1.

PREFACE A) INTRODUCTION :The circuit for OPTIC FIBRE COMMUNICATION SYSTEM is designed to demonstrate the transmission and reception of a digital data through an optic fiber cable. The optic signals generated by the transmitter circuit are received by the optical receiver circuit after transmission through an optic fiber cable. This communication is much more effective than ordinary communication. It provides bandwidth in the GHz range. It provides minimum transmission loss. It finds many applications in communication systems, measuring systems, industrial, medical and military applications.

B) GENERAL DESCRIPTION
This Kit allows you to send sound through 1mm plastic fibre optic (FO) cable. On the transmitter (Tx) circuit board (marker KIT 26T) there is a microphone and a circuit to modulate the light emitted from an LED. The LED is contained in a plastic case which allows easy connection of the FO cable. On the receiver (Rx) board (marked KIT26R) there is the photo-darlington receiver unit, a speaker and a circuit to convert and amplify the detected signal back into a sound wave. Because the signal travels in the FO cable as a light wave it is unaffected by any electric or magnetic fields that it travels through. Each board requires a 9V battery. However, for continuous use plug packs would be advised. Fourteen feet of 1mm diameter plastic (FO) cable is supplied. This Kit can be used to send a signal in well over 200 yards of cable. Note that the plastic FO cable used here is not the glass 1 micron FO cable which is used in long distance (say 20 miles) communications. However, plastic cable introduces most FO concepts, is far easier for the experimenter to use and certainly has definite uses for short distance communication in electrically noisy environments. The kit is constructed on a single-sided printed circuit board (PCB). Protel Autotrax and Schematic were used to design the board.

TECHNICAL SPECIFICATION WORKING VOLTAGE 230V AC OPERATING CURRENT 250 MA RANGE 1.5 METERS

BASIC DESCRIPTION OF FIBER OPTIC CABLE To understand how a fiber optic cable works, imagine an immensely long drinking straw or flexible plastic pipe. For example, imagine a pipe that is several miles long. Now imagine that the inside surface of the pipe has been coated with a perfect mirror. Now imagine that you are looking into one end of the pipe. Several miles away at the other end, a friend turns on a flashlight and shines it into the pipe. Because the interior of the pipe is a perfect mirror, the flashlight's light will reflect off the sides of the pipe (even though the pipe may curve and twist) and you will see it at the other end. If your friend were to turn the flashlight on and off in a morse code fashion, your friend could communicate with you through the pipe. That is the essence of a fiber optic cable. Making a cable out of a mirrored tube would work, but it would be bulky and it would also be hard to coat the interior of the tube with a perfect mirror. A real fiber optic cable is therefore made out of glass. The glass is incredibly pure so that, even though it is several miles long, light can still make it through (imagine glass so transparent that a window several miles thick still looks clear). The glass is drawn into a very thin strand, with a thickness comparable to that of a human hair. The glass strand is then coated in two layers of plastic. By coating the glass in plastic, you get the equivalent of a mirror around the glass strand. This mirror creates total internal reflection

just like a perfect mirror coating on the inside of a tube does. You can experience this sort of reflection with a flashlight and a window in a dark room. If you direct the flashlight through the window at a 90 degree angle, it passes straight through the glass. However, if you shine the flashlight at a very shallow angle (nearly parallel to the glass), the glass will act as a mirror and you will see the beam reflect off the window and hit the wall inside the room. Light traveling through the fiber bounces at shallow angles like this and stays completely within the fiber. To send telephone conversations through a fiber optic cable, analog voice signals are translated into digital signals works. A laser at one end of the pipe switches on and off to send each bit. Modern fiber systems with a single laser can transmit billions of bits per second -- the laser can turn on and off several billions of times per second. The newest systems use multiple lasers with different colors to fit multiple signals into the same fiber. Modern fiber optic cables can carry a signal quite a distance -- perhaps 60 miles (100 km). On a long distance line, there is an equipment hut every 40 to 60 miles. The hut contains equipment that picks up and retransmits the signal down the next segment at full strength.

CIRCUIT EXPLANATION The voice signal begins as a sound wave. It is converted to an electrical signal by the electret microphone in the Tx circuit. This signal is amplified by the LM358 audio amplifier and converted to an optical signal by switching the voltage to the LED via a signal transistor. This optical signal is fed into the plastic fiber optic cable. At the other end of the cable the optical signal is directed at a photodarlington in the receiver which converts it to an electrical signal again. The signal is amplified and fed into a speaker where it becomes a sound wave. A voltage regulator has been used in the circuit to overcome feedback in the circuit.

