Mechatronics Systems:

A Semiconductor Perspective

These slides are from a presentation given by: Simon Thomas (Motorola)

September 7, 2000
Mechatronics 2000 S.T

Outline
Introduction Automotive Opportunities
- Business - Motor Control - Smart Connector - MEMS integration - Emerging Systems

In the Home Opportunities System Needs of Semiconductors

- System on Chip - System in Package - Design Methodology

Conclusion
Mechatronics 2000 S.T

Mechatronics: Technology Integration

The synergistic combination of mechanical, electrical, and computer engineering - emphasis on integrated design for products - optimal combination of appropriate technologies
Mechatronics 2000 S.T

Mechatronics
Micro to Macro Applications

Mechatronics 2000 S.T

Dynamic Growth in Automobile Electronics

Automotive Semiconductor TAM World-Wide [$B]
40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 1975 Uncertainty 5fth Wave 5fth Wave (EPAS, X-by-Wire, 42V...) ITS (w/o Radio) Body (Comfort, Light) Safety (ABS, Airbag...) Engine Control

Mechatronics
Feature/Cost Driven

Multiplex Networking
Feature/Cost Driven

1980

1985

1990

1995

2000

2005

2010

Mechatronics 2000 S.T

5th Wave
(Conversion of Mechanical to Electronic Systems)
Typical Applications Brake-By-Wire system Steer-By-Wire Integrated vehicle dynamics Camless engines Integrated starter alternator
Direct Fuel Injection Continuously Variable Transmission Electric AC Compressor

Electric Valve Control

Active Suspension

OEM Driven Reliability Reduced weight Fuel economy Manufacturing flexibility Design freedom Advanced safety features Cost

Electric Water Pump

Crankshaft Starter Generator

Electric Brake (Brake-by-Wire)

42 Volt Electric Converter Mechatronics 2000 S.T Assist Power Steering

Steer-by-Wire

Automotive Semiconductor Market

$300
Vehicle Production

60
Rising Semiconductor Content Per Vehicle

$250 $200 $ Per Car $150 $100 $50 $0 1999 2000

50 40 30 20 10 0 Vehicles (In Millions)

2001

2002

2003

2004

Source: Strategy Analytics, 1999

Mechatronics 2000 S.T

Motors Are Everywhere:

From Simple to Sophisticated
Hand-held power tools to Precision-control robots Panel-based settings to intelligent spin control Window lifts to brake-by-wire Single speed to variable speed fans and blowers
*Motion Tech Trends February 1999

Industrial picture

automotive

Mechatronics 2000 S.T

ELEC TR IC M OT OR USA GE : M o to rs per v ehicle

250 200 150 100 50 0
60 90 19 85 30 45 00 15 19 19 75 19 18 19 19 19 20 05

Q uantity

1/27/99

MIT/Industry Consortium
Mechatronics 2000 S.T

Motors in Cars
Solenoid Stepper DC Stepper DC DC AC

Climate Light Level. Mirror Dashboard Dashboar d Gauges Hydraulics

Centr. Locking

R-Wiper Seat Mover

F-Wiper Window Lift Sun Roof

Climate Fan Engine Fan P-Steering

0.01 0.1

1 10

2.5 30

5 60

15 120

50 ITYP [A] 600 Power [W]

Mechatronics 2000 S.T

Mechatronic Systems
Example : Stepper Motor Driver for Climate Control

Stepper Motor

Existing Control Circuit/Connector Assembly

Final Motor Assembly

Solution : A Smart Connector

IC

Motorola MUX 3

HC05 Systemchip (S3)+ Chip Capacitor in Single Plastic Semiconductor Package With Lead Frame Formed to Meet Connector Requirements. Integration of Components and Connector Function Eliminates An Entire Assembly Level.

Chip Capacitor

Mechatronics 2000 S.T

Mechatronics: Stepper motor controller

L2 R2

R1 L1
G
BU S

ND

VS UP

HC05 Core 1008 Byte programm ROM or E2PROM On-Chip 4.96 MHz RC Oscillator On-Chip 5V Voltage Regulator ISO9141 Single-wire bus interface transceiver (LIN) Four universal 5 Ohms push-pull outputs
Mechatronics 2000 S.T

Potential Mechatronic Modules in a Car

Mechatronics 2000 S.T

Mechatronics Door Modules

3 wire LIN Bus

Smart Mirror motor-unit pin-header CAN Bus

Smart Doorlock

Smart Window Lift-unit

Switchboard with CAN Bus Gateway

Mechatronics 2000 S.T

Seat Module Solution

Seat Harness Architecture showing various smart connector interconnections solutions

Mechatronics 2000 S.T

Typical Smart Connector

FET

FET

MCU CONTROL

FET

FET

uC + TMOS Substrate Assembly and Test

Assembly into Module Final Test

Stamp Leadframe Overmold Leadframe Mold Housing

Mechatronics 2000 S.T

Technology Integration
System interconnect and packaging technology

System-on-Chip and substrate / chip-interconnect technology

Mechatronics 2000 S.T

Micro Electro Mechanical System (MEMS) Integration

Mechatronics 2000 S.T

General Accelerometer Applications

Acceleration / deceleration Velocity Precision displacement Shock / vibration Detecting premature failure in rotating equipment Detecting & measuring excessive handling/ shock Tilt / Inclinometer

