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w
is the rotational velocity of the wafer. The film thickness is
given as:
( (( ( ) )) ) = == = sin * sin r cos * sin r h , r h
M
(16)
In Eq. (16), h
M
is the mean film thickness, and are the tilt
angles of the wafer. Both forms of Reynolds equation were
solved using the simulation parameters in Table 2.
Table 2: Simulation parameters for CMP
Diameter
(mm)
d
(mm)
p
(RPM)
w
(RPM)
h
M
(m) () ()
200 150 100 50 100 0.015 0.015
The solution of the cylindrical Reynolds equation for the CMP
example without entrainment velocity assumptions, Eq. (11),
yields much different pressures than the traditional cylindrical
Reynolds equation (12) (Fig. 2). Specifically, the peak pressure
found with Eq. (12) is 180 kPa, while the peak pressure for the
traditional Reynolds equation is 420kPa. In addition, a sub-
ambient pressure region was generated when using the
traditional form of Reynolds equation (12) that did not result
from the proposed version of Reynolds equation (11).
Figure 2: Solution to CMP example using the derived Reynolds
equation (11), left, and the traditional Reynolds equation (12),
right.
CONCLUSIONS
A form of the cylindrical Reynolds equation is presented here
without entrainment velocity assumptions. This form of
Reynolds equation is most useful for applications where
r
is a
function of r and/or
is a function of . In addition,
simulations for both pin-on-disk and CMP case studies showed
large pressure deviations between the proposed form of
cylindrical Reynolds equation and the traditional Reynolds
equation. Therefore, using the traditional form of Reynolds
equation when entrainment velocities vary with the angle or
radius may lead to incorrect and misleading results.
NOMENCLATURE
B: Curvature of the pin
U: Sliding velocity of disk relative to pin
d: Center-to-center distance of the pad to the wafer
h: Film thickness
h
0
: Minimum film thickness
h
M
: Mean film thickness
r: Cylindrical coordinate, r
z: Cylindrical coordinate, z
, : Angles of tilt for the wafer
: Cylindrical coordinate,
: Viscosity
: Fluid density
: Velocity
p
: Rotational speed of the pad
w
: Rotational speed of the wafer
a
: Refers to surface of (z=0)
b
: Refers to surface of (z=h)
con
: Refers to region of shoe-floor contact
fl
: Refers to region where lubricant is present
t
: Refers to total (combined fluid and contact regions)
REFERENCES
1. Bhushan, B., Principles and Applications of Tribology. 1999:
Wiley-Interscience.
2. Hamrock, B.J., B.O. Jacobson, and S.R. Schmid,
Fundamentals of Fluid Film Lubrication. 2004: CRC Press.
3. Meyer, D., Reynolds Equation for Spherical Bearings.
Journal of Tribology, 2002. 125: p. 203.
4. Park, S.-S., C.-H. Cho, and Y. Ahn, Hydrodynamic analysis
of chemical mechanical polishing process. Tribology
International, 2000. 33(10): p. 723-730.
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