ASSEMBLY INSTRUCTION First of all check off the components against the Component Listing on the next page. Especially make sure to get the resistors correctly identified. Note that the FO emitter & detector modules are very similar. The detector which goes on the receiver board has a red dot marked on its black case. The emitter which goes on the transmitter board has a pink dot on a blue case. The components for both boards are mixed together. Make one board at a time. Look at the circuit schematic diagram, identify the component then place it in the board. It is

generally best to add the lowest height components first. So place the resistors first. The electret microphone must be inserted with the pin connected to the metal case connected to the negative rail (that is, to the ground or zero voltage side of the circuit.) This is marked with a '-' sign on the MIC on the transmitter circuit board. Make sure to get the electrolytic capacitors around the correct way. To get the highest transmission efficiency, make sure that the ends of the FO cable are square cut cleanly. You can experiment with different degrees of smoothness. You will find that the LED gives out so much signal that even with the worst cutting you will almost certainly get good reception over the 14 feet of cable supplied.

PART (COMPONENTS) LIST [RX]

R1 R2 R3, R4 R5 R6 P1 C1 C2 C3 C4 D1-D4 U1 U2, U3 Q1 TX1 2 NOS 1 NOS LM741 10K

3K3 4K7

100E 1K 1M/3006 TRIMOT 1000UF/16V 22UF/16V 47KPF DISC 10UF/25V 4007 DIODE (4 NOS) LM7809

BC547 FBO TRANSMITTER 8 PIN IC SOCKET CON.MICE

1NOS

0-2 / 250 ma XMER

PART (COMPONENTS) LIST [RX] R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 C1, C2, C3, C4, C5 C8, C9 C2 C6 C10 C11 D1-D4 U1 U2 U3 RX1 2 NOS 1 NOS 1000/16V 10UF/25V 10UF/25V 47KPF DISC 4007 DIODE (4NOS) LM 7805 LM 358 LM 386 FIBER OPTIC RECEIVER 8 PIN IC SOCKET 0-12/250 ma X MER 100K 1M 1K 100K 100K/3006 TRIMPOTE 10K LOG VOLUME CONTROL 220L 100K 10K 4.7E 0.1UF DISC (104)

1 NOS 1 NOS

3mm FIBER OPTIC CABLE (1.5) 2 SPEAKER

B) DESIGN OF THE PROJECT:

a) BLOCK DIAGRAM:-

Voice Through Fiber Cable - Rx

Power Supply

OFC Rx Spk Audio Amp & Pre Amp

Fiber Optic Cable

Voice Through Fiber Cable - Rx

Power Supply

Mic

Mic Pre Amp

OFC Tx

Fiber Optic Cable

b) Component List:-

1. ICs

Number

Quantity

Rate/P.

AT89C51 LM324 1738 LM7805 LM555

1 1 1 1 1

140.00 40.00 35.00 10.00 10.00

2. Transistors BC548B 9 3.00

3. Light Emitting Diodes (LEDs) Red 6 1.50

4. Diodes IN4007 9 1.50

5. Zener Diodes 5V 3 4.00

6. Crystal 12 Mhz 1 30.00

7. Electrolytic Capacitors

1000uF/25V 22uF/25V 10uF/25V 8. Ceramic Capacitors 103pF 150pF 33pF 9. Variable Resistors Preset 2k 10. Carbon Resistors (0.25W) 10K 2.2K

1 1 1

7.00 3.00 3.00

3 1 2

1.00 1.00 1.00

5.00

9 2

0.25 0.25

1K 220E 100E 2 2

10 0.25 0.25

0.25

11. Relays 12V/200E 6 25.00

12. PCB 6 X 9 13. Meslenious. IC Base(40pin) IC Base(20 pin) IC Base(16 pin) IC Base(8 pin) Ferric Chloride Soldering Wire Connecting Wire Soldering Paste c) Component Description:RESISTORS:A Resistor is a heat-dissipating element and in the electronic circuits it is mostly used for either controlling the current in the circuit or developing a voltage drop across it, which could be utilized for many applications. There are various types of resistors, which can be classified according to a number of factors depending upon: (I) Material used for fabrication (II) Wattage and physical size (III) Intended application (IV) Ambient temperature rating (V) Cost Basically the resistor can be split in to the following four parts from the view point. (1) Base 1 1 1 1 100 gms. 20 gms. 2 mtrs. 10 gms. 14.00 6.00 5.00 3.00 40.00 12.00 10.00 5.00 1 90.00

