Documente Academic
Documente Profesional
Documente Cultură
MODEL : 42LH5000
CAUTION
42LH5000-ZB
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in Korea
CONTENTS
CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION .................................................................9 BLOCK DIAGRAM...................................................................................14 EXPLODED VIEW .................................................................................. 15 SVC. SHEET ...............................................................................................
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-2-
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
0.15uF
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 *Base on Adjustment standard
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500F to 600F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500F to 600F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500F to 600F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
-4-
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
-5-
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to the LCD TV used LD91B chassis.
3. Test method
1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC/EN60065 - EMC:CE, IEC
4. Electrical specification
- Module General Specification No 1 2 3 4 Item Screen Device Aspect Ratio LCD Module Storage Environment Specification 42 wide color display module 16:9 42 TFT LCD FHD 100Hz SCAN Temp. : -20 ~ 60 deg Humidity : 10 ~ 90 % 5 6 7 8 9 10 11 Input Voltage Power Consumption Module Size Pixel Pitch Back Light Display Colors Coating AC100-240V~, 50/60Hz Typ : 167.8W 983 (H) x 57 (V) x 46 (D) 0.4845 mm(D) EEFL 1.06Billion(FHD LGD),16.7M (others) 3H, AG Without inverter LGD LCD Remark
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-6-
5. Chroma& Brightness
- Module optical specification No. Item 1. 2. 3. 4. Viewing Angle<CR>10> Luminance Contrast Ratio CIE Color Coordinates Specification Right/Left/Up/Down Luminance (cd/m2) Variation CR White RED Green Blue WX WY Xr Yr Xg Yg Xb Yb 1000 Min. 178 400 500 1400 0.279 0.292 0.638 0.334 0.290 0.606 0.144 0.064 Typ 0.03 1.3 MAX /MIN Typ. Max. Degree Remark
1) Standard Test Condition (The unit has been ON) 2) Stable for approximately 30 minutes in a dark environment at 252 3) The values specified are at approximate distance 50Cm from the LCD surface 4) Ta=252C, VLCD=12.0V, fV=60Hz, Dclk=74.25MHz VBR_A=1.65V,ExtVBR_B=100%
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-7-
7. RGB (PC)
No Resolution 1. 2. 3. 4. 5. 6. 7. 8. 720*400 640*480 800*600 1024*768 1280*768 1360*768 1280*1024 1920*1080 H-freq(kHz) 31.468 31.469 37.879 48.363 47.78 47.72 63.595 66.587 Specification V-freq(Hz) 70.08 59.94 60.31 60.00 59.87 59.8 60.0 59.93 Pixel Clock(MHz) 28.321 25.17 40.00 65.00 79.5 84.75 108.875 138.625 VESA VESA VESA(XGA) WXGA WXGA SXGA WUXGA FHD model FHD model For only DOS mode Input 848*480 60Hz, 852*480 60Hz -> 640*480 60Hz Display Proposed Remark
(2) PC Mode
No 1. 2. 3. 4. 5. 6. 7. 8. Resolution 720*400 640*480 800*600 1024*768 1280*768 1360*768 1280*1024 1920*1080 H-freq(kHz) 31.468 31.469 37.879 48.363 47.78 47.72 63.595 67.5 V-freq.(Hz) 70.08 59.94 60.31 60.00 59.87 59.8 60.0 60.00 Pixel clock(MHz) 28.321 25.17 40.00 65.00 79.5 84.75 108.875 138.625 VESA VESA VESA(XGA) WXGA WXGA SXGA WUXGA Proposed HDCP HDCP HDCP HDCP HDCP HDCP HDCP/FHD model HDCP/FHD model Remark
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-8-
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV with LD91B chassis. 4) Click Connect tab. If Cant is displayed, check connection between computer, jig, and set.
(2) (3)
2. Designation
1) The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing. 2) Power Adjustment: Free Voltage 3) Magnetic Field Condition: Nil. 4) Input signal Unit: Product Specification Standard 5) Reserve after operation: Above 5 Minutes (Heat Run) Temperature : at 255C Relative humidity : 6510% Input voltage : 220V, 60Hz 6) Adjustment equipments: Color Analyzer (CA-210 or CA110), DDC Adjustment Jig equipment, SVC remote controller 7) Push The IN STOP KEY - For memory initialization. Case1 : Software version up 1. After downloading S/W by USB, TV set will reboot automatically 2. Push In-stop key 3. Push Power on key 4. Function inspection 5. After function inspection, Push I n-stop key. Case2 : Function check at the assembly line 1. When TV set is entering on the assembly line, Push In-stop key at first. 2. Push Power on key for turning it on. -> If you push Power on key, TV set will recover channel information by itself. 3. After function inspection, Push In-stop key.
Please Check the Speed : To use speed between from 200KHz to 400KHz
5) Click Auto tab and set as below 6) Click Run. 7) After downloading, check OK message.
(4)
filexxx.bin
(5)
(7) .OK
(6)
* USB DOWNLOAD
1) Put the USB Stick to the USB socket 2) Automatically detecting update file in USB Stick - If your downloaded program version in USB Stick is Low, it didnt work. But your downloaded version is High, USB data is automatically detecting 3) Show the message Copying files from memory
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-9-
4) Updating is staring.
Adjustment pattern - Component 480I MODEL: 209 in Pattern Generator(480i Mode) PATTERN : 65 in Pattern Generator(MSPG-925 SERIES) After enter Service Mode by pushing ADJ key, Enter Internal ADC mode by pushing G key at 5. ADC Calibration
5) Fishing the version uploading, you have to put USB stick and AC Power off. 6) After putting AC Power on and check updated version on your TV. * If downloading version is more high than your TV have, TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didnt have a DTV/ATV test on production line.
<Caution> Using power on button of the Adjustment R/C , power on TV. * ADC Calibration Protocol (RS232)
Item Adjust Mode In ADC Adjust CMD1 CMD2 Data0 A A 0 0 When transfer the Mode In, Carry the command. A D 1 0 Automatically adjustment (The use of a internal pattern)
Adjust Sequence aa 00 00 [Enter Adjust Mode] xb 00 40 [Component1 Input (480i)] ad 00 10 [Adjust 480i Comp1] xb 00 60 [RGB Input (1024*768)] ad 00 10 [Adjust 1024*768 RGB] aa 00 90 End Adjust mode * Required equipment : Adjustment R/C.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 -
** Caution ** Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0. (when R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)
CA-210
COLOR ANALYZER TYPE: CA-210
RS-232C Communication
* After done all adjustments, Press In-start button and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the models module from factory JIG model. * Push The IN STOP KEY after completing the function inspection.
* Auto-control interface and directions 1) Adjust in the place where the influx of light like floodlight around is blocked. (illumination is less than 10ux). 2) Adhere closely the Color Analyzer (CA210) to the module less than 10cm distance, keep it with the surface of the Module and Color Analyzers Prove vertically.(80~100). 3) Aging time - After aging start, keep the power on (no suspension of power supply) and heat-run over 5minutes. - Using no signal or full white pattern or the others, check the back light on. Auto adjustment Map(RS-232C) RS-232C COMMAND [CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End RS-232C COMMAND MIN [CMD ID DATA] Cool R Gain G Gain B Gain R Cut G Cut B Cut jg jh ji Mid Ja Jb Jc Warm jd je jf 00 00 00 Cool 172 172 192 64 64 64 CENTER (DEFAULT) Mid 192 192 192 64 64 64 Warm 192 192 172 64 64 64 255 255 255 128 128 128 MAX
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 11 -
- Auto Download
After enter Service Mode by pushing ADJ key, Enter EDID D/L mode. Enter START by pushing OK key.
00 10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0
10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0
- Manual Download
* Caution 1) Use the proper signal cable for EDID Download - Analog EDID : Pin3 exists - Digital EDID : Pin3 exists 2) Never connect HDMI & D-sub Cable at the same time. 3) Use the proper cables below for EDID Writing 4) Download HDMI1, HDMI2, separately because HDMI1 is different from HDMI3 For Analog EDID D-sub to D-sub For HDMI EDID DVI-D to HDMI or HDMI to HDMI
* Detail EDID Options are below Product ID Model Name FHD Model HD Model HEX 0001 0000 EDID Table 01 00 00 00 DDC Function Analog/Digital Analog/Digital
Serial No: Controlled on production line. Month, Year: Controlled on production line: ex) Monthly : 02 -> 02 Year : 2009 -> 13 Model Name(Hex): Item Manufacturer ID Version Revision Condition GSM Digital : 1 Digital : 3 Data(Hex) 1E6D 01 03 Checksum: Changeable by total EDID data. Vendor Specific(HDMI)
INPUT HDMI1 HDMI2 HDMI3 HDMI4 MODEL NAME(HEX) 67030C001000B82D 67030C002000B82D 67030C003000B82D 67030C003000B82D
MODEL all MODEL NAME(HEX) 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 12 -
* Manual Download (Model Name and Serial Number) If the TV set is downloaded by OTA or Service man, sometimes model name or serial number is initialized.(Not always) There is impossible to download by bar code scan, so It need Manual download. 1) Press the instart key of ADJ remote controller. 2) Go to the menu 5.Model Number D/L like below photo. 3) Input the Factory model name(ex 42LH4000-ZA) or Serial number like photo.
