1

Chapt er 7
Chapt er 7
M echani cal Charact eri zat i on of t he
M echani cal Charact eri zat i on of t he
El ect roni c Packages
El ect roni c Packages
2
3
4
Thermal M i smat ch
Thermal M i smat ch
Si (CTE=2~3 ppm/C)
Substrate (CTE=15~20 ppm/C)
EU solder (CTE=25 ppm/C)
Underfill (CTE=7 ppm/C)
z Ther mal mi smat ch i n el ect r oni c package i s due t o t he di f f er ent
coef f i ci ent s of t her mal expansi on ( CTE) i n di ssi mi l ar mat eri al s
( Si / sol der , Si / under f i l l , Si / subst r at e) or t he t emper at ur e
gr adi ent
z Ther mal st r ess and t he associ at ed t her mal st r ai ns wi l l ar i se i n
t he connect i on j oi nt or al l i nt er connect i ons.
z Ther mal f at i gue f ai l ur es r esul t f r om t he t her mal mi smat ch
dur i ng t her mal cycl e ( uni f or m t emper at ur e envi r onment ) or
power cycl e ( power on/ of f , pr ogr am r unni ng)
5
Thermal Fat i gue
Thermal Fat i gue
z Low cycl e f at i gue ( LCF) : bel ow 10
6
cycl es, pl ast i ci t y encount er ed wi t h
obvi ous pl ast i c def or mat i on.
z Hi gh cycl e f at i gue( HCF) : above 10
6
cycl es, st r ai ns ar e el ast i c and
wi t hout obvi ous pl ast i c def or mat i on.
z Ther mal f at i gue i s a cl assi c case of l ow cycl e f at i gue ( LCF)
z For sol der , t he st r ai n encount er ed i n t her mal cycl e can be a f ew t i mes
as l ar ge as t he yi el d st r ai n
6
Fat i gue L i f e Predi ct i on Procedure
Fat i gue L i f e Predi ct i on Procedure
F
F
M
M
Shear Stress
Shear Strain
1. Det er mi ne syst em f or ces and def or mat i ons
2. Det er mi ne l ocal st r esses and st r ai ns i n sol der
3. Est i mat e f at i gue l i f e
Est i mat i on
z Local st r esses/ st r ai ns ar e cr i t i cal t o t he suscept i bl e el ement i n
packages ( sol der j oi nt )
z Local shear st r ai ns i n sol der j oi nt domi nat e t he f ai l ur e mode and ar e
used f r o t he pr edi ct i on of t he t her mal f at i gue l i f e
7
Thermal St ress/ St rai n
Thermal St ress/ St rai n
Chip "1"
Joint "C"
Substrate "2"
= T
= L
=
C
h
=
Temper at ur e
r i se
Beam l engt h
Joi nt hei ght
CTE
Shear St r ess Shear St r ai n
( )
c c
c c
c
c
I E
A h
G
h
T L
12
3
2 1
+

=

( )
c
h
T L
=
2 1

1. E1, E2, I 1, I 2 ar e ver y l ar ge val ues

2. Shape of sol der i s r i ght ci r cul ar cyl i nder
8
Cof f i n
Cof f i n
-
-
M anson Rel at i onshi p
M anson Rel at i onshi p
L
c
h

For mat i on
z Lar ge t emper at ur e excur si ons cause di f f er ent
damage mechani sm whi ch depends on
over st r ess and st r ong var i at i on of t he
pr oper t i es of sol der
z Sol der j oi nt qual i t y whi ch may cause f r act ur e
i n sol der t hat f ai l s t hi s model
z Hi gh f r equency/ l ow t emper at ur e make sol der
behavi or l i ke an el ast i c mat er i al , t hus pl ast i c
st r ai n i s not cl ose t o t he l ocal st r ai n
C
f
f
N
1
'
2 2
1
(
(

