75 V VRAD

PA

DCS/PCS Input

1710 1910 MHz VBAT


PWM/PFM WDCDCREF

GSM/ EDGE HB

+
DAC DAC

LPF

ChP

PhD

XO

GSM/EDGE PA + Ant Sw.

VccWPA

DAC 1.8 V VIO

Switch Control Logic

En RFCtrl1

GSM/EDGE AM

UL: 1920 1980 MHz DL: 2110 2170 MHz

+
RFCtrl1

DAC
CLK RADCLK RADDAT RADSTR

FB

VccWPA

RFCtrl1

LPF
RFCtrl2

ChP

PhD

Serial Control

DATA STROBE

Power coupler UL: 1749.9 1784.9 MHz DL: 1844.9 1879.9 MHz

RFCtrl2

DET

Bias

En

VCO
WCDMA HB

N.M
WTxIA

VccWPA

WCDMA HB

WTxIB

WCDMA HB

0 90
WTxQA WTxQB

Power coupler UL: 830 840 MHz DL: 875 885 MHz

DET

Bias

En

WCDMA LB

MCLK

VccWPA
XOn MCLKSec

2.75 V VRAD
26MHz X-tal DET

XOp

XO
CLKREQ

Figure 3-7-3. WCDMA Receiver Architecture

LGE Internal Use Only

- 64 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.7.2.3. Synthesizer
WCDMA Transmitter Synthesizer All RF frequencies are generated in the WCDMA Tx 4 GHz VCO, subsequently divided by 2 or 4 to arrive at the final frequency. The WCDMA Tx RF-VCO is locked to the XO in a fractional N PLL consisting of a prescaler, a phase frequency detector, a charge-pump, a sigma-delta modulator, and a fully integrated loop filter. Automatic trimming of the VCO center frequency and the RC constant ensures that the variation of the PLL dynamics is sufficiently low. GSM/EDGE and WCDMA Receiver Synthesizer All RF frequencies are generated in either of the two 4 GHz VCOs, subsequently divided by 2 or 4 (depending on final frequency). The selection of either of the two VCOs is done using the digital bus. The selected RF-VCO is locked to the XO in a fractional N PLL consisting of a prescaler, a phase-frequency detector, a charge-pump, a sigma-delta modulator, and a fully integrated loop filter. Automatic trimming of the VCO center frequency and the RC constant ensures that the variation of the PLL dynamics is sufficiently low.

VRAD_2V8

VDDA_2V8

R123 R126 R127 DNI R124 390 C160 FB100 0

560 1800 C161 DNI C159 3.9p 4.3nH R125 GRX_1900

U108
C162 4 C163 TX_ADC_STRB 1 2 3 _OE VCC A GND Y 5 VRAD_2V8

FL103
L104 3.3nH GND6 10 GND4 8 GND2 7 6 C164 15p 9 OUT_1842_5 IN_1842_5 1 L107 NA OUT_1960 GND5 5 GND3 3 GND1 2 IN_1960 4 3.9nH L105 NA

0.01u

22p

SN74LVC1G125DRLR
TX_ADC_STRB_2V8

33p

closed to RF3300

R128 GRX_1800

0.01u

22p

WRX_Q_N WRX_Q_P WRX_I_N WRX_I_P

C166

C167

VDDA_2V8

R129 270

27 270

R130 C169

0 C170

C165 DNI

SAWEN1G84BC0F25
L106 2.2nH

GTX_1800_1900

R131

AMP_FREQ_LSB DATA_STR 55 53 49 47 45 43 41 39

R132

DNI

2.7p

0 C172 3.3p

R133 GRX_900

FL104
GND6 10 GND4 8 GND2 7 6 9 OUT_942_5 OUT_881_5 GND5 5 GND3 3 GND1 2 IN_942_5 IN_881_5 4 0 1 L112 NA R140 GRX_850 L109 NA

270

R138 DNI

R139 DNI

3 WRXIN 4 WRXIP 6 EDATAC 7 EDATASTR 8 EDATAA 9 EDATAB 10 11 12 STR DATA CLK

R136

56 ETXHB 54 ETXLB EAMMOD 52

R137

51 VCCA2 27 VCCA1

270

QDATA_AMP_MSB IDATA_FREQ_MSB

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8

R134

27

GTX_850_900 L110 8.2nH L111 NA

1 WRXQN 2 WRXQP

C177 GTX_VAM L113 10nH C178

3.3p

DNI R141

SAWEN881MBA0F25
L114 NA

50 ERXHB2 48 ERXHB1 46 ERXLB2 44 ERXLB1 42 WRXHB2 38 WRXHB1 WRXLB 40 39nH L116 DNI R145 WDCDC_EN C180 DNI 560 R143

RF_CTRL_STR_1 RF_CTRL_DATA RF_CTRL_CLK TESTOUT MCLKREQ MCLK R148 DNI

33p

U111 RF3300

R142

18p

WRX_BAND_1 C179 10nH R146 4.7K ADOUT

R144

13 TESTOUT 14 CLKREQ 15 MCLK 17 XON 18 XOP


4

TX_ADC_STRB_2V8

L115 5.6nH

TN4-26562 26MHz
2 GND1 3 HOT2 HOT1 1 GND2

37 RFCTRL1 36 RFCTRL2 35

C181 100p

PT100

R149

R150

X100

GND9 GND10 GND11 GND12 GND13 GND14 GND15 GND16

DNI

23 WTXLP 24 WTXIN 25 WTXQP 26 WTXQN

R155 DNI

C185 DNI

31 WTXHB3 33 WTXHB2 29 WTXHB1 PGND 57

R151

FL105 SAFEB897MAM0F00

WRX_BAND_2 DNI WTX_BAND_8_5_TO_PA R153 R152 0 L117 2.2nH

IN

OUT

DNI

DNI

G1 G2 G3

TEMP SENSOR
L118
FL106 SAFEB1G95KA0F00

R158

5 16 19 22 28 30 32 34

MCLKSEC

R157

10nH WRX_BAND_8_5

R159 DNI

R161 0 C187 DNI

3 1
G3 IN OUT G1 G2

R162

0 R164 DNI WTX_BAND_1_TO_PA L119 1.8p

NA L120

VDIGRAD_1V8 C188 DNI C189 DNI

RF TRANCEIVER
0 C191 DNI WTX_I_P WTX_I_N WTX_Q_P WTX_Q_N R165

FL107 SAFEA1G88KB7F00 3 1
G3 IN OUT G1 G2

R166

0 R168 DNI WTX_BAND_2_TO_PA

Figure 3-7-4. WCDMA Transceiver schematic

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 65 -

LGE Internal Use Only

4.7K

20 MCLKSEC 21 VCCD

RTEMP

WTXLB

3. TECHNICAL DESCRIPTION

3.7.2.4. Power Amplifier Module


The SKY77182 Power Amplifier module is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 19201980 MHz bandwidth into a single compact package.

Figure 3-7-5. SKY77182 Functional Block Diagram

The SKY77181 Power Amplifier module is a fully matched 8-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 880915 MHz bandwidth into a single compact package.

Figure 3-7-6. SKY77181 Functional Block Diagram

LGE Internal Use Only

- 66 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

VDDA_2V8 VBAT

VRAD_2V8

R100

R101

DNI

C103 0.1uF

C104 22p

C105 22p

U100 1 R103 2 R104 3 75 VDD RF_IN

LMV221 OUT REF DAP EN 6 5 4

R102 WPOW_DET 1K C106 33nF

C100 10u

C101 0.1u

C102 1000p U102 SKY77182 9 PGND 8 GND2 GND1 RFOUT VCC 7 6 5

120

GND

WTX_BAND_1_EN BIAS_CTRL WTX_BAND_1_TO_PA C115 1000p C116 1000p

1 2 3 4

VENB VCTRL RFIN VBIAS

C110 0.1u L100 18p C117 NA C118 NA

C111 22p

WPOW_DET_EN

VBAT VCC_WPA C120 0.1uF C121 22p C122 22p

3 1 FL100

IN

COU

3 R109 DNI

TX RX ANT 6

L601 2.2nH

U103 LDC151G8620Q-359 1 4 OUT TER

7 GND4 8 GND5 9 GND6 C119 100p

5 GND3 4 GND2 2 GND1

R107

10

U105
1 2 VEN_BAND_2 IN_BAND_2 GND1 VCC1 VCONT IN_BAND_5

SKY77175
PGND GND4 OUT_BAND_2 GND3 VC2 VBIAS OUT_BAND_5 15 L101 14 C127 DNI 1.8nH 13 12 11 10 C137 1000p 9 8 C136 22p U104 LDC151G8620Q-359 1 4 OUT TER C128 1.5p

WRF_BAND_1 C124

SAYFP1G95AA0B00 3.6nH

56

WTX_BAND_2_EN WTX_BAND_2_TO_PA BIAS_CTRL WTX_BAND_8_5_TO_PA C133 C134 WTX_BAND_8_5_EN DNI 100p R116 R118 DNI

3 4 5 6

R113

C123

DNI

WRX_BAND_1

GND4 GND5 GND6 C135 100p TX R117 56 DNI RX FL101 C138

GND3 GND2 GND1 C636 3.3nH ANT ACMD-7407 C143 0.5p

C141 1000p

7 C142 22p

IN

COU

VEN_BAND_5

GND2

WRF_BAND_2

R120

24

DNI

VBAT U107 1 C148 10u C149 0.1u C150 1000p 2 3 4 C157 1000p C158 1000p VBIAS RF_IN VCONT VEN SKY77181 8 VCC RF_OUT 7 C146

WRX_BAND_2 GND4 GND5 GND6 C145 100p TX R121 56 R652 DNI RX FL102 C153 1000p C154 0.1u C155 10u C156 DNI L103 8.2nH C151 LT56B ANT 6.8nH C152 0 WRF_BAND_8_5 GND3 GND2 GND1

C144

U106 LDC15874M19Q-360 1 4 OUT TER C147 22p 2 IN COU 3

100p

6 GND2 5 GND1 9 PGND

BIAS_CTRL

WCDMA PA Block

WRX_BAND_8_5

Figure 3-7-8. WCDMA PAM schematic

3.7.3. WCDMA/EDGE/GPRS/GSM RF block


The transceiver is a multi-mode transceiver for WCDMA/EGDE/GPRS/GSM. The EDGE/GPRS/GSM part of the transceiver use a digital baseband interface that is shared between received and transmitted data. The receive interface is based on I and Q data and the transmitter interface is based on envelope and frequency data. The WCDMA part of the transceiver use differential analog in-phase and quadraturephase interfaces, that is an IQ-interface, in the receiver and the transmitter data paths. The EDGE/GSM/GPRS part of the transceiver has the following general features: Power class - GMSK low bands: Class 4 (33 dBm) - GMSK high bands: Class 1 (30 dBm) - 8PSK low bands: Class E2 (27 dBm) - 8PSK high bands: Class E2 (26 dBm) - WCDMA: class 3 (+24dBm)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 67 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

VBAT

WCDMA/GSM/GPRS/EDGE TRX
1930 1990 MHz
GSM/EDGE HB GSM/EDGE HB GSM/EDGE LB GSM/EDGE LB WRxIA

LNA LNA LNA LNA LNA

WRxIB

1805 1880 MHz

0 90
WRxQA WRxQB

925 960 MHz

869 894 MHz

WCDMA HB

EDataStr

A
VAPC
WCDMA HB

EDataA

LNA LNA
VCO VCO

D
EDataC

WCDMA LB

A D
N.M

EDataB

ANT

ESD

PA

GSM850/ 900 Input

824 915 MHz

GSM/ EDGE LB

2.75 V VRAD

PA

DCS/PCS Input

1710 1910 MHz VBAT


PWM/PFM WDCDCREF

GSM/ EDGE HB

+
DAC DAC

LPF

ChP

PhD

XO

GSM/EDGE PA + Ant Sw.

VccWPA

DAC 1.8 V VIO

Switch Control Logic

En RFCtrl1

GSM/EDGE AM

UL: 1920 1980 MHz DL: 2110 2170 MHz

+
RFCtrl1

DAC
CLK RADCLK RADDAT RADSTR

FB

VccWPA

RFCtrl1

LPF
RFCtrl2

ChP

PhD

Serial Control

DATA STROBE

Power coupler UL: 1749.9 1784.9 MHz DL: 1844.9 1879.9 MHz

RFCtrl2

DET

Bias

En

VCO
WCDMA HB

N.M
WTxIA

VccWPA

WCDMA HB

WTxIB

WCDMA HB

0 90
WTxQA WTxQB

Power coupler UL: 830 840 MHz DL: 875 885 MHz

DET

Bias

En

WCDMA LB

MCLK

VccWPA
XOn MCLKSec

2.75 V VRAD
26MHz X-tal DET Bias En

XOp

XO
CLKREQ

RF Pow det Det


En
WPOW_DET_EN

Figure 3-7-9. GSM Transceiver Architecture

3.7.3.1. Transmitter Part


Transmitter There are two transmitter blocks, one for GSM/EDGE and one for WCDMA. GSM/EDGE Transmitter Block A separate block is used to convert the digital bit streams from the baseband into parallel words to be used in the DACs and Sigma Delta modulator. This block also includes programmable delays for optimizing timing between the different modulation paths. A separate output is generated for the auto-tuning block of the second FM path. The block also outputs a low-frequency square wave to the FM paths, to enhance the speed of the auto tuning for the second FM path.

LGE Internal Use Only

- 68 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

The combined DAC and LP filter is used to convert the digital words of the digital block into analog signals. The LP filters are 3rd order Bessel reconstruction filters. The second FM path is used to add the high-frequency part of the FM to the VCO. It also includes an autotuning block that compensates for VCO gain variations. The AM block converts the differential voltage from the DAC to a single-ended output that drives the PA. The output is scaled according to the desired output power, and an offset can be added for PA linearization. The Tx-buffer is used to drive the PA with the correct power level. A divide by 2 or 4 block is used to generate the correct output frequency from the 4 GHz VCO. WCDMA Transmitter Block The transmitter has differential voltage I and Q inputs. The IQ signal is filtered in a second order LP filter before it is up-converted to the RF in the direct IQ mixer. Automatic trimming of the filter RC constant ensures that the bandwidth variation is sufficiently low. The signal path is split in one low and three high band paths. The RF signal is amplified in a PGA, which is controlled by the 3-wire control bus. The low band and two of the high band transmit output stages provide +5 dBm (minimum) and the last high band output stage provide +7 dBm (minimum) at maximum power control. The output power is set through the serial bus.

3.7.3.2. Receiver part


Receiver The receiver is a homodyne receiver with direct conversion of the received radio channel to baseband I and Q channels. The receiver block consists of multi-band front ends with separate LNAs, a common mixer and a common LP filter with configurable bandwidth. GSM/EDGE Receiver The front end block is followed by a baseband block with active anti-aliasing filters that also suppress blocking signals and interferers. Automatic trimming of the filter RC constant ensures that the bandwidth variation is sufficiently low. The baseband block is followed by a fully integrated ADC of sigma delta structure with high dynamic range. The analog signals are converted to digital bit-streams in a sigma delta converter. The digital output signals are sent over a serial interface to the digital baseband controller for further processing and detection. WCDMA Receiver The front end block is followed by a baseband block with active anti-aliasing filters that suppress blocking signals and interferers. Automatic trimming of the filter RC constant ensures that the bandwidth variation is sufficiently low. The baseband signal is amplified in a PGA, which is controlled by the 3-wire control bus. The PGA has a built in second order loop for DC-offset cancellation. The output of the receiver is analog differential I, Q signals.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 69 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.7.4. Front-End Module (FEM)


A single antenna is used for all bands. The single antenna is used for all transmission and reception. The Front End block connects the proper block in the radio system to the antenna. The Front End has two inputs for EDGE/GSM/GPRS, one for low band (850/900 MHz) and one for high band (1800/1900 MHz). The EDGE/GSM/GPRS power amplifier output is filtered by the low pass filter in the Front End and then connected to the antenna through a switch. In receive mode, the EDGE/GSM/GPRS signal from the antenna passes through the switch to one of the four receive SAW filters. The SAW filter provides receive band selectivity. In GSM/GRPS/EDGE systems, transmit and receive operations are divided in time and the switch connects the proper block in accordance with the mode of operation (that is, transmit or receive; one at a time). In WCDMA the transmit outputs from the WCDMA transceiver are filtered by an external SAW filter that cleans up the spectrum. The SAW filter output is connected to the power amplifier, one for each band. For power control, a sample of the transmit output is taken by a directional coupler and converted to a DC level by the power detection circuit. This signal is used to control the transmitter output power. The transmit signal passes through an isolator and then a duplexer. The duplexer output is selected by the switch in the Front End for connection to the antenna. In WCDMA receive mode the signal from the antenna is switched by the Front End to the correct duplexer. The output from the duplexer is connected to the LNA input in the WCDMA receiver.

Figure 3-7-10. Front-End Module

LGE Internal Use Only

- 70 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL DESCRIPTION

3.7.4.1. Front End Part


SKY77521 is a transmit and receive Front End Module (FEM) designed in a very low profile (1 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation a complete transmit VCO-to-Antenna and Antenna-to receive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar Modulation. WCDMA switch-through support is provided by three dedicated high-linearity ports.

Figure 3-7-11. SKY77521Functional Block Diagram


VBAT

C108 0.01u

30 29 28 27 26 25 24 23 22 21 12 11 2 GTX_850_900 GTX_1800_1900 ANTSW2 ANTSW1 R111 R112 0 0 C129 22p C130 22p

GND13 GND12 GND11 GND10 GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1

PGND1 31 PGND2 32 PGND3 33 PGND4 34

VBATT VAPC

C107 10u

C109 47p

5 4 C112 C113 C114 22p 33p 22p GRX_850 GRX_900 GRX_1800 GRX_1900 R108 DNI WRF_BAND_2 WRF_BAND_8_5 WRF_BAND_1

R105 R106 DNI

GTX_VAM

WCDMA3 20 WCDMA2 19 WCDMA1 18

U101

RX1 16 RX2 15 RX3 14 RX4 13 RSVD MODE _TXEN ANT 10


G2

SW100
KMS-518
G1 C A

LB_RF_IN 3 HB_RF_IN 1 BS2 6 BS1 7

9 8 C125 17 C126 DNI 22p

SW101 UFL-R-SMT10 L102 100p ANT C132 DNI G1 G2

SKY77521

ANTSW0 ANTSW3

R114 R115

0 0 C139 22p C140 22p

GSM PA WITH ASM


Figure 3-7-12. Front End part schematic

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 71 -

LGE Internal Use Only

3. TECHNICAL DESCRIPTION

3.7.5. Control Flow


The access side of the digital baseband controller controls the overall radio system. In both EDGE/GSM/GPRS and W-CDMA air interface mode, the digital baseband controller controls the radio system through a threewire serial bus. The digital baseband controller also manages PA band control and the antenna switch mechanism in the front end module. The 26 MHz VCXO clock residing in the GSM/EDGE transceiver is turned on only when required, the digital baseband controller initiates this. The EDGE/GSM/GPRS RF system requires control, which is temperature dependent. The temperature within the RF system is estimated by a voltage measurement performed by the analog baseband controller. The control flow for the RF system is shown in Figure 3-7-11.

Figure 3-7-13. RF Control Flow

LGE Internal Use Only

- 72 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4.1 Power ON Trouble 4.1 Power ON Trouble
VPPFLASH_E CTS_ON APP_ACC_UART_RX APP_ACC_UART_TX
TP800 TP801 TP802 TP803 TP804

START

OTP_SUB

TP1
The voltage of main battery is higher than 3.3V ? Yes No change main battery

END key operates well? UART_TX(TP1) level is 1.8V when END key pressed.

No

Follow the keypad Trouble shooting guide

TP10

TP8
Yes

TP5

TP6
Check the voltage.

TP9

TP3 TP2

TP7 TP4

TP3 TP2 TP4

< Main Board Bottom side >


VDDA_2V8 VDDD_2V65 VDDE_1V8 VDIGRAD_1V8 VBAT

VDDA_2V8 (TP2) 2.8V VDDD_2V65 (TP3) 1.5V


R302 0

VBAT VDDA_2V8 R303 R304 R305 C302 2.2u C303 2.2u C304 2.2u VDDC_2V65 EXT_LDO VDDH_2V75 VDDF_2V5 VDDG_2V85 VDDK_2V75 0 VDDD_2V65 0 VDDE_1V8 0 VDIGRAD_1V8 to RF3300 digital to All I/O Supplies and Memory to AB3100 CODECs/ADC/PLL to RF3300 Power Detector

VDDE_1V8 (TP4) 1.8V VDDC_2V65(TP5) 2.65V VDDH_2V75(TP6) 2.75V VDDF_2V5 (TP7) 2.5V VDDG_2V85 (TP8) 2.75V VDDK_2V75(TP9) 2.75V VCORE(TP10) 1.2V

TP5 TP6 TP7 TP8 TP9

R306 R307 R308 R309 R310

0 VDDC_2V65 0 VDDH_2V75 0 VDDF_2V5 0 VDDG_2V85 0 VDDK_2V75 to Bluetooth to SD Card and LCD to DB3100 analog to 3xis to Hall Switch and AB3100 BEAR

R311 VBACKUP 4.7K C307 2.2u C308 1u C309 1u C310 4.7u 1608 C311 1u C312 1u VBAT_C VBAT VCORE

BLM18PG121SN1J 120ohm 1608 2A 50mohm Bead FB300

TP10
VCORE to DB3210 CORE

No Change main board


C314 0.1u C315 10u

2.8*2.6*1.0 0.7A 240mohm 20% R312 L300 4.7uH D300 RB521S-30 C317 10u C318 10u C319 0.1u Parallel with VCORE Local ground plane 0

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 73 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.2 USB Trouble


START (Connect a USB Cable from a PC) Yes No

Is it open state between USW_ID(TP1) & TP2? Yes

Change main board

No ACC_GP_USB_CS(TP3) is 1.8V? Yes Finish Change main board

TP2

TP1 TP3
VBAT 10V

R500

MUIC
D2 BAT VB D5 USW_DM USW_DP R502 R504 2.2K R507 R508 DNI DNI 0 VBAT USW_ID

V
51K R655

C500 0.1u

C501 4.7u

A4 DN1 A5 DP2 B3 U1 A3 U2 A1 MIC D4 AUD1 D3 AUD2 ISET SCL SDA INT


2 A2

C5 COM1 B5 COM2 U501 B4 MAX14526EEWP_TCC6 UID RES CAP B1 D1

VCC NC2 NC1

F3 F2 F1

C4 GND C3 IC

TI : PD = USB, MAXIM : NA = U

C2 C1 B2

ACC_GP_USB_CS ACC_USB_HS_IN_CLK USB_DATA(0) USB_DATA(1) USB_DATA(2) ACC_USB_HS_DATA(3) ACC_USB_HS_DATA(4) ACC_USB_HS_DATA(5) ACC_USB_HS_DATA(6) ACC_USB_HS_DATA(7) ACC_USB_HS_NXT ACC_USB_HS_STP ACC_USB_HS_DIR

C3
TP500 A4

If TI, then 10nF If Maxim, then 4.7uF

TP2
C512 4.7u C513 0.1u

< Main Board Bottom side >

LGE Internal Use Only

- 74 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

GND3 E4 GND2 D2 GND1 C5

C509 4.7u

B1 TP501 A1 A2 A3 A5 A6 B6 C6 D5 D6 E5 E1 E6

TEST CHIP_SEL VCC_IO1 CLOCK VCC_IO2 DATA0 RREF DATA1 DM DATA2 U502 DP DATA3 DATA4 ISP1508AET FAULT DATA5 DATA6 DATA7 NXT STP DIR CFG0 REF1V8 ID CFG2 CFG1 PSW_N VBUS REG3V3 XTAL1 XTAL2

C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6

4. TROUBLE SHOOTING

4.3 SIM Detect Trouble


SIM control path
- DB3200 generates SIM interface signals(1.8V level) to AB3100. - AB3100 converts SIM interface signals to 3V.

START

Reconnect SIM card

SIM works well? No Resolder J800 on main PCB and check the contact between J800 and SIM card

Yes

Finish J800

SIM works well? No Change SIM card

Yes

Finish

< Sub Board >

SIM works well? No Change Sub board

Yes

Finish

J800 4 GND VCC 5 VPP RST 6 I_O CLK 8 GND2 GND1

1 2 3 7

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 75 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.4 MicroSD card Trouble


GND 1 2 3 4 5 6 7 8
SWA SWB

START

R416

2.2

Re-insert MicroSD card

MicroSD works well? No Check operation of MicroSD card using other notebook or PDA

Yes

Finish TP1

H EN

TP2

MicroSD works well? Yes Re-insert MicroSD Yes

No

Change the MicroSD

S100

< Main Board - Top side > VDDG_2V85 (TP1) is same to 2.85V? No Change Main board

Yes

APP_GP_MMC_DETn(TP2) is same to 0 V?

No

Change Main board

Yes MicroSD works well? No Change main board Yes Finish

LGE Internal Use Only

- 76 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.5 Key and Touch Screen Trouble


4.5.1 Key Trouble
START

Press the key button

Key works well? No

Yes

Finish

Check key button. If Key button is pressed or appearance is abnormal, Change the key button.

works well? No

Yes

Finish

Check BtoB connector(CN2) Re-assemble CN2. Check connector soldering. Re-solder CN2.

works well? No Change the key FPCB.

Yes

Finish

works well? No Change Main Board

Yes

Finish

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 77 -

LGE Internal Use Only

4. TROUBLE SHOOTING

1
Check key button. If Key button is pressed or appearance is abnormal, Change the key button.

CN2

2
Check BtoB connector(CN2) Re-assemble CN2. Check connector soldering. Re-solder CN2.

LGE Internal Use Only

- 78 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.5.2 Touch Screen Trouble


START

Reboot the phone

Touch screen works well? No Perform Touch Calibration

Yes

Finish

Touch screen works well? No

Yes

Finish

Check connector. CN400, CN901 Re-assemble or Re-solder. Yes

Touch screen works well? No

Finish

Check U404, U405, U406 and peripheral circuit. Re-solder U404, U405, U406 and peripheral circuit.

Touch screen works well? No Change touch window

Yes

Finish

Touch screen works well? No Change main board

Yes

Finish

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 79 -

LGE Internal Use Only

4. TROUBLE SHOOTING

CN400

1
Check connector. CN400, CN901 Re-assemble or Re-solder.

CN901

Peripheral circuit U405

2
U406 U404
Check U404, U405, U406 and peripheral circuit. Re-solder U404, U405, U406 and peripheral circuit.

LGE Internal Use Only

- 80 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.6 Camera Trouble


Camera control signals are generated by DB3200 with ISP

4.6.1 5M Camera
START

Press END Key to turn on the power

NO Is the circuit powered?

Follow the Power On Trouble Shooting

YES Reconnect the 5M 24pin B to B connector

YES 5M Cameras Operation is OK?

NO Change 5M Camera

NO
Pin7 of U603 or C628=1.8V? Pin8 of U603 or C627=2.8V?

Change U603

YES

Change Main Board

5M Camera Works

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 81 -

LGE Internal Use Only

4. TROUBLE SHOOTING

pin7

pin8
U603

CN600
C628 C627

< Main Board Bottom side >

< Main Board Top side >

ISP_AVDD_2V8 VBAT ISP_DVDD_1V8

R635 R625 APP_GP_ISP_LDO_EN 5.6K C629 1u 0

U603 1 VIN 2 EN1 3 EN2 4 NC1 C630 1u

RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND C628 1u C627 1u

PGND

C628

C627

LGE Internal Use Only

- 82 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.6.2 VGA Camera


VGA Camera control signals are generated by DB3200.

START

Press END Key to turn on the power

NO Is the circuit powered? YES Follow the Power On Trouble Shooting

1
Reconnect the 34pin B to B connector CN503 and VGA 34pin Camera Connector YES VGA Camera Operation OK? NO

NO
Pin33(TP1) of CN503) or pin 8 of U 601(TP2) =2.8V? Pin31(TP3) of CN503) or pin 7 of U 601(TP4)=1.8V?

Change U601

YES
C901(TP5) =2.8V? C900(TP6)=1.8V?

NO

Change VGA FPCB

YES NO
C913 (TP7) =1.5V?

