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Personal Navigation Devices (PNDs) Portable Media Players (PMPs) Personal Digital Assistants (PDAs)
Low cost single package GPS RF antenna module u-blox 6 GPS Position Engine Low 3.9mm height for thin devices Low current consumption Easy to use drop-in solution
Anti-jamming technology
Product Description
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Antenovas GPS RADIONOVA M10382 is a single package solution that combines a full GPS engine and antenna on a small SMD module. The M10382 is a highly integrated GPS RF Antenna Module suitable for L1-band GPS and A-GPS systems. The device combines the high performance ublox 6 GPS position engine with Antenovas high efficiency antenna technology in a small SMD module. M10382 also benefits from novel external matching that ensures easy tuning for each platform.
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Package Style
24.2 x 9.9mm RF Antenna Module Top View Component side view (w/o shielding can) Bottom View
All front-end and receiver components are contained in a single package laminate base module, providing a complete GPS receiver for optimum performance. The M10382 operates on 1.8V or 3.3V positive bias supply with low power consumption and several low power modes for further power savings. An accurate 0.5ppm TCXO and very low noise LNA ensures high sensitivity and short TTFF. The M10382 is supported by u-blox stand alone software and is compatible with UART, SPI, DDC, I2C and USB host processor interfaces.
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Features
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Product Specification 11MD-0043-0.3-PS
Applications
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-25 10 500 +2.0 +125 Max +85 1.89 3.6 3.6 3.6 3.6 3.6 Typ 52 45
-40
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-2.0 Min -40 1.75 2.5 2.5 1.4 1.65 3.0 3.3 3.3 Typ +25 1.8 3.3 3.3 Min 42 22 25
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Ta
Ambient Temperature
Symbol
Parameter
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* Exposure to absolute ratings may adversely affect reliability and may cause permanent damage.
USB Supply Voltage Mode Battery backup voltage Supply voltage I/O ring Supply voltage USB
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VDD_USB
DC Electrical Characteristics
Parameter Total Supply Current - Acquisition Mode Tracking - Max Performance Mode Tracking - Eco Mode Tracking - Power Save Mode Batter backup current Max Unit mA mA mA mA A
Current consumption is very dynamic and can peak at 100mA. The value given is the average over 1 minute. At 1fix/s
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dBm C mA mW kV Unit C V V V V V V 2
Product Specification 11MD-0043-0.3-PS
RF Specifications
Conditions: VCC = 1.8V, TA = = 25 C Symbol GLNA NFLNA PdB ANTRL ANTBW ANTEFF ANTEFF_RHCP Parameter LNA Gain LNA Noise Figure In band 1dB Compression Point Antenna Return Loss Antenna Bandwidth at -10dB Antenna Total Efficiency Antenna RHCP Efficiency Typ 20 0.7 -15.5 >10 20 Unit dB dB dBm dB % % MHz
Band Rejection
Frequency 698-798 824-849 869-894 880-915 1710-1785 1850-1910 1920-1980 2400-2492 2500-2690 Standard LTE700 Cellular CDMA GSM850 GSM900 GSM1800/DCS GSM1900/PCS WCDMA
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Condition Min 0 0.7*VIO IOL=4mA IOH=4mA VIO -0.4V 13 115 87 Typ <
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>30% Typ* 50 55 55 60 33 30 30 30 30 Max 0.2*VIO VIO 0.4 -
>40%
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Digital I/O
Symbol Ileak VIL VIH VOL VOH RPU_IIC RPU RPD
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Paramater Leakage current input pins Low Level Input Voltage High Level Input Voltage Low Level Output Voltage High Level Output Voltage Pull-up resistor for PIO0...3 Pull-up resistor Pull-down resistor
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Unit dB dB dB dB dB dB dB dB dB Unit nA V V V V k k k 3
Product Specification 11MD-0043-0.3-PS
USB Interface
Symbol Ileak VIL VIH VOL Paramater Leakage current input pins Low Level Input Voltage High Level Input Voltage Low Level Output Voltage VDD_USB >= 3.0V VDD_USB >= 3.0V RL = 14.25 k to VDD_USB, VDD_ USB > = 3.0V, 22 external series resister RL = 14.25 k to VDD_USB, VDD_ USB > = 3.0V, 22 external series resister 2.8 0 2.0 Condition Min Typ < 0.8 VDD_USB 0.3 Max Unit nA V V V
RPUI RPUO
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900 1200 1925 1425 Typ 24.2(L) x 9.9(W) x 3.9(H) Suface mounted, 34 pin 1.1 UART (4.8 kb/s to 115 kb/s) USB 2.0 FS (12Mb/s) DDC (I2C compatible) 9.6kb/s
