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900 MHz Cellular Base Station CDMA 1.9 GHz Cellular Base Station W -CDMA 2.1 GHz Cellular Base Station W -CDMA 3.5 GHz Power GaAs Transistors General Purpose Linear Amplifiers ICs CATV GaAs
Product
MRF5S9070NR1, MRF5S9100MR1, MRF5S9100MBR1, MRF5S9100NR1, MRF5S9100NBR1, MRF5S9101MR1, MRF5S9101MBR1, MRF5S9101NR1, MRF5S9101NBR1, MRF9200LR3, MRF9200LSR3 MRF5S19060NR1, MRF5S19060NBR1, MRF5S19060MR1, MRF5S19060MBR1, MRF5S19090HR3, MRF5S19090HSR3, MRF5S19100HR3, MRF5S19100HSR3, MRF6S19100HR3, MRF6S19100HSR3, MRF5S19130HR3, MRF5S19130HSR3, MRF5S19150HR3, MRF5S19150HSR3 MRF5S21090HR3, MRF5S21090HSR3, MRF5P21180HR6, MRF6S21100HR3, MRF6S21100HSR3, MRF6S21140HR3, MRF6S21140HSR3, MRF6P21190HR6 MRFG35030R5 MMG3001NT1, MMG3002NT1, MMG3003NT1 MHW1346, MHW8247A, MHW8267A, MHW8342, MHW9186A, MHW9247A, MHW9267A
Product
SG10092 SG1009Q42004
SINGLE CHIP GPS SOLUTION FOR MSBASED, MSASSISTED AND AUTONOMOUS APPLICATIONS
The MG4100 device is the industrys first commercial single chip GPS solution. Integrating all the functional blocks of a GPS receiver into a tiny 7*7 mm FBGA, the device offers simplicity of use, fast time to market and high performance. Thanks to the integrated ARM7 processor, realtime host processing tasks are eliminated, reducing software engineering risks and enabling host platform flexibility. Once software is bootloaded into the IC, it is capable of supporting AssistedGPS and Autonomous operation, with signal detection to 152 dBm. The low IF front end and integrated LNA support the use of passive or active antennas, and system level clocks can be shared from the host using the onboard fractional synthesizer, further reducing costs. Serial communications are via a configurable SPI/UART port.
NEW FAMILY OF InGaP HBT AMPLIFIERS DESIGNED FOR USE IN GENERAL PURPOSE APPLICATIONS
Freescale Semiconductor introduces InGaP HBT general purpose amplifiers (GPAs) designed for a broad range of Class A, smallsignal, high linearity, general purpose applications. These devices (MMG3001NT1, MMG3002NT1, MMG3003NT1 and MMG3005) are the first of a full portfolio of GPAs suitable for applications with frequencies from 0.04 to 3.6 GHz and can be used in applications such as Cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS or general smallsignal RF. Freescales InGaP HBT GPA portfolio offers high volume production and dropin replacement capability, better thermal characteristics and better ruggedness compared to the competition. The MMG3001NT1, MMG3002NT1 and MMG3003NT1 are in full production. Samples of the MMG3005 are expected early in Q4, 2004.
Key Features
MMG3001NT1 Frequency: 403600 MHz P1dB: 18.5 dBm @ 900 MHz Power Gain: 20 dB @ 900 MHz Third Order Output Intercept Point: 32 dBm @ 900 MHz Single Voltage Supply Internally Matched to 50 Ohms Low Cost SOT89 Surface Mount Package MMG3002NT1 Frequency: 403600 MHz P1dB: 21 dBm @ 900 MHz Power Gain: 20 dB @ 900 MHz Third Order Output Intercept Point: 37.5 dBm @ 900 MHz Single Voltage Supply Internally Matched to 50 Ohms Low Cost SOT89 Surface Mount Package Frequency: 4002400 MHz P1dB: 30 dBm @ 2140 MHz Power Gain: 15 dB @ 2140 MHz Third Order Output Intercept Point: 45 dBm @ 2140 MHz Single Voltage Supply Internally Prematched to 50 Ohms Low Cost PQFN 5x5 Package
50OHM GSM/GPRS QUADBAND POWER AMPLIFIER MODULE USES HIIPA AND EMODE TECHNOLOGIES
By combining High Impedance Integrated Power Amplifier (HIIPA) packaging, and true enhancementmode (Emode) GaAs wafer process technologies, Freescale Semiconductor is defining a new paradigm for 50ohm power amplifier (PA) modules. The MMM5063 is currently the worlds smallest size quadband GSM/GPRS single power supply PA module and leads the way to smaller and more economical wireless products. This PA module uses the HIIPA packaging technique to provide a 50ohm solution without the need for additional external components. Design of the 50ohm impedance matching network at the output of the die is accomplished with capacitors and inductors, where capacitors are integrated onto the die, and inductors are implemented by wire bonds of variable lengths. The tolerance of the capacitor values, together with the precision of the wire bonding process, allow a matching impedance value with less design variance than can be achieved by using passive components on a traditional radio board. Because of its low offstate leakage current, this true enhancementmode device eliminates the drainsupply switch required for depletionmode pHEMT and MESFET devices. The Emode GaAs technology helps to reduce the cost and size of the end product by eliminating both the negative voltage generator and the drainsupply switch within the handset power amplifier section, as well as eliminating additional passive components.
MMG3003NT1
MMG3005
Frequency: 403600 MHz P1dB: 24.1 dBm @ 900 MHz Power Gain: 20 dB @ 900 MHz Third Order Output Intercept Point: 40.5 dBm @ 900 MHz Single Voltage Supply Internally Matched to 50 Ohms Low Cost SOT89 Surface Mount Package
SG10093 SG1009Q42004
RFICs
Power Amplifiers
Product Freq. Range MHz 880915 17101785 18501910 824849 880915 17101875 18501910 Supply Voltage Range Vdc 2.7 to 5.5 Saturated Pout dBm (Typ) 35.2 33.8 34 35.2 35 33 33
Mode second.