YES

1
Check the CN 901 soldering status And resolder the CN 901.

VGA Camera works well.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 83 -

LGE Internal Use Only

4. TROUBLE SHOOTING

CN 503

CN901
VGA CAM FPCB (Top)

Main board (Bottom)

LGE Internal Use Only

- 84 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

2 TP1 (pin33)
34

TP3(pin31)
18

Main board (Bottom)

CN 503
1 17

TP4 (pin7)
U601 Main board (Top)

TP2 (pin8)

TP2 TP4
VBAT CAM_DVDD_1V8

CAM_AFVDD_2V8 CAM_AVDD_2V8

R634 APP_GP_CAM_LDO_EN R616 5.6K 1u 0 1u

U601 1 VIN 2 EN1 3 EN2 4 NC1

RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND

PGND

C611

C612

C613

1u

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

C614

1u

- 85 -

LGE Internal Use Only

4. TROUBLE SHOOTING

TP6

TP5 TP7

VGA CAM FPCB(Bottom)


CAM_DVDD_1V8

CAM_AVDD_2V8

TP6

TP5
A2 IOVDD B6 DVDD E5 AVDD DCLK HSYNC VSYNC DATA0 DATA1 DATA2 DATA3 DATA4 DATA5 DATA6 DATA7 GND1 GND2 GND3 GND4 A3 D1 D2 B3 B1 B2 B4 C1 C2 C3 D4 A4 C4 E2 E3 R904 51 CI_PCLK CI_HSYNC CI_VSYNC CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7]

SYSCLK0 APP_GP_VGA_SDN CI_RES_n APP_I2C_SDA APP_I2C_SCL

B5 C6 D3 C5 D6

EXTCLK PWRDWN RESET SDA SCL

U901 TCM9000MD

TP7
C901 0.1u C900 0.1u

C913 0.1u

LGE Internal Use Only

F1

PGND

A5 VDD15_1 E4 VDD15_2

- 86 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.7 Main LCD Trouble


LCD control signals are generated by DB3200.
START

Press END Key to turn on the power. NO Is the circuit powered? YES No Is the backlight on? 1

Follow the Power On Trouble Shooting

Reconnect the LCD FPCB 50pin(CN2) and 40pin (CN1) LCD connector. Or Change Key FPCB.

YES

Yes Is the backlight on? No 2 Yes Change the U604

LCD display OK? NO 1 Reconnect the LCD FPCB 50pin(CN2) and 40pin (CN1) LCD connector. Or Change Key FPCB.

The LCD works

3 No LCD display OK? Is the R600 (TP1) 1.8V? And Is the R601(TP2) 2.8V? Yes 5 The LCD works Is the LCD ID High? (CN1 Pin3 (TP3)) Yes No No Change LCD No Change the U600

Yes

Yes

IS the CN1 Pin11(TP4) Low? And Is the CN1 pin 19(TP5) high?

Change the main board

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 87 -

LGE Internal Use Only

4. TROUBLE SHOOTING

1
Key FPCB CN 1

CN 2

Key FPCB 40 pin B to B Connector

Key FPCB 50 pin B to B Connector

U604

U600

Main board (Bottom)

LGE Internal Use Only

- 88 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4
TP1 R600
U600 1 VIN 2 EN1 3 EN2 4 NC1 RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND VBAT

LCD_AVDD_2V8

TP1

LCD_DVDD_1V8

R600

U604 R601 TP2

PGND

APP_GP_LCD_ALDO_EN APP_GP_LCD_DLDO_EN

R653 R654

0 0 1u

R601

TP2

1u

C601

Main board (Bottom)


LDO for LCD Power

21

20

6
TP5 (pin19) TP4 (pin11)

40 CN 1

TP3 (pin3)

Key FPCB(Bottom)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 89 -

LGE Internal Use Only

C602

C603

1u

4. TROUBLE SHOOTING

4.8 Keypad Backlight Trouble

START

Press END Key to turn on the power

YES Keypad Backlight Works? NO NO VBAT applied? (TP1)

Keypad Backlight Works

Change Main Board

YES Check V at LD1000 or LD1001 or LD1002 or LD1003 is confirm (TP2) YES NO Change LD1000 or LD1001 Of LD1002 or LD 1003

Check V at R626(TP3)or R627(TP4) is confirm

NO Change Key FPCB

YES

Keypad Backlight Works

LGE Internal Use Only

- 90 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

LD1000

TP1
VBAT SSC-TWH104-HL LD1001 SSC-TWH104-HL LD1002 SSC-TWH104-HL LD1003

KEY_LED1

TP1

KEY_LED2 SSC-TWH104-HL

TP1

TP2
Key FPCB(Top)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 91 -

LGE Internal Use Only

4. TROUBLE SHOOTING

TP3

TP4

CN604

Main board (Bottom)

LGE Internal Use Only

- 92 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.9 Audio Trouble Shooting


4.9.1. Receiver

Signals to the receiver Receiver signals are generated at AB3100 BEARP, BEARN Receiver path : AB3100 (BEARP, BEARN) R322, R323 on main board Camera FPCB Receiver

Note : It is recommended that engineer should check the soldering of R, L, C along the corresponding path before every step.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 93 -

LGE Internal Use Only

4. TROUBLE SHOOTING

START

Connect the phone to network Equipment and setup call. Setup 1KHz tone out.

NO

Does the sine wave appear at TP1, TP2 ?

Change the main board

YES The sine wave not appear Does the sine wave appear at Number TP3, TP4 in the main Bd CN503? NO Change U301

YES

Does the sine wave appear at EAR(+) PAD(TP5) in LCD FPCB?

NO

Change the Camera FPCB

YES

Is the soldering of the receiver OK?

NO Resolder the Receiver

YES

Can you hear sine wave out of the receiver ?

NO Change the Receiver

YES

END

LGE Internal Use Only

- 94 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

TP2 1

Audio Subsystem

VBAT

C332 1u 1u

C333 1u

C334 0.1u

TP1
U301
EAR_R EAR_L SPKRP SPKRN C338 1u

C336

A3

B1 VDD

A4 A5

C1N C1P

PVDD

VSS

C5

HPR HPL

A1 A2

HS_EAR_R HS_EAR_L

C339 C342 C343 C344

1u 1u 18000p 18000p

D1 INA2 D2 INA1 C1 INB2 C2 INB1 B2 BIAS

U301 MAX9877AEWP_TG45 OUT+ OUTD5 B5 VA300 ICVL0505101V150FR VA301 ICVL0505101V150FR SPK_RCV+ SPK_RCV-

AMP_I2C_SDA AMP_I2C_SCL BEARP BEARN 1% R322 15 R323 15 1%

B3 SDA C3 SCL 22p PGND GND C352 D3 D4 RXIN+ B4 RXINC354 1u 22p C353

TP1 Main PCB Bottom 2 34

TP2

Audio Subsystem

CN503 18

TP3 TP4
SYSCLK0 TOUCH_X+ TOUCH_XTOUCH_Y+ TOUCH_YTOUCH_Y- : GND line shielding to CN APP_GP_VGA_SDN APP_I2C_SDA APP_I2C_SCL CI_RES_n 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CN503

C4

CAM_AVDD_2V8

CAM_DVDD_1V8

1 TP3 TP4

17

SPK_RCV+ SPK_RCV-

34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 C523 0.1u C525 0.1u

CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7] CI_HSYNC CI_VSYNC CI_PCLK

ENBY0040301 GB042-34S-H10-E3000

Main PCB Bottom

TP5

2 1 CN902

SPK_RCV+ SPK_RCV-

TP5 Camera FPCB Bottom

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 95 -

LGE Internal Use Only

4. TROUBLE SHOOTING

1 2

Measured 1khz Sine Wave Signal

Measured 1khz Sine Wave Signal

LGE Internal Use Only

- 96 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.9.2. Speaker (Voice Loud Speaker,Midi, MP3,Key Tone)

Signals to the speaker Speaker signals are generated at AB3100 SPKRP, SPKRN Speaker path : 1.AB3100 (SPKRP, SPKRN) 2. C343, C344 on the main board 3. U301(audio amp) on the main board 4. C352, C353 on the main board 5. Speaker

Note : It is recommanded that engineer should check the soldering of R, L, C along the corresponding path before every step.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 97 -

LGE Internal Use Only

4. TROUBLE SHOOTING

START

Connect the phone to network Equipment and setup call Setup 1KHz tone out

Does the sine wave appear at C343(TP1),C344(TP2)?

NO Change the main board

YES The sine wave not appear

Does the sine wave appear at U301 ? YES

NO Change the U301

Does the sine wave appear at R352(TP3),R353(TP4) ?

NO Change the U301

YES

Can you hear sine wave out of a speaker ?

NO Change each Speaker

YES

END

LGE Internal Use Only

- 98 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

TP3

TP4

U301

TP1 TP2

Audio Subsystem

VBAT

C332 1u 1u C336

C333 1u

C334 0.1u

TP1
C338 1u

A4 A5

C1N C1P

PVDD

VDD

VSS

TP3
HPR HPL A1 A2 HS_EAR_R HS_EAR_L

A3

EAR_R EAR_L SPKRP SPKRN

C339 C342 C343 C344

1u 1u 18000p 18000p

D1 INA2 D2 INA1 C1 INB2 C2 INB1 B2 BIAS

U301 MAX9877AEWP_TG45 OUT+ OUTD5 B5 VA300 ICVL0505101V150FR VA301 ICVL0505101V150FR SPK_RCV+ SPK_RCV-

TP2

AMP_I2C_SDA AMP_I2C_SCL BEARP BEARN 1% R322 15 R323 15 1%

B3 SDA C3 SCL 22p PGND D4 RXIN+ B4 RXINC354 1u 22p

B1

C5

TP4

GND

C352

D3

Audio Subsystem

< Main Board Bottom side >

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

C4

C353

- 99 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Measured 1khz Sine Wave Signal

LGE Internal Use Only

- 100 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.9.3. Microphone (Voice call, Voice Recorder, Video Recorder)

Microphone Signal Flow MIC is enable by MIC Bias CCO, MIC1P, MIC1N signals to AB3100 Check Points Microphone bias Audio signal level of the microphone Soldering of components Signal from the mic MIC C625,C626 on main board AB3100

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 101 -

LGE Internal Use Only

4. TROUBLE SHOOTING

START

Does not open Tx path about Mic?

No

Yes

Change the MIC

Yes

No Does it work properly ?

Yes

END

LGE Internal Use Only

- 102 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

1 MIC

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 103 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.9.4. Headset Receiver (Voice call, Video Telephony,MP3 )


START

Connect the phone to network Equipment and setup call Setup 1KHz tone out

1
Insert Headset. Does the Headset icon display on the main LCD? NO Does the level of R502 (TP1) under 0.5Volt ? NO

YES

2
YES Change the U501

3
Resolder R502(TP1) And try

again from the start

YES

Insert Headset. Does the Headset icon display on the main LCD?

NO Does the sine wave appear at R339(TP2),R342(TP3) ? YES NO Change the main B,d

Does the sine wave appear at R505(TP4),R506(TP5) ?

NO

Change the U301

YES

Does the sine wave appear at TP6, TP7 at CN501 ?

NO

Change the U501

7
Resolder CN501 Pins or change the Headset

Can you hear sine wave out of the receiver ? YES

NO Change the main Bd

END

LGE Internal Use Only

- 104 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.9.5. Headset MIC(Voice call, Video Telephony )


START

Connect the phone to network Equipment and setup call Setup 1KHz tone out

1
Insert Headset. Does the Headset icon display on the main LCD? NO Does the level of R502 (TP1) under 0.5Volt ? NO

YES

2
YES Change the U501

3
Resolder R502(TP1) And try

again from the start

YES

Insert Headset. Does the Headset icon display on the main LCD?

Check the signal level at C505(TP8) at the putting Audio signal in MIC Change the main B,d NO

6
A few hundred of mV Of the signal measured at C505(TP8) ? NO Resolder C505(TP8) and try again. If fail again, Change the main Bd

YES

Change the main Bd

NO Does it work properly ?? Try again from the start

YES

END

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 105 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.9.6. Headset
VBAT

MUIC

VBUS

TP1
1u

TP8 TP4
MIC2P HS_EAR_L HS_EAR_R C505 R505 R506 0.1u 10 10

D2 USB_DM USB_DP R501 APP_ACC_UART_RX APP_ACC_UART_TX R503 0 0

BAT

VB

D5 USW_DM USW_DP R502 R504 2.2K R507 R508 DNI DNI TI : PD = USB, PU = UART MAXIM : NA = USB, PU = UART C509 4.7u 0 VBAT USW_ID C504 1u

C503

A4 DN1 A5 DP2 B3 U1 A3 U2 A1 MIC D4 AUD1 D3 AUD2 ISET SCL SDA INT


TP602 A2

C5 COM1 B5 COM2 U501 B4 MAX14526EEWP_TCC6 UID RES CAP B1 D1

FB500 FB501 FB502 C506 C507 C508 22p 22p 22p

TP5
Close to MUIC
VDDE_1V8

C4 GND C3 IC

C2 C1 B2

If TI, then 10nF If Maxim, then 4.7uF

APP_GP_USW_SCL APP_GP_USW_SDA APP_GP_USW_INT

Audio Subsystem

R511

2.2K

VBAT

C332 1u 1u C336

C333 1u

C334 0.1u

A3

A4 C338 1u A5

C1N C1P

PVDD

VDD

VSS

TP2

B1

C5

TP7
HPR HPL A1 A2 HS_EAR_R HS_EAR_L

TP6
1 2 3 4 5

6
8

10 CN501 12
14

EAR_R EAR_L SPKRP SPKRN

C339 C342 C343 C344

1u 1u 18000p 18000p

D1 INA2 D2 INA1 C1 INB2 C2 INB1 B2 BIAS

U301 MAX9877AEWP_TG45 OUT+ OUTD5 B5 VA300 ICVL0505101V150FR VA301 ICVL0505101V150FR SPK_RCV+ SPK_RCV-

USW_DM USW_DP
USW_ID

7
9

TP3
AMP_I2C_SDA AMP_I2C_SCL BEARP BEARN 1% R322 15 R323 15 1%

11
13 15

B3 SDA C3 SCL 22p PGND GND C352 D3 C4 D4 RXIN+ B4 RXINC354 1u 22p C353

Audio Subsystem

LGE Internal Use Only

- 106 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

CN501 TP4 TP5

TP8

TP6 TP7

U501

U301 TP1

TP3 TP2

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 107 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10 Charger Trouble Shooting


Charging Circuit
VBUS Q300
S2

SIA911DJ
G2

D2

Charging

D4

D3

D1

S1

G1

CHREG

DCIO_INT VBAT_H R314 0 USB charging path VBAT 2012 1/4W 1% CHS+ R316 Route as a differential pair 0.1 CHS-

C330 22p D302


C1 1 A2 2 A1_C2 3

C331 33u

Discharging

BDATA C337 22p R320 300K

KDS221E_RTK

Causion when PCB lLayout Direction of BAT and GND

Phone ground return path

CN300 D1 1 2 3 D2

FGS+
2012 1/4W

1%

R324 0.025

Route as a differential pair FGS-

Make an Area at 8, 9 Layer

Main Battery Charging Path Charging Procedure - Connecting TA and Charger Detection - Control the charging current by AB1000 - Charging current flows into the battery Check Point - Connection of TA - Charging current path - Battery Trouble shooting setup - Connect TA and battery to the phone Trouble Shooting Procedure - Check the charger connector - Check the Charging current Path - Check the battery

LGE Internal Use Only

- 108 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

start

Check the pin(TP1) and battery connect terminals of I/O connector

Connection OK?

NO

Change I/O connector

YES

Is the TA voltage(TP2) 5.1V?

NO

Change TA

YES

NO
3

Is the VBUS voltage(TP3) 5.1V?

Change Main board

YES

4 3

Is it charging properly after changing Q400(TP4)?

YES

END

NO

Change Main board

Trouble Shooting - Charging

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 109 -

LGE Internal Use Only

4. TROUBLE SHOOTING

TP1

TP2
VBUS Q300
S2

SIA911DJ
G2

TP3
Charging

D2

TP4

D4

D3

D1

S1

G1

CHREG

DCIO_INT

Main Board ( Bottom side) - I/O connector and FET


VBUS
9

FM_ANT L500 C502 VA500

G2

G1

3
4 3 DRAIN CNTRL GND IN

U500 SRC GATE OUT VCC DRAIN_THERMAL NUS3065MUTAG 5 6 7 8 9

OUT IN 2 1 NFM21PC105B1A3 FL500 ZD500

TP2

82nH

DNI

ULCE0505C015FR

TP1
1 2 3 4 5

6
8

INSTPAR SD12T1G

10 CN501 12
14 CN500 1 2

C510
2012

C511

USW_DM USW_DP
USW_ID

1 uF

22p

TP3

Close by uUSB CONN

7
9

11
13 15

LGE Internal Use Only

- 110 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.11 Bluetooth Trouble


Bluetooth IC (STLC2593) gets power from PMIC (AB3100) and clock (MCLK) from RFIC. (RF3300) After checking them, Bluetooth RF path should be examined.

4.11.1 Bluetooth Power path


1 start TP1 TP2 1
1. Check BT IC Block TP1: 1.8V , TP2 : 2.75V

OK NG
2. Check Mainboard Connector TP3: 1.8V , TP4 : 2.75V

Go to 4.11.2

OK

Sub PCB
VDD_BT VDDK_2V75

NG
B2 C3 M8 C1 C2 M2 J4 BT_RSVR_CL1 BT_RSVR_CL2 BT_RSVR_D BT_RSVR_DSM BT_RSVR_N BT_RSVR_RF BT_REG_CTRL

Replace Sub PCB

TP1
R742 0

Check AB3100 (U300)

N7 BT_HVD E6 BT_VDD_CLD 0.1u C735

TP2

C736

0.1u

D4 NC1 F7 NC2 F8 NC3 L4 NC4

VDDE_1V8

VDDK_2V75

R638

TP4 (3rd pin from the end of the connector)


1 2 3 4 5

CN601 G1 G2 60 59 58 57 56

Main PCB (Bottom side)

TP3 (2nd pin from the end of the connector)

TP3

TP4

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 111 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.11.2 Bluetooth Clock path


1 start

1
1. Check BTCLK (Buffered MCLKSEC) TP1: 26MHz

TP1 NG TP2
2. Check MCLKSEC TP2: 26MHz

OK

Go to 4.11.3

OK

Replace U730

Sub PCB
TP2
U730 SN74LVC1G125DRLR 5 1 _OE VCC 2 A 4 3 GND Y R731 C730 0.1u C731 4.7u 100K

NG

TP1

VDD_BT

3. Check Mainboard Connector TP3: 26MHz


R730 BT_CLK 33

BT_CLKREQ_n MCLKSEC

OK NG Check RF3300 (U111)

Replace Sub PCB

2 TP3 (4th pin from the end of the connector)


24 25 26 27 28 29 30 G3 G4 37 36 35 34 33 32 31

TP3

FM_ANT MCLKSEC RTCCLK

Main PCB (Bottom side)

LGE Internal Use Only

- 112 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.11.3 Bluetooth RF path


TP1
FL730 5 DEA212450BT-7043C1 1 U_BP BP_DC 2 C732 100p BT_TXRX

TP1
4

BP1 BP2

VSS_BT_RF

6 3

TP2

G2 G1

TP2
ANT780 C700
DUMMY FEED

VDDK_2V75

R700

C701 100p

0 4.7nH R780 WIFI_TXRX BT_TXRX R701 ANT_SEL_N R781 0

FL700 XM0830SK-TL1301TMP 3 RFGND1 ANT 7 RFGND2 GND1 GND2 GND3 GND4 GND5 PGND 1 4 6 9 11 13

1p C702

DNI C704

8 PORT1 2 PORT2 12 10 VCTL VDD

C705 4p

C706 4p

WIFI_RF_G

WIFI_RF_G

C707 1u WIFI_RF_G VSS_BT_RF

WIFI_RF_G

start

Check Power level at BT IC Output (C732) with Spectrum Analyzer

No
TP1: Range 0 ~ 4dBm ?

Replace BT Chip (U731)

Yes

Check Power level at RF SW Output (C701) with Spectrum Analyzer

No
TP2: Range 0~4dBm ?

Replace RF Switch (FL700)

Yes

Replace ANT780

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 113 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.12 Wi-Fi Trouble


Wi-Fi module (M710) gets power from 2 LDOs (U710, U711) and clock from oscillator inside the module. RF path is shared with Bluetooth RF.

4.12.1 Wi-Fi Power path


VBAT

TP1 TP2

TP1
R717 0

POWER
RP101K332D 4 VDD 3 CE C722 1u U710 1 VOUT 2 GND C721 1u PGND 5

TP2
R716 VDD_WLAN_3V3 0

ACC_GP_WLAN_EN

TP3

TP3
RP101K182D 4 VDD 3 CE U711 1 VOUT 2 GND C723 1u VDD_WLAN_1V8

C724 1u

Sub PCB
start

1. Check VBAT TP1: VBAT

No Yes
2. Check 1.8V LDO TP2: 1.8V

Change Sub PCB

No Yes
3. Check 3.3V LDO TP3: 3.3V

Replace U710

No Yes Go Next Step

Replace U711

LGE Internal Use Only

- 114 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

PGND

4. TROUBLE SHOOTING

4.12.2 Wi-Fi RF path


TP1
C717 100p WIFI_TXRX
TP713

TP2

C725 DNI

WIFI_RF_G

1 2 3 4 5 6 7 8

GND1 ANT GND2 ANT_SEL_P SPI_SDO_S SCLK ESCN GND3

WIFI_RF_G

TP1

TP2
ANT780 C700
DUMMY FEED

VDDK_2V75

R700

C701 100p

0 4.7nH R780 WIFI_TXRX BT_TXRX R701 ANT_SEL_N R781 0

FL700 XM0830SK-TL1301TMP 3 RFGND1 ANT 7 RFGND2 GND1 GND2 GND3 GND4 GND5 PGND 1 4 6 9 11 13

1p C702

DNI C704

8 PORT1 2 PORT2 12 10 VCTL VDD

C705 4p

C706 4p

WIFI_RF_G

WIFI_RF_G

C707 1u WIFI_RF_G VSS_BT_RF

WIFI_RF_G

start

Check Power level at Wi-Fi module Output (C717) with Spectrum Analyzer

TP1: Range 13 ~ 17dBm at 802.11b?

No Replace Wi-Fi module (M710)

Yes

Check Power level at RF SW Output (C701) with Spectrum Analyzer

TP2: Range 13~17dBm at 802.11b ?

No Replace RF Switch (FL700)

Yes

Replace ANT780

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 115 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.13 GPS Trouble


GPS IC (U751; BCM4750) gets power from a single 1.8V LDO (U752). Clock comes from TCXO (X750) and RFIC. (RF3300) After checking them, GPS RF path should be examined.

4.13.1 GPS Power path


1 TP1 TP4 1 TP3 TP2
1. Check Voltage at GPS IC TP1: 1.8V, TP2: 1.8V

start

TP1
KT2520F16369ACW18T 6 VCC NC2 OUT 5 4 C750 2.2u C751 0.1u R757 0

Sub PCB
VGPS_1V8

Yes No
VDDE_1V8

Power OK Go to 4.13.2

TP2
R750 0

2. Check Voltage at LDO TP3: 1.8V, TP4: VBAT

Yes No
V8 F2 CNTIN E7 YNC_PPS B6 VDDIO1 G3 VDDIO2 G7 VDDIO3 A3 LPREGIN F5 RTCCLK A2 TCXO C752 1u C4 RFREGIN

Change Sub PCB

2
3. Check Mainboard Connector TP5: VBAT

C6

BMS0

VPD

D5

VBAT

TP4
RP101K182D 4 VDD 3 CE U752 1 VOUT 2 GND 1u R755 PGND

TP3
VGPS_1V8 0

Yese No Check AB3100 (U300)

Change U752

1u

C765

2
VBAT

C766

R644

100K

CN601 G1 G2 1 2 3 4 5 60 59 58 57 56

TP5 (2nd and 3rd pin from the end of the connector)

Main PCB (Bottom side)

TP5

LGE Internal Use Only

- 116 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.13.2 GPS Clock path

4.13.2 GPS Clock path


start

1 TP2 TP1 1 TP3


1. Check TCXO output TP1: 16.369MHz

No Yes

Replace X750

Sub PCB
X750 1 2 3 GND1 NC1 GND2 KT2520F16369ACW18T 6 VCC NC2 OUT 5 4 R757 0

2. Check Buffered MCLKSEC TP2: 26MHz

TP1
Yes

No

C750 2.2u

C751 0.1u

Go to 4.11.3
3. Check MCLKSEC TP3: 26MHz

VDDE_1V8

F5 CCLK A2 TCXO

F2 NTIN E7 _PPS

OK
VDDE_1V8

Replace U750

NG

GPS Clock Buffer


U750
NL17SZ126XV5T2G ACC_GP_GPS_PON MCLKSEC OE A VCC

R752 10

C753 0.1u

C754 2.2u

4. Check Mainboard Connector TP4: 26MHz

OK
R753 Y 33 100K R754 GPS_CNTIN

GND

NG Check RF3300 (U111)

Replace Sub PCB

TP3

TP2

2 TP4 (4th pin from the end of the connector)

TP4
24 25 26 27 28 29 30 G3 G4 37 36 35 34 33 32 31

FM_ANT MCLKSEC RTCCLK

Main PCB (Bottom side)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 117 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.13.3 GPS RF path


start

1 1
1. Check GPS Antenna pad contact

2 2. Change the LNA (U750)

2 3 3 3. Change GPS IC (U751)

Change the sub PCB

VGPS_1V8

VDDE_1V8

2.2nH L770

10 R770

R750 0

C771 0.1u

2.2u C770

3
D5 VPD F1 TESTMODE RFIN B1 E2 RFREGOUT D2 VDDRF E1 RFSREGOUT D1 VDDIFSYNTH F6

C752 1u

10nH L771

2
1 S_D L750 6.8nH 5 VDD 4 FIL_OUT 0.5p

ACC_GP_GPS_PON R772 0

1
2.2nH C755 CN750 1 CN751 1 C757 C758 100nH

C760 1u

_LPREGOUT

LGE Internal Use Only

C756

C759 1u

GPS LNA block

- 118 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

NA

U770 ALM-1612

L772 100nH

100p C772

2 RF_IN 3 GND

4. TROUBLE SHOOTING

4.14 RF Component

U109 FL106 FL105 U100 U102 FL100 FL102 U107 FL103 U111 FL104 X100

U101

Main Board : Top side

Reference FL100 FL102 FL103 FL104 FL105 FL106 SW100

Description WCDMA BC 1 Duplexer WCDMA BC 8 Duplexer GSM High Band Rx Filter GSM Low Band Rx Filter WCDMA BC 8 Tx Filter WCDMA BC 1 Tx Filter RF Mobile Switch

Reference X100 U100 U101 U102 U107 U109 U111

Description X-tal Power Detector GSM PAM with ASM WCDMA BC 1 PAM WCDMA BC 8 PAM DCDC Converter RF Transceiver

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 119 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15 Procedure to check


start

Oscilloscope setting

1. Check Power Source Block

2. Check VCXO Block

3. Check Ant. SW Module

Agilent 8960 : Test mode (WCDMA) Ch. 9750 (Uplink) Ch. 10700 (Downlink)

4. Check WCDMA Block

Agilent 8960 : Test mode (GSM) Ch. 190, P.L. 7 level setting Ch. 190, -60dBm setting

5. Check GSM Block

Redownload SW, Cal

LGE Internal Use Only

- 120 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.16 Checking Common Power Source Block

WCDMA DC/DC VBAT

Step 1 PAM VBAT Block

Step 2 GSM PAM Block Step 3 WCDMA PAM Block GSM PA VBAT

Main Board : Top side - Common Source Block

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 121 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.16.1 Step 1
TP1

TP5 TP3 TP4

TP2 Main Board (Top side) - Step 1 : VBAT Block Main Board (bottom side) - Power Source Block

VBAT_H R314 0 USB charging path

VBAT 2012 1/4W 1% CHS+ R316 Route as a differential pair 0.1 CHS-

C330 22p D302


C1 1 A2 2 A1_C2 3

C331 33u

Discharging

TP1 TP3 TP4


BDATA

KDS221E_RTK

C337 22p

R320 300K

TP2
Causion when PCB lLayout Direction of BAT and GND
CN300 D1 1 2 3 D2

LGE Internal Use Only

- 122 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Step 1 Check Point (TP1) in

3.7V OK?

