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D D D D
Fast Response Times Strobe Capability Maximum Input Bias Current . . . 300 nA Maximum Input Offset Current . . . 70 nA
LM111 . . . JG PACKAGE LM211 . . . D, P, OR PW PACKAGE LM311 . . . D, P, PS, OR PW PACKAGE (TOP VIEW)
1 2 3 4
8 7 6 5
NC VCC
NC No internal connection
description/ordering information
The LM111, LM211, and LM311 are single high-speed voltage comparators. These devices are designed to operate from a wide range of power-supply voltages, including 15-V supplies for operational amplifiers and 5-V supplies for logic systems. The output levels are compatible with most TTL and MOS circuits. These comparators are capable of driving lamps or relays and switching voltages up to 50 V at 50 mA. All inputs and outputs can be isolated from system ground. The outputs can drive loads referenced to ground, VCC+ or VCC. Offset balancing and strobe capabilities are available, and the outputs can be wire-OR connected. If the strobe is low, the output is in the off state, regardless of the differential input.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
NC BALANCE NC
description/ordering information
ORDERING INFORMATION
TA VIO max AT 25C PDIP (P) SOIC (D) 0C to 70C 0C 7.5 7 5 mV SOP (PS) TSSOP (PW) PDIP (P) SOIC (D) TSSOP (PW) 40C to 125C 40C 55C 55C to 125C
PACKAGE Tube of 50 Tube of 75 Reel of 2500 Reel of 2000 Reel of 150 Tube of 2000 Tube of 50 Tube of 75 Reel of 2500 Reel of 150 Reel of 2000 Tube of 75 Reel of 2500 Tube of 50 Tube of 55
ORDERABLE PART NUMBER LM311P LM311D LM311DR LM311PSR LM311PW LM311PWR LM211P LM211D LM211DR LM211PW LM211PWR LM211QD LM211QDR LM111JG LM111FK
TOP-SIDE MARKING LM311P LM311 L311 L311 LM211P LM211 L211 LM211Q LM111JG LM111FK
40C to 85C 40 C 85 C
3 mV
3 mV 3 mV
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
IN+
IN
schematic
Component Count BAL/STRB BALANCE Resistors Diodes EPI FET Transistors 20 2 1 22 VCC+ 2.4 k 2.4 k 750 70 1.2 k 600
450
450
IN+
1.2 k 4 k
COL OUT IN 400 60 450 250 200 2 k 4 EMIT OUT VCC All resistor values shown are nominal. 600 130
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage: VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V VCC+ VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Input voltage, VI (either input, see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V Voltage from emitter output to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Voltage from collector output to VCC: LM111 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V LM211 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V LM211Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V LM311 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 s Package thermal impedance, JA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149C/W Package thermal impedance, JC (see Notes 7 and 8): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61C/W JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: J or JG package . . . . . . . . . . . . . . . . 300C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, PS, or PW package . . . . . . . . 260C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC. 2. Differential voltages are at IN+ with respect to IN. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. The output may be shorted to ground or either power supply. 5. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. 7. Maximum power dissipation is a function of TJ(max), JC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) TC)/JC. Operating at the absolute maximum TJ of 150C can affect reliability. 8. The package thermal impedance is calculated in accordance with MIL-STD-883.
IIL(S)
V(strobe) = 0.3 V,
mA
VICR
Full range
AVD
VO = 5 V to 35 V, I(strobe) = 3 mA, 3 VID = 5 mV VID = 5 mV, IOL = 50 mA VCC+ = 4.5 V, VCC = 0, 0 IOL = 8 mA VID = 10 mV,
25C 25C Full range 25C 25C 25C Full range Full range 25C
V/mV nA A nA
IOH
VOL
ICC+
ICC
VID = 10 mV,
No load
25C
4.1
4.1
mA
Unless otherwise noted, all characteristics are measured with BALANCE and BAL/STRB open and EMIT OUT grounded. Full range for LM111 is 55C to 125C, for LM211 is 40C to 85C, for LM211Q is 40C to 125C, and for LM311 is 0C to 70C. All typical values are at T = 25C. A NOTES: 9. The offset voltages and offset currents given are the maximum values required to drive the collector output up to 14 V or down to 1 V with a pullup resistor of 7.5 k to VCC+. These parameters actually define an error band and take into account the worst-case effects of voltage gain and input impedance. 10. The strobe should not be shorted to ground; it should be current driven at 3 mA to 5 mA (see Figures 13 and 27).