CMD : A0h LENGTH : 85~94h (1~16 bytes) ADH : EEPROM Sub Address high (00~1F) ADL : EEPROM Sub Address low (00~FF) Data : Write data CS : CMD + LENGTH + ADH + ADL + Data_1 ++ Data_n Delay : 20ms
* Description FOS Default write : <7mode data> write Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0, Phase Data write : Model Name and Serial Number write in EEPROM,.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 13 -
LVDS ( 10 b it)
DDR_A_D[ 0: 15] DDR_A_A[ 0: 12] DDR2 SDRAM ( 512Mb ) IC1001 DDR2 SDRAM ( 512Mb ) IC1000
CI_TS_DATA[ 0: 7]
CI_ADDR[ 0: 7]
FE_VMAIN
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Serial Flash Serial Flas h IC103 IC104 Fo r Bo o t Fo r Trit o n SC1_CVBS_IN SC1_R/ G/ B
FE_ VOUT
F-SCART
Mst ar S6
SDDR_D[ 0: 15] SDDR_A[ 0: 12] TDDR_D[ 0: 15] TDDR_A[ 0: 12]
LGE3369A ( DVIX)
PCM_A[ 0: 7]
BLOCK DIAGRAM
AV3
SC2_CVBS_I N AV_CVBS_IN
COMPONENT
RGB
( IC100)
I2C
EEPROM AT24C512 ( IC105) EEPROM AT24C512 ( HDCP) IC107 Dig it al am p ( NTP3100L) IC701
USB_DM/ DP USB
SC1/ 2_L/ R_IN, FE_AM_AUDIO, AUDIO IN AV_L/ R_IN, COMP_L/ R_IN, PC_L/ R_IN
L/ R
Head Pho ne
HP_L/ ROUT
RS-232C
SPDIF
HDMI 1/ 2/ 3/ 4
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
803
802
800
801
200
820
550
200T
810
121
300
120
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
510
500
122
A2
A10
900
- 15 -
+3.3V
NC_1
48
NC_2
47
NC_3 NC_25
46
3.9K
1K
NC_4
45
AR102
I/O6 PCM_A[6] R107 470 I/O7 PCM_A[7]
NC_5
44
R105 OPT 1K
R1540
R111
NC_6
43
R/B
/F_RB
RE
1386 WON
42
/PF_OE
41
CE
22
/PF_CE0
40
1K
NC_7
10
39
OPT
C103 0.1uF
NC_8
11
38
R112
VCC_1
12
37
VSS_1
13
36
NC_9
14
35
NC_10
15
34
CLE
16
33
AR103
ALE
PF_ALE
17
32
WE
/PF_WE
18
31
WP
19
30
R1539 1K
+3.3V_ST
+3.3V
NC_11
20
29
NC_12
21
28
22
R114 OPT
R103
10K
NC_13
22
27
R151
NC_14
PF_WP
23
26
NC_15
24
25
R1509
OPT
+3.3V
+3.3V
PCM_RST /PCM_CD
R1520
DBG_TX POWER_DET
IC103 W25X32VSSIG
EEPROM
IC105: EAN43352801(ATMEL SHRINK)
+3.3V /PCM_WAIT /PCM_IRQA
E0 1 8 VCC
R1533 4.7K
L102
0IMMRMP008A(MICROCHIP)
/PCM_OE /PCM_REG
CS
VCC
+3.3V
$0.76
E1 2 7 WC
R104 10K
Flash_WP_1
R1504 4.7K
R1505 4.7K
R1506 1.2K
R1507 1.2K
R1503 2.2K
R1502 2.2K
R124
4.7K
R125
AI13;10:I9
FE_TUNER_SDA
AI13;10:I9
FE_TUNER_SCL
4.7K
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
$0.418
3 6
33
E2
0.1uF C104
R1530
DO
HOLD
ISP_TXD
R101 R110 EEPROM_SCL E19;T19;Y13 D6 C4 EEPROM_SDA E20;T19;Y14 D7 D6 A7 C3 E16;E19;T19 E16;E20;T19 R162 R163 R113 22 C107 8pF OPT C108 8pF OPT 22 C4
WP
CLK
SPI_CK
C
4 5 SDA
R102
GND
DIO
SPI_DI
R100 0 VSS
OPT
HDCP EEPROM
SCL0 ISP_RXD ISP_TXD R1545 A_DIM DBG_TX R198 1K PWM_DIM PWM0 PWM1 C1500 1uF OPT C1501 2.2uF OPT 100 PWM2 R1544 R1501 1K 100 PWM0 R143 DBG_RX R142 R140 R141 10 : BOOT 51 11 : BOOT RISC +3.3V
+3.3V
4:AG3
Addr:10101--
IC107 CAT24WC08W-T
R158 4.7K
A0
VCC
C114 0.1uF
A1
$0.199
WP
R109
4.7K
A2
SCL
R161
22
E16;T19;Y13 EEPROM_SCL
VSS
SDA
R171
22
EEPROM_SDA E16;T19;Y14
R199 1K OPT
R1500 1K OPT
I2C
+5V_GENERAL
+3.3V_TUNER
+3.3V
6:AI16;6:AL7;6:AL12 9:AI24
10:I12
FE_DEMOD_SDA
R122
FE_DEMOD_SCL
R123
11:J8
MEMC_SDA
R130
11:Q8
MEMC_SCL
R131
7:F12;11:AG10
SDA_SUB/AMP
R128
7:F13;11:AG9
SCL_SUB/AMP
R129
MODEL OPTION
POWER DETECT
+24V R1603 3.3K 100 R1605 3.3K OPT R1607 3.3K R1609 3.3K
+12V
+3.3V_ST
3.6K
MODEL_OPT_0 MODEL_OPT_1
R1543 10K
KIA7042AF 1 3
MODEL OPTION
PIN NO. D6 R1608 3.3K OPT R1610 3.3K OPT MODEL_OPT_1 MODEL_OPT_2 MODEL_OPT_3 D7 B9(FHD) B9(HD) E11 B9 HIGH LCD FRC LVDS_B LED_NORMAL FHD LOW PDP NO_FRC LVDS_A GPIO67 LED_MOVING HD GPIO68
+3.3V
A7 B8
R192 R155
100 100
EAX57644501 MAIN_1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2008.12.12 1 12
+1.26V_VDDC
C2028 10uF
C2002 10uF
C243 0.1uF C246 0.1uF C249 0.1uF C252 0.1uF C275 0.1uF C294 0.1uF C297 0.1uF C261 0.1uF C268 0.1uF C280 0.1uF C295 0.1uF C257 0.1uF C2000 0.1uF C278 0.1uF C290 0.1uF C2001 0.1uF C2003 0.1uF C219 0.1uF C282 0.1uF C281 0.1uF C2005 0.1uF C220 0.1uF C298 0.1uF C299 0.1uF C289 0.1uF C270 0.1uF
C264 0.1uF
+3.3V +3.3V_VDDP
L210 BLM18PG121SN1D
+1.8V_DDR
C2004 0.1uF C2027 0.1uF C242 0.1uF C245 0.1uF C248 0.1uF C266 0.1uF C283 0.1uF C251 0.1uF C277 0.1uF C254 0.1uF C259 0.1uF C296 0.1uF
C2026 0.1uF C276 0.1uF C250 0.1uF C241 0.1uF C247 0.1uF
C265 0.1uF
6:X15 AD16 AD15 AF16 AF15 AE15 AD13 AF14 AF13 AE13 MEMC_RXE4002:Z25;009:Q28 GND_8 VDDC_8 VDDC_9 L12 L13 L14 L15 L16 L17 L18 GND_15 GND_16 GND_17 GND_18 GND_19 GND_20 GND_21 GND_22 GND_23 GND_24 AA3 C229 C230 2.2uF SC1_L_IN 9:J10 2.2uF 2.2uF 2.2uF SC2_R_IN 9:AE11 9:AE10 4:M6 4:M5 4:K15 4:K13 4:Z5 4:Z6 10:P13 SC2_L_IN AV_R_IN AV_L_IN COMP_R_IN COMP_L_IN PC_R_IN PC_L_IN FE_SIF 2.2uF 2.2uF 2.2uF 2.2uF 2.2uF 2.2uF 2.2uF C2006 C2007 C2008 C2009 C2011 C2012 C2013 C2014 C2015 C2016 SC1_R_IN 9:J12 2.2uF AUR0 Y1 AE1 AF3 AE3 AUL0 AUR1 AUL1 M18 N4 N9 N10 N11 N12 N13 N14 N15 N16 N17 N18 P4 W3 R241 R242 47 47 SIF0P W2 C232 0.1uF SIF0M P11 R266 5V_HDMI_4 SPDIF_OUT 4:T11 R230 100 100 P12 P13 P14 P15 P16 AF1 AUOUTR0/HP_ROUT AF2 R238 R239 R240 R250 R251 100 100 100 100 100 AD3 AD1 AC1 AD2 AUOUTL0/HP_LOUT AUOUTR1/SC1_ROUT AUOUTL1/SC1_LOUT AUOUTR2/SC2_ROUT AUOUTL2/SC2_LOUT R252 22K R253 22K R254 22K R255 22K C2017 0.01uF C2018 0.01uF C2020 0.01uF C2021 0.01uF C2022 0.01uF R256 22K C2023 0.01uF R237 100 P17 HP_ROUT HP_LOUT 7:G21 7:G19 9:T14 9:S12 9:AN15 SCART2_Lout 9:AM13 P18 R4 R9 R10 R11 R12 R257 22K R13 R14 AUDIO_MASTER_CLK MS_LRCK MS_SCK MS_LRCH SEL1_HDMI_SW 7:F7 7:F12 R16 7:F12 7:F12 R17 R18 T5 T9 T10 T11 T12 C234 0.1uF T13 T14 0.1uF 10uF 6.3V 0.1uF 1uF 4.7uF T15 T16 T17 T18 U5 W13 Y21 AA23 GND_64 GND_65 GND_66 GND_67 GND_68 GND_69 GND_70 GND_71 GND_72 GND_73 AVDD_USB C240 2.2uF C256 0.1uF H8 AVDD_DM +3.3V_S6 W8 C239 22pF OPT C238 22pF OPT GND_56 GND_57 GND_58 GND_59 GND_60 GND_61 GND_62 GND_63 AVDD_33_1 AVDD_33_2 AVDD_33_3 AVDD_33_4 AVDD_33_5 J7 K7 L7 M7 N7 C263 C271 C274 AVDD_MPLL C2029 0.1uF H7 R15 GND_48 GND_49 GND_50 GND_51 GND_52 GND_53 GND_54 GND_55 AVDD_LPLL R20 AVDD_MEMPLL_1 AVDD_MEMPLL_2 AVDD_MEMPLL_3 GND_40 GND_41 GND_42 GND_43 GND_44 GND_45 GND_46 GND_47 C231 0.1uF P9 P10 GND_33 GND_34 GND_35 GND_36 GND_37 GND_38 GND_39 AVDD_DDR_1 AVDD_DDR_2 AVDD_DDR_3 AVDD_DDR_4 AVDD_DDR_5 AVDD_DDR_6 AVDD_DDR_7 AVDD_DDR_8 AVDD_DDR_9 AVDD_DDR_10 AVDD_DDR_11 H17 T20 V20 C262 F11 SPDIF_IN E9 SPDIF_OUT G12 G13 H13 H14 H15 H16 W14 W15 W16 W17 W18 AVDD_AU +1.8V_DDR C284 0.1uF W7 GND_25 GND_26 GND_27 GND_28 GND_29 GND_30 GND_31 GND_32 VDDP_1 VDDP_2 VDDP_3 VDDP_4 VDDP_5 VDDP_6 VDDP_7 VDDP_8 H9 H10 H11 H12 N20 P20 W9 W10 +3.3V_S6 M9 M10 M11 M12 M13 MEMC_RXOC+ 002:Z19;009:T28 002:Z19;009:T28 M16 M17 M15 M14 MEMC_RXOCGND_13 GND_14 GND_12 VDDC_13 VDDC_14 VDDC_15 VDDC_16 VDDC_17 VDDC_18 VDDC_19 VDDC_20 VDDC_21 VDDC_22 VDDC_23 VDDC_24 VDDC_25 VDDC_26 VDDC_27 GND_11 VDDC_12 GND_10 P7 R7 T7 T22 U7 U20 U22 V7 V22 W11 W12 W19 W20 W22 Y22 VDDC_11 M20 GND_9 L20 VDDC_10 K20 J20 H20 VDDC_7 002:Z24;009:Q28 002:Z24;009:R28 002:Z17;009:U28 002:Z17;009:V28 002:Z18;009:U28 002:Z18;009:U28 002:Z18;009:U28 002:Z18;009:U28 002:Z20;009:T28 002:Z20;009:T28 002:Z21;009:S28 002:Z21;009:T28 L11 MEMC_RXEC+ MEMC_RXECMEMC_RXO0+ MEMC_RXO0MEMC_RXO1+ MEMC_RXO1MEMC_RXO2+ MEMC_RXO2MEMC_RXO3+ MEMC_RXO3MEMC_RXO4+ MEMC_RXO4GND_7 H19 AE14 LVACKP AD14 AE20 LVB0P AD20 AD19 AF20 AF19 AE19 AD17 AF18 AF17 AE17 AE18 LVBCKP AD18 LVBCKM LVB0M LVB1P LVB1M LVB2P LVB2M LVB3P LVB3M LVB4P LVB4M LVACKM MEMC_RXE4+ 002:Z26;009:Q28 VDDC_6 L10 GND_6 H18 MEMC_RXE3002:Z25;009:Q28 VDDC_5 L9 GND_5 D20 MEMC_RXE3+ 002:Z25;009:Q28 VDDC_4 F7 GND_4 D19 MEMC_RXE2002:Z23;009:R28 VDDC_3 E18 GND_3 D18 MEMC_RXE2+ 002:Z23;009:R28 VDDC_2 E17 GND_2 D17 MEMC_RXE1002:Z22;009:R28 VDDC_1 E16 D16 MEMC_RXE1+ 002:Z23;009:R28 MEMC_RXE0002:Z22;009:S28 LVA0M LVA1P LVA1M LVA2P LVA2M LVA3P LVA3M LVA4P LVA4M