construction

(2) Resistance element (3) Terminals (4) Protective means. The following characteristics are inherent in all resistors and may be controlled by design considerations and choice of material i.e. Temperature co-efficient of resistance, Voltage co efficient of resistance, high frequency characteristics, power rating, tolerance &voltage rating of resistors. Resistors may be classified as. (1) Fixed. (2) Semi variable. (3) Variable resistor In our project carbon resistors are being used. CAPACITORS Capacitor is an energy storing component & it allows ac component and blocks the dc component. The fundamental relation for the capacitance between two flat plates separated by dielectric material is given by:C=0.08854KA/D Where C= capacitance in pf. K= dielectric constant A=Area per plate in square cm. D=Distance between two plates in cm Design of capacitor depends on the proper dielectric material with particular type of application. The dielectric material used for capacitors may be grouped in various classes like Mica, Glass, air, ceramic, paper, Aluminum, electrolyte etc. The value of capacitance never remains constant. It changes with temperature, frequency and aging. The capacitance value marked on the capacitor strictly applies only at specified temperature and at low frequencies.

LED (Light Emitting Diodes) As its name implies it is a diode, which emits light when forward biased. Charge carrier recombination takes place when electrons from the N-side cross the junction and recombine with the holes on the P side. Electrons are in the higher conduction band on the N side whereas holes are in the lower valence band on the P side. During recombination, some of the energy is given up in the form of heat and light. In the case of semiconductor materials like Gallium arsenide (GaAs), Gallium phosphide (Gap) and Gallium arsenide phosphide (GaAsP) a greater percentage of energy is released during recombination and is given out in the form of light. LED emits no light when junction is reverse biased.

TRANSISTOR:A transistor consists of two junctions formed by sandwiching either p-type or n-type semiconductor between a pair of opposite types. There are two types of transistors namely: 1. n-p-n transistor 2. p-n-p transistor An n-p-n transistor is composed of two n-type semiconductors separated by a thin section of p type. However a p-n-p transistor is formed by two p sections separated by a thin section of n-type. In each type of transistor the following points may be noted.

(NPN)

(PNP)

A transistor raises the strength of a weak signal and thus acts as an amplifier. The weak signal is applied between emitter base junction and output is taken across the load Rc connected in the collector circuit (in common emitter configuration). In order to achieve faithful amplification, the input circuit should always remain forward biased. To do so, a dc voltage is applied in the input in addition to the signal. Transistor may be used in different configuration like CB (common base) & CC (common collector) according to requirements of amplifier (impedance matching, buffer amplifier etc.).

TRANSFORMERS:Definition The transformer is a static electro-magnetic device that transforms one alternating voltage (current) into another voltage (current). However, power remains the same during the transformation. Transformers play a major role in the transmission and distribution of ac power.

Principle Transformer works on the principle of mutual induction. A transformer consists of laminated magnetic core forming the magnetic frame. Primary and secondary coils are wound upon the two cores of the magnetic frame, linked by the common magnetic flux. When an alternating voltage is applied across the primary coil, a current flows in the primary coil producing magnetic flux in the transformer core. This flux induces voltage in secondary coil. Transformers are classified as: (a) Based on position of the windings with respect to core i.e. (1) (2) (b) Core type transformer Shell type transformer

Transformation ratio: (1) (2) Step up transformer Step down transformer

(c)

Core & shell types: Transformer is simplest electrical machine, which consists of windings on the laminated magnetic core.

(1) Winding encircle the core in the case of core type transformer. (2) Cores encircle the windings on shell type transformer. (3) Step up and Step down: In these voltage transformation takes place according to whether the primary is high voltage coil or a low voltage coil.

DIODES:Diode is a two terminal device consisting of a P-N junction formed either of Ge or Si crystal.

The P and N type regions are referred to as anode and cathode respectively. Commercially available diodes usually have some means to indicate which lead is P and which lead is N.

