20312 Gramercy Pl., Torrance CA 90501 Email: sales@laserod.

com

Tel: (310) 328-5869 Fax: (310) 328-5873 Toll Free: (888) 991-9916

Model M1-MEL
Laser Micro-machining

Primarily for Micro-Electronics Uses: Resizes Silicon Wafers, Solar Cells, and Ceramic Substrates. Drills Vias, Marks, Cuts, & Scribes Wafers, Hybrids &Thin Metals. A Micromachining Tool

Model M1-MEL Laser Tool for Micro-Machining

Model M1-MEL is a general purpose laser micromachining tool suited to a wide range of tasks. Cuts/drills any thin metal or composite, some plastics and rubber. Marks S/Ns on parts, even microscopically. Powerful laser easily works substrates of CVD diamond but not glass or FR4 PCBs. However, glass passivation coatings are easily removed. By trepanning, drills precision holes. Cutting edge (kerf) is 30um typicallywider by multiple passes. By adjusting power and number of passes, one can cut/scribe/groove to a given depth. A laser wavelength of 1064nm (IR) and a single turning mirror (M1) are chosen to maximize power. The laser is Q-switched Nd:YAG, lamp pumped. Features long life25 yrs. No power degradation with age. Low cost of maintenancemainly a $100 lamp to replace every 400 hours. Requires chilled water. Customers served include but are not limited to: aerospace/defense, medical device, electronics companies, R&D labs in universities, etc.

SPECIFICATIONS:
Usage: Throughput: Safety: Laser: Lamp Life: Lamp Cost: Kerf: Rep Rate: Wavelength: Pulsewidth: Avg Power: Peak Power: HeNe Laser: Optics: Viewing: Magnification: Targeting: Illumination: Telescope: Stage: Travel: Resolution: Programming: Monitor: Frame: Water: Power: Weight: Footprint: General laser micromachining: cuts, drills, scribes, marks. Depends on the job. U. S. Government Class I rated for eye safe operation without goggles Nd:YAG, lamp pumped, frequency multiplied optional 400-1000 hours. Recommend change every 400 hours. Approximately $100 USD, numerous suppliers 30 microns typical cutting edge 3-5 KHz operating range for max peak power, 50KHz rating 1064nm in the IR - expandable to UV & green 200ns typical 15w TEMoo (single mode). 5.7KW Helium neon laser for YAG alignment & spot marking Laserod Model M1 Optics Head. See www.laserod.com/M1_optics_head.shtm Magnified through the lens using video camera and flat panel 20 display 60X viewing, real time, on video monitor Electronic crosshairs visible on the monitor Uniform using ring illuminator Beam expander to reduce spot size and correct for chromatic aberration Closed loop X/Y servo motors, precision ground ball screws & duplex bearings Handles up to 8 x 8 parts one micron on encoders PC with CAD/CAM software to convert dxf to laser machining code A second matching 20 flat panel display serving as a computer screen Welded steel frame, unified, compact construction, minimal footprint, M1 Frame External chilled water 4-6 l/m, 20C, on demand. Customer supplied. 220VAC, 50/60Hz, 3-phase, 30a 600 lbs in shipping crate 3 x 7 complete, no separate electronics cabinet

20312 Gramercy PL. Torrance CA 90501 Tel:(310) 328-5869 Fax:(310) 328-5873 www.laserod.com

LASEROD MODEL M1-MEL APPLICATIONS

Fig. 1. Laser Machining Silicon Wafers

www.laserod.com/Si_details.shtm

Fig. 2. Machine Fired Ceramic, even 99% purity

Fig. 3. Machine Green Tape Ceramic

www.laserod.com/ceramic.shtm

Fig. 4. Microwave Antennas (Copper)

Fig. 5. Medical

Fig. 6. Mark Serial Numbers on Parts

Fig. 7. Fixturing is Possible

Fig. 8. Copper (25um dia., 125um thickness)

Fig. 9. SS Part (dia. 2 mm, thickness 125um)

http://www.laserod.com/thin.shtm

Fig. 10. Microwave Antennaes

http://www.laserod.com/thin.shtm

Fig. 11. Slot in Blind Hole in Rubber (Bleed Orfice) http://www.laserod.com/hole_drilling.shtm

Fig. 12. Small Part Laser Machining

3

Fig. 13. Slots in SS Tubing

Fig. 14. Small Parts Machined in Diamond

Fig. 15. CVD Diamond http://www.laserod.com/thin.shtm

Fig. 16. Slots in Alumina Ceramic http://www.laserod.com/thin.shtm

Fig. 17. Silicon Wafer Resizing (Coring) http://www.laserod.com/Si_details.shtm

Figure 18. Machining in a Circle, aka "Trepanning:" Resizing Silicon Wafer.