INTRODUCTION

CIPSA TEC India Private Limited (formerly CIPSA-RIC India Private Limited) acquired business in 2005 from erstwhile Rao Insulating Company Limited (RIC) who started PCB manufacturing in 1987 with technical collaboration from UNICAP, Taiwan. It is a multinational organization by partnering with CIPSA, Spain and TECNOMEC, Italy both of whom are leaders in their own country in the arena of PCB manufacturing. These two partners with their rich experience of 3 decades in PCB manufacturing, they have remained pillars of strength in our growth in Technology, Process Control and Process Improvement and Market expanse in Europe. CIPSA TEC s current manufacturing facility is fairly new plant and was set up by SIEMENS in Germany. In 2007, the same was relocated to India. It is a state of the art facility compiled with latest technology machineries manufactured by the leaders in the industry to meet the latest market demands. 30,000sqmtrs is the installed capacity of this plant, which we shall attain in phases by year 2012. Current capacity of 13,000 sqmtrs per month is getting augmented to 18,000sqmtrs by June 2011.

Its growth rate has been enormous; it has grown 3 times in the last 5 years. Its current operation is in the building of 15,000sqmtrs within the sprawling area of 60,000sqmtrs gives us further potential to expand. We produce 2 to 8 layers of quantity 1 to 1million pieces. they also offer QUICK TURN services to the R&D sector (irrespective of volumes). They mainly cater to Automotive and Energy sectors apart from Telecommunication, Peripherals and Industrial automation. Their 40% of product is exported to European countries. Vision of Management and commitment of over 400 dedicated and experienced work forces ensures that quality products and services are delivered to customer at most competitive prices. Their product confirms to UL standards and also certified by Government of India for needs of Telecommunication and Defence sectors. Their QMS standard confirms to ISO 9001:2008 and TS-16949:2009. ISO-14001 certification shall be in place during second half of 2011. Their motto is CUSTOMER DELIGHT.

ABOUT COMPANY

ICC CIPSA INDUSTRIAL PRODUCTS, SL is a company with over 30 years experience in the manufacture and supply of products. Consolidated in the domestic market is advancing steadily towards internationalization. CPI ensures efficient delivery of all its products, based on its production sites in Spain, India and China. CPI is composed of 3 major divisions: CPI SEALING encompassing (CPI GASKETS and RUBBER CPI) , CPI ELECTRONICS and CPI FLUIDS & AUTOMATION. With his division SEALING CPI , CPI covers a wide range of seals, allowing you to be present in sectors as diverse as petrochemical, chemical, nuclear, thermal and hydraulic caldedera engines, pharmaceuticals, shipbuilding, food, automotive, machinery manufacturing, etc.. With other division, ELECTRONICS CPI, CPI focuses on the provision of electronic related products. Finally with FLUIDS & AUTOMATION CPI, CPI offers solutions industrial sector, pneumatic and hydraulic fluid connection. With a clear commitment to continuous improvement, CPI 's main objective is customer satisfaction.

CIPSA produced high-density connections multilayer boards up to 20 layers. Also offers flexible and rigid-flexible circuit with polyimide and PET material options. Expertise in manufacturing of circuits with different copper thicknesses in both dual layers and multi layers boards. Manufacture of circuits where it is share on the same circuit both, power and SMD control.

PRODUCTS
CIPSA CIRCUITS MONOCARA, S.L. manufactures PCB simple face with finishes in HAL tin/lead, HAL without chemical Tin, chemical silver, lead, nickel / gold or organic passivation (OSP).

They are high-tech with highest quality finishes circuits due to manufacturing process of drilling and milling, performed by numerical control and photo imaging processes for solder mask.

Addition of circuits made of conventional materials type FR4 or EMF, are also produced circuits with IMS aluminium base.

SERIGRAFA CIPSA-DOS S.L Manufactures all kinds of inlays, and synoptic tables, as well as a great variety of membrane switches, both flexible circuit and rigid printed circuit support keyboards.

With the help of the most advanced design means and the collaboration of more qualified personnel, we try the idea exposed by the client to the product manufacturing. Manufacturing in mechanized and digital serigraphed (PMMA) for multiple applications.