PARAMETER
TEST CONDITIONS
UNIT
NOTE 11: The response time specified is for a 100-mV input step with 5-mV overdrive and is the interval between the input step function and the instant when the output crosses 1.4 V.
TYPICAL CHARACTERISTICS
INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE
20 18 I IO Input Offset Current nA 16 14 12 10 8 6 LM311 4 2 0 60 40 20 LM111 LM211 Condition 1 LM111 LM211 I IB Input Bias Current nA LM311 VCC = 15 V VO = 1 V to 14 V See Note A 500 450 400 350 300 250 200 150 LM311 100 50 40 60 80 100 120 140 LM111 LM211 0 20 40 60 80 100 120 140 Condition 1 LM111 LM211 Condition 2 LM311
Condition 2
20
0 60 40 20
TA Free-Air Temperature C NOTE A: Condition 1 is with BALANCE and BAL/STRB open. Condition 2 is with BALANCE and BAL/STRB connected to VCC+.
TA Free-Air Temperature C NOTE A: Condition 1 is with BALANCE and BAL/STRB open. Condition 2 is with BALANCE and BAL/STRB connected to VCC+.
Figure 1
Figure 2
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
VCC+ VI = 50 V (LM111, LM211) 40 V (LM311) = 30 V 1 k
Output
50
VCC VO Output Voltage V LM311 40 Emitter Output RL = 600 Collector Output RL = 1 k COLLECTOR OUTPUT TRANSFER CHARACTERISTIC TEST CIRCUIT FOR FIGURE 3 VCC+ = 30 V
30
20 VID 10 VCC 0.5 0 0.5 1 EMITTER OUTPUT TRANSFER CHARACTERISTIC TEST CIRCUIT FOR FIGURE 3 VID Differential Input Voltage mV Output 600 0 1
Figure 3
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
OUTPUT RESPONSE FOR VARIOUS INPUT OVERDRIVES OUTPUT RESPONSE FOR VARIOUS INPUT OVERDRIVES
100 mV VCC = 15 V RC = 500 to 5 V TA = 25C 5 4 3 2 1 0 0 50 100 150 200 250 300 350 5 mV 20 mV
100 mV VCC = 15 V RC = 500 to 5 V TA = 25C 5 4 20 mV 3 2 5 mV 1 0 0 50 100 150 200 250 300 350 2 mV
VO Output Voltage V
2 mV
VO Output Voltage V
t Time ns
t Time ns
Figure 4
VCC+ = 15 V 5V 500 VID VO
Figure 5
TYPICAL CHARACTERISTICS
OUTPUT RESPONSE FOR VARIOUS INPUT OVERDRIVES
Differential Input Voltage Differential Input Voltage
100 mV
VCC = 15 V RE = 2 k to 15 V TA = 25C
15 VO Output Voltage V 10
20 mV 5 mV VO Output Voltage V
15 10 5
t Time ms
t Time ms
Figure 6
VCC+ = 15 V
Figure 7
VID
VO RE = 2 k
TYPICAL CHARACTERISTICS
OUTPUT CURRENT AND DISSIPATION vs OUTPUT VOLTAGE
160 I O Output Current and Dissipation mA 140 120 PO (right scale) 100 80 60 40 IO (left scale) 20 0 0 5 10 VO Output Voltage V 100 0 15 500 400 300 200 VCC = 15 V t 10 s VID = 10 mV TA = 25C 800 700 600 PO Output Dissipation mW 6 TA = 25C No Load I CC+ Positive Supply Current mA 5 VID = 10 mV
VID = 10 mV
Figure 8
Figure 9
Figure 10
10
APPLICATION INFORMATION
Figure 11 through Figure 29 show various applications for the LM111, LM211, and LM311 comparators.