F1 AE16
RXACKP
6:X14
CK-_HDMI_SW
F2
RXACKN
6:X15
D0+_HDMI_SW
G2
RXA0P
G3
6:X15
RXA0N
6:X16
D0-_HDMI_SW D1+_HDMI_SW
H3
RXA1P
6:X16
D1-_HDMI_SW
G1
RXA1N
6:X17
D2+_HDMI_SW
H1
RXA2P
6:X17
D2-_HDMI_SW
H2
RXA2N
6:X13;6:AL14
DDC_SDA_SW
R207
A1
DDCD_A_DA
6:X13;6:AL13
DDC_SCL_SW
R208
B2
DDCD_A_CK
6:J6
HPD1
R247
0 100
A2
HOTPLUG_A
C3
RXBCKP
B1
RXBCKN
C1
RXB0P
LVDS OUT
C2
RXB0N
D2
RXB1P
HDMI
D3
RXB1N
SCART_RGB
DSUB
COMP
CVBS
TV/MNT
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
+3.3V_VDDP VDDP : 102.3mA AUDIO IN
+3.3V
E3
RXB2P
D1
RXB2N
E1
DDCD_B_DA
F3
DDCD_B_CK
6:J6
HPD2
R201
100
E2
HOTPLUG_B
6:X15
CK+_HDMI4
6:X14
CK-_HDMI4
6:X15
D0+_HDMI4
6:X15
6:X16
D0-_HDMI4 D1+_HDMI4
6:X16
D1-_HDMI4
6:X17
D2+_HDMI4
6:X17
D2-_HDMI4
6:X13;6:AL14
DDC_SDA_4
R248
6:X13;6:AL13
DDC_SCL_4
R249
6:W11
HPD4
R200
0 100
6:AM25
HDMI_CEC
R204
100
9:P8
SC1_ID
N2
HSYNC0/SC1_ID
9:O6
SC1_FB
R210
47
N1
VSYNC0/SC1_FB
9:J6
SC1_R
R211
47
C200
0.047uF
P2
RIN0P/SC1_R
9:J8
SC1_G
R212
C201
R3
AUR2 AUL2 AE2 AA1 AUR3 AB1 AUL3 AB2 AUR4 AC2 AUL4 AB3 AUR5 AC3 AUL5
AVDD_AU : 36.11mA
L209 BLM18PG121SN1D
GIN0P/SC1_G
9:J9
SC1_B
R213
47 47
C202
0.047uF 0.047uF
R1
BIN0P/SC1_B
E21;9:O4
SC1_CVBS_IN
R214
470
1000pF
P3
SOGIN0/SC1_CVBS
C293 0.1uF
R215
47
C203 C204
0.047uF
P1
RINM
R216
C205
T3
BINM
R217
47 47
C206
0.047uF 0.047uF
R2
GINM
R243 10K
R244 10K
4:C22
DSUB_HSYNC
R246
22
K3
HSYNC1/DSUB_HSYNC
4:C22
DSUB_VSYNC
R245
K2
VSYNC1/DSUB_VSYNC
4:C26
DSUB_R
R218
47
22 0.047uF
L1
RIN1P/DSUB_R
4:C24
DSUB_G
R219
C212 C207
L3
GIN1P/DSUB_G
4:C23
DSUB_B
R220
C213
0.047uF 0.047uF
K1
BIN1P/DSUB_B
R221
47 47 470
C208
1000pF
L2
SOGIN1
+3.3V_S6
AVDD_MEMPLL : 23.77mA
4:K13
COMP_Pr
R222
4:K11
COMP_Y
R223
47 47
C214 C215
0.047uF
V1
RIN2P/COMP_PR+
4:K12
COMP_Pb
R224
C216
0.047uF 0.047uF
V2
GIN2P/COMP_Y+
U1
BIN2P/COMP_PB+
AUDIO OUT
R225
47 470
C209
1000pF
V3
SOGIN2
9:P8 A8 R231 R232 R233 R234 R274 C236 22pF OPT C237 22pF OPT 100 22 22 22 22 I2S_OUT_MCK B7 C7 D8 C8 I2S_OUT_WS I2S_OUT_BCK I2S_OUT_SD I2S_IN_SD
SC2_ID
R284
100
J5
VSYNC2
AVDD_LPLL : 4.69mA
E17;9:O4
SC1_CVBS_IN
R205
47
C210
0.047uF
U3
CVBS1/SC1_CVBS
9:AE2
SC2_CVBS_IN
R206
47
C211
0.047uF
U2
CVBS2/SC2_CVBS
4:M2
AV_CVBS_IN
R226
47
C217
0.047uF
T1
CVBS3/SIDE_CVBS
R227
47
C218
0.047uF
T2
VCOM1
M1 K4 VCLAMP H4 J4 0.1uF R229 1% +3.3V Check AE5 C224 C225 C226 C227 C228 AUCOM AE4 AF4 AD4 AUVRM AUVRP AUVAG 390 G4 C233 REFP REFM REXT C223 0.1uF C235 0.1uF
CVBS4/S-VIDEO_Y
M2
AVDD_33 : 281mA
+3.3V_AVDD L206 BLM18PG121SN1D C260 C267 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF +3.3V_S6 C286 0.1uF
CVBS6/S-VIDEO_C
R235
47
C2024
0.047uF
N3
CVBS5
R236
47
C2019
0.047uF
M3
CVBS7
10:AA8
FE_VMAIN
R228
C221
0.047uF
W1
CVBS0/RF_CVBS
R209
100 100
C222
0.047uF
Y3
VCOM0
9:AL4
DTV/MNT_VOUT
FE_VSCART_OUT
Y2
C2030 0.1uF
AVDD_DM : 0.03mA
AVDD_OTG : 22.96mA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX57644501 MAIN_2
2008.12.12 2 12
0.1uF C330
C337
C324
0.1uF C327
0.1uF C328
0.1uF C341
0.1uF C342
10uF C325
0.1uF C326
0.1uF C332
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF C314
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF C329
0.1uF C331
0.1uF C334
0.1uF C339
C303
10uF
C306
C310
C316
C319
C320
0.1uF C336
C304
C305
C307
C308
C312
C313
0.1uF C315
C317
C318
+1.8V_DDR +1.8V_DDR
+1.8V_DDR 1K 1%
R345 1K
R301
R321
0.1uF
1% 0.1uF
1K 1%
R322
R302 1K 1%
SDDR_D[0] SDDR_A[5] A_MVREF AR303 BDDR2_A[9] TDDR_A[9] TDDR_A[3] TDDR_A[1] 56 TDDR_A[10] AR304 BDDR2_A[5] BDDR2_A[12] BDDR2_A[7] BDDR2_A[0] BDDR2_A[2] BDDR2_A[4] BDDR2_A[6] BDDR2_A[11] R325 BDDR2_A[8] AC23 BDDR2_BA[0] BDDR2_BA[1] BDDR2_BA[2] OPT BDDR2_MCLK A_DDR2_BA0 AC24 AB22 V25 A_DDR2_BA1 A_DDR2_BA2 A_DDR2_MCLK A14 /BDDR2_MCLK BDDR2_CKE D23 A_DDR2_CKE D14 BDDR2_ODT /BDDR2_RAS /BDDR2_CAS /BDDR2_WE A_DDR2_ODT D13 D12 D22 /A_DDR2_WE B18 C17 A_DDR2_DQS1 C18 A19 A_DDR2_DQM1 B_DDR2_DQM1 AB25 A_DDR2_DQSB0 AA25 W25 A_DDR2_DQ0 AE26 W24 AF24 AF25 V26 AE25 W26 Y26 AD25 B_DDR2_DQ9 B_DDR2_DQ10 B_DDR2_DQ11 B_DDR2_DQ12 B_DDR2_DQ13 B_DDR2_DQ14 B_DDR2_DQ15 Y25 A_DDR2_DQ1 B_DDR2_DQ1 B_DDR2_DQ2 B_DDR2_DQ3 B_DDR2_DQ4 B_DDR2_DQ5 B_DDR2_DQ6 B_DDR2_DQ7 B_DDR2_DQ8 A_DDR2_DQ2 A_DDR2_DQ3 A_DDR2_DQ4 A_DDR2_DQ5 A_DDR2_DQ6 A_DDR2_DQ7 A_DDR2_DQ8 A_DDR2_DQ9 A_DDR2_DQ10 A_DDR2_DQ11 A_DDR2_DQ12 A_DDR2_DQ13 A_DDR2_DQ14 A_DDR2_DQ15 B_DDR2_DQ0 BDDR2_D[0] BDDR2_D[1] BDDR2_D[2] BDDR2_D[3] BDDR2_D[4] BDDR2_D[5] BDDR2_D[6] BDDR2_D[7] BDDR2_D[8] BDDR2_D[9] A_DDR2_DQSB1 B_DDR2_DQSB1 ADDR2_D[0] ADDR2_D[1] ADDR2_D[2] ADDR2_D[3] ADDR2_D[4] ADDR2_D[5] ADDR2_D[6] ADDR2_D[7] ADDR2_D[8] ADDR2_D[9] ADDR2_D[10] B16 ADDR2_D[11] B20 ADDR2_D[12] A20 ADDR2_D[13] A16 ADDR2_D[14] B19 ADDR2_D[15] A17 C19 C16 C15 C20 C14 C21 B21 A15 A21 B15 B_DDR2_DQSB0 BDDR2_DQS0_N BDDR2_DQS1_N AR310 BDDR2_D[11] BDDR2_D[12] BDDR2_D[9] BDDR2_D[14] AR311 BDDR2_D[4] BDDR2_D[3] BDDR2_D[1] BDDR2_D[6] BDDR2_D[15] BDDR2_D[8] BDDR2_D[10] BDDR2_D[13] AR313 Y24 BDDR2_D[7] BDDR2_D[0] BDDR2_D[2] BDDR2_D[5] 56 BDDR2_D[13] AD24 BDDR2_D[14] AA24 BDDR2_D[15] 56 BDDR2_D[10] AE24 BDDR2_D[11] AD26 BDDR2_D[12] 56 AR312 56 TDDR_D[11] TDDR_D[12] TDDR_D[9] TDDR_D[14] TDDR_D[4] TDDR_D[3] TDDR_D[1] TDDR_D[6] TDDR_D[15] TDDR_D[8] TDDR_D[10] TDDR_D[13] TDDR_D[7] TDDR_D[0] TDDR_D[2] TDDR_D[5] +1.8V_DDR A18 B17 A_DDR2_DQM0 AC26 B_DDR2_DQM0 AC25 B_DDR2_DQS1 BDDR2_DQM0_P BDDR2_DQM1_P A_DDR2_DQS0 AA26 B_DDR2_DQS0 AB26 /B_DDR2_WE BDDR2_DQS0_P BDDR2_DQS1_P /A_DDR2_CAS AB24 /B_DDR2_CAS /A_DDR2_RAS U24 /B_DDR2_RAS U25 B_DDR2_ODT U26 B_DDR2_CKE /A_DDR2_MCLK AB23 /B_DDR2_MCLK V24 B_DDR2_MCLK B_DDR2_BA2 B_DDR2_BA1 B_DDR2_BA0 R327 R328 R329 R330 R326 56 56 56 TDDR_A[6] TDDR_A[11] TDDR_A[8] 56 56 56 22 R344 150 OPT TDDR_MCLK R331 R332 22 56 +1.8V_DDR R309 ADDR2_ODT /ADDR2_RAS /ADDR2_CAS /ADDR2_WE R310 R311 R312 R333 R334 R335 R336 56 R349 OPT 4.7K 56 56 56 /TDDR_RAS /TDDR_CAS /TDDR_WE /TDDR_MCLK TDDR_CKE R351 0 R348 OPT 4.7K TDDR_A[4] TDDR_A[2] AR305 TDDR_A[0] 56 TDDR_A[7] TDDR_A[12] TDDR_A[5] TDDR_A[0] TDDR_A[1] TDDR_A[2] TDDR_A[3] TDDR_A[4] TDDR_A[5] TDDR_A[6] TDDR_A[7] TDDR_A[8] TDDR_A[9] TDDR_A[10] TDDR_A[11] TDDR_A[12] ADDR2_A[0] ADDR2_A[1] ADDR2_A[2] ADDR2_A[3] ADDR2_A[4] ADDR2_A[5] ADDR2_A[6] ADDR2_A[7] ADDR2_A[8] ADDR2_A[9] A_DDR2_A9 AD23 BDDR2_A[10] R24 BDDR2_A[11] AE22 BDDR2_A[12] A_DDR2_A10 A_DDR2_A11 A_DDR2_A12 B_DDR2_A12 B_DDR2_A11 B_DDR2_A10 B_DDR2_A9 ADDR2_A[10] B22 ADDR2_A[11] A12 ADDR2_A[12] A24 C23 BDDR2_A[9] A_DDR2_A8 AC22 B_DDR2_A8 B12 BDDR2_A[8] A_DDR2_A7 R25 B_DDR2_A7 B23 BDDR2_A[7] A_DDR2_A6 AD22 B_DDR2_A6 C12 A_DDR2_A5 R26 BDDR2_A[6] B_DDR2_A5 A23 A_DDR2_A4 B_DDR2_A4 AE23 BDDR2_A[5] A13 A_DDR2_A3 B_DDR2_A3 T24 BDDR2_A[4] C22 BDDR2_A[3] A_DDR2_A2 AF23 B_DDR2_A2 BDDR2_A[10] B13 T25 BDDR2_A[2] A_DDR2_A1 B_DDR2_A1 BDDR2_A[1] A22 AF26 BDDR2_A[1] A_DDR2_A0 B_DDR2_A0 BDDR2_A[3] C13 T26 BDDR2_A[0] SDDR_A[3] SDDR_A[1] ADDR2_A[1] 56 ADDR2_A[10] AR301 SDDR_A[9] ADDR2_A[9] ADDR2_A[12] ADDR2_A[7] AR302 ADDR2_A[0] ADDR2_A[2] ADDR2_A[4] 56 ADDR2_A[6] R319 56 ADDR2_A[11] ADDR2_A[8] R320 56 SDDR_A[12] SDDR_A[7] SDDR_A[0] SDDR_A[2] SDDR_A[4] SDDR_A[6] SDDR_A[11] SDDR_A[8] 56 SDDR_A[10] ADDR2_A[3] ADDR2_A[5]