Both quality and productivity, best results are achieved by high quality and precision machinery like automatic printing lines with conventional curing and UV, notably the new "plotter" laser cutting and cylindrical printing line.

What is PCB Board Design

PCB board design defines the electrical pathways between components It is derived from a schematic representation of the circuit When it is derived, or imported from a schematic design, it translates the schematic symbols and libraries into physical components and Connections .

The Printed Circuit Board (PCB) Layout

The connections on the PCB should be identical to the circuit diagram, but while the circuit diagram is arranged to be readable, the PCB layout is arranged to be functional, so there is rarely any visible correlation between the circuit diagram and the layout. PCB layout can be performed manually (using CAD) or in combination with an Autorouter. The best results are usually still achieved using atleast some manual routing - simply because the design engineer has a far better judgement of how to arrange circuitry. Surprisingly, many autorouted boards are often completely illogical in their track routing the program has optimised the connections, and sacrificed any small amount of order that may have been put in place by manual routing. Generally autorouted boards are somewhat harder for a technician to repair or debug, for this reason. Historically, PCBs used to be laid out by drawing or using stick on paper shapes on mylar film, - that really WAS manual routing. The CAD PCB layout consists of several layers, for illustration often the layers will be coloured and compressed into the one overlay image. (Click here to see a typical overlay, and Click here to see a colour coded key diagram) When we layout boards, we usually try to use actual size checkplots at some stage during the design process. Most overlays need to be printed out enlarged to show the detail, but an actual size print, with mounting holes and possibly cutouts, is a great check tool. The print itself can be placed inside the actual enclosure; we can see how it will be positioned in relation to other parts. We can also place components up against the pad markings as a quick idiot-check of dimensions

PCB Design Process

There are 11 steps to the PCB design process & work flow which we cover in the pcb design guide. Step 1: Finalize your Circuit Design Everything starts with the circuit design. Without a circuit there is no need for a pcb. In the old days most circuits were hand drawn and later captured electronically. In today s world of modern computing, the circuit design is capture directly into a schematic. For the sake of clarity we ve added this as step 1 in the pcb design guide. Step 2: Choose PCB Design Software Many times electrical engineers don t have a choice when it comes to choosing the pcb design software. Their companies have invested thousands into software packages and all their legacy design are captures in those packages, and therefore are stuck . However the hobbiest has several choices. Its important to choose a package that is first and foremost easy to use, but also capable of completing the pcb design as some packages won t be able to handle the complexity. Step 3: Capture Your Schematic As mentioned earlier its likely that the circuit design is being captured electronically from the start. In general capturing the schematic is the process by which each component is drawn electronically and are interconnected with each other. Step 4: Design Component Footprints Once the schematic is complete its time to draw the physical outline of each of the components. These outlines are what are placed on the pcb in copper to allow the components to be soldered to the printed wiring board. Step 5: Establish PCB Outline Each project will have restrictions related to the board outline. This should be determined in this step since an idea of component count and area should be known.

Step 6: Setup Design Rules With the pcb outline and pcb footprints complete is just about time to start the placement. Before placement thought you should setup the design rules to ensure that components or traces aren t to close together. This is only one example as there are probably hundreds of different rules that can be applied to a pcb design. Step 7: Place Components Now its time to move each component onto the pcb and begin the tedious work of making all those components fit together. This is where you ll find that pcb design is really a jigsaw puzzle. Step 8: Manual Route Traces It s necessary to manually route critical traces. Clocks. Power. Sensitive analog traces. Once that s complete you can turn it over to Step 9. Step 9: Using the Auto Router There are a handful of rules that will need to be applied for using an autorouter, but doing so will save you hours if not days of routing traces. Step 10: Run Design Rule Checker Most pcb design software packages have a very good setup of design rule checkers. Its easy to violate pcb spacing rules and this will pinpoint the error saving you from having to respin the pcb. Step 11: Output Gerber Files Once the board is error free it s time to output the gerber files. These files are universal and are needed by the pcb fabrication houses to manufacture your printed circuit board.