No

Power Source Block Yes To Check Power source to Check if main power source input or not Proceed to the Step 2

Check Point (TP2) in Power Source Block To Check Power source


3.7V OK? Yes

No

Check the Power Supply

Check (TP1 & TP2) in Block to check inner line connection From TP4 to TP3

Short? Yes

No

Change Board

Soldering Check Component (CN300) In Power Source Block

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 123 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.16.2 Step 2
TP1

TP4 TP5 TP3

GSM PAM (Bottom) Figure 4-6. Step 2 : GSM PAM Block TP2 Main Board (bottom side) - Power Source Block

TP3

TP4
VBAT

TP5

C108 0.01u

PGND1 31 PGND2 32 PGND3 33 PGND4 34

30 29 28 27 26 25 24 23 22 21 12 11 2 GTX_850_900 GTX_1800_1900 ANTSW2 ANTSW1 R111 R112 0 0 C129 22p C130 22p

GND13 GND12 GND11 GND10 GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1

VBATT VAPC

C107 10u

C109 47p

5 4 C112 C113 C114 22p 33p 22p GRX_850 GRX_900 GRX_1800 GRX_1900 R108 DNI WRF_BAND_2 WRF_BAND_8_5 WRF_BAND_1

R105 R106 DNI

GTX_VAM

WCDMA3 20 WCDMA2 19 WCDMA1 18

U101

RX1 16 RX2 15 RX3 14 RX4 13 RSVD MODE _TXEN ANT 10


G2

SW100
KMS-518
G1 C A

LB_RF_IN 3 HB_RF_IN 1 BS2 6 BS1 7

9 8 C125 17 C126 DNI 22p

SW101 UFL-R-SMT10 L102 100p ANT C132 DNI G1 G2

SKY77521

ANTSW0 ANTSW3

R114 R115

0 0 C139 22p C140 22p

GSM PA WITH ASM

LGE Internal Use Only

- 124 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Step 2 Check VBATI (TP3,TP4,TP5) in GSM PAM Block to Check if main power source input or not

3.7V OK? Yes

No

Proceed to the Step 3

Check Point (TP1) in Power Source Block To Check Power source Check (TP1&TP3,TP4,TP5) in Block to check inner line connection From TP1 to TP3,TP4,TP5
Short? Yes 3.7V OK? Yes

No

Check the Power Supply

No

Change Board

Soldering Check Component (CN300) In Power Source Block

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 125 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.16.3 Step 3
TP1

TP3

TP4

TP5

TP2 Main Board (bottom side) Step 3 :WCDMA PAM Block - Power Source Block

Step 3 Check VBAT (TP3) in WCDMA PAM Block

3.7V OK? Yes

No

See the Next Page

Check Point (TP1) in Power Source Block To Check Power source


3.7V OK? Yes

No

Check the Power Supply

Check (TP1 & TP3) in Block , to check inner line connection From TP3 to TP1

No Short ? Yes

Change Board

Soldering Check Component (CN300) In Power Source Block

LGE Internal Use Only

- 126 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.16.4 Checking VCC

AB3100

TP2

TP1 Main Board (Bottom side) : Power for Radio ASIC

TP1
VDDA_2V8 VDDD_2V65 VDDE_1V8 VDIGRAD_1V8 VBAT VBAT R302 R303 R304 R305 0 VDDA_2V8 0 VDDD_2V65 0 VDDE_1V8 0 VDIGRAD_1V8 to RF3300 digital C302 2.2u C303 2.2u C304 2.2u VDDC_2V65 OA_OUT C12 EXT_LDO
L12 G14 K13

to RF3300 Power Detector to AB3100 CODECs/ADC/PLL to All I/O Supplies and Memory

AB3100
EXT_LDO

VDDH_2V75

VDDF_2V5

VDDG_2V85

VDDK_2V75

TP2

OD OUT

Check Point VRADA_2V8 (TP1) Check Point VDIGRAD_1V8 (TP2)

2.8V OK?

No Yes

Check the AB31000

1.8V OK?

No Yes Common Input Power is OK See The Next Part

Check the AB31000

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 127 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.17 Checking VCXO Block


The reference frequency (26MHz) from U111(Transceiver RF3300) is used WCDMA TX part and BB part, Bluetooth part. Therefore, 3 test points in the following figure should be checked.

U201 Digital Base Band

X100

DB3200

Crystal

RF3300
U111 Transceiver

Main board : bottom side

Main board : Top side

Notebook to send TP command Oscilloscope

Phone

Connection for Checking VCXO Block

LGE Internal Use Only

- 128 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Check 1. Crystal and RF3300 (Transceiver) part If you already check this crystal part, you can skip check 1

TP1

Test Point (Crystal Part)


RF_CTRL_STR_1 RF_CTRL_DATA RF_CTRL_CLK TESTOUT MCLKREQ MCLK R148 DNI 10 11 12 STR DATA CLK

R144

13 TESTOUT 14 CLKREQ 15 MCLK 17 XON 18 XOP


4

TN4-26562 26MHz
2 GND1 3 HOT2 HOT1 1 GND2

RF3300

R149

R150

X100

20 MCLKSEC 21 VCCD 23 WTXLP 24 WTXIN 25 WTXQP 26 WTXQN D9

TP1

DNI

Schematic (Crystal Part)

Figure 4-15. 26MHz at TP1

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

DNI

- 129 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Check 3. 26MHz at BB part

TP1

Test Point (Crystal Part) Figure 4-18. Test point (26MHz at BB part) Test Point (Crystal Part)
RF_CTRL_STR_1 RF_CTRL_DATA RF_CTRL_CLK TESTOUT MCLKREQ MCLK R148 DNI 10 11 12 STR DATA CLK

MCLK

RF3300
MCLK RTCCLK BT_CLKREQ_n MCLKREQ SYSCLK0 SYSCLK1 USB_XTAL1 ACC_IRQ_n APP_IRQ_n R200 3.3K

DB3200
E17 A15 B18 B17 A18 A17 A19 C19 C20 MCLK RTCCLKIN SYSCLKREQN MCLKREQ SYSCLK0 SYSCLK1 SYSCLK2 MSACCIRQN MSAPPIRQN

R144

13 TESTOUT 14 CLKREQ 15 MCLK 17 XON 18 XOP


4

TN4-26562 26MHz
2 GND1 3 HOT2 HOT1 1 GND2

R149

R150

X100

20 MCLKSEC 21 VCCD 23 WTXLP 24 WTXIN 25 WTXQP 26 WTXQN ND9

DNI

TP1

Figure 4-19. Schematic (26MHz at BB Part)

DNI

Figure 4-20. 26MHz at TP1

LGE Internal Use Only

- 130 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Check TP1 Refer to Figure 4-15 Yes

Checking No 1, 3 26MHz at VCXO

VCXO part has a problem. Changing XTAL or U111

VCXO part is O.K. Check next stage

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 131 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.18 Checking Front End Module Block

<Top>

Antenna Switch Module (+ GSM/EDGE PA)

TP1 TP2 TP3 TP4

Figure 4-21. Front End Module Block

TP4
GTX_850_900 GTX_1800_1900 ANTSW2 ANTSW1 R111 R112 0 0 C129 22p C130 22p LB_RF_IN 3 HB_RF_IN 1 BS2 6 BS1 7 MODE _TXEN ANT 9 8 17

SKY77521
TP3
0 0 C139 22p C140 22p

TP2 TP1

ANTSW0 ANTSW3

R114 R115

LGE Internal Use Only

- 132 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.19 Checking Front End Module Block input logic


4.19.1 Mode Logic by TP Command
WCDMA 2100 ANTSW3 WCDMA 900

ANTSW1

ANTSW0/2

GSM850/EGSM Tx ANTSW0/1

DCS/PCS Tx

ANTSW2

ANTSW3

GSM850 Rx ANTSW0

EGSM Rx

ANTSW2

ANTSW3

DCS Rx ANTSW0

PCS Rx

ANTSW2

ANTSW3

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 133 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Table 4-1. Front End module Logic

LGE Internal Use Only

- 134 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.19.2 Checking Switch Block power source


Before Checking this part, must check common power source (through AB3100) part

TP Command MODE=3 SWRX=190,3

No
Check Soldering It is necessary to check short condition. Using Tester. Check 3 capacitors ANTSW0(TP2),ANTSW1(TP3) ANTSW2(TP4)

Open?

Yes

Check soldering (C106)

High?
Check ANTSW0(TP2) To check Switch input power source

No

OK?

No

Resoldering

Yes

Yes

Check each mode By TP command

Change the Board

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 135 -

LGE Internal Use Only

4. TROUBLE SHOOTING

A. GSM850 Rx mode

GSM850 Rx MODE=3 SWRX=190,3 ANTSW0 High Low

ANTSW2

ANTSW3

Low

Figure 4-22-1. GSM850 Rx Mode

No
GSM850 Rx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (EGSM Rx Mode)

Change the Board

LGE Internal Use Only

- 136 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

B. EGSM Rx mode

EGSM Rx MODE=0 SWRX=49,3 ANTSW0 High ANTSW2

Low

ANTSW3

High

Figure 4-22-2. EGSM Rx Mode

No
EGSM Rx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (GSM850/EGSM Tx Mode)

Change the Board

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 137 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C. GSM850/EGSM Tx mode

GSM850/EGSM Tx MODE=3 SWTX=190,64,7

ANTSW0/1

Low

ANTSW2

Low

High ANTSW3

Figure 4-23.GSM850/EGSM Tx Mode

No
GSM850/EGSM Tx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (DCS Rx Mode)

ANTSW0/1:Low ANTSW2:Low ANTSW3:High WON : Low

No
Change the Board

Yes

Change U101

LGE Internal Use Only

- 138 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

D. DCS Rx mode DCS Rx MODE=2 SWRX=699,3

ANTSW0 High

ANTSW2

High

Low ANTSW3

Figure 4-24. DCS Rx Mode

No
DCS Rx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (DCS Tx Mode)

Change the Board

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 139 -

LGE Internal Use Only

4. TROUBLE SHOOTING

E. PCS Rx mode

PCS Rx MODE=1 SWRX=661,3

ANTSW0

High

High ANTSW2 High ANTSW3

Figure 4-25. PCS Rx Mode

No
PCS Rx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (PCS Tx Mode)

Change the Board

LGE Internal Use Only

- 140 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

F. DCS / PCS Tx mode

DCS / PCS Tx MODE=2 SWTX=1,699,0

ANTSW0/1

Low

ANTSW2

High

ANTSW3

High

Figure 4-26. DCS / PCS Tx Mode

No
DCS Tx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

WCDMA1900 Mode

Change the Board

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 141 -

LGE Internal Use Only

4. TROUBLE SHOOTING

G. WCDMA 2100 mode

WCDMA2100 Mode MODE=4 WTXC=10700,1,890,903,542,557

ANTSW3 Low ANTSW1

High

ANTSW0/2

Low

Figure 4-27-1. WCDMA2100 Mode

No WCDMA2100 Logic OK? Yes 4.17 part Check OK? Yes

No Try 4.17 part

WCDMA900 Mode

Change the Board

LGE Internal Use Only

- 142 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

H. WCDMA 900 mode

WCDMA900 Mode MODE=11 WTXC=3012,1,890,903,542,557

ANTSW3 High ANTSW1

Low

ANTSW0/2 Low

Figure 4-27-2. WCDMA900 Mode

No WCDMA900 Logic OK? Yes 4.17 part Check OK? Yes

No Try 4.17 part

Input Signal and Power to Front End Module block is OK. See the Next Page

Change the Board

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 143 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.20 Checking WCDMA Block


start

1. Check VCXO Block

2. Check Front End Module

3. Check Control Signal

4. Check RF TX Level

5. Check PAM Block

6. Check RF RX Level

Re-download SW, Cal

LGE Internal Use Only

- 144 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.20.1 Checking VCXO Block


Refer to 4.17

4.20.2 Checking Ant. SW module


Refer to 4.18

4.20.3 Checking Control Signal


First of all, control signal should be checked. (data, clk, strobe)

TP3 [RF_CTRL_CLK] TP2 [RF_CTRL_DATA] TP1 [RF_CTRL_STR1]

Bottom View

Figure 4-28-1. Test points (Control Signal)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 145 -

LGE Internal Use Only

4. TROUBLE SHOOTING

TP1 [RF_CTRL_STR1]
RF_CTRL_STR_1

6 EDATAC 7 EDATASTR 8 EDATAA 9 EDATAB 10 STR DATA CLK

DNI R141

RF3300

TP2 [RF_CTRL_DATA]
RF_CTRL_DATA

11 12

TP3 [RF_CTRL_CLK]
RF_CTRL_CLK

U1 RF3

Figure 4-28-2. Schematic (Control Signal)

Notebook to send TP command Oscilloscope

Phone

Figure 4-29. Connection for Checking Control Signal

LGE Internal Use Only

- 146 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

TP1 (RF_CTRL_STR1) TP2 (RF_CTRL_DATA) TP3 (RF_CTRL_CLK)

TP1 (RF_CTRL_STR1) TP2 (RF_CTRL_DATA) TP3 (RF_CTRL_CLK)

Figure 4-30. Control Signal


TP Command MODE=4 WTXC=9750, 1,754,643,418,568 SYCT=9750

Check TP1, TP2, TP3. Check shape and pk-pk level Refer to Figure 4-30

No

Similar ?

Download the SW If signal is not OK even after downloading, Change the U201

Yes

Control Signal is O.K. Check next stage

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 147 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.20.4 Checking RF TX Level

<Top side>
TP2 [WBAND 1 PAM Input] TP4 [RF3300 Output BAND 1]

TP1 [WBAND 8 PAM Input]

TP3 [RF3300 Output BAND 8]

<Bottom side>
TP7 Ant.

TP5 FEM Output

TP6 Ant. SW

Figure 4-31. Test point (RF TX Level)

LGE Internal Use Only

- 148 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

TP3 [RF3300 Output BAND 8]

TP1 [WBAND 8 PAM Input]

WTXLB

35 R151 0 C185 DNI


FL105 SAFEB897MAM0F00 1

G1 G2 G3

GND15 GND16

R158

34

DNI

PGND

57

FL106 SAFEB1G95KA0F00

R161 0 C187 DNI

3 1
G3 IN OUT G1 G2

R162

0 R164 DNI WTX_BAND_1_TO_PA

NCEIVER
R165 0 C191 DNI

FL107 SAFEA1G88KB7F00 3 1
G3 IN OUT G1 G2

R166

0 R168 DNI WTX_BAND_2_TO_PA

TP4 [RF3300 Output BAND 1] TP6 Ant. SW

TP2 [WBAND 1 PAM Input]

R108 RSVD MODE _TXEN ANT 10

DNI

SW100
KMS-518
G2 G1 C A

9 8 C125 17 C126 DNI 22p

R155 DNI

31 WTXHB3 33 WTXHB2 29 WTXHB1

IN

OUT

R152

0 WTX_BAND_8_5_TO_PA

SW101 UFL-R-SMT10 L102 100p ANT C132 DNI G1 G2

521

TP5 FEM Output

TP7 Ant.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 149 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Notebook to send TP command Spectrum Analyzer

Phone

Fig. 4-32 Connection for Checking RF TX Level

Fig. 4-33-1 Output Level at PAM Input ( TP1&TP2)

Fig. 4-33-2 Output Level at RF3300 Output ( TP3&TP4)

LGE Internal Use Only

- 150 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Fig. 4-33-3 Output Level at FEM Output (TP5)

Fig. 4-33-4 Output Level at RF test connector ( TP6)

Fig. 4-33-5 Output Level at TP7 .Ant

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 151 -

LGE Internal Use Only

4. TROUBLE SHOOTING

To verify that the phone fulfils requirements on maximum output power.

Set the FDD Test of the Agilent 8960 Set the Maximum Power

TP Command MODE=4 WTXC=9750, 1,754,643,418,568 SYCT=9750 TFTI=9750

Check output power at the TP6 with antenna Cable. Refer to Figure 4-33-4

TP6 About 22~23dBm?

Yes

TP7 About 19dBm? No The L102 will be broken. Change the L102

Yes

RF TX Level is OK Check next stage

No

Check the power at the TP7.Ant with probe. Refer to Figure 4-33-5

Check the power at the TP5 with probe. Refer to Figure 4-33-3

TP5 About 15dBm? No

Yes The SW100 has any problem. Change the SW100

Check the power at the TP1/TP2 with probe. Refer to Figure 4-33-1

TP1&TP2
About -6dBm? No The U111 will be not operated. Change the board

Yes The U102 has any problem. You have to check PAM block.

LGE Internal Use Only

- 152 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.20.5 Checking PAM Block


WPAM input (R162, R152)

DC/DC converter

WCDMA band1 PAM

Bias_CTRL (C115, C157)

VCC_PA (C103, C155) from DC/DC Duplexer Output (L601, C152)

WCDMA band8 PAM Figure 4-34. Test points of WCDMA TX PAM block

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 153 -

LGE Internal Use Only

4. TROUBLE SHOOTING

TP Command -mode =5 - WTXC=9750, 1,754,643,418,568

Check Duplex output (L601, C152) To Check PAM output

No 22dBm ? Level < -10dBm? Yes

No

Download the SW & Calibrate

Yes

WCDMA PAM is OK See the Next page

Check R162, R152 To Check PAM Input level

Level >2dBm No Yes

Check the WCDMA RF Tx Chip (RF3300)

Check C115, C157 To Check PAM control signal from AB3100 (Bias_CTRL) Check C103, C155 To Check PAM VCC BIAS from DC/DC converter (VCC_WPA)

1.1V at Po_max? Yes

No

Check the RF3300 to WCDMA PAM Signal line

3.4V ? No Yes

Change the DC/DC

Change The PAM

LGE Internal Use Only

- 154 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.20.6 Checking RX I,Q


To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q.

WRX_I_P (PIN 4) WRX_I_N (PIN 3) WRX_Q_P( PIN 2) WRX_Q_N( PIN 1)

Figure 4-35. RF3300, WCDMA Transceiver (Bottom)

About 2 MHz
Feed a CW signal at 2142MHz with a power level of 60dBm. Figure 4-36-1. RX I,Q signal (CW:2142MHz)

WRX_Q_P (PIN 2) WRX_Q_N (PIN 1) WRX_I_P (PIN 4) WRX_I_N (PIN 3)

Figure 4-36-2. RX I, Q signal

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 155 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Set the CW Mode of the Agillent 8960 Feed a CW signal at 1950MHz Set the RX Continuous mode

TP Command MODE=4 WRXC=9750

Check the pk-pk level at PIN 1, PIN 2, PIN 3, PIN 4 With Oscilloscope. Refer to Figure 4-36-1

No About 130mVp-p? Change RF3300 (U111)

Yes Check the Mean level at PIN 1, PIN 2, PIN 3, PIN 4 With Oscilloscope. Refer to Figure 4-36-1 No About 160mV? Change RF3300 (U111)

Yes Check the frequency at PIN 1, PIN 2, PIN 3, PIN 4 With Oscilloscope. Refer to Figure 4-36-2 No About 2MHz? Change RF3300 (U111)

Yes Verify whether the signal was similar as Figure 4-36-2 with Oscilloscope. No Similar? Change RF3300 (U111)

Yes

Check Next Stage

LGE Internal Use Only

- 156 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.21 Checking GSM Block


start

1. Check VRAD_2V8

2. Check VCXO Block

3. Check FEM Module

4. Check Control Signal

5. Check RF TX Path

6. Check RF RX Path

Figure 4-37-1. GSM Block (Bottom)

Re-download SW, Cal

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 157 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.21.1 Checking Regulator Circuit


Refer to 4.16 Checking Power Source block IF you already check this point while checking power source block (4.15), You can skip this test.

4.21.2 Checking VCXO Block


Refer to 4.17 Checking VCXO block IF you already check this point while checking VCXO block (4.17), You can skip this test.

4.21.3 Checking Front End Module


Refer to 4.19.2 Checking Ant. SW Module IF you already check this point while checking Ant. SW module (4.19.2), You can skip this test.

LGE Internal Use Only

- 158 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.21.4 Checking Control Signal


Test Program Script MODE=3 SWTX=190,7,1024,1

Figure 4-38. Test points of RF control signals RF_CTRL_CLK (PIN12) RF_CTRL_DATA( PIN11) RF_CTRL_STRB (PIN10)

RF3300 GSM PAM

STRB CLK DATA

Figure 4-39. GSM RF Control signal

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 159 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Check PIN10,PIN11,PIN12 of RF3300. Check if there is any Major difference. Refer to Figure 4-39 No No

Similar? Yes

Short? Yes Change the board

Re-download SW

Control signal is OK. See next page to check

LGE Internal Use Only

- 160 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

VBAT

WCDMA/GSM/GPRS/EDGE TRX
1930 1990 MHz
GSM/EDGE HB WRxIA

LNA
WRxIB

1805 1880 MHz

GSM/EDGE HB

LNA

0 90
WRxQA WRxQB

925 960 MHz

GSM/EDGE LB

LNA LNA LNA


EDataStr

869 894 MHz

GSM/EDGE LB

WCDMA HB

A
EDataA WCDMA HB

VAPC
EDataC WCDMA LB

LNA LNA

D A
EDataB

D
VCO VCO

ANT

A. GSM Tx path Level

ESD

PA 2.75 V VRAD

GSM850/ 900 Input

824 915 MHz

GSM/ EDGE LB

N.M

PA VBAT
PWM/PFM WDCDCREF

DCS/PCS Input

1710 1910 MHz

GSM/ EDGE HB

4.21.5 Checking RF Tx Path

+
LPF ChP PhD

XO

GSM/EDGE PA + Ant Sw.


DAC DAC VccWPA
Switch Control Logic En RFCtrl1

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
DAC
GSM/EDGE AM

1.8 V VIO

+
DAC RFCtrl1

UL: 1920 1980 MHz DL: 2110 2170 MHz


FB

VccWPA
RFCtrl1

CLK

RADCLK DATA STROBE RADDAT RADSTR

LPF
RFCtrl2

ChP

PhD

Serial Control

RFCtrl2

Power coupler
DET Bias En

VCO
WCDMA HB

- 161 N.M
VccWPA
WCDMA HB WCDMA HB

UL: 1749.9 1784.9 MHz DL: 1844.9 1879.9 MHz

WTxIA WTxIB

0 90
WTxQA WTxQB

Power coupler
DET Bias En

UL: 830 840 MHz DL: 875 885 MHz VccWPA


XOn

WCDMA LB

MCLK

MCLKSec

2.75 V VRAD
XOp
26MHz X-tal

XO

CLKREQ


DET Bias En

RF Pow det Det


En
WPOW_DET_EN

4. TROUBLE SHOOTING

LGE Internal Use Only

4. TROUBLE SHOOTING

(Top)

PIN 6,7,8,9

(Bottom)

Figure 4-41. Test Points of GSM850/EGSM/DCS/PCS Tx Path

LGE Internal Use Only

- 162 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

B. GSM Tx Output Level Check

Figure 4-42. GSM850/EGSM/DCS/PCS Tx Level at Test Program Script 1. GSM850 Tx MODE=3 SWTX=190,64,5,1024,1 2. EGSM Tx MODE=0 SWTX=49,5,1024,1 3. DCS Tx MODE=2 SWTX=699,0,1024,1 4. PCS Tx MODE=1 SWTX=661,0,1024,1

v Agilent 8960 Setting : GSM BCH+TCH Mode v Oscilloscope Setting Check GSM850/EGSM/DCS/PCS output power at . No Check if there is any Major difference. Similar? Refer to Figure 4-42. GSM850>32dBm Yes EGSM>32dBm DCS>29dBm PCS>29dBm GSM850/EGSM/DCS/PCS Tx path OK. See Chapter 4.8.6 to check Rx path

See Next page to check Tx path

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 163 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C. GSM RF Transceiver Check

`
DCS/PCS Tx (R129) Vapc (PIN 52)

GSM Tx (R134)

RF3300 (U111)

Figure 4-43. GSM850/EGSM/DCS/PCS Transceiver (RF3300)

Check GSM RF Transceiver Output power at .

GSM850/EGSM/DCS/PCS >5dBm Yes See Next page to check Tx path

No

Redownload SW

LGE Internal Use Only

- 164 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

D. GSM PAM Check

(Top)

Vapc (PIN 52) GSM850/EGSM/ DCS/PCS Tx (C125)

(Bottom)

GSM/EDGE PAM (+Ant. SW) U101

Figure 4-44-1. Test points of GSM850/EGSM/DCS/PCS Tx

Check Vapc level. Check if there is any Major difference. Refer to Figure 4-44-1

GSM850/EGSM>1.5 V? DCS/PCS>1.3 V? Yes GSM850/EGSM:32.0dBm DCS/PCS: 30.0dBm Yes GSM Tx path OK. See Next page to check

No

Redownload SW, Cal

Check GSM850/EGSM/DCS/PCS PAM output power at C111.

No

Changing GSM PAM (U100)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 165 -

LGE Internal Use Only

DCS/PCS : -51.7dBm

LGE Internal Use Only

VBAT


WCDMA/GSM/GPRS/EDGE TRX
WRxIA

1930 1990 MHz

GSM/EDGE HB

LNA
WRxIB

1805 1880 MHz

GSM/EDGE HB

LNA

0 90
WRxQA WRxQB

925 960 MHz

GSM/EDGE LB

LNA LNA LNA


EDataStr

4. TROUBLE SHOOTING

869 894 MHz

GSM/EDGE LB

A. GSM Rx path Level

WCDMA HB

A
EDataA WCDMA HB

VAPC
EDataC WCDMA LB

LNA LNA

D A
EDataB

D
VCO

4.21.6 Checking RF Rx Path

ANT

ESD

PA

GSM850/ 900 Input

824 915 MHz

GSM/ EDGE LB

VCO

N.M
2.75 V VRAD

PA

DCS/PCS Input

1710 1910 MHz

GSM/ EDGE HB

VBAT
PWM/PFM WDCDCREF

+
LPF ChP PhD

XO

GSM/EDGE PA + Ant Sw.


DAC DAC VccWPA
Switch Control Logic En RFCtrl1

DAC

GSM/EDGE AM

1.8 V VIO

+
RFCtrl1

DAC
CLK RADCLK DATA STROBE RADDAT RADSTR

UL: 1920 1980 MHz DL: 2110 2170 MHz


FB

VccWPA
RFCtrl1

Figure 4-45. GSM/DCS/PCS Rx Path Level


LPF ChP PhD

- 166
RFCtrl2

Serial Control

RFCtrl2

Power coupler
DET Bias En

VCO
WCDMA HB

UL: 1749.9 1784.9 MHz DL: 1844.9 1879.9 MHz

N.M
WTxIA WTxIB


VccWPA
WCDMA HB WCDMA HB

0 90
WTxQA WTxQB

Power coupler
DET Bias En

UL: 830 840 MHz DL: 875 885 MHz VccWPA


XOn

WCDMA LB

MCLK

MCLKSec

2.75 V VRAD
XOp
26MHz X-tal DET Bias En

XO
CLKREQ

RF Pow det Det


En
WPOW_DET_EN

DCS : -50dBm

PCS : -50dBM

EGSM : -50dBm

GSM850 : -50dBm

GSM850/EGSM : 51.5dBm

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

(Top)
GSM Transceiver RF3300 U111

(Bottom)

GSM8 EGSM DCS PCS 50 Rx Rx Rx Rx

GSM/EDGE PAM U101

Figure 4-46. Test Points of GSM/DCS/PCS Rx

Test Program Script 1. GSM850/EGSM Rx SWRX=3,190,5,1024,1 (GSM850) SWRX=0,65,5,1024,1 (EGSM) 2. DCS/PCS Rx SWRX=2,700,0,1024,1 SWRX=1,700,0,1024,1

(DCS) (PCS)

v Agilent 8960 Setting CW Mode GSM850 : -50dBm@Ch190(881.6MHz) EGSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz) v Oscilloscope Setting

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 167 -

LGE Internal Use Only

4. TROUBLE SHOOTING

B. GSM RF Level Check

(Top)
GSM Transceiver RF3300 U111

(Bottom)

GSM8 EGSM DCS PCS 50 Rx Rx Rx Rx

GSM/EDGE PAM U101

Figure 4-47. GSM850/EGSM/DCS/PCS Rx path

v Agilent 8960 Setting CW Mode GSM850 : -50dBm@Ch190(881.6MHz) EGSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz)

Check GSM850/EGSM/DCS/PCS Rx signal level at .

GSM850/EGSM:-51.5dBm DCS/PCS:-51.7dBm Yes GSM Rx path OK.

No

Change Ant. SW module (U101)

LGE Internal Use Only

- 168 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. Download

5. Download
The downloading purpose is described below: 1) To make a phone operate at the first manufacturing A phone = Hardware + Software A phone cannot operate with hardware alone. The hardware with the suitable software can operate properly. 2) To upgrade the software of the phone The software of the phone may be changed to enhance the performance of the phone. The older version software of the phone can be replaced to the newer version.