RELAY:In this circuit a 12V magnetic relay is used. In magnetic relay, insulated copper wire coil is used to magnetize and attract the plunger. The plunger is normally connected to N/C terminal. A spring is connected to attract the plunger upper side. When output is received by relay, the plunger is attracted and the bulb glows.

d) Cicuit Diagram

3. FINAL DESIGN
a) Circuit Description:The voice signal begins as a sound wave. It is converted to an electrical signal by the electret microphone in the Tx circuit. This signal is amplified by the LM358 audio amplifier and converted to an optical signal by switching the voltage to the LED via a signal transistor. This optical signal is fed into the plastic fiber optic cable. At the other end of the cable the optical signal is directed at a photo-darlington in the receiver which converts it to an electrical signal again. The signal is amplified and fed into a speaker where it becomes a sound wave. A voltage regulator has been used in the circuit to overcome feedback in the circuit. b) Circuit Layout:-

4. HARDWARE IMPLEMENTATION
P.C.B. MANUFACTURING PROCESS

It is an important process in the fabrication of electronic equipment. The design of PCBs (Printed Circuit Boards) depends on circuit requirements like noise immunity, working frequency and voltage levels etc. High power PCBs require a special design strategy. The fabrication process to the printed circuit board will determine to a large extent the price and reliability of the equipment. A common target aimed is the fabrication of small series of highly reliable professional quality PCBs with low investment. The target becomes especially important for customer tailored equipments in the area of industrial electronics. The layout of PCBs has to incorporate all the information of the board before one can go on the artwork preparation. This means that concept which clearly defines all the details of the circuit and partly defines the final equipment, is prerequisite before the actual lay out can start. The detailed circuit diagram is very important for layout designer but he must also be familiar with the design concept and with the philosophy behind the equipment.

BOARD TYPES: The two most popular PCB types are: 1. Single Sided Boards Single-sided PCB means that wiring is available only on one side of the insulating substrate. The side which contains the circuit pattern is called the solder side whereas the other side is called the component side. These types of boards are mostly used in case of simple circuitry and where the manufacturing costs are to be kept at a minimum. Nevertheless, they represent a large volume of printed boards currently produced for professional and non-professional grades. 2. Double Sided Boards Double-sided PCBs (Double-sided Printed Circuit Boards) are one step up above single-sided printed circuit board in their complexity. Double Sided PCBs require plated through holes between top and bottom pads to provide better anchoring for soldered components. This process and the resultant boards allow interconnections between layers through all holes. And meanwhile, most designs require solder mask front and back along with a silkscreen layer for component designators.

CHRONOLOGY

The following steps have been followed in carrying out the project.

1. Study the books on the relevant topic.

2. Understand the working of the circuit.

3. Prepare the circuit diagram.

4. Prepare the list of components along with their specification. Estimate the

cost and procure them after carrying out market survey.

5. Plan and prepare PCB for mounting all components.

6. Fix the components on the PCB and solder them.

7. Test the circuit for the desired performance.

8. Trace and rectify faults if any.

9. Give good finish to the unit.

10. Prepare the project report.

DESIGN SPECIFICATION

STEPS TAKEN WHILE PREPARING CIRCUIT A) PCB DESIGNING: The main purpose of printed circuit is in the routing of electric currents and signals through thin copper layer that is bounded firmly to and insulating base material sometimes called the substrata. This base is manufactured with an integral bounded layer of thin copper foil which has to be partly etched or otherwise removed to arrive at a pre-designed pattern to suite the circuit connections. From the constructors point of view the main attraction of using PCB is its role as the mechanical support for small components. There is less need for complicated and time consuming metal work or chassis construction except perhaps in providing in the final enclosure. Most straight forward circuit designs can be easily converted into printed wiring layout the thorough required to carry out the conversion can often highlights any possible error that would otherwise be missed in convention point to point wiring. The finished project is usually neater and truly a work of art. Actual size PCB layout for the circuit shown is drawn on the copper board. The board is then immersed in FeCl3 solution for 12 hours. In this process only the exposed copper portion is etched out by the solution. Now the petrol washes out the paint and the copper layout on PCB is rubbed with a smooth sand paper slowly and lightly such that only the oxide layers over the Cu are removed. Now the holes are drilled at their respective places according to component layout as shown in figure. B) LAYOUT DESIGN: When designing the layout one should observe the minimum size (component body length and weight). Before starting to design the layout have all the required components to hand so that an accurate assessment of space can be made care must be taken so as to allow for adequate air flow after the components have been mounted. It might be necessary to turn some components round to a different angular position so that terminals are closer to the connections of other components. The scale can be checked by positioning the components on the squad paper. If any connection crosses, then one can reroute to avoid such condition. All common or earth lines should ideally be connected to a common line routed around the perimeter of the layout this will act as the ground plane. If possibly try to route the outer supply line ground plane. If possibly try to route the