Schematic Capture
Schematic capture is the crux of a solid circuit board design. Whether inherited a pcb design, trying to design own printed circuit board, or just trying to understand how to read a schematic. Here you ll find information on many different aspects of schematic capture like the components of a schematic, what a good schematic looks like, and how to read and work with schematics. In the electronic age we live schematic capture software has become readily available. Today you can download many different free pieces of schematic capture design software. Most of these tools are user friendly and allow hobbyists and seasoned engineers to begin capturing their schematics in minutes. However in order to become proficient there are many standards practices that should be followed.

Any respectable pcb design software with schematic capture will have a schematic level design rule check. You should run this periodically for a couple reasons. You dont want to get to the end of the schematic capture process to find that youve been doing something wrong and then have to do it all over again. It will also help you get familiar with the process and fix any minor issues along the way. The design rule check generally looks for any reference designators that are duplicated, inputs that are connected to inputs, etc. This tool cant tell you if you hooked up your schematic correctly so double check your work!

What is Schematic Capture.

Simply defined the process by which a circuit design is captured electronically is considered schematic capture. The main purpose of a schematic, related to pcb design, is the creation of a netlist. This netlist is a text file which tells the pcb layout software how all the components are connected and is the back bone of the printed circuit board design process. Schematic capture software is everywhere and the process is easier than ever. Schematic capture software is available in full-featured expensive packages (industry standard OrCAD Capture), to very capable mid-range package (Protel), to open source software. The new craze, offered by the larger pcb fab houses, is to offer full featured software packages that allow you to complete you schematic capture and pcb layout. The reason they are willing to give away their software is so youll purchase your next pcb from them. Another big advantage to capturing a schematic is the option to simulate the circuit design. Popular tools, such as OrCAD Pspice will give you piece of mind that the copper you etch will work the first time around. Just remember there is no substitute for good circuit design. should never design a circuit using PSpice it should be for simulation purposes only.

PCB Design Layers

A PCB design package allows the designer to define and design on multiple layers Many of these are physical layers such as: Signal Layer Power plane Layer Mechanical Layer

And some are special layers such as: Solder & Paste Mask Layers Silkscreen or Top Overlay Layers Drill guides Keep-out Layer And some CAD specific display-only layers: Ratsnest layer DRC Errors

Signal Layers
Signal Layers are the tracks that represent where copper needs to be placed They are designed in the positive There are no conventions for how thick signal traces can be. The width of your signals depend on Electrical nature of the trace (e.g. power traces are generally thicker than signal traces) Routing and space constraints Manufacturing constraings! Not all manufacturing houses/processes can handle fine traces For signals you can use 8 mil trace widths with 8 mil spacing Thicker traces provide lesser resistance and Inductance

Internal Layers
Internal Layers are generally used for Power Planes They are drawn in the negative, in other words tracks placed on this layer represent the void A signal name such as VCC or GND can be assigned to an Internal Plane and the CAD tool will automatically connect pads to the plane, greatly simplifying PCB routing Internal planes can also be split into sub planes or split planes

Materials
A PCB as a design on a computer (left) and realized as a board assembly populated with components (right). The board is double sided, with through-hole plating, green solder resist, and white silkscreen printing. Both surface mount and through-hole components have been used. A PCB in a computer mouse. The Component Side (left) and the printed side (right). The Component Side of a PCB in a computer mouse; some examples for common components and their reference designations on the silk screen. Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue, black, white and red. There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. FR-4 is by far the most common material used today. The board with copper on it is called "copper-clad laminate". Copper foil thickness can be specified in ounces per square foot or micrometres. One ounce per square foot is 1.344 mils or 34 micrometres. [edit]Patterning (etching) The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a "blank PCB") then removing unwanted copper after applying a temporary mask (e.g., by etching), leaving only the desired copper traces. A few PCBs are made by adding traces to the bare substrate (or a substrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. The PCB manufacturing method primarily depends on whether it is for production volume or sample/prototype quantities. Double-sided boards or multi-layer boards use plated-through holes, called vias, to connect traces on either side of the substrate.