C300 0.1uF
C301
C309
C311
IC300 HY5PS1G1631CFP-S6
1K 1%
0.1uF
R343 1K
C333 0.1uF
1%
C335 0.1uF
0.1uF C338
IC301 H5PS5162FFR-S6C
DQ0 G8 G2 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12 M8 M3 M7 N2 N8 N3 N7 P2 P8 P3 M2 P7 R2 H7 H3 H1 H9 F1 F9 C8 C2 D7 D3 D1 D9 B1 B9 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 TDDR_D[0] TDDR_D[1] TDDR_D[2] TDDR_D[3] TDDR_D[4] TDDR_D[5] TDDR_D[6] TDDR_D[7] TDDR_D[8] TDDR_D[9] TDDR_D[10] TDDR_D[11] TDDR_D[12] TDDR_D[13] TDDR_D[14] TDDR_D[15]
G8
J2
VREF
SDDR_D[1]
DQ1
G2
SDDR_D[2]
DQ2
H7
SDDR_D[3]
DQ3
H3
M8
A0
SDDR_A[0]
SDDR_D[4]
DQ4
H1
M3
A1
SDDR_A[1]
SDDR_D[5]
DQ5
H9
M7
A2
SDDR_A[2]
SDDR_D[6]
DQ6
SDDR_A[0-12]
SDDR_D[0-15]
SDDR_D[11]
DQ11
SDDR_D[13]
DQ13
D9
M2
A10/AP
SDDR_A[10]
SDDR_D[14]
DQ14
B1
P7
A11
SDDR_A[11]
SDDR_D[15] 56 ADDR2_BA[0] ADDR2_BA[1] ADDR2_BA[2] ADDR2_MCLK B14 D24 B24 56 56 22 R306 R305 R304 R303 C24
DQ15
B9
R2
A12
SDDR_A[12]
+1.8V_DDR
BDDR2_A[0-12]
SDDR_D[12]
DQ12
D1
TDDR_A[0-12]
D3
P8
A8
SDDR_A[8]
P3
A9
SDDR_A[9]
ADDR2_A[0-12]
SDDR_D[10]
DQ10
D7
P2
L2
BA0
SDDR_BA[0]
VDD5
A1
L3
BA1
SDDR_BA[1]
VDD4
E1
L1
BA2
SDDR_BA[2]
J9
OPT
VDD1
R1
K8
CK
/SDDR_CK
K2
CKE
VDDQ10 56 56 56
OPT R350
150 R300
VDD2
M9
J8
CK
SDDR_CK
A9
K9
ODT
SDDR_ODT 56
K9 L8 K7 L7 K3
A9 C1 C3 C7 C9 E9 G1 R337 R338 56 56 TDDR_DQS0_P TDDR_DQS1_P LDQS UDQS F7 B7 G3 G7 G9 R339 R340 56 56 TDDR_DQM0_P TDDR_DQM1_P LDM UDM F3 B3 A3
VDDQ10 VDDQ9 VDDQ8 VDDQ7 VDDQ6 VDDQ5 VDDQ4 VDDQ3 VDDQ2 VDDQ1
VDDQ9
C1
L8
CS
R347
OPT 4.7K
VDDQ8
C3
K7
RAS
/SDDR_RAS
VDDQ7
C7
L7
CAS
/SDDR_CAS
VDDQ6
C9
K3
WE
/SDDR_WE
E9
VDDQ4
G1
VDDQ3
G3
F7
LDQS
SDDR_DQS0_P
G7
B7
UDQS
SDDR_DQS1_P
VDDQ1
G9
F3
LDM
SDDR_DQM0_P
B3
UDM
SDDR_DQM1_P
VSS5 56 ADDR2_DQS0_N ADDR2_DQS1_N AR306 SDDR_D[11] SDDR_D[12] SDDR_D[9] SDDR_D[14] SDDR_D[4] SDDR_D[3] SDDR_D[1] SDDR_D[6] SDDR_D[15] SDDR_D[8] SDDR_D[10] SDDR_D[13] SDDR_D[7] SDDR_D[0] SDDR_D[2] SDDR_D[5] 56 ADDR2_D[5] ADDR2_D[2] ADDR2_D[0] ADDR2_D[7] 56 AR309 ADDR2_D[13] ADDR2_D[10] ADDR2_D[8] AR308 ADDR2_D[15] 56 ADDR2_D[6] ADDR2_D[1] ADDR2_D[3] ADDR2_D[4] ADDR2_D[14] 56 AR307 ADDR2_D[9] ADDR2_D[12] ADDR2_D[11] 56 R318 R317
VSS5 E3 J3 N1 NC5 NC6 R3 R7 B2 NC1 NC2 NC3 A2 E2 R8 B8 A7 D2 D8 VSSDL J7 E7 F2 F8 H2 VDDL J1 H8 VSSQ10 VSSQ9 VSSQ8 VSSQ7 VSSQ6 VSSQ5 VSSQ4 VSSQ3 VSSQ2 VSSQ1 P9 VSS4 VSS3 VSS2 VSS1
VSS4
E3
E8
LDQS
SDDR_DQS0_N
VSS3
J3
A8
UDQS
SDDR_DQS1_N
VSS2
N1
VSS1
P9
R3
NC5
R7
NC6
VSSQ10
B2
VSSQ9
B8
A2
NC1
VSSQ8
A7
E2
NC2
VSSQ7
D2
R8
NC3
VSSQ6
D8
VSSQ5
E7
VSSQ4
J7
VSSDL
F2
+1.8V_DDR
VSSQ2
H2
VSSQ1
H8
J1
VDDL
ADDR2_D[0-15]
F8
BDDR2_D[0-15]
VSSQ3
EAX57644501 DDR2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2008.12.12 3 12
TDDR_D[0-15]
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
0.1uF C340 0.1uF C302 0.1uF C323 0.1uF
F1
N2
A3
SDDR_A[3]
SDDR_D[7]
DQ7
F9
N8
A4
SDDR_A[4]
SDDR_D[8]
DQ8
C8
N3
A5
SDDR_A[5]
SDDR_D[9]
DQ9
C2
N7
A6
SDDR_A[6]
A7
SDDR_A[7]
AV
R400 0 AV_CVBS_IN AMOTECH D406 30V R411 75 +3.3V JK401 PEJ024-01 3 R409 AV_CVBS_DET 6A 7A PC_R_IN 2:S16 R_SPRING R449 470K R453 10K T_SPRING B_TERMINAL2 PC_L_IN 2:S16 T_TERMINAL2 SHIELD_PLATE R454 10K R450 470K R456 0 R452 15K R451 15K R455 0 4 AV_L_IN 5 R415 12K R410 470K 7B 6B AV_R_IN 8 D422 AMOTECH 5.6V OPT C424 100pF 50V R414 10K AMOTECH D405 5.6V R408 470K C412 100pF 50V R417 12K C413 100pF 50V AMOTECH D404 5.6V B_TERMINAL1 T_TERMINAL1 AMOTECH D403 5.6V C404 1K 0.1uF 16V E_SPRING C414 47pF 50V
JK402
PPJ218-01
PC AUDIO
4A
[YL]O_SPRING
5A R401 4.7K
[YL]CONTACT
2A
[YL]U_CAN
3B
[WH]C_LUG
[WH]U_CAN
4C
[RD]O_SPRING
5C
[RD]CONTACT
2C
[RD]U_CAN
+3.3V
COMPONENT
R425 1K COMP_DET 1:AA22 +5V_GENERAL +5V_GENERAL AMOTECH D412 5.6V
R418 4.7K
JK400
+5V_USB_SIDE
PPJ229-01
7 OUT_1
IN_1
2A
0.1uF C407 10uF OPT USB_CTL 1:AI26 R420 10K R403 47 SIDE_USB_DM 1:AL8 SIDE_USB_DP 1:AL7 D425 CDS3C05HDMI1 5.6V D426 CDS3C05HDMI1 5.6V
3A COMP_Y 2:E20 SPDIF_OUT 2:X18 COMP_Pb 2 2:E20 VCC R427 75 C406 0.1uF 16V 3 VINPUT 4 COMP_Pr 2:E20 FIX_POLE R432 10K R435 0 COMP_L_IN 2:S16 D410 AMOTECH 5.6V R434 12K R429 470K C415 1000pF 50V R428 75 OPT ZD403 AMOTECH D408 30V D407 30V R426 75
[GN]O_SPRING
R419 AMOTECH 0
2B
[BL]1P_CAN
USB_OCD 1:AI14
[RD]C_LUG_L
KJA-UB-4-0004 JK405
5D
[WH]C_LUG_L
4E R431 10K R436 0 COMP_R_IN 2:S16 C417 1000pF 50V R433 12K D411 AMOTECH 5.6V R430 470K
[RD]CONTACT 5
3E
[RD]O_SPRING
A0 1 WP 8
VCC
RS232C
R404 2.2K R412 R416 10K 100 ISP_RXD ISP_TXD C428 0.33uF 16V R406 2.2K
+5V_ST
A1 2 SCL 7
[ PC ]
3 SDA 6 VSS 4 5
A2
V-
C2-
C2+
C1-
V+
RIN2
DOUT2
D413 30V D414 30V ADUC30S03010L_AMODIODE D419 ADMC5M03200L_AMODIODE 5.6V OPT +3.3V +5V_ST D418 ADMC5M03200L_AMODIODE 5.6V OPT
IC403 MAX3232CDR
R437
11
12
13
14
15
R440
GND
DIN1
DIN2
ROUT1
RIN1
2:E19 DSUB_B D415 ADUC30S03010L_AMODIODE 30V JP414 R448 DSUB_DET JP412 R446 0 OPT OPT 1K D420 ADMC5M03200L_AMODIODE 5.6V
ROUT2
DOUT1
VCC
2:E18
DSUB_HSYNC
10
16
2:E18
DSUB_VSYNC
C1+
R443 75
C418 OPT
R441 75
C419 OPT
DBG_RX C426
6 7 8 9 10 16
50V 50V
@maker
DBG_TX
R460 100
R457 6.2K
R458 6.2K
R459 100
R461 0 OPT
2:E18 DSUB_R
P400 KCN-DS-1-0089
R442 75
P401 KCN-DS-1-0088 6 7 8 9
10
2E
[RD]1P_CAN2
2D
[WH]1P_CAN
Fiber Optic
2C
[RD]1P_CAN1
ADMC5M03200L_AMODIODE R462 1K
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
EAX57644501 INTERFACE 2008.12.12 4 12
C403
4A
[GN]CONTACT
5B
[BL]C_LUG_L
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_CI_ON
+5V_GENERAL
R505
10K
/CI_CD1
R511
100
AR500
CI_TS_DATA[4]
33
CI_TS_DATA[5]
CI_TS_DATA[6] CI_TS_DATA[7]
R508
10K
CI_IORD
CI_IOWR
CI_MDI[0]
CI_MDI[1]
CI_MDI[2]
CI_MDI[3]
C503
0.1uF
R513
GND
CI_MDI[4]
CI_MDI[5]
CI_MDI[6] 56 57 58 59 60 61 62 63 64 65 66 67 68
CI_DATA[0-7]
CI_MDI[7]
R509
10K
PCM_RST
R503
47
/PCM_WAIT
R500
47
REG
AR503
CI_TS_CLK CI_TS_VAL
33
CI_TS_SYN
CI_TS_DATA[0]
R507
10K
+5V_GENERAL
R506
CI_MISTRT CI_MIVAL_ERR
CI_MCLKI
+3.3V_CI
IC500 74LVC1G32GW
AR508
TC74LCX244FT
10K
R512
/CI_CD2
R510
100
GND
OPT
AR504
0.1uF
C510
CI_DATA[0-7]
C512
A0 2 3 4 5 6 A5 A6 A7 GND 7 8 9 10 A1 A2 A3
R522 10K
19 18 17 16 15 14 13 12 11
OE2
PCM_D[0-7]
0.1uF
1 20
CI_DATA[7]
PCM_D[7]
Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
R526 47 R528 47
CI_DATA[0-7] BUF_TS_CLK
BUF_TS_VAL_ERR R527 47 CI_ADDR[8] BUF_TS_SYN R525 47 CI_ADDR[9] CI_ADDR[10] BUF_TS_DATA[0] CI_ADDR[11] 33 AR510 PCM_A[8] PCM_A[9] PCM_A[10] PCM_A[11]
Q501 RSR025P03
A4
BUFFER
R504 22K
33
R529 2.2K
R502 10K
PCM_5V_CTL
Q500 2SC3052