VOH
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1575 3090 Unit mm g Specification
Parameter Module exterior dimensions Module mass Module support and connection
System Specifications
Communication Data Output Protocol
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Mechanical Specifications
Host Interfaces
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Product Specification 11MD-0043-0.3-PS
Accuracy of Time Pulse signal RMS 99% Time Pulse GPS Engine Chip Firmware Version TCXO Channels Accuracy Horizontal Position Accuracy Maximum Position Update Rate Velocity Accuracy2 Heading Accuracy2 Sensitivity Autonomous Acquisition Tracking TTFF Hot Start Warm Start Cold Start3 General 2.5m CEP 5 Hz 0.5 0.1m/s FW v6.02 26MHz, 0.5ppm Up to 50 Channels 30 ns <60 ns Configurable f = 0.25 Hz ... 1 kHz (TP = 1/f = 4 s ... 1ms)
u-blox 6 UBX-G6010-ST
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Additional Features
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50% CEP, Open-Sky, 24hr Static, good view of the sky 50% at 30m/s With good view of the sky Assuming airborne <4g platform
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-146dBm -159Bm 32s at 50% probability 37s at 90% probability 50000m 514 m/s Removes in-band jammers up to 80 dB-Hz Tracks up to 8 CW jammers AssistNOW Online AssistNOW Offline OMA SUPL Compliant SBAS, WAAS, EGNOS, MSAS, GAGAN Support 5
Product Specification 11MD-0043-0.3-PS
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ETSI EN 300 019-2-7 specification T 7.3 ETSI EN 300 019-2-7 specification T 7.3 ETSI EN 300 019-2-7 specification T 7.3 E ETSI EN 300 019-2-1 Class 1.1 ETSI EN 300 019-2-1 Class 1.2
-40 C ... +85 C, 200 cycles -5 C to +55 C, 95% RH max, 96 hrs, non-operating, unpackaged -25 C to +70 C, 93% RH max, 96 hrs, non-operating, packed
Vibration
ISO16750-3
ISO16750-3 ISO16750-3
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JEDEC, JESD22-A115 ESD Sensitivity Testing Machine Model (MM), Class B IEC 60068-2-21, Test Ue3: Shear JEDEC, J-STD-020D EN/IEC 60068-2-58 Test Td
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JEDEC, JESD22-A114 ESD Sensitivity Testing Human Body Model (HBM). Class 2
Shear
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Random vibration, 10~1000Hz, 27.8m/s2, 8hrs/axis, X, Y, Z 8hrs for each 3 axis non-operating Half-sinusoidal 50g, 6ms, 10time/face, X, Y and Z non-operating 1mm height, 2 drops on opposite side +2000V - Human hand assembly +200V - Machine automatic final assembly Force of 5N applied to the side of the PCB MSL3/260 C More than 90% of the electrode should be covered by solder. Solder temperature 245 C 5 C
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Product Specification 11MD-0043-0.3-PS
Assembly Inspection
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VIO Input VDD_USB VDD_USB VIO Input Pull-up VIO Input Pull-up VIO Input Pull-up Input Pull-up Input Pull-up Input Pull-up VIO VDD_B VIO VDD_B Input Pull-up VIO
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SO
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PIO21 PIO6/SS_N/SCSO_N I/O SPI Chip/Slave Select PIO6 PIO5/TXD1 Output UART1 TxD PIO6 Reset Threshold Analog PIO4/RXD1 Input UART 1 RxD PIO4 Wake-up Supplies RTC and back-up RAM MISI/PIO19/CFG_COM1: I/O SPI MISI CFG_COM0 (see Table 4) PIO10
IN
10
SPI SELECT
TX
12
V_TH
13
RX
14 15
GND V_BCKP
16
SI
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Input
Input Pull-up
Input Pull-up
Input Pull-up
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Product Specification 11MD-0043-0.3-PS
17
GND
PIO2/SDA2 I/O DDC for perifpherals Serial Data PIO2 CFG_COM0 (see Table 4) PIO3/SCL2 VIO Input Pull-up Input Pull-up
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SDA
19
SCL
I/O DDC for peripherals Serial Clock PIO3 Input JTAG Test Data In Safe Boot Mode (see Table 1) Input JTAG Test Clock Input JTAG Test Data Out Time Pulse Voltage supply to RF unit Main DC supply PIO7/EXTINTO Time Mark 0 PIO7 DCDC_EN
VIO
20 21 22 23 24 25 26 27 28
SAFEBOOT_ N/TDI GND TCK TIMEPULSE/ TDO GND VDD_RF GND VCC GND EXT_ INTERRUPT
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VIO Input Pull-up Input Pull-up Output low VIO Vio VIO Input Pull-up Output Pull-up Input Pull-up VIO Vio VDD_USB
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IN
29
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30
V_EN
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Enables external DC-DC converter CFG_PIN/TMS CFG_PIN (see Table 2) JTAG Test mode select USB I/O interface power supply. Connect to ground if USB is not used.