442 . 0
325 . 0
'
=
=
C
f

9
Exampl e
Exampl e
5 mm
100 um
dia.
hc
1
2
C
Temper at ur e r ange: 35C t o 85C
Sol der hei ght ef f ect on f at i gue l i f e:
6100
110
5020
100
3874
90
N
f
( cycl e)
Hei ght ( um)
442 . 0 ; 325 . 0 ; 50 ) 35 85 (
/ 4 . 4 / ) 6 . 2 7 (
'
= = = =
= =
c C T
C ppm C ppm
f

5020
65 . 0
011 . 0
2
1
442 . 0
1
=
(

=

f
N 011 . 0
100
50 4 . 4 5000
=

=
10
Pref erred Sol ut i on
Pref erred Sol ut i on
z Ther mal st r ess:
z By decr easi ng:
z By i ncr easi ng:
z Ther mal st r ai n:
z By decr easi ng:
z By i ncr easi ng:

c c
E G L T , , , ,
L T, ,
c
c
c
I
A
h ,
c
h
z The hei ght of sol der j oi nt i s suggest ed t he hi gher t he bet t er
z can be l ower ed by sel ect ed a pr oper subst r at e
z Smal l er suggest ed usi ng sof t er sol der mat er i al
z DNP( L) : t he di st ance bet ween a sol der j oi nt and t he neut r al poi nt of t he
chi p ( chi p cent er )

c c
G E ,
11
Qui ck Est i mat i on of Sol der Hei ght
Qui ck Est i mat i on of Sol der Hei ght
z The sol der vol ume of a spher i cal sol der j oi nt :
z Hei ght of a f ur st r um of a cr one:
z Ver t i cal l oadi ng per j oi nt :
( ) | |
2 2 2
3
6
c s s
s
r r H
H
V + + =

| | | |
3
1
3 2
3
1
3 2
B A A B A A H
s
+ + + + =

V
A
3
=
2 2
s c
r r B + =
( )
2 2
3
s s c c
c
r r r r
V
H
+ +
=

( )
s c
s
n
H H
H H F
f

=
( ) ( ) ( ) { }
(
(

+ +
)
`

+ +

=
2
1
2
2
2
1
2 2 2
2
2 2 2
2
2
4 4
c s c c s s s c s
s
c s s
s
s c
r r H r r H H r r
H
r r H
r
H H
F

s
H
c
H
12
D i f f erent Sol der Vol ume
D i f f erent Sol der Vol ume
z I nput Dat a
z Fi nal Hei ght & Deposi t i on Hei ght + / - Var i at i on:
cm dyne
gf dyne f
um cm r
um cm r
n
s
c
/ 325
005 . 0 9 . 4
50 005 . 0
50 005 . 0
=
= =
= =
= =