PAE % (Typ)
Packaging
System Applicability
MMM5063
53 44 43 51 53 45 43
MMM6035(46b)
3.0 to 4.5
GSM Cellular
(42)In LNA section, specifications are represented in High Gain Mode first and Bypass (43)In Mixer section, LO frequency ranges are specified for 190 MHz and 380 MHz IF. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05
SG10094 SG1009Q42004
MBC13720(18c) MBC13916(18c)
ISM900, 2400, PCS, CDMA General Purpose Cascode Amp for VCOs, Buffers, & LNAs ISM900, ISM2400, GPS, Cellular, PCS, WCDMA
MC13820(18b,46b)
800 to 2500
2.7 to 3.0
2.8
10
18 @ 1575 MHz
1345/ QFN12
(18)Tape
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05
RF BUILDING BLOCKS
SG10095 SG1009Q42004
RF/IF SUBSYSTEMS
MC13192(46b) MC13191(46b)
2.03.4
2.42.5
SPI
250
802.15.4
2.03.4
500
2.42.5
89
SPI
250
DSSS
Encoders/Decoders
Product Function Number of Address Lines Maximum Number of Address Codes Depends on Decoder 243 19,683 Number of Data Bits Operation Packaging
Depends on Decoder 5 9
Depends on Decoder 4 0
SG10096 SG1009Q42004
Parallel Interface Parallel Interface, Uses External DualModulus Prescaler Serial Interface, Auxiliary Reference Divider, Evaluation Kit MC145170EVK
932 48 LQFP
Receivers
Product Frequency (Typ) MHz Supply Voltage Digital Core V RF I/O V Digital Core (Typ) mA @ Oper Mode @ RF Input (dBm) MG4100(46b) 1575.42 1.82.2 2.73.3 14 @ Integer Tracking @ 130 14 @ Integer Tracking @ 130 Supply Current RF I/O (Typ) mA @ Oper Mode @ RF Input (dBm) 40 @ Integer Tracking @ 130 42 @ Integer Tracking @ 130 15 @ Sleep 152 MSBased GPS MSAssisted GPS Autonomous GPS MSBased GPS MSAssisted GPS Autonomous GPS 64FBGA Total Supply Current (Typ) mA A @ Oper Mode RF Sensitivity (Typ) dBm System Applicability Packaging
FSOncore(46b)
1575.42
1.82.2
2.73.3
20 @ Sleep
152
24LGA
(18)Tape
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05
SG10097 SG1009Q42004
RECEIVERS (ROMEO2)
Product MC33591 MC33592 MC33593 MC33594 Description PLL Tuned UHF Receiver, OOK/FSK Modulation, IF BW = 500 kHz, - 40_C to +85_C PLL Tuned UHF Receiver, OOK Modulation, IF BW = 300 kHz, - 40_C to +85_C PLL Tuned UHF Receiver, OOK/FSK Modulation, IF BW = 500 kHz, - 40_C to +85_C PLL Tuned UHF Receiver, OOK/FSK Modulation (Data Manager in FSK only), IF BW = 500 kHz, - 40_C to +105_C Extended Temperature Packaging LQFP24 LQFP24 LQFP24 LQFP24 Band (MHz) 315/434 315/434 868 315/434 Data Rate (kbps) 1 to 11 1 to 11 1 to 11 1 to 11 MCU Interface SPI SPI SPI SPI Operating Voltage (V) 5 5 5 5 Status Available Available Samples Now Available
68HC08 Family
Product ROM (Kbytes) RAM (Kbytes) Flash or OTP (Kbytes) 2K Flash EEPROM (Kbytes) Timer I/O Serial MUX A/D PWM Packaging Oper Voltage (V) 1.8 to 3.6 Oper Freq (MHz) 4.0 Max Temp Flash or OTP Flash Status Comments Documentation
MC68HC908RF2
n/a
128
n/a
1CH, 16Bit
12
n/a
n/a
n/a
See Timer
C, M
Available
RF transmitter integrated
MC68HC908RF2/D
SG10098 SG1009Q42004
VHF & UHF, Land Mobile Radio, Class AB MRF1513T1(18f) MRF1511T1(18f) MRF1517T1(18f) MRF1518T1(18f) MRF1535T1(18j) MRF1535FT1(18j) MRF1550T1(18j) MRF1550FT1(18j) MRF1570T1(18j) MRF1570FT1(18j) MRF1570NT1(18j) MRF1570FNT1(18j)
(18)Tape
U U U U U U U U U U U U
400520 135175 430520 400520 400520 400520 135175 135175 400470 400470 400470 400470
3 CW 8 CW 8 CW 8 CW 35 CW 35 CW 50 CW 50 CW 70 CW 70 CW 70 CW 70 CW
1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone
7.5/12.5 7.5 7.5 12.5 12.5 12.5 12.5 12.5 12.5 12.5 12.5 12.5
11/520 11.5/175 11/520 11/520 10(Min)/520 10(Min)/520 10(Min)/175 10(Min)/175 10(Min)/470 10(Min)/470 10(Min)/470 10(Min)/470
4.0 2.0 2.0 2.0 0.90 0.90 0.75 0.75 0.75 0.75 0.75 0.75
466/1 466/1 466/1 466/1 1264/1 1264A/1 1264/1 1264A/1 1366/1 1366A/1 1366/1 1366A/1
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output.
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG10099 SG1009Q42004
RF TRANSISTORS
RF TRANSISTORS
470 - 1000 MHz, Class AB MRF373ALR1(18a) MRF373ALSR1(18a) MRF374A MRF372 MRF372R5(18p) MRF377 MRF377R3(18i) MRF377R5(18p) U U U I I I/O I/O I/O 470860 470860 470860 470860 470860 470860 470860 470860 75 CW 75 CW 130 PEP 180 PEP 180 PEP 45 AVG 45 AVG 45 AVG 1Tone 1Tone 2Tone 2Tone 2Tone OFDM OFDM OFDM 32 32 32 32 32 32 32 32 18.2/860 18.2/860 17.3/860 17/860 17/860 18.2/860 18.2/860 18.2/860 60 60 41.2 36 36 23 23 23 0.89 0.63 0.58 0.5 0.5 0.36 0.36 0.36 360B/1 360C/1 375F/1 375G/1 375G/1 375G/1 375G/1 375G/1
Cellular
To 1000 MHz
Product Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style
800 - 1000 MHz, Class AB MRF9002R2(18e) MRF9030MBR1(18a) MRF9030MR1(18a) MRF9030LR1(18a) MRF9030LSR1(18a) MRF9045MBR1(18a) MRF9045MR1(18a) MRF9045LR1(18a) MRF9045LSR1(18a)
(18)Tape
U U U U U U U U U
(3x) 2 PEP(41) 30 PEP 30 PEP 30 PEP 30 PEP 45 PEP 45 PEP 45 PEP 45 PEP
26 26 26 26 26 28 28 28 28
50 41 41 41.5 41.5 41 41 42 42
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (41)Three individual transistors in a single package.