31
CFG
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32 33 34
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Input Pull-up
Input Pull-up
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Product Specification 11MD-0043-0.3-PS
Configuration Pins
Some PIO pins are read at system start and can be used to submit some start-up configuration into the boot process. In the following tables, all default settings (pin left open) are bolded. SAFEBOOT Configuration
Pin 20
Designator SAFEBOOT_N
Value 1 0
GPS Mode
Safe Mode, minimal ROM boot, Ignore Backup RAM & FLASH Table 1: SAFEBOOT_N options
CFG_PIN
The state of CFG_PIN at system start is preserved in bit BOOTMODE1 of the special function register (SF).
Pin 31
Designator CFG_PIN
IN
The detection of serial FLASH and SPI and serial EEPROM on DDC interfaces is not affected by CFG_PIN. In default, only pin configurations will be read.
Value 1 0
The CFG_PIN decides whether external parallel FLASH memory is accessed at all. If the CFG_PIN is left open (i.e. = 1) at power up the receiver reads the configuration from the configuration pins.
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Ignore CFG pins, required setting for parallel FLASH Table 2: CFG_PIN options
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Pin 9
Designator CFG_GPS0
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GPS Mode Use CFG pins GPS Mode Eco Mode
Normal boot
Maximum Performance
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The state of SAFEBOOT_N at system start is preserved in bit BOOTMODE0 of the special function register (SF).
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If it is pulled to low level, the system will start up in safe mode using as few configuration settings as possible and establishing only the minimum functionality reuqired for establishing communication with the host. No GPS operation is started. This mode is primarily used for production testing.
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Product Specification 11MD-0043-0.3-PS
Communication Interfaces
Protocol
Messages
USB Power
0 0
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4800 57600
38400
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IN
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NMEA
9600
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Product Specification 11MD-0043-0.3-PS
Condition 1.75V - 1.89V, 1.8V typical UART, NMEA, 9600bps Maximum performance
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3 2 1
VI O
C3 22pF
TX
IN
FB1
RX
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C11 22pF
C10 22pF
4 5 6 7 8 9 10 11 12 13 14 15 16 17
GND GND
36 35
GND VI O USB_DP USB_DM SO CFG_GPS0/ SCK SPISELECT TX V_TH RX GND V_BCKP SI GND
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C1 22pF
L1 DNP
L2 DNP
GND GND VDD_USB CFG V_EN EXT_I NTR GND VCC GND VDD_RF GND TD0 TCK GND
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34 33 32 31 30 29 28 27 26 25 24 23 22 21 Vcc
C4 22pF
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V_BCKP
C6 22pF
Bill of Material
Ref. Designator FB1, FB2 C3, C4, C6, C10, C11 C1, L1, L2 Type Ferrite Capacitor TBD QTY. 2 5 3 Description/Comments Murata BLM15HD102, 0402 22pF, COG, 0402 Value and type depends on antenna matching (see External Matching)
18 19 20
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Vc i ma n vola s cs i t ge uppl 1. y: 75V t o 1. 89V,1. Typi a 8V cl
Product Specification 11MD-0043-0.3-PS
Condition 2.5V - 3.6V, 3.3V typical UART, NMEA, 9600bps Maximum performance
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3 2 1 4 5 6 7 8 9 10 11 12 13 14 15 16 17
VI O
C3 22pF
GND GND
36 35
TX
IN
FB1
RX
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C11 22pF
C10 22pF
GND VI O USB_DP USB_DM SO CFG_GPS0/ SCK SPISELECT TX V_TH RX GND V_BCKP SI GND
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C1 22pF
L1 DNP
L2 DNP
GND GND VDD_USB CFG V_EN EXT_I NTR GND VCC GND VDD_RF GND TD0 TCK GND
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34 33 32 31 30 29 28 27 26 25 24 23 22 21 Vcc
C4 22pF
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V_BCKP
C6 22pF
Bill of Material
Ref. Designator FB1, FB2 C3, C4, C6, C10, C11 C1, L1, L2 Type Ferrite Capacitor TBD QTY. 2 5 3 Description/Comments Murata BLM15HD102, 0402 22pF, COG, 0402 Value and type depends on antenna matching (see External Matching)
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Vc i ma n vola s cs i t ge uppl 2. t y: 5V o 3. 3. Typi a 6V, 3V cl
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Product Specification 11MD-0043-0.3-PS
Condition 5.0V from USB Bus USB, NMEA, 9600bps Maximum performance
L1 DNP
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C1 22pF
U1
C4
Vi n Vout GND
3V3
C3