Chemical etching
Chemical etching is done with ferric chloride, ammonium persulfate, or sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away. The simplest method, used for small scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride. Compared with methods used for mass production, the etching time is long. Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching, air is passed through the etchant bath to agitate the solution and speed up etching. Splash etching uses a motor-driven paddle to splash boards with etchant; the process has become commercially obsolete since it is not as fast as spray etching. In spray etching, the etchant solution is distributed over the boards by nozzles, and recirculated by pumps. Adjustment of the nozzle pattern, flow rate, temperature, and etchant composition gives predictable control of etching rates and high production rates. As more copper is consumed from the boards, the etchant becomes saturated and less effective; different etchants have different capacities for copper, with some as high as 150 grams of copper per litre of solution. In commercial use, etchants can be regenerated to restore their activity, and the dissolved copper recovered and sold. Small-scale etching requires attention to disposal of used etchant, which is corrosive and toxic due to its metal content. The etchant removes copper on all surfaces exposed by the resist. "Undercut" occurs when etchant attacks the thin edge of copper under the resist; this can reduce conductor widths and cause open-circuits. Careful control of etch time is required to prevent undercut. Where metallic plating is used as a resist, it can "overhang" which can cause short-circuits between adjacent traces when closely spaced. Overhang can be removed by wire-brushing the board after etching.

Drilling
Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp to not mar or tear the traces. Drilling with high-speed-steel is simply not feasible since the drill bits will dull quickly and thus tear the copper and ruin the boards. The drilling is performed by automated drilling machines with placement controlled by a drill tape or drill file. These computer-generated files are also called numerically controlled drill (NCD) files or "Excellon files". The drill file describes the location and size of each drilled hole. These holes are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical and thermal connection of conductors on opposite sides of the PCB. When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias. It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers. The walls of the holes, for boards with 2 or more layers, are made conductive then plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB. For multilayer boards, those with 4 layers or more, drilling typically produces a smear of the high temperature decomposition products of bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear process, or by plasma-etch. Removing (etching back) the smear also reveals the interior conductors as well.

PCBs are plated with solder, tin, or gold over nickel as a resist for etching away the unneeded underlying copper. After PCBs are etched and then rinsed with water, the soldermask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anticorrosion coating. Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface.[10] This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU and US, which restricts the use of lead. One of these leadfree compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60ppm germanium. It is important to use solder compatible with both the PCB and the parts used. An example is Ball Grid Array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste. Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel plated then gold plated. Another coating consideration is rapid diffusion of coating metal into Tin solder. Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating and/or leaving voids. Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence of halide and other ions, making it a poor choice for electronics use. Tin will grow "whiskers" due to tension in the plated surface. Tin-Lead or Solder plating also grows whiskers, only reduced by the percentage Tin replaced. Reflow to melt solder or tin plate to relieve surface stress lowers whisker incidence. Another coating issue is tin pest, the transformation of tin to a powdery allotrope at low temperature.

Exposed conductor plating and coating

Solder resist
Areas that should not be soldered may be covered with a polymer solder resist (solder mask) coating. The solder resist prevents solder from bridging between conductors and creating short circuits. Solder resist also provides some protection from the environment. Solder resist is typically 2030 micrometres thick.

Screen printing
Line art and text may be printed onto the outer surfaces of a PCB by screen printing. When space permits, the screen print text can indicate component designators, switch setting requirements, test points, and other features helpful in assembling, testing, and servicing the circuit board. Screen print is also known as the silk screen, or, in one sided PCBs, the red print. Lately some digital printing solutions have been developed to substitute the traditional screen printing process. This technology allows printing variable data onto the PCB, including serialization and barcode information for traceability purposes.

Printed circuit assembly

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly,[14][15] or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder. There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with SMT placement machine and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.)[16] by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts may be extremely difficult to solder by hand, such as BGA packages. Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages,. After the board has been populated it may be tested in a variety of ways: While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing. While the power is off, analog signature analysis, power-off testing. While the power is on, in-circuit test, where physical measurements (i.e. voltage, frequency) can be done. While the power is on, functional test, just checking if the PCB does what it had been designed for. To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board. In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins. When boards fail the test, technicians may desolder and replace failed components, a task known as rework.

Protection and packaging

PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum chamber. The chief disadvantage of conformal coatings is that servicing of the board is rendered extremely difficult.

Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare boards are sometimes static sensitive. Traces have become so fine that it's quite possible to blow an etch off the board (or change its characteristics) with a static charge. This is especially true on non-traditional PCBs such as MCMs and microwave PCBs.