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100910 SG1009Q42004
800 - 1000 MHz, Class AB (continued) MRF5S9070NR1(18a) MRF5S9070MR1(18a) MRF9060MBR1(18a) MRF9060MR1(18a) MRF9060LR1(18a) MRF9060LSR1(18a) MRF652270R3(18i) MRF9080LR3(18i) MRF9080LSR3(18i) MRF9085LR3(18i) MRF9085LSR3(18i) MRF5S9100NR1(18a) MRF5S9100NBR1(18a) MRF5S9100MR1(18a) MRF5S9100MBR1(18a) MRF9100R3(18i) MRF9100SR3(18i) MRF5S9101NR1(18a) MRF5S9101NBR1(18a) MRF5S9101MR1(18a)
(18)Tape
U U U U U U I I I I I I I I I I/O I/O I I I
880 880 945 945 945 945 921960 921960 921960 880 880 880 880 880 880 921960 921960 869960 869960 869960
14 AVG 14 AVG 60 PEP 60 PEP 60 PEP 60 PEP 70 CW 70 CW 70 CW 90 PEP 90 PEP 20 AVG 20 AVG 20 AVG 20 AVG 100 CW 100 CW 100 CW 100 CW 100 CW
NCDMA NCDMA 2Tone 2Tone 2Tone 2Tone 1Tone 1Tone 1Tone 2Tone 2Tone NCDMA NCDMA NCDMA NCDMA 1Tone 1Tone 1Tone 1Tone 1Tone
26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26
17.8/880 17.8/880 18/945 18/945 17/945 17/945 16/921,960 18.5/921,960 18.5/921,960 17.9/880 17.9/880 19.5/880 19.5/880 19.5/880 19.5/880 17.2/960 17.2/960 17.5/960 17.5/960 17.5/960
30 30 40 40 40 40 58 52 52 40 40 28 28 28 28 60 60 60 60 60
0.80 0.80 0.56 0.56 1.1 0.8 1.1 0.7 0.7 0.7 0.7 0.52 0.52 0.52 0.52 1.0 1.0 0.41 0.41 0.41
1265/1 1265/1 1337/1 1265/1 360B/1 360C/1 465D/1 465/1 465A/1 465/1 465A/1 1486/1 1484/1 1486/1 1484/1 465/1 465A/1 1486/1 1484/1 1486/1
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100911 SG1009Q42004
RF TRANSISTORS
RF TRANSISTORS
800 - 1000 MHz, Class AB (continued) MRF5S9101MBR1(18a) MRF9120R3(18i) MRF9120LR3(18i) MRF6S9130H(46b) MRF6S9130HS(46b) MRF9130LR3(18i) MRF9130LSR3(18i) MRF9135LR3(18i) MRF9135LSR3(18i) MRF9180R6(18o) MRF9200LR3(18i) MRF9200LSR3(18i) MRF9210R3(18i) I I I I I I I I I I I/O I/O I/O 869960 880 880 880 880 921960 921960 880 880 880 880 880 880 100 CW 120 PEP 120 PEP 27 AVG 27 AVG 130 CW 130 CW 25 AVG 25 AVG 170 PEP 40 AVG 40 AVG 40 AVG 1Tone 2Tone 2Tone NCDMA NCDMA 1Tone 1Tone NCDMA NCDMA 2Tone NCDMA NCDMA NCDMA 26 26 26 28 28 28 28 26 26 26 26 26 26 17.5/960 16.5/880 16.5/880 18.5/880 18.5/880 16.5/921,960 16.5/921,960 17.8/880 17.8/880 17.5/880 17.5/880 17.5/880 16.5/880 60 39 39 30 30 48 48 25 25 39 25 25 25.5 0.6 0.6 0.6 0.6 0.45 0.28 0.28 0.31 0.41 0.45 0.45 1484/1 375B/1 375B/1 465/1 465A/1 465/1 465A/1 465/1 465A/1 375D/1 465B/1 465C/1 375G/1
PCS and 3G
To 2200 MHz
Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style
Product
1800 - 2000 MHz, Class AB (GSM1800, GSM1900, GSM EDGE and PCS TDMA) MRF18030ALR3(18i) MRF18030ALSR3(18i) MRF18030BLR3(18i) MRF18030BLSR3(18i) MRF6S18060NR1(18a,46b)
(18)Tape
30 CW 30 CW 30 CW 30 CW 60 CW
26 26 26 26 26
50 50 50 50 56
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05 New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100912 SG1009Q42004
RF HIGH POWER LDMOS TRANSISTORS (continued) PCS and 3G To 2200 MHz (continued)
Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style Product
1800 - 2000 MHz, Class AB (GSM1800, GSM1900, GSM EDGE and PCS TDMA) (continued) MRF6S18060NBR1(18a,46b) MRF6S18060MR1(18a,46b) MRF6S18060MBR1(18a,46b) MRF18060AR3(18i) MRF18060ASR3(18i) MRF18060ALSR3(18i) MRF18060BR3(18i) MRF18060BSR3(18i) MRF18060BLSR3(18i) MRF18085AR3(18i) MRF18085ALSR3(18i) MRF18085BR3(18i) MRF18085BLSR3(18i) MRF6S18090NR1(18a,46c) MRF6S18090NBR1(18a,46c) MRF6S18090MR1(18a,46c) MRF6S18090MBR1(18a,46c) MRF18090AR3(18i) MRF18090BR3(18i) MRF18090BSR3(18i)
(18)Tape
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
18002000 18002000 18002000 18051880 18051880 18051880 19301990 19301990 19301990 18051880 18051880 19301990 19301990 18002000 18002000 18002000 18002000 18051880 19301990 19301990
60 CW 60 CW 60 CW 60 CW 60 CW 60 CW 60 CW 60 CW 60 CW 85 CW 85 CW 85 CW 85 CW 90 CW 90 CW 90 CW 90 CW 90 CW 90 CW 90 CW
1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone 1Tone
26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26
15/1990 15/1990 15/1990 13/1805,1880 13/1805,1880 13/1805,1880 13/1930,1990 13/1930,1990 13/1930,1990 15/1805,1880 15/1805,1880 12.5/1930,1990 12.5/1930,1990 15/1990 15/1990 15/1990 15/1990 13.5/1805,1880 13.5/1930,1990 13.5/1930,1990