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D+ OUT V_Bus D-OUT
J 1
5V0 1 2 3 U2 6 5 4
USBLC62
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VBUS D+ DGND
D+ I N GND D-I N
R10
22ohm
R11 22ohm
V_BCKP
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4 5 6 7 8 9 10 11 12 13 14 15 16 17
GND GND
36 35
M10382
3 2 1
GND VI O USB_DP USB_DM SO CFG_GPS0/ SCK SPISELECT TX V_TH RX GND V_BCKP SI GND
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L2 DNP
GND GND VDD_USB CFG V_EN EXT_I NTR GND VCC GND VDD_RF GND TD0 TCK GND
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Pl c L1,C12,L2 a c os a ae s l e s pos i e t M 10382 us ng s bl o i ve y s tlne . r hor i s L1, L2 a e us d f C1, r e or fne t ng t a e i t i -uni he nt nna n he fna pr i l oduc . t
34 33 32 31 30 29 28 27 26 25 24 23 22 21
C5 22pF
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Bill of Material
Ref. Designator U1 U2 C1, C2 C3, C4 R10, R11 J1 C1, L1, L2
Type LDO, Regulates VBUS (4.4 ... 5.25V) down to 3.3V ESD Protection Diode Capacitor Capacitor Resistor Connector TBD
QTY. 2 2 2
Description/Comments Must be able to deliver the maximum current of about 100 mA. A DC/DC converter may be used as an alternative Use low capacitance ESD protection such as STMictroelectronics USBLC6-2 22pF, COG, 0402 Value depends on U1 specification 22 USB connector Value and type depends on antenna matching (see External Matching)
18 19 20
C2 22pF
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Product Specification 11MD-0043-0.3-PS
External Matching
The M10382 module uses a matching circuit on the host PCB in order to fine-tune the on-board antenna to each specific application. This external matching allows compensating for the detuning of the antenna caused by various different components that can be close to the M10382 module in the actual application (plastic case, battery, speakers etc). The external matching must be placed on the host PCB between ANT_OUT (PIN3) and ANT_IN (PIN1). Although 2 components are typically more than enough to match the antenna to the 50 impedance required, a P-network topology with 3 components is recommended for safe proving. Schematic
Both low-pass and hi-pass topologies for the matching network can be used with similar results. As the same footprint can be used for both topologies, the exact type and value of the components used can be determined during the optimization phase. Hi-pass: C12 = 18pF L1, L2 = Not Fitted Low-pass: L1 = Jumper (0 resistor) C1, C2 = Not fitted
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External matching circuit schematic Low-pass configuration
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The initial values can be simply chosen as the null-circuit (no impedance matching):
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Product Specification 11MD-0043-0.3-PS
Type of Matching Components Capacitors: Use 0402, COG components High-Q, wire wound inductors in 0402 size are recommended for maximum performance, e.g. Murata LQW15 series cheaper alternative Layout Inductors:
The layout of the external matching circuit should be done using the following guidlines: Minimize the length of the tracks between the components Use a solid groundplane under the matching circuit area
Absolutely avoid routing any track under the matching circuit area
Connect the top ground layer with the ground layer underneath using several vias
Layout drawings (Gerber or other format) are available from Antenova. Please contact your local FAE.
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Matching Procedure The types and values of the matching components must be chosen so that the impedance seen by port ANT_ IN (PIN1) is as close as possible as 50. Althought it is a relatively simple operation, it requires some RF skills and a VNA (Vector Network Analyzer). Please contact an Antenova FAE to get support on defining the optimal matching for your specific device.
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Minimize the length of the tracks connecting the ANT_OUT and ANT_IN pads to the matching
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Product Specification 11MD-0043-0.3-PS
Good quality multi-layer type inductors (e.g. Muraga LQG15 series) can also be used as a
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Front View
Back View
Side View
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Product Specification 11MD-0043-0.3-PS
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Front-end Rejection
In the figure below is reported the rejection for the input SAW filter before the LNA, including the effect of pads, tracks, ESD protection and decoupling. The plot can be useful to calculate the isolation required from adjacent transmitters in order to avoid the saturation of the LNA.