5.1 Requirements
5.1.1 Download Items
Items needed to download SW images with LGEDP. A. Micro-USB Cable B. Target( GT500 / GT505 Phone ) C. PC and LGEDP Software D. SW Images

A
5.1.2 System Requirement
The table below shows the requirements for setting up. You should check the requirements below first to set up your PC.

USB Driver cannot support Windows 98, Windows Me, and Windows XP Service Pack 1. Although it can do, it cannot be guaranteed. So, highly recommend OS upgrade.

5.1.3 Required Tool


LGEDP : Download tool for GT500 / GT505 software

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 169 -

LGE Internal Use Only

5. Download

5.2 GT500 / GT505 Download


Install LGEDP USB Driver in the following order. 1) Go to the directory = ../LGEDP_U330_SVC_EURO_YYYYMMDD/wrapper_USBDriver 2) Click installme.bat

5.2.1. USB Driver Install


* Please make sure that install this usb driver for download not for a pc sync driver. There are two different type of usb driver. One for downloading , the other for PC sync. If you use LGEDP Tool firstly, Error will happen because of USB Driver uninstalled. If you see Found New Hardware when phone is connect after complete install, and then follow as indicated blew. when connect the phone, must be check that phone should be turn off and battery should be full-gauge (At lease three(75%) more). The installation procedure of LGEDP USB Driver is described below:

1) Push the Next Button in Found New Hardware Wizard

LGE Internal Use Only

- 170 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. Download

2) Select Search for the best driver in these locations in Found New Hardware Wizard 3) Select Include this location in the search in Found New Hardware Wizard 4) Push the Browse Button , and then select USB driver Information file This File is provided with LGEDP.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 171 -

LGE Internal Use Only

5. Download

5) Select Mobile Equipment USB Flash in Found New Hardware Wizard

You must be select this..!

6) Continue Anyway

LGE Internal Use Only

- 172 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. Download

7) Please wait while the wizard installs the software.. 8) Push the Finish Button in Found New Hardware Wizard

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 173 -

LGE Internal Use Only

5. Download

5.2.2 Download Menu Selection.


Download Menu Selection in the following order: 1) Click Configuration download in Menu bar.

6
LGE Internal Use Only

- 174 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. Download

5.2.3 LGEDP Configuration & SW & GDFS Image Selection.


The installation procedure of Download Configuration is described below: 1) You must select Window Size 1 ~ 4. ( Defualt is 4 ) 2) You must select Chipset U330 for GT500 / GT505. 3) You can select SW image to download by clicking Add button. Select next two image files orderly. Order is important. Main image : cxc000000_APPLICATION_PHONE_SB_IAR-ARM-NAND.ssw, FileSystem image : CXC_FS_CABS_LP_NAND.ssw LGPXO image : CXC_LGPXO_SYS_CABS_LP_NAND.ssw 4) You can select GDFS map to download by clicking Add button. Select next two GDFS files. Acc GDFS : GT500 / GT505_Update_GDFS_Acc_XXXXXXXX.gdf, App GDFS : GT500 / GT505_Update_GDFS_App_XXXXXXXX.gdf. 5) After choose all image to download, click OK button.

1)

3)

4)

5)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 175 -

LGE Internal Use Only

5. Download

5.2.4 Starting Download


Follow the procedure described below to start download. You should follow the instruction below and be sure to follow in right order. 1) 2) 3) 4) 5) 6) 7) If you have not detached Battery from the phone yet, detach Battery from the phone. Connect your phone with Micro-USB cable. Insert the Battery into phone. In case of GT500/GT505, press Side-Up-Key. Keep pressing until step 6. Press Power-Key. And then Downloading will be started. Release both Side-Up-Key and Power-Key after start downloading in GT500 If Downloading has not started yet, Repeat procedure 1) ~ 6).

< Before phone is turned on >

LGE Internal Use Only

- 176 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. Download

5. 2.5 Download is on going

< After phone is turned on >

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 177 -

LGE Internal Use Only

6. Block Diagram

6. Block Diagram

Figure 6-1 GT500 Block Diagram

LGE Internal Use Only

- 178 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

VDDA_2V8 VBAT

VRAD_2V8

VBAT

R100

R101

DNI

C103 0.1uF

C104 22p

C105 22p

U100 1 R103 2 R104 3 75 VDD RF_IN

LMV221 OUT REF DAP EN 6 5 4

R102 C108 0.01u 1K C106 33nF PGND1 31 PGND2 32 PGND3 33 PGND4 34 C107 10u C109 47p WPOW_DET

C100 10u

C101 0.1u

C102 1000p U102 SKY77182 9 PGND 8 GND2 GND1 RFOUT VCC 7 6 5

120

GND

WTX_BAND_1_EN BIAS_CTRL WTX_BAND_1_TO_PA C115 1000p C116 1000p

1 2 3 4

VENB VCTRL RFIN VBIAS

C110 0.1u L100 18p C117 NA C118 NA

C111 22p

WPOW_DET_EN 30 29 28 27 26 25 24 23 22 21 12 11 2 WRF_BAND_1 C124 GTX_850_900 GTX_1800_1900 ANTSW2 ANTSW1 R111 R112 0 0 C129 22p C130 22p GND13 GND12 GND11 GND10 GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1

VBATT 5 VAPC 4 WCDMA3 20 WCDMA2 19 WCDMA1 18 C112 C113 C114 22p 33p 22p GRX_850 GRX_900 GRX_1800 GRX_1900 R108 RSVD MODE _TXEN ANT 10
G2

R105 WRF_BAND_2 WRF_BAND_8_5 WRF_BAND_1 R106 DNI

GTX_VAM

VBAT

L601 2.2nH

U103 LDC151G8620Q-359 1 4 OUT TER 2 IN COU 3

7 GND4 8 GND5 9 GND6 C119 100p 3 1 FL100 C123 TX RX

5 GND3 4 GND2 2 GND1

U101

RX1 16 RX2 15 RX3 14 RX4 13 DNI

R107

10

VCC_WPA C120 0.1uF C121 22p C122 22p

SW100
KMS-518
G1 C A

B
SW101 UFL-R-SMT10 L102 100p ANT G1 G2

R109

U105
1 2 VEN_BAND_2 IN_BAND_2 GND1 VCC1 VCONT IN_BAND_5

SKY77175
PGND GND4 OUT_BAND_2 GND3 VC2 VBIAS OUT_BAND_5 15 L101 14 C127 DNI C128 1.5p 1.8nH 13 12 11 10 C137 1000p 9 8 C136 22p U104 LDC151G8620Q-359 1 4 OUT TER

DNI

ANT

SAYFP1G95AA0B00 3.6nH

LB_RF_IN 3 HB_RF_IN 1 BS2 6 BS1 7

9 8 C125 17 C126 DNI 22p

56

WTX_BAND_2_EN WTX_BAND_2_TO_PA BIAS_CTRL WTX_BAND_8_5_TO_PA C133 C134 WTX_BAND_8_5_EN DNI 100p R116 R118 DNI

3 4 5 6

R113

DNI

WRX_BAND_1

SKY77521

GND4 GND5 GND6 C135 100p TX R117 56 DNI RX FL101 C138

GND3 GND2 GND1 C636 3.3nH ANTSW0 ANTSW3 WRF_BAND_2 C143 0.5p

R114 R115

0 0 C139 22p C140 22p

C141 1000p

7 C142 22p

IN

COU

VEN_BAND_5

GND2

ANT ACMD-7407

C132 DNI

R120

24

DNI

VBAT U107 1 C148 10u C149 0.1u C150 1000p 2 3 4 C157 1000p C158 1000p VBIAS RF_IN VCONT VEN SKY77181 8 VCC RF_OUT 7 C146

WRX_BAND_2 GND4 GND5 GND6 C145 100p TX R121 56 R652 DNI RX FL102 C153 1000p C154 0.1u C155 10u C156 DNI L103 8.2nH C151 LT56B ANT 6.8nH C152 0 WRF_BAND_8_5 GND3 GND2 GND1

GSM PA WITH ASM

C144

U106 LDC15874M19Q-360 1 4 OUT TER C147 22p 2 IN COU 3

100p

6 GND2 5 GND1 9 PGND

GT500 GND contact for ANT


WRX_BAND_8_5 CN198 1 1 2 3 4 5 6 7 8 9

BIAS_CTRL

SC1 10 11 12 13 14 15 16 17 18

WCDMA PA Block
VRAD_2V8 VDDA_2V8

CN199 1

R123 R126 R127 DNI R124 390 C160 FB100 0

560 1800 C161 DNI C159 3.9p 4.3nH R125 GRX_1900

U108
C162 4 C163 TX_ADC_STRB 1 2 3 _OE VCC A GND Y 5 VRAD_2V8

FL103
L104 3.3nH GND6 10 GND4 8 GND2 7 6 C164 15p 9 OUT_1842_5 IN_1842_5 1 L107 NA C168 10u U109 C171 0 C172 3.3p R133 GRX_900 DCDC_REF GND5 5 GND3 3 GND1 2 IN_942_5 IN_881_5 4 0 9 C177 3.3p OUT_881_5 1 L112 NA L113 10nH C178 33p L114 NA R140 GRX_850 L109 NA R135 WDCDC_EN 220 C176 22p 0.01u C2 C1 VCON EN B1 A1 VDD PVIN LM3208TL A2 SW FB C3 C173 4.7u C174 1000p C175 22p L108 3.3uH VCC_WPA OUT_1960 GND5 5 GND3 3 GND1 2 IN_1960 4 3.9nH L105 NA

0.01u

22p

SN74LVC1G125DRLR E
TX_ADC_STRB_2V8

33p

closed to RF3300

R128 GRX_1800

VBAT

0.01u

22p

WRX_Q_N WRX_Q_P WRX_I_N WRX_I_P

C166

C167

VDDA_2V8

R129 270

27 270

R130 C169

0 C170

C165 DNI

SAWEN1G84BC0F25
L106 2.2nH

GTX_1800_1900

AMP_FREQ_LSB DATA_STR 55 53 49 47 45 43 41 39

R131

R132

2.7p

DNI

FL104
GND6 10 GND4 8 GND2 7 6 OUT_942_5

R138 DNI

R139 DNI

3 WRXIN 4 WRXIP 6 EDATAC 7 EDATASTR 8 EDATAA 9 EDATAB 10 11 12 STR DATA CLK

F
DNI R141

56 ETXHB 54 ETXLB EAMMOD 52

R136

R137

51 VCCA2 27 VCCA1

270

270

QDATA_AMP_MSB IDATA_FREQ_MSB

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8

R134

27

GTX_850_900 L110 8.2nH L111 NA

B3 SGND A3 PGND

1 WRXQN 2 WRXQP

SAWEN881MBA0F25 Placement Notice:PGND must be isolated from Common GND on L1, L2 and L3

GTX_VAM

50 ERXHB2 48 ERXHB1 46 ERXLB2 44 ERXLB1 42 WRXHB2 38 WRXHB1 WRXLB 40 39nH L116 DNI R145 WDCDC_EN C180 DNI 560 R143

RF_CTRL_STR_1 RF_CTRL_DATA RF_CTRL_CLK TESTOUT MCLKREQ MCLK R148 DNI

DC-DC CONVERTER
R142 18p WRX_BAND_1 C179 10nH R146 4.7K PGND 5 VRAD_2V8 GND 2 VOUT 1 U110 C183 2.2u R147 0 ADOUT VBAT

U111 RF3300

R144

13 TESTOUT 14 CLKREQ 15 MCLK 17 XON 18 XOP


4

TX_ADC_STRB_2V8

L115 5.6nH

TN4-26562 26MHz
2 GND1 3 HOT2 HOT1 1 GND2

37 RFCTRL1 36 RFCTRL2 35

C181 100p

PT100

R149

R150

X100

DNI

23 WTXLP 24 WTXIN 25 WTXQP 26 WTXQN

R155 DNI

C185 DNI

31 WTXHB3 33 WTXHB2 29 WTXHB1 PGND 57

R151

FL105 SAFEB897MAM0F00

WRX_BAND_2 DNI WTX_BAND_8_5_TO_PA R153 R152 0 L117 2.2nH

4.7K

20 MCLKSEC 21 VCCD

RTEMP C182 1u

WTXLB

CE 3 VDD 4

RP101K282D

IN

OUT

DNI

DNI

G1 G2 G3

R156

GND9 GND10 GND11 GND12 GND13 GND14 GND15 GND16

TEMP SENSOR
L118
FL106 SAFEB1G95KA0F00

VDDA_2V8 0 R160

R158

5 16 19 22 28 30 32 34

MCLKSEC

R157

10nH WRX_BAND_8_5 EXT_LDO

R159 DNI

R161 0 C187 DNI

3 1
G3 IN OUT G1 G2

DNI R162 0 R164 DNI WTX_BAND_1_TO_PA L119 1.8p NA L120

EXTERNAL LDO
H

VDIGRAD_1V8 C188 DNI C189 DNI

RF TRANCEIVER
0 C191 DNI WTX_I_P WTX_I_N WTX_Q_P WTX_Q_N R165

FL107 SAFEA1G88KB7F00 3 1
G3 IN OUT G1 G2

R166

0 R168 DNI WTX_BAND_2_TO_PA

10

11

12

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 179 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

4
WTX_BAND_1_EN WTX_BAND_2_EN WTX_BAND_8_5_EN QDATA_AMP_MSB IDATA_FREQ_MSB AMP_FREQ_LSB TX_ADC_STRB DATA_STR

10

11

12

RF_CTRL_DATA RF_CTRL_CLK RF_CTRL_STR_1

WPOW_DET_EN WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P WPOW_DET

WTX_I_N WTX_I_P WTX_Q_N WTX_Q_P

KEYOUT0 KEYOUT1 KEYOUT2

ANTSW0 ANTSW1 ANTSW2 ANTSW3

Service mode for WEB D/L Added in the REV.D

DNU1 DNU2 DNU3 DNU4 DNU5 DNU6 DNU7 DNU8 DNU9 DNU10 DNU11 NC1 NC2 NC3 NC4 NC5

VDDE_1V8 SD_DATA(0) SD_DATA(1) SD_DATA(2) SD_DATA(3) SD_DATA(4) SD_DATA(5) SD_DATA(6) SD_DATA(7) SD_DATA(8) SD_DATA(9) SD_DATA(10) SD_DATA(11) SD_DATA(12) SD_DATA(13) SD_DATA(14) SD_DATA(15) B3 C4 C3 D4 D3 E4 E3 F4 J4 K3 K4 L3 L4 M3 M4 N3 R299 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15

A2 A9 A10 B1 B10 N1 N10 P1 P2 P9 P10 B2 B7 B9 F3 J3

KEYIN2 KEYIN3

KEYIN0

SD_ADDR(1:13)

MCP 2G NAND 1G SDRAM


A

SD_DATA(0:15)

DNI R298 U202 KEY_LED5 PWRRST_n R297 R296 DNI DNI


1 IN1 2 IN2 GND 3 OUT 4 VCC 5

RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_E

RF_CTRL_DATA RF_CTRL_CLK RF_CTRL_STRB1 RF_CTRL_STRB2

RF_DATA_A RF_DATA_B RF_DATA_C TX_ADC_STRB RF_DATA_STRB

NC7SZ08P5X MCLK RTCCLK BT_CLKREQ_n MCLKREQ SYSCLK0 SYSCLK1 USB_XTAL1 ACC_IRQ_n APP_IRQ_n R200 3.3K E17 A15 B18 B17 A18 A17 A19 C19 C20

B
0 R295

KEY_LED6 D201 RB521CS-30 C203 1000p KEYIN2 D200 RB521CS-30 RESOUT0_n RESOUT1_n RESOUT2_n
TP209

B10 PWRRSTN J14 RESOUT0N B19 RESOUT1N E18 RESOUT2N D17 ACCSLEEP D18 APPSLEEP C21 DCON C18 SERVICEN E2 PCMCLK E3 PCMSYN D2 PCMULD D3 PCMDLD G22 F22 G20 F21 G21 E21 G19 E22 I2S0CLK I2S0WS I2S0ULD I2S0DLD I2S1CLK I2S1WS I2S1ULD I2S1DLD

ACCSLEEP APPSLEEP DCON

SD_BA0 SD_BA1 SD_DATA(0) SD_DATA(1) SD_DATA(2) SD_DATA(3) SD_DATA(4) SD_DATA(5) SD_DATA(6) SD_DATA(7) SD_DATA(8) SD_DATA(9) SD_DATA(10) SD_DATA(11) SD_DATA(12) SD_DATA(13) SD_DATA(14) SD_DATA(15) SD_CS_n SD_CLK SD_CKE SD_CAS_n SD_RAS_n SD_WE_n SD_DQML_n SD_DQMU_n

U200 KA100J00BA-AJYY

VDDQ1 VDDQ2 VDDQ3

D2 F2 K2

R620

Q200 VPPFLASH
B IN

C OUT

KRC402E

PCM_CLK PCM_SYNC PCM_ULD PCM_DLD DB_I2S0_CLK DB_I2S0_WS DB_I2S0_ULD DB_I2S0_DLD DB_I2S1_CLK DB_I2S1_WS DB_I2S1_ULD DB_I2S1_DLD

GND

R203

2.2K

VDDE_1V8

EMIF1_D0 EMIF1_D1 EMIF1_D2 EMIF1_D3 EMIF1_D4 EMIF1_D5 EMIF1_D6 EMIF1_D7 EMIF1_D8 EMIF1_D9 EMIF1_D10 EMIF1_D11 EMIF1_D12 EMIF1_D13 EMIF1_D14 EMIF1_D15 EMIF1_SDCSN EMIF1_SDCLK EMIF1_SDCKEN EMIF1_SDCASN EMIF1_SDRASN EMIF1_WEN EMIF1_BE0N EMIF1_BE1N

VDDE_1V8

R202

10K

H4 J4 L4 K4 M3 M4 P4 P3 R4 N8 P8 R8 T4 U5 U4 U3 Y2 W3 V4 Y3 V2 W2 W1 V3 AC12 AA11 AB13 AC14 AB14 AB15 AA15 AB16 AC16 AC17 AB17 AB18 AC18 AA18 AB19 AC19 AA19 AB20 AA20 AB21 Y21 AA21 AB22 AA22 Y22 V21 Y13 Y14 T11 AA12 AA13 AA14 Y15 AA16 AA17 Y16 W17 W18 Y17 Y20 Y18 Y19 Y10 AB8 AA7 AA9 AC8 AB9 AC10 AB10 Y11 AA10 T10 Y12 AC9 AC11 AB12 AB11

VSS1 VSS2 VSS3 VSS4 VSSQ1 VSSQ2 VSSQ3

C2 F9 G2 N4 E2 J2 L2

C204 0.1u

C205 0.1u

C206 1u

VDDE_1V8

NF_IO(0) NF_IO(1) NF_IO(2) NF_IO(3) NF_IO(4) NF_IO(5) NF_IO(6) NF_IO(7)

J5 L5 J6 L6 J7 L7 J8 L8

IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7

VCC1 VCC2 VCCQ

B6 N7 N6 C207 0.1u C208 0.1u C209 0.1u

MCLK RTCCLKIN SYSCLKREQN MCLKREQ SYSCLK0 SYSCLK1 SYSCLK2 MSACCIRQN MSAPPIRQN

EMIF1_A1 EMIF1_A2 EMIF1_A3 EMIF1_A4 EMIF1_A5 EMIF1_A6 EMIF1_A7 EMIF1_A8 EMIF1_A9 EMIF1_A10 EMIF1_A11 EMIF1_A12 EMIF1_A13 EMIF1_SDBS0_A14 EMIF1_SDBS1_A15

L1 L2 M2 M1 N1 N2 P1 P2 R3 R2 T2 T3 U2 U1 V1

SD_ADDR(1) SD_ADDR(2) SD_ADDR(3) SD_ADDR(4) SD_ADDR(5) SD_ADDR(6) SD_ADDR(7) SD_ADDR(8) SD_ADDR(9) SD_ADDR(10) SD_ADDR(11) SD_ADDR(12) SD_ADDR(13)

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12

C7 C8 C9 B8 M9 L9 K9 J9 H7 H8 D9 H9 G7

SD_ADDR(1) SD_ADDR(2) SD_ADDR(3) SD_ADDR(4) SD_ADDR(5) SD_ADDR(6) SD_ADDR(7) SD_ADDR(8) SD_ADDR(9) SD_ADDR(10) SD_ADDR(11) SD_ADDR(12) SD_ADDR(13)

DNI

C17 C16 D16 C14

H11 H13 H14 H15

B15 B16 C15 D15 A16

B14 D14 B13 C13

C22 D22 D21 F20 E20 F19 KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5

D9 C9 C8 D8 B6

DAC_I_NEG DAC_I_POS DAC_Q_NEG DAC_Q_POS

ADC_I_NEG ADC_I_POS ADC_Q_NEG ADC_Q_POS TX_POW

ANT_SW0 ANT_SW1 ANT_SW2 ANT_SW3

KEYOUT0 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4

J13 J10 K9 L9 J11

E7 D7 E6 D6

SD_CS_n SD_CS2_n SD_CLK SD_CKE SD_WE_n SD_BA0 SD_BA1 SD_RAS_n SD_CAS_n SD_DQML_n SD_DQMU_n

E9 E8 H4 G8 F8 D7 D8 E7 F7 G3 H3

_CS1 _CS2 CLK CKE1 _WED BA0 BA1 _RAS _CAS LDQM UDQM

VDD1 VDD2 VDD3 VDD4

B4 G9 H2 M2

VDDE_1V8

B
C200 0.1u C201 0.1u C202 0.1u

SDAT SCLK SRST_n USB_DATA(0) USB_DATA(1) USB_DATA(2) ACC_USB_HS_STP ACC_USB_HS_DIR ACC_UART0_RX ACC_UART0_TX ACC_USB_HS_IN_CLK ACC_USB_HS_NXT ACC_USB_HS_DATA(4) ACC_USB_HS_DATA(5) ACC_USB_HS_DATA(6) ACC_USB_HS_DATA(7) ACC_UART3_RX ACC_UART3_TX ACC_UART3_CTS ACC_UART3_RTS

B2 SDAT C2 SCLK C4 SRSTN J2 USB_SE0_VM K2 USB_DAT_VP L3 USB_OE J3 K3 L8 G1 K8 F1 J8 G3 H3 G2 H9 E1 H10 D1 F3 D4 C3 G5 E4 G4 C1 F4 F2 H2 V5 AB3 AA4 Y4 P9 AC4 T9 AA5 R10 Y5 H20 G23 H21 H22 J22 J21 H23 K21 L16 J23 P15 P16 B22 R14 N16 R21 R16 U22 T13 T14 T15 T23 P21 R23 P20 ACC_GPIO_0 ACC_GPIO_1 ACC_GPIO_2 ACC_GPIO_3 ACC_GPIO_4 ACC_GPIO_5 ACC_GPIO_6 ACC_GPIO_7 ACC_GPIO_8 ACC_GPIO_9 ACC_GPIO_10 ACC_GPIO_11 ACC_GPIO_12 ACC_GPIO_13 ACC_GPIO_14 ACC_GPIO_15 ACC_GPIO_16_USBPRB ACC_GPIO_17 ACC_GPIO_18 ACC_GPIO_19 ACC_GPIO_20 ACC_GPIO_21 ACC_GPIO_22 ACC_GPIO_23 ACC_GPIO_24 ACC_GPIO_25 ACC_GPIO_26 ACC_GPIO_27 ACC_GPIO_28 ACC_GPIO_29 ACC_GPIO_30 ACC_GPIO_31 ACC_GPIO_32 ACC_GPIO_33_A27 APP_GPIO_0 APP_GPIO_1 APP_GPIO_2 APP_GPIO_3 APP_GPIO_4 APP_GPIO_5 APP_GPIO_6 APP_GPIO_7 APP_GPIO_8 APP_GPIO_9 APP_GPIO_10 APP_GPIO_11 APP_GPIO_12 APP_GPIO_13 APP_GPIO_14 APP_GPIO_16 APP_GPIO_17 APP_GPIO_18 APP_GPIO_19 APP_GPIO_20 APP_GPIO_21 APP_GPIO_22 APP_GPIO_23 APP_GPIO_24 APP_GPIO_25 B20 I2CSCL D19 I2CSDA B21 I2CSCL2 D20 I2CSDA2

DNI

R658

DNI

U201-1 DB3200_A

100K

ACC_GP_USB_CS ACC_GPS_START ACC_USB_HS_DATA(3) ACC_SPI_WLAN_CSn ACC_SPI_MISO ACC_SPI_MOSI ACC_SPI_CLK ACC_GP_GPS_PON ACC_GP_SPI_BT_CSn ACC_GP_SPI_BT_IRQ ACC_GP_SPI_WLAN_IRQn ACC_GP_GPS_RESETn ACC_GP_WLAN_RESETn ACC_GP_WLAN_EN ACC_GP_WLAN_PWR_DOWNn

EMU_MODE_0

NF_IO(0:7) NF_IO(0) NF_IO(1) NF_IO(2) NF_IO(3) NF_IO(4) NF_IO(5) NF_IO(6) NF_IO(7)

CI_PCLK CI_VSYNC CI_HSYNC CI_RES_N CI_D0 CI_D1 CI_D2_CLK0_M CI_D3_CLK0_P CI_D4_DAT0_M CI_D5_DAT0_P CI_D6_CLK1_M CI_D7_CLK1_P CI_D8_DAT1_M CI_D9_DAT1_P

MCCLK MCCMD MCDAT0 MCDAT1 MCDAT2 MCDAT3 MCCMDDIR MCDATADIR

PDI_RES_N PDI_C0 PDI_C1 PDI_C2 PDI_C3 PDI_C4 PDI_C5 PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7

APP_GP_VGA_SDN APP_GP_TOUCH_SCL APP_GP_TOUCH_SDA APP_GP_TOUCH_LDO_EN APP_GP_ISP_LDO_EN APP_GP_LCD_ID APP_GP_LCD_ALDO_EN APP_GP_MOTORLDO_EN APP_MMC_FB_CLK APP_GP_LCD_IF1 APP_GP_USW_SCL APP_GP_USW_SDA APP_GP_MMC_DETn APP_GP_CAM_LDO_EN APP_GP_TOUCH_PENIRQn APP_GP_USW_INT APP_GP_3AXIS_INT APP_GP_3AXIS_SCL APP_GP_FM_GPIO2 APP_GP_3AXIS_SDA APP_GP_LCD_DLDO_EN APP_GP_BL_EN

TDI TMS TRST_N TCK EMU_MODE_0 EMU_MODE_1 TDO RTCK

ETM_TCLK ETM_TSYNC ETM_TPKT0 ETM_PSTAT0 ETM_PSTAT1 ETM_PSTAT2 ETM_TPKT1 ETM_TPKT2 ETM_TPKT3 ETM_TPKT4 ETM_TPKT5 ETM_TPKT6 ETM_TPKT7

VCORE

N3 EFUSE_HV4 N4 VDDA_AF

AC22 DU1 AC23 DU2 B1 DU3

AB4 W4 AB2 AA2 AC1 AB1 AA3 AA1

AB5 Y6 Y9 AB6 Y7 AA6 Y8 AB7 AA8 AC7 W6 AC6 W7

C210

APP_UART_RX APP_UART_TX

EMIF2_D00 EMIF2_D01 EMIF2_D02 EMIF2_D03 EMIF2_D04 EMIF2_D05 EMIF2_D06 EMIF2_D07 EMIF2_D08 EMIF2_D09 EMIF2_D10 EMIF2_D11 EMIF2_D12 EMIF2_D13 EMIF2_D14 EMIF2_D15 EMIF2_NFIF_READY EMIF2_WAITN EMIF2_CS0N EMIF2_CS1N EMIF2_CS2N EMIF2_CS3N EMIF2_SDCAS_RE_OEN EMIF2_WEN EMIF2_SDCLK EMIF2_CLK EMIF2_FBCLK EMIF2_SDCKEN0 EMIF2_SDCKEN1 EMIF2_SDRAS_ADVN EMIF2_BE0N EMIF2_BE1N

TDI TMS TRST_N TCK EMU_MODE_0 EMU_MODE_1 TDO RTCK

EMU_MODE_1

PWRRST_n VDDE_1V8

EMIF2_A01 EMIF2_A02 EMIF2_A03 EMIF2_A04 EMIF2_A05 EMIF2_A06 EMIF2_A07 EMIF2_A08 EMIF2_A09 EMIF2_A10 EMIF2_A11 EMIF2_A12 EMIF2_A13 EMIF2_SDBS0_A14 EMIF2_SDBS1_A15 EMIF2_A16 EMIF2_CLE_A17 EMIF2_ALE_A18 EMIF2_A19 EMIF2_A20 EMIF2_A21 EMIF2_A22 EMIF2_A23 EMIF2_A24 EMIF2_A25 EMIF2_CRE_A26