33
R501 33K
EAX57644501 PCMCIA
PCM_D[0-7]
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
33 PCM_D[0] PCM_D[1] PCM_D[2] PCM_D[3]
CI_TS_DATA[1]
33
CI_TS_DATA[2] CI_TS_DATA[3]
E12 /CI_CD2
VCC
16V
GND
GND
AR509
33
FE_TS_DATA[0-7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2008.12.12 5 12
5V_HDMI_1
HDMI EEPROM
5V_HDMI_1 +5V_ST
22
Q601 2SC3052
R615 10K
HPD1
E A2
18 C
UI_HW_PORT2
ENKMC2838-T112 D600
R600
R610
22
16 EDID_WP JP606 A0 1 WP C603 0.1uF 4.7K R626 4.7K R629 R618 0 8 VCC +3.3V
JP600
17
2K
R612 1K
IC600 CAT24C02WI-GT3
D0+_HDMI2
D0-_HDMI2
CK+_HDMI2
CK-_HDMI2
DDC_SCL_2
D2+_HDMI2
D2-_HDMI2
D1+_HDMI2
13 +5V_HDMI_SW A1 2 7 SCL R623 C608 0.1uF VSS 4 R621 0 5 SDA DDC_SDA_1 C609 0.1uF C610 0.1uF C611 0.1uF C612 0.1uF C613 0.1uF C614 0.1uF 0 DDC_SCL_1 L600
12
BLM18PG121SN1D
11 10 A2 3 6 D605
CK+
2:E8
EAG39789402
8 C616 0.1uF
D0_GND
D0+
5 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
D1_GND
4 DDC_SDA_1 DDC_SCL_1 GND_1 3 4 5 6 JP611 A0 1 8 WP R640 0 C607 0.1uF SCL VCC 7 8 9 10 11 12 13 14 15 16 +3.3V 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 S2 4 5 VSS 34 EQ SDA 35 HPD1 DDC_SDA_3 3 6 36 SDA1 A2 DDC_SCL_3 37 SCL1 CK-_HDMI3 38 B11 2 7 CK+_HDMI3 A1 39 A11 40 VCC_5 D0-_HDMI3 41 B12 D0+_HDMI3 42 A12 43 GND_6 D1-_HDMI3 44 B13 D1+_HDMI3 45 A13 46 B31 CK-_HDMI1 A31 VCC_1 B32 D0-_HDMI1 A32 GND_2 B33 A33 VCC_2 D2-_HDMI1 D2+_HDMI1 GND_3 VSADJ R624 4.7K 1/10W 1% Y4 Z4 Y3 Z3 Y2 Z2 Y1 Z1 S1 OPT 4.7K R650 GND A34 B34 D0+_HDMI1 D1-_HDMI1 D1+_HDMI1 CK+_HDMI1 VCC_6 D2-_HDMI3 SCL3 2 47 B14 D2+_HDMI3 SDA3 1 48 A14
D2-
D2_GND
EDID_WP
D1+
MMBD301LT1G 30V
D0-
D1-_HDMI2
DDC_SDA_2
14
R607 0
JP601
15
R611
22
19
D2+
IC602 CAT24C02WI-GT3
20
IC603 TMDS351PAGR
21
GND
J600
UI_HW_PORT1
R646 4.7K
A2
2:E9 D2+_HDMI1
UI_HW_PORT3
UI_HW_PORT1
5V_HDMI_2
VCC_3
GND_4
VCC_4
SCL_SINK
SDA_SINK
HPD_SINK
E R633 0
GND_5
22
Q602 2SC3052
R616 10K
HPD2
2K
A2
R601
17
R603
22
A1 ENKMC2838-T112 D606
D2+_HDMI_SW
D2-_HDMI_SW
D1+_HDMI_SW
D1-_HDMI_SW
D0+_HDMI_SW
D0-_HDMI_SW
CK+_HDMI_SW
9 4.7K R652
D04.7K R651
CK-_HDMI_SW
EAG39789402
A2
D2+
2:E12 D2+_HDMI2
A1
20
SIDE HDMI
HPD3 A24 B24 VCC_8 A23 B23 GND_7 A22 B22 VCC_7 A21 B21 SCL2 SDA2 HPD2 5V_HDMI_4 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 SDA3 C JACK_GND 2 3 4 5 6 7 8 9 10 11 12 B34 A34 GND_3 VSADJ 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 20 B31 A31 VCC_1 B32 A32 GND_2 B33 A33 VCC_2 E 19 18 R602 JP604 17 R608 22 16 15 R606 K19;K8;AH25 R609 0 CEC_REMOTE 2:E13 CK-_HDMI4 22 2K R614 1K C602 0.1uF 16V Q603 2SC3052 GND_1 HPD4 B R617 10K SCL3 1
21
IC601 CAT24C02WI-GT3
JP607 A0 49 A14 48 47 46 45 44 43 42 41 40 39 38 37 36 B14 VCC_6 A13 B13 GND_6 A2 3 VSS A12 B12 VCC_5 A11 B11 SCL1 SDA1 HPD1 35 34 33 32 RESERVE1 S2 6 SCL R620 0 1 A1 8 VCC
UI_HW_PORT2
J601
GND
RESERVE2
19
$0.26
14 13 DDC_SDA_3 DDC_SCL_3 9 8 7 6 CK+_HDMI3 5 D0-_HDMI3 4 3 D0+_HDMI3 2 D1-_HDMI3 1 D2+ D2_GND D2D1+ D1_GND D1D0+ D0_GND D011 10 CK+ 2:E13 CK+_HDMI4 2:E13 D0-_HDMI4 12
18
JP605
2K
R636
Y4
Z4
Y3
Z3
Y2
Z2
Y1
Z1
14 CEC_REMOTE CK-_HDMI3
VCC_3
GND_4
VCC_4
EAG42463001
SCL_SILK
SDA_SILK
12
HPD_SILK
13
GND_5
R639
JP602
S1
EAG39789402
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5V_HDMI_3 +5V_ST
19
18
R613 1K
JP609
16
15
R604
22
IC6004 CAT24C02WI-GT3
JP608 A0 1 A1 8 VCC
14
R605 0
JP603
K8;X14;AH25
EDID_WP
13
12
11 10
CK+
2 A2
WP
R641 0
R643 4.7K
R644 4.7K
8 DDC_SDA_SW DDC_SCL_SW
D0_GND
D0+
D1-
D1_GND
D1+
D2-
5V_HDMI_4
+5V_ST
D2_GND
ENKMC2838-T112 D601
EDID_WP
WP
R619 0
C604 0.1uF
R628 4.7K
R630 4.7K
5V_HDMI_3
DDC_SCL_4
IC603-*1 BU16027KV
22
Q604 2SC3052
R634 10K
HPD3
R635 1K
HDMI S/W_rohm
JP610
17
R637
22
16
15
R638
22
+3.3V_ST
R627 120K
11 10
CK+
D0-
MMBD301LT1G D603 30V HDMI_CEC SOURCE1 1 GATE1 2:E14 D2+_HDMI4 6 DRAIN1 CEC_REMOTE 2:E14 D1+_HDMI4 2:E14 D2-_HDMI4
D0_GND
D0+
D1-
2 DRAIN2
OPT
3
GATE2
5 D1+_HDMI3 D2-_HDMI3
D1_GND
D1+
SOURCE2
D2-
D2_GND
D2+
UI_HW_PORT4
R625
GND
20
21
UI_HW_PORT3
J603
GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX57644501 HDMI
2008.12.12 6 12
+24V C741 1000pF 50V R730 4.7K 2S C745 0.47uF 50V 1S C750 0.1uF 50V R731 4.7K SPK_LAB11 C726 22000pF 50V C756 0.01uF 50V 3.3 1F R735 C749 0.1uF 50V C733 0.1uF 50V C725 10uF 35V D705 1N4148W 100V OPT R726 R713 12 12 C716 22000pF 50V C742 1000pF 50V C729 0.1uF 50V L704 DA-8580 EAP38319001 2F
SPEAKER_L
100
PGND1A_2 OUT1A_2
PGND1A_1 OUT1A_1
PVDD1A_2
PVDD1A_1
PVDD1B_2 OUT1B_2
PVDD1B_1 OUT1B_1 47 46
PGND1B_2 45
56
55
54
53
52
51 50
49
48
PGND1B_1 44
1:AA21
AMP_RST
C707 1000pF 50V R740 0 C713 VDR1A 2 3 4 5 6 7 8 9 10 11 32 31 30 29 15 16 17 18 19 20 21 22 23 24 25 26 27 28 +24V PGND2B_2 C728 0.1uF 50V C720 0.1uF 50V OUT2B_1 OUT2B_2 12 12 12 13 14 NTP-3100L PVDD2B_1 R728 R719 0.1uF 50V 4.7K 33 PVDD2B_2 D707 1N4148W 100V OPT C752 R733 EAN60664001 34 PVDD2A_1 35 PVDD2A_2 1S 1F 3.3 C758 0.01uF 50V 36 C744 1000pF 50V OUT2A_1 R737 3.3 IC701 37 OUT2A_2 0.1uF 50V 4.7K 38 PGND2A_1 C746 0.47uF 50V C751 R732 0.01uF 50V R736 39 PGND2A_2 C757 C743 1000pF 50V L705 DA-8580 EAP38319001 2S 2F 40 BST2A 41 VDR2A 12 RESET AD DVSS_1 VSS_IO CLK_I VDD_IO DGND_PLL AGND_PLL LFM AVDD_PLL DVDD_PLL TEST0 C708 1000pF 50V R708 3.3K C709 0.1uF 12 0.1uF16V +3.3V C732 22000pF 50V D706 1N4148W 100V OPT BST1A 1 42 NC R716 R727 C730 0.1uF 16V
2:X21
AUDIO_MASTER_CLK
SPK_R+
AB11
+1.8V_AMP
+1.8V_AMP
SPEAKER_R
L701
R703 0
L700
C705
BLM18PG121SN1D
100pF 50V
BLM18PG121SN1D
SPK_R-
AB12
C706 0.1uF 16V DVDD SDATA FAULT VDR2B BST2B +1.8V_AMP C734 0.1uF 50V C731 22000pF 50V +3.3V_ST C721 0.1uF 16V R718 C Q701 2SC3052 10K NTP_MUTE 1:AA22 E A2 B C R729 SB_MUTE 1:AA19;G25;9:AI24;9:AI25 C712 33pF 50V R717 33K OPT C714 33pF 50V D709 ENKMC2838-T112 A1 100 R724 10K 0.1uF 50V C735 C736 10uF 35V DVSS_2 MONITOR_0 MONITOR_1 MONITOR_2 PGND2B_1
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
WAFER-ANGLE L706 120-ohm AE3 SPK_L+ L707 120-ohm AE5 SPK_LL709 120-ohm AE7 SPK_R+ L708 120-ohm AE9 SPK_R1 P700 2 3 4
2:X21
MS_LRCH
2:X21
MS_LRCK
2:X21
MS_SCK
1:L22;11:AG10
SDA_SUB/AMP
1:L22;11:AG9
SCL_SUB/AMP
Monitor0_1_2 TP is necessory
EARPHONE AMP
2A => 5A
HP_LOUT
IC700 TPA6110A2DGNRG4
+3.3V BYPASS 1 8 16V GND 2 VDD C719 100uF 16V 1K R714 C723 0.1uF C761 22uF 25V HP_DET 2 R715 1K R706 20K +5V_GENERAL DJ-S3600LM JK700 C711 100uF 16V C A2 D700 ENKMC2838-T112 A1 +5V_EARPHONE C722 0.1uF D711 AMOTECH 5.6V C762 22uF 25V 1 5 D710 5.6V AMOTECH 7 VO1 C718 100uF 16V IN1R711 20K R712 20K C717 0.22uF R707 10K 4 3
+5V_EARPHONE
2:X19
R701 10K
HP_ROUT IN24 5
R702 20K
2:X19
+5V_EARPHONE
R742 10K
R700
10K
Q700 2SC3052
R741
HP_MUTE
10K
Q705 2SC3052
J25;M25
SB_MUTE
D708 ENKMC2838-T112 A1
1:AJ19
SIDE_HP_MUTE
A2
EAX57644501 AMP
2008.12.12 7 12
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+12V
+5V_GENERAL
+3.3V_ST
IC808 MP2305DS
R818 3.3K
BackLight On/Off
R814 100
RT1P141C-T112
C 1 2 R806 0 C B R810 POWER_ON/OFF1 E 1:AK10 +5V_ST PANEL_CTL R833 10K B 0 R802 10K OPT Q800 2SC3052 R805 10K OPT R832 10K R804 10K
INV_CTL
R821 10K
P800 FW20020-24S
$0.28
+24V
L804 CB3216UA121
10
11
12
13
14
15
16
17 .