Mechatronics 2000 S.T

Z-Axis Accelerometer Two Chip Packaging Solution

Mechatronics 2000 S.T

Pressure Sensor- Packaging

Pressure Stainless Steel Cap Package

Silicone Gel Die Coat Wire Bond

Die

Lead frame Pressure

RTV Die Bond

Basic chip carrier package gauge or differential die

Mechatronics 2000 S.T

MEMS Sensors
MGS1100 Sensor Package

CO

CO

CO

Metal Si (2.5m) SiO2 Poly Si SnO 2 Sensor Contacts Membrane Heater

Die attach

Sensor Header
Mechatronics 2000 S.T

Emerging Systems: Advanced Braking

Brake By Wire
Advanced silicon and fault tolerant protocol
Provides increased features for Total Stability Control Advanced Vehicle Dynamics through integration of Cruise Control and Braking Systems CPUs, Power and SmartMOSTM Intelligent Sensors Brake By Wire Architecture

Advanced Braking

Front Brake 1

PEDAL

Rear Brake1 BUS1 BUS2

Front Brake2

High Level ECU or gateway Mechatronics 2000 S.T

Rear Brake2

Emerging Systems: Hybrid Engines

Advanced control,liter Car!! power 42V/14V Moving towards the 3 system and Fifth(>10kW)products Increased power Wave
Lowering emissions (-30%) High performance PowerPCTM User friendly stop-starts DSP cores for vector control Integration with other 42V systems (Combined Alternator Starter, Power and SmartMOSTM products for high Electronic Valve Control) power battery control Intelligent Sensors for temperature and position Dependable real-time bus Hybrid Architecture
Starter Generator 4cyl Engine Inverter Nickel/Metal Hydride Battery

Hybrid Engines

Motor ECU Re-Generative Braking Mechatronics 2000 S.T

Total Connectivity
Paging messaging data AM/FM/DAB MP3/DVD/Games XM & Command Audio Mobile Computer navigation www server PIM applications Cellular voice data

Display e-call messages route instructions

PDA Support Palm Organiser

Positioning (GPS)

OEM Bus/IDB Gateway Mechatronics 2000 S.T (with firewall)

Existing OEM Vehicle Bus

In-the-Home Opportunities

Mechatronics 2000 S.T

Appeal of Smart Kitchens

MORI survey commissioned by Motorola
1/3 of European consumers want technology to make home life easier and more fun Two most desired smart products:
- One-button washing machine - Intelligent oven

Consumers want technology to: - Reduce environmental waste - Save energy costs
Mechatronics 2000 S.T

* *
iFridge

Smart Sensors

Networked Appliances

* * * *
DigitalDNA Technology in the Kitchen
- Networked appliances - Motor controls - Smart sensors Motor Controls
Mechatronics 2000 S.T

Lawn Tool Motor Controls

* * * *
White Goods Motor Controls

* * *

Industrial Motor Controls

DigitalDNA Technology in the Workshop

- Motor controls
Mechatronics 2000 S.T

Exercise Equipment Motor Controls

Power Supply Rectifiers/Regulator

MC7805

Washing Machine System Solution

Pressure Sensor MPX5006/MPX2010

MC68HC08MP16
2E72G SSAC9616-A

User Interface

8-bit MCU

TUB
Motor Driver (IGBT Inverter) MGP4N60ED MGP7N60ED MGP11N60ED

Motorola Daves Control Center

MOTOR/PUMP

Mechatronics 2000 S.T

Smoke Detector System

Smoke

Smoke Test
Smoke IC

LED Driver

Ion Chamber ( or Photo Chamber)

Horn Driver Smoke Signal

Horn To other units, Escape lights, Aux. Alarms, etc.
Mechatronics 2000 S.T

I/O

Motor Controls: Turning White Goods Green

Motorola has created a family of DSPs and
MCUs for all motor types (DSP5680X) These embedded solutions serve as a brain for the motor Motors are now able to determine amount of energy required to get a particular job done Result: cost and energy savings for manufacturers and consumers alike
Mechatronics 2000 S.T

Motor Control Example: Washing Machine

Indirect Drive, 3-Phase, AC Induction Motor

POWER STAGE

ANALOG CONDITIONING

Motor Controls Enable: More economical to build Cleaner clothes Better fabric care Reduced drying time Improved energy management Overall machine control without additional controller

Hot Water Valve Control

Cold Water Valve Control

Motor Control

DSP56F805
Mechatronics 2000 S.T

Motor Temp

Water Temp

Cycle Control Settings

Motor Control Example: Refrigerator

3-Phase, Sensorless BLDC Motor

FAN

Motor Controls Enable: Improved operating economy Lower manufacturing costs Better food preservation

Temperature Reading

Temperature Setting

ANALOG CONDITIONING

POWER STAGE

DSP56F803
Mechatronics 2000 S.T

Local Area Networks

Linking the Entire Home

Mechatronics 2000 S.T

Connected Home
Multiple user interface options Communicating thermostats and sensors