2G v1.8 x8 NAND + 1G v1.8 x16 SDRAM(MCP)

G4 G5 G6 H5 H6 K5 K6 K7 K8 M5 M6 M7 M8 N2 N9

NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20

R657

NF_CS0_N SD_CKE2 NF_ALE NF_CLE NF_OE_N NF_READY NF_WE_N RESOUT0_n

C6 F6 D5 C5 E5 E6 D6 F5

_CE CKE2 ALE CLE _RE R__B _WE _WP

VSS5 VSS6 VSS7

B5 N5 N8

DNI

DNI

DNI

DNI

DNI

DNI

R648

R647

R649

R646

R650

R659

JTAG and ETM


VDDE_1V8
TMU200
TCK PS_HOLD

RESIN

RTCK

TRST

GND

VCC

TDO

TMS

TCK

JTG201

100K

R643

NF_CLE NF_ALE

TCK

TDI

TMU201

E
TRST_N TMS TDI TDO RTCK TCK

R204

VDDF_2V5

DB3200 POWER

0.1u

VDDF_2V5

F
C212 33nF

NF_READY NF_CS0_N
TP220

SD_CS2_n NF_OE_N NF_WE_N

0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u

C213 C214 C215 C216 C217 C218 C219 C220 C221 C222 C223 C224 C225 C226 C227 C229 C230 C231 C237 C238 C239 C240 C241

SD_CKE2

B4 D13 A7 J1 K1 T1 AC3 AC15 AC21 AA23 N23 D23 C23 A21 A14 A4 A3 H1 R1 Y1 AC5 AC13 AC20 Y23 F23 E23 A20 A13

VDDC_ADDA_ESD VDDC_IO VDDC_PLL VDDC1 VDDC2 VDDC3 VDDC4 VDDC5 VDDC6 VDDC7 VDDC8 VDDC9 VDDC10 VDDC11 VDDC12 VDDC13 VDDE1 VDDE2 VDDE3 VDDE4 VDDE5 VDDE6 VDDE7 VDDE8 VDDE9 VDDE10 VDDE11 VDDE12

1u C211

A10 PLL_26_VCONT A9 PLL_26_FILTVDD VDDA_ADDA VDDA_ADDA_REF VDDA_ADDA_ESD VDDA_ADGP VDDA_DA A6 B8 C7 C6 D5

U201-2 DB3200_B

C12 VDDA_PLL_13_208 B12 VDDA_PLL_26_208 D12 VDDA_PLL_26_60 A12 VDDA_PLL_32_13 C10 VDDA_PLL_ESD VSS_ADDA_ESD VSS_PLL VSSA_AD VSSA_ADDA VSSA_ADDA_ESD VSSA_ADDA_REF VSSA_ADGP VSSA_DA B3 A8 B9 A5 E5 B7 B5 C5 C232

VDDE_1V8

G
0.1u 0.1u 0.1u 0.1u 0.1u C236

T22 N20 R22 N21 P22 M21 P23 M20

U21 R20 U23 T21 U19 V19 V20 W20 U20 T20 V23 W23 W22 V22

K20 K23 J16 K22 K16 L22 L21 L23 L20 M22 J20 M23 K15 N22 N15

C234

C233

C235

VDDE_1V8

B11 VSSA_PLL_13_208 C11 VSSA_PLL_26_208 D11 VSSA_PLL_26_60 A11 VSSA_PLL_32_13 D10 VSSA_PLL_ESD VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21

TP221 TP222

SHARED_I2C_SCL SHARED_I2C_SDA APP_I2C_SCL APP_I2C_SDA

LCD_RESET_N LCD_VSYNC LCD_WE_N LCD_RS LCD_CS_N LCD_RD_N

TP223

MICROSD_CLK MICROSD_CMD MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_CMD_DIR MICROSD_DAT_DIR

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]

CI_PCLK CI_VSYNC CI_HSYNC CI_RES_n

CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7]

3300 3300

R214 3300 R211 3300

3300 3300

1u

R15 J9 N9 J15 M15 M8 R11 R13 W19 F5 T12 W5 R12 R9 M9 W21 L15 E19 M16 J12 H12

R212 R213

R209 R210

R639

APP_GP_3AXIS_SDA APP_GP_3AXIS_SCL 0 APP_GP_USW_SDA APP_GP_USW_SCL 0 R215 R216 AMP_I2C_SDA AMP_I2C_SCL

A1 A2 A22 A23 AB23 AC2 B23

DU4 DU5 DU6 DU7 DU8 DU9 DU10

C228

I2C MAP

R205 R206 R207 R208

3300 3300 3300 3300

1u

H
VDDE_1V8

APP_GP_TOUCH_SDA APP_GP_TOUCH_SCL

10

11

12

LGE Internal Use Only

- 180 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

GPA3:PCB_Rev_ADC A, H : 100K : 6.2K : 0.155V B, I : 100K : 12.1K : 0.286V C, J : 100K : 20.0K : 0.442V D, K : 100K : 27.0K : 0.563V E, L : 100K : 39.0K : 0.744V F, M : 100K : 51.0K : 0.895V G, N : 100K : 68.0K : 1.073V 1.0 : 100K : 100K : 1.325V 1.1 : 100K : 150.0K : 1.59V 1.2 : 100K : 215K : 1.809V 1.3 : 100K : 390K : 2.109V 1.4 : 100K : 680K : 2.31V PCB_VERSION

VDDD_2V65

SHARED_I2C_SDA SHARED_I2C_SCL

PCB_VERSION TESTOUT RTEMP

MOTOR_PWM

KEY_LED1 KEY_LED2

KEY_LED5 KEY_LED6

100K

R300

ADOUT

TX_ADC_STRB

VBACKUP

A
VDDD_2V65 VDDA_2V8 VDDD_2V65 VDDE_1V8 VDIGRAD_1V8 VBAT

ONSWA_n ONSWB_n DCON ACC_IRQ_n APP_IRQ_n PWRRST_n

VBAT 100K R301

SYSCLK1 ACCSLEEP APPSLEEP

TP300

VBAT
TP302 TP304

H13

D14

C14

B13

C13

C11

C10

E13

E14

E12

E11

F13

F12

F11

A9

B9

C9

B8

A8

C8

D8

B7

B4

A4

D3

C3

A3

B3

C7

A5

C301 4.7u

TP301 TP303

C300 0.1u

R302 R303 R304 R305 C302 2.2u C303 2.2u C304 2.2u

0 VDDA_2V8 0 VDDD_2V65 0 VDDE_1V8 0 VDIGRAD_1V8 to RF3300 digital to All I/O Supplies and Memory to AB3100 CODECs/ADC/PLL to RF3300 Power Detector

ONSWA_N ONSWB_N ONSWC IRQA_N IRQB_N PWRRST_N

VIBR_OUT

C305 4.7u
K12

AD_OUT VDD_ADC

MCLK SLEEP_A SLEEP_B

LED1_N LED2_N LED3_N LED4_N LED5_N LED6_N

GPA0 GPA1 GPA2 GPA3 GPA4 GPA5 GPA6 GPA7 GPA12

SDA SCL

TXON

VDDC_2V65 VBAT_A

VDDH_2V75

VDDF_2V5

VDDG_2V85

VDDK_2V75

B
K14

LDO_A LDO_D

2.75V 150mA 2.65V 200mA

LDOA_OUT C12 EXT_LDO


L12

K13

EXT_LDO

VBAT_B

C306 4.7u

F14

LDO_G 1.50~2.85V 100mA


VBAT_E

LDOD_OUT G14 LDOE_OUT R306 0 VDDC_2V65 R307 R308 LDOF_OUT L13 LDOG_OUT
G13 N12

to Hall Switch and AB3100 BEAR to 3xis to DB3100 analog to SD Card and LCD to Bluetooth

M13

LDO_E
VBAT_F

1.80V 200mA

VBAT_H
N14 F3 M3

LDOC_OUT L14 LDOH_OUT

0 VDDH_2V75 0 VDDF_2V5 0 VDDG_2V85 0 VDDK_2V75

LDO_F 1.05~2.65V 30mA


VBAT_G VBAT_H VBAT_K VBAT_L VBAT_M VBAT_C

R309 R310

Charger Block

LDO_H 1.20~1.80V 200mA 2.75V 100mA LDO_K 1.80~2.75V 200mA

LDOK_OUT

M14

VBAT_C

B14 A1

R311 VBACKUP

C
D1

LDO_C

2.65V 200mA
C307 2.2u C308 1u C309 1u C310 4.7u 1608 C311 1u C312 1u VBAT_C BLM18PG121SN1J 120ohm 1608 2A 50mohm Bead FB300 VBAT

4.7K

C
VCORE

VDD_REF

LDO_LP

2.20V

LDOLP_OUT BUCK_FB

D13 E1

B12

2.8*2.6*1.0 0.7A 240mohm 20% MOD1 BUCK 1.2V 5% VBUCK


C1

R312 L300 C314 0.1u C315 10u 4.7uH D300 RB521S-30 C317 10u C318 10u

0 VCORE C319 0.1u Parallel with VCORE to DB3210 CORE

X300 Route as a differential pair 22p 22p 1 2 32.768KHz

A10

XTAL1 D11 XTAL2 R313


B11

RTCCLK 1 % 27 C322 DNI


TP305

XTAL_OUT Local ground plane VSS_BUCK


B1

C320

C321

Use multiple via

D
RTC_GND

P2

SIMOFF_N

U300 AB3100

SIMLDO_OUT

L1

SIMVCC Close to ABB C323 1u

SRST_n SCLK SDAT BDATA FGS+

M2 M1 N3 A11 J14

SRST_N SCLK SDAT BDATA FGSENSEP

SIMRST_N N2 SIMCLK P1 SIMDAT


K3

N1

SIMRST_n SIMCLK SIMDAT

Charging Circuit
VBUS Q300
S2

VA605 varistor VBAT FGSJ13 G2 H1

SCK1 J3 WS1 J1 SDI1 K2 SDO1 SCK2 K1 WS2 K4 SDI2 L2 SDO2


N10 M10 N9 P9 N8 P8 N11 P10 L3

DB_I2S0_CLK DB_I2S0_WS DB_I2S0_ULD DB_I2S0_DLD DB_I2S1_CLK DB_I2S1_WS DB_I2S1_ULD DB_I2S1_DLD

SIA911DJ
G2

FGSENSEN VBAT_D CHSENSEP

E
Charging

D2

E
MIC1P MIC1N MIC2P FM_RP FM_LP 0.1u 0.1u 0.1u 22p 22p 22p

D4

CHS+

D3

D1

CHSG1

H2 H3

CHSENSEN CHREG

S1

CHREG

CHREG

MIC1P MIC1N MIC2P MIC2N MIC3P MIC3N MIC4P MIC4N

DCIO_INT VBAT_H R314 0 USB charging path VBAT CHS+ 2012 1/4W 1% R316 Route as a differential pair 0.1 CHSDCIO_INT VBUS VBUS TRICKLE R317 VDDE_1V8 VDD_REF VDDC_2V65 C330 22p D302
C1 1 A2 2 A1_C2 3

OTP
CCO1 CCO2 SPKRP_OUT SPKRN_OUT BEARP_OUT BEARN_OUT AUXO1_OUT AUXO2_OUT LINEIN1 LINEIN2 MIDR_OUT
N13 P14 N7 N6 P5 M5 M4 P4 P12 P11 N4

C325

C326

C327

C328

D301

RSX101VA-30TR

C329

C631

CCO1 SPKRP SPKRN BEARP BEARN EAR_R EAR_L C335 22p

F1

E2

DCIO_INT DCIO VBUS F2 TRICKLE DAC_DAT DAC_STR DAC_CLK

J2

Audio Subsystem

VBAT

VBAT

C4

1u

F
C331 33u Discharging

1u

RF_CTRL_DATA RF_CTRL_STR_1 RF_CTRL_CLK

C5 B5

C332 1u C336

C333 1u

C334 0.1u

P7 P6 P13 P3 G1

BDATA C337 22p R320 300K

VDD_SPKR VDD_BEAR VDD_AUDIO VDD_AUXO VDD_REF

Audio Block Audio Block Digital Block Audio Block Charger Block

A3

VDD

R319

24K

A4 C338 1u A5

C1N C1P

PVDD

VSS

PLL_DEC3 J12 PLL_DEC4

H14

B1

C5

KDS221E_RTK

A12

C340

C341

VDD_IO

SW_BOOST C2 BOOST_ISP D2 BOOST_ISN B2 VBOOST DACO_0 B6 DACO_1 A6 DACO_2 C6 DACO_3


A7

47n

E3

3300p

HPR HPL

A1 A2

HS_EAR_R HS_EAR_L

EAR_R EAR_L SPKRP SPKRN

C339 C342 C343 C344

1u 1u 18000p 18000p

D1 INA2 D2 INA1 C1 INB2 C2 INB1 B2 BIAS

U301 MAX9877AEWP_TG45 OUT+ OUTD5 B5 VA300 ICVL0505101V150FR VA301 ICVL0505101V150FR SPK_RCV+ SPK_RCV-

D12 A13 A14

CN300 D1 1 2 3 D2

Causion when PCB lLayout Direction of BAT and GND

1u 100K

TEST VREF IREF

DCDC_REF BIAS_CTRL

Audio Block

C345 R321

VSS_BEAR VSS_SPKR

22p

SPARE1 SPARE2

VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 VSS22 VSS23 VSS24 VSS25 VSS26 VSS27 VSS28 VSS29 VSS30 VSS31 VSS32 VSS33 VSS34 VSS35 VSS36 VSS37 VSS38 VSS39 VSS40 VSS41 VSS42 VSS43 VSS44 VSS45 VSS46 VSS47 VSS48 VSS49 VSS50 VSS51 VSS52 VSS53 VSS54 VSS55 VSS56 VSS57 VSS58 VSS59 VSS60 VSS61 VSS62 VSS63 VSS64 VSS65 VSS66 VSS67

PGND

GND

C352

1% C354 1u

E4

E5

E6

E7

E8

E9

F10

L10

E10

L11

J4

J5

J6

J7

J8

N5

D4

D5

D6

D9

H4

H5

H6

H7

H8

H9

J9

K5

K6

K7

K8

K9

D3

M11

Phone ground return path

FGS+
2012 1/4W

1%

R324 0.025

Route as a differential pair FGS-

M12

G10

G11

G12

J10

D10

H10

H11

H12

J11

K10

B10

K11

Audio Subsystem

C4

F4

F5

F6

F7

F8

F9

L4

L5

L6

L7

L8

M7

L9

M6

M8

M9

D7

G4

G5

G6

G7

G8

G3

G9

A2

C353

BEARP BEARN

D4 RXIN+ B4 RXIN-

22p

C346 0.1u

C347 1u

C348 0.1u

C349 0.1u

AMP_I2C_SDA AMP_I2C_SCL 1% R322 15 R323 15

B3 SDA C3 SCL

H Make an Area at 8, 9 Layer

10

11

12

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 181 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

10

11

12

Three-Axis Interface
VDDH_2V75

VDDE_1V8

Motor Interface
VDD_MOTOR_3V3 VDD_MOTOR_3V3

R640

R656 U401 1 2 3 4 5 R409 C400 22n NC1 VDD GND INT CSB BMA150 10 NC2 9 VDDIO 8 SDI 7 SDO 6 SCK R402 150K APP_GP_3AXIS_SDA APP_GP_3AXIS_SCL R408 0.1u C401 MOTOR_PWM R411 51K 51K C1 BYPASS B1 _SHUTDOWN C2 IN+ C3 INU400 R413 1K VDD TPA6205A1ZQVR R412 150K VO+ A3 VOB3 GND A1 B2 APP_GP_3AXIS_INT 11 NOT1 12 NOT2

MOTOR_N MOTOR_P

390

Three-Axis Sensor
R414 1K 0.01u C403

C404 1u

MOTOR AMP

Micro SD Card Interface


C
VDDE_1V8 VDDG_2V85

VDDG_2V85 2 4 6 8

VBAT 100K R637 100K RA400 GND U403 A5 C5 B2 C1 A2 B4 A4 B5 B1 A3 A1 B3 C3 C409 0.1u VCCA DAT0_DIR DAT0A DAT123_DIR DAT1A DAT2A DAT3A CMD_DIR CMDA CLKA CLK_F GND1 GND2 SN74AVCA406EZXYR D5 VCCB DAT0B D2 MICROSD_DAT0_2V85 MICROSD_DAT1_2V85 MICROSD_DAT2_2V85 MICROSD_DAT3_2V85 MICROSD_DAT2_2V85 MICROSD_DAT3_2V85 MICROSD_CMD_2V85 MICROSD_CLK_2V85 MICROSD_DAT0_2V85 MICROSD_DAT1_2V85 VA400 VA401 VA402 VA403 VA404 VA405 1 2 3 4 5 6 7 8
SWA SWB

VDD_MOTOR_3V3

1 3 5 7

RP103K331D 4 VDD 3 CE

U402 1 VOUT 2 GND

R416

2.2

EVLC18S02015

EVLC18S02015

EVLC18S02015

C2 CMDB D3 CLKB C410 0.1u

MICROSD_CMD_2V85 MICROSD_CLK_2V85 R419 220K

EVLC18S02015

EVLC18S02015

EVLC18S02015

MICROSD_DAT0 MICROSD_DAT_DIR MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_CMD_DIR MICROSD_CMD MICROSD_CLK APP_MMC_FB_CLK

D1 DAT1B C4 DAT2B D4 DAT3B

APP_GP_MOTORLDO_EN S400 DM3AT-SF-PEJ Hirose ( Micro-SD Socket, Normal ,T= 1.68) ENSY0020901 C406 1u

PGND

D
C407 1u

VDDE_1V8

1608 C408 10u

LDO 3.3V For MOTOR 150mA


VA406 EVLC18S02003

APP_GP_MMC_DETn

MICROSD LEVEL SHIFTER


E

MICROSD SOCKET

Touchscreen Interface
VDDE_1V8 VDD_TOUCH_2V8 R642

VDD_TOUCH_2V8

R420

F
C411 1u C412 0.1u R424 2.7K U405 A1 A2 A3 B1 B2 B3 TSC2007IYZGR SDA A1 XSCL GND YC1 C2 C3 D1 D2 D3 AUX VDD_REF X+ PENIRQA0 Y+ R421 2.7K R422

R425

51K

B2

B1

A4

VBAT

VCCA

VCCB

A4

VDD_TOUCH_2V8

R423 A3 A3 R426

0 APP_GP_TOUCH_SDA 0 APP_GP_TOUCH_SCL

B3 RP103K281D-TR-F 4 VDD 3 CE U406 1 VOUT 2 GND APP_GP_TOUCH_PENIRQn_2V75 B4 C1

OE

DNI

APP_GP_TOUCH_SDA_2V75 TOUCH_X-

GND TXS0104EZXUR A2 A2 U404 B1 B2 B3 B4 A1 A1

APP_GP_TOUCH_PENIRQn_2V75
APP_GP_TOUCH_PENIRQn

APP_GP_TOUCH_SCL_2V75
TOUCH_Y-

APP_GP_TOUCH_LDO_EN

PGND

EUSY0337101

C2

C3

R429

100K

C413 1u

C414 1u

APP_GP_TOUCH_SCL_2V75 APP_GP_TOUCH_SDA_2V75

G
TOUCH_Y+

C4

TOUCH_X+ ZD400 RSB6.8CST2R ZD401 RSB6.8CST2R ZD402 RSB6.8CST2R ZD403 RSB6.8CST2R

TOUCH LEVEL SHIFTER

TOUCH SCREEN DRIVER IC

10

11

12

LGE Internal Use Only

- 182 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

High Speed USB Interface


VBAT 10V R641 VDDE_1V8

MUIC Circuit

Micro USB Interface


A

A
0 R500 51K C500 0.1u C501 4.7u

VBAT

R655

MUIC
D2 BAT VB D5 USW_DM USW_DP R502 R504 2.2K R507 R508 DNI DNI 0 VBAT USW_ID

VBUS

VBUS
9

FM_ANT L500 C502 VA500

F3 F2 F1

1u

C2 C1 B2

ACC_GP_USB_CS ACC_USB_HS_IN_CLK USB_DATA(0) USB_DATA(1) USB_DATA(2) ACC_USB_HS_DATA(3) ACC_USB_HS_DATA(4) ACC_USB_HS_DATA(5) ACC_USB_HS_DATA(6) ACC_USB_HS_DATA(7) ACC_USB_HS_NXT ACC_USB_HS_STP ACC_USB_HS_DIR

GND3 E4 GND2 D2 GND1 C5

C3 TP500 A4 B1 TP501 A1 A2 A3 A5 A6 B6 C6 D5 D6 E5 E1 E6

DATA5 DATA6 DATA7 NXT STP DIR CFG0 REF1V8

ID CFG2 CFG1 PSW_N VBUS REG3V3 XTAL1 XTAL2

ISET

SCL SDA INT

C506 C507 C508 R509 VBUS


TP502

TP602 A2

C4 GND C3 IC

INSTPAR SD12T1G

TEST CHIP_SEL CLOCK VCC_IO1 DATA0 VCC_IO2 RREF DATA1 DATA2 DM U502 DATA3 DP DATA4 ISP1508AET FAULT

C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6 0.1u 4.7u 0.1u 12K

C503

USB_DM USB_DP R501 APP_ACC_UART_RX APP_ACC_UART_TX R503 0 0

A4 DN1 A5 DP2 B3 U1 A3 U2 A1 MIC D4 AUD1 D3 AUD2

C5 COM1 B5 COM2 U501 B4 MAX14526EEWP_TCC6 UID RES CAP B1 D1

VCC NC2 NC1

4
C504 1u

G2 OUT

G1 IN

3
4 3 DRAIN CNTRL GND IN

U500 82nH DNI SRC GATE OUT VCC DRAIN_THERMAL NUS3065MUTAG ULCE0505C015FR 5 6 7 8 9

2 1 NFM21PC105B1A3 FL500 ZD500

USB_DM USB_DP

MIC2P HS_EAR_L HS_EAR_R

C505 R505 R506

0.1u 10 10

FB500 FB501 FB502

2 1

6
8

10 CN501 12
14

TI : PD = USB, PU = UART MAXIM : NA = USB, PU = UART

22p 22p 22p

C510
If TI, then 10nF If Maxim, then 4.7uF C509 4.7u 2012 Close by uUSB CONN

C511

1K

USB_XTAL1

Close to MUIC
VDDE_1V8

USW_DM USW_DP
USW_ID

1 uF

22p

1 2 3 4 5 7
9

CN500 1 2

C512 4.7u

C513 0.1u

1%

2.2u

11
13 15 R511 2.2K APP_GP_USW_SCL APP_GP_USW_SDA APP_GP_USW_INT

C514

C515

C516

USB Transceiver

R510

C517

ESD / EMI Filter


KNATTE2-C2 APP_UART_RX ACC_UART0_RX ACC_UART0_TX APP_UART_TX D2 C3 D4 D3 C5 VPPFLASH D5 D1 DTMS_I CTMS_I CFMS_I DFMS_I DCIO_I

VDDE_1V8

OJ
FL501 OJ500 DTMS_E CTMS_E CFMS_E DFMS_E DCIO_E A1 A3 A4 A2 B5 R513 R515 R517 R518 DNI 0 0 DNI APP_ACC_UART_RX OJ501

Backlight Charge Pump


VBAT

VCC

C4

U604 0 APP_ACC_UART_TX R629 4 1u C632 5 C1+ C1-

AAT3169IFO-T1 7 C2+ C2OUTCP 8 6 1u C633 R631 0 WLED_PWR

9 A5 B1 VPPFLASH_E CTS_ON APP_GP_BL_EN 3

IN D1 D2 D3 D4 D5 D6

VPPFLS_I CTS_ON_I

VPPFLS_E CTS_ON_E

ONSWB_n

EN_SET

GND5 C2 GND4 C1 GND3 B4 GND2 B3 GND1 B2

R630

100K

10 GND 15 PGND C635 1u

11 12 13 14 1 2 C634 1u

WLED1 WLED2 WLED3 WLED4 WLED5

34 pin connector To VGA FPCB


E

Download Point And TP Test Point


E

2.5G APP_ACC_UART_RX APP_ACC_UART_TX then remove VBUS CTS_ON VBUS 1 2 3 4 5 6 7 8 9 10 11 12


GND RX TX

3G

If VBUS not used,


CAM_AVDD_2V8 CAM_DVDD_1V8

If VBUS not used, then remove

GND RX TX VCHAR ON_SW ON_SW VBAT VBAT NC2 PWR NC3 URXD NC4 UTXD
NC1 DSR RTS CTS

VPPFLASH_E CN503

SYSCLK0 TOUCH_X+ TOUCH_XTOUCH_Y+ TOUCH_YTOUCH_Y- : GND line shielding to CN APP_GP_VGA_SDN APP_I2C_SDA APP_I2C_SCL CI_RES_n SPK_RCV+ SPK_RCV-

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 C523 0.1u C525 0.1u

URT500 VBAT

DOWNLOAD POINT
CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7] CI_HSYNC CI_VSYNC VPPFLASH_E CI_PCLK CTS_ON APP_ACC_UART_RX APP_ACC_UART_TX

TP607 TP605 TP606 TP603 TP604 TP608 TP609

ENBY0040301 GB042-34S-H10-E3000

G
OTP_A VBAT

Test Point

10

11

12

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 183 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

10

11

12

50 Pin Connector To KEY and LCD FPCB


LCD_AVDD_2V8 LCD_DVDD_1V8 VBAT VDDE_1V8 VBAT

LCD_AVDD_2V8 LCD_DVDD_1V8

60 Pin Connector To Sub PCB


VBAT VDDE_1V8 VDDK_2V75

4.7K

10K

DNI

R600

10K

10K

10K

R609

R608

R607

R628

C601

C602

C603

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3]

1 2 3 4

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2

9 8 7 6

1u

1u

C625 C626

47n FB604 47n FB605

MIC1P MIC1N KEYIN0 KEYIN3 KEYIN2

1u

Close to ABB

CCO1

PGND

APP_GP_LCD_ALDO_EN APP_GP_LCD_DLDO_EN

100K

R644

EVRC14S03Q030050R

FL600

B
LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]

EVRC14S03Q030050R
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2 9 8 7 6

FL601

EVRC14S03Q030050R LCD_RS LCD_CS_N LCD_RD_N LCD_WE_N


1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2 9 8 7 6

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 53 54

50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26

R603

R604

R653 R654

0 0

U600 1 VIN 2 EN1 3 EN2 4 NC1

RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND

R601

CN604 51 52

R638 CN601 G1 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 G3 G4 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

0 ISP_GP_FLASH_SET ISP_GP_FLASH_EN ISP_GP_FLASH_INH ACC_GP_WLAN_RESETn ACC_GP_WLAN_PWR_DOWNn ACC_SPI_WLAN_CSn ACC_GP_SPI_WLAN_IRQn ACC_GP_WLAN_EN ACC_SPI_MOSI ACC_SPI_CLK ACC_SPI_MISO SIMRST_n SIMDAT SIMVCC SIMCLK APP_ACC_UART_TX APP_ACC_UART_RX VPPFLASH_E CTS_ON FM_ANT MCLKSEC RTCCLK

R627 R626

100ohm 100ohm

ONSWA_n
KEY_LED1 KEY_LED2 KEYOUT0 KEYOUT1 KEYOUT2 APP_GP_LCD_ID WLED1 WLED2 WLED3 WLED4 WLED5

FM
LDO for LCD Power
OTP OTP_A

RESOUT1_n APP_GP_FM_GPIO2 APP_I2C_SCL APP_I2C_SDA VBACKUP


MOTOR_P MOTOR_N ACC_GP_SPI_BT_IRQ ACC_GP_SPI_BT_CSn BT_CLKREQ_n RESOUT2_n PCM_ULD PCM_DLD PCM_SYNC PCM_CLK ACC_GP_GPS_PON ACC_UART3_RX ACC_UART3_TX ACC_UART3_RTS ACC_UART3_CTS ACC_GPS_START ACC_GP_GPS_RESETn FM_LP FM_RP