56 56 56 45 45 45 45 45 45 52 52 50 50 52 52 52 52 52 45 45 0.70 0.70 0.70 0.97 0.97 0.97 0.97 0.97 0.97 0.79 0.79 0.79 0.79
1484/1 1486/1 1484/1 465/1 465A/1 465A/1 465/1 465A/1 465A/1 465/1 465A/1 465/1 465A/1 1486/1 1484/1 1486/1 1484/1 465B/1 465B/1 465C/1
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100913 SG1009Q42004
RF TRANSISTORS
RF TRANSISTORS
RF HIGH POWER LDMOS TRANSISTORS (continued) PCS and 3G To 2200 MHz (continued)
Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style Product
2000 MHz, Class AB (2- CH N- CDMA and W - CDMA) MRF19030LR3(18i) MRF19030LSR3(18i) MRF19045LR3(18i) MRF19045LSR3(18i) MRF6S19060NR1(18a,46c) MRF6S19060NBR1(18a,46c) MRF6S19060MR1(18a,46c) MRF6S19060MBR1(18a,46c) MRF5S19060NR1(18a) MRF5S19060NBR1(18a) MRF5S19060MR1(18a) MRF5S19060MBR1(18a) MRF19060R3(18i) MRF19060SR3(18i) MRF19085R3(18i) MRF19085LR3(18i) MRF19085SR3(18i) MRF19085LSR3(18i) MRF5S19090HR3(18i) MRF5S19090HSR3(18i)
(18)Tape
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990
30 PEP 30 PEP 9.5 AVG 9.5 AVG 12 AVG 12 AVG 12 AVG 12 AVG 12 AVG 12 AVG 12 AVG 12 AVG 60 PEP 60 PEP 18 AVG 18 AVG 18 AVG 18 AVG 18 AVG 18 AVG
2Tone 2Tone NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA 2Tone 2Tone NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA
26 26 26 26 28 28 28 28 28 28 28 28 26 26 26 26 26 26 28 28
13/1990 13/1990 14.5/1990 14.5/1990 15/1990 15/1990 15/1990 15/1990 14/1990 14/1990 14/1990 14/1990 12.5/1990 12.5/1990 13/1990 13/1990 13/1990 13/1990 14.5/1990 14.5/1990
0.80 0.80 0.80 0.80 0.97 0.97 0.79 0.79 0.79 0.79 0.66 0.66
1486/1 1484/1 1486/1 1484/1 465/1 465A/1 465/1 465/1 465A/1 465A/1 465/1 465A/1
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05 New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100914 SG1009Q42004
RF HIGH POWER LDMOS TRANSISTORS (continued) PCS and 3G To 2200 MHz (continued)
Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style Product
2000 MHz, Class AB (2- CH N- CDMA and W - CDMA) (continued) MRF19090R3(18i) MRF19090SR3(18i) MRF6S19100NR1(18a,46c) MRF6S19100NBR1(18a,46c) MRF6S19100MR1(18a,46c) MRF6S19100MBR1(18a,46c) MRF5S19100HR3(18i) MRF5S19100HSR3(18i) MRF6S19100HR3(18i) MRF6S19100HSR3(18i) MRF19125R3(18i) MRF19125LR3(18i) MRF5S19130HR3(18i) MRF5S19130HSR3(18i) MRF6S19140H(46b) MRF6S19140HS(46b) MRF5S19150HR3(18i) MRF5S19150HSR3(18i) MRF5P20180R6
(18)Tape
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990 19301990
90 PEP 90 PEP 22 AVG 22 AVG 22 AVG 22 AVG 22 AVG 22 AVG 22 AVG 22 AVG 24 AVG 24 AVG 26 AVG 26 AVG 29 AVG 29 AVG 32 AVG 32 AVG 38 AVG
2Tone 2Tone NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA NCDMA WCDMA
26 26 28 28 28 28 28 28 28 28 26 26 28 28 28 28 28 28 28
11.5/1990 11.5/1990 14.5/1990 14.5/1990 14.5/1990 14.5/1990 13.9/1990 13.9/1990 16.1/1990 16.1/1990 13.5/1990 13.5/1990 13/1990 13/1990 16/1990 16/1990 14/1990 14/1990 14/1990
0.65 0.65
465/1 465A/1 465/1 465A/1 465B/1 465B/1 465B/1 465C/1 465B/1 465C/1
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05 New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100915 SG1009Q42004
RF TRANSISTORS
RF TRANSISTORS
RF HIGH POWER LDMOS TRANSISTORS (continued) PCS and 3G To 2200 MHz (continued)
Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style Product
2000 MHz, Class A, AB MRF281SR1(18a) MRF281ZR1(18a) MRF282SR1(18a) MRF282ZR1(18a) MRF284LR1(18a) MRF284LSR1(18a) U U U U U U 19302000 19302000 19302000 19302000 19302000 19302000 4 PEP 4 PEP 10 PEP 10 PEP 30 PEP 30 PEP 2Tone 2Tone 2Tone 2Tone 2Tone 2Tone 26 26 26 26 26 26 12.5/2000 12.5/2000 11.5/2000 11.5/2000 10.5/2000 10.5/2000 33 33 28(min) 28(min) 35 35 5.74 5.74 4.2 4.2 2.0 2.0 458B/1 458C/1 458B/1 458C/1 360B/1 360C/1
2200 MHz, Class AB (2- CH W - CDMA, UMTS) MRF21010LR1(18a) MRF21010LSR1(18a) MRF21030LR3(18i) MRF21030LSR3(18i) MRF21045LR3(18i) MRF21045LSR3(18i) MRF6S21060NR1(18a,46c) MRF6S21060NBR1(18a,46c) MRF6S21060MR1(18a,46c) MRF6S21060MBR1(18a,46c) MRF21060R3(18i) MRF21060SR3(18i) MRF21085R3(18i) MRF21085LSR3(18i) MRF21085SR3(18i)
(18)Tape
U U I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170
10 PEP 10 PEP 30 PEP 30 PEP 10 AVG 10 AVG 14 AVG 14 AVG 14 AVG 14 AVG 60 PEP 60 PEP 19 AVG 19 AVG 19 AVG
