Documente Academic
Documente Profesional
Documente Cultură
To
EMBEDDED SYSTEMS
Yogesh Misra Mody Institute of Technology & Science (Deemed University) Faculty of Engineering & Technology Sikar [Raj.]
Essential Components Processor (P, C , DSP or ASIC) Sensor (it convert a physical quantity into electrical signal) Converters (ADC and DAC) Actuator (it transforms electrical energy into mechanical energy) Memory (On-chip / Off chip) Communication path with the interacting environment
As soon as the partially assembled car chassis is sensed, the workstation begins to perform its work on the car chassis.
Car Chassis Car Chassis Car Chassis
Car Chassis
Car Chassis
Fit Engine
Fit Door
Fit Wheel
Spray Paint
Finished Car
Conveyor Belt
A microcontroller (embedded system) receives the data from various sensors. These sensors constantly monitor the engine rpm, vehicle road speed, emission gas content, exhaust temperature, the engine coolant temperature, etc.
Depending upon the data received by various sensors the microcontroller control the PULSE WIDTH
which ultimately controls the duration for which the injector valve is open.
(iii) A hydraulic control unit. The microcontroller constantly monitors the signal from each wheel speed sensor. When it senses that any of the wheels are approaching lock up during braking, the microcontroller sends the signal to the hydraulic control unit, which modulates the braking pressure for a corresponding wheel(s) preventing it from locking up.
Due to heavy brake pedal application let the green wheel is about to lock up. The ABS control module (B)
detects this locking up of the wheel through the sensor (A) and reacts by releasing the brake pressure slightly by rapidly opening a pressure release valve (C). This lowers the pressure in the brake pipe (D) which causes the brake caliper to loosen its grip on the brake disc on the locking wheel. If this corrects the locked wheel, the hydraulic motor (C) will build up the pressure again to the optimum braking force and the valve will revert to the closed position.
Design Metrics
[To be optimized by design engineer] 1. NRE Cost 2. Unit Cost
3. Size 4. Power
5. Performance 6. Flexibility 7. Time-to-Prototype
2. IC Technology
It relates with the different technologies involve for the implementation of processors onto an IC
3. Design Technology
It relates with the way how we convert our idea of desired functionality into an implementation
1. Processor Technology
(A) General-Purpose Processors
Advantages: Low Time to market Low NRE Cost ,
High Flexibility
Unit cost low for small quantities
Disadvantages: Unit cost high for large quantities Size and power is more
1. Processor Technology
(B) Single Purpose Processors
Advantages: Fast performance Size and power is small
Disadvantages: High NRE High Time to market Low flexibility Unit cost high for small quantities Size and power is more
1. Processor Technology
It is a programmable processor optimized for a particular class of applications having common characteristics.
IC Technology
(ii)
Various Cells
VDD
VDD
NOT
In
out
GND
GND
VDD
VDD
VDD
VDD
In 1
In 1
NAND2
NOR2
out In 2
out
GND
VDD
NOT
NAND2
NOR2
F
GND
VDD
VDD
Cell F
F
GND
GND
* Now Cell F is as basic as cell NOT, cell NAND and cell NOR
F1
F2
F3
Final Design
Step-I
An array of uncommitted transistors are fabricated on the chip using standard mask.
Step-II
As per the requirement uncommitted transistors are interconnected by defining the metal interconnect using custom mask.
The design time is less because designer can purchase the uncommitted transistors chip from the market and he has to concentrate only on the interconnection part.
Various types of PLDs available are : (1) ROM (Read Only Memory) (2) PLA (Programmable Logic Array) (3) PAL (Programmable Array Logic) (4) CPLD (Complex PLD) (5) FPGA (Field Programmable Gate Array)
PLA
X1 X2
...................
Xn
Pk
F1 F2
Fm
AB AB
Sum
Carry
P1 P2 Pk
Fixed OR Plane
..
F1 F2
Fm
Output-1
Output-2
P1
E0
P2
P3 P4 P5 P6
E1
E2
P7
P8
P9
E3
B3
B2
B1
B0
P1
P2
P3 P4 P5 P6
P7
P8 P9
E3
E2
E1
E0
FPGA
PLD`S[Like ROM ,PAL,PLA,& CPLD] are used for two level logic implementation.[2-level logic is useful for relatively small logic function]. FPGA`s are used for multi-level logic implementation ie for complex logic. FPGA`s can be programmed while it is in the circuit.
Basic elements of FPGA : CLB(Combinational Logic Block) PIA(Programmable Interconnect Array) I/O (Input output) Pins (1). CLB : FPGA contains two dimensional array of CLB`s .The required logic is implemented in CLB`s.In CLB the basic element to store a logic is LUT. A flipflop is generally used as storing element in LUT for storing one bit. Generally 4-input LUT is used. (2). PIA : a pia is used to interconnect two CLB`s. The PIA`s are organized as horizontal and vertical channels. Interconnections are required not only between the CLB`s and wires but also between horizontal and vertical wires. (3). I/O Blocks : Input /Output pins are referred as I/O Blocks.Any pin can be made input or output pin through programming.
Semi custom
Standard Cell GateArray Medium
FPGA
Low
Medium Long
High
Low Fast
Medium
Design Technology
[It is the way by which we convert the idea of our desired functionality into an implementation]
Design Idea
Circuit Generated
Circuit Implemented
Simulation Tool
VHDL Model
Generated Waveforms
Synthesis Tool
Inputs to Synthesis Tool are: - HDL Description - Device Selection (Target Technology) - Information about design priority ( area vs speed )
EDIF File
Bit Map File [ for FPGA ] GDS II File [ for cell based design ]