10

FLASH WLAN SPI SIM TP


B

R645

10

R610

10K

BT

10

APP_GP_LCD_IF1

LCD_RESET_N

KEYOUT0 KEYOUT1 KEYOUT2


ICVS0514X350FR RSB6.8CST2R RSB6.8CST2R

GPS

10

LCD_VSYNC FL602 WLED_PWR PRSB6.8C PRSB6.8C

RSB6.8CST2R

EVLC14S02050

INSTPAR ESD9X5.0ST5G

INSTPAR ESD9X5.0ST5G

INSTPAR ESD9X5.0ST5G

EVLC14S02050

KEYIN0 KEYIN3 KEYIN2

R621

C638 2.2u

TRICKLE 100K R622

SOCKET

DNI

1u

1u

VA603

D600 PRSB6.8C

C604

C605

ZD605

ZD606

ZD601

VA604

ZD603

ZD604

ZD600

KEY ESD Protection


D D

5M Camera Interface
VBAT CAM_DVDD_1V8

VA602

ZD602

VA601

R611

CAM_AFVDD_2V8 CAM_AVDD_2V8

CAM_AVDD_2V8

R634 APP_GP_CAM_LDO_EN R616 5.6K 1u 0 1u

U602 D601 PRSB6.8C CI_RES_n SYSCLK0 CI_DATA[7] CI_DATA[6] CI_DATA[5] CI_DATA[4] CI_DATA[3] CI_DATA[2] CI_DATA[1] CI_DATA[0] CI_PCLK CI_HSYNC CI_VSYNC APP_I2C_SDA APP_I2C_SCL G7 H7 H8 H6 C3 E8 F5 F4 G4 H4 F3 G3 H3 F2 E1 E2 F1 B3 A3 A8 B8 C7 C8 G1 D1 F8 B2 A2 A1 B1 A6 B6 A5 B5 4.3K 4.3K

MV9319

PGND

R632 R633

0 0

ISP_GP_FLASH_SET ISP_GP_FLASH_EN ISP_GP_FLASH_INH

CAM_DVDD_1V8

U601 1 VIN 2 EN1 3 EN2 4 NC1

RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND

E
1u 1u C614

SOMI_S_GPIO30 SIMO_S_GPIO31 SCLK_S_SDO9 SS_S_SDO8 NRESET MCLK SDO7 SDO6 SDO5 SDO4 SDO3 SDO2 SDO1 SDO0 PCLKO HSYNCO VSYNCO SDA_S SCL_S TCLK TCLKB TDATA TDATAB NSRESET SRESET SMCKO
SDA_M_MISO_M

GPIO25_SS_M GPIO26_MISO_M GPIO27_MOSI_M GPIO24_SCLK_M GPIO20_PWM0 GPIO21_PWM1 GPIO22_PWM2 GPIO23_PWM3 GPIO28_SCL_M GPIO29_SDA_M RXD TXD RGVDD_1_8V VDDIO_2_8V
VDDCO

F6 G6 G5 H5 H1 G2 H2 D2 C1 C2 E7 F7 E4 E5 D3 D4 D5 D6 C6 A7 B7 C5 B4 C4 D7 D8 E3 E6 A4 G8

0.1u

C606

1 C608 1u C609 0.1u FL603 CLKN CLKP DATAN DATAP ULCA2114C015FR


1 2 3 4 P1 P2 P3 P4 P8 P7 P6 P5 8 7 6 5

24 23 22 21 20

2 3 4 5 6 7 8 9

C607

CN603

FB600

FB601

0.1u

R614

47

ISP_SENS_MCLK

TP600 TP601

ISP_AVDD_2V8

D602 PRSB6.8C

C610 7.5p CAM_AFVDD_2V8

C611

VA600

1 P1 2 P2 3 P3 4 P4

ICMF214P101M

LDO for 5M & VGA Camera


F

19 18 17 16 15 14 ISP_SENS_I2C_SDA R635 R625 ISP_SENS_I2C_SCL APP_GP_ISP_LDO_EN C621 220p C622 2.2u 5.6K C629 1u 0 13 U603 1 VIN 2 EN1 3 EN2 4 NC1 C630 1u RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND C628 1u C627 1u LC Filter for power noise from GSM RF L600 47nH ISP_AVDD_2V8 FB602 BLM15AG100PN1 VBAT ISP_DVDD_1V8

5MCAM_RESET_N ISP_SENS_MCLK ISP_SENS_I2C_SDA ISP_SENS_I2C_SCL

VDDCO_E AVDDP AVDD VDDA_2_8RX VDDA_2_8TX VSSA_TX VSSA_RX DGND1


DGND2

R617

100ohm

C615 1u

C616 0.1u

C617 1u

C618 1u

C619 1u

C620 1u

8 P8 7 P7 6 P6 5 P5

10 11 5MCAM_RESET_N 12 D603 PRSB6.8C

CLKP CLKN DATAP DATAN

SCL_M_SS_M GPIO10_SCLK_M GPIO11_MOSI_M RCLK RCLKB RDATA RDATAB

DGND3 DGND4 DGND5 DGND6 TEST_0 SEL1

FB603

C623 1u

C624 0.1u

ENBY0034201 GB042-24S-H10-E3000

PGND

C613

ISP_DVDD_1V8

C612

ISP_DVDD_1V8 R618 R619

5M CAMERA Conector 5M camera ISP(MTEK vision)


LDO for ISP

10

11

12

LGE Internal Use Only

- 184 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

VDDK_2V75

WLAN
4.7nH R780 R781 0 WIFI_RF_G
TP710

ANT780 C700
DUMMY FEED

C701 100p

0 WIFI_TXRX BT_TXRX R701 ANT_SEL_N 0

FL700 XM0830SK-TL1301TMP 5 3 ANT RFGND1 7 RFGND2 8 PORT1 2 PORT2 12 10 VCTL VDD GND1 GND2 GND3 GND4 GND5 PGND 1 4 6 9 11 13

BT+FM
BT_CLKREQ_n MCLKSEC C705 4p C706 4p WIFI_RF_G VSS_BT_RF

VDD_BT

VDDE_1V8

R700

1p C702

DNI C704

U730 SN74LVC1G125DRLR 5 1 _OE VCC 2 A 4 3 GND Y C730 0.1u C731 4.7u 100K R731

A
VDD_BT R730 BT_CLK 33

WIFI_RF_G VDD_WLAN_3V3

WIFI_RF_G VDD_WLAN_1V8

C707 1u

VDDE_1V8

RF GND: Isolate from Common GND on L1, L2 and L3 Analog GND must be Isolated from Common GND on L1, L2 and L3

FB710

FB711

TP711

TP712

VDD_WLAN_1V8

Careful routing of BT_CLK Keep away from noise signals U731 STLC2593
BT_CLK_REQ_OUT_1 BT_UART_TXD BT_UART_RTS BT_RFP BT_RFN BT_VIO_A BT_VIO_B BT_VIO_C BT_VIO_D BT_VIO_E BT_VSSDIG1 BT_VSSDIG2 BT_VSSDIG3 BT_VSSDIG4 BT_VSSDIG5 BT_VSSANA1 BT_VSSANA2 BT_VSSANA3 BT_VSSANA4 BT_VSSANA5 BT_VSSANA6 BT_VSSANA7 BT_VSSANA8 BT_VSSANA9 BT_VSSANA10 BT_VSSANA11 BT_VSSANA12 BT_VSSRF1 BT_VSSRF2 BT_VSSRF3 BT_VSSRF4 BT_HVA1 BT_HVA2 BT_HVA3 BT_HVA4 BT_HVA5 BT_TEST1 BT_TEST2 BT_AF_PRG J7 G7 J6 K1 J1 RESOUT2_n K7 BT_RESETN F6 BT_REF_CLK_IN K9 BT_LP_CLK L9 RTCCLK ACC_GP_WLAN_RESETn ACC_GP_WLAN_PWR_DOWNn ACC_SPI_MOSI ACC_SPI_CLK PCM_SYNC PCM_CLK PCM_DLD PCM_ULD BT_WAKEUP

100K

R732

ACC_SPI_MISO ACC_GP_SPI_BT_CSn

10u C712

C710

22p C713

10u C714

C711

for WLAN-BT coexistence


PTA_BT_PRIO PTA_BT_STATE PTA_WLAN_ACTIVE WLAN_SLEEPn

B
FL730 5 4 VDDE_1V8 BP1 BP2 DEA212450BT-7043C1 1 U_BP BP_DC 2 C732 100p BT_TXRX

R710 100K

R711 100K

BT_CLK RTCCLK

1u

1u

T_R_N SLEEP_CLK GPIO0 BT_PRIORITY RESETN PDN WL_ACTIVE BT_STATE VDD_PA VDD30

10u C716

37 PGND1 38 PGND2 39 PGND3 40


PGND4

C717 100p WIFI_TXRX


TP713

VDD_HOST_IO GPIO6 GPIO5 SD_DAT3 GPIO2 SPI_CLK_SD_CLK GPIO4 GPIO1 VDD18 VDD12

C725 DNI

WIFI_RF_G

1 2 3 4 5 6 7 8

PGND5 PGND6 PGND7 PGND8 PGND9

1u

41 42 43 44 45 26 25 24 23 22 21 20 19

C715

N4 BT_PCM_SYNC M4 BT_PCM_CLK K5 BT_PCM_A M5 BT_PCM_B M3 BT_GPIO_9 K3 BT_GPIO_11 K4 BT_GPIO_10 J3 BT_GPIO_16 L3 BT_GPIO_8

M6 J9 N3 N5 G8 H6 H7 H8 K8 L8 D1 D2 E3 F1 F2 F3 F4 G1 G3 G4 H3 H4 H1 L1 J2 K2 L2 D3 E1 E2 E4 H2 G2 G6 VSS_BT_ANA

36 35 34 33 32 31 30 29 28 27

FB730 60

VSS_BT_RF

VDD_WLAN_1V8 PTA_BT_PRIO PTA_BT_STATE PTA_WLAN_ACTIVE WLAN_SLEEPn R733 DNI ACC_GP_SPI_WLAN_IRQn ACC_SPI_WLAN_CSn ACC_SPI_MOSI ACC_SPI_CLK ACC_SPI_MISO VDDE_1V8 VDDE_1V8 ACC_GP_SPI_BT_IRQ

100K

100K

GND1 ANT GND5 VDD18A GND2 ANT_SEL_P LBWA18HNVZ-305 ANT_SEL_N SPI_SDO_SD_DAT1 T_R3_N SPI_SINTN_SD_DAT2 SCLK ESCN SPI_SCSN_SD_DAT0 SPI_SDI_SD_CMD GND3 GND4

M710

ANT_SEL_N

R713 100K

C733 0.1u

G9 BT_GPIO_0 E7 BT_CLK_REQ_IN_1 F9 BT_CLK_REQ_IN_2 E8 BT_HOST_WAKEUP L7 BT_CONFIG_1 M7 BT_CONFIG_2 N6 BT_CONFIG_3 J8 B2 C3 M8 C1 C2 M2 J4 BT_CLK_REQ_OUT_2 BT_RSVR_CL1 BT_RSVR_CL2 BT_RSVR_D BT_RSVR_DSM BT_RSVR_N BT_RSVR_RF BT_REG_CTRL

6 3

H9 BT_UART_RXD K6 BT_UART_CTS

G2 G1

VSS_BT_ANA

R734

R714

VDD_WLAN_1V8

R715

9 10 11 12 13 14 15 16 17 18

100K

WIFI_RF_G

VDD_WLAN_1V8

VDDK_2V75

VBAT

POWER
RP101K332D 4 VDD 3 CE C722 1u U710 1 VOUT 2 GND C721 1u VDD_WLAN_3V3 0 R716 PGND 5

BT_CLKREQ_n VDD_BT VDDK_2V75

R717

R735

0.1u

VSS_BT_RF

1u

C720

C719

ACC_GP_WLAN_EN

R742

C718 1u

0.1u

C736

VDDE_1V8 RP101K182D 4 VDD 3 CE C724 1u U711 1 VOUT 2 GND C723 1u VDD_WLAN_1V8

VBAT

VDDE_1V8

C735

0.1u

N7 BT_HVD E6 BT_VDD_CLD

C734 0.1u

VDDE_1V8

PGND

R738

R740

100K

D4 F7 F8 L4 L5 L6

NC1 NC2 NC3 NC4 NC5 NC6

R737 0 C737 C738 1u 1u FM_RP FM_LP APP_I2C_SDA

FM_ROUT FM_LOUT FM_VIO FM_SDIO FM_GND1 FM_GND2 FM_GND3 FM_GND4 FM_GND5 FM_GND6 FM_GND7 FM_GND8 FM_RFGND

C5 B5 D6 D8 A3 B4 B6 B7 C4 C6 C7 D5 C8

R739 110 C739 0.1u

APP_GP_FM_GPIO2

RESOUT1_n RTCCLK

E
APP_I2C_SCL

R741 110 22n

A4 B3 A7 A6 A5 B8 C9 D7 D9 E9

FM_VA FM_VD FM_GPIO1 FM_GPIO2 FM_GPIO3 FM_FMIP FM_RSTB FM_RCLK FM_SENB FM_SCLK

A-GPS
X750 1 2 GND1 NC1 GND2 KT2520F16369ACW18T 6 VCC NC2 OUT 5 4 C750 2.2u C751 0.1u R757 0

C740

22n C741

VGPS_1V8 C743 120p

C742

10p

FM_ANT VGPS_1V8

VDDE_1V8

2.2nH L770

10 R770

R750 0

C771 0.1u

2.2u C770

VDDE_1V8

Reference Number
78x: BT/WiFi Antenna Pattern 70x: BT/WiFi RF path
C754 2.2u

RTCCLK ACC_GPS_START GPS_CNTIN VDDE_1V8 F2 CNTIN E7 SYNC_PPS B6 VDDIO1 G3 VDDIO2 G7 VDDIO3 A3 LPREGIN F5 RTCCLK A2 TCXO C752 1u ACC_GP_GPS_PON R772 0 D5 VPD F1 TESTMODE RFIN TX_SDA_MISO RX_SCL_SCK CTS_N_I2C_GRP1_SCS_N RTS_N_I2C_GRP0_MOSI INTR_N RESET_N STANDBY_N TRST_N TCK TDI TDO TMS U751 BCM4750 E1 RFSREGOUT D1 VDDIFSYNTH F6 C761 1u C760 1u B1 10nH L771 C4

GPS Clock Buffer


U750
NL17SZ126XV5T2G ACC_GP_GPS_PON MCLKSEC 2.2nH C755 100p C772 CN750 1 CN751 1 OE A VCC BBRFREGIN

R752 10

C753 0.1u

S_D

C6 B4 C5 ACC_UART3_RX ACC_UART3_TX ACC_UART3_RTS ACC_UART3_CTS G6 G2 G1 G5 F7 ACC_GP_GPS_RESETn ACC_GP_GPS_PON G4 F3 A6 A7 C7 B7 A5

BMS0 BMS1_I2C_A0 BMS2_UARTCS_N

R753 GND Y 33 GPS_CNTIN

L750

6.8nH

5 VDD 4 FIL_OUT

2 RF_IN 3 GND L772 100nH

71x~72x: WiFi 73x~74x: Bluetooth 75x~76x: A-GPS 77x: GPS LNA


G

C757

0.5p

NA

VDDLP_LPREGOUT

C756

C759 1u

GPS LNA block

100nH

E2 RFREGOUT D2 VDDRF

U770 ALM-1612

C758

C1 VSSRFSYNTH B3 VSSIFSUB

PGND

B2 ATEST0 C3 ATEST1 R756 100K VSSD1 VSSD2 VSSD3 VSSD4 VSSD5 VSSD6

BBREGOUT VDDCORE1 VDDCORE2 VDDCORE3 VDDCORE4

A4 D4 D6 E3 E6 C762 1u

GPS Power
ACC_GP_GPS_PON
TP751 TP752 TP753

VBAT

R754

100K

RP101K182D 4 VDD 3 CE 1u

U752 1 VOUT 2 GND 1u R755 VGPS_1V8 0

WIFI_RF_G

VSS_BT_RF VSS_BT_ANA

C763 1u

C764 1u

C765

C766

B5 D3 D7 E4 E5 F4

10

11

12

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 185 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

10

11

12

60 Pin Connector From Main PCB


A A

VBAT

VDDE_1V8

VDDK_2V75

FM
B

R814 0 CN800 G1 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 G3 G4 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

FLASH
B

Motor

CN801 1 2
MOTOR_P MOTOR_N

BT
C

GPS

RESOUT1_n APP_GP_FM_GPIO2 APP_I2C_SCL APP_I2C_SDA VBACKUP OTP_SUB MOTOR_P MOTOR_N ACC_GP_SPI_BT_IRQ ACC_GP_SPI_BT_CSn BT_CLKREQ_n RESOUT2_n PCM_ULD PCM_DLD PCM_SYNC PCM_CLK ACC_GP_GPS_PON ACC_UART3_RX ACC_UART3_TX ACC_UART3_RTS ACC_UART3_CTS ACC_GPS_START ACC_GP_GPS_RESETn FM_LP FM_RP

ISP_GP_FLASH_SET ISP_GP_FLASH_EN ISP_GP_FLASH_INH ACC_GP_WLAN_RESETn ACC_GP_WLAN_PWR_DOWNn ACC_SPI_WLAN_CSn ACC_GP_SPI_WLAN_IRQn ACC_GP_WLAN_EN ACC_SPI_MOSI ACC_SPI_CLK ACC_SPI_MISO SIMRST_n SIMDAT SIMVCC SIMCLK APP_ACC_UART_TX APP_ACC_UART_RX VPPFLASH_E CTS_ON FM_ANT MCLKSEC RTCCLK

WLAN

SPI SIM TP Backup Battery


C

D
BACKUP BATTERY VBACKUP BAT800

PLUG

Boost Converter for Camera Flash


VBAT

SIM Interface
For Product inspection TP(7PIN)
F
SIMVCC SIMDAT and SIMCLK Siganls to be separated when routing SIMVCC
TP800 TP801 TP802 TP803 TP804

VPPFLASH_E CTS_ON APP_ACC_UART_RX SIMRST_n SIMCLK EVLC18S02003 VA800 EVLC18S02003 VA801 APP_ACC_UART_TX OTP_SUB

R801

200K

10K

C801 47n U800 ISP_GP_FLASH_SET ISP_GP_FLASH_EN 1 2 3 4 5 6 7 L800 1u CT EN_SET FLEN AGND IN LX PGND AAT1270IFO-T1 14 RSET 13 FLOUTA 12 FLGND 11 FLOUTB 10 FLINH 9 GND 8 OUT

SIMDAT R805 0

J800 4 1 GND VCC 2 5 RST VPP 3 6 CLK I_O 8 7 GND2 GND1 C803 22p C804 1u C805 33p

G_SLUG

CAMERA FLASH LED


LD800 VA807 EVLC14S02050 VA806 EVLC14S02050

R806

R807

EVLC18S02003 VA802

ISP_GP_FLASH_INH

100K

100K

C802 33p

15

R803

2.2u C807 C800 2.2u C806 DNI

SIM CONNECTOR

10

11

12

LGE Internal Use Only

- 186 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

5 6

10

11

12

50 Pin Connector From Main PCB


LCD_AVDD_2V8 LCD_DVDD_1V8 VBAT CN2 51 52 1 2 50 49 48 47 CCO1 5 LCD_DATA[1] 6 LCD_DATA[2] 7 LCD_DATA[3] 8 LCD_DATA[4] 9 LCD_DATA[5] 10 LCD_DATA[6] 11 LCD_DATA[7] 12 39 40 KEYIN2 41 KEYIN3 42 KEYIN0 43 44 MIC1N 45 MIC1P 46

40 Pin Connector To LCD


LCD_AVDD_2V8 LCD_DVDD_1V8

CN1 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 R6 0

B
LCD_DATA[0]

3 4

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]

APP_GP_LCD_ID WLED_PWR WLED1 WLED2 WLED3 WLED4 WLED5 APP_GP_LCD_IF1 LCD_RS LCD_CS_N LCD_RESET_N LCD_RD_N LCD_WE_N LCD_VSYNC LCD_IF0

ONSWA_n

C
APP_GP_LCD_IF1 LCD_RS

13 14 15 LCD_CS_N 16 LCD_RESET_N 17 LCD_RD_N 18 LCD_WE_N 19 20 LCD_VSYNC 21 22 LCD_IF0

38 KEY_LED1 37 KEY_LED2 36 35 KEYOUT0 34 KEYOUT1 33 KEYOUT2 32 APP_GP_LCD_ID 31 WLED1 30 WLED2 29 WLED3 28 WLED4 27 WLED5 26 53 54

SOCKET

D
WLED_PWR

23 24 25

Key Matrix
F

Main Key LED ( 4ea)


LD1000 KEY_LED1 VBAT SSC-TWH104-HL LD1001

F
SSC-TWH104-HL LD1002 SSC-TWH104-HL LD1003

SEND KEYIN3
SW1000 EVPAHBD6A

KEY_LED2

KEYOUT0 CLR ONSWA_n

LOCK END
C B D C_

VOLUME_DOWN

VOLUME_UP

SSC-TWH104-HL

KEYOUT2
B_ A HALF SHUTTER FULL SHUTTER KEYIN0 KEYIN2

KEYOUT1

KEYIN0

Main MIC
CCO1 C1000 47p MIC100 1 P 2 G1 3 G2 4 O SPU0410HR5H-PB

ANT Feeding
SW1001 UFL-R-SMT10 G1 G2 R4 ANT 0 0 R3 OUT101 OUT100

KEYIN0
D1000

KEYOUT2 ONSWA_n
RB521S-30

KEYIN3

KEYOUT1

SEND CLEAR KEY

END KEY

AUTO FOCUS KEY

TOUCH LOCK KEY

VOLUME KEY

MIC1N MIC1P

C1004 DNI

C1002 DNI

R123 0

5 6

10 0

11

12

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 187 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

10

11

12

34 Pin Connector From Main PCB


CAM_AVDD_2V8 CN901 CAM_DVDD_1V8 1 R910 47 2 3 4 TOUCH_X+ 5 TOUCH_X6 TOUCH_Y+ 7 TOUCH_Y8 9 10 APP_GP_VGA_SDN 11 APP_I2C_SDA 12 APP_I2C_SCL 13 CI_RES_n 14 15 2 1 CN902 SPK_RCV+ SPK_RCVSPK_RCV+ 16 SPK_RCV17 18 19 CI_PCLK 21 CI_VSYNC 20 22 CI_HSYNC 24 CI_DATA[6] 23 CI_DATA[7] 27 CI_DATA[3] 26 CI_DATA[4] 25 CI_DATA[5] 28 CI_DATA[2] 29 CI_DATA[1] 30 CI_DATA[0] 34 33

SYSCLK0

B
32 31

PLUG
D D

VGA Camera
E
CAM_DVDD_1V8

TOUCH CONNECTOR
E

CAM_AVDD_2V8

A2 IOVDD B6 DVDD E5 AVDD

SYSCLK0 APP_GP_VGA_SDN CI_RES_n APP_I2C_SDA APP_I2C_SCL

B5 EXTCLK C6 PWRDWN D3 RESET C5 SDA D6 SCL

U901 TCM9000MD

DCLK HSYNC VSYNC DATA0 DATA1 DATA2 DATA3 DATA4 DATA5 DATA6 DATA7 GND1 GND2 GND3 GND4

A3 D1 D2 B3 B1 B2 B4 C1 C2 C3 D4 A4 C4 E2 E3

R904

51

CI_PCLK CI_HSYNC CI_VSYNC CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7]

conn_axk7l10225
CN400 G1 G2 1 2 3 4 5 G3 G4 10 9 8 7 6

TOUCH_Y+ TOUCH_X+

TOUCH_XTOUCH_Y-

C901 0.1u

C900 0.1u

C913 0.1u

F1

PGND

A5 VDD15_1 E4 VDD15_2

11

12

LGE Internal Use Only

- 188 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA Pin Map

8. BGA Pin Map


DB3200 ( Digital BB)

: NC pin

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 189 -

LGE Internal Use Only

8. BGA Pin Map

AB3100 (Analog Baseband)

: NC pin

LGE Internal Use Only

- 190 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA Pin Map

MCP (2G NAND / 1G SDRAM)

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 191 -

LGE Internal Use Only

8. BGA Pin Map

RF3300

LGE Internal Use Only

- 192 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA Pin Map

Bluetooth STLC2593

Top View

NC pin

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 193 -

LGE Internal Use Only

8. BGA Pin Map

GPS BCM4750 Top View

TCK

TDO

TDI

VSSD3

SYNC_PPS

INTR_N

VDDIO3

TRST_N

VDDIO1

BMS0

VDDCORE2

VDDCORE4

VDDLP_LPREGOUT

TX_SDA_MISO

TMS

VSSD1

BMS2_UARTCS_N

VPD

VSSD5

RTCCLK

RTS_N_I2C_GRP0_MOSI

BBREGOUT

BMS1_I2C_A0

BBRFREGIN

VDDCORE1

VSSD4

VSSD6

RESET_N

LPREGIN

VSSIFSUB

ATEST1

VSSD2

VDDCORE3

STANDBY_N

VDDIO2

TCXO

ATEST0

VDDRF

RFREGOUT

CNTIN

RX_SCL_SCK

RFIN

VSSRFSYNTH

VDDIFSYNTH

RFSREGOUT

TESTMODE

CTS_N_I2C_GRP1_SCS_N

Not use

LGE Internal Use Only

- 194 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

U404 Touch Level shifter No touch operation S400 SD card socket No SD card operation U405 Touch screen driver IC No touch operation U406 LDO for touch No touch operation U602 ISP chipset No 5M camera U603 LDO for ISP No 5M camera U601 LDO for camera No VGA camera No 5M camera FL501 EMI/ESD lter No UART communication No download

U400 Motor Amp No motor operation

U402 LDO for Motor No Motor operation

U403 MicroSD level shifter No SD card operation U401 3-Axis sensor No 3-Axis sensor operation

U102 WCDMA band I PA No service U107 WCDMA band VIII PA No service U109 DC/DC converter No service

X100 26M Crystal No booting No service U111 RFIC No service U101 FEM + GSM PA No service

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 195 -

LGE Internal Use Only

9. PCB LAYOUT

CN603 5M camera Con. No 5M camera U502 USB transceiver No download No data service U200 Memory No booting U201 DBB No booting No service No display

CN503 VGA FPCB Con. No VGA camera No touch operation No sound

CN500 5Pin Micro USB Con. No Charging No headset No download

U500 OVP IC No charging U501 MUIC No download No headset

CN601 60Pin Sub Con. No SIM No GPS operation No Wi-Fi operation No BT operation No FM radio operation No Flash

SW100 No service

U301 Audio Amp No Sound SW101 No service

U600 LDO for LCD No display CN604 50Pin Con. No display No keypad input No power on No mic input

U300 PMIC No power on No service No charging No sound

X300 crystal No power on

U604 Backlight charge pump No display

LGE Internal Use Only

- 196 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

X750 TCXO for GPS No GPS CN750/CN751 GPS ant. pad No GPS

LD800 No ash

U800 bust converter No ash

CN801 Motor pad No motor operation

U770 GPS LNA No GPS U751 GPS IC No GPS

ANT780 No BT connection No Wi-Fi service U731 BT+FM radio IC No BT connection No FM radio

M710 Wi-Fi Module No wi-service

J800 SIM socket No SIM

CN800 60Pin Sub Con. No SIM No GPS operation No Wi-Fi operation No BT operation No FM radio operation No Flash

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 197 -

LGE Internal Use Only

9. PCB LAYOUT

CN2 50Pin Con. No display No keypad input No power on No mic input

LD1001 No power on

MIC100 No mic

SW100 No service

LGE Internal Use Only

- 198 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

CN1 40Pin Con. No display

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 199 -

LGE Internal Use Only

9. PCB LAYOUT

CN400 touch con. No touch operation

CN901 VGA FPCB Con. No VGA camera No touch operation No sound

U901 VGA camera No VGA operation

LGE Internal Use Only

- 200 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

CN902 speaker pad No sound

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 201 -

LGE Internal Use Only

LGE Internal Use Only

- 202 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. CALIBRATION

10. CALIBRATION
10.1 General Description
This document describes the installation and software usage for the calibration of LGs GSM/GPRS/EDGE/WCDMA Multimedia Mobile Phone. The calibration menu and its result is displayed in PC terminal by Mobile phone.