2Tone 2Tone 2Tone 2Tone WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA 2Tone 2Tone WCDMA WCDMA WCDMA
28 28 28 28 28 28 28 28 28 28 28 28 28 28 28
13.5/2170 13.5/2170 13/2170 13/2170 15/2170 15/2170 15/2170 15/2170 15/2170 15/2170 12.5/2170 12.5/2170 13.6/2170 13.6/2170 13.6/2170
35 35 33 33 23.5 23.5 26 26 26 26 34 34 23 23 23
360B/1 360C/1 465E/1 465F/1 465E/1 465F/1 1486/1 1484/1 1486/1 1484/1
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05 New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100916 SG1009Q42004
RF HIGH POWER LDMOS TRANSISTORS (continued) PCS and 3G To 2200 MHz (continued)
Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style Product
2200 MHz, Class AB (2- CH W - CDMA, UMTS) (continued) MRF21090R3(18i) MRF21090SR3(18i) MRF5S21090HR3(18i) MRF5S21090HSR3(18i) MRF6S21100NR1(18a,46b) MRF6S21100NBR1(18a,46b) MRF6S21100MR1(18a,46b) MRF6S21100MBR1(18a,46b) MRF5S21100HR3(18i) MRF5S21100HSR3(18i) MRF6S21100HR3(18i) MRF6S21100HSR3(18i) MRF21120R6(3,18o) MRF21125R3(18i) MRF21125SR3(18i) MRF5S21130HR3(18i) MRF5S21130HSR3(18i) MRF6S21140HR3(18i) MRF6S21140HSR3(18i)
(3)Internal Impedance Matched Push-Pull (18)Tape and Reel Packaging Options: a) R1
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170 21102170
90 PEP 90 PEP 19 AVG 19 AVG 23 AVG 23 AVG 23 AVG 23 AVG 23 AVG 23 AVG 23 AVG 23 AVG 120 PEP 20 AVG 20 AVG 28 AVG 28 AVG 30 AVG 30 AVG
2Tone 2Tone WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA 2Tone WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA
28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28
11.7/2170 11.7/2170 14.5/2170 14.5/2170 14.5/2170 14.5/2170 14.5/2170 14.5/2170 13.5/2170 13.5/2170 15.9/2170 15.9/2170 11.4/2170 13/2170 13/2170 13.5/2170 13.5/2170 15.5/2170 15.5/2170
0.57 0.57 0.45 0.45 0.45 0.53 0.53 0.44 0.44 0.35 0.35
465/1 465A/1 465/1 465A/1 375D/1 465B/1 465C/1 465B/1 465C/1 465B/1 465C/1
Transistors = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05 New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100917 SG1009Q42004
RF TRANSISTORS
RF TRANSISTORS
RF HIGH POWER LDMOS TRANSISTORS (continued) PCS and 3G To 2200 MHz (continued)
Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style Product
2200 MHz, Class AB (2- CH W - CDMA, UMTS) (continued) MRF5S21150R3(18i) MRF5S21150SR3(18i) MRF5P21180HR6(18o) MRF21180R6(3,18o) MRF6P21190HR6(18a) MRF5P21240R6(18o) I/O I/O I/O I/O I/O I/O 21102170 21102170 21102170 21102170 21102170 21102170 33 AVG 33 AVG 38 AVG 38 AVG 44 AVG 52 AVG WCDMA WCDMA WCDMA WCDMA WCDMA WCDMA 28 28 28 28 28 28 12.5/2170 12.5/2170 14/2170 12.1/2170 15.5/2170 13/2170 25 25 25.5 22 26.5 24 0.47 0.47 0.31 0.46 0.25 0.35 465B/1 465C/1 375D/1 375D/1 375D/1 375D/1
MMDS
To 2700 MHz
Product Frequency Band(37) MHz Pout (Typ) Watts Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ) % JC C/W Packaging/Style
28 28 28
24.5 24.5 22
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05 New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100918 SG1009Q42004
Linear Transistors
Product
To 6000 MHz
Frequency Band(37) MHz Pout (Typ)/Freq. Watts/MHz Test Signal VDD Volts Gain (Typ)/Freq. dB/MHz Eff. (Typ)/Freq. %/MHz JC C/W Packaging/Style
3500- 6000 MHz, Class AB (WLL, BWA, W- CDMA) MRFG35003MT1(18f) MRFG35003M6T1(18f) MRFG35005MT1(18f) MRFG35010 MRFG35010MT1(18f) MRFG35030R5(18p) U U U U U DC5800 DC5800 DC5800 DC5800 DC5800 34003600 0.3 AVG/ 3550 0.45 AVG/ 3550 0.45 AVG/ 3550 1 AVG/ 3550 0.9 AVG/ 3550 3 AVG/ 3550 WCDMA(44) WCDMA(44) WCDMA(44) WCDMA(44) WCDMA(44) WCDMA(44) 12 6 12 12 12 12 11.5/3550 9/3550 11/3550 10/3550 10/3550 12/3550 25/3550 24/3550 25/3550 30/3550 28/3550 21/3550 1.9 4.8(15) 466/1 466/1 466/1 360D/1 466/1 1490/1
I/O
Gain @ f GHz
Packaging/Style
IC mA
MBC13900(18c)
15
20
1.0 1.3
1.0 2.0
17 14
1.0 2.0
20
Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (37)U = Unmatched; I = Input; I/O = Input/Output. (44)Peak-to-Average Power Ratio = 8.5 dB New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100919 SG1009Q42004
RF TRANSISTORS
Base Stations
Designed for applications such as macrocell drivers and microcell output stage, these Class AB amplifiers are ideal for base station systems with power requirements up to 30 watts.