18
19
12 20
21 11 14 22
OPC_OUT2
23
13 24
+5V
450 mA
L826 2.2uH 10K R1 R872 Vout=0.8*(1+R1/R2) C877 0.1uF 16V
ERROR_OUT C865 0.1uF 16V C826 100uF 16V +12V C829 1uF 6.3V EN2 FB2 R803 100K R809 10.5K 1%
R841 0
+12V
R2 R859 PWM_DIM 22uF C876 20 19 18 17 PGND2_1 1 15 14 BS 1 8 SS R874 75K 7 COMP R873 5% 3 6 FB 56000 5% GND 4 5 C882 330pF +3.3V_AVDD R1 L827 2.2uH L805 BLM18PG121SN1D GND GND +3.3V_AVDD_MPLL +3.3V +3.3V_ST L808 22UH C811 0.1uF 16V C883 330pF C804 22uF 25V C816 0.47uF 25V C863 0.01uF SW 25V IN 2 EN C862 5.6nF 50V R813 9.1K AVCC NC C823 0.1uF 16V 2 3 13 ITH2 L817 BLM18PG121SN1D 10uF C878 PVCC_2 PVCC_3 4 12 11 6 7 8 9 10 ITH1 5 AGND 10uF C879 PGND1_1 PVCC_1 16 OPC_OUT1 +5V_ST OPT 22 R871 8.2K 1%
PGND2_2 SW2_2
SW2_1
A_DIM
R851
4.7K
IC810 MP2305DS
OPT
IC806 BD9150MUV
$0.28
EN1
FB1
SW1_1
PGND1_2
33K R849 1%
R838 12K
$0.24 DEVELOPE IN 3 BS
$0.195
OPT C849 22uF 10V C856 0.1uF R836 10K EN 2 VIN C836 10nF 50V R862 R826 10 1/10W 1% C840 1uF 6.3V 47 Placed on SMD-TOP 7 ADJ
1/10W 1%
EAX57644501 POWER
9.1K R840
1% 1/10W
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
22uF C880 SW1_2 +3.3V_MEMC R2 R850 12.4K 1% Vout=0.923*(1+R1/R2) BLM18PG121SN1D L815 C867 22uF 16V C869 0.1uF 16V C815 0.1uF 16V +3.3V_CI R856 4.7K R800 1:AK11 POWER_ON/OFF1 10K 10uF C866 C852 0.1uF 16V L814 BLM18PG121SN1D C825 0.1uF 16V
Stand-by +3.3V
+5V_ST
+3.3V_ST
Replaced Part
+3.3V_ST
IC801
AP1117E33G-13
L803 BLM18PG121SN1D
IN
$0.048
ADJ/GND
OUT
+5V_GENERAL
+3.3V_TUNER
50 mA
2 OUT C822 100uF 16V C827 0.1uF 16V
+3.3V_MEMC
IC809
AP1117E33G-13
IN IC804 AZ1117H-1.2TRE1 IN 3 $0.05 1 ADJ/GND C801 100uF 16V C805 0.1uF 16V C884 0.1uF 16V C810 100uF 16V 2 OUT +1.2V_TUNER
3 +3.3V
$0.048
ADJ/GND
OUT
$0.23
VCC 2 ITH R829 18K C817 10uF 6.3V C819 0.1uF 16V C828 330pF 50V GND 4 5 PGND 7 PVCC
180 mA
3 6 SW
R1
R835 17.4K 1%
R2
BLM18PG121SN1D L812
Replaced Part OPT R830 10K 1/16W
MAX 3A
R831 1/16W 10K
Vout=0.8*(1+R1/R2)
400 mA
IC805 MP2212DN
R1 FB R2 GND 2 7
+3.3V_MEMC
+1.8V_FRC_DDR
1600 mA
NC_1
IC807 SC4215ISTRT
Vout=0.8*(1+R1/R2) GND 1 8
R1
Placed on SMD-TOP
R1/R2 : 27K / 20K => Vout=1.88 R1/R2 : 15K / 12K => Vout=1.80 R1/R2 : 12K / 9.1K => Vout=1.85 R1/R2 : 18K / 13K => Vout=1.90
3 NC_2
VO
C IN
C838 22uF
NC_3
2008.12.12 8 12
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPI FLASH
+3.3V_MEMC
PANEL_POWER
MEMC_RXE4+
MEMC_RXE4-
MEMC_RXE3+
MEMC_RXE3-
MEMC_RXEC+
MEMC_RXEC-
MEMC_RXE2+
MEMC_RXE2-
MEMC_RXE1+
MEMC_RXE1-
MEMC_RXE0+
MEMC_RXE0-
MEMC_RXO4+
MEMC_RXO4-
MEMC_RXO3+
MEMC_RXO3-
MEMC_RXOC+
MEMC_RXOC-
MEMC_RXO2+
MEMC_RXO2-
MEMC_RXO1+
MEMC_RXO1-
MEMC_RXO0+
10K
C903
R927
M_SPI_CZ R928 100 M_SPI_CK R930 100 100 C952 1000pF 0.1uF C953 R936 +3.3V_MEMC 100 R946 100 R939 L905 100 C904 0.1uF C906 1uF R943 100 +3.3V_MEMC_AVDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
R925 R929 100 R931 L907 URSA_A0P URSA_A0M URSA_A1P URSA_A1M URSA_A2P URSA_A2M URSA_A3P URSA_A3M URSA_A4P URSA_A4M URSA_B0P URSA_B0M URSA_B1P URSA_ACKP BLM18PG121SN1D
P900 TF05-51S
56
CS
VCC
M_SPI_DO
R926
56
DO
HOLD
M_XTALO
GND
DIO
R948 M_SPI_DI R935 100 +3.3V_MEMC +3.3V_MEMC_AVDD 100 R938 BLM18PG121SN1D 100 R942 L904 10V 10uF C908 C901 10V 100 C939 0.1uF R945 URSA_ACKM URSA_B1M C951 220uF 16V
56
+1.26V_MEMC
Placed on SMD-TOP
22uF
16V
10uF
10uF
C914
C912
C956 0.1uF
C937
R954 C907 10uF C905 820 A0P A0M A1P A1M A2P A2M ACKP ACKM A3P A3M A4P A4M CPV OE B0P B0M B1P B1M REXT 10uF OPT 10V
+3.3V_MEMC
RXE4+
RXE4-
RXE3+
RXE3-
RXECK+
RXECK-
RXE2+
RXE2-
RXE1+
RXE1-
RXE0+
RXE0-
AVDD_LVDS_2 0.1uF
VSS16
RXO4+
RXO4-
RXO3+
RXO3-
RXOCK+
RXOCK-
RXO2+
RXO2-
RXO1+
RXO1-
RXO0+
RXO0-
AVDD_LVDS_1
VSS_15
GPIO_4
GPIO_3
XTALO
XTALI
GPIO_2
GPIO_1
I2CM_SDA
I2CM_SCL
GPIO25
POL
POL_SI
TP
VSS14
4.7K
4.7K
+3.3V_MEMC B1 A1 C1 C2 A2 B2 B3 A3 C3 C4 A4 B4 H8 B5 A5 C5 C6 A6 B6 B7 A7 C7 C8 A8 B8 H7 D4 D3 D5 D6 N7 G8 B9 A9 C9 D9 D7 F11 G11 K15 K16 B14 A14 E11 D13 D11 F10 C10 A10 B10 B11 A11 C11 C12 A12 B12 B13 A13 C13 C14 D12
AVDD_PLL
CB3216PA501E
19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 P901 TF05-41S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42
WP_FLASH_MEMC
M_XTALI
WP
CLK
R947
56
0.1uF
W25X20AVSNIG
MEMC_RXO0-
IC902
R949 E1 R970 D10 E10 E3 [E1] [D1] B15 A15 A16 B16 C16 D15 D16 F9 G10 E15 E16 E14 F14 F16 F15 G15 G16 G14 VDDC_2 C926 DDR2_DQ20 H1 H16 H15 J15 J16 J14 K14 DDR2_DQ27 J2 J3 K1 L14 L15 L16 M16 F8 M15 M14 N16 N15 H6 N6 E12 D14 F12 E13 F13 G13 H13 J13 K12 [N13] [L9] [N5] [N4] [N12] L12 K13 M12 M13 L13 N14 N13 N12 T3 R3 P3 T4 R4 J10 P4 T5 R5 P5 T6 R6 P6 T7 L11 R7 P7 T8 R8 P8 N8 K10 F7 T9 R9 K7 P9 T10 K11 R10 P10 T11 R11 J11 P11 T12 R12 P12 J7 H11 T13 R13 P13 T14 R14 P14 T15 R15 P15 T16 R16 P16 N9 N10 N11 M11 G6 D2M DCKP DCKM AVDD1 D3P D3M D4P D4M VDDC_5 GPIO24 GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 PWM0 PWM1 SPI_CZ SPI_DO SPI_DI SPI_CK GPIO30 GPIO29 GPIO28 OPT R933 0 WP_FLASH_MEMC VDDP_3 GPIO26 GPIO27 RESET VDDC_4 GPIO8 PWM1 VSS11 M_SPI_CZ M_SPI_DO M_SPI_DI M_SPI_CK OPT R960 1K R964 1K OPT 1K 0.1uF +3.3V_MEMC C947 URSA_D3P URSA_D3M URSA_D4P URSA_D4M K2 K6 K3 L1 J8 L2 L3 L6 L8 H10 M1 M2 L7 M3 N1 J9 N2 N3 L10 P1 R1 T1 T2 R2 P2 G7 L9 N5 N4 C950 G9 D2P 0.1uF VSS12 URSA_D2P URSA_D2M URSA_DCKP URSA_DCKM DDR2_DQ28 C919 0.1uF DDR2_DQ25 DDR2_DQ30 AVDD_DDR1 DDR2_DQM3 DDR2_DQM2 C920 DDR2_DQS2 DDR2_DQSB2 AVDD_DDR2 VDDP_2 VSS5 C927 DDR2_DQSB3 AVDD_DDR3 DDR2_DQ31 DDR2_DQ24 C921 0.1uF DDR2_DQ26 DDR2_DQ29 AVDD_DDR4 DDR2_DQ23 DDR2_DQ16 DDR2_DQ18 DDR2_DQ21 DDR2_MCLK DDR2_MCLKZ C925 0.1uF AVDD_MEMPLL MVREF DDR2_ODT 0.1uF 0.1uF C923 C922 VSS7 VSS6 0.1uF DDR2_DQS3 0.1uF VSS4 D1M D1P D0M D0P C4M H2 H3 J1 C4P DDR2_DQ19 DDR2_DQ17 DDR2_DQ22 F6 H14 C3M C3P CCKM CCKP URSA_CCKP URSA_CCKM URSA_C3P URSA_C3M URSA_C4P URSA_C4M URSA_D0P URSA_D0M URSA_D1P URSA_D1M C2M URSA_C2M C2P URSA_C2P C1M URSA_C1M LVDS_SEL OPT OPT OPT OPT 22 C1P URSA_C1P C0M 0.1uF URSA_C0M PWM_DIM R967 OPT C0P URSA_C0P VSS13 OPC_OUT1 L911 BLM18PG121SN1D AVDD2 C949 B4M URSA_B4M B4P URSA_B4P OPC_EN L910 BLM18PG121SN1D B3M URSA_B3M B3P URSA_B3P OPC_OUT2 BCKM URSA_BCKM BCKP URSA_BCKP B2M URSA_B2M C15 B2P URSA_B2P D2 BIST BIT_SEL R955 22 OPT PDI STV STH_F D1 F1 G1 K8 E5 E2 F2 F3 G2 M4 M5 G3 E4 F4 G4 H4 J4 K4 L4 J6 H9 K9 D8 I2CS_SCL GPIO8 +3.3V_MEMC VDDC_1 GPIO10 GPIO11 GPIO12 1K GPIO13 GPIO22 GPIO23 GPIO14 R957 R956 GPIO15 1K GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 C929 VSS2 0.1uF 0.1uF VSS3 VDDP_1 1K C928 0.1uF VSS1 GPIO9