70
110
78
X 50
2
X 110
CASE 3
64
90
69
X 50
2
X 90
CASE 2
67
100
73
X 50
2
X 100
CASE 1
) (
3
um V
) (um H
s
) (um H
c
) (um H
13
Exampl e
Exampl e
400um
600um
TRADE-OFF BETWEEN FATIGUE, THERMAL AND PROCESSING
PROCESSING VARATION
Standard joint height: 15um ; deposition thickness: 15.2 um
Standard deviation 10% of specified thickness (within 3-sigma deviation)
Max. joint height = 19.3um Min. joint height = 10.6um
FATIGUE AND THERMAL RESISTANCE VARIATION
51
23000
Mi n.
54
51000
Mean
56
93000
Max.
Ther mal r esi st ance ( C/ W)
Fat i gue l i f e ( cycl es, del t a T = 60C)
Joi nt hei ght
14
M i crost ruct ure of 63Sn/ 37Pb Eut ect i c Sol der
M i crost ruct ure of 63Sn/ 37Pb Eut ect i c Sol der
z The coar sened r egi on i s i nher ent l y weaker and t hr ough whi ch cr acks
pr opagat e t o f i nal sol der f ai l ur e
z The het er ogeneous coar sened band i s appr oxi mat el y par al l el t o t he
i mposed shear st r ai n
z Quant i t at i ve model i ng of t he mi cr ost r uct ur e change i s not possi bl e
15
Au/ N i M et al l i zat i on on a Cu Pad
Au/ N i M et al l i zat i on on a Cu Pad
Solder Ball
Die
Solder Mask
Cu Pad/Trace
Solder Ball
16
Fi ni t e El ement Anal ysi s of Sol der Fat i gue L i f e
Fi ni t e El ement Anal ysi s of Sol der Fat i gue L i f e
17
Anal ysi s Al gori t hm f or Sol der Fat i gue
Anal ysi s Al gori t hm f or Sol der Fat i gue
ANSYS Modeling
Fatigue Life
* Material Properties Analysis Procedure
Data Output Prediction Model
Solder ball profile Solder Material Specific Temp. cycle
Solution Methodology
Geometry consideration Bump+Underfill
composite properties
Converge criteria
Boundary conditions
Component properties
18
FEA M odel i ng Schemes
FEA M odel i ng Schemes
Referred from: Finite Element Modeling of BGA Packages for Life Prediction
2000 Electronic Components and Technology Conference, pp.1059-1063
Modeling Met hod Modeling Descipt ion Advant age/ Disadvant age Remark
Nonlinear slice model
1. Oct ant symmet ry, unt ilizes inly a diagonal slice of t he package
2. The model imposes symmet ric boundary condit ions on t he slice plane coinciding
wit h t he t rue symmet ry plane
Reduce comput at ion t ime Most Conservat ive
Nonlinear global model wit h
linear super model
1. Package and board are modeled as t wo super element and all of t he solder balls
as t hree-dimensional f init e element s
2. Except f or t he crit ical j oint s, t he solder balls are modeled wit h a coarse mesh
Avoid t he assumpt ions associat ed wit h
t he boundary condit ions of t he slice
model
Not accept able
Linear global model wit h
nonlinear submodel
1. Linear model of subst rat e and board and all of t he solder balls using t hree-
dimensional f init e element s
2. The global model includes only linear mat erial propert ies, whereas t he submodel
includes nonlinear mat erial behavior
3. The linear global model is s
Permit t he simulat ion of any t hermal
cycle using only one set of global model
result s
Most f idelit y
Nonlinear global model wit h
nonlinear submodel
1. Nonlinear global model wit h a very coarse mesh f or t he subst rat e and board and
f or t he solder balls
2. Providing t he crit ical solder j oint f or t he subsequent nonlinear submodeling
Displacement s become t he coundary
condit ions f or t he nonlinear submodel of
t he crit ical j oint in accordance wit h t he
t hermal cycling
Nonlinear global model
1. Global model employs a relat ively coarse mesh f or all of t he component s of a
package except f or t he crit ical j oint s
2. I t is not f easibile t o model all of solder j oint s if t he package consist s of a large
number of solder j oint s
Time consuming
Selected Modeling Methodologies:
Nonlinear slice model: single chip package
Linear global model with nonlinear sub-model: SiP or MCM packages
19
Approachi ng Archi t ect ures
Approachi ng Archi t ect ures
Viscoplast icit y
Plast icit y
Elast o-plast ic + Creep
- curves (SOLI D185)
Creep Model (SOLI D185)
Anands Model (VI SCO107)
Darveaux (plastic work)
Coffin-Manson (Equivalent plastic strain)
2
1 0
K
ave
W K N =
dN
da
a
N + =
0

m
f
p
CN =
Finite Element Solution Domain
Experimental+Analytical Solution Domain
ANSYS Environment
4
3
K
ave
W K
dN
da
=
2