MHVIC915R2 (18e) MWIC930R1 (18a) MWIC930GR1 (18a) MW4IC915MBR1 (18a) MW4IC915GMBR1 (18a) MW4IC001MR4 (18n)
AB AB AB AB AB AB
10 20 20 30 30
39 29 29 23 23
26 26 26 27 27
AB AB AB AB AB
(18)Tape
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100920 SG1009Q42004
AB AB AB AB
AB AB AB
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100921 SG1009Q42004
RF AMPLIFIER ICs AND MODULES (continued) Base Station Module PreDrivers (continued)
Ultra - Linear (for CDMA, W- CDMA, TDMA, Analog) Class A (LDMOS Die) Lateral MOSFETs (continued) Product Frequency Band MHz 18051880 19002000 19301990 19002000 21102170 VDD (Typ) Volts 26 28 26 26 26 IDD (Typ) mA 1100 500 1000 1400 500 Gain (Typ) dB 28.6 30 29.4 29 31 Gain Flatness (Typ) dB .3 .1 .3 .2 .15 P1dB (Typ) dBm 40 36 40 41 35 3rd Order Intercept (Typ) dBm 50 46 50 49.5 45 NF (Typ) dB 4.2 4.2 4.2 4.2 4.5 Packaging/Style
1483/ 1483/
Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100922 SG1009Q42004
Class A
InGaP HBT
VCC (Typ) Volts ICC (Typ) mA Gain (Typ) @ 900 MHz dB 20 20 20 15* *@ 2140 MHz P1dB (Typ) @ 900 MHz dBm 18.5 21 24.1 30* *@ 2140 MHz 3rd Order Intercept (Typ) dBm NF (Typ) @ 900 MHz dB 4.1 4.2 4 Packaging/Style
Class A
VCC (Typ) Volts
Silicon Bipolar
ICC (Typ) mA Gain (Typ) @ 100 MHz dB 34.5 Gain Flatness (Typ) dB P1dB (Typ) @ 200 MHz dBm 28 3rd Order Intercept (Typ) dBm NF (Typ) @ 200 MHz dB 3.8 Packaging/Style
MHW1345
Note: Possible replacement for CA2830C.
(9)In development. (18)Tape and Reel Packaging
10200
24
310
1.0
44
1302/1
Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100923 SG1009Q42004
Silicon Bipolar
Maximum Distortion Specifications Output Level dBmV/CH 2nd Order Test dBc Composite Triple Beat dBc 152 CH Cross Modulation dBc DC Current mA Typ Noise Figure @ 1000 MHz dB Packaging/ Style
152 CH
Max
Preamplifiers MHW9182B MHW9242A 18.5 23.2 152 152 +38 +38 63(40) 61(40) 61 58 61 59 210 318 7.5 8.0 714Y/1 1302/1
GaAs
Maximum Distortion Specifications 2nd Order Test dBc Composite Triple Beat dBc 132 CH Cross Modulation dBc DC Current mA Typ Noise Figure @ 870 MHz dB Packaging/ Style
132 CH
Max
Preamplifiers MHW9146 MHW9186 MHW9186A MHW9206 MHW9236 MHW9276 Power Doublers MHW9187 MHW8188A
(34)Composite 2nd (36)Composite 2nd (40)Composite 2nd
60 58 58 57 60 60
55 52 52 51 50 53
20 20.3
132 112
+48 +48
62(34) 64(34)
56 58* *112 CH
55 56* *112 CH
425 425
1302/1 1302/1
New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100924 SG1009Q42004
FORWARD AMPLIFIER MODULES (continued) 40870 MHz High Output Hybrids VCC = 24 Vdc, Class A
Product Hybrid Gain (Nom) @ 870 MHz dB Channel Loading Capacity
GaAs (continued)
Maximum Distortion Specifications 2nd Order Test dBc Composite Triple Beat dBc 132 CH Cross Modulation dBc 132 CH DC Current mA Typ Noise Figure @ 870 MHz dB Packaging/ Style
Max
Power Doublers (continued) MHW9188 MHW9188A MHW9189(35) MHW9189A MHW8207A MHW9207A MHW8227A MHW9227 MHW9227A MHW8247A MHW9247 MHW9247A MHW8267A MHW9267 MHW9267A
(34)Composite 2nd (35)Mirror image of
20.3 20.3 20.3 20.3 21.3 21.3 22.1 22.1 22.1 24.9 24.9 24.9 27.6 27.6 27.6
132 132 132 132 112 132 112 132 132 112 132 132 112 132 132
+48 +48 +48 +48 +48 +48 +48 +48 +48 +48 +48 +48 +48 +48 +48
62(34) 62(34) 62(34) 62(34) 62(34) 62(34) 64(34) 62(34) 62(34) 62(34) 62(34) 62(34) 62(34) 60(34) 60(34)
425 425 425 425 425 425 425 425 425 440 440 440 440 440 440
4.5 5.0 4.5 5.0 4.5 (Typ) 5.0 4.5 (Typ) 4.5 4.5 6.0 (Typ) 7.0 7.0 6.0 (Typ) 7.0 7.0
1302/1 1302/1 1302/2 1302/2 1302/2 1302/2 1302/1 1302/1 1302/1 1302/1 1302/1 1302/1 1302/1 1302/1 1302/1
New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100925 SG1009Q42004
FORWARD AMPLIFIER MODULES (continued) 40870 MHz High Output MMIC, VCC = 24 Vdc, Class A
Product Hybrid Gain (Nom) @ 870 MHz dB Channel Loading Capacity
GaAs
Maximum Distortion Specifications Output Level dBmV/CH 2nd Order Test dBc Composite Triple Beat dBc 132 CH Cross Modulation dBc 132 CH DC Current mA Typ Noise Figure @ 870 MHz dB Packaging/ Style
Max
Preamplifiers MMG1001R2(18e) Power Doublers MMG2001R2(18e) 21 132 +48 60 54 53 425 4.5 978/ 19 132 +44 58 56 52 250 5.0 978/
Silicon Bipolar
Maximum Distortion Specifications Output Level dBmV/CH 2nd Order Test dBc Composite Triple Beat dBc 128 CH Cross Modulation dBc 128 CH DC Current mA Typ Noise Figure @ 870 MHz dB Packaging/ Style
Max
Preamplifiers MHW8202B MHW8272A MHW8312 (46b) MHW8342 20.9 27.2 31.3 35.5 128 128 128 132 +38 +38 +40 +44 66(40) 64(40) 53(39) 44(36) 63 64 54 46* *132 CH
(18)Tape
62 62 56 50* *132 CH
and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units; o) R6 = 150 units; p) R5 = 50 units. (36)Composite 2nd Order; V out = + 44 dBmV/ch (39)Composite 2nd Order; V out = + 40 dBmV/ch (40)Composite 2nd Order; V out = + 38 dBmV/ch (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05 New Product
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100926 SG1009Q42004
FORWARD AMPLIFIER MODULES (continued) 40860 MHz Hybrids, VCC = 24 Vdc, Class A
Product Hybrid Gain (Nom) @ 50 MHz dB
Silicon Bipolar
Maximum Distortion Specifications Output Level dBmV/CH 2nd Order Test dBc Composite Triple Beat dBc 128 CH Cross Modulation FM = 55 MHz dBc 128 CH DC Current mA Typ Noise Figure @ 860 MHz dB Packaging/ Style