other supply lines around the opposite edge of the layout or through the center. The first step is to rearrange the circuit to eliminate the crossover without altering the circuit detail in any way. Plan the layout as if looking at the top side of the board. First this should be translated in reverse later for the etching pattern. Larger areas are recommended to maintain good copper adhesive. It is important to bear in mind always that copper track width must be at least to the recommended minimum dimensions and allowance must be made for increased width where termination holes are needed from this aspect it can become little tricky to negotiate the route for connections to small transistors. One can affect the copper interconnection pattern in the underside of the board in a way described below Make the interconnections pattern looking like conventional point to point writing by routing uniform width of copper from component to component. C) ETCHING PROCESS Etching process requires the use of chemicals, acid resistant dishes and a running water supply. Ferric chloride is the maximum used solution, but other enchants such as ammonium sulfate can be used.Nitric acid can also be used but in general it is not used due to the poisonous fumes. The pattern prepared is glued to the copper surface of the board using a latex type of adhesive that can be cubed after use. The pattern is laid firmly on the copper, use vary sharp knife to cut round the pattern carefully and remove the paper corresponding to the required copper pattern areas. Then apply the resist solution clean outlines as for as possible. While the board is drying to test all components. Before going to the next stage, check the whole pattern and cross check against the circuit diagram check for any foreign matter on the copper. The etching bath should be in a glass or enamel disk. If using crystal of ferric chloride these should be thoroughly dissolved in water to the proportion suggested. There should be 0.5 Lt. Of water for 125 gm of crystal. The board is then immersed in FeCl3 solution for 12 hours, in this process only the non-hidden copper portion is etched out by the solution. 2FeCl3 + 2H2O + 3Cu 0 3CuCl2 + 2Fe (OH) 2 Waste liquid should be thoroughly diluted and buried in water land never pour down the drain. To prevent particles of copper hindering further etching, agitate the solutions carefully by gently twisting or rocking the tray. The board should not be left in the bath a moment longer than is needed to remove just the right amount of cooper. In spite of there being a resist coating, there is no protection against etching away through exposed copper edges; this leads to over etching. Have running water ready so that the etched board can be removed properly and rinsed; this will halt etching immediate. Now the paint is washed out by the petrol. Now the copper layout on PCB is rubbed with a smooth sand paper slowly and lightly such that only the oxide layers over the Cu is removed. Now the holes are drilled at the respective places, according to component layout as shown in figure.

Drilling is one of those operation that calls for great care, because most of the holes will be made and vary small drill. For most purpose a no. 60 drill all holes
with this size first those that need to be larger can be easily drilled again with the appropriate large size.

D) COMPONENT ASSEMBLY:There should be no damage, such as hair line crack in the copper on PCB that could have a serious effect on the operational ability of the completed assembly holes.If there are, than they can and should be repaired first, by soldering a short link of bare copper wire over the affected part. The most popular method of holding all the items is to bend the wires further apart after they have been inserted in the appropriate holes. This will hold the component in position ready for soldering. Some component will be considerably larger than others, occupying and possibly partly obscuring component. Because of this, it is best to start by mounting the smallest first and progressing through to the largest, before starting, makes certain that no further drilling is likely to be necessary, because access may be impossible later. When filling each group of components, mark off each one on the components list as it is fitted and, if we have to leave the job, we will know where to recommence. Although transistors and integrated circuits are small items, there are good reasons for leaving the soldering of these until the last step. The main point is that these components are varying sensitive to heat and if subjected to prolonged application of the soldering iron, they could be internally damaged. All the components before mounting are rubbed with sand paper so that oxide layer is removed iron their tips. Now they are mounted according to the components layout. E) SOLDERING:This is the operation of joining the components with PCB after this operation the circuit will be ready to use to avoid any damage or fault during this operation following care must be taken. 1. A longer duration contact between soldering iron bit & components lead can exceed the temperature rating of device & cause partial or total damage of the device. Hence before soldering we must carefully read the maximum soldering temperature & soldering time for device

2. The wattage of soldering iron should be selected as minimum as permissible for that soldering place. 3. To protect the devices by leakage current of iron its bit should be earthed properly. 4. We should select the soldering wire with proper ratio of Pb & Tn to provide the suitable melting temperature. 5. Proper amount of good quality flux must be applied on the soldering point to avoid dry soldering.