=
ff
N
Approaching Method Property Implement Advantages Disadvantagess
1. popular for life prediction of eutectic solder 1. limitation of material informations (LF)
2. has been proven and widely used 2. only plastic work can be read out
3. nonlinear plasticity & creep involved 3. life prediction variables are difficult obtained
1. stress-strain curves can be experimented (LF) 1. only plasticity behavior without creep effect
2. Coffin-Manson variables can be determined
3. both two kinds of life prediction methods can be used
1. can be used for low frequency fatigue analysis 1. difficult converge and time consuming
2. both two kinds of life prediction methods can be used 2. not real plasticity behavior involved
3. creep functions can be determined by experiments
Viscoplasticity
Plasticity
Temp. dependent elastic
modulus and creep function
Elasto-plastic + Creep
Temp. dependent
stress-strain curves
Anand's model
Plasticity (high-cycle fatigue) +Creep (low-cycle fatigue) = Viscoplasticity (in-elastic fatigue)
20
Fat i gue Anal ysi s usi ng AN SYS Code
Fat i gue Anal ysi s usi ng AN SYS Code
cr
eq
pl
eq
in
eq
+ =
( ) ( ) ( )
i
in
eq
i
in
eq
in
eq
=
+1
( ) ( ) ( )
saturated
in
eq
n
in
eq
n
in
eq
= = =
+
L
1
( )
C
saturated
in
eq f
B N =
FEM: Plasticity & Elasto-plastic +Creep
After nth cycles
Modified Coffin-Manson Law
Plasticity: equivalent plastic strain grows in the ramp duration and stays in the hold-time (dwell)
Elasto-plastic + Creep: creep strain accumulates more in the hold-time duration (dwell)
21
Two
Two
-
-
st age Anal ysi s M et hod
st age Anal ysi s M et hod
C*** SOLDER !MATERIAL PROPERTIES OF SOLDER BALL
MP,EX,1,30E3
MP,NUXY,1,0.4
MP,ALPX,1,24.7E-6
TB,BKIN,1,3
TBTEMP,273 ! Temperature = 273
TBDATA,1,46,(55-46)/(0.45-0.025) ! Stresses at temperature = 273 (0)
TBTEMP,323 ! Temperature = 323
TBDATA,1,34,(39-34)/(0.45-0.025) ! Stresses at temperature = 323 (50)
TBTEMP,373 ! Temperature = 393
TBDATA,1,18,(20-18)/(0.45-0.025) ! Stresses at temperature = 393 (100)
Equivalent Equivalent Plastic Strain Plastic Strain
C*** SOLDER !MATERIAL PROPERTIES OF SOLDER BALL
MP,EX,1,30E3
MP,NUXY,1,0.4
MP,ALPX,1,24.7E-6
TB,BISO,1,3
TBTEMP,273 ! Temperature = 273
TBDATA,1,46,(55-46)/(0.45-0.025) ! Stresses at temperature = 273 (0)
TBTEMP,323 ! Temperature = 323
TBDATA,1,34,(39-34)/(0.45-0.025) ! Stresses at temperature = 323 (50)
TBTEMP,373 ! Temperature = 393
TBDATA,1,18,(20-18)/(0.45-0.025) ! Stresses at temperature = 393
(100)
TB,CREEP,1,,,8 !CREEP MODEL
TBDATA,1,12423.2,0.125938,1.88882,61417
Stage 1: Plasticity analysis
-Temp. dependent stress-strain curves
-Nonlinear kinematic strain hardening

Equivalent Equivalent Creep Strain Creep Strain

Stage 1: Plasticity + Creep analysis
-Temp. dependent stress-strain curves
-Isotropic strain hardening
-Creep function
22
Temperat ure Cycl e Prof i l e
Temperat ure Cycl e Prof i l e
0J
100J
25J
1
st
cycle
2
nd
cycle 3
rd
cycle
Dwell period of 5 mins Ramp rate = 10J /min
(L)
(A) (B)
(C) (D)
(E) (F)
(G) (H)
(I) (J)
(K)
Time
Temp
183J
Remark:
Board Level TC: 0~100C; 5 mins dwell and ramp rate with 10C/min
23
St ress
St ress
-
-
st rai n Curves of Sol der Joi nt
st rai n Curves of Sol der Joi nt
Kinematic Hardening
Stress-Strain Curves of Eutectic Solder (63Sn/37Pb)
Remark:
To used bi-linear stress-strain model instead of multi-linear
model can make a balance between computation accuracy and
time consuming
Kinematic hardening effect must be considered into the FEA
analysis
C
D
Yield Surface
Bauschinger Effect

F
0
3
2

O
S
0.0 0.1 0.1 0.2 0.2 0.3 0.3 0.4 0.4 0.5
Strain
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
S
t
r
e
s
s