HomeManagerTM software UniversalControllerTM for HVAC, lighting, security

ControlServerTM OSGi using MCore processor

InvensysReadyTM appliances

Peracom Avcast SmartModuleTM technology Mechatronics technology 2000 S.T

System Needs for Semiconductors

Mechatronics 2000 S.T

System Needs for Semiconductors

Today's "glamour chips" such as MPUs, DSPs and DRAMs must be surrounded by a wide array of discretes and passives
PRESSURE PRESSURE CHEMICAL CHEMICAL ACCELERATION ACCELERATION MOTION MOTION POSITION POSITION SIGNAL SIGNAL

ISO ISO COUPLE COUPLE PROTECT PROTECT

MPU MPU MCU MCU DSP DSP MEMORY MEMORY

POWER TRANS POWER TRANS RECTIFIER RECTIFIER THYRISTOR THYRISTOR IGBTS IGBTS RF POWER RF POWER

ISO ISO COUPLE COUPLE PROTECT PROTECT

SENSING SENSING INPUT INPUT

DECISION DECISION MAKING MAKING

WORK WORK OUTPUT OUTPUT

POWER POWER

RECTIFIERS RECTIFIERS POWER TRANSISTORS POWER TRANSISTORS

Mechatronics 2000 S.T

Semiconductor Technology Spectrum

0.13 0.18 0.25 0.25 0.5 0.65 0.65 0.65 1.4 0.15mcm2 2 0.3mcm 0.6mcm2

CMOS
High-End Computing 64/128-bit CPU 6-layer metal, 2.5/1.8V

CMOS + Flash

SMARTMOS
Robust I/O, Mid-Power 40/65/80V Bip + CMOS digital/analog/NVM-trim

TMOS
High-Power 40/65/80V Low-RDSON FET protection and I/T-sensing

Embedded Control 8/16/32-bit micro NVM 512Kbyte limited analog, 40V I/O Code Synthesis

C Assembler

Flip-Chip SMT, BGA

1.2kW / 30A / 42V / 150Camb 200W / 15A / 14V / 85Camb

Software
Hardware Driver Operating System (OSEK, Time Triggered OS) Networking (LIN, CAN, TTx, MOST)

IC. Packaging
SoC MCM System in Package

Mechatronics 2000 S.T

CMOS Technology Platform

Copper & Low k Dielectric
Copper

High k & Metal Gates

Silicide Poly Si Cap TiN

TFSOI

Buried Oxide Low k Dielectric High k Gate Silicon Substrate

Process Performance

gh Hi

r rfo Pe

S ce n ma

s te m ys

1.8 GHz SOI 1.5 GHz SOI 1.0 GHz SOI .03ma/MIPS .05ma/MIPS .10ma/MIPS

600 MHz

350 MHz

.12ma/MIPS .40ma/MIPS

120 MHz

.55ma/MIPS

P gh Hi

r rfo e

m Co ce an m

s ion t ica n mu

1994

1995

1996

1997

1998

1999

Mechatronics 2000 S.T

2000

2001

2002

2003

2004

Production Dates

Integrated Packaging for System Solutions

PCB
Packages on PC Board IC R L C PCB Multi-Chip-Package IC IC

MCP
Modules on Chip

Increased Density Increased Performance Improved Reliability

SoC
Selected Modules & MCP Technology
Application Specific System Partitioning

Cost-Performance Tradeoff Latitude: _ Technology Mix & Match _ Performance Adaptability

Mechatronics 2000 S.T

DRIVING FORCES FOR PACKAGE LEVEL INTEGRATION

INTEGRATION OF MIXED TECHNOLOGIES. PERFORMANCE IMPROVEMENTS. SIZE / WEIGHT REDUCTION. SYSTEM COST REDUCTION. MANUFACTURABILITY. SERVICING ENHANCEMENTS. ERGONOMICS. DESIGN FLEXIBILITY.
Mechatronics 2000 S.T

Mechatronics Packaging Challenges

System Partitioning (function, technology, cost etc) System Cost Multichip Issues (KGD, Test) Diverse packaging /interconnect technologies Thermo-mechanical Performance and Design Guidelines Thermal management Micro vs. Macro electronics Reliability
Mechatronics 2000 S.T

Design Approach Today

System Requirements Partitioning Logic Memory Power Incomplete requirements

IC design

IC design

IC design

Debugging

PKG design

PKG design

PKG design

Substrate/Interconnect Design

Mechatronics 2000 S.T

Mechatronics System Design

System Requirements
Functional Partitioning Partitioning Digital Analog SW
System cost/performance trade-off

Tech choice IC Substrate design kits design kits

IC design

Package design

CMOS TMOS SubMEMS system PBGA Substrate LTCC design PASSIVES

Schematic Verification System Simulation Test Generation Cost Design Infrastructure

Mechatronics Design Framework

Package library

Mechatronics 2000 S.T

Mechatronics--- Confluence of diverse fields of Science and Technology - Semiconductors key enabler - Integration of mixed technology components for system performance - IC Design methodology for System needs - Business opportunities unlimited
Mechatronics 2000 S.T