Max
Preamplifiers MHW8182B MHW8222B MHW8242A Power Doublers MHW8185L(21) MHW8185 MHW8205L(22) MHW8205 18.5 18.8 19.5 19.8 128 128 128 128 +40 +40 +40 +40 62(39) 62(39) 60(39) 60(39) 63 64 63 63 64 64 64 64 365 400 365 400 8.5* 8.0 8.5* 8.0 *@ 870 MHz 714Y/1 714Y/1 714Y/1 714Y/1 18.5 21.9 24 128 128 128 +38 +38 +38 64(40) 60(40) 62(40) 66 64 64 65 63 62 220 220 318 7.5 7.0 7.5 714Y/1 1302/1 1302/1
Silicon Bipolar
Maximum Distortion Specifications Output Level dBmV/CH 2nd Order Test dBc Composite Triple Beat dBc 110 CH Cross Modulation FM = 55 MHz dBc 110 CH DC Current mA Typ Noise Figure @ 750 MHz dB Packaging/ Style
Max
66 61 63
64 60 61
(21)Low DC Current Version of MHW8185; Typical I CC @ (22)Low DC Current Version of MHW8205; Typical I CC @ (39)Composite 2nd Order; V = + 40 dBmV/ch out (40)Composite 2nd Order; V = + 38 dBmV/ch out
New Product
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SG100927 SG1009Q42004
FORWARD AMPLIFIER MODULES (continued) 40750 MHz Hybrids, VCC = 24 Vdc, Class A
Product Hybrid Gain (Nom) @ 50 MHz dB
Max
Preamplifiers (continued) MHW7272A MHW7292A MHW7312 (46b) MHW7342 27.2 29 31.3 34 110 110 112 112 +40 +40 +42 +44 64(39) 60(39) 55(45) 50(36) 64 60 55* 50 *112 CH Power Doublers MHW7185CL MHW7185C MHW7205CL MHW7205C 18.5 18.8 19.5 19.8 110 110 110 110 +44 +44 +44 +44 64(36) 64(36) 63(36) 63(36) 61 62 61 61 63 63 62 62 370 400 365 400 7.5 7.5 7.5 7.5 714Y/1 714Y/1 714Y/1 714Y/1 60 60 56* 53 *112 CH 310 310 325 325 6.5 6.5* 6.5 6.0 *@ 770 MHz 1302/1 1302/1 1302/1 1302/1
Silicon Bipolar
Maximum Distortion Specifications Output Level dBmV/CH 2nd Order Test dBc Composite Triple Beat dBc Cross Modulation FM = 55 MHz dBc 77 CH DC Current mA Typ T Noise Figure @ 550 MHz dB Packaging/ Style
Max M 77 CH Forward Amplifiers MHW6342T 34.5 77 +44 57(36) 57 57 310 6.5 1302/1
(36)Composite 2nd Order; V out = + 44 dBmV/ch (39)Composite 2nd Order; V out = + 40 dBmV/ch (45)Composite 2nd order; V out = + 42 dBmV/ch (46)To be introduced: a) 3Q04; b) 4Q04; c) 1Q05
New Product
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SG100928 SG1009Q42004
Silicon Bipolar
Channel Loading g Capacity C i Maximum Distortion Specifications Output Level Le el dBmV/CH dB V/CH 2nd Order Test T dBc 72(30) 72(31)* *22 CH Composite Triple Beat p dBc dB 22 CH 68 68 26 CH 67.5(19) 70(19) Cross Modulation dBc 22 CH 61 60 26 CH 61(19) 63(19) 210 325 DC Current C rrent mA A Typ Noise Figure @ 175 MHz dB Packaging/ Style Style
MHW1244 MHW1346
22, 26 22, 26
+50 +50
Silicon Bipolar
Maximum Distortion Specifications 2nd Order Test dBc dB 6 CH 10 CH 65 66 65 6 CH 75 75 74 Composite Triple Beat p dBc dB 10 CH 66 66 64 Cross Modulation dBc 6 CH 65 65 64 10 CH 60 61 58 95 95 95 DC Current mA A Typ Noise Figure @ 200 MHz dB Packaging/ Style y
68 68 68
Silicon Bipolar
Maximum Distortion Specifications 2nd Order Test dBc dB 6 CH 10 CH 65 6 CH 73 Composite Triple Beat p dBc dB 10 CH 62 Cross Modulation dBc 6 CH 63 10 CH 57 95 DC Current mA A Typ Noise Figure @ 150 MHz dB Packaging/ Style y
MHW1353LA
(19)Typical (30)Channels 2 and A @ 7 (31)26 Ch. Composite Second
6,10
+50
68
New Product
Order Test
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SG100929 SG1009Q42004
Silicon Bipolar
Maximum Distortion Specifications 2nd Order Test dBc dB 6 CH 10 CH 65 66 65 65 6 CH 75 75 74 73 Composite Triple Beat p dBc dB 10 CH 66 66 64 62 Cross Modulation dBc 6 CH 65 65 64 63 10 CH 60 61 58 57 95 95 95 95 DC Current mA A Typ Noise Figure @ 65 MHz dB Packaging/ Style y
68 68 68 68
Silicon Bipolar
Maximum Distortion Specifications 2nd Order Test T 30) dBc 70 Composite Triple Beat p dBc dB 3 CH 70 Cross Modulation dBc 4 CH 62 115 DC Current mA A Typ Noise Figure @ 50 MHz dB Packaging/ Style y
MHW1254L
(30)Channels 2
+50
and A @ 7
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SG100930 SG1009Q42004
RF REFERENCE DESIGNS
RF Power Reference Designs provide: RF Performance Tuned for Specific Standard Broadcast Formats Low Cost Component Selection Complete BOM, Layout, PCB and All Design Information Available Integral Temperature Compensated Bias Circuits Included Extensive RF Characterizations
RF LDMOS MODELS
Freescale Semiconductor continues to populate its LDMOS Model Library with the LDMOS MET models and with the LDMOS Root models. All product models available in the RF LDMOS Model Library (Root and MET) include package, bond wire and internal matching network effects. The MET model for RF LDMOS transistors is a nonlinear model that examines both electrical and thermal phenomena and can account for dynamic selfheating effects of device performance. It is specifically tailored to model high power RF LDMOS transistors used in wireless base station applications. Implemented in the Agilent EEsof EDA Advanced Design System, APLAC Analog Design Tool, Applied Wave Research Microwave Office, and Ansoft Serenade Design Environment and Eagleware GENESYS Microwave and RF Design Suite, the MET LDMOS model is capable of performing smallsignal, largesignal, harmonicbalance, noise and transient simulations. Because of its ability to simulate selfheating effects, the MET model is more accurate than existing models, enabling circuit designers to predict prototype performance more accurately and reduce design cycle time. The current release of the MET LDMOS model is available for these tools: 1. Agilent EEsof ADS (UNIX and PC) nonlinear circuit simulator 2. APLAC Analog Design Tool 3. Applied Wave Research Microwave Office 4. Ansoft Serenade Design Environment 5. Eagleware GENESYS Microwave and RF Design Suite The LDMOS Model Library is available for all major computer platforms supported by these simulators. For more information and latest releases supported, go to http://www.freescale.com/rf/models.