(
M
P
a
)
Temp. = 0 C
Temp. = 50 C
Temp. = 100 C
B
A
O
24
M at eri al Propert i es
M at eri al Propert i es
Material Type Temp. (K) Yield Strength (MPa)
22000 x,y 0.28 xz,yz 19 x,y
10000 z 0.11 xy 70 z
Solder Mask 298 3448 0.35 elastic 30
Copper Pad 298 68900 0.34 69 16.7
26000 x,y 0.39 xz,yz 15 x,y
11000 z 0.11 xy 52 z
< 70 7 32
> 70 0.04 110
Silicon Chip 298 162000 0.28 elastic 2.3
< -120
> -120 0.35 232
< 49 39
> 49 162
Heat Spreader 298 71 0.0334 elastic 18
0.38 elastic
Temp.-dependent
nonlinear
0.3 Adhesive
TIM
7/273,4/298,0.7/323,0.09/348,0.
075/373,0.075/423
BT Laminate 298 elastic
Underfill 0.33 elastic
Elastic Modulus (MPa) Poisson's Ratio CTE (ppm/K)
FR-4 Board 298 elastic
Solder creep function: for 63Sn/37Pb solder
( ) | |
T
creep
e
88882 . 1
125938 . 0 sinh 2 . 12423 =
61417
&

U S U S U Eeq, Geq, veq,\
eq
m
j+1
n
j+1
n
j
m
j
m
j
n
j
n
j+1
m
j+1
Solder bump + Underfill
V
u
V
s
V
V V n
u u
/ =
V V n
s s
/ =
Total volume:
Bump volume:
Underfill volume:
s s u u eq
n E n E E + =
s s u u eq
n n + =
Equivalent material properties
Composite Algorithm
25
Fi ni t e El ement M odel & BC
Fi ni t e El ement M odel & BC

s
s
Remark:
Diagonal slice modeling for single-chip module
Solder ball profile is determined by program prediction
Coupling constraints make structure behave plane strain condition
Coupling UY
UX=0
UY=0
Coupling UX
Fix
Single-chip Module Modeling
Symmetric BCs
S
y
m
m
e
t
r
i
c