10.2 Environment
10.2.1 H/W Environment
- PC with RS-232 Interface & GPIB card installed - GSM/GPRS/EDGE/WCDMA Multimedia Mobile Set - Agilent 8960 Series 10 E5515C Instrument (E1987A above version A.05.28) - Tektronix PS2521G Power Supply or Agilent A66311B - ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery)

10.2.2 S/W Environment


- National Instrument GPIB & VISA (version 2.60 full) driver install - Agilent 8960 VXI driver(E1960) install - HotKimchi EXE files - OS : Window98, Window2000, WindowXP

10.2.3 Configuration Diagram of Calibration Environment

KF757

Figure 10-1. Calibration Configuration

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 203 -

LGE Internal Use Only

10. CALIBRATION

10.3 Calibration Environment


Ensure that the following conditions are maintained throughout the duration of the tests and calibrations described within this document.

Parameter Temperature Relative Humidity Vbatt Supply current

Min 15 20 3.6 0

Typical 25 40 3.7

Max 30 75 3.8 3

Unit C % V A

Table 10-1. Nominal Environmental Test Conditions

LGE Internal Use Only

- 204 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. CALIBRATION

10.4 Program Operation


10.4.1 HotKimchi Program Overview
When trying to calibrate the mobile phone, the service engineers make a configuration of calibration environment like Figure10-1. And if you finish making configuration, please execute the HotKimchi program. See Figure 10-2. HotKimchi supports following functions. - Calibration of GSM850/900/1800/1900, WCDMA 2100/900 - Instrument (Agilent8960, Tektronix PS2521G) control - UART communication with mobile phone

GT500

Figure 10-2. HotKimchi Window

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 205 -

LGE Internal Use Only

10. CALIBRATION

10.4.2 SETTING
Select a Ezlooks menu.

Select OFF-LINE in the EZLOOKS Mode.

LGE Internal Use Only

- 206 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. CALIBRATION

Select a Line System menu.

Select MANUAL in the RUN MODE. Select NO in the MULTI CAL SYSTEM.

GT500

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 207 -

LGE Internal Use Only

10. CALIBRATION

Select a Logic Operation menu.

Select LOGIC MODE that you want. 1. CAL only 2. AUTO only 3. CAL + AUTO Select UART Port for only S/B1 to communicate with mobile phone.

GT500

LGE Internal Use Only

- 208 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. CALIBRATION

10.4.3 Calibration Procedure


Select a model name GT500. Click the START button.

GT500

RF Calibration steps as follow : DCS PCS PCS GSM850 WCDMA2100 WCDMA900 When RF calibration is finished, the result of judgment will be displayed.

GT500

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 209 -

LGE Internal Use Only

LGE Internal Use Only

- 210 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST


11.1 EXPLODED VIEW

60 67 31 30

26 25 20 18 19 63

27

28 29 32 64

4 5 1

9 33

14 63

65

2 59 17 16 10 11 68 61 21 22 40 39 8 50 38 35 36 34 51 37 66 6 47 45 48 46 55 12 41 42 44 43 52 53 56 57 15 58 3 7

13 24

49 54

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 211 -

LGE Internal Use Only

ASSY EXPLODED VIEW

D F

A B E

F E D C B A

LGE Internal Use Only

- 212 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts


<Mechanic component>
Level Location No. AAAY00 Description Part Number

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Spec

Color WITHOUT COLOR

Remark

ADDITION

AAAY0395901

AMBA00

MANUAL ASSY,OPERATION

AMBA0155801

GT500 manual assy for TMU

WITHOUT COLOR SILVER SNOW WITHOUT COLOR BLACK WITHOUT COLOR BLACK WITHOUT COLOR WITHOUT COLOR Without Color Without Color BLACK F, 7 D, 12

MCHZ00

COMPACT DISK

MCHZ0078101

COMPLEX, (empty), , , , ,

MMBB00

MANUAL,OPERATION

MMBB0343001

PRINTING, (empty), , , , ,

APKA00

PEN ASSY,STYLUS

APKA0001101

MBAD00

BAG,VINYL(PE)

MBAD0008404

COMPLEX, (empty), , , , ,

MCJA00

COVER,BATTERY

MCJA0082401

MOLD, PC LUPOY SC-1004A, , , , ,

MPHY00

PROTECTOR

MPHY0016901

COMPLEX, (empty), , , , , GT500 TMU(TR1/3018&4541 LB/WD-9501/Angle/PLB2ea/Seal/Bag) TR1 Angle Palletizing (Angle/WD-9501/400ea)

APAY00

PACKAGE

APAY0131205

APLY00

PALLET ASSY

APLY0002303

MCJZ00

COVER

MCJZ0030520

COVER(for TR 1 Angle_COVER_GSM)

4 3

MPCY00 BSEA00

PALLET SUPPLEMENTARY PART

MPCY0009501 BSEA0003901

PALLET(G7100 for Orange UK_EUR) PACKING-LIST ENVELOPE

MBAD00

BAG,VINYL(PE)

MBAD0005204

COMPLEX, (empty), , , , ,

Without Color Without Color Without Color Without Color WITHOUT COLOR WITHOUT COLOR Red

MLAC00

LABEL,BARCODE

MLAC0004541

PRINTING, (empty), , , , ,

MLAC01

LABEL,BARCODE

MLAC0003018

PRINTING, (empty), , , , ,

MLAJ00

LABEL,MASTER BOX

MLAJ0004402

LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label)

MLAZ

LABEL

MLAZ0048203

PRINTING, (empty), , , , ,

MLAZ00

LABEL

MLAZ0050901

PRINTING, (empty), , , , ,

MPAE00

PACKING,BLISTER

MPAE0007803

COMPLEX, (empty), , , , ,

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 213 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 2 3 4

Location No. APEY00 ACGM00 MCCE00 PHONE

Description

Part Number APEY0750101 ACGM0129501 MCCE0049201

Spec

Color BLACK BLACK

Remark

COVER ASSY,REAR CAP,RECEPTACLE

C 54

MOLD, PC LUPOY SC-1004A, , , , ,

BLACK WITHOUT COLOR BLACK BLACK BLACK WITHOUT COLOR BLACK WITHOUT COLOR BLACK WITHOUT COLOR BLACK BLACK BLACK BLACK WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR BLACK BLACK SILVER BLACK

MCCF00

CAP,MOBILE SWITCH

MCCF0060901

COMPLEX, (empty), , , , ,

4 4 4

MCCG00 MCJN00 MDAD00

CAP,MULTIMEDIA CARD COVER,REAR DECO,CAMERA

MCCG0019101 MCJN0098701 MDAD0045101

MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , ELECTROFORMING, Cu, , , , ,

52 53 58

MGAD01

GASKET,SHIELD FORM

MGAD0197801

COMPLEX, (empty), , , , ,

46

MHCY00

HANGER

MHCY0003101

MOLD, Urethane Rubber S195A, , , , ,

44

MLAB03

LABEL,A/S

MLAB0003601

COMPLEX, (empty), , , , ,

MLCE00

LENS,FLASH

MLCE0012701

MOLD, PMMA HI835M, , , , ,

48

MPBF00

PAD,FLEXIBLE PCB

MPBF0041401

COMPLEX, (empty), , , , ,

41

4 4 4 4

MPBJ00 MPBT00 MPBZ00 MPBZ01

PAD,MOTOR PAD,CAMERA PAD PAD

MPBJ0062001 MPBT0072101 MPBZ0225101 MPBZ0228201

COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

43 49 47 45

MTAA00

TAPE,DECO

MTAA0188101

COMPLEX, (empty), , , , ,

57

MTAB00

TAPE,PROTECTION

MTAB0332701

COMPLEX, (empty), , , , ,

66

MTAK00

TAPE,CAMERA

MTAK0024701

COMPLEX, (empty), , , , ,

56

4 3 4 4 5 5 5 5

MWAE00 ACGV00 ABGF00 ACGK00 MBJL00 MBJL01 MCJK01 MDAG01

WINDOW,CAMERA COVER ASSY,BAR BUTTON ASSY,MAIN COVER ASSY,FRONT BUTTON,SIDE BUTTON,SIDE COVER,FRONT DECO,FRONT

MWAE0045001 ACGV0004301 ABGF0012901 ACGK0130701 MBJL0081801 MBJL0081701 MCJK0102001 MDAG0046701

CUTTING, PMMA MR 200, , , , ,

13 A 3

MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , ,

BLACK BLACK BLACK SILVER

15 14 9 4

LGE Internal Use Only

- 214 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 5 5

Location No. MDAK01 MFBC01

Description DECO,REAR FILTER,SPEAKER

Part Number MDAK0018001 MFBC0048501

Spec MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , ,

Color BLACK BLACK WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR

Remark 11 20

MFBD01

FILTER,MIKE

MFBD0038201

COMPLEX, (empty), , , , ,

17

MPBT01

PAD,CAMERA

MPBT0075501

COMPLEX, (empty), , , , ,

19

MPBU01

PAD,CONNECTOR

MPBU0063501

COMPLEX, (empty), , , , ,

18

MTAA01

TAPE,DECO

MTAA0187401

COMPLEX, (empty), , , , ,

10

MTAB01

TAPE,PROTECTION

MTAB0299601

COMPLEX, (empty), , , , ,

MTAB02

TAPE,PROTECTION

MTAB0336001

COMPLEX, (empty), , , , ,

68

MTAK01

TAPE,CAMERA

MTAK0024601

COMPLEX, (empty), , , , ,

63

ADBY00

DECO ASSY

ADBY0015001

MBFZ00

BRACKET

MBFZ0035501

CUTTING, STS, , , , ,

WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR BLACK WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR BLACK

22

MTAD00

TAPE,WINDOW

MTAD0109001

COMPLEX, (empty), , , , ,

21

AFBZ00

FRAME ASSY

AFBZ0012701

LCD BRACKET assy

MBFF00

BRACKET,LCD

MBFF0024501

PRESS, STS, , , , ,

28

MGAD00

GASKET,SHIELD FORM

MGAD0198601

COMPLEX, (empty), , , , ,

64

MTAA00

TAPE,DECO

MTAA0197401

COMPLEX, (empty), , , , ,

62

MTAA01

TAPE,DECO

MTAA0200001

COMPLEX, (empty), , , , ,

32

4 5 5

AHCZ00 MDAH00 MPBN00

HOLDER ASSY DECO,RECEIVER PAD,SPEAKER

AHCZ0002101 MDAH0025801 MPBN0068601 MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , 1.4 mm,1.8 mm,SWCH18A ,N ,+ , ,; ,[empty] ,+ , , ,CR-7 ,WHITE ,[empty] ,[empty] COMPLEX, (empty), , , , ,

BLACK BLACK WHITE SILVER WITHOUT COLOR BLACK

31 30

GMEY00

SCREW MACHINE,BIND

GMEY0019201

29

MGAD00

GASKET,SHIELD FORM

MGAD0196901

59

MPBG01

PAD,LCD

MPBG0089501

COMPLEX, (empty), , , , ,

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 215 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. MPBG02

Description

Part Number

Spec

Color WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR BLACK WITHOUT COLOR WITHOUT COLOR BLACK

Remark

PAD,LCD

MPBG0096401

COMPLEX, (empty), , , , ,

61

MTAA00

TAPE,DECO

MTAA0202201

COMPLEX, (empty), , , , ,

67

MTAB01

TAPE,PROTECTION

MTAB0299901

COMPLEX, (empty), , , , ,

2, 16

MTAB02

TAPE,PROTECTION

MTAB0333101

COMPLEX, (empty), , , , ,

65

MTAC01

TAPE,SHIELD

MTAC0091301

COMPLEX, (empty), , , , ,

60

MWAC01

WINDOW,LCD

MWAC0114501

CUTTING, Tempered Glass, , , , ,

GMEY

SCREW MACHINE,BIND

GMEY0011201

1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK

E, 24

MLAA00

LABEL,APPROVAL

MLAA0062304

COMPLEX, (empty), , , , ,

5 6 6 6

AFBA00 MFEA00 MPBU00 MTAF00

FRAME ASSY,SHIELD FRAME,SHIELD PAD,CONNECTOR TAPE,MOTOR

AFBA0012001 MFEA0027701 MPBU0063301 MTAF0025201 MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

BLACK BLACK BLACK WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR WITHOUT COLOR BLACK BLACK WITHOUT COLOR

38 37

AFBA01

FRAME ASSY,SHIELD

AFBA0013901

GT505 SHIELD CAN COVER ASSY

MCBA00

CAN,SHIELD

MCBA0043301

PRESS, STS, , , , ,

34

MGAD00

GASKET,SHIELD FORM

MGAD0200401

COMPLEX, (empty), , , , ,

MPBU00

PAD,CONNECTOR

MPBU0063201

COMPLEX, (empty), , , , ,

50

7 7

MPBU01 MTAC00

PAD,CONNECTOR TAPE,SHIELD

MPBU0063401 MTAC0087801

COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

MLAZ00

LABEL

MLAZ0038301

PID Label 4 Array

LGE Internal Use Only

- 216 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts


<Main component>
Level 1 4 SNGF00 Location No. Description IMT,BAR/FLIP ANTENNA,GSM,FIXED Part Number TIMT0005201 SNGF0046101

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Spec

Color BLACK

Remark

3.0 ,-2.0 dBd, ,GPS, FPCB ,; ,SINGLE ,-2.0 ,50 ,3.0 3.0 ,-2.0 dBd, ,GSM850/GSM900/DCS/PCS/Band1/Band8, INTERNAL ,; ,MULTI ,-2.0 ,50 ,3.0

SNGF01

ANTENNA,GSM,FIXED

SNGF0046203

4 5

SACY00 SACE00

PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,FLEXIBLE,SMT TOP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD CAMERA PCB,FLEXIBLE PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM CONNECTOR,BOARD TO BOARD PCB ASSY,FLEXIBLE,SMT TOP CAP,CERAMIC,CHIP CAP,CHIP,MAKER

SACY0090901 SACE0083501

SACC00

SACC0058701

7 7 7 7 7

C900 C901 C913 R904 R910

ECZH0003103 ECZH0003103 ECZH0003103 ERHZ0000490 ERHZ0000483

0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP

SACD00

SACD0071701

CN400

ENBY0018601

10 PIN,.4 mm,STRAIGHT , ,H=0.9, SOCKET

CN901

ENBY0040201

34 PIN,0.4 mm,ETC , ,H=1.0, Plug

7 6 4 5

U901 SPCY00 SACY01 SACE00

SVCY0019901 SPCY0175001 SACY0091001 SACE0083601

CMOS ,VGA ,Toshiba(1/10"), 4x4x2.23t, Reflow Type POLYI ,0.3 mm,MULTI-3 , ,; , , , , , , , , ,

SACC00

SACC0059001

CN1

ENBY0036001

40 PIN,0.4 mm,ETC , ,H=1.0, Socket

SACD00

SACD0071801

7 7

C1000 C1002

ECCH0000122 ECZH0000802

47 pF,50V,J,NP0,TC,1005,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 217 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. CN2

Description CONNECTOR,BOARD TO BOARD DIODE,SWITCHING

Part Number

Spec 50 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT ,MALE ,SMD ,P/TR , , EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) UNIT ,-42 dB,3.76*2.95*1.1 ,mems smd mic ,; , , ,OMNI ,[empty] , ,[empty] 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 1.5 nH,J ,1005 ,R/TP , 0 ohm,1/16W ,J ,1005 ,R/TP 15 V,20 mA,HORIZONTAL ,1 G, ,; ,1C1P ,[empty] ,[empty] ,[empty] , ,[empty] ,SMD , dB, POLYI ,0.3 mm,MULTI-3 , ,; , , , , , , , , , ASSY ,8 ohm,90 dB,1812 mm,10mm ,; , , , , , , ,[empty] Main ,3.0 inch ,240*400 ,74.9*44.88*2.0t ,262K ,TFT ,TM ,NEC(uPD161710) , , 65 mm, LINE, ,; ,[empty] ,[empty] ,[empty] , ,[empty] , ,[empty]

Color

Remark

ENBY0042001

D1000

EDSY0011901

7 7 7 7

LD1000 LD1001 LD1002 LD1003

DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP

EDLH0011901 EDLH0011901 EDLH0011901 EDLH0011901

MIC100

MICROPHONE

SUMY0010609

7 7 7 7

R123 R3 R4 R6

RES,CHIP,MAKER RES,CHIP,MAKER INDUCTOR,CHIP RES,CHIP,MAKER

ERHZ0000401 ERHZ0000401 ELCH0004726 ERHZ0000401

SW1000

SWITCH,TACT

ESCY0006101

7 6 4

SW1001 SPCY SUSY00

CONN,RF SWITCH PCB,FLEXIBLE SPEAKER

ENWY0003901 SPCY0174901 SUSY0027506

SVLM00

LCD MODULE

SVLM0035301

SWCC00

CABLE,COAXIAL

SWCC0006501

3 4 5 5

SAFY00 SAFB00 BRAH00 SACY00

PCB ASSY,MAIN PCB ASSY,MAIN,INSERT RESIN,PC PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,INSERT PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM ANTENNA,GSM,FIXED

SAFY0316001 SAFB0103801 BRAH0001301 SACY0090801 ; , , , ,[empty] Black

SACB00

SACB0056001

SACE00

SACE0083401

SACC00

SACC0058601 3.0 ,-2.0 dBd, ,BLUETOOTH, SMD, 3.2*1.6*1.2 ,; ,SINGLE ,-2.0 ,50 ,3.0

ANT780

SNGF0046501

LGE Internal Use Only

- 218 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. BAT800

Description

Part Number

Spec 2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free 0 ohm,1/16W ,J ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 4 pF,50V,C,NP0,TC,1005,R/TP 4 pF,50V,C,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 22 pF,50V,J,NP0,TC,1005,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP

Color

Remark

BATTERY,CELL,LITHIUM

SBCL0001701

8 8 8 8 8 8 8 8

C700 C701 C702 C705 C706 C707 C710 C711

RES,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

ERHZ0000401 ECZH0000813 ECZH0000802 ECCH0000105 ECCH0000105 ECCH0004904 ECCH0004904 ECCH0004904

C712

CAP,CERAMIC,CHIP

ECCH0005604

C713

CAP,CERAMIC,CHIP

ECCH0000115

C714

CAP,CERAMIC,CHIP

ECCH0005604

C715

CAP,CERAMIC,CHIP

ECCH0004904

C716

CAP,CERAMIC,CHIP

ECCH0005604

8 8 8 8 8 8 8 8 8 8 8 8 8 8

C717 C718 C719 C720 C721 C722 C723 C724 C730 C731 C732 C733 C734 C735

CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER

ECZH0000813 ECCH0004904 ECZH0003103 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECZH0003103 ECCH0007802 ECZH0000813 ECZH0003103 ECZH0003103 ECZH0003103

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 219 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Location No. C736 C737 C738 C739 C740 C741 C742 C743 C750 C751 C752 C753 C754 C755 C756 C758 C759 C760 C761 C762 C763 C764 C765 C766 C770 C771 C772 C800 C801 C802

Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP INDUCTOR,CHIP CAP,CHIP,MAKER INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER

Part Number ECZH0003103 ECCH0004904 ECCH0004904 ECZH0003103 ECCH0000179 ECCH0000179 ECCH0000110 ECCH0000129 ECCH0000198 ECZH0003103 ECCH0004904 ECZH0003103 ECCH0000198 ELCH0004721 ECZH0001002 ELCH0004727 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000198 ECZH0003103 ECZH0000813 ECCH0005603 ECCH0000163 ECZH0000830

Spec 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 120 pF,50V,J,NP0,TC,1005,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 2.2 nH,S ,1005 ,R/TP , 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 100 nH,J ,1005 ,R/TP , 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

Color

Remark

LGE Internal Use Only

- 220 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 8 8 8 8 8 8

Location No. C803 C804 C805 C807 CN750 CN751

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CONNECTOR,ETC CONNECTOR,ETC CONNECTOR,BOARD TO BOARD FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP

Part Number ECCH0000115 ECCH0004904 ECZH0000830 ECCH0000198 ENZY0018801 ENZY0018801

Spec 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP PIN, mm,ETC , ,RCS=1.35 PIN, mm,ETC , ,RCS=1.35 60 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT ,MALE ,SMD ,[empty] , , 600 ohm,1005 , 600 ohm,1005 , 60 ohm,1005 , 800 , MHz,0.3 dB,30 dB,25000 , MHz,0.3 dB,32 dB,SMD ,ETC ,2.5x2.5x0.75 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW 6 PIN,ETC , ,2.54 mm,H=1.5 6.8 nH,J ,1005 ,R/TP ,Pb Free 2.2 nH,S ,1005 ,R/TP , 10 nH,J ,1005 ,R/TP ,PBFREE 100 nH,J ,1005 ,R/TP , 1 uH,N ,2.5x2.0x1.2 ,R/TP ,MLCI,power inductor ,; ,1uH ,30% ,; ,; ,; ,; ,; ,[empty] ,2.5X2MM ,[empty] ,[empty] ,Inductor,Wire Wound,Chip WHITE ,1 LED,3.5X2.8X0.6T ,R/TP , WiFi Module(Marvell8686), 8.2x8.4x1.0 ,; ,WLAN 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/10W ,J ,1608 ,R/TP 33 ohm,1/16W ,J ,1005 ,R/TP

Color

Remark

CN800

ENBY0045401

8 8 8

FB710 FB711 FB730

SFBH0008101 SFBH0008101 SFBH0000909

FL700

FILTER,SEPERATOR,SPDT

SFAC0002101

8 8 8 8 8 8

FL730 J800 L750 L770 L771 L772

FILTER,SAW CONN,SOCKET INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP

SFSY0027301 ENSY0018101 ELCH0001408 ELCH0005001 ELCH0001041 ELCH0004727

L800

INDUCTOR,SMD,POWER

ELCP0008009

8 8 8 8 8 8 8 8 8 8

LD800 M710 R710 R711 R713 R714 R715 R716 R717 R730

DIODE,LED,MODULE MODULE,ETC RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

EDLM0009401 SMZY0022701 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000401 ERHZ0000701 ERHZ0000463

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 221 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Location No. R731 R732 R734 R735 R737 R738 R739 R740 R741 R742 R750 R752 R753 R754 R755 R756 R757 R770 R772 R780 R781 R801 R803 R805 R806 R807 R814

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER INDUCTOR,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

Part Number ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000401 ERHZ0000401 ERHZ0000406 ERHZ0000408 ERHZ0000401 ERHZ0000408 ERHZ0000401 ERHZ0000401 ERHZ0000402 ERHZ0000463 ERHZ0000406 ERHZ0000401 ERHZ0000406 ERHZ0000401 ERHZ0000206 ERHZ0000401 ELCH0004704 ERHZ0000401 ERHZ0000238 ERHZ0000405 ERHZ0000401 ERHZ0000406 ERHZ0000406 ERHZ0000701

Spec 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 110 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 110 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 33 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,F ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 4.7 nH,S ,1005 ,R/TP , 0 ohm,1/16W ,J ,1005 ,R/TP 200 Kohm,1/16W ,F ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/10W ,J ,1608 ,R/TP DFN1612-4B ,4 ,R/TP ,300mA 3.3V LDO ,; ,IC,LDO Voltage Regulator DFN1612-4B ,4 ,R/TP ,300mA 1.8V LDO ,; ,IC,LDO Voltage Regulator

Color

Remark

U710

IC

EUSY0367001

U711

IC

EUSY0366901

LGE Internal Use Only

- 222 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 8

Location No. U730 IC

Description

Part Number EUSY0245902

Spec DRL ,5 PIN,R/TP ,SINGLE,BUFFER,3STATE,1.7X1.7 WFBGA ,100 PIN,R/TP ,Bluetooth+FM 5*7.5*0.8 ,; ,IC,Bluetooth SOT553-5 ,5 ,R/TP ,1.6X1.6 , SINGLE,BUFFER,Noninverting,3STATE,High active ,; ,IC,Buffer WLBGA ,81 ,R/TP ,Pb-free_GPS IC ,; ,IC,GPS DFN1612-4B ,4 ,R/TP ,300mA 1.8V LDO ,; ,IC,LDO Voltage Regulator LNA Module(GPS LNA+B/P Filter) ,; ,RF Module DFN ,14 PIN,R/TP ,700mA Boost converter ,; ,IC,DC,DC Converter 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 16.369 MHz,0.5 PPM,10 pF,SMD ,25X20X0.8 ,Sirf GPS chip clock, 16.369MHz, 1.7~3.5V, Pb-Free ,; ,16.369MHz ,[empty] ,1.8V , , , , ,SMD ,R/TP POLYI ,0.33 mm,BUILD-UP 4 , ,; , , , , , , , , ,

Color

Remark

U731

IC

EUSY0358701

U750

IC

EUSY0149403

U751

IC

EUSY0380101

U752

IC

EUSY0366901

U770

MODULE,ETC

SMZY0016502

U800

IC

EUSY0264502

8 8 8 8 8

VA800 VA801 VA802 VA806 VA807

VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR

SEVY0004001 SEVY0004001 SEVY0004001 SEVY0001001 SEVY0001001

X750

TCXO

EXST0002001

SPCY

PCB,FLEXIBLE

SPCY0171401

SJMY00

VIBRATOR,MOTOR

SJMY0007112

2 V,40 mA,10*3.0 ,Quick response 17mm ,; ,3V , , , , , , , CMOS ,MEGA ,5M AF [FPCB, Sony 5M 1/3.2"(IMX034), CCP2]

SVCY00

CAMERA

SVCY0017301

SAFF00

PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP

SAFF0229201

SAFC00

SAFC0125301

6 6 6 6 6 6 6 6

C125 C200 C201 C202 C203 C204 C205 C206

ECCH0000115 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0000143 ECZH0003103 ECZH0003103 ECCH0004904

22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 223 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C207 C208 C209 C210 C211 C212 C213 C214 C215 C216 C217 C218 C219 C220 C221 C222 C223 C224 C225 C226 C227 C228 C229 C230 C231 C232 C233 C234 C235 C236

Description CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER

Part Number ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0004904 ECCH0000161 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0004904 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103

Spec 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP

Color

Remark

LGE Internal Use Only

- 224 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C237 C238 C239 C240 C241 C300 C301 C302 C303 C304 C305 C306 C307 C308 C309 C310 C311 C312 C314

Description CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER

Part Number ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0004904 ECZH0003103 ECCH0006201 ECCH0000198 ECCH0000198 ECCH0000198 ECCH0006201 ECCH0006201 ECCH0000198 ECCH0004904 ECCH0004904 ECCH0006201 ECCH0004904 ECCH0004904 ECZH0003103

Spec 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP

Color

Remark

C315

CAP,CERAMIC,CHIP

ECCH0005604

C317

CAP,CERAMIC,CHIP

ECCH0005604

C318

CAP,CERAMIC,CHIP

ECCH0005604

6 6 6 6 6 6 6

C319 C320 C321 C323 C325 C326 C327

CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER

ECZH0003103 ECCH0000115 ECCH0000115 ECCH0004904 ECZH0003103 ECZH0003103 ECZH0003103

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 225 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6

Location No. C328 C329 C330

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0000115 ECCH0000115 ECCH0000115

Spec 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 33 uF,10V ,M ,STD ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 3.3 nF,50V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 18000 pF,16V ,K ,X7R ,HD ,1005 ,R/TP 18000 pF,16V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

C331

CAP,TANTAL,CHIP

ECTH0005203

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

C332 C333 C334 C335 C336 C337 C338 C339 C340 C341 C342 C343 C344 C345 C346 C347 C348 C349 C352 C353 C354 C500 C501 C503 C504

CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

ECZH0001215 ECZH0001215 ECZH0003103 ECCH0000115 ECCH0004904 ECCH0000115 ECCH0004904 ECCH0004904 ECCH0002002 ECCH0000149 ECCH0004904 ECZH0001102 ECZH0001102 ECCH0004904 ECZH0003103 ECCH0004904 ECZH0003103 ECZH0003103 ECCH0000115 ECCH0000115 ECCH0004904 ECZH0003103 ECCH0007802 ECCH0004904 ECCH0004904

LGE Internal Use Only

- 226 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6

Location No. C505 C506 C507 C508 C509

Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECZH0003103 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0007802

Spec 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 1000000 pF,50V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm 22 pF,50V,J,NP0,TC,1005,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 220 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

C510

CAP,CERAMIC,CHIP

ECCH0000391

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

C511 C512 C513 C514 C515 C516 C517 C523 C525 C601 C602 C603 C604 C605 C607 C621 C622 C625 C626 C631 C632 C633 C634

CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER

ECCH0000115 ECCH0006201 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0006201 ECCH0000198 ECZH0003103 ECZH0003103 ECCH0004904 ECCH0004904 ECCH0004904 ECZH0001215 ECZH0001215 ECZH0003103 ECCH0000133 ECCH0000198 ECCH0000163 ECCH0000163 ECCH0000115 ECZH0001215 ECZH0001215 ECZH0001215