5 0 5 10 15 20 25 30 35 40 45 50 55 60 0 1000 2000 2505. M H z 2 - 395 dB 30. 4537. M H z 6 - 200 dB 9. [ dB] 1 2
mt 5 ool
M A RK ERS:
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M Hz 1: 1573 2: 1577 1 2 1500 1600 1700 M Hz 1: 1573 2: 1577
3000
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5 0
[ dB]
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10 15 20 25 30 35 40 45 50 55
60 1200
1300
1400
M A RK ERS:
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4000 dB 5000 1800 dB - 38 1. - 27 1. 1900
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[ H z] M 6000
mt 5 ool
[ H z] M 2000
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Product Specification 11MD-0043-0.3-PS
Antenna Matching
Typical antenna matching as seen by ANT_IN Port is shown in the following plot. The matching bandwidth at -10dB is typically 20MHz. Measured on M10382-U1 test board.
5 [ dB]
mt 5 ool
15
2 1
25 1350
1425
1500
1575
M ARKERS:
IN
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25j
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1: 1573 2: 1577 50j 25 2 1 50 2 1 100 50j M Hz 1: 1573 2: 1577 1: 1573 2: 1577
1: 1573 2: 1577
10j
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10j
25j
M ARKERS:
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1650 dB 1725 [ H z] M 1800 M Hz - 85 17. - 08 17. - 39 9. - 36 8. 100j 200 100j 62. 6. 8- 7i 46. 13. 2- 0i 28. 15. 1- 9i 23. 9. 3- 2i
20
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Product Specification 11MD-0043-0.3-PS
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Reflow Soldering
Moisture Preconditioning Before submitting the M10382 module to the reflow soldering process, it is mandatory to bake the module at 120 C for at least 3 hours. If the module is not baked, it could develop defects during the reflow soldering process; in particular, bubbles or other defects could appear on the metallised pattern of the antenna. Soldering Paste
Use of No Clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. An example of suitable soldering paste is Alpha OM350. Soldering
The exact reflow soldering profile depends on the soldering paste used, the thickness and size of the host PCB and other factors. Therefore the recommended soldering profile shown below should be considered a starting point for choosing the optimal profile.
40C to 220 C 130C to 220 C 170C to 220 C Above 220C Peak temperature
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Multiple Soldering The M10382 module can be submitted up to 3 reflow soldering processes. Upside-down soldering is not generally recommended but possible in particular circumstance; the PCB assembly manufacture must qualify the process in that case. Hand Soldering Hand-soldering and rework of the M10382 module are not recommended.
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<4 min 45 - 90 sec. < 250 C
Setting Zone
Dwell Period
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The maximum soldering temperature is 245C. Exceeding the maximum soldering temperature could permanently damage the module.
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Product Specification 11MD-0043-0.3-PS
Module Footprint
Note: All module pads are1mm x 1mm. Pitch is 1.6mm unless otherwise stated. Overall module footprint size is 24.2mm x 9.9mm.
Mechanical Drawing
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Product Specification 11MD-0043-0.3-PS
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www.antenova.com
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Tel: +44 (0) 1223 810600 Fax: +44 (0) 1223 810650 Email: sales@antenova.com
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Antenova Ltd. Far Field House Albert Road Stow-cum-Quy Cambridge, CB25 9AR UK
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Corporate Headquarters
USA Headquarters
Antenova USA Rogers Business Park 2541 Technology Drive, Suite 403 Elgin, IL 60124 USA Tel: +1 (847) 551-9710 Fax: +1 (847) 551-9719 Email: sales@antenova.com
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Asia Headquarters
Antenova Asia Ltd. 4F, No. 324, Sec. 1, Nei-Hu Road Nei-Hu District Taipei 11493 Taiwan, ROC Tel: +886 (0) 2 8797 8630 Fax: +886 (0) 2 8797 6890 Email: sales@antenova.com
Copyright 2011 Antenova Ltd. All Rights Reserved. Antenova and RADIONOVA are trademarks of Antenova Ltd. Any other names and/or trademarks belong to their respective companies. The materials provided herein are believed to be reliable and correct at the time of print. Antenova does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these information. Antenova further assumes no responsibility for the use of this information, and all such information shall be entirely at the users risk.
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Product Specification 11MD-0043-0.3-PS Release Date 20 May 2011
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