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Overview
Thin film Sputtering Zinc Oxide thin film
Thin film
Layer of material on a substrate less than about one micron
Source
Transport
Deposition
1. Source
Physical Vapor Deposition Solid material need to be vaporized to transport them into substrate This can be done by heat or energetic beam of
Electrons (e-beam evaporation) Photons (Laser ablation) Positive ions (Sputtering)
2. Transport
Uniformity of arrival rate over the surface area Factors affecting uniformity
High vacuum Lowers melting point Maintains purity Increases mean free path of particles Geometry Fluid collisions Gas flow pattern Diffusion of source molecules through other gases
present
3. Deposition
Substrate surface condition
Roughness Level of contamination Degree of chemical bonding with arriving material
Energy input
Substrate energy Photons in Laser assisted deposition Positive ion beams
Electrical
Magnetic Chemical
Mechanical
Thermal
Applications
Thin film transistors UV light emitters Chemical sensors Piezo electric devices Sprintronics
Synthesis
Vapor Transport Synthesis
Zno & Oxygen Decomposition of ZnO Heating Zn powder under Oxygen flow
Epitaxy)
Di-ethyl Zinc & Oxygen
Carbothermal Method
ZnO & Graphite
Sputtering
Ion impact setup a series of collisions between the atoms of the target Which leads to ejection of atoms from the target called sputtering
Sputter Yield
Sputter yield (S) =
Ejected atoms or molecules Incident ion
S values are typically in the range of 0.01 and 4 and increase with the mass of metals and energy of the sputtering gas.