Freescale Semiconductor is pleased to offer applicationspecific reference designs. These applicationspecific reference designs show some of the many possible uses of our high power RF transistors. They provide the customers design engineers with a fast and accurate tool to both evaluate the performance envelope and fully characterize the devices under a variety of different operating conditions. Lowcost component selection was chosen so that the end users could transition the design and its entire Bill of Materials into a high volume base station manufacturing process and still be cost competitive with other competing technologies. The circuit board is made of a recently developed ceramic loaded thermoset plastic woven glass material that offers very low material costs, low PCB fabrication cost, and yet still has an exceptionally low dissipation factor giving low RF loss. The dielectric constant of this material is high enough to allow for compact, distributed element matching structures, yet of a reasonable value to make it relatively insensitive to fabrication and etching variations. The circuits matching and decoupling capacitors utilize a lowcost silicon dioxide dielectric process rather than the traditional porcelain multilayered assemblies, and they offer low ESRs, very high Qs and tight capacitance value tolerances. The reference design data sheet contains a wealth of information that customers can use to better understand the range and capabilities of the Freescale devices. Included on the data sheet are such basics as the intended end use application (GSM, WCDMA, etc.), the typical performance level expected (2% EVM, 40 dBc ACP, etc.) and some device features such as ESD protection and good thermal stability. For more information, go to http://www.freescale.com/rf. Select Tools/Reference Designs.
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100931 SG1009Q42004
RF DESIGN TOOLS
RF DESIGN TOOLS
TOOLS PROVIDED
Reference Design Simulations provide an example application of MET models in a predesigned application circuit. Freescale Semiconductor has taken the time to characterize specific reference design circuits in "software form." The simulations have been chosen to represent a wide selection of RF devices under many of the major communication standards, including GSM, CDMA, WCDMA and TDMA.
LEARNING TOOLS
Reference Design Simulations provide examples of how to use nonlinear models of RF transistors. Specifically, the user will also learn how to design an amplifier using microwave stripline matching techniques. To provide the most accurate modeling results, each simulation provides examples for CW, 2tone and modulated signals, as applicable.
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100932 SG1009Q42004
(Scale 1:1)
(Scale 1:1)
(Scale 1:1)
(Scale 1:1)
(Scale 1:1)
(Scale 1:1)
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100933 SG1009Q42004
PACKAGING
PACKAGING
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100934 SG1009Q42004
(Scale 1:1)
(Scale 1:2)
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100935 SG1009Q42004
PACKAGING
Whats EOL?
Freescale Semiconductor follows the industry standard EIA724 Product Life Cycle Data Model" to track the life cycle of its product. This model tracks the products life cycle from Product Newly Introduced" to Product Phase Out." Products can be phased for a variety of reasons: improved product performance, change in technology roadmap, process obsolescence, market decline, etc. When products are discontinued, a suggested possible replacement device or an alternative source of supply for discontinued devices are made available when possible. For a list of discontinued devices with possible alternative suppliers, please contact your local Freescale sales office or authorized distributor, or visit the following URL: http://www.motorola.com/rf
Past Past
Past Past
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SG100936 SG1009Q42004
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100937 SG1009Q42004
For additional information on RF LDMOS High Power Transistor Products, Tape and Reel Specifications, Case Dimensions for all packages, and a device index, refer to SG46/D Wireless RF Product Selector Guide.
SG100938 SG1009Q42004
NOTES
SG100939 SG1009Q42004
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customers technical experts.
Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2004. All rights reserved. SG1009Q42004 Rev 0 12/2004