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 227 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6

Location No. C635 CN300 CN500

Description CAP,CHIP,MAKER CONNECTOR,ETC BRACKET

Part Number ECZH0001215 ENZY0023701 MBFZ0033201

Spec 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 3 ,2.5 mm,ETC ,- ,PRESS, STS, , , , , 5 , mm,ANGLE , , ,; , ,0.64MM ,ANGLE ,[empty] ,DIP ,[empty] , 34 PIN,0.4 mm,ETC , ,H=1.0, Socket 60 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT ,FEMALE ,SMD ,[empty] , , 24 PIN,0.4 mm,ETC , ,GB042 H=1.0, Socket 50 PIN,0.4 mm,STRAIGHT , ,H=1.0,SOCKET ,; , ,0.40MM ,STRAIGHT ,FEMALE ,SMD ,P/TR , , EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) TUMD2 ,30 V,1 A,R/TP , ,; ,1A ,30V , ,5A , , ,[empty] ,[empty] ,2P ,1 SMT ,20 V,200 A,R/TP , DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE 120 ohm,1608 ,CHIP BEAD, 2000mA 1800 ohm,1005 ,Bead 1800 ohm,1005 ,Bead 1800 ohm,1005 ,Bead 10 ohm,1005 ,Ferrite Bead 10 ohm,1005 ,Ferrite Bead 1800 ohm,1005 ,Bead 1800 ohm,1005 ,Bead SMD ,3 TERMINAL EMI FILTER SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 50ohm SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 50ohm SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 50ohm SMD ,Pb-free_Common mode filter ,; ,Filter,LCR 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

Color

Remark

Silver

CN501

CONNECTOR,I/O CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD DIODE,SWITCHING

ENRY0008801

CN503

ENBY0040301

CN601

ENBY0045501

CN603

ENBY0034201

CN604

ENBY0041901

D300

EDSY0011901

D301

DIODE,SWITCHING

EDSY0018401

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

D302 D600 D603 FB300 FB500 FB501 FB502 FB601 FB602 FB604 FB605 FL500 FL600 FL601 FL602 FL603 L102

DIODE,SWITCHING DIODE,TVS DIODE,TVS FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER CAP,CHIP,MAKER

EDSY0014001 EDTY0008606 EDTY0008606 SFBH0002302 SFBH0008102 SFBH0008102 SFBH0008102 SFBH0007102 SFBH0007102 SFBH0008102 SFBH0008102 SFEY0006501 SFEY0013101 SFEY0013101 SFEY0013101 SFEY0015601 ECZH0000813

LGE Internal Use Only

- 228 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6

Location No. L300 L500 L600

Description INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,CHIP

Part Number ELCP0009401 ELCH0004202 ELCH0004722

Spec 4.7 uH,M ,2.8*2.6*1.0 ,R/TP , 82 nH,J ,1608 ,R/TP , 47 nH,J ,1005 ,R/TP , SC70-6 ,6.5 W,-20 V,-4.5 A,R/TP ,P channel FET ,; ,PCHANNEL ,MOSFET ,-20 ,8 ,-4.5 ,0.153 ,6.5 ,SC70 ,R/TP ,6P SOT-23 ,0.15 W,R/TP ,EMT3 3300 ohm,1/16W ,F ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP

Color

Remark

Q300

TR,FET,P-CHANNEL

EQFP0009101

6 6 6 6 6 6 6 6 6 6 6 6 6

Q501 R200 R202 R203 R204 R205 R206 R207 R208 R211 R212 R213 R214

TR,BJT,NPN RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD OPEN

EQBN0007601 ERHZ0000267 ERHZ0000405 ERHZ0000443 ERHZ0000406 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000465

R215

SAFP0000501

R216

SAFP0000501

R295

SAFP0000401

R299

SAFO0000401

0OHM DNI

6 6

R300 R301

RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT

ERHZ0000204 ERHZ0000406

100 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP

R304

SAFP0000501

R305

SAFP0000501

R306

SAFP0000501

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 229 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. R308

Description PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER

Part Number

Spec

Color

Remark

SAFP0000501

R310

SAFP0000501

R311

ERHZ0000485

4700 ohm,1/16W ,J ,1005 ,R/TP

R312

SAFP0000501

R313

ERHY0000193

27 ohm,1/16W ,F ,1005 ,R/TP

R314

SAFP0000501

R316

ERHZ0003901

0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012 ,R/TP

6 6 6 6 6 6 6 6

R317 R319 R320 R321 R322 R323 R324 R500

CAP,CERAMIC,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT

ECCH0004904 ERHZ0000449 ERHZ0000265 ERHZ0000406 ERHY0000181 ERHY0000181 ERHY0017201 ERHZ0000493

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 24 Kohm,1/16W ,J ,1005 ,R/TP 300 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 15 ohm,1/16W ,F ,1005 ,R/TP 15 ohm,1/16W ,F ,1005 ,R/TP 0.025 ohm,1/4W ,F ,2012 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP

R501

SAFP0000401

R502

SAFP0000401

R503

SAFP0000401

6 6 6 6 6 6

R504 R505 R506 R509 R510 R511

ERHZ0000443 ERHZ0000402 ERHZ0000402 ERHZ0000404 ERHZ0000212 ERHZ0000443

2200 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 12 Kohm,1/16W ,F ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP

R600

SAFP0000501

LGE Internal Use Only

- 230 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. R601

Description PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD OPEN

Part Number

Spec

Color

Remark

SAFP0000501

6 6 6 6 6

R603 R604 R607 R609 R610

ERHZ0000405 ERHZ0000405 ERHZ0000405 ERHY0000254 ERHZ0000405

10 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 4.7K ohm,1/16W,J,1005,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP

R620

SAFP0000501

R621

SAFP0000501

6 6 6 6

R622 R626 R627 R628

ERHZ0000406 ERHY0003301 ERHY0003301 ERHZ0000405

100 Kohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP

R629

SAFP0000501

R630

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

R631

SAFP0000401

R638

SAFP0000501

R639

SAFP0000501

R641

SAFP0000401

6 6

R643 R644

ERHZ0000406 ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP

R653

SAFP0000501

R654

SAFP0000501

R655

SAFP0000401

R657

SAFO0000501

0OHM_1005_DNI

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 231 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. R658

Description

Part Number

Spec

Color

Remark

PCB ASSY,MAIN,PAD OPEN

SAFO0000501

0OHM_1005_DNI ,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER ,SMD ,R/TP ,AU , , ,SMD , dB, FBGA ,107 ,ETC ,FULLY 1.8V 2G(LB/256Mx8) NAND+1G(2CS/16Mx4x16) SDRAM ,; ,IC,MCP BGA ,323 ,R/TP ,HSDPA Digital Baseband ,; ,IC,Digital Baseband Processor BGA ,196 PIN,R/TP ,8x8 EMP U360 ABB CSP ,20 ,R/TP ,Class D(mono) + Capless HP + A/S ,; ,IC,Audio Sub System TLLGA ,8 PIN,R/TP ,OVP WLP ,20 ,R/TP ,MUIC for 5Pin Micro USB ,; ,IC,Analog Switch TFBGA ,36 PIN,R/TP ,USB2.0 Transceiver, 3.5X3.5X0.8

SW100

CONN,RF SWITCH

ENWY0005301

SW101

CONN,RF SWITCH

ENWY0003901

U200

IC

EUSY0316508

U201

IC

EUSY0363001

U300

IC

EUSY0331701

U301

IC

EUSY0360201

U500

IC

EUSY0333701

U501

IC

EUSY0371201

U502

IC

EUSY0320201

U600

IC

EUSY0319001

WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO

6 6 6 6

U604 VA300 VA301 VA500

IC VARISTOR VARISTOR VARISTOR

EUSY0336502 SEVY0003601 SEVY0003601 SEVY0007301

, PIN,R/TP , ,; ,IC,Charge Pump 5.6 V, ,SMD ,100pF, 1005 5.6 V, ,SMD ,100pF, 1005 5 V,<0.5pF ,SMD , 14 V, ,SMD ,2012055, LC 10uA, 0.5pF@1MHz, IL 0.05@2GHz, Rt 1ns ,; ,14 , , ,2.0*1.2*0.55 ,[empty] ,SMD ,R/TP 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,120pF, 1005 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9 ,40'C ~ +85'C, C0 1.05pF, C1 fF ,; ,32.768 ,20PPM ,12.5 , , ,SMD ,R/TP SMD ,12 V,350 W,R/TP , DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1

VA600

VARISTOR

SEVY0008801

6 6

VA601 VA603

VARISTOR VARISTOR

SEVY0001001 SEVY0004201

X300

X-TAL

EXXY0024301

6 6 6 6 6

ZD500 ZD600 ZD601 ZD602 ZD604

DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS

EDTY0007401 EDTY0008606 EDTY0008606 EDTY0009101 EDTY0009101

ZD605

DIODE,TVS

EDTY0009401

LGE Internal Use Only

- 232 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. ZD606

Description

Part Number

Spec VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1

Color

Remark

DIODE,TVS

EDTY0009401

SAFD01

PCB ASSY,MAIN,SMT TOP

SAFD0123001 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 100000 pF,16V ,Z ,X7R ,TC ,1005 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 10 nF,16V,K,X7R,HD,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 3.6 nH,S ,1005 ,R/TP , 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP

C100

CAP,CERAMIC,CHIP

ECCH0005604

6 6

C101 C102

CAP,CHIP,MAKER CAP,CERAMIC,CHIP

ECZH0003103 ECCH0000143

C103

CAP,CHIP,MAKER

ECZH0004402

6 6 6

C104 C105 C106

CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

ECCH0000115 ECCH0000115 ECCH0000161

C107

CAP,CERAMIC,CHIP

ECCH0005604

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

C108 C109 C110 C111 C113 C114 C115 C116 C119 C124 C129 C130 C134 C139 C140 C145 C146 C147

CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP

ECCH0000155 ECCH0000122 ECZH0003103 ECCH0000115 ECZH0000830 ECCH0000115 ECCH0000143 ECCH0000143 ECZH0000813 ELCH0003816 ECCH0000115 ECCH0000115 ECZH0000813 ECCH0000115 ECCH0000115 ECZH0000813 ECZH0000813 ECCH0000115

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 233 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. C148

Description

Part Number

Spec 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 6.8 nH,J ,1005 ,R/TP ,PBFREE 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 nH,J ,1005 ,R/TP ,PBFREE 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

CAP,CERAMIC,CHIP

ECCH0005604

6 6 6 6 6

C149 C150 C152 C153 C154

CAP,CHIP,MAKER CAP,CERAMIC,CHIP INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER

ECZH0003103 ECCH0000143 ELCH0001049 ECCH0000143 ECZH0003103

C155

CAP,CERAMIC,CHIP

ECCH0005604

6 6 6 6 6 6 6 6 6

C157 C158 C159 C160 C162 C163 C164 C166 C167

CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

ECCH0000143 ECCH0000143 ECCH0000195 ECZH0000830 ECCH0000155 ECCH0000115 ECCH0000112 ECCH0000155 ECCH0000115

C168

CAP,CERAMIC,CHIP

ECCH0005604

6 6 6 6 6 6 6 6 6 6 6 6

C170 C171 C172 C173 C174 C175 C176 C177 C178 C179 C180 C182

CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER INDUCTOR,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP

ECCH0000175 ECCH0000155 ECCH0000180 ECCH0006201 ECCH0000143 ECCH0000115 ECCH0000115 ECCH0000180 ECZH0000830 ELCH0001048 ECZH0000830 ECCH0004904

LGE Internal Use Only

- 234 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6

Location No. C183 C400 C401 C403 C404 C406 C407

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0000198 ECCH0000179 ECZH0003103 ECCH0000155 ECZH0001215 ECCH0004904 ECCH0004904

Spec 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(No X7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

C408

CAP,CERAMIC,CHIP

ECCH0005604

6 6 6 6 6 6 6 6 6

C409 C410 C411 C412 C413 C414 C606 C608 C609

CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER

ECZH0003103 ECZH0003103 ECCH0004904 ECZH0003103 ECCH0004904 ECCH0004904 ECZH0003103 ECCH0004904 ECZH0003103

C610

CAP,CERAMIC,CHIP

ECCH0010501

6 6 6 6 6 6 6 6 6 6 6

C611 C612 C613 C614 C615 C616 C617 C618 C619 C620 C623

CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECZH0003103 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 235 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6

Location No. C624 C627 C628 C629 C630 C638 CN198

Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,ETC

Part Number ECZH0003103 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000198 ENZY0018801

Spec 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP PIN, mm,ETC , ,RCS=1.35 VMN2 ,30 V,100 mA,R/TP ,1.0x0.6 ,; , , , , , , ,[empty] ,[empty] ,2P ,1 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP 10 ohm,1005 ,Ferrite Bead 10 ohm,1005 ,Ferrite Bead 1950 MHz,2140 MHz,1.8 dB,2.4 dB,52 dB,43 dB,2.5*2.0*0.55 ,SMD ,Band1, 2520size, SAW, Rx unbal ,; ,2140 ,2110 to 2170 ,1950 ,1920 to 1980 ,2.4 ,1.8 ,2.5x2.0x0.55 ,DUAL ,SMD ,R/TP 897.5 MHz,942.5 MHz,3.1 dB,3.5 dB,52 dB,45 dB,2.5*2.0*0.5 ,SMD ,SAW, Band8, Rx unbal ,; ,942.5 ,927.4 to 957.6 ,897.5 ,882.4 to 912.6 ,3.5 ,3.1 ,2.5x2.0x0.5 ,DUAL ,SMD ,R/TP 1842.5 MHz,75 MHz,2.6 dB,12 dB,1960 MHz,60 MHz,2.6 dB,12 dB,1.8*1.35*0.5 ,SMD ,1805M~1880M,1930M~1990M,10p,U,50,50,LH,DCS+PCS Rx ,; , ,1.8*1.35*0.5 ,SMD ,R/TP 881.5 MHz,25 MHz,2.6 dB,30 dB,942.5 MHz,35 MHz,2.6 dB,25 dB,1.8*1.35*0.5 ,SMD ,869M~894M,925M~960M,10p,U,50,50,LH,GSM850+EGS M Rx ,; , ,1.8*1.35*0.5 ,SMD ,R/TP 897.5 MHz,1.4*1.1*0.6 ,SMD ,880.48M~914.52M, IL 4.0, 5pin, U-U, 50-50, W-BAND VIII Tx ,; ,897.5 ,1.4*1.1*0.6 ,SMD ,R/TP 1950 MHz,1.4*1.1*0.6 ,SMD ,1920M~1980M, IL 2.9, 5pin, U-U, 50-50, W-BAND I Tx , ,1950 ,1.4*1.1*0.6 ,SMD ,R/TP CSP ,20 PIN,R/TP ,ESD protection & Filtering for analog signals, Pb-free 18 pF,50V,J,NP0,TC,1005,R/TP 8.2 nH,J ,1005 ,R/TP ,

Color

Remark

D200

DIODE,SWITCHING

EDSY0018101

6 6 6 6 6

D601 D602 FB100 FB600 FB603

DIODE,TVS DIODE,TVS FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP

EDTY0008606 EDTY0008606 SFBH0008105 SFBH0007102 SFBH0007102

FL100

DUPLEXER,IMT

SDMY0001901

FL102

DUPLEXER,IMT

SDMY0002001

FL103

FILTER,SAW,DUAL

SFSB0001901

FL104

FILTER,SAW,DUAL

SFSB0001801

FL105

FILTER,SAW

SFSY0037501

FL106

FILTER,SAW

SFSY0028101

FL501

IC

EUSY0269001

6 6

L100 L103

CAP,CERAMIC,CHIP INDUCTOR,CHIP

ECCH0000113 ELCH0004705

LGE Internal Use Only

- 236 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6

Location No. L104 L106 L108 L110 L113 L115 L116 L118 L119 L601 PT100 Q200

Description INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP CAP,CERAMIC,CHIP INDUCTOR,CHIP THERMISTOR TR,BJT,NPN PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER

Part Number ELCH0003826 ELCH0004721 ELCP0008003 ELCH0004705 ELCH0001041 ELCH0004718 ELCH0004716 ELCH0001048 ECCH0000183 ELCH0004709 SETY0007101 EQBN0012401 3.3 nH,S ,1005 ,R/TP ,chip 2.2 nH,S ,1005 ,R/TP ,

Spec

Color

Remark

3.3 uH,M ,2.5*2.0*1.0 ,R/TP ,Chip power 8.2 nH,J ,1005 ,R/TP , 10 nH,J ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP , 39 nH,J ,1005 ,R/TP , 10 nH,J ,1005 ,R/TP ,PBFREE 1.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 3.3 nH,S ,1005 ,R/TP , NTC ,4700 ohm,SMD ,1005 J B:3500K ESM ,100 mW,R/TP ,NPN TRANSISTOR

R101

SAFP0000501

6 6 6

R102 R103 R104

ERHZ0000404 ERHZ0000411 ERHZ0000509

1 Kohm,1/16W ,J ,1005 ,R/TP 120 ohm,1/16W ,J ,1005 ,R/TP 75 ohm,1/16W ,J ,1005 ,R/TP

R105

SAFP0000501

6 6

R107 R109

ERHZ0000402 ERHZ0000495

10 ohm,1/16W ,J ,1005 ,R/TP 56 ohm,1/16W ,J ,1005 ,R/TP

R111

SAFP0000501

R112

SAFP0000501

R114

SAFP0000501

R115

SAFP0000501

R116

SAFO0000501

0OHM_1005_DNI

R118

SAFP0000501

R120

ERHZ0000522

24 ohm,1/16W ,J ,1005 ,R/TP

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 237 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6

Location No. R121 R123 R124 R125

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP INDUCTOR,CHIP PCB ASSY,MAIN,PAD SHORT INDUCTOR,CHIP RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT CAP,CERAMIC,CHIP RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT

Part Number ERHZ0000495 ERHZ0000496 ERHY0000170 ELCH0004733

Spec 56 ohm,1/16W ,J ,1005 ,R/TP 560 ohm,1/16W ,J ,1005 ,R/TP 390 ohm,1/16W ,F ,1005 ,R/TP 4.3 nH,S ,1005 ,R/TP ,Coil

Color

Remark

R126

SAFP0000501

6 6

R128 R129

ELCH0001057 ERHZ0000451

3.9 nH,S ,1005 ,R/TP ,PBFREE 27 ohm,1/16W ,J ,1005 ,R/TP

R130

SAFP0000501

6 6

R131 R132

ERHZ0000531 ERHZ0000531

270 ohm,1/16W ,J ,1005 ,R/TP 270 ohm,1/16W ,J ,1005 ,R/TP

R133

SAFP0000501

6 6 6 6

R134 R135 R136 R137

ERHZ0000451 ERHY0003501 ERHZ0000531 ERHZ0000531

27 ohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/16W ,J ,1005 ,R/TP 270 ohm,1/16W ,J ,1005 ,R/TP 270 ohm,1/16W ,J ,1005 ,R/TP

R140

SAFP0000501

6 6

R142 R143

ECCH0000113 ERHZ0000496

18 pF,50V,J,NP0,TC,1005,R/TP 560 ohm,1/16W ,J ,1005 ,R/TP

R144

SAFP0000501

R146

ERHZ0000286

4700 ohm,1/16W ,F ,1005 ,R/TP

R147

SAFP0000501

R151

SAFP0000501

R152

SAFP0000501

R156

SAFP0000501

R157

SAFP0000501

LGE Internal Use Only

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Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No. R161

Description PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP RES,CHIP PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT

Part Number

Spec

Color

Remark

SAFP0000501

R162

SAFP0000501

R165

SAFP0000501

R166

SAFP0000501

6 6

R209 R210

ERHZ0000465 ERHZ0000465

3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP

R302

SAFP0000501

R303

SAFP0000501

R307

SAFP0000501

R309

SAFP0000501

6 6 6 6 6 6 6 6 6

R402 R408 R409 R411 R412 R413 R414 R416 R419

ERHZ0000222 ERHZ0000295 ERHZ0000474 ERHZ0000295 ERHZ0000222 ERHZ0000236 ERHZ0000229 ERHZ0000456 ERHZ0000445

150 Kohm,1/16W ,F ,1005 ,R/TP 51 Kohm,1/16W ,F ,1005 ,R/TP 390 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,F ,1005 ,R/TP 150 Kohm,1/16W ,F ,1005 ,R/TP 2000 ohm,1/16W ,F ,1005 ,R/TP 1800 ohm,1/16W ,F ,1005 ,R/TP 2.2 ohm,1/16W ,J ,1005 ,R/TP 220 Kohm,1/16W ,J ,1005 ,R/TP

R420

SAFP0000501

6 6

R421 R422

ERHY0003601 ERHY0003601

2700 ohm,1/16W ,J ,1005 ,R/TP 2700 ohm,1/16W ,J ,1005 ,R/TP

R423

SAFP0000501

R425

ERHZ0000493

51 Kohm,1/16W ,J ,1005 ,R/TP

R426

SAFP0000501

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 239 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6

Location No. R429

Description RES,CHIP,MAKER

Part Number ERHZ0000406

Spec 100 Kohm,1/16W ,J ,1005 ,R/TP

Color

Remark

R513

PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD OPEN

SAFO0000501

0OHM_1005_DNI

R515

SAFP0000501

R517

SAFP0000501

R518

SAFO0000501

0OHM_1005_DNI

6 6 6 6 6 6

R614 R616 R617 R618 R619 R625

RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,ARRAY,R CONN,SOCKET FRAME,SHIELD PCB,MAIN

ERHZ0000483 ERHZ0000499 ERHY0003301 ERHY0000253 ERHY0000253 ERHZ0000499

47 ohm,1/16W ,J ,1005 ,R/TP 5600 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 4.3K ohm,1/16W,J,1005,R/TP 4.3K ohm,1/16W,J,1005,R/TP 5600 ohm,1/16W ,J ,1005 ,R/TP

R632

SAFP0000401

R633

SAFP0000401

R634

SAFP0000401

R635

SAFP0000401

R637

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

R640

SAFP0000401

R642

SAFP0000401

R645

ERHZ0000402

10 ohm,1/16W ,J ,1005 ,R/TP

R652

SAFP0000501

R656

SAFP0000401

6 6 6 6

RA400 S400 SC1 SPFY

ERNR0000404 ENSY0020901 MFEA0027901 SPFY0197201

100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP 8 PIN,STRAIGHT , , mm, PRESS, STS, , , , , FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , , BLACK

LGE Internal Use Only

- 240 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6

Location No. U100 U101 IC

Description

Part Number EUSY0299401 SMRH0004901 ,6 PIN,R/TP ,0.3_2v

Spec

Color

Remark

RF MODULE,HANDSET

MHz, MHz, ,Tx Module(ASM + PAM) - WCDMA TriMode 28 dBm, %, A, dBc, dB,3x3x1 ,SMD ,EMP U330 Band 1 PAM ,; ,3.6 , , , , , , ,R/TP ,R/TP ,8 20.5 dB,0.22 dB,34 dB,1.0*0.5*0.4 ,SMD ,Pb_free_KPCS+USPCS+WCDMA ,; ,[empty] ,1865MHz ,230MHz ,SMD ,R/TP 19.4 dB,0.25 dB,32 dB,1.0*0.5*0.4 ,SMD ,Pbfree_DCN+JCDMA ,; ,[empty] ,874.5MHz ,101MHz ,SMD ,R/TP 28 dBm, %, A, dBc, dB,3x3 ,SMD ,EMP U300 ,; , , , , , , , ,R/TP ,R/TP , DRL ,5 PIN,R/TP ,SINGLE,BUFFER,3STATE,1.7X1.7 MicroSMD ,8 PIN,R/TP ,DCDC for PAM 650mA, ~3.4V DFN1612-4B ,4 ,R/TP ,300mA 2.8V LDO ,; ,IC,LDO Voltage Regulator HVQFN ,56 PIN,R/TP ,GSM,EDGE,WCDMA Transceiver, 7X7 mm. ,; ,IC,CMOS BGA ,8 PIN,R/TP ,Class AB SPK AMP ,; ,IC,Audio Amplifier 3*3 QFN ,10 PIN,R/TP ,3xis Accelerometer ,; ,IC,A/D Converter PLP1010-4 ,4 PIN,R/TP ,1x1 LDO, 3.3V , 150mA ,; ,IC,LDO Voltage Regulator BGA ,20 PIN,R/TP ,Levelshifter,sdcard,6ch ,; ,IC,Bus Controller BGA ,12 PIN,R/TP ,4-BIT BIDIRECTIONAL VOLTAGELEVEL TRANSLATOR (ZXU type) CSP ,12 PIN,R/TP ,Touchscreen Controller IC , ,IC,A/D Converter PLP1010-4 ,4 PIN,R/TP ,150mA 2.8V Single LDO ,; ,IC,Voltage Regulator WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO

U102

PAM

SMPY0018601

U103

COUPLER,RF DIRECTIONAL

SCDY0004301

U106

COUPLER,RF DIRECTIONAL

SCDY0004401

U107

PAM

SMPY0018501

6 6

U108 U109

IC IC

EUSY0245902 EUSY0222103

U110

IC

EUSY0365901

U111

IC

EUSY0357401

U400

IC

EUSY0349001

U401

IC

EUSY0345201

U402

IC

EUSY0353801

U403

IC

EUSY0334202

U404

IC

EUSY0334201

U405

IC

EUSY0337101

U406

IC

EUSY0355701

U601

IC

EUSY0319001

U602

IC

EUSY0321201

BGA ,64 PIN,R/TP ,6*6 ISP

U603

IC

EUSY0319001

WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO

6 6

VA400 VA401

VARISTOR VARISTOR

SEVY0003801 SEVY0003801

18 V, ,SMD , 18 V, ,SMD ,

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 241 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6

Location No. VA402 VA403 VA404 VA405 VA406

Description VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR

Part Number SEVY0003801 SEVY0003801 SEVY0003801 SEVY0003801 SEVY0004001 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD ,3pF, 1005

Spec

Color

Remark

VA602

DIODE,TVS

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 26 MHz,10 PPM,14 pF,25 ohm,SMD ,32*25*0.6 ,EMP Reference X-Tal, CF360, Pb-Free ,; ,26MHz ,10PPM ,14 , , ,SMD ,R/TP VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4

X100

X-TAL

EXXY0026101

ZD400

DIODE,TVS

EDTY0009401

ZD401

DIODE,TVS

EDTY0009401

ZD402

DIODE,TVS

EDTY0009401

ZD403

DIODE,TVS

EDTY0009401

ZD603

DIODE,TVS

EDTY0009101

LGE Internal Use Only

- 242 -

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.3 Accessory
Location No.

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Description

Part Number

Spec 3.7 V,1000 mAh,1 CELL,PRISMATIC ,553446,INNERPACK,WW ,; ,3.7 ,1000 ,200 ,PRISMATIC ,5.5X34X46 ,6.1X47X36.5 ,BLACK ,INNERPACK , 3.7 V,1000 mAh,1 CELL,PRISMATIC ,553446, INNERPACK ,; ,3.7 ,1000 ,200 ,PRISMATIC ,5.5X34X46 ,6.1X37X47 ,BLACK ,INNERPACK , ; ,[empty] ,[empty] ,1.2M , ,BLACK ,1.2m, 4, Shield case MicroUSB, ID resistor open ,N ; ,RMS 20mW(0.56V,RMS) ,16Ohm+-2.4Ohm 1KHZ ,116dB+-3dB 1KHZ,3mW ,116dB 1KHZ ,96dB 100HZ ,[empty] ,BLACK ,5P MICRO USB CONNECTOR , MICRO USB 5P ,Earphone,Stereo 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,90Vac~264Vac ,4.75Vdc~5.25Vdc ,700mA ,5060 , ,WALL 3P ,USB , 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,90Vac~264Vac ,4.75Vdc~5.25Vdc ,700mA ,5060 , ,WALL 2P ,USB ,

Color

Remark

SBPL00

BATTERY PACK,LI-ION

SBPL0098701

BLACK

BATTERY PACK,LI-ION

SBPL0098001

SGDY00

DATA CABLE

SGDY0014302

SGEY00

EAR PHONE/EAR MIKE SET

SGEY0003741

SSAD00

ADAPTOR,AC-DC

SSAD0032901

ADAPTOR,AC-DC

SSAD0032902

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 243 -

LGE Internal Use Only