Documente Academic
Documente Profesional
Documente Cultură
EMI Categories
Interference
Fully opposed
Interference
Partially opposed
EM Interaction Process
External Interaction - The EM wave couples with the
surface of the structure and causes electrical charge to flow on the surface. Resulting in a surface current density, and a charge density which correspond to tangential H field and normal E fields respectively.
Internal
Interaction
The
energy
penetrates
EM Interaction Process
Internal Propagation - Once the energy
penetrates into the interior, it will be propagated
most efficiently by the internal cables, which form multiconductor transmission lines along which energy is transported.
This energy is ultimately carried to the components, which can be either temporarily upset or permanently damaged.
EM Interaction Process
External Source External E & H Fields
External Coupling
Aperture Penetration
Conductive Penetration
Barrier Penetration
Component Responses
EM Field Radiat ion f r om Ant enna EM I nt er act ion wit h Syst em Ext er ior
Conduct or Penet r at ion I nt er nal Conduct or Pr opagat ion I nt er nal Equipm ent Excit at ion
PENETRATI O N
I NTERNAL CO UPLI NG
EM Interaction Depends on
Characteristics of Wave Characteristics of System
LRDE
2003 Brooks/Cole, a division of Thomson Learning, Inc. Thomson Learning is a trademark used herein under license.
where Ei is the incident field and E is the transmitted or reflected field. Note that Ei > E.
Reflection
Mainly due to interaction of electromagnetic radiation with the electrons in the solid
Skin Effect
Phenomenon in which high frequency electromagnetic radiation interacts with only the near surface region of an electrical conductor
Skin depth ()
where
f = frequency, = magnetic permeability = 0r, r = relative magnetic permeability, 0 = 4 x 10-7 H/m, and = electrical conductivity in -1m-1.
Absorption
Due to interaction of electromagnetic radiation with the electric/magnetic dipoles, electrons and phonons in the solid
EM COUPLING
Capacitive Coupling
Inductive Coupling
Radiative Coupling
Conductive Coupling
Methods of Coupling
Transfer Mechanism Conductive Electromagnetic Magnetic Field Electric Field
Coupling
Direct radiation From Source to Receptor Radiated From Source & transferred to AC/Signal/control cables RF energy radiated by Cables RF energy conducted by common electrical supply
Stray cap
Supply
Mutual inductance
Radiation System B
Radiation Coupling
EMI Characterization
EMITTER
EMISSION:
It is a phenomenon through which a system gives away EM energy to its environment
SUSCEPTIBILITY:
SYSTEM
It is the phenomenon through which a system gets in EM energy from its environment
SUSCEPTOR
32
Conducted Susceptibility
Conducted Emissions
VC
M
Loop Area
Induced Current
Interference to TV Reception
No Interference
Transients
Electrostatic Discharge & Transient Pulses ESD can induce glitches in circuits, leading to false triggering, errors in address & data lines and latch-up of devices
Upset Damage Degradation leading to future failure(s)
Examples
RADIO TRANSMITTERS
CERTIFICATION:
Test Product
Sell Product
Power Cord
3 m or 10 m
Turntable
Measuring Antenna
3 m or 10 m
Turntable
Measuring Antenna
Photos: EMC Test System, Austin, TX emctest.com
Cell phone
Switching noise
FM Radio
IEC 61000-4-1: Introduction IEC 61000-4- 2: Electrostatic Discharge Requirements IEC 61000-4- 3: Radiated Immunity IEC 61000-4- 4: Electrical Fast Transient IEC 61000-4- 5: Surge IEC 61000-4- 6: Conducted RF Immunity IEC 61000-4-7: Interharmonics IEC 61000-4-8 & 9: Magnetic field immunity IEC 61000-4-10: Damped Oscillatory pulsed field immunity IEC 61000-4-11: Dips & Interrupts (power quality) IEC 61000-4-12: Damped Oscillatory (surge)
ESD Testing
ESD Simulator
Anechoic Chamber
www.emctest.com
Surge Coupling
Lightning and pulse sources cause highenergy transients into power and data cables
Direct
Indirect
IEC 1000-4-11
Voltage Interrupt: