Advantages of Nanotechnology

Nanotechnology revolutionize a lot of electronic products, procedures, and applications. Nanotechnology cause more effective energy-producing, energy-absorbing, and energy storage products in smaller and more efficient devices are possible. More efficient and smaller batteries, fuel cells, and solar cells can be built with this technology. Manufacturing sector that will need materials like nanotubes, aero gels, nano particles, and other similar items to produce their products using nanotechnology. These materials are often stronger, more durable, and lighter than those that are not produced with the help of nanotechnology. In the medical world, nanotechnology is also seen as a bonus since these can help with creating what is called smart drugs. These help cure people faster and without the side effects that other traditional drugs have.

Disadvantages of Nanotechnology
Possible loss of jobs in the traditional farming and manufacturing industry. The development of nanotechnology can also bring about the crash of certain markets due to the lowering of the value of oil and diamonds due to the possibility of developing alternative sources of energy that are more efficient and wont require the use of fossil fuels. Atomic weapons can now be more accessible and made to be more powerful and more destructive. These can also become more accessible with nanotechnology. Since these particles are very small, problems arise from the inhalation of these minute particles, much like the problems a person gets from inhaling minute asbestos particles. Presently, nanotechnology is very expensive and developing it can cost you a lot of money. It is also pretty difficult to manufacture, which is probably why products made with nanotechnology are more expensive.

 Modern electronics technology is characterized by its emphasis on miniaturization. Where remarkable technological progress has come from reductions in the size of transistors, thereby increasing the number of transistors possible per chip. With more transistors per chip, designers are able to create more sophisticated integrated circuits (ICs) Using nanotechnology in electronics results nanoelectronics; which deals with the electronic devices that has length scales of approximately 1 to 100 nanometers In the age of microelectronics, the devices active zone, e.g., the channel length of a field effect transistor or the thickness of a gate dielectric is derived from the size of several m. Using nanotechnology typical geometrical dimension of an electronic device is the nm.

What is nanoelectronics?

Moores Law:
The industrys history of steady increases in complexity was noted by Gordon Moore, a cofounder of Intel. He made an observation in 1965, later it is called Moores law and states that: the complexity of an integrated circuit, with respect to minimum component cost, will double in about 18 months.

 A typical electronic device of the fifties was a single device with a dimension of 1 cm, while the age of microelectronics began in the eighties. Based on Moores law, in the year 2030 in which the nanometer era is to be expected.

 Roadmap milestones

Impacts, Limitations of conventional microelectronics:

Microelectronics is one of the most important technological advancement of our times, one that has drastically changed the way we work and live The success of the microelectronics industry is attributed in large parts due to reduced transistor size in complementary metal-oxide semiconductor (CMOS) integrated circuits over 60nm This increasing miniaturization has allowed an exponential growth in computing power

 But the size of the transistor approaches the nanoscale; it is difficult to sustain the Moore law. Thus new methods for computation are required and one of the most promising method is Molecular Electronics (by nanoelectronics), where active electronics devices are made up of a single molecule or a molecular monolayer

 Social positive impact of microelectronics 1. Mass production of products 2. Production of less complex (user friendly) products 3. Enhanced devices for information technology Some negative impacts are: 1. Misuse of technology 2. Destroy of human lives 3. Ignorance of fundamental parts of life

 Some limitations of microelectronics: 1. The physical limit: At thickness less than 1nm, SiO2 will no longer be a good insulator and leak current will occur, generating too much heat. In addition, quantum effects become significant at lower dimensions, interfering with the operation of the transistor. Moreover, as the device becomes smaller, the number of doping atoms used also decreases, leading to greater fluctuation of the number of dopant atoms and thus greater variation among the transistors.

2. The lithographic limit: The current technology can only produce a minimum feature size of 130 nm. Other techniques such as extreme ultraviolet, x-ray or electron beam lithography are required to produce features of smaller dimensions. 3. Limit of manufacturing time: Minimum time is required for maintaining high temperature, low pressure etc. during fabrication of microelectronics devices

4. The economic limit: Chip fabrication facilities, also known as fabs, are becoming increasingly expensive. The state-of-the-art fabs now cost about 10B$. Further reduction in transistor size will require more expensive equipment that will not make economic sense.

 Two types of approach for fabrication of nanomaterials: 1. Bottom-up 2. Top-down In bottom-up approach, arranging smaller components into more complex assemblies. It is similar to molecular selfassembly. In this method one collects, consolidates, and fashion individual atoms and molecules into structure. This is carried out by a sequence of chemical reactions controlled by catalysts. It is a process which is widespread in biology where, for example, catalysts called enzymes assemble amino acids to living tissue that forms and supports the organs of the body. The problem with this approach is longrange order difficult to achieve.

Introduction to methods of fabrication of nanomaterials:

 In top-down approach, creating smaller devices by using larger ones to direct their assembly. In this approach one starts with a large-scale object or pattern and gradually reduces its dimension or dimensions. This can be accomplished by a technique called lithography. Some problem with this approach with the precision and cost. In practice the combination of both approach is using

Fabrication of nano-layers:
Physical Vapor Deposition (PVD): In general, physical vapor deposition (PVD) from the gas phase is subdivided into four groups, namely (i) evaporation, (ii) sputtering, (iii) ion plating, and (iv) laser ablation The first three methods occur at low pressures

 An overview of PVD:

Evaporation: This procedure is carried out in a bell jar as shown below

 A crucible is heated up by a resistance or an electron gun until a sufficient vapor pressure develops. As a result, material is deposited on the substrate. Technically, the resistance is wrapped around the crucible, or a metal wire is heated up by a current and vaporized. The electron gun (egun) produces an electron beam of, e.g., 10keV. This beam is directed at the material intended for the deposition on the substrate. The guns advantage is its unlimited supply of evaporating material and applicability of non-conductive or high-melting materials. Its shortcomings lie in the production of radiation defects, for instance in the underlying oxide coating.