B
C

s

Slice Model
Substrate opening: 0.5 mm
PCB opening: 0.4 mm
Standoff height: 0.4 mm
26
Accumul at ed Pl ast i c and Creep St rai n
Accumul at ed Pl ast i c and Creep St rai n
Accumulated equivalent
plastic strain (1
st
cycle)
Accumulated equivalent
plastic strain (2
nd
cycle)
Accumulated equivalent
plastic strain (3
rd
cycle)
Accumulated equivalent
creep strain (2
nd
cycle)
Accumulated equivalent
creep strain (3
rd
cycle)
Accumulated equivalent
creep strain (1
st
cycle)
27
Exampl e of Case St udyi ng
Exampl e of Case St udyi ng
(a) 4112 cycles
(b) 1897 cycles
(c) 1151120 cycles
(d) 18036 cycles
(a) (c)
N
i
PEEQ CEEQ IEEQ IEEQ N
i
PEEQ CEEQ IEEQ IEEQ
Cycle 1 0.012766 1.332E-15 1.277E-02 0.0127660 Cycle 1 0.001228 5.995E-15 1.228E-03 0.0012280
Cycle 2 0.028515 1.998E-15 2.852E-02 0.0157490 Cycle 2 0.002155 1.044E-14 2.155E-03 0.0009270
Cycle 3 0.044276 2.665E-15 4.428E-02 0.0157610 Cycle 3 0.003071 1.488E-14 3.071E-03 0.0009160
(b) (d)
N
i
PEEQ CEEQ IEEQ IEEQ N
i
PEEQ CEEQ IEEQ IEEQ
Cycle 1 0.025338 1.332E-15 2.534E-02 0.0253380 Cycle 1 0.009468 1.776E-15 9.468E-03 0.0094675
Cycle 2 0.049560 2.665E-15 4.956E-02 0.0242220 Cycle 2 0.017186 3.109E-15 1.719E-02 0.0077185
Cycle 3 0.073809 3.997E-15 7.381E-02 0.0242490 Cycle 3 0.024829 4.441E-15 2.483E-02 0.0076430
Substrate Edge / Substrate Side
Substrate Edge / PCB Side
Chip Edge / Substrate Side
Chip Edge / PCB Side
Fatigue life at substrate edge / substrate side: 4412 cycles
Fatigue life at substrate edge / PCB side:1897 cycles (ASE:2000 cycles )
Fatigue life at chip edge / substrate side:1151120 cycles
Fatigue life at chip edge / PCB side:18036 cycles
28
Predi ct i on of Sol der Bal l Prof i l e
Predi ct i on of Sol der Bal l Prof i l e
-1.00 -0.75 -0.50 -0.25 0.00 0.25 0.50 0.75 1.00
0.00
0.10
0.20
0.30
0.40
PBC pad open: 0.380 mm
PBC pad open: 0.400 mm
PBC pad open: 0.475 mm
PBC pad open: 0.500 mm
Substrate pad open PCB pad open Standoff height
Case1 0.525 mm 0.380 mm 0.404 mm
Case2 0.525 mm 0.400 mm 0.399 mm
Case3 0.525 mm 0.475 mm 0.381 mm
Case4 0.525 mm 0.500 mm 0.374 mm
Programming by CY @ CCU (2000)
Original data are followed by KC
Pitch: 1 mm
29
PCB Pad Openi ng Ef f ect
PCB Pad Openi ng Ef f ect
Time (min) Pad=0.38 mm Pad=0.4 mm Pad=0.475 mm Pad=0.5 mm
0 0.000E+00 0.000E+00 0.000E+00 0.000E+00
600 1.572E-03 1.509E-03 1.409E-03 1.368E-03
900 1.572E-03 1.509E-03 1.409E-03 1.368E-03
1500 2.495E-02 2.467E-02 2.060E-02 1.983E-02
1800 2.790E-02 2.753E-02 2.285E-02 2.201E-02
2400 3.442E-02 3.397E-02 2.852E-02 2.754E-02
2700 3.442E-02 3.397E-02 2.852E-02 2.754E-02
3300 5.238E-02 5.099E-02 4.181E-02 3.972E-02
3600 5.527E-02 5.376E-02 4.405E-02 4.187E-02
4200 6.232E-02 6.054E-02 5.023E-02 4.789E-02
4500 6.232E-02 6.054E-02 5.023E-02 4.789E-02
5100 8.018E-02 7.733E-02 6.298E-02 5.960E-02
5400 8.310E-02 8.012E-02 6.523E-02 6.176E-02
cycle1 2.790E-02 2.753E-02 2.285E-02 2.201E-02
cycle2 2.738E-02 2.623E-02 2.120E-02 1.987E-02
cycle3 2.783E-02 2.636E-02 2.118E-02 1.989E-02
PEEQ 2.760E-02 2.630E-02 2.119E-02 1.988E-02
Time (min) Pad=0.38 mm Pad=0.4 mm Pad=0.475 mm Pad=0.5 mm
0 0 0 0 0
600 0.000E+00 0.000E+00 0.000E+00 0.000E+00
900 8.882E-16 8.882E-16 8.882E-16 8.882E-16
1500 1.332E-15 1.332E-15 1.332E-15 1.332E-15
1800 1.332E-15 1.332E-15 1.332E-15 1.332E-15
2400 1.332E-15 1.332E-15 1.332E-15 1.332E-15
2700 2.220E-15 2.220E-15 2.220E-15 2.220E-15
3300 2.665E-15 2.665E-15 2.665E-15 2.665E-15