VCC+ 3 k 3 k 1 k Square Wave Output (fanout to two Series 54 gates, or equivalent) BALANCE BAL/ STRB
VCC+ 20 k
10 k 1200 pF
20 k
39 k
NOTE: If offset balancing is not used, the BALANCE and BAL/STRB pins should be shorted together.
1 k
VCC
11
APPLICATION INFORMATION
5V
82 k 240 k Input 47 k 82 k
1 k Output to TTL
Resistor values shown are for a 0- to 30-V logic swing and a 15-V threshold. May be added to control speed and reduce susceptibility to noise spikes
4.5 k
Output
1 k
0.1 F 50 k
Magnetic Transducer
12
APPLICATION INFORMATION
From D/A Network VCC+ Output 22 k Analog Input BALANCE 0.1 F 2N2222 Sample 1 k
VCC+
BAL/STRB
Input
TTL Strobe
VCC+ = 5 V 3 k
2N3708
10 k
VCC = 10 V
13
APPLICATION INFORMATION
VCC+ = 5 V 3.9 k 30 k 1 k 1 k
2N3708
1N914 Output + 1N914 1.5 F 2N2222 510 2N2222 Input From TTL
2N2222 2.7 k
2.2 k
VCC+ = 5 V 5V
Opto Isolator
5 k
1 k TTL Output
100 1 k 0.01 F
50 k
1 k
VCC+ = 15 V
14
APPLICATION INFORMATION
VCC+ = 15 V
VCC = 15 V
3.9 k 1N2175
2N3708
1 k Output to TTL
2N2222 R1 30 k
R1 sets the comparison level. At comparison, the photodiode has less than 5 mV across it, decreasing dark current by an order of magnitude.
VCC+
Inputs
BAL/STRB
VCC
1 k
15
APPLICATION INFORMATION
VCC+ BAL/STRB 1 620 300
100 k
Output
100 k
BAL/STRB 2
39 k
300 k BAL/STRB
15 k Reference 0.22 F VCC V+ 510 15 k Input 510 BAL/STRB 2 VCC 300 k 620 620 620 620 Outputs
39 k
16
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25-Jan-2012
PACKAGING INFORMATION
Orderable Device JM38510/10304BPA LM111FKB LM111JG LM111JGB LM211D LM211DE4 LM211DG4 LM211DR LM211DRE4 LM211DRG4 LM211P LM211PE4 LM211PW LM211PWE4 LM211PWG4 LM211PWR LM211PWRE4 LM211PWRG4 LM211QD Status
(1)
Package Type Package Drawing CDIP LCCC CDIP CDIP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC JG FK JG JG D D D D D D P P PW PW PW PW PW PW D
Pins 8 20 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8
Package Qty 1 1 1 1 75 75 75 2500 2500 2500 50 50 150 150 150 2000 2000 2000 75
(2)
MSL Peak Temp N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type
(3)
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
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25-Jan-2012
Orderable Device LM211QDG4 LM211QDR LM211QDRG4 LM311D LM311DE4 LM311DG4 LM311DR LM311DRE4 LM311DRG4 LM311P LM311PE4 LM311PSR LM311PSRE4 LM311PSRG4 LM311PW LM311PWE4 LM311PWG4 LM311PWLE LM311PWR
Status
(1)
Package Type Package Drawing SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SO SO SO TSSOP TSSOP TSSOP TSSOP TSSOP D D D D D D D D D P P PS PS PS PW PW PW PW PW
Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8
Package Qty 75 2500 2500 75 75 75 2500 2500 2500 50 50 2000 2000 2000 150 150 150
Eco Plan
(2)
(3)
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI
2000
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 2
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25-Jan-2012
Status
(1)
Pins 8 8 0 8
Eco Plan
(2)
(3)
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD
CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI A42 Call TI N / A for Pkg Type
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM211 :
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Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 4
Device
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 12.4 12.4 12.4 16.4 12.4 6.4 7.0 6.4 8.2 7.0
Pack Materials-Page 1
Package Drawing D PW D PS PW
Pins 8 8 8 8 8
Pack Materials-Page 2
MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997
JG (R-GDIP-T8)
0.400 (10,16) 0.355 (9,00) 8 5
CERAMIC DUAL-IN-LINE
0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20)
015
4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8
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