1K
MEMC_SDA
R992
R978
MEMC_SCL
R993
100 100
I2CS_SDA STH_S
OPT
R950 OPT
1K
GPIO12
GPIO14
LOW
LOW
LOW
HIGH
HIGH
LOW
HIGH
HIGH
+3.3V_MEMC
10uF
10V
10uF
OPT 0
OPT
0OPT
0.1uF C957 C964 C960 0.1uF C963 0.1uF C962 0.1uF C961 0.1uF R971 R973 R937 R979 URSA_D4M URSA_D4P URSA_D3M URSA_D3P URSA_DCKM URSA_DCKP URSA_D2M URSA_D2P URSA_D1M URSA_D1P URSA_D0M URSA_D0P URSA_C4M URSA_C4P URSA_C3M URSA_C3P R959 1K R963 URSA_CCKM URSA_CCKP URSA_C2M URSA_C2P URSA_C1M URSA_C1P URSA_C0M URSA_C0P PWM0 I2C HIGH LOW HIGH EEPROM HIGH HIGH LOW SPI HIGH HIGH HIGH MEMC_RESET
C916
C917
+1.8V_FRC_DDR
URSA_DQ[20]
Placed on SMD-TOP
URSA_DQ[19]
22uF
16V
URSA_DQ[17]
URSA_DQ[0-31]
URSA_DQ[22]
IC900 MST7323S
URSA_DQ[27]
C909
URSA_DQ[28]
URSA_DQ[25]
URSA_DQ[30]
URSA_DQM3
URSA_DQM2
URSA_DQS2
URSA_DQSB2
URSA_DQS3
URSA_DQSB3
URSA_DQ[31]
URSA_DQ[24]
URSA_DQ[26]
URSA_DQ[29]
URSA_DQ[23]
URSA_DQ[16]
+3.3V_MEMC
URSA_DQ[18]
URSA_DQ[21]
URSA_MCLK
BLM18PG121SN1D
URSA_MCLKZ
L903
C913
10uF
URSA_ODT
VSS8
MCLKE
VSS9
DDR2_A0
DDR2_A2
DDR2_A4
DDR2_A6
DDR2_A8
DDR2_A1
DDR2_A5
DDR2_A9
DDR2_A7
DDR2_A3
VDDC_3
VSS10
DDR2_A11
DDR2_WEZ
DDR2_BA1
DDR2_BA0
DDR2_A10
DDR2_A12
DDR2_DQ4
DDR2_DQ3
DDR2_DQ1
DDR2_DQ6
DDR2_DQ9
DDR2_DQ8
DDR2_DQ7
DDR2_DQ0
DDR2_DQ2
DDR2_RASZ
DDR2_CASZ
AVDD_DDR5
AVDD_DDR6
DDR2_DQ11
DDR2_DQ12
DDR2_DQ14
AVDD_DDR7
DDR2_DQM1
DDR2_DQM0
DDR2_DQS0
DDR2_DQS1
DDR2_DQ15
DDR2_DQ10
DDR2_DQSB0
DDR2_DQSB1
DDR2_DQ13
DDR2_DQ5
DDR2_MCLK1
DDR2_MCLKZ1
TESTPIN
C938
C944
C941
0.1uF
XTAL
C932 C933 C934 C935 10K R951 C936
R934
1M
0.1uF
0.1uF
0.1uF
+3.3V_MEMC
M_XTALI
15pF
R953
C900
X900 12MHz
C902
C945
10K R994
URSA_A[0]
URSA_A[2]
URSA_A[4]
URSA_A[6]
URSA_A[8]
URSA_A[11]
URSA_A[1]
URSA_A[10]
URSA_A[5]
URSA_A[9]
URSA_A[12]
URSA_A[7]
C924 1uF
URSA_A[3]
URSA_DQ[4]
URSA_DQ[3]
URSA_DQ[1]
URSA_DQ[6]
URSA_DQ[11]
URSA_DQ[12]
URSA_DQ[9]
URSA_DQ[14]
URSA_DQ[15]
URSA_DQ[8]
URSA_DQ[10]
URSA_DQ[13]
URSA_DQ[7]
URSA_DQ[0]
URSA_DQ[2]
URSA_DQ[5]
URSA_DQ[0-31]
MEMC_SCL
0.1uF C959
0.1uF C958
001:F38;001:AE31 4
MEMC_SDA URSA_WEZ URSA_BA1 URSA_BA0 URSA_DQM1 URSA_DQM0 URSA_DQS0 URSA_MCLKE URSA_DQSB0 URSA_DQS1 URSA_DQSB1 URSA_MCLK1 URSA_A[0-12] URSA_MCLKZ1 5
001:F38;001:AE31
URSA_RASZ
URSA_CASZ
EAX57644501 MST7329N(FRC)
2008.12.12 9 12
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
0.1uF
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
OPT OPT OPT OPT
L902
BLM18PG121SN1D
10V
10V
10uF C1029
C1036
0.1uF C1025
0.1uF C1026
0.1uF C1027
0.1uF C1040
0.1uF
C1041 0.1uF
C1023
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF C1013
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
10uF C1024
0.1uF C1028
0.1uF C1031
0.1uF C1033
0.1uF C1034
0.1uF
0.1uF C1038
C1002
10uF
C1003
C1004
C1005
C1006
C1007
C1009
C1011
C1012
0.1uF C1014
C1015
C1016
C1017
C1018
C1019
C1020
0.1uF C1035
C1001
C1022
10uF
10uF
+1.8V_FRC_DDR
+1.8V_FRC_DDR
R1001
1K 1%
R1037
1K 1%
URSA_A[0-12]
R1038
R1002
1K 1% C1030
C1010
URSA_DQ[27]
DDR_DQ[27]
0.1uF
0.1uF
DDR_DQ[16-31]
DDR_DQ[26] DQ10 D7 D3 D1 D9 B1 B9 B_URSA_CASZ DDRB_A[11] 22 DDRA_A[11] R1024 A_URSA_BA0 A_URSA_BA1 22 150 L2 B_URSA_BA0 B_URSA_BA1 R1005 22 URSA_MCLK 009:J11 R1025 A_URSA_MCLKE 009:AB4 URSA_MCLK1 OPT R1000 150 22 VDD_5 A1 E1 J9 M9 K8 URSA_MCLKZ 009:AB4 010:V9 009:J10 B_URSA_MCLKE 010:T10 URSA_MCLKZ1 K2 CKE R1 CK R1006 22 J8 CK VDD_4 VDD_3 VDD_2 VDD_1 L3 BA1 BA0 DDRB_A[8] URSA_A[11] URSA_CASZ URSA_A[11] URSA_A[8] URSA_CASZ URSA_A[8] A_URSA_CASZ DDRA_A[8] R2 A12 DDRB_A[12] B_URSA_RASZ URSA_RASZ URSA_RASZ A_URSA_RASZ P7 AR1017 AR1019 A11 DDRB_A[11] M2 DDRB_A[6] URSA_A[6] URSA_A[4] DDRA_A[4] A10/AP DDRA_A[11] DDRA_A[12] DDRB_A[10] DDRA_A[10] P3 DDRB_A[4] 22 URSA_A[4] URSA_A[6] DDRA_A[6] 22 A9 DDRB_A[9] DDRA_A[9] P8 DDRB_A[2] AR1015 URSA_A[0] DDRA_A[0] URSA_A[2] AR1012 A8 DDRA_A[8] DDRB_A[8] DQ11 DQ12 DQ13 DQ14 DQ15
DDRA_A[0-12]
URSA_DQ[29] DDRA_A[7]
DDR_DQ[29] A7 DDRB_A[7]
C2
DDRB_A[0-12]
DDR_DQ[25] DQ9
N7 P2 P8
C2 D7 P3 M2 P7 R2 D3 D1 D9 B1 B9
DDR_DQ[0-15]
R1039 OPT
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
1K 1% 0.1uF C1037 0.1uF C1039 URSA_DQ[0-31] 010:E20;009:AB4 AR1004 DDR_DQ[15] DDR_DQ[8] DDR_DQ[10] DQ0 G8 G2 H7 H3 H1 H9 F1 F9 C8 A6 DDRB_A[6] DDRA_A[6] A6 N3 DDRB_A[7] 22 URSA_A[7] DDRA_A[7] URSA_A[7] 22 A5 DDRB_A[5] DDRA_A[5] A5 N8 DDRB_A[12] URSA_A[12] AR1011 DDRA_A[12] AR1014 URSA_A[12] A4 DDRA_A[4] N8 N3 DDRB_A[4] A4 N2 URSA_A[9] DDRA_A[9] A3 DDRA_A[3] N2 DDRB_A[3] A3 M7 DDRB_A[3] DDRB_A[9] URSA_A[3] URSA_A[9] A2 M7 DDRB_A[2] DDRA_A[2] A2 M3 DDRB_A[1] 22 URSA_A[10] DDRA_A[10] URSA_A[1] A1 M3 DDRB_A[1] DDRA_A[1] A1 M8 DDRB_A[10] AR1013 DDRA_A[1] URSA_A[10] URSA_A[1] 22 A0 M8 DDRB_A[0] DDRA_A[0] A0 URSA_A[3] AR1010 DDRA_A[3] J2 J2 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 VREF VREF G8 G2 H7 H3 H1 H9 F1 F9 C8 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DDR_DQ[0] DDR_DQ[1] DDR_DQ[2] DDR_DQ[3] DDR_DQ[4] DDR_DQ[5] DDR_DQ[6] DDR_DQ[7] DDR_DQ[8] DDR_DQ[13] DDR_DQ[7] DDR_DQ[0] DDR_DQ[2] DDR_DQ[5] DDR_DQ[11] DDR_DQ[12] DDR_DQ[9] DDR_DQ[14] DDR_DQ[6] DDR_DQ[1] DDR_DQ[3] DDR_DQ[4] AR1007 56 AR1006 56 AR1005 56 56 URSA_DQ[15] URSA_DQ[8] URSA_DQ[10] URSA_DQ[13] URSA_DQ[7] URSA_DQ[0] URSA_DQ[2] URSA_DQ[5] URSA_DQ[11] URSA_DQ[12] URSA_DQ[9] URSA_DQ[14] URSA_DQ[6] URSA_DQ[1] URSA_DQ[3] URSA_DQ[4]
010:AL20;009:AB4
URSA_DQ[0-31]
AR1000
URSA_DQ[28]
DDR_DQ[28]
IC1000 HYB18TC256160BF-2.5
IC1001 HYB18TC256160BF-2.5
URSA_DQ[25]
56
DDR_DQ[25]
URSA_DQ[30]
DDR_DQ[30]
DDR_DQ[16]
URSA_DQ[22]
AR1001
DDR_DQ[22]
DDR_DQ[17]
URSA_DQ[17]
DDR_DQ[17]
DDR_DQ[18]
URSA_DQ[19]
56
DDR_DQ[19]
DDR_DQ[19]
URSA_DQ[20]
DDR_DQ[20]
DDR_DQ[20]
DDR_DQ[21]
URSA_DQ[31]
AR1002
DDR_DQ[31]
DDR_DQ[22]
URSA_DQ[24]
DDR_DQ[24]
DDR_DQ[23]
URSA_DQ[26]
56
DDR_DQ[26]
DDR_DQ[24]
URSA_DQ[23]
AR1003
DDR_DQ[23]
DDR_DQ[27]
URSA_DQ[16]
DDR_DQ[16]
DDR_DQ[28]
URSA_DQ[18]
56
DDR_DQ[18]
DDR_DQ[29]
URSA_DQ[21]
DDR_DQ[21]
DDR_DQ[30]
DDR_DQ[31]
+1.8V_FRC_DDR
BA0 BA1
+1.8V_FRC_DDR
22
CK CKE
K8 K2
M9 R1
VDD_2 VDD_1