3600 2.665E-15 2.665E-15 2.665E-15 2.665E-15
4200 2.665E-15 2.665E-15 2.665E-15 2.665E-15
4500 3.553E-15 3.553E-15 3.553E-15 3.553E-15
5100 3.997E-15 3.997E-15 3.997E-15 3.997E-15
5400 3.997E-15 3.997E-15 3.997E-15 3.997E-15
cycle1 1.332E-15 1.332E-15 1.332E-15 1.332E-15
cycle2 1.332E-15 1.332E-15 1.332E-15 1.332E-15
cycle3 1.332E-15 1.332E-15 1.332E-15 1.332E-15
CEEQ 1.332E-15 1.332E-15 1.332E-15 1.332E-15
1000
1500
2000
2500
3000
3500
Pad=0.38 mm Pad=0.4 mm Pad=0.475 mm Pad=0.5 mm
Predictition ASE
Pad Open 0.38 mm 0.40 mm 0.475 mm 0.50 mm
Prediction 1470 1617 2469 2797
ASE Data 1710 2056 2780 3388
Difference 16.3% 27.2% 12.6% 21.1%
30
M oi re I nt erf eromet ry
M oi re I nt erf eromet ry
M et hod
M et hod
zAkO@--qkA]N OQj
]-| zA HA@OW]A
t @OP]C~OA
W]KHAPO]-| zA A zA
KC
31
M oi re I nt erf eromet ry
M oi re I nt erf eromet ry
M et hod
M et hod
32
M oi re I nt erf eromet ry
M oi re I nt erf eromet ry
M et hod
M et hod
33
Shadow
Shadow
M oi re
M oi re
M et hod
M et hod
v| kO@D BD }aBOkAD
-n--~qC-zOQ@]vb
-vA]-| zA AHq
--~C]Q]-P]vb-v
-|AGv| kC
:ql c~qByq...
34
Shadow
Shadow
M oi re
M oi re
M et hod
M et hod
35
Shadow
Shadow
M oi re
M oi re
M et hod
M et hod
36
El ect ri cal Speckl e Pat t ern I nt erf eromet er (ESPI )
El ect ri cal Speckl e Pat t ern I nt erf eromet er (ESPI )
ql vzAN (ESPI ) -zOQql beO
ovAAHovhevAYi ot
zA At CWwAi OD -
---~qC
:-WB~oqBi D BD }a
(N D E)B}D -qBD ...
37
El ect ri cal Speckl e Pat t ern I nt erf eromet er (ESPI )
El ect ri cal Speckl e Pat t ern I nt erf eromet er (ESPI )
38
Three Poi nt Bendi ng
Three Poi nt Bendi ng
Stiffness is a measure of how easily an object will bend when put under. It is
often necessary to have stiff components, and this is achieved through the
combination of design, ie the geometry, and material selection. The main material
property that affects the stiffness is the Young's modulus, which has a large range
of values for different materials.
A strip of balsa undergoing a 3-point
bending test
The three-point bend can also
allow us to find the Young's
Modulus (E) of the material once
the second moment of area (I) is
known.
This is done by relating the
vertical displacement , to the
load W (= Mg) using the formula:
= WL
3
/48EI
where L = distance between the
supports.
39
D eri vat i on of equat i on under 3
D eri vat i on of equat i on under 3
-
-
poi nt Bendi ng
poi nt Bendi ng
Starting with
take moments about left hand end:
and integrate:
At x = L/2, dy/dx = 0, hence C1 = WL2/16
Integrate again:
At x = 0, y = 0, hence C2 = 0.
y is at a maximum at x = L/2, so
and
40
3
3
-
-
Poi nt Bendi ng f or Fract ure I nt ensi t y
Poi nt Bendi ng f or Fract ure I nt ensi t y
41
Four Poi nt Bendi ng
Four Poi nt Bendi ng
42
Four Poi nt Bendi ng I nst rument
Four Poi nt Bendi ng I nst rument
43
4
4
-
-
Poi nt Bendi ng Appl i cat i on
Poi nt Bendi ng Appl i cat i on
Four point bending test
With four point bending fixture a constant bending moment is achieved between
the two indenters. In three point bending the moment increases linearly from
support to the indenter.
The strain (and stress) in four point bending varies linearly across the test
specimen. e = M y / EI, where y is distance from the center of test sample Because
the bending moment is constant between the indenters also the strain is.
When the reliability of solder joints is tested 4 point bending test is good because
all joints between the indenters are under equal loading.