K9 URSA_ODT 010:Y14;009:J10 010:R16 010:R16 010:T10 010:V8 A_URSA_WEZ 010:X16 A_URSA_CASZ 010:X16 A_URSA_RASZ 010:Q14;009:J10 B_URSA_RASZ B_URSA_CASZ B_URSA_WEZ URSA_ODT A9 C1 C3 L7 K3 WE C7 C9 E9 G1 G3 G7 G9 F3 URSA_DQM2 009:J15 009:J15 009:W4 009:X4 URSA_DQM3 B3 UDM R1015 56 LDM R1014 56 URSA_DQM0 URSA_DQM1 B7 URSA_DQS3 009:J13 009:Y4 UDQS R1013 56 F7 URSA_DQS2 009:J14 009:X4 LDQS R1012 56 URSA_DQS0 URSA_DQS1 CAS K7 RAS L8 CS VDDQ_9 VDDQ_8 VDDQ_7 VDDQ_6 VDDQ_5 VDDQ_4 VDDQ_3 VDDQ_2 VDDQ_1
ODT
R1008
22
R1027
22
K9 L8 K7 L7 K3 A9 C1 C3 C7 C9 R1031 R1032 56 56 LDQS UDQS F7 B7 E9 G1 G3 G7 R1033 R1034 56 56 LDM UDM F3 B3 G9 VDDQ_10 VDDQ_9 VDDQ_8 VDDQ_7 VDDQ_6 VDDQ_5 VDDQ_4 VDDQ_3 VDDQ_2 VDDQ_1
VDDQ_10
VSS_5 A3 URSA_DQSB2 009:J14 009:J13 AR1016 B_URSA_BA0 B_URSA_BA1 010:Q14 B2 B8 A7 D2 +1.8V_FRC_DDR 010:V10;009:R4 010:V10;009:T4 J7 VSSDL 010:V10;009:R4 URSA_WEZ 22 URSA_MCLKE URSA_BA1 D8 E7 F2 F8 H2 H8 J1 VDDL R8 NC_3 010:V10;009:S4 URSA_BA0 E2 NC_2 A2 NC_1 AR1018 010:Q13 B_URSA_WEZ 22 VSSQ_9 VSSQ_8 VSSQ_7 VSSQ_6 VSSQ_5 VSSQ_4 VSSQ_3 VSSQ_2 VSSQ_1 B_URSA_MCLKE URSA_DQSB3 E3 J3 N1 P9 R3 R7 NC_6 NC_5 L1 NC_4 A8 UDQS R1017 56 E8 VSS_4 VSS_3 VSS_2 VSS_1
LDQS
R1016
56
009:X4 009:Y4
URSA_DQSB0 URSA_DQSB1
R1035 R1036
56 56
LDQS UDQS
E8 A8
A3 E3 J3 NC_4 L1 N1
NC_5 NC_6
R3 R7
P9
VSSQ_10
NC_1 NC_2 A_URSA_BA0 A_URSA_BA1 A_URSA_MCLKE A_URSA_WEZ 010:AA15 010:AA15 010:Z14 010:Y13 VSSDL +1.8V_FRC_DDR NC_3
A2 E2 R8
B2 B8 A7 D2 D8 J7 E7 F2 F8 H2 VDDL J1 H8
VSSQ_10 VSSQ_9 VSSQ_8 VSSQ_7 VSSQ_6 VSSQ_5 VSSQ_4 VSSQ_3 VSSQ_2 VSSQ_1
2008.12.12 10 12
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V
R1124 4.7K SCART1_DET R1126 1K +12V L1104 BLM18PG121SN1D +12V 4.7K R1122 L1109 BLM18PG121SN1D SCART2_DET R1159 1K C1104 10uF 35V R1162 470 B R1166 47K C B DTV/MNT_VOUT 20 19 18 R1161 120 17 16 15 14 13 R1125 62K SC2_ID R1132 11K 12 11 R1134 0 REC_8 D1115 30V OPT R1136 75 R1131 390 E R1167 15K C1109 47uF 16V C1139 0.1uF 50V C1141 0.1uF 50V C1113 0.1uF 16V +3.3V
23 R1117 0 C C1108 220pF 50V OPT 23 R1182 0 FE_VSCART_OUT 0 22 22 2SC3052 21 Q1111 R1175 15K 21 20 19 SC1_FB 18 17 16 15 14 13 12 11 SC1_ID 2:E16 . 10 9 R1137 75 . SC2_ID 8 . 7 6 5 4 C1120 OPT L_IN R1110 10K GND SC1_L_IN GND L_OUT 3 R_IN 2 R_OUT 1 R1108 10K SC1_R_IN D1107 5.6V OPT R1100 C1100 OPT 470K R1111 12K L1108 BLM18PG121SN1D C1112 1000pF 50V L1100 120-ohm C1102 330pF 50V 2:S14 C1121 R1115 OPT 470K D1117 5.6V OPT R1164 0 C1124 330pF 50V L1106 120-ohm R1128 10K R1129 12K SC2_R_IN D1108 5.6V OPT R1103 470K L1101 120-ohm C1101 OPT C1103 330pF 50V R1112 12K D1116 R1116 5.6V 470K OPT D1118 30V OPT R1118 62K R1123 11K D1111 30V OPT C1122 100uF 16V C1107 100uF 16V R1138 120 22 D1112 30V OPT R1139 75 C1119 47pF 50V C1125 220pF 50V OPT C 23 SC2_CVBS_IN R1133 Q1120 C 2SC3052 B R1174 47K C1142 47uF 16V E out_of_stock ISA1530AC1 Q1109
23
R1109 75
22
22
21 R1113 390 E
GND
21
20
20
19
19
R1107 75
18
18
17
17
R1114
16
16
15
SC1_R
15
14
R1104
R1106 75
14
75
13
13
12
12
R1105 0
11
SC1_G
11
R1101
10
75
SC_ID 8
SC1_B
LIN
GND
R1102 75
L1105 120-ohm
GND
L_OUT 3
R_IN
R_OUT 1
OPT
R1194 470K
[SCART2 PIN 8]
+12V 3 3 R1157 4 4 10 SCART2_Lout R1158 5.6K 11 11 5.6K SCART2_Rout 12 12 C1129 33pF R1143 5.6K SCART1_Lout C1127 33pF
OPT
R1193 470K
R1148 10K
10K
R1186
R1154 10K
OPT
R1195 470K
1:AJ19
Q1117 2SC3052
R1192 470K
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
JK1101
DTV/MNT_L_OUT R1135 0 TV_L_OUT C1116 4700pF L1107 BLM18PG121SN1D 002:P7 D1114 5.6V OPT C1117 4700pF R1163 0 DTV/MNT_R_OUT R1160 0 TV_R_OUT 002:P7 D1113 5.6V OPT C1115 4700pF C1114 1000pF 50V C1118 4700pF
JK1100
L1102 BLM18PG121SN1D
L1103 BLM18PG121SN1D
IC1103 LM324D
R1191 2.2K 1 1 DTV/MNT_R_OUT R1155 33K C1135 10uF 16V 14 R1145 33K 14 TV_L_OUT R1196 2.2K
P1304 12507WS-12L R1321 100 SCL_SUB/AMP +3.3V_ST ZD1300 CDS3C05HDMI1 5.6V R1322 100 SDA_SUB/AMP R1319 4.7K R1318 100 KEY1 R1317 100 R1320 4.7K L1301 BLM18PG121SN1D 4 L1303 BLM18PG121SN1D ZD1304 5.6V AMOTECH
+12V
SCL
2
SDA
ZD1301 CDS3C05HDMI1 5.6V 3
C1126 0.1uF 50V R1144 5.6K 5 5 9 R1156 33K 10 SCART1_Rout R1146 33K 6 6 R1130 33pF 9 Q1118 2SC3052 C1128 33pF
R1184 15K
GND KEY1
DTV/MNT_L_OUT KEY2 5
R1176
R1185 0
R1187 0
R1178
12K
KEY2
C1136 10uF 16V +5V_ST L1313 BLM18PG121SN1D C1305 0.1uF C1307 0.1uF ZD1302 5.6V AMOTECH 6
SC_RE1
5V_ST
7
R1177
560 OPT
R1180 1K
GND
R1325 100 +3.3V +3.3V_ST C1314 0.1uF 16V C1315 1000pF 50V IR R1141 10K R1305 100 WARM_LED_ON 9 8
SC_RE2
R1181 1K
Q1116 2SC3052
WARM_ST IR
R1119 10K R1120 10K C1309 100pF 50V +5V_ST ZD1303 5.6V AMOTECH 10
680 OPT
GND
D1120 ENKMC2838-T112 A1 C A2 11 SB_MUTE +5V_ST SCART1_MUTE R1301 10K IR-OUT +3.3V L1314 BLM18PG121SN1D 12
3.3V PWR_ON
C1131 0.1uF IR_OUT 22 R1300 IR-OUT C B E Q1300 2SC3052 IR-OUT R1302 10K IR-OUT C B E 47K R1304 R1323 IR-OUT LED_ON Q1301 2SC3052 IR-OUT 100 R1303 10K IR-OUT C1310 0.1uF 16V C1311 1000pF 50V 13
DTV/MNT_L_OUT
Q1128 2SC3052 2K
R1150
SB_MUTE SCART2_MUTE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_GENERAL
L1204 MLB-201209-0120P-N2 R1229 10 R1231 10K Q1202 E ISA1530AC1 R1230 2.2K B +5V_GENERAL C Q1203 2SC3052 E B L1201 MLB-201209-0120P-N2 C R1232 10K FE_BOOSTER_CTL
TU1200 TDFW-G235D
ANT[5V]
BB[CTR]
GND_1
4 C1207 100pF 50V C1208 0.1uF 16V OPT C1209 68uF 10V
+B[5V]
NC_1
OPTION : RF AGC
6 C1212 47uF 16V C B FE_AGC_SPEED_CTL R1240 200 R1241 200 R1209 10K +5V_GENERAL Q1200 2SC3052 R1208 FE_TUNER_SCL E 47
RF_AGC
TP[VT]
NC_2
GND_2
10
SDA_T
11
SCL_T
12
AIF_1
13 E R1238 B 0
NC_3
14
GND
FE_VMAIN
15
VIDEO
R1205
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Q1205 C ISA1530AC1 R1239 1K OPT FE_DEMOD_SDA FE_DEMOD_SCL +5V_GENERAL R1227 470 R1228 82 E FE_SIF +3.3V_TUNER FE_TS_CLK FE_TS_DATA[7] R1224 100 /FE_RESET C1219 0.1uF 16V FE_TS_DATA[6] FE_TS_DATA[5] FE_TS_DATA[4] FE_TS_DATA[3] FE_TS_DATA[2] FE_TS_DATA[1] FE_TS_DATA[0] FE_TS_VAL FE_TS_SYN FE_TS_DATA[0-7],FE_TS_CLK,FE_TS_VAL,FE_TS_SYN L1202 +3.3V_TUNER MLB-201209-0120P-N2 C1221 0.1uF 16V FE_TS_VAL R1225 100K R1226 4.7K C Q1201 B ISA1530AC1
16
NC_4
TUNER
17
SIF
C1216
18
SDA
100pF
50V
R1221 33
19
SCL
20
RST
21
3.3V
22
1.2V
23
ERR
24
MCL
R1210 47
25
D7
R1211 47
26
D6
R1212 47
27
D5
R1213 47
28
D4
R1214 47
29
D3
R1215 47
30
D2
R1216 47
31
D1
R1217 47
32
D0
R1218 47
33
VAL
R1219 47
34
SYNC
R1220 47
DVB-CI DETECT
+3.3V_TUNER
35
SHIELD
IC1201 NL17SZ08DFT2G
+1.2V_TUNER
FE_TS_VAL FE_TS_ERR
EAX57644501 TUNER
2008.12.12 12 12
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.